CN113967881A

CN113967881A - Clamp, equipment and system for testing

Info

Publication number: CN113967881A
Application number: CN202010712495.6A
Authority: CN
Inventors: 王延政; 周培; 詹超; 石彬彬; 季培成; 宫鹏鹏; 卓成龙
Original assignee: Shanghai Fudan Microelectronics Group Co Ltd
Current assignee: Shanghai Fudan Microelectronics Group Co Ltd
Priority date: 2020-07-22
Filing date: 2020-07-22
Publication date: 2022-01-25
Anticipated expiration: 2040-07-22
Also published as: CN113967881B

Abstract

The embodiment of the invention provides a clamp, equipment and a system for testing. This anchor clamps include the double-layered lid, a pedestal, temperature acquisition unit and first elastic component, double-layered lid and base form jointly and are suitable for holding the device to be measured, the first cavity of temperature acquisition unit and first elastic component, the base is provided with the probe that is suitable for with the pin conductive connection of device to be measured, the temperature acquisition unit is connected and is suitable for the temperature signal with the device to be measured butt in order to gather the device to be measured through first elastic component and double-layered lid, first elastic component is suitable for being compressed so that pin and probe conductive connection when the temperature acquisition unit butt is in the device to be measured. Because, the temperature acquisition unit is elastically connected with the clamping cover, interaction force can be generated between the clamping cover and the temperature acquisition unit, between the temperature acquisition unit and the device to be tested and between the pin of the device to be tested and the probe when the temperature acquisition unit is abutted to the device to be tested, and therefore good contact property and conductivity between the pin of the device to be tested and the probe are ensured.

Description

Clamp, equipment and system for testing

Technical Field

The invention relates to the technical field of electronic device testing, in particular to a clamp, equipment and a system for testing.

Background

When testing an electronic device, it is usually necessary to fix the device to be tested in a fixture and electrically connect the device to be tested and a test load board through a probe. However, when the same fixture is used to test different devices to be tested, especially devices to be tested with different thicknesses, the contact between the device to be tested and the probe often has the condition of undervoltage or overvoltage. Under the condition of undervoltage, the device to be tested and the probe cannot be completely conductively connected due to very poor contact between the device to be tested and the probe. Under the condition of overpressure, the pin of the device to be tested is subjected to overlarge pressure due to the fact that the device to be tested is in contact with the probe too tightly, and therefore the device to be tested is easily damaged. How to ensure that the device to be tested and the probe have proper contact and make the device to be tested and the probe have good conductivity is a problem which needs to be solved at present.

Disclosure of Invention

The embodiment of the invention aims to provide a clamp, equipment and a system for testing.

The clamp for testing provided by the embodiment of the invention comprises a clamping cover, a base, a temperature acquisition unit and a first elastic piece, wherein the clamping cover and the base jointly form a first cavity suitable for accommodating a device to be tested, the temperature acquisition unit and the first elastic piece, the device to be tested is provided with a pin, the base is provided with a probe suitable for being in conductive connection with the pin, the temperature acquisition unit is connected with the clamping cover through the first elastic piece and is suitable for being abutted against the device to be tested so as to acquire a temperature signal of the device to be tested, and the first elastic piece is suitable for being compressed when the temperature acquisition unit is abutted against the device to be tested so as to enable the pin to be in conductive connection with the probe.

Optionally, a heating unit is included, housed within the first cavity, adapted to heat the device under test.

Optionally, a heat conduction unit is included, housed within the first cavity, adapted to conduct heat generated by the heating unit to the device under test.

Optionally, the temperature acquisition unit is partially accommodated in the heat conduction unit, and one end of the temperature acquisition unit, which is adapted to abut against the device under test, extends out of the heat conduction unit when the first elastic member is not compressed.

Optionally, a pressure acquisition unit accommodated in the first cavity is included, and the pressure acquisition unit is adapted to acquire a pressure signal of the device to be tested when the temperature acquisition unit abuts against the device to be tested so as to determine the pressure applied to the pin.

Optionally, the pressure acquisition unit is fixed to the clamping cover and connected with the temperature acquisition unit through the first elastic member.

Optionally, a second elastic member for connecting the pressure collection unit and the clip cover is included, and the second elastic member is adapted to be compressed when the temperature collection unit abuts against the device under test so that the pressure collection unit abuts against the device under test.

Optionally, a first control module connected to the pressure acquisition unit is included, and is adapted to determine the pressure applied to the pin based on the pressure signal of the device under test, and determine whether the pressure applied to the pin is within a predetermined pressure range.

Optionally, the first elastic member is adapted to be compressed when the temperature acquisition unit abuts against the device under test so that the pressure applied to the pin is within a predetermined pressure range.

Optionally, a securing assembly is included that connects both the clip cover and the base and is adapted to adjust the distance therebetween such that the pins are subjected to a pressure within a predetermined pressure range.

Optionally, the fixing assembly comprises a first threaded hole, a second threaded hole and a screw, wherein the first threaded hole and the second threaded hole are respectively arranged on the fixing assembly, the screw is in threaded connection with the first threaded hole and the second threaded hole, and the adjustment of the distance between the fixing assembly and the screw is realized by changing the position of the screw in the first threaded hole and/or the second threaded hole.

Alternatively, the fixing member includes an internal threaded portion provided to one of the two and an external threaded portion provided to the other of the two, the internal threaded portion and the external threaded portion being threadedly connected, the adjustment of the distance therebetween being achieved by changing the position of the connection between the internal threaded portion and the external threaded portion.

The embodiment of the invention also provides equipment for testing, which comprises a second control module, wherein the second control module is suitable for acquiring the pressure signal of the device to be tested from the clamp provided by the embodiment of the invention, determining the pressure applied to the pin based on the pressure signal of the device to be tested, and judging whether the pressure applied to the pin is within a preset pressure range.

Optionally, the apparatus includes production test equipment and burn-in test equipment.

Optionally, the apparatus is an incubator for testing a device under test.

Optionally, the device comprises at least one slot module; each slot module in the at least one slot module comprises at least one temperature area sub-module, and each temperature area sub-module in the at least one temperature area sub-module is used for testing a device to be tested.

Optionally, each temperature zone sub-module includes a system control board for controlling the test.

