CN113873062A

CN113873062A - Shell, manufacturing method thereof and electronic equipment

Info

Publication number: CN113873062A
Application number: CN202111020754.XA
Authority: CN
Inventors: 康展博
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-09-01
Filing date: 2021-09-01
Publication date: 2021-12-31

Abstract

The application provides a shell, a manufacturing method thereof and electronic equipment, wherein the shell comprises a shell main body and a protection piece, the shell main body is provided with a protruding portion, and the protruding portion is provided with a light transmission hole; the protective piece is arranged in the light-transmitting hole; wherein the case main body is made of ceramic, the protector is made of transparent ceramic, and regions where the protector and the protrusion are adjacent to each other are joined by melting and solidification. The casing that this application embodiment provided is through forming the bulge in the shell main part to meet protection piece and bulge adjacent region each other through melting process and solidification, avoid appearing the gap between protection piece and shell main part, and then can avoid the gap to hide the defect of ash, thereby promote the outward appearance performance and the user of casing and electronic equipment and use experience.

Description

Shell, manufacturing method thereof and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a shell, a manufacturing method of the shell and the electronic equipment.

Background

With the continuous development of electronic devices, the electronic devices have become indispensable entertainment tools and social tools in people's daily life, and people's demand for the electronic devices is also higher and higher. Taking a mobile phone as an example, a lens corresponding to a camera is usually mounted on a rear shell of some mobile phones to protect the camera to some extent. However, since the back shell and the lens are generally assembled together after being molded separately, there are gaps visible to the naked eye during assembly due to the influence of manufacturing tolerances, and dust accumulates in the gaps during the use of the user, which seriously affects the user experience.

Disclosure of Invention

An aspect of the present disclosure provides a housing for an electronic device, the housing including a housing main body and a protection member, the housing main body being provided with a protruding portion, the protruding portion being provided with a light-transmitting hole; the protective piece is arranged in the light-transmitting hole; wherein the case main body is made of ceramic, the protector is made of transparent ceramic, and regions where the protector and the protrusion are adjacent to each other are joined by melting and solidification.

Another aspect of the embodiments of the present application provides a method for manufacturing a housing, where the method includes: providing a shell main body, wherein the shell main body is provided with a protruding part, and the protruding part is provided with a light hole; providing a protection piece, and arranging the protection piece in the light-transmitting hole; melting a region where the protector and the bulge are adjacent to each other, and solidifying so that the protector and the bulge meet; wherein the case main body is made of ceramic, and the protector is made of transparent ceramic.

An embodiment of the present application further provides an electronic device, where the electronic device includes: the display screen, the middle frame, the camera and the shell in the embodiment are arranged on the shell; the display screen is connected with one side of the middle frame, and the shell is connected with the other opposite side of the middle frame; the camera set up in the center with between the casing, and with the bulge sets up relatively.

According to the shell, the manufacturing method of the shell and the electronic equipment, the protruding portion is formed on the shell main body, the protection piece serving as the lens and the protruding portion are connected with each other in the adjacent area through melting treatment and solidification, the protection piece and the shell main body are integrated, a gap between the protection piece and the shell main body is avoided, namely the gap generated by assembly tolerance of the protection piece and the shell main body during assembly can be avoided, the defect that dust is stored in the gap can be avoided, and the appearance expressive force of the shell and the electronic equipment and the use experience of a user are improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of an electronic device in some embodiments of the present application;

FIG. 2 is a schematic diagram of the electronic device in FIG. 1 with a split structure;

FIG. 3 is a schematic structural view of a housing according to some embodiments of the present application;

FIG. 4 is a schematic sectional view of the housing of FIG. 3 along A-A;

FIG. 5 is a partially enlarged structural view of a region B in the embodiment of FIG. 4;

FIG. 6 is a schematic flow chart of a method of fabricating a housing according to some embodiments of the present application;

FIG. 7 is a schematic view of the internal structure of an optical float zone furnace according to some embodiments of the present disclosure;

FIG. 8 is a schematic flow chart of a method of making a shell body according to some embodiments of the present application;

FIG. 9 is a schematic structural diagram of a base material of the case having a convex portion in the embodiment of FIG. 8;

FIG. 10 is a schematic view of the embodiment of FIG. 9 with light holes formed on the protrusions;

FIG. 11 is a schematic flow chart illustrating a polishing process performed on the convex portion in the embodiment of FIG. 8;

FIG. 12 is a flow chart illustrating a method of fabricating a housing according to further embodiments of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device 100 according to some embodiments of the present application, and fig. 2 is a schematic structural diagram of the electronic device 100 according to fig. 1.

