CN113808993B - Wafer clamping mechanism and wafer post-processing equipment - Google Patents

Wafer clamping mechanism and wafer post-processing equipment Download PDF

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Publication number
CN113808993B
CN113808993B CN202111110191.3A CN202111110191A CN113808993B CN 113808993 B CN113808993 B CN 113808993B CN 202111110191 A CN202111110191 A CN 202111110191A CN 113808993 B CN113808993 B CN 113808993B
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Prior art keywords
wafer
clamping mechanism
claw
liquid
claws
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CN202111110191.3A
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CN113808993A (en
Inventor
曹自立
李灯
李长坤
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Huahaiqingke Co Ltd
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Huahaiqingke Co Ltd
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Priority to CN202111110191.3A priority Critical patent/CN113808993B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The application discloses a wafer clamping mechanism and wafer post-processing equipment, wherein the wafer clamping mechanism comprises a rotatable disc-shaped base, clamping claws for holding a wafer are arranged on the periphery of the base at intervals, the clamping claws are provided with end faces which are right opposite to the wafer, a first side face which is contacted with the wafer and a second side face which is adjacent to the first side face and is far away from the wafer, the end faces of the clamping claws are in a fusiform, and the clamping claws are obliquely arranged so that an acute angle is formed between long diagonal lines of the fusiform and the opposite direction of the wafer in the rotating direction.

Description

Wafer clamping mechanism and wafer post-processing equipment
Technical Field
The application relates to the technical field of wafer post-processing, in particular to a wafer clamping mechanism and wafer post-processing equipment.
Background
The integrated circuit industry is the core of the information technology industry and plays a key role in the process of converting and upgrading the boosting manufacturing industry into digital and intelligent conversion. The chip is a carrier of an integrated circuit, and the chip manufacturing involves the technological processes of chip design, wafer manufacturing, wafer processing, electrical measurement, dicing packaging, testing, and the like.
In the fabrication of integrated circuits, wafers may be exposed to a large number of particles during multiple processing steps such as thin film deposition, etching, polishing, and the like. In order to maintain the clean state of the wafer surface and eliminate the particles remained on the wafer surface in the process, the wafer after each process must be cleaned.
In order to effectively remove particles on the surface of the wafer, the wafer is placed on a rotary clamping device and rotated at a certain speed when being subjected to a single-wafer wet cleaning process; and spraying a certain flow of cleaning liquid to the substrate to clean and/or dry the surface of the substrate.
Patent CN111540702B discloses a vertical marangoni wafer processing apparatus, in which a wafer is held by a wafer holding device and rotated around an axis of the wafer, and the wafer surface is dried by swinging a supply arm provided with a nozzle. The marangoni wafer processing device is provided with a base plate for clamping a wafer, a claw for clamping the wafer is generally arranged on the base plate, and a motor drives the clamped wafer to rotate through rotating the base plate; in the rotating process of the wafer, a plurality of process steps can spray liquid on the front surface of the wafer for cleaning or rinsing, the liquid can be thrown out by centrifugal force along with the rotation of the wafer, and the thrown liquid is caught by a peripheral retainer ring so as to reduce the sputtering of the liquid.
However, the side of the existing claw collides with the liquid thrown out by the wafer to cause the problem of sputtering, and some sputtered liquid drops fall to the position of the surface of the wafer close to the edge, pollute the dried area of the wafer, form defects such as water marks and the like, and influence the cleaning and drying effects of the wafer.
Disclosure of Invention
The embodiment of the application provides a wafer clamping mechanism and wafer post-processing equipment, which aim to at least solve one of the technical problems in the prior art.
According to a first aspect of the embodiment of the application, a wafer clamping mechanism is provided, the wafer clamping mechanism comprises a rotatable disc-shaped base, clamping claws for holding a wafer are arranged on the periphery of the base at intervals, the clamping claws are provided with end faces which are right opposite to the wafer, a first side face which is contacted with the wafer and a second side face which is adjacent to the first side face and is away from the wafer, the end faces of the clamping claws are in a fusiform, and the clamping claws are obliquely arranged so that long diagonal lines of the fusiform form acute angles with the direction opposite to the rotating direction of the wafer.