Optionally, each temperature zone sub-module comprises a DPS board communicably connected to the system control board and providing regulated dc power.

Optionally, the DPS board includes a multiple device under test power supply circuit for providing operating power to the device under test.

Optionally, each socket module includes a load board electrically connected to pins of the device under test via probes.

The embodiment of the invention also provides a system for testing, which comprises the clamp, the equipment and the connecting wire for connecting the clamp and the equipment, wherein the connecting wire is suitable for transmitting the pressure on the device to be tested from the clamp to the equipment.

Compared with the prior art, the technical scheme of the embodiment of the invention has the beneficial effect. For example, in the prior art, a temperature acquisition unit is generally used to acquire a temperature signal. In the embodiment of the invention, the temperature acquisition unit can acquire the temperature signal and simultaneously electrically connect the pin of the device to be tested with the probe through ingenious design. Particularly, through with temperature acquisition unit and clamping cover elastic connection, can all produce the interact power between clamping cover and temperature acquisition unit, between temperature acquisition unit and the device to be measured and between the pin of device to be measured and the probe when can be so that temperature acquisition unit butt in the device to be measured to make and have good contact nature and electric conductivity between the pin of device to be measured and the probe.

For another example, the pressure acquisition unit fixed on the clamping cover is elastically connected with the temperature acquisition unit, so that the pressure applied to the device to be tested can be conveniently acquired through the pressure acquisition unit.

For another example, the pressure applied to the pin of the device under test can be determined according to the pressure applied to the device under test, so as to help determine whether the pressure applied to the pin of the device under test is proper (i.e., within a predetermined pressure range).

For another example, when the pressure applied to the pin of the device to be tested is over-pressure or under-pressure (i.e. when the pressure exceeds the predetermined pressure range), the distance between the clamping cover and the base can be adjusted through the first elastic member and/or the fixing component, so as to ensure that the pressure applied to the pin of the device to be tested is proper, thereby ensuring that the test can be effectively performed and being beneficial to prolonging the service life of the device to be tested.

For another example, because the first elastic member has elasticity and can be compressed, the interaction force between the temperature acquisition unit and the device to be tested and the interaction force between the pin of the device to be tested and the probe are transmitted in a soft manner, so that the problem that the pin of the device to be tested and the probe are damaged due to rigid action force is solved, and the service lives of the device to be tested and the probe are prolonged.

For another example, the clamp has a simple structural design, which is beneficial to saving cost and facilitating manufacturing.

Drawings

FIG. 1 is a simplified cross-sectional view of a clamp according to an embodiment of the present invention;

FIG. 2 is a simplified cross-sectional view of another embodiment of a clamp of the present invention;

FIG. 3 is a simplified schematic third cross-sectional view of a clamp in accordance with an embodiment of the invention;

FIG. 4 is a simplified cross-sectional view of a connection between the clip cover and the base in an embodiment of the present invention;

FIG. 5 is a simplified cross-sectional view of the clip cover and base in an exploded condition in accordance with an embodiment of the present invention;

FIG. 6 is a simplified cross-sectional view of another embodiment of the present invention showing the connection between the clip cover and the base;

FIG. 7 is a simplified cross-sectional view of a clip cover and base in another exploded configuration in accordance with an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of an apparatus for testing in an embodiment of the present invention;

FIG. 9 is a diagram of the hardware architecture of a socket module in an embodiment of the present invention;

FIG. 10 is a simplified schematic diagram of a load board in an embodiment of the present invention;

fig. 11 is a schematic structural diagram of a platform for testing in an embodiment of the present invention.

Detailed Description

In the prior art, the contact between the device to be tested and the probe often has the condition of undervoltage or overvoltage, so that the device to be tested and the probe cannot be completely connected in a conductive manner, or the device to be tested is easily damaged.

Different from the prior art, the embodiment of the invention provides a clamp, equipment and a system for testing. This anchor clamps include the double-layered lid, a pedestal, temperature acquisition unit and first elastic component, double-layered lid and base form jointly and are suitable for holding the device under test, the first cavity of temperature acquisition unit and first elastic component, the device under test has the pin, the base is provided with and is suitable for the probe with pin conductive connection, the temperature acquisition unit is connected and is suitable for the temperature signal with the device under test butt in order to gather the device under test through first elastic component and double-layered lid, first elastic component is suitable for being compressed so that pin and probe conductive connection when the temperature acquisition unit butt is in the device under test.

Compared with the prior art, in the embodiment of the invention, the temperature acquisition unit is elastically connected with the clamping cover, so that the interaction force is generated between the clamping cover and the temperature acquisition unit, between the temperature acquisition unit and the device to be tested and between the pin of the device to be tested and the probe when the temperature acquisition unit is abutted to the device to be tested, and the pin of the device to be tested and the probe are ensured to have good contact property and conductivity.

In order to make the objects, features and advantages of the embodiments of the present invention more comprehensible, specific embodiments accompanied with figures are described in detail below.

FIG. 1 is a simplified cross-sectional view of a clamp according to an embodiment of the present invention.

As shown in fig. 1, a jig 10 for testing according to an embodiment of the present invention includes a jig body. The clip body includes a clip cover 111 and a base 112.

In particular, the cap 111 and the base 112 may both be arranged one above the other and together form a first cavity 113 adapted to accommodate the device under test 20. The device under test 20 has pins on its side facing the base 112. The base 112 is adapted to support a device under test 20 and is provided with probes 30 adapted to be electrically connected to pins of the device under test 20.

The clamp body further includes a temperature acquisition unit 116 accommodated in the first cavity 113 and elastically connected to the clamp cover 111. The temperature acquisition unit 116 is adapted to abut the device under test 20 to acquire a temperature signal of the device under test 20.

Specifically, the temperature acquisition unit 116 may include a front end 116a and a rear end 116 b. Wherein, the front end 116a of the temperature acquisition unit 116 is adapted to abut against the device under test 20 and is adapted to acquire the temperature signal of the device under test 20. The end 116b of the temperature collection unit 116 is adapted to be elastically coupled with the clip cover 111.

Fig. 2 is another simplified cross-sectional view of a clip according to an embodiment of the present invention.