The electronic device 100 provided in the embodiment of the present application may specifically be a mobile phone, a tablet computer, a notebook computer, and the like, and the following description will be given by taking the electronic device 100 as a mobile phone. The electronic device 100 may include a display screen 10, a bezel 20, a housing 30, and an optical assembly 40. Wherein the display screen 10 may be connected to one side of the middle frame 20, and the case 30 may be connected to the other opposite side of the middle frame 20. The optical assembly 40 may be disposed between the middle frame 20 and the housing 30, and external light may pass through the housing 30 to irradiate the photosensitive side of the optical assembly 40, so as to implement the corresponding function of the optical assembly 40. The optical assembly 40 may be a photosensitive device such as a camera or an image sensor. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.

Specifically, the display screen 10 may be used to provide an image display function for the electronic device 100, and the display screen 10 may be covered on one side of the middle frame 20, and may be fixed by an adhesive. The display screen 10 may include a transparent cover plate, a touch panel, and a display panel, which are sequentially stacked. The surface of the transparent cover plate can have the characteristics of flatness and smoothness, so that a user can conveniently perform touch operations such as clicking, sliding and pressing. The transparent cover plate may be made of a rigid material such as glass, or may be made of a flexible material such as Polyimide (PI) or Colorless Polyimide (CPI). The touch panel is disposed between the transparent cover and the display panel, and is configured to respond to a touch operation of a user, convert the touch operation into an electrical signal, and transmit the electrical signal to the processor of the electronic device 100, so that the electronic device 100 can make a corresponding response to the touch operation of the user. The display panel is mainly used for displaying pictures and can be used as an interactive interface to instruct a user to perform the touch operation on the transparent cover plate. The Display panel may adopt an OLED (Organic Light-Emitting Diode) or an LCD (Liquid Crystal Display) to realize an image Display function of the electronic device 100. In this embodiment, the transparent cover plate, the touch panel and the display panel may be attached together by using an optical Adhesive (OCA) or a Pressure Sensitive Adhesive (PSA). Meanwhile, the display screen 10 may be a double curved screen or a four curved screen in appearance to reduce a black edge of the display screen 10 and increase a visible area of the display screen 10. Accordingly, the display screen 10 may be a conventional flat screen, and only the display screen 10 can implement the graphic display function of the electronic device 100.

As shown in fig. 2, the middle frame 20 may include a middle plate 21 and a side frame 22 that are integrally formed, and they may be integrally formed by injection molding, punch forming, heat absorption forming, or the like. The frame 22 may be formed by extending the side wall of the middle plate 21 in the thickness direction of the middle plate 21, so that both sides of the middle frame 20 opposite to each other may form a corresponding open structure. The display screen 10 and the casing 30 may respectively cover the open structures on two opposite sides of the middle frame 20, so as to form an accommodating space of the electronic device 100 together with the middle frame 20. The receiving space may be used to mount electronic devices, such as a battery, a sensor, and a circuit board, etc., required by the electronic apparatus 100. Accordingly, the optical element 40 may also be disposed in the accommodating space, and the optical element 40 may be disposed between the middle frame 20 and the casing 30. That is, the optical assembly 40 may be a rear camera of the electronic device 100. For example, the side of the middle plate 21 facing away from the display screen 10 may be provided with a mounting opening or a mounting bracket for mounting the optical assembly 40, so that the optical assembly 40 may be fixedly connected to the middle plate 21. In some embodiments, the middle plate 21 and the side frame 22 may also be two independent structural members, and the two may be connected by one of assembling methods such as clamping, bonding, welding, and the like, and a combination thereof. Alternatively, the middle frame 20 may include only the bezel 22.

In addition, the material of the middle frame 20 may be glass, metal, hard plastic, etc., so that the middle frame 20 has a certain structural strength. Because the middle frame 20 is generally directly exposed to the external environment, the middle frame 20 may also have certain wear-resistant, corrosion-resistant, scratch-resistant, and other properties, or the outer surface of the middle frame 20 (i.e., the outer surface of the electronic device 100) may be coated with a layer of functional material for wear-resistant, corrosion-resistant, scratch-resistant, and the like. In addition, in some embodiments, a corresponding brand identifier (LOGO) may be further disposed on the middle frame 20 to beautify the appearance of the electronic device 100 and improve brand recognition.

Referring to fig. 3 to 5, fig. 3 is a schematic structural diagram of a housing 30 in some embodiments of the present application, fig. 4 is a schematic structural diagram of a cross section of the housing 30 along a direction a-a in the embodiment of fig. 3, and fig. 5 is a schematic enlarged structural diagram of a region B in the embodiment of fig. 4.

