CN113835153A - Four-core lens optical fiber for silicon optical chip and wedge-shaped lens processing method thereof - Google Patents
Four-core lens optical fiber for silicon optical chip and wedge-shaped lens processing method thereof Download PDFInfo
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- CN113835153A CN113835153A CN202111011908.9A CN202111011908A CN113835153A CN 113835153 A CN113835153 A CN 113835153A CN 202111011908 A CN202111011908 A CN 202111011908A CN 113835153 A CN113835153 A CN 113835153A
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 91
- 230000003287 optical effect Effects 0.000 title claims abstract description 53
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 38
- 239000010703 silicon Substances 0.000 title claims abstract description 38
- 238000003672 processing method Methods 0.000 title abstract description 7
- 238000005253 cladding Methods 0.000 claims abstract description 25
- 239000000835 fiber Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 abstract description 15
- 238000010168 coupling process Methods 0.000 abstract description 15
- 238000005859 coupling reaction Methods 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000009826 distribution Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/25—Preparing the ends of light guides for coupling, e.g. cutting
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides a four-core lens optical fiber for a silicon optical chip and a wedge-shaped lens processing method thereof, wherein the four-core lens optical fiber comprises a cladding and four optical fiber cores which are arranged in the cladding side by side, the head of each optical fiber core is processed with a wedge-shaped lens, the upper section of each wedge-shaped lens is positioned on the same plane, the lower section of each wedge-shaped lens is positioned on the same plane, and the upper section and the lower section of each wedge-shaped lens are arranged up and down symmetrically along the plane where the central lines of the four optical fiber cores are positioned. The invention greatly reduces the volume occupation of the optical fiber, simultaneously solves the problem that the optical fiber can be arranged according to the period only by utilizing the fixing of the optical fiber V-groove substrate, and greatly reduces the space occupation of the optical channel after removing the optical fiber V-groove substrate; on the basis of the four-core optical fiber, the wedge-shaped lens is processed at the head of each optical fiber core, and the vertical mode field is compressed, so that the mode field is further reduced, and the coupling efficiency between the optical fiber and the silicon optical chip can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to a four-core lens optical fiber for a silicon optical chip and a wedge-shaped lens processing method thereof.
Background
With the development of semiconductor technology, the silicon optical concept has been developed vigorously in recent years.
With the realization of silicon optical technology, the integration level of an optical communication system is further improved; the volume of the device is obviously reduced, and the volume of the corresponding optical and electrical interfaces must be reduced together with the device. The existing optical interface is limited by the volume of the optical fiber, the size of the FA substrate and other problems are difficult to reduce, and therefore the area utilization rate of the optical chip is affected. Another problem is optical coupling, which is a critical technique affecting fiber systems, and fiber lensing, which is a critical component of fiber coupling. The original lens optical fiber FA (optical fiber array) cannot meet the requirements of mass production and low-cost production due to the complex design and manufacturing process, and the performance is still in the application stage of a laboratory despite of superior performance. However, when the low-cost common FA is used, the coupling efficiency is low, or the input/output interface of the optical chip is designed to be complex, which makes the implementation difficult.
Disclosure of Invention
The invention aims to provide a four-core lens optical fiber for a silicon optical chip and a wedge lens processing method thereof, and aims to solve at least part of the problems in the prior art.
The invention is realized by the following steps:
in a first aspect, the invention provides a four-core lens optical fiber for a silicon optical chip, which comprises a cladding and four optical fiber cores arranged in the cladding side by side, wherein a wedge-shaped lens is processed at the head of each optical fiber core, the upper section of each wedge-shaped lens is positioned on the same plane, the lower section of each wedge-shaped lens is also positioned on the same plane, and the upper section and the lower section of each wedge-shaped lens are arranged in an up-and-down symmetrical manner along the plane where the center lines of the four optical fiber cores are positioned.
Further, each of the optical fiber cores is arranged in a diameter direction of the cladding.
Furthermore, an isolation layer is arranged outside each optical fiber core.
Further, the diameter of the cladding is 125-140 um.
Further, the operating wavelength of four-core lens optic fibre is 1550nm 10nm, the core footpath of optic fibre core is 9um 10um, the optic fibre core with the refractive index difference of cladding is 0.36% +/-0.1%.
Furthermore, the optical fiber cores are arranged at equal intervals, and the core diameter interval between two adjacent optical fiber cores is 25um +/-10 um.
In a second aspect, the present invention further provides a method for processing a wedge lens of a four-core lensed fiber for a silicon optical chip, the method comprising: in the process of grinding the wedge-shaped lens, a light source is used for irradiating the tail end of the optical fiber core, the optical power of the transmitted light on the upper and lower grinding surfaces of the wedge-shaped lens is respectively monitored by using the same optical power meter, the grinding angle is adjusted according to the optical power difference of the transmitted light on the upper and lower grinding surfaces, and the upper tangent plane and the lower tangent plane of the wedge-shaped lens are ensured to be arranged in an up-and-down symmetrical mode along the plane where the central lines of the four optical fiber cores are located.