As shown in fig. 2, the jig body 110 may further include a heating unit 114 received in the first cavity 113. Specifically, the heating unit 114 may be fixed within the clip cover 111 and adapted to heat the device under test 20.

In some specific examples, the clamp body 110 may further include a heat dissipation unit (not shown in fig. 2). The heat dissipation unit is adapted to dissipate heat of the device 20 to be tested when the temperature of the device 20 to be tested is greater than a set value of the test temperature during the test process.

Specifically, the heat dissipation unit may be disposed on the top of the folder 111 or the heat conduction unit 115, so as to directly dissipate heat from the folder 111 or the heat conduction unit 115, and thus, dissipate heat from the device under test 20. In some specific examples, the heat dissipating unit may employ a fan.

In some preferred embodiments, the fixture body 110 further includes a heat conduction unit 115 accommodated in the first cavity 113, and adapted to conduct heat generated by the heating unit 114 to the device under test 20 to heat the device under test 20.

Specifically, the heat conduction unit 115 may be made of a material having a low thermal resistance and a high heat conduction capability. For example, the heat conductive unit 115 may be made of copper. In this way, the heat generated by the heating unit 114 can be quickly and effectively conducted to the surface of the housing of the device under test 20 through the heat conduction unit 115 to heat the device under test 20.

In some specific examples, the heat conduction unit 115 may be fixed in the cap 111 and positioned above the device under test 20.

The thermally conductive unit 115 may also have a second cavity (not shown in fig. 2) adapted to receive the heating unit 114. The heating unit 114 is accommodated in the second cavity to rapidly conduct heat to the heat conduction unit 115.

In some preferred embodiments, the heating unit 114 may be provided in plurality. The plurality of heating units 114 are uniformly distributed in the second cavity of the heat conduction unit 115, so that heat is uniformly conducted to the heat conduction unit 115, and the device under test 20 is uniformly heated by the heat conduction unit 115.

In a specific example in which the heating unit 114 is provided in plurality, one or more second cavities may be provided. In a specific example where the second cavity is provided with one, a plurality of heating units 114 may be accommodated in the same second cavity. In a specific example in which the second cavity is provided in plurality, each of the plurality of heating units 114 may be respectively accommodated in one second cavity.

In the embodiment of the present invention, the fixing of the heating unit 114 in the cover 111 includes the direct fixing connection of the heating unit 114 and the inner sidewall of the cover 111, and also includes the indirect fixing of the heating unit 114 in the cover 111 through the heat conduction unit 115. The indirect fixing of the heating unit 114 to the inside of the folder 111 through the heat conduction unit 115 means that the heating unit 114 is accommodated in the heat conduction unit 115 and the heat conduction unit 115 is directly fixed to the inside of the folder 111.

In a specific example in which the jig body 110 does not include the heat conduction unit 115, the tip 116b of the temperature collection unit 116 may be directly elastically connected to the jig cover 111. For example, the end 116b of the temperature collection unit 116 may be directly elastically connected to the inner top wall of the clip cover 111.

In a specific example in which the holder body 110 includes the heat conduction unit 115, the end 116b of the temperature collection unit 116 may be elastically connected to the clip cover 111 either directly or indirectly.

In particular, the thermally conductive unit 115 may have a third cavity adapted to receive the temperature acquisition unit 116. In some specific examples, the temperature collection unit 116 may be partially accommodated in the third cavity, and the end 116b of the temperature collection unit 116 passes through the top wall of the third cavity and is directly elastically connected with the inner top wall of the clip cover 111. In other embodiments, the temperature acquisition unit 116 may be partially housed in the third cavity, but the end 116b thereof is located in the third cavity and is directly elastically connected to the inner top wall of the third cavity (the temperature acquisition unit 116 is indirectly elastically connected to the clip cover 111).

In the specific example of the fixture body 110 including the heat conduction unit 115, the temperature collection unit 116 can only be partially accommodated in the third cavity, and the front end 116a of the temperature collection unit 116 needs to be continued outside the third cavity, so that the front end 116a of the temperature collection unit 116 can be abutted with the device under test 20 located below the heat conduction unit 115.

In the embodiment of the present invention, the third cavity of the heat conduction unit 115 may be independent from the second cavity, or may be implemented by the second cavity (that is, the third cavity and the second cavity are the same cavity).

In some preferred embodiments, the temperature acquisition unit 116 may be located in the middle of the cover 111 and/or the heat conduction unit 115, so that the front end 116a of the temperature acquisition unit 116 may abut against the middle of the device under test 20, thereby ensuring that the device under test 20 is stably supported on the base 112, and enabling the pins of the device under test 20 and the probes 30 to have good contact and conductivity, so as to avoid the situation that some pins of the device under test 20 cannot contact the probes 30 due to the inclination of the device under test 20.

In some specific examples, the elastic connection between the temperature collection unit 116 and the clip cover 111 or the heat conduction unit 115 may be achieved by a first elastic member 118 a. Specifically, the first elastic member 118a may employ a spring and/or a rubber pad having elasticity.

In the present embodiment, the first elastic member 118a has an initial length. When the temperature acquisition unit 116 abuts against the device under test 20, the first elastic member 118a may be compressed with respect to its initial length and make the pins of the device under test 20 electrically connected with the probes 30.

Specifically, when the temperature acquisition unit 116 moves downward along with the clip cover 111 and abuts against the device under test 20 supported on the base 112, the first elastic member 118a can be compressed by the clip cover 111, or the clip cover 111 and the heating unit 114 fixed to the clip cover 111, or the clip cover 111 and the heating unit 114 and the heat conduction unit 115 fixed to the clip cover 111.

When the temperature acquisition unit 116 abuts against the device under test 20 and the first elastic member 118a is compressed, it indicates that the first elastic member 118a receives a reaction force from the temperature acquisition unit 116, and an interaction force is generated between the first elastic member 118a and the temperature acquisition unit 116. Further, corresponding interaction forces are generated between the temperature acquisition unit 116 and the device under test 20, and between the pin of the device under test 20 and the probe 30. When an interaction force is generated between the pin of the device under test 20 and the probe 30, it indicates that the pin of the device under test 20 and the probe 30 are in complete contact, so that the device under test 20 and the probe 30 are in complete conductive connection.