The housing 30 may be a rear cover or a battery cover of the electronic device 100, and may be used to protect various functional devices in the accommodating space. As shown in fig. 3 and 4, the housing 30 may include a housing main body 31 and a protection member 32. The shell body 31 may cover a side of the middle frame 20 away from the display screen 10, and is fixedly connected to the middle frame 20. The optical assembly 40 may be disposed between the middle plate 21 and the housing main body 31, and external light may pass through the housing main body 31 to irradiate to the photosensitive side of the optical assembly 40, so as to realize the corresponding function of the optical assembly 40. In the present embodiment, limited by the thickness of the optical assembly 40, the region of the shell main body 31 opposite to the optical assembly 40 may be arched toward a direction away from the middle frame 20, thereby providing an escape space when the optical assembly 40 is assembled.

In one embodiment, the housing main body 31 may be connected to a side of the bezel 22 facing away from the display screen 10, and an area of the housing main body 31 opposite to the optical assembly 40 may be arched away from the bezel 22, so as to provide an escape space for assembling the optical assembly 40. The region where the housing main body 31 and the optical assembly 40 are disposed opposite to each other may be arched toward a direction away from the middle frame 20 to form the protruding portion 311, and the protruding portion 311 may further form an avoiding groove 3101 by being surrounded with the housing main body 31, so that when the housing main body 31 is assembled with the electronic device 100, the avoiding groove 3101 may be used as an avoiding space when the optical assembly 40 is assembled, thereby avoiding interference with the optical assembly 40 on the middle plate 21 when the housing main body 31 and the middle frame 20 are assembled.

In an embodiment, the side of the shell main body 31 may further be provided with a bending portion 312, and the bending portion 312 may be bent toward a direction away from the protruding portion 311, so that the shell main body 31 as a whole may be arched toward a direction away from the middle frame 20 to expand the accommodating range of the accommodating space. The bending portion 312 may be used for being connected to the frame 22, for example, the bending portion and the frame 22 may be fixedly connected by an adhesive and/or a buckle, so that a smooth transition may be formed between the case main body 31 and the frame 22 by using an arc surface formed by bending the bending portion 312, and a large drop between the case main body 31 and the middle frame 20 is avoided, which may affect the appearance refinement of the electronic device 100. Wherein the case main body 31 may be similar in external shape to a plate-like structure. Of course, the design of the bending portion 312 can be eliminated from the housing main body 31, that is, the housing main body 31 can be a relatively flat plate-like structure in appearance.

The protrusion 311 may be disposed on a side of the shell main body 31 departing from the middle frame 20, and the protrusion 311 may arch toward a direction of the shell main body 31 departing from the middle frame 20, so as to form an avoiding groove 3101 together with the shell main body 31, providing an avoiding space when the optical assembly 40 is assembled. As shown in fig. 5 to 6, the protrusion 311 may include: side wall 3111 and bottom wall 3112. Wherein, the side wall 3111 can be disposed on a side of the housing main body 31 departing from the middle frame 20, and the side wall 3111 can be respectively connected to the housing main body 31 and the bottom wall 3112, and the bottom wall 3112 can be disposed parallel to the housing main body 31 at an interval, so that the side wall 3111, the bottom wall 3112 and the housing main body 31 can jointly enclose the avoiding groove 3101, thereby providing an avoiding space when the optical assembly 40 is assembled. In the present embodiment, the protrusion 311 and the case main body 31 may be of an integral structure to improve the structural strength of the case main body 31. In some embodiments, the protrusion 311 and the shell main body 31 may be separate structures, and only need to be connected by fixing means such as welding, fusing, and bonding.

In addition, in order to improve the consistency between the protruding portion 311 and the housing main body 31 and reduce the obtrusiveness caused by the protruding portion 311, the side wall 3111 may be disposed obliquely to connect the housing main body 31 and the bottom wall 3112 at a relatively gentle slope, so as to avoid a large difference between the bottom wall 3112 and the housing main body 31. For example, the angle of the included angle α formed by the side wall 3111 and the bottom wall 3112 may be greater than or equal to 90 °, and the angle of the included angle α may be specifically 100 °, 120 °, 135 °, or the like, so that the side wall 3111 may be disposed obliquely compared to the bottom wall 3112 and the case main body 31. Correspondingly, in order to alleviate the scratch that the region that lateral wall 3111 and diapire 3112 meet brought and feel, lateral wall 3111 can also be connected through the fillet with diapire 3112, and the corner that lateral wall 3111 meets with diapire 3112 can have the cambered surface promptly to utilize the cambered surface to lead the thing of scraping, alleviate the scratch that the corner that lateral wall 3111 meets with diapire 3112 brings and feel. For example, the fillet radius of the area where the side wall 3111 meets the bottom wall 3112 may be greater than or equal to 0.5mm, and the fillet radius may be specifically 0.6mm, 0.7mm, or 0.8mm, etc., so that the corner where the side wall 3111 meets the bottom wall 3112 may have a cambered surface. In some embodiments, the angle of the included angle α and the fillet radius are not limited to the above values, and the specific values may be set according to the actual requirement of the protrusion 311, which is not limited herein.

