CN113943966A - Electroplating device and electroplating method for circuit board - Google Patents
Electroplating device and electroplating method for circuit board Download PDFInfo
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- CN113943966A CN113943966A CN202010688421.3A CN202010688421A CN113943966A CN 113943966 A CN113943966 A CN 113943966A CN 202010688421 A CN202010688421 A CN 202010688421A CN 113943966 A CN113943966 A CN 113943966A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000007747 plating Methods 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 20
- 230000001502 supplementing effect Effects 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000010405 anode material Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 229910021645 metal ion Inorganic materials 0.000 description 8
- 239000007921 spray Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 2
- 230000005288 electromagnetic effect Effects 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses an electroplating device and an electroplating method of a circuit board, wherein the electroplating device comprises anodes arranged at two sides of the circuit board; the plurality of rectifiers correspond to the positions of the anodes one by one and are arranged adjacent to the anodes; the plurality of rectifiers are used for outputting current matched with the specific surface area of each part of the circuit board corresponding to the position of the anode, and the plurality of rectifiers are used for enabling the anode to release electrons matched with the specific surface area of each part of the circuit board so as to enable the circuit board to be electroplated uniformly. The invention arranges the rectifier at the corresponding position of the anode, so that the rectifier outputs the current matched with the specific surface area of each part of the circuit board corresponding to the position of the anode, and the anode releases the electrons matched with the specific surface area of each part of the circuit board, so that the circuit board is uniformly electroplated. The rectifier output matched current corresponding to the anode position is determined through the specific surface area of each part of the circuit board, so that the purpose of uniform electroplating of the hole surface of the circuit board is achieved, the structure is simple, and the operation is convenient.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board electroplating device and method.
Background
Circuit boards are providers of electrical connections for electronic components. Due to the high concentration of interconnect lines resulting from the increased packaging density of integrated circuits, the use of double-sided boards and even multi-layer boards has become necessary, and drilling has to be performed in order to achieve electrical connections between the multi-layer boards. Copper has good electrical conductivity, thermal conductivity and electrical resistivity, high reliability, good ductility and other characteristics, and is widely used as an interconnection material in the manufacture of very large integrated circuits and circuit boards at present.
In the process of manufacturing the circuit board, a layer of extremely thin copper is obtained on the board surface and in the holes of the circuit board through a chemical copper deposition process. But the uniformity of the electroplated copper layer is relatively poor because the circuit board has the phenomenon of uneven distribution of the anode area in the electroplating process. Although the anode baffle and cathode floating frame design technology adopted in the prior art can block partial high-potential current, the phenomenon of uneven current distribution is caused due to different hole numbers and inconsistent specific surface areas at different positions of the circuit board.
Disclosure of Invention
The invention mainly provides an electroplating device and an electroplating method for a circuit board, which solve the problem of uneven electroplating of the hole surface of the circuit board in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: providing an electroplating device of a circuit board, wherein the electroplating device comprises anodes arranged at two sides of the circuit board; the plurality of rectifiers correspond to the positions of the anodes one by one and are arranged adjacent to the anodes; the plurality of rectifiers are used for outputting current matched with the specific surface area of each part of the circuit board corresponding to the position of the anode, and the plurality of rectifiers are used for enabling the anode to release electrons matched with the specific surface area of each part of the circuit board so as to enable the circuit board to be electroplated uniformly.
Wherein, a plurality of commutators arrange in proper order and set up on two cowling panels, and two cowling panels set up respectively in one side of both sides positive pole.
The electroplating device further comprises a liquid supplementing device, wherein the liquid supplementing device is arranged on one side of the rectifier and used for releasing electroplating liquid matched with the specific surface area of each part of the circuit board.
The anode comprises a first anode and a second anode, the first anode and the second anode are respectively connected with the rectifier, the first anode comprises a titanium basket, and the titanium basket is used for loading anode materials; the second anodes are multiple and are connected with the corresponding rectifying machines.
In order to solve the above technical problems, the second technical solution adopted by the present invention is: provided is a method for plating a circuit board, including: acquiring electroplating characteristic information of a circuit board; the electroplating characteristic information comprises position information of each part of the circuit board and a specific surface area corresponding to each part; controlling the current of a rectifier which is arranged adjacent to the anode and corresponds to the circuit board in position, so that the anode corresponding to each part of the circuit board releases electrons matched with the specific surface area corresponding to each part of the circuit board, and the circuit board is uniformly electroplated; the plurality of the rectifiers are respectively in one-to-one correspondence with the parts of the circuit board corresponding to the anodes.