In one embodiment, the claw further has a third side adjacent to the second side, the third side forming an acute angle with the end face, thereby forming an outward facing tip at the end of the shuttle away from the wafer to funnel liquid to the tip to narrow the width of the slinger.
In one embodiment, the end of the shuttle opposite the tip is above the plane of the wafer, the tip being substantially coplanar with the wafer.
In one embodiment, the angle between the long diagonal of the shuttle and the opposite direction to the wafer rotation direction is 10 ° to 60 °.
In one embodiment, the second side is provided with a flow guide groove to concentrate the liquid falling on the jaws and to guide it to the third side.
In one embodiment, the first side is provided with a support slot for supporting an edge of a wafer.
In one embodiment, the support slot communicates with the flow guide slot.
In one embodiment, the claw is further provided with a drainage hole communicating the first side surface and the third side surface.
In one embodiment, the angle between the first side and the second side is an acute angle.
A second aspect of an embodiment of the present application provides a wafer post-processing apparatus comprising a wafer clamping mechanism as described above, a supply arm for delivering a fluid, and a retaining ring disposed around a wafer; the supply arm may oscillate vertically and supply fluid to the wafer via a spray mechanism disposed at a free end thereof.
The beneficial effects of the embodiment of the application include: the blocking effect of the claw sides on the liquid thrown out of the wafer is reduced, and secondary pollution to the wafer caused by sputtering caused by impact between the liquid thrown out of the wafer and the claw sides is avoided.
Drawings
The advantages of the present application will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the application, wherein:
FIG. 1 illustrates a wafer post-processing apparatus provided in an embodiment of the present application;
FIG. 2 illustrates a wafer clamping mechanism provided in accordance with one embodiment of the present application;
FIG. 3 shows a jaw provided by an embodiment of the application;
fig. 4 to 6 respectively show the fixing claws provided by an embodiment of the present application from different angles;
fig. 7 to 10 respectively show movable claws provided by an embodiment of the present application from different angles.
Detailed Description
The following describes the technical scheme of the present application in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present application for illustrating the concept of the present application; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the application in its aspects. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein. It should be understood that the following description of the embodiments of the present application, unless specifically stated otherwise, is established in the natural state of the relevant devices, apparatuses, components, etc. in which no external control signal or driving force is given, in order to facilitate understanding.
In addition, it is noted that terms used herein such as front, back, upper, lower, left, right, top, bottom, front, back, horizontal, vertical, etc. are merely for convenience of description and are not intended to limit any device or structure orientation to aid in understanding the relative position or orientation.
In order to describe the technical solution according to the application, reference will be made to the accompanying drawings and examples.
In the present application, a wafer (wafer) is also called a die, a silicon wafer, a substrate or a substrate (substrate), and its meaning and actual function are equivalent.
As shown in fig. 1, a wafer post-processing apparatus 1 according to the present application includes: the housing 10, the wafer clamping mechanism 20 provided in the housing 10, the supply arm 40 for conveying the fluid, the retainer ring 60 provided around the wafer w, and the like, and the motor assembly 50 provided at the bottom of the housing 10. Wherein, inside the box 10 is a wafer processing chamber. The supply arm 40 has two ends, one end being connected to the rotating shaft member and the other end being a free end rotatable about the rotating shaft member. The supply arm 40 is further connected to the motor assembly 50 such that the supply arm 40 can be rotated about the rotation shaft member by the motor assembly 50, thereby achieving the swinging of the supply arm 40 in a vertical plane parallel to the plane of the wafer w. And, the supply arm 40 is provided with a spray mechanism (not shown) at a free end thereof so that fluid can be supplied to the global surface of the rotating wafer w via the spray mechanism moving with the supply arm 40. The wafer clamping mechanism 20 has a plurality of claws 21 to hold a wafer w and drive the wafer w to vertically rotate in the housing 10 about a wafer rotation axis passing through the center of the wafer and perpendicular to the wafer surface.
Fig. 2 shows a schematic structure of a wafer clamping mechanism 20 according to the present application, which includes a rotatable disk-shaped base 22, and a fixed claw 23 and a movable claw 24 for holding a wafer w are disposed at intervals on a peripheral side of the base 22.