In the embodiment of the present invention, since the first elastic member 118a has elasticity and can be compressed, the interaction force between the temperature acquisition unit 116 and the device under test 20 and the interaction force between the pin of the device under test 20 and the probe 30 are both transmitted in a soft manner, so that the problem that the pin of the device under test 20 and the probe 30 are damaged by rigid action force is avoided, and the service lives of the device under test 20 and the probe 30 are further prolonged.

In some preferred embodiments, the first elastic member 118a with an elastic coefficient matching with the pin and the probe 30 can be selected according to the material and performance of the pin and the probe. When the temperature acquisition unit 116 abuts against the device under test 20, the first elastic member 118a is adapted to be compressed so that the pressure to which the pin of the device under test 20 is subjected is within a predetermined pressure range.

In the embodiment of the present invention, the pressure applied to the pin of the device under test 20 is within the predetermined pressure range, which means that not only the pin of the device under test 20 is completely contacted and electrically connected with the probe 30, but also the pin of the device under test 20 is not damaged due to the excessive pressure applied during the testing process.

Specifically, the predetermined pressure range is a pressure range from equal to or greater than a minimum pressure threshold value to equal to or less than a maximum pressure threshold value. When the pressure applied to the pin of the device under test 20 is less than the minimum pressure threshold, the pin of the device under test 20 cannot be in full contact and fully conductively connected to the probe 30. When the pressure applied to the pin of the device under test 20 is greater than the maximum pressure threshold, the pin of the device under test 20 may be damaged due to the excessive pressure.

During the testing process, since the device under test 20 may need to operate at a high temperature for a long time, the tension of the probe 30 contacting the pin of the device under test 20 may be increased accordingly, so that the pressure applied to the pin of the device under test 20 may also be increased accordingly. When the pressure applied to the pin of the device under test 20 exceeds the maximum pressure threshold, the pin of the device under test 20 may deform and cause damage to the internal circuit of the device under test 20.

It is noted that the predetermined pressure range of the pins may be different for different types of devices under test 20. Specifically, the predetermined pressure range is related to the material of the pins of the device under test 20.

In specific implementation, before the formal test, a small-batch pretest may be performed, and the pressure signal received by the pin of the device under test 20 and the conductive signal between the pin and the probe 30 are collected during the small-batch pretest, so as to determine the predetermined pressure range of the pin of the device under test 20.

Referring to fig. 2, the jig body 110 may further include a pressure collecting unit 117. Specifically, the pressure acquisition unit 117 is accommodated in the first cavity 113 and is adapted to acquire a pressure signal of the device under test 20 when the temperature acquisition unit 116 abuts against the device under test 20 to determine the pressure applied to the pin.

In some specific examples, the pressure collection unit 117 may be fixed to the clip cover 111 and connected to the temperature collection unit 116 through the first elastic member 118a to collect a pressure signal of the device under test 20 when the temperature collection unit 116 abuts against the device under test 20.

In the present embodiment, the pressure collecting unit 117 may be directly or indirectly fixed to the folder cover 111. Specifically, the pressure collecting unit 117 may be directly fixed to the inner top wall of the folder cover 111, or the pressure collecting unit 117 may be indirectly fixed to the folder cover 111 by being fixed to the inner top wall of the heat conduction unit 115.

In the embodiment of the present invention, the connection of the temperature collection unit 116 to the clip cover 111 through the first elastic member 118a may include a direct connection or an indirect connection. Specifically, the direct connection may include the temperature collection unit 116 being directly connected to the folder 111 through the first elastic member 118 a; the indirect connection may include the temperature collection unit 116 connected to the heat conduction unit 115 fixed to the cap 111 through the first elastic member 118a, or the temperature collection unit 116 connected to the pressure collection unit 117 fixed to the cap 111 or the heat conduction unit 115 through the first elastic member 118 a.

Fig. 3 is a simplified schematic cross-sectional view of a third embodiment of a clamp according to the present invention.

As shown in fig. 3, the clamp body 110 may further include a second elastic member 118 b.

Specifically, the second elastic member 118b may employ a spring and/or a rubber pad having elasticity.

In the embodiment of the present invention, the second elastic element 118b is used to connect the pressure collecting unit 117 and the clip cover 111, and is adapted to be compressed when the temperature collecting unit 116 abuts against the device under test 20, so that the pressure collecting unit 117 abuts against the device under test 20.

In some specific examples, a support 111b adapted to fix the second elastic member 118b may be provided on an inner sidewall of the folder cover 111. One end of the second elastic member 118b is connected to the supporting member 111b, and the other end thereof is connected to the pressure collecting unit 117.

In the present embodiment, the second elastic member 118b also has an initial length. When the temperature collection unit 116 abuts against the device under test 20, the second elastic member 118b is also compressed relative to its initial length, and the pressure collection unit 117 abuts against the device under test 20 to collect the pressure signal of the device under test 20.

It should be noted that if the pressure acquisition unit 117 is rigidly connected to the clip cover 111, the temperature acquisition unit 116 and the pressure acquisition unit 117 may not be simultaneously abutted against the device under test 20.

For example, the height of the pressure collection unit 117 in the vertical direction is high, and when the temperature collection unit 116 abuts against the device under test 20, the pressure collection unit 117 may not abut against the device under test 20.

For another example, the height of the pressure collection unit 117 in the vertical direction is low, and when the temperature collection unit 116 is not yet abutted against the device under test 20, the pressure collection unit 117 may already be abutted against the device under test 20, and the temperature collection unit 116 may not move downward and may not be abutted against the device under test 20.

In the embodiment of the present invention, the second elastic member 118b elastically connects the clip cover 111 and the pressure collecting unit 117, so that the pressure collecting unit 117 and the temperature collecting unit 116 can be abutted to the device under test 20 at the same time, and the pressure collecting unit 117 can collect the pressure signal of the device under test 20 when the pin of the device under test 20 is conductively connected to the probe 30.

Specifically, the second elastic member 118b and the first elastic member 118a may have the same elastic parameters, for example, they may have the same elastic coefficient, so that they may be compressed synchronously, thereby enabling the temperature acquisition unit 116 and the pressure acquisition unit 117 to abut against the device under test 20 at the same time.

