CN113894112B - Indium foil surface treatment method - Google Patents
Indium foil surface treatment method Download PDFInfo
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- CN113894112B CN113894112B CN202111074466.2A CN202111074466A CN113894112B CN 113894112 B CN113894112 B CN 113894112B CN 202111074466 A CN202111074466 A CN 202111074466A CN 113894112 B CN113894112 B CN 113894112B
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- indium foil
- indium
- foil
- water
- container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
The invention relates to the technical field of semiconductor packaging, and discloses an indium foil surface treatment method which comprises the following steps: setting an acid container and a plurality of water containers; step two: putting the indium foil into an acid container for pickling; step three: putting the indium foil into a first water container for water washing; step four: putting the indium foil into a second water container for water washing; step five: dripping isopropanol on the surface of the indium foil, and wiping the product on the surface of the indium foil; step six, a step of performing a step of; putting the indium foil into a third water container for water washing; step seven: drying the indium foil; step eight: cutting the indium foil; step nine: and (5) vacuum packaging indium foil. Compared with the prior art, the indium foil with the cleaned surface can avoid packaging failure caused by impurities of the indium foil in the packaging process, the packaging efficiency is improved, and the heat conduction capability of the indium foil is also ensured. The indium foil surface treatment method is simple and reliable and has good cleaning effect.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an indium foil surface treatment method.
Background
In the semiconductor industry, higher-end processors often have larger power consumption, and higher requirements are also put on the heat dissipation performance of the processors. Compared with the traditional silicone grease material, the metal indium has good heat dissipation performance due to the excellent heat conduction capability and special physical characteristics, so the metal material (indium and indium alloy) is the material with the best heat dissipation performance in the industry at present. When the indium foil is used as a packaging material, the metal indium and the indium alloy are often in the form of an indium foil, the prior art mostly only focuses on the manufacturing of the indium foil, but neglects the maintenance of the indium foil, and the surface of the indium foil needs to be treated to have good heat conduction performance in practical operation.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide the indium foil surface treatment method which has the advantages of easiness in operation, short process flow, excellent treatment effect on packaging materials and the like.
Based on the above, the invention provides a surface treatment method of indium foil, which comprises the following steps:
step one: setting an acid container for containing dilute nitric acid solution and a plurality of water containers for containing pure water, pouring dilute nitric acid solution into the acid container, and pouring pure water into the water containers;
step two: clamping an indium foil to be treated, and putting the indium foil into an acid container for pickling;
step three: taking the indium foil out of the dilute nitric acid solution, putting the indium foil into a first water container, and washing the indium foil once;
step four: taking the indium foil out of the pure water and putting the indium foil into a second water container, and performing secondary water washing on the indium foil;
step five: placing an indium foil on dust-free paper, dripping isopropanol on the surface of the indium foil, and wiping a product on the surface of the indium foil;
step six, a step of performing a step of; putting the indium foil into a third water container, and washing the indium foil for three times;
step seven: taking the indium foil out of the pure water, and drying the indium foil to remove water stains on the surface of the indium foil;
step eight: placing an indium foil on a marble platform, and shearing the indium foil;
step nine: vacuum packaging the sheared indium foil.
In some embodiments of the present application, in the first step, the dilute nitric acid solution has a concentration of 3% -10%.
In some embodiments of the present application, in the first step, the indium foil is pickled in a dilute nitric acid solution for a period of time ranging from 5 minutes to 30 minutes.
In some embodiments of the application, in the first step, the water container is provided with more than three water containers.
In some embodiments of the present application, in the second step, the indium foil is pressed into the dilute nitric acid solution by providing a balancing weight.
In some embodiments of the present application, in the third step and the fourth step, the method further comprises providing a conductivity meter to measure the conductivity of the pure water in the water container cleaned with the indium foil.
In some embodiments of the present application, in the seventh step, the indium foil is blown dry with compressed air.
The embodiment of the invention provides a surface treatment method for an indium foil, which has the beneficial effects that compared with the prior art:
the invention provides an indium foil surface treatment method, which is characterized in that stains on the surface of an indium foil are cleaned by a dilute nitric acid solution, and the stains on the surface of the indium foil can be effectively removed on the basis of the chemical property of the dilute nitric acid solution, and the stains do not react with the indium foil more, so that the quality of the indium foil is affected; in order to avoid the influence of residual acid liquor on the surface of the indium foil on packaging, a plurality of water containers are used for containing pure water and other indium foils for cleaning, so that no acid liquor remains; meanwhile, the dilute nitric acid solution still can react with the exposed indium foil to a certain extent, and the isopropanol is dripped and the surface of the indium foil is slowly wiped to remove reaction products of the indium foil and the dilute nitric acid, so that tiny wrinkles generated in the cleaning process can be wiped off at the same time, and the surface of the indium foil is recovered to be glossy; the indium foil with the cleaned surface is used in the subsequent packaging process, so that packaging failure caused by impurities carried by the indium foil can be avoided, packaging efficiency can be improved, and heat conduction capability of the indium foil is ensured.