The step of acquiring the electroplating characteristic information of the circuit board specifically comprises the following steps: collecting image information of the circuit board; acquiring parameter information of the circuit board through the image information of the circuit board; and determining the electroplating characteristic information of the circuit board according to the parameter information of the circuit board.
The step of controlling the current of the rectifier, which is arranged adjacent to the anode and corresponds to the circuit board in position, so that the anode corresponding to each part of the circuit board releases electrons matched with the specific surface area corresponding to each part of the circuit board in quantity to enable the circuit board to be electroplated uniformly specifically comprises the following steps: determining the current of a rectifier corresponding to each part of the circuit board through the specific surface area of the circuit board; controlling the current of a rectifier corresponding to the specific surface area position of the circuit board, so that the anode connected with the rectifier releases electrons matched with the specific surface area quantity corresponding to each part of the circuit board; and obtaining electrons with the same quantity as the electrons released by the corresponding anode at the position of the circuit board corresponding to the rectifier, and electroplating the circuit board.
The step of determining the current of the rectifier corresponding to each part of the circuit board through the specific surface area of the circuit board specifically comprises the following steps: judging whether the specific surface area of the circuit board is larger than a preset value or not; and if the specific surface area of the circuit board is larger than a preset value, activating the rectifier.
Wherein, the step of controlling the current of the rectifier which is arranged adjacent to the anode and the position of which corresponds to the circuit board so that the anode corresponding to the position of each part of the circuit board releases electrons with the quantity matched with the specific surface area corresponding to each part of the circuit board to ensure that the circuit board is electroplated uniformly further comprises: determining the dosage of the replenishing electroplating solution of the solution replenishing device according to the specific surface area of the circuit board; and controlling the liquid supplementing device corresponding to the specific surface area position of the circuit board to release the metal ion supplementing liquid for electroplating to the circuit board.
The method comprises the steps of obtaining electroplating characteristic information of a circuit board; wherein, the step that the electroplating characteristic information includes the position information of each part of the circuit board and the corresponding specific surface area of each part still includes before: and establishing a corresponding relation table of the preset specific surface area, the current applied by the rectifier and the dosage of the electroplating solution released by the solution supplementing device.
The invention has the beneficial effects that: the electroplating device of the circuit board is characterized in that a rectifier is arranged at a position corresponding to an anode, so that the rectifier outputs current matched with the specific surface area of each part of the circuit board corresponding to the anode, and the anode releases electrons matched with the specific surface area of each part of the circuit board, so that the circuit board is electroplated uniformly. The current that this application corresponds the output of rectifier and matches is confirmed the anode position through the specific surface area of each part of circuit board to reach the even purpose of circuit board hole face electroplating, simple structure, convenient operation.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of a circuit board electroplating apparatus according to the present invention;
FIG. 2 is a schematic diagram of an embodiment of a current plate in the circuit board electroplating apparatus of FIG. 1;
FIG. 3 is a schematic flow chart of a first embodiment of the circuit board electroplating method of the present invention;
FIG. 4 is a schematic flow chart of a circuit board electroplating method according to a second embodiment of the present invention;
FIG. 5 is a flow chart illustrating a second embodiment of the method for electroplating a circuit board according to the present invention.
Detailed Description
The following describes in detail the embodiments of the present application with reference to the drawings attached hereto.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
In order to make those skilled in the art better understand the technical solution of the present invention, a circuit board electroplating apparatus and an electroplating method according to the present invention are described in further detail below with reference to the accompanying drawings and the detailed description.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of an electroplating apparatus for a circuit board according to the present invention; FIG. 2 is a schematic structural diagram of an embodiment of a rectifying plate in the circuit board electroplating apparatus of FIG. 1. In this embodiment, the circuit board electroplating apparatus 1 is used for electroplating copper on a hole surface of a circuit board 16 to be electroplated, and the electroplating apparatus 1 includes an electroplating cylinder 11 for containing an electroplating solution 12, an anode installed inside the electroplating cylinder 11, a rectifying plate 17, a copper dissolving tank 13, a liquid supplementing device and a fixing member. The anode includes a first anode 14 and a second anode 15.