In some preferred specific examples, the pressure collecting unit 117 may be provided in plurality. For example, four may be provided. Specifically, each of the plurality of pressure collection units 117 is connected to the inner sidewall of the folder cover 111 by one second elastic member 118b, respectively.

Further, the plurality of pressures collected by the plurality of pressure collecting units 117 may be averaged to determine the pressure of the device under test 20.

As a variation of the example shown in fig. 3, the pressure collecting unit 117 may be further connected to the heat conduction unit 115 by a second elastic member 118 b.

In the embodiment of the present invention, the connection of the pressure collecting unit 117 and the folder cover 111 by the second elastic member 118b may include a direct connection or an indirect connection. Specifically, the direct connection may include directly connecting the pressure collecting unit 117 with the folder cover 111 through the second elastic member 118 b; the indirect coupling may include coupling the pressure-collecting unit 117 with the heat conduction unit 115 fixed to the folder cover 111 through the second elastic member 118b, thereby indirectly coupling the pressure-collecting unit 117 with the folder cover 111.

In some specific examples, the pressure of the device under test 20 may simply represent the pressure applied to the device under test 20 and coming from above the device under test 20. For example, the pressure of the device under test 20 may represent the weight of the folder 111 and the pressure applied to the device under test 20 by the weight of the heating unit 114, the heat conduction unit 115, the temperature collection unit 116, and the pressure collection unit 117 fixed to the folder 111 and the elastic force generated by the compression of the first elastic member 118 a.

The pressure experienced by the pins of the device under test 20 may simply represent the pressure applied to the pins of the device under test 20 and coming from beneath the device under test 20. For example, the pressure experienced by the pins of the device under test 20 may be indicative of the pressure applied to the pins by the probes 30.

In an embodiment of the present invention, the pressure applied to the pins of the device under test 20 can be determined by the pressure applied to the device under test 20. For example, the pressure to which the pins of the device under test 20 are subjected may be the pressure of the device under test 20 plus the gravity of the device under test 20 itself.

Referring to fig. 2 and 3, the fixture 10 may further include a first control module 120. The first control module 120 is adapted to be connected to the pressure acquisition unit 117 and to obtain a pressure signal of the device under test 20 from the pressure acquisition unit 117 and to determine therefrom the pressure to which the pins of the device under test 20 are subjected.

In some specific examples, the fixture 10 may further include a display module connected to the first control module 120 for displaying the pressure applied to the pins of the device under test 20.

In other specific examples, the first control module 120 is further adapted to determine whether the pressure applied to the pin of the device under test 20 is within a predetermined pressure range. Further, the fixture 10 may further include an alarm module connected to the first control module 120, for triggering an alarm signal when the pressure applied to the pins of the device under test 20 exceeds a predetermined pressure range.

In particular, the alarm signal may comprise a voice signal and/or a light signal. For example, the alarm signal may include a voice message such as a ticker or may include a flashing red light.

Referring to fig. 2 and 3, the jig 10 may further include a first connection line 130. The first connection line 130 is adapted to connect the pressure collecting unit 117 and the first control module 120 and transmit the pressure signal collected by the pressure collecting unit 117 to the first control module 120.

In some specific examples, the first connection line 130 is further adapted to connect the first control module 120 and the display module, and to transmit the pressure signal received by the pin of the device under test 20 from the first control module 120 to the display module.

In other specific examples, the first connection line 130 is further adapted to connect the first control module 120 and the alarm module, and is adapted to control the alarm module to trigger an alarm signal through the first control module 120 when the pressure applied to the pin of the device under test 20 exceeds a predetermined pressure range.

Referring to fig. 2 and 3, the jig 10 may further include a control interface 140 provided to the first control module 120, which is adapted to connect the jig 10 with an external device for mutual communication.

In the embodiment of the present invention, after the pressure applied to the pin of the device under test 20 is determined, it can be determined whether the pressure applied to the pin of the device under test 20 is within the predetermined pressure range. If the pressure applied to the pin of the device under test 20 exceeds the predetermined pressure range, the pressure applied to the pin of the device under test 20 may be adjusted before the test, so that the pressure applied to the pin of the device under test 20 is within the predetermined pressure range.

Referring to fig. 1 to 3, the jig 10 may further include a fixing assembly 119. The fixing member 119 is used to connect the cap 111 and the base 112, and adjust the distance between the cap 111 and the base 112 so that the pins of the device under test 20 are subjected to a pressure within a predetermined pressure range.

FIG. 4 is a simplified cross-sectional view of a connection between the clip cover and the base in an embodiment of the present invention; FIG. 5 is a simplified cross-sectional view of the clip cover and base in an exploded condition in accordance with an embodiment of the present invention.

As shown in fig. 4 and 5, in some specific examples, the cover 111 has a downward turned edge 111a turned from the bottom to the outside, and the base 112 has an upper edge 112a matching with the downward turned edge 111 a. The fixing assembly 119 includes a first threaded hole 119a formed in the lower flange 111a of the cover 111, a second threaded hole 119b formed in the upper edge 112a of the base 112, and a screw 119c for screwing the first threaded hole 119a and the second threaded hole 119 b.

In the embodiment of the present invention, when the pin of the device under test 20 is subjected to a pressure exceeding a predetermined pressure range, the distance between the clamping cover 111 and the base 112 can be adjusted by changing the position of the screw 119c in the first threaded hole 119a and/or the second threaded hole 119 b.

When the distance between the cover 111 and the base 112 is changed, the degree of compression of the first elastic member 118a is changed accordingly, and the elastic force generated by the first elastic member 118a due to the compression is also changed, so that the interaction force between the temperature acquisition unit 116 and the device under test 20 and the interaction force between the pins of the device under test 20 and the probes 30 are also changed. When the interaction force between the pin of the device under test 20 and the probe 30 changes, the pressure applied to the pin of the device under test 20 also changes.

Thus, in the embodiment of the present invention, the distance between the clip cover 111 and the base 112 can be adjusted by changing the positions of the screws 119c in the first threaded holes 119a and/or the second threaded holes 119b, so that the pins of the device under test 20 are subjected to a pressure within a predetermined pressure range.