Drawings
Fig. 1 is a schematic diagram illustrating the operation steps of a surface treatment method for indium foil according to an embodiment of the present invention.
Detailed description of the preferred embodiments
The following describes in further detail the specific implementation of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
It should be understood that the terms "front", "rear", etc. are used in the present invention to describe various information, but the information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, "front" information may also be referred to as "rear" information, and "rear" information may also be referred to as "front" information, without departing from the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a surface treatment method for an indium foil, which includes the following steps: setting an acid container for containing dilute nitric acid solution and a plurality of water containers for containing pure water, pouring the dilute nitric acid solution into the acid container, and pouring the pure water into the water containers; step two, clamping an indium foil to be treated, and putting the indium foil into an acid container for acid washing; step three, taking the indium foil out of the dilute nitric acid solution, putting the indium foil into a first water container, and washing the indium foil once; step four, taking the indium foil out of the pure water and putting the indium foil into a second water container, and carrying out secondary water washing on the indium foil; step five, placing an indium foil on dust-free paper, dripping isopropanol on the surface of the indium foil, and wiping a product on the surface of the indium foil; step six, putting the indium foil into a third water container, and washing the indium foil for three times; step seven, taking the indium foil out of the pure water, and drying the indium foil to remove water stains on the surface of the indium foil; step eight, placing an indium foil on a marble platform, and shearing the indium foil; and step nine, vacuum packaging the sheared indium foil.
Based on the technical characteristics, the stains on the surface of the indium foil are cleaned by the dilute nitric acid solution, and the stains on the surface of the indium foil can be effectively removed on the basis of the chemical property of the dilute nitric acid solution, and the stains do not react with the indium foil more, so that the quality of the indium foil is affected; in order to avoid the influence of residual acid liquor on the surface of the indium foil on packaging, a plurality of water containers are used for containing pure water and other indium foils for cleaning, so that no acid liquor remains; meanwhile, the dilute nitric acid solution still can react with the exposed indium foil to a certain extent, and the isopropanol is dripped and the surface of the indium foil is slowly wiped to remove reaction products of the indium foil and the dilute nitric acid, so that tiny wrinkles generated in the cleaning process can be wiped off at the same time, and the surface of the indium foil is recovered to be glossy; the indium foil with the cleaned surface is used in the subsequent packaging process, so that packaging failure caused by impurities carried by the indium foil can be avoided, packaging efficiency can be improved, and heat conduction capability of the indium foil is ensured.
Specifically, in order to ensure the removal effect of stains on the surface of the indium foil and simultaneously avoid excessive reaction between the indium foil and the dilute nitric acid solution, in the first step, the concentration of the dilute nitric acid solution is 3% -10% (mass ratio), and the pickling time of the indium foil in the dilute nitric acid solution is 5-30 minutes. Obviously, the lower the concentration of the dilute nitric acid solution, the longer the pickling time required for the indium foil, and the pickling time of the indium foil in the dilute nitric acid solution is inversely proportional to the concentration of the dilute nitric acid solution, specifically, in one embodiment of the application, the pickling time is 30 minutes when preparing a 3% dilute nitric acid solution, and in another embodiment of the application, the pickling time is 5 minutes when preparing a 10% dilute nitric acid solution to pickle the indium foil.
Further, for the indium foil in the present application, three water containers are required according to the above steps, the indium foil is cleaned of dilute nitric acid remaining on the surface in the first water container and the second water container, and the indium foil is cleaned of isopropyl alcohol remaining on the surface in the third water container. However, it should be noted that in actual operation, the cleaning of the surface of the indium foil by only two times of cleaning cannot be ensured to completely remove the residual dilute nitric acid, and similarly, the cleaning of the surface of the indium foil by only a single time of cleaning cannot be ensured to complete. Therefore, the water container can be provided with more than three in actual use, and a large number of water containers can ensure that the indium foil is cleaned for a plurality of times, ensure that the residual dilute nitric acid and isopropanol on the surface of the indium foil meet the detection requirement, avoid the influence on packaging, and ensure the packaging effect.