The side of the base 22 is provided with a driving motor, not shown, which rotates to drive the base 22 and the wafer w held by the claws 21 to rotate; the supply arm 40 provided at the side of the wafer w performs cleaning and drying processes on the rotated wafer w according to the process steps to remove particles on the surface of the wafer w and to strip off the water film on the surface of the wafer w. In the rotation process of the wafer w, a plurality of process steps can spray cleaning liquid on the front surface of the wafer w for cleaning or rinsing, the cleaning liquid can be thrown out by centrifugal force along with the rotation of the wafer w, and the thrown cleaning liquid is caught by the peripheral check ring 60 so as to reduce the liquid sputtering.
In one embodiment, the number of fixing claws 23 is plural and is arranged adjacent to each other. As shown in fig. 3 to 6, as an embodiment, two claws 21 are provided on the fixed claw 23 to firmly support the wafer w with a space between the two claws 21.
In one embodiment, at least one, and possibly a plurality of movable claws 24 are provided on the other side of the base 22 opposite to the fixed claws 23, in other words, a diameter is taken to divide the base 22 into two parts, the plurality of fixed claws 23 are provided on the same part, and the movable claws 24 are provided on the other part. The movable claws 24 can move along hinge points provided at the edges of the susceptor 22 to clamp the wafer w, thereby fixing the wafer w to the susceptor 22.
The fixed jaw 23 and the movable jaw 24 may have one or more jaws 21 of the same structure. When the wafer is placed, the movable claw 24 is firstly opened, the wafer w is placed on the fixed claw 23 by the mechanical arm, the movable claw 24 closes to clamp the wafer w, and the mechanical arm loosens the wafer and moves away. When the wafer is taken, the wafer w is clamped by the manipulator, the movable claw 24 is opened, and the wafer w is taken by the manipulator.
As shown in fig. 3 to 6, as an embodiment of the present application, the claw 21 has an end face 25 seen when facing the wafer w, a first side face 26 in contact with the wafer w, a second side face 27 facing away from the wafer w adjacent to the first side face 26, a third side face 28 adjacent to the second side face 27 and opposite to the first side face 26, and a fourth side face 29 adjacent to the first side face 26 and opposite to the second side face 27.
Wherein the first side 26 and the second side 27 of the claw 21 are substantially perpendicular to the surface of the wafer w.
As shown in fig. 3, in one embodiment, the angle β between the first side 26 and the second side 27 is an acute angle, specifically, the angle β between the first side 26 and the second side 27 is 5 ° to 50 °, preferably 15 ° to 25 °, and further preferably 20 °.
As shown in fig. 3, as an embodiment of the present application, the end surface 25 of the claw 21 has a shuttle shape, wherein the shuttle shape refers to a shape with a width between two tips, and may include a diamond shape or a parallelogram shape. The clamping jaw 21 is obliquely arranged so that an acute angle alpha is formed between a long diagonal line of the shuttle shape and the opposite direction of the rotation direction of the wafer w, thereby reducing the blocking effect of the clamping jaw 21 side on liquid thrown out of the wafer w and avoiding secondary pollution to the wafer w caused by the fact that the liquid thrown out of the wafer w and the clamping jaw 21 side are impacted to form sputtering.
As shown in fig. 3, the angle α between the long diagonal of the shuttle and the direction opposite to the rotation direction of the wafer w is 10 ° to 60 °, preferably 15 ° to 45 °, and more preferably 30±10°.
As shown in fig. 3, when the liquid drop thrown out by the wafer w hits the claw 21, the incident speed direction of the liquid drop relative to the claw 21 is close to tangent with the surface of the claw 21, so that severe collision and formed splash liquid drop at the position are effectively avoided; further, the incident liquid drop is sucked by the surface of the claw 21 and is guided to the tip 33 at the other end to be thrown out. It should be noted that, in fig. 3, the direction of the droplet is the direction taking the rotating claw 21 as the reference frame, when the wafer w is rotated by the wafer clamping mechanism 20, the claw 21 also rotates along with the rotating claw, and the actual scattering direction of the droplet is the direction away from the edge of the wafer along with the rotation direction of the wafer, but when the rotating claw 21 is taken as the reference frame, the moving direction of the droplet relative to the claw 21 is the direction as shown in fig. 3.