It is noted that "changing the position of the screw 119c in the first threaded hole 119a and/or the second threaded hole 119 b" is the same as the principle and manner of screwing the screw in the related art. This may be useful to understand the manner in which the securing assembly 119 of fig. 4 and 5 operates.

FIG. 6 is a simplified cross-sectional view of another embodiment of the present invention showing the connection between the clip cover and the base; FIG. 7 is a simplified cross-sectional view of a clip cover and base in another exploded configuration in accordance with an embodiment of the present invention.

As shown in fig. 6 and 7, the fixing member 119 may further include an external thread portion 119d provided to a bottom outer circumferential sidewall of the clip cover 111 and an internal thread portion 119e provided to a top inner circumferential sidewall of the base 112. The female screw portion 119e and the male screw portion 119d are screwed together.

In the embodiment of the present invention, when the pin of the device under test 20 is subjected to a pressure exceeding a predetermined pressure range, the distance between the clip cover 111 and the base 112 can be adjusted by changing the position of the connection between the internal thread portion 119e and the external thread portion 119 d.

Thus, in the embodiment of the present invention, the distance between the clip cover 111 and the base 112 can be adjusted by changing the position of the connection between the internal thread portion 119e and the external thread portion 119d so that the pin of the device under test 20 is subjected to a pressure within a predetermined pressure range.

It is understood that, in the embodiment of the present invention, the external thread portion 119d may be provided on the base 112, and the internal thread portion 119e may be provided on the clip cover 111.

The embodiment of the invention also provides equipment for testing. The apparatus may include a second control module. The second control module is adapted to obtain a pressure signal of the device under test 20 from the fixture 10 provided in the embodiment of the present invention, determine the pressure applied to the pin of the device under test 20 based on the pressure signal of the device under test 20, and determine whether the pressure applied to the pin of the device under test 20 is within a predetermined pressure range.

In particular, the apparatus may include production test equipment and burn-in test equipment. The production test equipment can be used for performance test of the device 20 to be tested, and the burn-in test equipment can be used for burn-in test of the device 20 to be tested.

In some specific examples, the apparatus may be an incubator for testing the device under test 20. The oven may be a high temperature oven suitable for testing the device under test 20 as is known in the art.

In other specific examples, the device may include at least one slot module; each of the at least one socket module includes at least one temperature zone sub-module, and each of the at least one temperature zone sub-module is used for testing the device 20 to be tested.

Fig. 8 is a schematic structural diagram of an apparatus for testing in the embodiment of the present invention.

As shown in fig. 8, the device 40 may include a chassis 41 and at least one slot module (not shown in fig. 8) disposed within the chassis 41.

Specifically, the cabinet 41 may include a first case 411, a second case 412 located behind the first case 411, and a third case 413 located above the second case 412. The first box 411, the second box 412 and the third box 413 are all suitable for accommodating cards and/or cables in the slot module.

FIG. 9 is a diagram of the hardware architecture of a socket module in an embodiment of the present invention.

As shown in fig. 9, each socket module 42 includes at least one temperature zone sub-module 420. Each temperature zone sub-module 420 is used to test at least one device under test 20.

Each temperature zone sub-module 420 may further include at least one temperature control unit, each temperature control unit corresponding to at least one device under test 20.

Specifically, each temperature zone sub-module 420 includes a system control board 421 for controlling the test and a DPS (DPS: device under test power supply) board 422 communicably connected to the system control board 421 and supplying a dc voltage-stabilized power supply.

In this description, "communicatively coupled" means that two elements may receive and/or transmit data from each other based on a communication protocol. In the embodiment of the present invention, communication is possible between the system control board 421 and the DPS board 422, for example, the system control board 421 transmits control information to the DPS board 422 to control the parameter configuration of the latter, which one or ones of the circuits provide power output, and the like, and the DPS board 422 transmits status information to the system control board 421 to feed back the parameter configuration status, the operation status, and the like of the former.

At least one temperature control unit in each temperature zone sub-module 420 can be integrated into the system control board 421 of the temperature zone sub-module 420 for testing at least one device under test 20.

In some specific examples, the control of the dut 20 by the system control board 421 may include process control, temperature control, DPS parameter configuration and monitoring, hardware system communication, human interface control, key parameter monitoring and backup saving, universal excitation interface control, and abnormal protection control. The board card hardware of the system control board 421 may be composed of a processor, a memory, a network communication circuit, a general excitation signal isolation protection circuit, and the like.

In some specific examples, the processor of the system control board 421 may include the second control module of embodiments of the present invention.

In the embodiment of the present invention, the system control board 421 may implement the determination of the start, interruption, pause, and end of the test, the control of powering on/off the device under test 20, the control of turning on/off the temperature control, and the control of powering off and dissipating heat of the device under test 20 at the time of the occurrence of the abnormality.

The system control board 421 is further adapted to invoke a temperature control unit, DPS board 422, to implement real-time monitoring of parameters of the device under test 20, such as operating voltage, current, temperature, etc.

The system control board 421 is further adapted to determine whether the operating voltage, current, temperature, and other parameters of the device 20 are within a normal operating range, and perform alarm or error reporting processing according to the relevant determination conditions under the abnormal condition that the operating voltage, current, temperature, and other parameters exceed the normal operating range, and in case of serious conditions, the system control board can also directly complete the power-down operation of the device 20 to be tested, so as to ensure the normal and stable operation of the system and the safety of the device 20 to be tested.

The system control board 421 is also suitable for implementing the configuration of the DPS board parameters and the configuration of the testing temperature parameters, including not only the configuration of the voltage, current, temperature, etc. required by the test, but also the parameter settings for alarm and error reporting of these parameters.

The system control board 421 is further adapted to upload the critical data in the testing process to the server in real time to complete the storage and backup of the data.

In an embodiment of the present invention, the DPS board 422 includes a multi-channel device under test power supply circuit for providing operating power to the device under test 20.

For example, the DPS board 422 may include 5 devices under test power supply circuits. The output current of the power supply circuit of the 1 path of device to be tested is large, and the maximum output current of the power supply circuit can be 50 amperes so as to supply power to the core of the device to be tested 20; the output current of the 4 paths of power circuits of the device under test is small, and the maximum output current of the 4 paths of power circuits of the device under test can be 25 amperes, so that power is supplied to other modules in the device under test 20. Therefore, the power supply device can meet the diversified requirements of different parts of the same device to be tested on the power supply.