The rectifying plate 17 is composed of a plurality of small rectifying machines 18 which are arranged in sequence, two sides of the rectifying plate 17 are respectively adjacent to the first anode 14 and the copper dissolving tank 13, and the rectifying plate 17 is electrically connected with a fixing piece of the clamped circuit board 16 to be electroplated. In the present embodiment, the number of the rectifying plates 17 is two, and the two rectifying plates 17 are respectively provided on both sides of the inside of the plating cylinder 11. The small rectifier 18 on the rectifying plate 17 is used for outputting current, and the output current is matched with the specific surface area of the corresponding part of the circuit board 16 to be electroplated corresponding to the position of the second anode 15. In one embodiment, the rectifying plate 17 serves as an insoluble anode, which may be a titanium mesh.
The copper dissolving tank 13 is provided with an open groove at the bottom, a plurality of second anodes 15 are accommodated in the copper dissolving tank 13, the copper dissolving tank 13 is immersed in the electroplating solution 12, the electroplating solution 12 is immersed in the second anodes 15, the plurality of second anodes 15 are connected with the small rectifying machines 18 at corresponding positions on the adjacent rectifying plates 17 through leads 21, and the positions of the small rectifying machines 18 on the plurality of second anodes 15 and the rectifying plates 17 are correspondingly arranged. In this embodiment, there are two copper dissolution tanks 13, and the two copper dissolution tanks 13 are respectively disposed on both sides of the interior of the plating cylinder 11. The material of the second anode 15 in this embodiment may be metallic copper.
The first anode 14 and the second anode 15 are connected to a rectifier 18, respectively, and the plurality of second anodes 15 are connected to the corresponding rectifiers 18. The positions of the rectifying plate 17, the second anode 15 and each part of the circuit board to be electroplated 16 clamped by the fixing piece correspond to one another. The first anode 14 includes a titanium basket 14, the titanium basket 14 is used for loading anode material, the first anode 14 is connected to the positive pole of the rectifier 18 through a lead 21, in this embodiment, the rectifier 18 connected to the first anode 14 is a power supply 20, and the negative pole of the power supply 20 is connected to one end of the fixing member through the lead 21. One end of the first anode 14 is immersed in the plating solution 12 contained in the plating tank 11, and the size of the first anode 14 is not smaller than that of the circuit board 16 to be plated. In the present embodiment, there are two first anodes 14, and the two first anodes 14 are respectively disposed on two sides of the circuit board 16 to be plated. In this embodiment, the material of the second anode 15 may be the metal to be plated. The fixing member is made of a conductive material.
The liquid supplementing device is a spray pipe 19 which can convey the electroplating cation solution, one end of the spray pipe 19 can be communicated with the copper dissolving tank 13, and can also be communicated with equipment for storing the electroplating solution 12 outside the electroplating device 1; the other end of the spray pipe 19 passes through the rectifying plate 17 and the first anode 14 and extends to the position near the surface of the circuit board 16 to be electroplated, a control valve 20 is arranged on the spray pipe 19, and the system controls the dosage of the replenishing electroplating solution 12 of the solution replenishing device through controlling the on-off of the control valve 20. The nozzles 19 are used to deliver the plating solution 12 near the surface of the circuit board 16 to be plated, and the delivery of the plating solution 12 increases the concentration of plating cations near the circuit board 16 to be plated, thereby improving the plating uniformity of the hole surface of the circuit board 16 to be plated.
In the electroplating device for the circuit board provided by the embodiment, the rectifier is arranged at the position corresponding to the anode, so that the rectifier outputs the current matched with the specific surface area of each part of the circuit board corresponding to the second anode position, and the anode releases electrons matched with the specific surface area of each part of the circuit board, so that the circuit board is uniformly electroplated. The current that this application corresponds the output of rectifier and matches is confirmed the anode position through the specific surface area of each part of circuit board to reach the even purpose of circuit board hole face electroplating, simple structure, convenient operation.
Referring to fig. 3, fig. 3 is a schematic flow chart of a circuit board electroplating method according to an embodiment of the invention. In this embodiment, a method for electroplating a circuit board is implemented by using the electroplating apparatus for a current board provided in the above embodiment, where the circuit board in this embodiment is a circuit board to be electroplated, and the electroplating method specifically includes the following steps:
s1: acquiring electroplating characteristic information of the circuit board; the electroplating characteristic information comprises position information of each part of the circuit board and the corresponding specific surface area of each part.
Specifically, referring to fig. 4, fig. 4 is a schematic flow chart of a circuit board electroplating method according to a second embodiment of the present invention. Step S1 specifically includes:
s11: and establishing a corresponding relation between the preset specific surface area and the current applied by the rectifier and the dosage of the electroplating solution released by the solution supplementing device.