In an embodiment, the protrusion 311 is disposed opposite to the optical assembly 40, in order to ensure that the protrusion 311 has sufficient light transmittance to meet the light sensing requirement of the optical assembly 40, the bottom wall 3112 of the protrusion 311 may further be provided with a corresponding light hole 3102, and the light hole 3102 may penetrate through the bottom wall 3112 in the thickness direction of the bottom wall 3112, so that light can pass through the light hole 3102 and irradiate to the optical assembly 40 through the protrusion 311, so as to achieve the corresponding light sensing function of the optical assembly 40. Accordingly, the electronic device 100 may further include a corresponding protection member 32 on a side of the bottom wall 3112 facing away from the housing main body 31 to close the light transmission hole 3102, so as to improve the sealing and waterproof performance of the electronic device 100 and prevent the optical assembly 40 from being directly exposed.

In one embodiment, the bottom wall 3112 may be opened with three light holes 3102, and the light holes 3102 may be circular holes to match the number of the optical assemblies 40 and the shape of the protection member 32. In some embodiments, the number of the light transmission holes 3102 may not be limited to three, but may be other plural. The shape of the light transmission holes 3102 may be not limited to a circular hole, but may be an elliptical hole, a rectangular hole, or the like. The number and shape of the light holes 3102 may be adjusted according to actual needs, and are not limited. For example, when the optical assembly 40 is a camera, the protection member 32 can be a lens, the camera is disposed corresponding to the lens, and the number and shape of the light holes 3102 are adapted to the lens.

Referring to fig. 3 to fig. 5, the protection member 32 is made of a transparent material and is disposed in the transparent hole 3102, that is, the protection member 32 is substantially equivalent to a protection lens of the optical assembly 40, which can improve the sealing and waterproof performance of the electronic device 100, and can enable light to irradiate the photosensitive side of the optical assembly 40 through the protection member 32. The protection member 32 is substantially in the shape of a sheet or a plate, the shape of the protection member 32 is adapted to the shape of the light transmission hole 3102, and the protection member 32 is disposed corresponding to the light transmission hole 3102.

In an embodiment, the protection member 32 is disposed in the light hole 3102, and the adjacent areas of the protection member 32 and the protrusion 311 can be melted and cured to be integrated into a whole, so as to realize an integrated seamless structure of the housing 30, thereby avoiding the influence of dust accumulation in the gap during the use of the user due to the assembly gap between the conventional lens and the housing main body, which seriously affects the user experience.

As can be understood, the outer peripheral edge of the protection member 32 and the inner side wall of the light transmission hole 3102 are adjacent to each other, when the protection member 32 and the protrusion 311 are subjected to melting treatment, the annular region of the protection member 32 close to the outer peripheral edge is melted, and the annular region of the light transmission hole 3102 close to the inner side wall is melted, so that the outer peripheral edge of the protection member 32 can be completely integrated with the inner side wall of the light transmission hole 3102, and the occurrence of gaps is avoided, so that the user experience and the appearance effect are not affected.

The light-transmitting hole 3102 may penetrate through the bottom wall 3112 in the thickness direction of the bottom wall 3112, that is, in the axial direction of the light-transmitting hole 3102, the thickness of the bottom wall 3112 is approximately 0.55-0.75mm, and the thickness of the protection member 32 is approximately 0.55-0.75 mm. Preferably, the thickness of the bottom wall 3112 may be 0.58mm, 0.65mm, 0.70mm, 0.72mm, etc., and the thickness of the protector 32 may be 0.58mm, 0.65mm, 0.70mm, 0.72mm, etc.

In one embodiment, the surface of the protective member 32 facing away from the housing body 31 and the surface of the bottom wall 3112 facing away from the housing body 31 are substantially coplanar to maintain the uniformity of the housing 30 in appearance. It is understood that the thickness of the bottom wall 3112 and the thickness of the protection member 32 are approximately the same, or it is understood that the bottom wall 3112 and the protection member 32 are approximately coplanar on the appearance surface of the electronic device 100, so as to avoid a large drop height between the housing main body 31 and the protection member 32, which affects the appearance quality of the electronic device 100.

Both the housing main body 31 and the protector 32 may be made of a ceramic material. The case main body 31 may be made of transparent ceramic or non-transparent ceramic. It is understood that the reason why the general ceramics are opaque is that impurities and pores exist in the interior of the ceramics, the former can absorb light, and the latter can scatter light, thus showing opacity. Therefore, if high-purity raw materials are selected and the pores are eliminated by the process, it is possible to obtain transparent ceramics. The protective member 32 is made of transparent ceramics, for example, transparent ceramics of various oxide series such as zirconia, yttria, alumina, or titania, or transparent ceramics of non-oxide such as gallium arsenide, zinc sulfide, zinc selenide, magnesium fluoride, calcium fluoride. For example, the protector 32 may be a sapphire lens, and the shell body 31 may be a zirconia ceramic shell.