Referring to fig. 9, each socket module 42 may further include a socket interface board 423 adapted to relay the control signals and the power signals. The socket interface board 423 is connected to the system control board 421 and the DPS board 422 of each temperature zone submodule 420.

In an embodiment of the invention, the apparatus 40 further comprises at least one load board 43. Each slot module 42 is connected to a respective loadboard 43 via its slot interface board 423.

Fig. 10 is a simplified schematic diagram of a load board in an embodiment of the present invention.

As shown in fig. 10, each load plate 43 includes at least one temperature controlled zone 430, and each temperature controlled zone 430 includes at least one temperature controlled sub-zone 431.

In the embodiment of the present invention, each temperature control area 430 is correspondingly connected to one temperature area sub-module 420, and each temperature control sub-area 431 is correspondingly connected to one temperature control unit. Each load board 43 is adapted to receive at least one clamp 10 provided by an embodiment of the present invention.

In some preferred embodiments, each temperature controlled sub-area 431 in each load plate 43 is adapted to accommodate one clamp 10. Each temperature control unit is adapted to be connected to one fixture 10 in sequence through one socket interface board 423 and one temperature control sub-area 431 of one load board 43, respectively, so as to control the testing of the device under test 20 in the fixture 10.

In some specific examples, each load board 43 may also be provided with at least one interface socket. Each of the at least one interface socket is adapted to be connected to a respective one of the clamps 10. Specifically, the interface socket may interface with a control interface 140 in the fixture 10.

Further, in the embodiment of the present invention, the load board 43 is also electrically connected to pins of the device under test 20 through the probes 30.

Referring to fig. 9, each socket module 42 may further include a clip power supply 424 connected to the socket interface board 423. The fixture power supply 424 is adapted to supply power to the fixture 10 electrically connected to the load board 43 through the socket interface board 423.

Specifically, the jig power supply 424 is adapted to convert an external ac power into a dc power and supply the dc power to the jig 10 through the socket interface board 423 and the load board 43 in this order. For example, the chuck power supply 424 may convert 220V AC power to 12V DC power and provide the same to the chuck 10.

In the embodiment of the present invention, each slot module 42 may further include at least one human-computer interaction module, and each human-computer interaction module of the at least one human-computer interaction module corresponds to one temperature zone sub-module 420.

Each slot module 42 may also include a man-machine interface board 425 coupled to the slot interface board 423. Each man-machine interaction module is respectively connected with one temperature zone submodule 420 through a corresponding man-machine interface board 425 and a corresponding slot interface board 423.

Each socket module 42 may also include a system control power supply 426 connected to the socket interface board 423. The system control power source 426 is adapted to convert an external ac power into a dc power and supply the dc power to the system control board 421 and the DPS board 422. For example, the system control power source 426 may convert 220V of ac power into 9V of dc power and provide it to the system control board 421 and the DPS board 422.

Each slot module 42 may also include a network switch 427 connected to slot interface board 423. The network switch 427 is adapted to communicatively connect the system control board 421 in the slot module 42 with an external terminal device.

In some specific examples, device 40 also includes a master switch communicatively coupled to each of network switches 427. The master switch is adapted such that each network switch 427 is communicatively coupled to an external end device.

In the embodiment of the present invention, the external terminal device may be a data configuration terminal, a maintenance terminal, a monitoring terminal, a data server, and the like of the device 40.

Each socket module 42 may also include cables connected to the socket interface board 423.

In the embodiment of the present invention, the cables include at least one or more of a power cable connecting the socket interface board 423 and the system control power supply 426, a power cable connecting one socket interface board 423 and the clamp power supply 424, a network cable connecting one socket interface board 423 and the network switch 427, and a signal cable connecting one socket interface board 423 and the man-machine interface board 425.

In some preferred embodiments, the system control board 421 and the DPS board 422 of the slot module 42 are adapted to be received within the third casing 413 of the housing 41, and the cabling routed by the slot module 42 is adapted to be received within the second casing 412 of the housing 41.

In other specific examples, one or more of the system control power supply 426, the network switch 427, and the fixture power supply 424 connected to the slot module 42 are also adapted to be housed within the second enclosure 412 of the chassis 41.

With continued reference to fig. 8, the second casing 412 and/or the third casing 413 may further be provided with a heat dissipation assembly 417 to dissipate heat of the boards and/or cables disposed in the second casing 412 and/or the third casing 413, so as to ensure the working stability and safety of the device 40.

The first housing 411 in the housing 41 may be used to house a human-machine interaction module.

Referring to fig. 8, in some specific examples, each human-computer interaction module may include a user operation unit 414 adapted to operate the corresponding temperature zone sub-module 420 and an indicator lamp 415 adapted to display an operating state of the corresponding temperature zone sub-module 420.

Further, the user operation unit 414 may be configured as a user key. The tester can directly operate the device 40 through the user keys to start testing, end testing, power-on, power-off, heating and radiating operations of the device 20 to be tested, and clear the current alarm state.

Specifically, the user operation unit 414 and the indicator lamp 415 in each human-computer interaction module are correspondingly connected to one temperature zone sub-module 420 through a human-computer interface board 425 and a socket interface board 423.

In some preferred embodiments, the user operation unit 414 and the indicator light 415 of each human-computer interaction module may be disposed at a front side of the first housing 411 for user operation and observation.

In other preferred embodiments, a power switch 416 may be further disposed at the front side of the first housing 411. The power switch 416 is adapted to control the device 40 to start or stop operation.

The embodiment of the invention also provides a system for testing. The system comprises the clamp 10, the equipment 40 and a second connecting line for connecting the clamp 10 and the equipment 40, wherein the second connecting line is suitable for transmitting a pressure signal to which the device under test 20 is subjected from the clamp 10 to the equipment 40.

It is noted that the fixture 10 in this system does not include the first control module 120, while the apparatus 40 includes the second control module. The second control module is adapted to determine the pressure applied to the pin of the device under test 20 based on the pressure signal of the device under test 20 and determine whether the pressure applied to the pin of the device under test 20 is within a predetermined pressure range.