In a third aspect, the present invention further provides a silicon optical chip package structure, including any one of the four-core lens optical fibers for a silicon optical chip described above.
Compared with the prior art, the invention has the following beneficial effects:
the four-core lens optical fiber for the silicon optical chip and the wedge-shaped lens processing method thereof provided by the invention have the advantages that the four-core lens optical fiber comprises a cladding and four optical fiber cores which are arranged in the cladding side by side, and more optical fiber cores are accommodated in the space under the condition that the integral diameter of the optical fiber is not changed by utilizing an optical fiber space division multiplexing technology, so that the volume occupation of the optical fiber is greatly reduced, the problem that the optical fiber can be periodically arranged only by utilizing the fixing of an optical fiber V-groove substrate is solved, and the space occupation of an optical channel is greatly reduced after the optical fiber V-groove substrate is removed; on the basis of the four-core optical fiber, the wedge-shaped lens is processed at the head of each optical fiber core, and the vertical mode field is compressed, so that the mode field is further reduced, and the coupling efficiency between the optical fiber and the silicon optical chip can be effectively improved.
Drawings
Fig. 1 is a schematic structural diagram of a four-core lens optical fiber for a silicon optical chip according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a four-core lensed fiber for a silicon optical chip according to an embodiment of the present invention;
FIG. 3 is a diagram of a fundamental mode electric field profile across a fiber according to an embodiment of the present invention;
FIG. 4 is a transverse distribution diagram of the electric field of the fundamental mode of the core of an adjacent optical fiber according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of wedge lens processing provided by an embodiment of the present invention.
Description of reference numerals: 1-cladding, 2-fiber core, 3-wedge lens, 4-isolation layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and fig. 2, an embodiment of the present invention provides a four-core lens fiber for a silicon optical chip, including a cladding 1 and four fiber cores 2 arranged side by side in the cladding 1, and using a fiber space division multiplexing technique, under the condition that the overall diameter of the fiber is not changed, more number of light-transmitting cores are accommodated in a space, so that the problem of volume occupation of the fiber is greatly reduced, and at the same time, the problem that the fiber needs to be fixed by using a fiber V-groove substrate to be periodically arranged is solved, and after the fiber V-groove substrate is removed, the space occupation of an optical channel is greatly reduced; the head of each optical fiber core 2 is processed with a wedge-shaped lens 3, the upper section of each wedge-shaped lens 3 is located on the same plane, the lower section of each wedge-shaped lens 3 is located on the same plane, the upper section and the lower section of each wedge-shaped lens 3 are symmetrically arranged up and down along the plane where the central lines of the four optical fiber cores 2 are located, the compression of the vertical mode field by the wedge-shaped lenses is improved, the mode field is further reduced, and the coupling efficiency between the wedge-shaped lenses and a silicon optical chip can be effectively improved.
Preferably, as shown in fig. 2, each of the optical fiber cores 2 is arranged in the diameter direction of the cladding 1, where the space for arrangement is the largest. Further preferably, an isolation layer 4 is disposed outside each of the optical fiber cores 2, so that crosstalk between adjacent cores can be reduced.
In the preferred embodiment, the diameter of the cladding 1 is 125-140 um, which is equivalent to the diameter of a traditional single mode fiber, so that the overall diameter of the four-core lens fiber of the embodiment is only equivalent to the diameter of a traditional single mode fiber while providing four channels. Preferably, the operating wavelength of the four-core lens optical fiber is 1550nm +/-10 nm, the core diameter of the optical fiber core 2 is 9um +/-10 um, the refractive index difference between the optical fiber core 2 and the cladding 1 is 0.36% +/-0.1%, and the crosstalk between the adjacent optical fiber cores 2 of the four-core lens optical fiber is small at the moment.
According to the invention, APSS numerical simulation analysis software is adopted to calculate the field distribution of the fundamental mode under the refractive index difference of different light source wavelengths, different fiber cores 2 and diameters and different fiber cores 2 and claddings 1, wherein the refractive indexes of the fiber cores 2 and the claddings 1 are calculated by a three-order Sellmeier formula which changes along with the wavelengths. When the wavelength of the light source is 1.55mm, the diameter of the optical fiber core is 9mm, and the difference between the refractive indexes of the optical fiber core 2 and the cladding 1 is 0.36%, the calculated distribution of the fundamental mode electric field on the cross section of the optical fiber is as shown in fig. 3, and the effect is better.
Further preferably, the optical fiber cores 2 are arranged at equal intervals, and the core diameter interval between two adjacent optical fiber cores 2 is 25um ± 10 um.