In the following embodiments of the present application, a method of manufacturing the case 30 will be described by taking the case main body 31 made of black zirconia ceramics and the protector 32 made of transparent alumina ceramics as examples.

Referring to fig. 6, fig. 6 is a flow chart of a method for manufacturing a housing according to some embodiments of the present application, which can be used for manufacturing the housing 30 according to the above embodiments to achieve a melt-seamless connection between a protection member and a housing main body, the method generally includes the following steps:

s601, providing a shell main body, wherein the shell main body is provided with a protruding part, and the protruding part is provided with a light hole. Wherein, the bulge encloses with the shell main part jointly and establishes and form and dodge the groove, should dodge the groove and be configured as the dodge space that is used for providing that electronic equipment's camera and casing assemble. It will be appreciated that the housing body may be the housing body 31 of the previous embodiment.

S602, providing a protection member and disposing the protection member in the light-transmitting hole. It will be appreciated that the protector may be the protector 32 of the previous embodiment.

And S603, performing melting treatment on the area where the protective piece and the bulge are adjacent to each other, and solidifying to enable the protective piece and the bulge to be connected. Wherein the region where the protective member and the convex portion are adjacent to each other may be subjected to a melting process by an optical float zone method and cured so that the protective member and the convex portion are in contact.

Specifically, the adjacent area where the protector and the bulge are close to each other, that is, the adjacent area between the protector and the bulge, is placed in a melting zone in an optical float zone furnace, and the adjacent area between the protector and the bulge or the adjacent area between the protector and the bulge is locally heated to a molten state and is melted with each other, and then the molten area between the protector and the bulge is solidified by gradually lowering the temperature of the adjacent area between the protector and the bulge, so that the protector and the bulge are integrally joined, that is, the integral fixed joining of the shell main body and the protector is completed.

It will be appreciated that the present embodiment achieves the integral joining of the case main body and the protector by fusing, and avoids the occurrence of a gap in the region where the protector and the projection are adjacent to each other. Of course, in other embodiments, the contact between the case main body and the protector may be achieved by welding, adhesion, or the like.

Referring to fig. 7, fig. 7 is a schematic diagram of an internal structure of an optical float zone furnace according to some embodiments of the present application, which can be used to perform the step S603, that is, melting the region where the protection member and the protrusion are adjacent to each other, and solidifying the region so that the protection member and the protrusion are integrally connected.

The heating device in the optical floating-zone furnace 500 may generally include an ellipsoidal mirror 510, a halogen lamp 520, a supporting device 530 for supporting the housing 30, and a driving device 540 for driving the housing 30 to rotate. The halogen lamp 520 is disposed at the inner side of the ellipsoidal mirror 510 and at both ends of the axis of the ellipsoidal mirror 510, so that light emitted from the halogen lamp 520 can be collected in the central region inside the ellipsoidal mirror 510 after being reflected by the ellipsoidal mirror 510 to form a melting region C, and then the shell placed in the melting region C is locally heated to locally form a molten state, so that the shell main body and the protection member are connected in a molten state. I.e. the melting zone C corresponds to the area where the protector and the bulge are adjacent to each other.

Further, the housing is placed on the supporting device 530, and light emitted from the halogen lamp 520 is reflected by the ellipsoidal mirror 510 and then collected in an area where the protection member and the protrusion are adjacent to each other and heated, so that the area where the protection member and the protrusion are adjacent to each other is melted and fused with each other. And then gradually cooling down the region where the protector and the bulge are adjacent to each other to solidify, thereby realizing that the region where the protector and the bulge are adjacent to each other are integrally connected.

The driving device 540 is connected to the end of the supporting device 530 exposed outside the ellipsoidal mirror 510, and is used to drive the supporting device 530 to rotate, so that the region where the protection member and the protrusion are adjacent to each other can be uniformly heated, thereby ensuring the stability of the connection between the protection member and the housing main body.

It can be understood that the optical floating zone furnace utilizes the ellipsoidal mirror to perform gathering heating, the highest temperature of a melting zone can reach 3000 ℃ or even above, and non-contact heating can be realized. Of course, a cooling device may be further provided in the optical float zone furnace to cool and solidify the molten protector and the area where the convex portions are adjacent to each other, that is, the molten protector and the convex portions may be gradually cooled and solidified at a certain cooling speed.