Specifically, before the plating operation is performed, a relationship between the preset specific surface area and the current applied by the rectifier and the amount of the plating liquid required to be discharged by the liquid replenishing device is established in the system. In this example, a table of the correspondence between the preset specific surface area and the amount of the plating liquid applied by the rectifier and discharged by the liquid replenishing device may be established. In another alternative embodiment, because the larger the specific surface area of the circuit board, the more copper is plated on the surface of the circuit board, the more copper is contained in the electroplating solution, the more electrons are obtained by the circuit board, and the larger the current is needed, according to the principle, the relationship between the specific surface area and the applied current, the relationship between the specific surface area and the needed electroplating solution are fitted, and then the corresponding relationship between the specific surface area and the applied current of the rectifier and the amount of the electroplating solution needed to be supplemented by the solution supplementing device is established.
S12: and collecting image information of the circuit board.
Specifically, image information of the circuit board is acquired by an image acquisition device of the system. The image information is a three-dimensional image of the circuit board. Wherein the image acquisition device may be at least one of a camera and a scanning device.
S13: and acquiring the parameter information of the circuit board through the image information of the circuit board.
Specifically, the acquired image information of the circuit board is compared with the image information of the circuit board in the image information base, and if the image information of the corresponding circuit board is found, the parameter information corresponding to the image information of the circuit board is the required parameter information of the circuit board. If the corresponding circuit board is not found, the acquired image information of the circuit board needs to be subjected to parameter identification detection, and the parameter information is determined. The parameter information includes coordinates of different positions of the circuit board, the number of through holes, the hole diameter, the board thickness, the area of the area and the like.
S14: and determining the electroplating characteristic information of the circuit board according to the parameter information of the circuit board.
Specifically, the electroplating characteristic information of the circuit board is obtained by calculation according to the number of through holes of different parts of the circuit board, the aperture of the through holes, the thickness of the board and the area of the different parts. Specifically, the electroplating characteristic information comprises position information of each part of the circuit board and the corresponding specific surface area of each part. And extracting parameters of the number of the through holes, the aperture of the through holes, the plate thickness and the area of the region of different parts of the circuit board, and calculating and outputting the specific surface area corresponding to each part of the circuit board.
S2: and controlling the current of a rectifier which is arranged adjacent to the anode and corresponds to the circuit board in position, so that the anode corresponding to each part of the circuit board releases electrons matched with the specific surface area corresponding to each part of the circuit board, and the circuit board is uniformly electroplated.
Specifically, referring to fig. 5, fig. 5 is a schematic flow chart of a circuit board electroplating method according to a third embodiment of the present invention. Step S2 specifically includes:
s21: and judging whether the specific surface area of the circuit board is larger than a preset value or not.
Specifically, the specific surface area of the circuit board determined in step S1 is compared with a preset value. And judging whether the circuit board needs to supplement extra current or not. If the specific surface area of the circuit board is greater than a preset value, a rectifier needs to be started to supplement the extra current. If the specific surface area of the circuit board is smaller than or equal to the preset value, the circuit board indicates that the part of the circuit board does not need to be supplemented with extra current, namely, the rectifier does not need to be started.
S22: the rectifier is activated.
Specifically, if the specific surface area of the circuit board is greater than the preset value, it indicates that the part of the circuit board needs to be electroplated with copper in an amount greater than the preset copper plating amount, and the rectifying plate needs to be activated to apply additional current.
S23: the dosage of the plating solution supplemented by the solution supplementing device is determined according to the specific surface area of the circuit board.
Specifically, the amount of the replenishing electroplating solution corresponding to the specific surface area is searched in a corresponding relation table of the preset specific surface area and the amount of the released electroplating solution, and then the amount of the electroplating solution to be released by the solution replenishing device corresponding to the specific surface area at different positions of the circuit board is determined. In another alternative embodiment, the specific surface area of different positions of the circuit board is input into the relation between the specific surface area and the plating solution dosage of the solution supplementing device, and the dosage of the required plating solution corresponding to different positions of the circuit board is output.
S24: and controlling the liquid supplementing device corresponding to the specific surface area position of the circuit board to release the metal ion supplementing liquid for electroplating to the circuit board.
Specifically, the control valve in the liquid supplementing device controls the corresponding electroplating liquid released by the spray pipe at the position corresponding to the specific surface area of different positions of the circuit board. The plating solution is a metal ion replenishment solution for plating.