FIG. 4 shows the lateral distribution of the fundamental mode electric field of the adjacent optical fiber cores 2 at a center-to-center distance of 25mm between the optical fiber cores 2. The APSS software can simulate the mode coupling and power conversion between adjacent waveguides with different distances when light is transmitted in the waveguides. The coupling coefficient Cij of the mode between adjacent waveguides can also be calculated by:
where Ni, Nj are the normalized coefficients of the modes and psi i, psi j are the field distributions of the two fundamental modes.
It can be seen from fig. 4 that for the fundamental mode electric fields in the two adjacent optical fiber cores 2, the amplitude has dropped to 10 when the field of one fiber reaches the position of the other fiber core 2 (25 mm)-6Below (-60 dB). Therefore, four-core transmission is calculated according to the current optical fiber parametersThe coupling between adjacent cores in a mirrored fiber is negligible and small.
The wedge-shaped lens 3 of the four-core lens optical fiber for the silicon optical chip of the embodiment is ground by using special equipment, and an important problem needs to be solved in the grinding process, namely the angle above and below the lens needs to be kept consistent in the grinding process.
Referring to fig. 5, an embodiment of the present invention further provides a method for processing a wedge lens 3 of a four-core lens fiber for a silicon optical chip, where the method includes: in the process of grinding the wedge-shaped lens 3, the tail end of the optical fiber core 2 is irradiated by using a light source, a light beam can be respectively transmitted on the upper and lower grinding surfaces of the wedge-shaped lens 3, in order to prevent errors between different power meters, in this embodiment, the same optical power meter is used for respectively monitoring the optical power of the transmitted light on the upper and lower grinding surfaces of the wedge-shaped lens 3, when the two grinding surfaces are ground by using equipment, the grinding angle is adjusted according to the optical power difference of the transmitted light on the upper and lower grinding surfaces, when the value on one side is higher than the value on the other side, for example, when the value of the transmitted light (transmitted light 1) on the upper cutting surface is higher than the transmitted light (transmitted light 2) on the lower cutting surface, the grinding of the upper cutting surface is accelerated. By using the mode, the upper tangent plane and the lower tangent plane of the wedge-shaped lens 3 are ensured to be symmetrically arranged up and down along the plane where the central lines of the four optical fiber cores 2 are located, namely, the angles of the upper tangent plane and the lower tangent plane are consistent, and the center of the optical fiber core 2 is positioned in the middle of the two tangent planes, so that the precision of the ground wedge-shaped lens 3 is higher.
Correspondingly, the embodiment of the invention also provides a silicon optical chip packaging structure which comprises the four-core lens optical fiber for the silicon optical chip, wherein the four-core lens optical fiber and the silicon optical chip are fixed in a laser welding or soldering mode after being coupled and aligned. Because the four-core lens optical fiber with smaller volume is adopted, the volume of the silicon optical chip packaging structure is smaller, and the coupling efficiency of the four-core lens optical fiber and the silicon optical chip is also greatly improved.
The coupling of a silicon optical chip to a single-mode optical fiber is essentially a mode field matching problem. The more light emitted by the silicon optical chip is coupled into the optical fiber, the smaller the loss is, the longer the distance of optical fiber communication transmission is, and the longer the relay distance is. For the four-core lens fiber, equivalently, a micro-lens column is added on the flat-end fiber surface to play a role of a transmission factor. The structure of the XZ section is consistent with that of the tapered optical fiber, the coupling loss caused by phase mismatch can be reduced by adjusting the curvature radius to be matched with the mode field radius of the laser, the coupling loss caused by mode field radius mismatch is reduced, the coupling efficiency is improved, and the original mode field radius of the optical fiber material is maintained by the YZ section.
In summary, the four-core lens fiber for the silicon optical chip and the wedge lens 3 processing method thereof provided by the invention have the advantages that the four-core lens fiber comprises the cladding 1 and the four fiber cores 2 which are arranged in the cladding 1 side by side, and the fiber space division multiplexing technology is utilized, under the condition that the overall diameter of the fiber is not changed, more light-transmitting cores are accommodated in the space, so that the volume occupation of the fiber is greatly reduced, meanwhile, the problem that the fiber can be periodically arranged only by utilizing the fixation of the fiber V-groove substrate is solved, and the space occupation of an optical channel is greatly reduced after the fiber V-groove substrate is removed; on the basis of the four-core optical fiber, the wedge-shaped lens 3 is processed at the head of each optical fiber core 2, and the vertical mode field is compressed, so that the mode field is further reduced, and the coupling efficiency between the optical fiber and the silicon optical chip can be effectively improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A four-core lens optical fiber for a silicon optical chip, characterized in that: the optical fiber core structure comprises a cladding and four optical fiber cores which are arranged in the cladding side by side, wherein wedge-shaped lenses are processed at the heads of the optical fiber cores, the upper tangent planes and the lower tangent planes of the wedge-shaped lenses are located on the same plane, and the upper tangent planes and the lower tangent planes of the wedge-shaped lenses are arranged up and down symmetrically along the plane where the central lines of the four optical fiber cores are located.