In one embodiment, the temperature of the melt processing of the adjoining regions of the protector and the bulge is 1800 ℃ to 3000 ℃ based on the protector and the shell body being made of ceramic material, so that the regions where the protector and the bulge are adjacent to each other are formed in a molten state. The cooling rate is then set so that the region where the protector and the projection are adjacent to each other is gradually cooled to room temperature, thereby solidifying and uniting. Wherein the cooling rate is approximately (0.3-1.0) DEG C/min, namely, the temperature of the area where the protection piece and the convex part are adjacent to each other can be gradually cooled to room temperature at the speed of reducing 0.3-1.0 ℃ per minute. Preferably, the temperature of the fusion treatment of the adjacent regions of the protector and the bulge is 2000-2100 ℃, and the region where the protector and the bulge are adjacent to each other is gradually cooled down to room temperature at a rate of 0.5-0.8 ℃ per minute reduction, so that the regions where the protector and the bulge are adjacent to each other are solidified and integrated.

Referring to fig. 8-10, fig. 8 is a schematic flow chart illustrating a manufacturing method of a case main body according to some embodiments of the present application, fig. 9 is a schematic structural view illustrating a case base material having a protruding portion according to the embodiment of fig. 8, and fig. 10 is a schematic structural view illustrating a light-transmitting hole formed on the protruding portion according to the embodiment of fig. 9. The method for manufacturing the shell main body in this embodiment may be used to manufacture the shell main body in the above embodiment, and further may be used to provide the shell main body in step S601, and the manufacturing method generally includes the following steps:

s801, providing a shell substrate with a convex part.

Specifically, the black zirconia ceramic powder may be sequentially subjected to dry pressing, isostatic pressing, binder removal, and sintering processes to form a preform having a protrusion, and then the preform may be subjected to corner processing by machining or computer numerical control precision machining (CNC) to conform the preform to a predetermined size, which may be understood as a size of the shell.

The dry pressing process generally includes placing black zirconia ceramic powder into a mold, and pressing the black zirconia ceramic powder into a certain shape by using pressure to form a preform having protrusions and/or bends, wherein the preform substantially matches or is identical to the shape of the shell. The isostatic pressing process uses fluid to transfer pressure, which applies pressure to the preform in the elastic mold uniformly from all directions, and because of the uniformity of the pressure inside the fluid, the preform is subjected to the same pressure in all directions, so that the difference of density in the preform can be avoided to obtain a uniform and dense preform. The binder, plasticizer and the like in the prefabricated member are gasified by a heating mode in the glue discharging process, so that the prefabricated member is discharged, and the sintering quality is prevented from being influenced in the sintering process. The sintering process is to heat the prefabricated part at high temperature, so that particles in the prefabricated part are subjected to substance migration, the prefabricated part shrinks after reaching a certain temperature, grains grow, air holes are eliminated, and finally the prefabricated part is changed into a compact shell base material with a protruding part at a temperature lower than a melting point (generally 0.5-0.7 time of the melting point).

Further, the surface of the housing substrate after sintering is generally uneven, so that machining or CNC machining is required to obtain a relatively flat surface as a reference surface for subsequent processing. Wherein the shell can be machined or CNC machined to the required shape and size, namely the required shape of the shell.

It can be understood that the casing substrate also can be formed by hot forging, CNC, hot bending, die-casting, bonding and processes such as butt fusion, only need the shell main part can have the bulge, and the bulge can enclose with the shell main part jointly and establish and form and dodge the groove can for the region that the shell main part corresponds the camera can have the molding similar to "volcanic vent" is the same, thereby provides the space of dodging for the installation of camera. Accordingly, when the case main body is provided with the bent portion, the bent portion may also be formed by the above-described process.

And S802, polishing the convex part. In this step, polishing treatment is mainly performed on the side wall and the bottom wall of the projection portion to reduce the surface roughness of the projection portion to obtain a bright, flat surface, and also to achieve the effect of straightening the ridge line of the projection portion by the polishing treatment. Wherein, the polishing is a modification processing of the workpiece surface by using a polishing tool and a polishing medium.

For example, the polishing medium may be diamond liquid or other polishing liquid. The diamond liquid may include polycrystalline, single crystal, and nano 3 different types of polishing liquids, which may also be referred to as diamond polishing liquid, diamond lapping liquid, diamond slurry, and the like. Diamond liquid is widely used for grinding and polishing various hard materials such as silicon carbide substrates, sapphire, optical crystals, ceramics, bearings, super-hard alloys and the like. Wherein, diamond particles or diamond liquid particles with different particle sizes can be selected according to application and manufacturing requirements.