S25: the specific surface area of the circuit board determines the current of the corresponding rectifier of each part of the circuit board.
Specifically, the extra current to be applied by the rectifier corresponding to the specific surface area is searched in the corresponding relation table of the preset specific surface area and the current applied by the rectifier, so that the extra current to be applied to the anode by the rectifier at different positions of the rectifying plate is determined. In another alternative embodiment, the specific surface areas of different positions of the circuit board are input into the relation between the specific surface area and the applied current of the rectifier, and the additional applied current required corresponding to different positions of the circuit board is output.
S26: controlling the current of a rectifier corresponding to the specific surface area position of the circuit board, so that the anode connected with the rectifier releases electrons matched with the specific surface area quantity corresponding to each part of the circuit board; and obtaining electrons with the same quantity as the electrons released by the corresponding anode at the position of the circuit board corresponding to the rectifier, and electroplating the circuit board.
Specifically, the current to be applied by the rectifier connected with the anode corresponding to different parts of the circuit board is determined according to the obtained electroplating characteristic information of the circuit board, and the current applied by the rectifier corresponding to the position of the anode is controlled. The current applied by the commutators corresponding to the different parts of the circuit board enables the corresponding anodes to release the matched electrons. The anode in the copper dissolving tank loses electrons and is oxidized into metal ions, the concentration of metal ions to be electroplated in electroplating solution in the copper dissolving tank is increased, and the electroplating solution in the copper dissolving tank enables liquid with high concentration of the metal ions to be electroplated to be diffused to the position near the surface of the circuit board through openings at the upper end and the lower end, so that the concentration of the metal ions to be electroplated in the electroplating solution near the circuit board is increased. The position of the circuit board corresponding to the rectifier simultaneously obtains electrons with the same quantity as the electrons released by the corresponding anode, and metal ions in the electroplating solution are separated out on the circuit board as the cathode. Because an electromagnetic effect can be generated between the anode and the circuit board, the position of the circuit board corresponding to the rectifier applying current is relative to the position not applying current, and the position is easier to make the metal to be plated in the electroplating solution be deposited on the circuit board. And applying current according to the specific surface area, controlling the anode to lose matched electrons, and controlling the cathode to obtain the same number of electrons, so that metal cations in the electroplating solution are sucked out of the corresponding position of the circuit board according to the electromagnetic effect, thereby realizing uniform electroplating of the circuit board.
In one embodiment, a table of the relationship between the preset specific surface area and the current applied by the rectifier and the amount of the plating solution released by the solution replenishing device is established in the system. The method comprises the steps of collecting three-dimensional image information of a circuit board by adopting a scanner, comparing the collected image information of the circuit board with images in a circuit board gallery, determining parameter information such as the number, the aperture, the plate thickness and the area of through holes of the circuit board with the same circuit board image information as the parameter information of the circuit board for collecting the images, calculating specific surface areas of different positions of the circuit board according to coordinates, the number, the aperture, the plate thickness and the area of the through holes of the circuit board at different positions, comparing the calculated specific surface areas with preset values, determining that the specific surface areas corresponding to partial positions of the circuit board are larger than the preset values, and activating the corresponding rectifying machines of the partial positions. And searching the corresponding applied current and the amount of the electroplating solution to be supplemented of the part of the specific surface area in a table establishing the corresponding relation between the preset specific surface area and the applied current and the amount of the electroplating solution to be supplemented of the rectifier. Controlling the current of a rectifier corresponding to the specific surface area position of the circuit board, and controlling the dosage of the electroplating solution released by the solution supplementing device corresponding to the specific surface area position of the circuit board; making an anode connected with a rectifier release electrons with the number matched with the specific surface area of each part of the circuit board; and obtaining electrons with the same quantity as the electrons released by the corresponding anode at the position of the circuit board corresponding to the rectifier, and further electroplating the circuit board.
According to the electroplating method of the circuit board, the electroplating characteristic information of the circuit board is obtained, the current of the rectifier at the corresponding position is determined according to the electroplating characteristic information, and then the current of the rectifier corresponding to the anode is controlled, so that the anode corresponding to each part of the circuit board releases electrons matched with the specific surface area corresponding to each part of the circuit board, the purpose of uniform electroplating of the hole surface of the circuit board is achieved, the structure is simple, and the operation is convenient.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An electroplating device of a circuit board is characterized in that,
the electroplating device comprises anodes arranged at two sides of the circuit board;
the plurality of rectifiers are respectively in one-to-one correspondence with the positions of the anodes and are arranged adjacent to the anodes;
the plurality of rectifiers are used for outputting currents matched with the specific surface area of each part of the circuit board corresponding to the position of the anode, and the plurality of rectifiers are used for enabling the anode to release electrons matched with the specific surface area of each part of the circuit board so as to enable the circuit board to be electroplated uniformly.