Furthermore, since the indium foil is cleaned by pure water, a corresponding method is necessarily required to detect the cleaning degree of the indium foil, so that the time and material waste caused by repeated cleaning are avoided, and the production efficiency is not improved. Therefore, in the third and fourth steps, the method further comprises the step of setting a conductivity measuring instrument to measure the conductivity of the pure water in the water container. The conductivity measuring instrument can measure the conductivity of pure water in the water container, nitric acid is dissolved in the acid-washed pure water, the acid-washed pure water has certain conductivity compared with non-conductive pure water, the content of nitric acid in the pure water can be obtained by measuring the conductivity change of the pure water after the indium foil is washed, further the nitric acid residue condition on the surface of the indium foil is confirmed, if the conductivity change is large, fresh pure water can be replaced again to continuously wash the indium foil, and if the conductivity change is small, the nitric acid residue on the surface of the indium foil can be confirmed to be thoroughly washed. Therefore, the numerical change of the conductivity can more quickly and intuitively embody the nitric acid residual condition on the surface of the indium foil, the measuring effect is excellent, and the use experience of operators is good.
Optionally, because the surface area of a part of indium foil is larger, the indium foil is difficult to be fully immersed in the nitric acid solution when being pickled, so in order to ensure the pickling effect of the indium foil, in the second step, the indium foil is pressed into the dilute nitric acid solution by arranging the balancing weight, during pickling, firstly, the indium foil is placed on the surface of the solution by using tweezers, then, the indium foil is pressed into the solution by using special tools such as the balancing weight, and the like, so that the pickling effect is ensured, and meanwhile, the indium foil cannot be scratched by using the tweezers, so that the completeness of the indium foil is ensured.
In addition, for the step seven, the indium foil is dried to remove the water stain on the surface of the indium foil, and the indium foil can be dried by various methods, such as heating, in actual operation, and in the embodiment, the indium foil is dried by compressed air, so that the influence of high temperature on the indium foil is avoided, and the drying method is simple and reliable, easy to implement and good in operation effect.
In summary, the present invention provides a surface treatment method for indium foil, which includes the following steps: setting an acid container and a plurality of water containers; step two: putting the indium foil into an acid container for pickling; step three: putting the indium foil into a first water container for water washing; step four: putting the indium foil into a second water container for water washing; step five: dripping isopropanol on the surface of the indium foil, and wiping the product on the surface of the indium foil; step six, a step of performing a step of; putting the indium foil into a third water container for water washing; step seven: drying the indium foil; step eight: cutting the indium foil; step nine: and (5) vacuum packaging indium foil. Compared with the prior art, the indium foil with the cleaned surface can avoid packaging failure caused by impurities of the indium foil in the packaging process, the packaging efficiency is improved, and the heat conduction capability of the indium foil is also ensured. The indium foil surface treatment method is simple and reliable and has good cleaning effect.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present invention, and these modifications and substitutions should also be considered as being within the scope of the present invention.
Claims (7)
1. A method for treating the surface of an indium foil, comprising the steps of:
step one: setting an acid container for containing dilute nitric acid solution and a plurality of water containers for containing pure water, pouring dilute nitric acid solution into the acid container, and pouring pure water into the water containers;
step two: clamping an indium foil to be treated, and putting the indium foil into an acid container for pickling;
step three: taking the indium foil out of the dilute nitric acid solution, putting the indium foil into a first water container, and washing the indium foil once;
step four: taking the indium foil out of the pure water and putting the indium foil into a second water container, and performing secondary water washing on the indium foil;
step five: placing an indium foil on dust-free paper, dripping isopropanol on the surface of the indium foil, and wiping a product on the surface of the indium foil;
step six, a step of performing a step of; putting the indium foil into a third water container, and washing the indium foil for three times;
step seven: taking the indium foil out of the pure water, and drying the indium foil to remove water stains on the surface of the indium foil;
step eight: placing an indium foil on a marble platform, and shearing the indium foil;
step nine: vacuum packaging the sheared indium foil.
2. The method of claim 1, wherein in the first step, the concentration of the dilute nitric acid solution is 3% -10%.
3. The method of claim 1, wherein in the first step, the indium foil is pickled in a dilute nitric acid solution for 5 to 30 minutes.
4. The method of claim 1, wherein in the first step, the water container is provided with three or more containers.
5. The method according to claim 1, wherein in the second step, the indium foil is pressed into the dilute nitric acid solution by providing a weight block.
6. The method of claim 1, further comprising providing a conductivity meter to measure conductivity of pure water in the water container in which the indium foil has been cleaned.
7. The method of claim 1, wherein in the seventh step, the indium foil is dried by compressed air.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111074466.2A CN113894112B (en) | 2021-09-14 | 2021-09-14 | Indium foil surface treatment method |
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| CN202111074466.2A CN113894112B (en) | 2021-09-14 | 2021-09-14 | Indium foil surface treatment method |
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| CN113894112A CN113894112A (en) | 2022-01-07 |
| CN113894112B true CN113894112B (en) | 2023-05-30 |
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