In particular, different polishing patterns may be used based on different areas of the projections. Wherein the projection may comprise a bottom wall and a side wall, reference may be made to the detailed description of the previous embodiments with respect to the features of the bottom wall and the side wall. Referring to fig. 11, fig. 11 is a schematic flow chart illustrating a polishing process performed on the convex portion in the embodiment of fig. 8. That is, step S802 may further include the steps of:

and S8021, polishing the side wall of the convex part. The outer surface of the sidewall may be polished, or both the inner and outer surfaces of the sidewall may be polished. The outer surface of the side wall refers to the exposed surface of the shell on the electronic equipment, and the inner surface is opposite to the outer surface.

Specifically, the sidewall of the protrusion may be polished by using a buffing or grinding head in combination with a diamond liquid to remove CNC cutting lines or machining lines on the sidewall. It can be understood that the hardness of the buffing or grinding head, and the particle size of the diamond liquid particles, have a greater effect on the polishing performance. The particle size of the diamond liquid particles is too small, so that knife grains or other grains on the side wall cannot be effectively removed; too large a particle size of diamond liquid may result in a deep polishing mark, which cannot be removed in subsequent processes.

In one embodiment, a profiling grinding head or a grinding skin with the hardness of 70-100 degrees can be used, and diamond liquid with the particle size of 15-20 μm is added to polish the side walls of the convex parts, wherein the polishing time can be 5-10min, so as to remove the knife lines or other lines on the side walls.

And S8022, carrying out rough polishing treatment on the bottom wall of the bulge. The outer surface of the bottom wall may be polished, or both the inner and outer surfaces of the bottom wall may be polished. The outer surface of the bottom wall refers to the exposed surface of the housing on the electronic device, and the inner surface is opposite to the outer surface.

Specifically, the bottom wall of the protrusion may be subjected to rough polishing treatment using a buffing or a grinding head in combination with a diamond liquid to remove a large CNC cutting line or machining line or the like on the bottom wall. In one embodiment, a profiling grinding head or a grinding skin with the hardness of 70-100 degrees can be used, and diamond liquid with the particle size of 15-20 μm is added to perform rough polishing treatment on the bottom wall of the convex part, wherein the polishing treatment time can be 5-10min, so as to remove larger knife grains or other grains on the bottom wall.

It can be understood that, before the rough polishing treatment is performed on the bottom wall of the protrusion, an annealing process may be used to anneal the housing substrate, that is, the residual stress of the housing substrate is reduced by slow cooling, so as to reduce the deformation and cracks of the housing substrate.

And S8023, performing finish polishing treatment on the bottom wall of the bulge. The outer surface of the bottom wall may be polished, or both the inner and outer surfaces of the bottom wall may be polished. The outer surface of the bottom wall refers to the exposed surface of the housing on the electronic device, and the inner surface is opposite to the outer surface.

Particularly, the bottom wall of the bulge part can be subjected to finish polishing treatment by adopting a planetary type flattening process so as to remove knife grains or other grains on the bottom wall and realize the effect of straightening ridge lines of the bulge part. It is to be understood that the planetary smoothing process generally refers to a polishing manner using a housing base material rotating relative to a grinding head or buffing along an orbit similar to a planetary motion.

In order to achieve a better finish polishing effect, the bottom wall may be subjected to finish polishing treatment a plurality of times. For example, the first finish polishing treatment may be a finish polishing treatment of the bottom wall using a buffing or grinding head having a hardness of 90 to 100 degrees and a diamond liquid having a particle size of 8 to 15 μm, wherein the buffing may be a polyurethane pad or a polyurethane sheet. The second fine polishing treatment may be a finish polishing treatment of the bottom wall using a buffing or grinding head having a hardness of 80 to 90 degrees and in combination with a silica diamond liquid.

It can be understood that the grinding head/buffing and polishing solution for finish polishing the bottom wall can be other so as to remove the knife lines or other lines on the bottom wall and realize the effect of straightening the ridge line of the convex part. Of course, the polishing method is not limited to the planetary type fine polishing process.

And S803, arranging a light hole on the protruding part to form the shell main body. As shown in fig. 10, holes are punched in the polished projections to form light transmission holes, and the light transmission holes communicate with the escape grooves. Wherein the light-transmitting hole can be formed on the projection by drilling, punching or the like.

In order to further enable the shell to have a better appearance performance effect, the application also provides a manufacturing method of the shell. Referring to fig. 12, fig. 12 is a schematic flow chart illustrating a method for manufacturing a housing according to another embodiment of the present application, the method generally including the following steps:

s1201, providing a shell main body, wherein the shell main body is provided with a protruding part, and the protruding part is provided with a light hole. Here, the step can refer to the step S601 in the foregoing embodiment, and is not repeated herein.

S1202, providing a protection member, and disposing the protection member in the light-transmitting hole. Here, the step can refer to the step S602 in the foregoing embodiment, and thus is not described again.