2. The plating apparatus as recited in claim 1, wherein said plurality of rectifiers are arranged in sequence on two rectifying plates provided on either side of said anode.
3. The plating apparatus as recited in claim 1, further comprising a liquid replenishment device provided at a side of said rectifying machine for discharging a plating liquid matched to a specific surface area of each part of said circuit board.
4. The plating apparatus as recited in claim 1, wherein said anode comprises a first anode and a second anode, said first anode and said second anode being respectively connected to said rectifying machine, said first anode comprising a titanium basket for loading anode material; the second anodes are multiple and connected with the corresponding rectifying machines.
5. A method for electroplating a circuit board, the method comprising:
acquiring electroplating characteristic information of the circuit board; the electroplating characteristic information comprises position information of each part of the circuit board and a specific surface area corresponding to each part;
controlling the current of a rectifier which is arranged adjacent to an anode and corresponds to the circuit board in position, so that the anode corresponding to each part of the circuit board releases electrons matched with the specific surface area corresponding to each part of the circuit board, and the circuit board is uniformly electroplated;
the plurality of the rectifiers are respectively in one-to-one correspondence with the parts of the circuit board corresponding to the anodes.
6. The electroplating method of the circuit board according to claim 5, wherein the step of acquiring the electroplating characteristic information of the circuit board specifically comprises:
collecting image information of the circuit board;
acquiring parameter information of the circuit board through the image information of the circuit board;
and determining the electroplating characteristic information of the circuit board according to the parameter information of the circuit board.
7. The method for electroplating a circuit board according to claim 5, wherein the step of controlling the current of a rectifier disposed adjacent to the anode and corresponding to the circuit board so that the anode corresponding to each portion of the circuit board releases electrons in an amount matching the specific surface area corresponding to each portion of the circuit board to uniformly electroplate the circuit board specifically comprises:
determining the current of the rectifier corresponding to each part of the circuit board through the specific surface area of the circuit board;
controlling the current of the rectifier corresponding to the specific surface area position of the circuit board, so that the anode connected with the rectifier releases electrons with the quantity matched with the specific surface area quantity corresponding to each part of the circuit board; and obtaining electrons with the same quantity as the electrons released by the anode at the position of the circuit board corresponding to the rectifier, and electroplating the circuit board.
8. The method for electroplating a circuit board according to claim 7, wherein the step of determining the current of the rectifier corresponding to each part of the circuit board through the specific surface area of the circuit board further comprises:
judging whether the specific surface area of the circuit board is larger than a preset value or not;
and if the specific surface area of the circuit board is larger than the preset value, activating the rectifier.
9. The method for electroplating a circuit board according to claim 5, wherein the step of controlling the current of a rectifier disposed adjacent to the anode and corresponding to the position of the circuit board so that the anode corresponding to the position of each portion of the circuit board discharges an amount of electrons matching the amount of the specific surface area corresponding to each portion of the circuit board to uniformly electroplate the circuit board further comprises:
determining the amount of the electroplating solution supplemented by the solution supplementing device according to the specific surface area of the circuit board;
and controlling the liquid supplementing device corresponding to the specific surface area position of the circuit board to release electroplating liquid for electroplating to the circuit board.
10. The electroplating method of the circuit board according to claim 5, wherein the obtaining of the electroplating characteristic information of the circuit board; wherein, the step that the electroplating characteristic information comprises the position information of each part of the circuit board and the corresponding specific surface area of each part further comprises the following steps before:
and establishing a corresponding relation table of the preset specific surface area, the current applied by the rectifier and the dosage of the electroplating solution released by the solution supplementing device.
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| CN202010688421.3A CN113943966A (en) | 2020-07-16 | 2020-07-16 | Electroplating device and electroplating method for circuit board |
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| CN202010688421.3A CN113943966A (en) | 2020-07-16 | 2020-07-16 | Electroplating device and electroplating method for circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114959820A (en) * | 2022-05-25 | 2022-08-30 | 景旺电子科技(龙川)有限公司 | Manufacturing method of flexible circuit board with fine circuit and flexible circuit board |
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Application publication date: 20220118 |