In the embodiment of the application, the spindle-shaped end face 25 of the claw 21 is obliquely arranged, and the inclination mode and the rotation direction are related, so that the blocking effect of the claw fingers on the water flow is obviously reduced compared with the prior art according to the speed direction of the liquid flow thrown out by the wafer w relative to the claw 21, the liquid throwing out by the wafer w can be effectively guided away, and the phenomenon that the liquid throwing out by the wafer w and the side face of the claw 21 are impacted positively to form sputtering and pollute the wafer w is avoided.
As shown in fig. 5, 6, 8 and 9, in one embodiment, the sharp-angled end of the jaws 21 is provided with structure for holding a wafer w. Specifically, the first side 26 is provided with a support groove 261 for supporting the edge of the wafer w. The supporting groove 261 has a notch that fits the edge profile of the wafer w to hold the wafer w.
As shown in fig. 4 and 7, in one embodiment, the second side 27 is provided with a channel 271 to concentrate the liquid falling on the jaws 21 and leading to the third side 28. The channel 271 may be a "V" shaped channel or a "U" shaped channel. And, the supporting groove 261 communicates with the flow guide groove 271. The side of the claw 21 facing the water is provided with the diversion trench 271, so that the liquid which is impacted on the claw 21 can be more concentrated in flow distribution and can be thrown out to the vertex easily when diversion is carried out to the outer side of the claw 21 along the claw 21.
As shown in fig. 4, 6, 7, 9 and 10, in one embodiment, the other end of the claw 21 with an acute angle gradually converges and narrows to form an outward pointed end 33, and the top point of the pointed end 33 is located near the plane of the front surface of the wafer w, so that after the liquid flows onto the claw 21 from the edge of the wafer w, the liquid is guided to the top point of the pointed end 33 along the surface of the claw 21 to be thrown out, and the throwing width is kept in a narrow state. Specifically, one end of the third side 28 forms an acute angle, so that an outward pointed end 33 is formed at the end of the shuttle-shape away from the wafer w, so that the liquid is guided to the pointed end 33 in a converging manner to narrow the liquid throwing width.
In one embodiment, as shown in fig. 10, the end 34 of the shuttle opposite the tip is above the plane of the wafer w, such that the wafer w rides on the first side 26. The tip 33 is in the same plane with the wafer w, so that the water throwing width of the tip 33 is the same as the surface of the wafer w, and when the liquid on the claw 21 is guided to be thrown out by the tip 33, the liquid thrown out by the edge of the wafer w is in the same plane, so that the retainer ring 60 is favorable for collecting the liquid, and the liquid cannot be sprayed outwards. That is, the end faces 25 of the jaws 21 are inclined to the plane of the wafer w, and are not parallel.
As shown in fig. 7 to 10, as an embodiment of the present application, the claw 21 may further have a through hole structure leading from the grip side to the vicinity of the apex of the protrusion to enhance the drainage capacity of the grip side. Specifically, a drain hole 35 is provided that communicates the first side 26 with the third side 28. One end of the drainage hole 35 is arranged in the supporting groove 261, and the other end of the drainage hole is arranged on the third side surface 28, so that the supporting groove 261 is communicated with the third side surface 28, and the cleaning liquid gathered in the supporting groove 261 is quickly drained to the outer side of the clamping jaw 21.
In one embodiment, the drain hole 35 of the claw 21 has a circular or oval cross-section to facilitate the drainage of the washing liquid. Further, the inner side wall of the drainage hole 35 of the claw 21 is provided with a protective layer to prevent the drainage hole 35 from being blocked due to crystallization of the cleaning liquid on the inner side wall of the drainage hole 35. As a preferred embodiment, the inner side wall of the drainage hole 35 is provided with a protective layer of parylene C or other contamination-resistant coating, the thickness of the protective layer being 0.1-0.5mm, to ensure that the cleaning liquid is led from the inner side of the jaws 21 to the outer side of the jaws 21 through the drainage hole 35.