2. The four-core lensed fiber for a silicon photonic chip of claim 1, wherein: the optical fiber cores are arranged along the diameter direction of the cladding.
3. The four-core lensed fiber for a silicon photonic chip of claim 1, wherein: and an isolation layer is arranged outside each optical fiber core.
4. The four-core lensed fiber for a silicon photonic chip of claim 1, wherein: the diameter of the cladding is 125~140 um.
5. The four-core lensed fiber for a silicon photonic chip of claim 1, wherein: the working wavelength of the four-core lens optical fiber is 1550nm +/-10 nm, the core diameter of the optical fiber core is 9um +/-10 um, and the refractive index difference of the optical fiber core and the cladding is 0.36% +/-0.1%.
6. The four-core lensed fiber for a silicon photonic chip of claim 5, wherein: each the fiber core is arranged at equal intervals and the core diameter interval of two adjacent fiber cores is 25um +/-10 um.
7. A method of processing a wedge lens for a four-core lensed fiber for a silicon optical chip as claimed in any one of claims 1 to 6, the method comprising: in the process of grinding the wedge-shaped lens, a light source is used for irradiating the tail end of the optical fiber core, the optical power of the transmitted light on the upper and lower grinding surfaces of the wedge-shaped lens is respectively monitored by using the same optical power meter, the grinding angle is adjusted according to the optical power difference of the transmitted light on the upper and lower grinding surfaces, and the upper tangent plane and the lower tangent plane of the wedge-shaped lens are ensured to be arranged in an up-and-down symmetrical mode along the plane where the central lines of the four optical fiber cores are located.
8. A silicon optical chip packaging structure is characterized in that: a four-core lensed fiber for a silicon optical chip comprising any of claims 1-6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111011908.9A CN113835153A (en) | 2021-08-31 | 2021-08-31 | Four-core lens optical fiber for silicon optical chip and wedge-shaped lens processing method thereof |
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| CN202111011908.9A CN113835153A (en) | 2021-08-31 | 2021-08-31 | Four-core lens optical fiber for silicon optical chip and wedge-shaped lens processing method thereof |
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|---|---|---|---|---|
| US5257173A (en) * | 1989-12-13 | 1993-10-26 | Stanley Electric Co., Ltd. | Light irradiating apparatus having light emitting diode used as light source |
| JP2003075660A (en) * | 2001-08-30 | 2003-03-12 | Kyocera Corp | Lens-like optical fiber and method for measuring the optical fiber |
| CN102183819A (en) * | 2011-03-30 | 2011-09-14 | 西安盛佳光电有限公司 | Method for manufacturing lensed fiber |
| CN107991737A (en) * | 2017-12-11 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of single polarization fiber lenticule production method applied to light emitting semiconductor device |
| CN109163884A (en) * | 2018-10-29 | 2019-01-08 | 武汉理工大学 | A kind of Optical fibre parametric measurement system and method |
| CN109765656A (en) * | 2019-03-07 | 2019-05-17 | 深圳市艾孚光电科技有限公司 | Expand multimode fibre lens and production method |
| CN112180498A (en) * | 2019-07-03 | 2021-01-05 | 住友电气工业株式会社 | Multi-core optical fiber |
| CN216052278U (en) * | 2021-08-31 | 2022-03-15 | 武汉楚星光纤应用技术有限公司 | Four-core lens optical fiber for silicon optical chip and silicon optical chip packaging structure |
-
2021
- 2021-08-31 CN CN202111011908.9A patent/CN113835153A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5257173A (en) * | 1989-12-13 | 1993-10-26 | Stanley Electric Co., Ltd. | Light irradiating apparatus having light emitting diode used as light source |
| JP2003075660A (en) * | 2001-08-30 | 2003-03-12 | Kyocera Corp | Lens-like optical fiber and method for measuring the optical fiber |
| CN102183819A (en) * | 2011-03-30 | 2011-09-14 | 西安盛佳光电有限公司 | Method for manufacturing lensed fiber |
| CN107991737A (en) * | 2017-12-11 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of single polarization fiber lenticule production method applied to light emitting semiconductor device |
| CN109163884A (en) * | 2018-10-29 | 2019-01-08 | 武汉理工大学 | A kind of Optical fibre parametric measurement system and method |
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| CN216052278U (en) * | 2021-08-31 | 2022-03-15 | 武汉楚星光纤应用技术有限公司 | Four-core lens optical fiber for silicon optical chip and silicon optical chip packaging structure |
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