The embodiment of the invention also provides a platform for testing.

As shown in fig. 11, the platform 50 for testing has an open shelf structure to facilitate heat dissipation during testing.

Specifically, the platform 50 may include a support 51 having a plurality of stages 511 and the apparatus 40 detachably disposed on each stage 511. Wherein the cabinet 41 in the device 40 is supported by a rack 51.

While specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even where only a single embodiment is described with respect to a particular feature. The characteristic examples provided in the present disclosure are intended to be illustrative, not limiting, unless differently stated. In particular implementations, the features of one or more dependent claims may be combined with those of the independent claims as technically feasible according to the actual requirements, and the features from the respective independent claims may be combined in any appropriate manner and not merely by the specific combinations enumerated in the claims.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A jig (10) for testing, characterized by comprising a jig cover (111), a base (112), a temperature-collecting unit (116), and a first elastic member (118a), the clamping cover (111) and the base (112) together form a first cavity (113) suitable for accommodating a device under test (20), a temperature acquisition unit (116) and a first elastic piece (118a), the device under test (20) having pins, the base (112) being provided with probes (30) adapted to be electrically connected to the pins, the temperature acquisition unit (116) is connected with the clamping cover (111) through the first elastic piece (118a) and is suitable for being abutted with the device to be tested (20) so as to acquire a temperature signal of the device to be tested (20), the first elastic piece (118a) is suitable for being compressed when the temperature acquisition unit (116) abuts against the device under test (20) so that the pin is in conductive connection with the probe (30).

2. The jig (10) of claim 1, comprising a heating unit (114) housed within the first cavity (113) and adapted to heat the device under test (20).

3. The jig (10) according to claim 2, characterized by comprising a heat conduction unit (115) housed in the first cavity (113) and adapted to conduct heat generated by the heating unit (114) to the device under test (20).

4. The clamp (10) according to claim 3, characterized in that said temperature acquisition unit (116) is partially housed inside said thermally conductive unit (115), the end of which adapted to abut against said device under test (20) extending outside said thermally conductive unit (115) when said first elastic element (118a) is not compressed.

5. The clamp (10) according to any one of claims 1 to 4, comprising a pressure acquisition unit (117) housed in the first cavity (113) and adapted to acquire a pressure signal of the device under test (20) to determine the pressure to which the pin is subjected when the temperature acquisition unit (116) is abutted against the device under test (20).

6. The clamp (10) according to claim 5, wherein the pressure acquisition unit (117) is fixed to the clamp cover (111) and connected with the temperature acquisition unit (116) through the first elastic member (118 a).

7. The clamp (10) according to claim 5, characterized in that it comprises a second elastic element (118b) for connecting said pressure acquisition unit (117) and said clamp cover (111), suitable to be compressed when said temperature acquisition unit (116) is abutted against said device under test (20) so as to make said pressure acquisition unit (117) abut against said device under test (20).

8. The clamp (10) according to claim 5, comprising a first control module (120) connected to the pressure acquisition unit (117) and adapted to determine the pressure to which the pin is subjected based on a pressure signal of the device under test (20) and to determine whether the pressure to which the pin is subjected is within the predetermined pressure range.

9. The clamp (10) according to any one of claims 1 to 4, 6 to 8, characterized in that the first elastic member (118a) is adapted to be compressed when the temperature acquisition unit (116) abuts against the device under test (20) so that the pressure to which the pins are subjected is within a predetermined pressure range.

10. The clamp (10) according to any one of claims 1 to 4, 6 to 8, comprising a fixing assembly (119) connecting both the clamp cover (111) and the base (112) and adapted to adjust the distance between the two so that the pressure to which the pins are subjected is within a predetermined pressure range.

11. The clamp (10) according to claim 10, characterized in that said fixing assembly (119) comprises a first threaded hole (119a), a second threaded hole (119b) and a screw (119c) in threaded connection with said first threaded hole (119a) and said second threaded hole (119b), respectively provided to said two, adjusting the distance between said two being achieved by varying the position of said screw (119c) in said first threaded hole (119a) and/or said second threaded hole (119 b).

12. The clamp (10) according to claim 10, wherein the fixing assembly (119) comprises an internal threaded portion (119e) provided to one of the two and an external threaded portion (119d) provided to the other of the two, the internal threaded portion (119e) and the external threaded portion (119d) being screwed, the adjustment of the distance between the two being achieved by varying the position of the connection between the internal threaded portion (119e) and the external threaded portion (119 d).

13. An apparatus (40) for testing, comprising a second control module adapted to obtain a pressure signal of the device under test (20) from the fixture (10) of any of claims 5 to 7, determine a pressure experienced by the pin based on the pressure signal of the device under test (20), and determine whether the pressure experienced by the pin is within a predetermined pressure range.

14. The apparatus (40) of claim 13, wherein the apparatus (40) comprises a production test apparatus and a burn-in test apparatus.

15. The apparatus (40) of claim 14, wherein the apparatus (40) is an incubator for testing the device under test (20).

16. The apparatus (40) of claim 15, wherein the apparatus (40) includes at least one slot module (42); each slot module (42) of the at least one slot module (42) comprises at least one temperature area submodule (420), and each temperature area submodule (420) of the at least one temperature area submodule (420) is used for testing a device (20) to be tested.

17. The apparatus (40) of claim 16, wherein each temperature zone sub-module (420) includes a system control board (421) for controlling testing.

18. The apparatus (40) of claim 17, wherein each temperature zone sub-module (420) includes a DPS board (422) communicably connected to the system control board (421) and providing regulated dc power.

19. The apparatus (40) of claim 18, wherein the DPS board (422) includes a multiple device under test power supply circuit for providing operating power to the device under test (20).

20. The apparatus (40) of claim 16, wherein each socket module (42) includes a load board (43), the load board (43) being conductively connected to pins of the device under test (20) through the probes (30).

21. A system for testing, characterized in that it comprises a clamp (10) according to any one of claims 5 to 7, a device (40) according to any one of claims 13 to 20, and connecting lines connecting the clamp (10) and the device (40), said connecting lines being adapted to transmit the pressure to which the device under test (20) is subjected from the clamp (10) to the device (40).