As an aspect of this embodiment, the drainage hole 35 is a circular hole, and the inner diameter of the circular hole is 0.2mm-3mm, so as to overcome the surface tension of the cleaning solution, and avoid that the end surface of the drainage hole 35 is blocked by a water film to affect smooth drainage of the cleaning solution. As a variation of this embodiment, the drainage hole 35 may also be a tapered hole, and the diameter of the opening of the drainage hole 35 on the first side 26 is smaller than the diameter of the opening of the drainage hole 35 on the third side 28, which is beneficial to the drainage effect of the cleaning liquid.
As an embodiment of the present application, the jaws 21 are made of polyetheretherketone, and a surface thereof is coated with a stain-resistant coating to prevent the cleaning solution from crystallizing on the outer side surfaces of the jaws 21 to affect the cleaning effect of the wafer w. The PEEK is a polymer with a main chain structure containing one ketone bond and two ether bonds, is a special polymer material, has the physical and chemical properties of high temperature resistance, chemical corrosion resistance and the like, and can be used in the technical field of chemical mechanical polishing. It will be appreciated that the jaws 21 may also be made of a polymer material resistant to chemical attack, such as polyphenylene sulfide (PPS).
As an aspect of this embodiment, the stain resistant coating comprises parylene C having a thickness of 0.1-0.5mm.
As shown in fig. 4 to 9, as an embodiment of the present application, a jaw seat 36 for fixing the jaw 21 is further provided, and the jaw seat 36 is used for improving the rigidity of the jaw 21 as a whole, so that the jaw 21 is not easily deformed during the high-speed rotation of the wafer w.
According to the claw structure provided by the embodiment of the application, the speed direction of liquid flow thrown out by the wafer w relative to the claw 21 is complied, and compared with the prior art, the claw structure is in a fusiform structure, so that the blocking effect of the claw on the water flow is obviously reduced, the liquid throwing of the wafer w can be effectively guided away, and the situation that the liquid throwing of the wafer w and the side surface of the claw 21 are impacted positively to form sputtering and pollute the wafer w is avoided; meanwhile, the clamping capacity of the wafer w is reserved, and the wafer w has the characteristic of greatly narrowing the liquid throwing width, so that the wafer w is a better scheme.
The drawings in the present specification are schematic views, which assist in explaining the concept of the present application, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present application, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. The wafer clamping mechanism is characterized by comprising a base with a rotatable disc-shaped structure, wherein claws for holding a wafer are arranged on the peripheral side of the base at intervals, each claw is provided with an end face which is right opposite to the wafer and is seen, a first side face which is contacted with the wafer, and a second side face which is adjacent to the first side face and is far away from the wafer, the end faces of the claws are in a fusiform, and the claws are obliquely arranged so that long diagonal lines of the fusiform form acute angles with the opposite direction of the rotating direction of the wafer; the claw is also provided with a third side surface adjacent to the second side surface, and an acute angle is formed at the intersection of the third side surface and the end surface, so that an outward pointed end is formed at one end of the fusiform far away from the wafer, and liquid is converged and guided to the pointed end, so that the liquid throwing width is narrowed.
2. A wafer clamping mechanism according to claim 1 wherein the end of the shuttle opposite the tip is above the plane of the wafer, the tip being substantially coplanar with the wafer.
3. The wafer clamping mechanism of claim 1 wherein the angle between the long diagonal of the shuttle and the opposite direction to the direction of wafer rotation is 10 ° to 60 °.
4. The wafer clamping mechanism of claim 1 wherein said second side is provided with a flow guide to concentrate liquid falling on the jaws and directed to the third side.
5. The wafer clamping mechanism of claim 1 wherein said first side is provided with a support slot for supporting a wafer edge.
6. The wafer clamping mechanism of claim 5 wherein said support slot communicates with said flow guide slot.
7. The wafer clamping mechanism of claim 1 wherein said jaws are further provided with drainage apertures communicating said first side with said third side.
8. The wafer clamping mechanism of claim 1 wherein the angle between the first side and the second side is an acute angle.
9. A wafer post-processing apparatus comprising a wafer clamping mechanism as claimed in any one of claims 1 to 8, a supply arm for delivering a fluid, and a retaining ring disposed around a wafer; the supply arm may oscillate vertically and supply fluid to the wafer via a spray mechanism disposed at a free end thereof.
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