S1203, a region where the protector and the bulge are adjacent to each other is subjected to melting processing, and is solidified so that the protector and the bulge meet. Here, the step can refer to the step S603 in the foregoing embodiment, and thus is not described again.

And S1204, performing finish polishing treatment on the bottom wall of the bulge and the protection piece, so that the exposed surface of the bottom wall and the exposed surface of the protection piece are arranged in a substantially coplanar manner. The exposed surface of the bottom wall and the exposed surface of the protection member refer to surfaces of the electronic device on which the housing is exposed, that is, appearance surfaces.

Specifically, the exposed surface of the bottom wall and the exposed surface of the protector may be finish-polished by a planetary finish-flattening process to remove the uneven exposed surface of the bottom wall and the uneven exposed surface of the protector, thereby ensuring that the adjoining areas of the bottom wall and the protector are even and smooth and achieve a break-free joint. Of course, the way of polishing the exposed surface of the bottom wall and the exposed surface of the protector is not limited to the planetary type smoothing process.

In order to ensure that the adjoining areas of the bottom wall and the protective member are smooth and uniform, and a step-free connection is achieved, diamond liquid with a particle size of 15-20 μm may be used for the finish polishing in step S1204.

In an embodiment, after step S1204, the method may further include:

and S1205, polishing the shell, and attaching a protective film on the outer surface of the shell.

The outer surface of the shell may be polished, or both the inner and outer surfaces of the shell may be polished. The outer surface of the shell refers to the exposed surface of the shell on the electronic equipment, and the inner surface is opposite to the outer surface. That is, the surface of the casing is subjected to a full-face polishing process to obtain a casing having a uniform appearance.

Further, the outer surface of the shell is close to the skin protection film, so that the shell can be protected from being scratched on one hand, and fingerprint traces can be prevented from being left when the electronic equipment is operated on the other hand. The protective film can be made of transparent material, such as high-transmittance fingerprint-proof film. Of course, the protective film may also be made of other transparent resin materials, which are not described in detail.

It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A housing for an electronic device, the housing comprising:

the shell body is provided with a bulge, and the bulge is provided with a light hole;

the protective piece is arranged in the light-transmitting hole;

wherein the case main body is made of ceramic, the protector is made of transparent ceramic, and regions where the protector and the protrusion are adjacent to each other are joined by melting and solidification.

2. The housing of claim 1, wherein the protrusion includes a bottom wall spaced from the shell body and side walls connecting the shell body and the bottom wall, respectively; wherein, the diapire, the lateral wall and the shell main part enclose jointly and form and dodge the groove, dodge the groove and be configured as and be used for providing dodge space when the optical component of electronic equipment assembles.

3. The housing according to claim 2, wherein the light transmission hole penetrates the bottom wall in a thickness direction of the bottom wall, and a surface of the protective member facing away from the housing main body and a surface of the bottom wall facing away from the housing main body are coplanar.

4. The housing of claim 2, wherein the side wall and the bottom wall form an included angle of not less than 90 °, and the side wall and the bottom wall are connected by a fillet.

5. A method of making a housing, the method comprising:

providing a shell main body, wherein the shell main body is provided with a protruding part, and the protruding part is provided with a light hole;

providing a protection piece, and arranging the protection piece in the light-transmitting hole;

melting a region where the protector and the bulge are adjacent to each other, and solidifying so that the protector and the bulge meet;

wherein the case main body is made of ceramic, and the protector is made of transparent ceramic.

6. The method of manufacturing of claim 5, wherein the step of providing a shell body comprises:

providing a shell substrate with a convex part;

polishing the convex part;

and the protruding part is provided with the light hole to form the shell main body.

7. The method of claim 6, wherein the projection includes a bottom wall and a side wall, and the step of polishing the projection includes:

polishing the side wall of the bulge;

carrying out rough polishing treatment on the bottom wall of the bulge;

and carrying out fine polishing treatment on the bottom wall of the bulge.

8. The production method according to any one of claims 5 to 7, wherein a temperature of the melt-processing of a region where the protector and the projection are adjacent to each other is 1800 ℃ to 3000 ℃.

9. The method of claim 8, wherein the step of curing the protector such that the protector meets the projection comprises:

the temperature is gradually reduced at the speed of reducing 0.3-1.0 ℃ per minute.

10. The method of claim 9, wherein the step of curing the protector such that it meets the projection is further followed by:

the bottom wall of the projection and the protector are subjected to finish polishing treatment so that the exposed surface of the bottom wall and the exposed surface of the protector are coplanar.

11. An electronic device, characterized in that the electronic device comprises: a display screen, a center frame, a camera, and the housing of any one of claims 1-4;

the display screen is connected with one side of the middle frame, and the shell is connected with the other opposite side of the middle frame; the camera set up in the center with between the casing, and with the bulge sets up relatively.