CN113727588A

CN113727588A - Temperature control method and device for machine room, equipment and medium

Info

Publication number: CN113727588A
Application number: CN202111035495.8A
Authority: CN
Inventors: 张杨锴; 郑虹
Original assignee: Industrial and Commercial Bank of China Ltd ICBC
Current assignee: Industrial and Commercial Bank of China Ltd ICBC
Priority date: 2021-09-03
Filing date: 2021-09-03
Publication date: 2021-11-30
Anticipated expiration: 2041-09-03
Also published as: CN113727588B

Abstract

The present disclosure relates to the field of communication rooms or the field of finance, and the like, and more particularly, to a temperature control method, apparatus, room, device, medium, and program product for a room. According to the temperature control method for the machine room, the temperature of each cabinet is monitored and calculated through the sensor, and when the monitored cabinet temperature does not accord with the preset temperature value, the corresponding cabinet temperature is adjusted through the refrigerating device, so that the accurate adjustment of the temperature of a single cabinet in the machine room is realized, and the problem of high energy consumption of the machine room caused by the integral adjustment mode is avoided. Further, when the temperature of the cabinet is calculated, in order to ensure the accuracy of the obtained current temperature of the cabinet, the influence of the adjacent cabinet of the current cabinet on the temperature of the current cabinet is introduced when the temperature of the current cabinet is calculated, the heat productivity of the adjacent cabinet is judged by detecting the stacking height of the servers in the adjacent cabinet, and then the temperature influence coefficient on the current cabinet is determined.

Description

Temperature control method and device for machine room, equipment and medium

Technical Field

The present disclosure relates to the field of communication rooms or the field of finance, and the like, and more particularly, to a temperature control method, apparatus, room, device, medium, and program product for a room.

Background

With the development of science and technology, the application of IT equipment such as servers, network switches and large computers is continuously increased, the scale of data centers is continuously enlarged, and the heat dissipation density of the IT equipment is also remarkably increased. The continuous operation of each equipment of the data center can cause the continuous temperature rise of a machine room of the data center, and further the safe operation and the service life of the IT equipment are influenced.

Disclosure of Invention

In view of the above, the present disclosure provides a temperature control method, apparatus, room, device, medium, and program product for a room.

According to a first aspect of the present disclosure, there is provided a temperature control method for a machine room in which a plurality of cabinets and a cooling device are disposed, the method comprising: numbering a plurality of cabinets in sequence from 1 to N based on the placement order of the cabinets, wherein N is an integer; acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than 1 and less than N, and is an integer; respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet, and respectively determining the temperature influence coefficient a of the M-1 th cabinet on the M cabinet and the temperature influence coefficient b of the M +1 th cabinet on the M cabinet based on the stacking heights; according to said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M(ii) a And determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet.

In certain embodiments, said determining is based on said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_MThe method comprises the following steps: t is_M＝t_m+(t_m-1-t_m)*a+(t_m+1-t_m)*b。

In some embodiments, the temperature control method for a machine room of the present disclosure further includes: dividing the height of the cabinet into a plurality of continuous height intervals according to the standard height U of the server; the respectively obtaining the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet comprises: respectively arranging position sensors in the range of the height interval, wherein the position sensors are used for detecting whether the server is placed in the height interval; and determining the stacking height from the height interval in which the server is determined to be placed according to the detection result of the position sensor.

In some embodiments, the dividing the height of the cabinet into a plurality of consecutive height intervals according to the standard height U of the server includes: the height interval is (0, 3U), (3U, 6U), (6U, 9U), (9U, 12U), (12U, 24U) and (24U, 36U) from the bottom end of the cabinet upwards in sequence.

In some embodiments, the temperature control method for a machine room of the present disclosure further includes: setting different temperature influence coefficients for the plurality of height sections respectively, wherein the values of the temperature influence coefficients at least depend on the heating values of the servers in the different height sections; the determining the temperature influence coefficient a of the M-1 th cabinet on the Mth cabinet and the temperature influence coefficient b of the M +1 th cabinet on the Mth cabinet respectively based on the stacking heights comprises: and determining the temperature influence coefficient according to the height interval corresponding to the stacking height.

In some embodiments, the value of the temperature coefficient is also dependent on the efficiency of heat transfer between adjacent cabinets.

In some embodiments, the cooling device includes a plurality of outlet floors disposed below the cabinets, and the controlling the operating state of the cooling device in the machine room according to the difference value to adjust the overall temperature of the mth cabinet includes: determining an air outlet floor corresponding to the Mth cabinet according to the serial number of the Mth cabinet; and adjusting the size of an air outlet on the air outlet floor according to the difference.

In some embodiments, the air outlet floor includes a first ventilation board fixedly disposed and a wind deflector disposed below the first ventilation board, wherein the wind deflector is driven by a motor to move in a translational manner relative to the first ventilation board, and the adjusting the size of the air outlet on the air outlet floor according to the difference includes: and adjusting the rotation angle of the motor by adopting a PID algorithm according to the difference value so as to adjust the translation distance of the wind shield relative to the first ventilation board.

A second aspect of the present disclosure provides a temperature control apparatus for a machine room, including: the equipment comprises an identification module, a storage module and a processing module, wherein the identification module is used for numbering a plurality of equipment cabinets from 1 to N in sequence based on the placement sequence of the equipment cabinets; a temperature acquisition module for acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than or equal to 1 and less than or equal to N; the server stacking height acquisition module is used for respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet; a temperature influence coefficient determining module, configured to determine a temperature influence coefficient a of the M-1 th cabinet on the mth cabinet and a temperature influence coefficient b of the M +1 th cabinet on the mth cabinet, respectively, based on the stacking height; an integral temperature calculation module for calculating the integral temperature according to the temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M(ii) a A bulk temperature adjustment module for determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet.

A third aspect of the present disclosure provides a machine room, comprising: a plurality of cabinets, a plurality of cabinets set up side by side in the computer lab, every all be provided with on the cabinet: a temperature sensor for detecting a real-time temperature of the cabinet; a plurality of position detection devices for detecting a stacking height of the servers within the cabinet; the machine room further comprises: the refrigerating device is used for adjusting the temperature of the cabinet; a controller adapted to perform any of the above described temperature control methods for a machine room.

In some embodiments, the position detecting device is configured as a position sensor, a plurality of consecutive height sections are divided in the height direction of the cabinet according to a standard height U of the server, and a plurality of the position sensors are respectively arranged on the cabinet corresponding to the height sections.

In certain embodiments, the refrigeration device comprises: the cooling device is used for preparing cold air for reducing the temperature of the cabinet; the air outlet floor is arranged on the bracket below the cabinet and used for guiding the cold air to flow to the cabinet; and the air duct is arranged between the cooling device and the air outlet floor and used for circulating the cold air.

In some embodiments, the outlet floor comprises: the first ventilating plate is fixed on the support and provided with an air outlet, and the air outlet is arranged towards the cabinet; the wind shield is movably arranged below the first ventilation plate, an air outlet corresponding to the air outlet is formed in the wind shield, and the wind shield does translational motion relative to the first ventilation plate under the driving of a motor.

In some embodiments, the outlet floor further comprises: the second ventilating plate is arranged below the wind shield and fixed on the bracket, and an air inlet suitable for being communicated with the air channel is formed in the second ventilating plate; the motor is arranged on the second ventilating plate, a rack is arranged in the middle of the end face, facing the second ventilating plate, of the wind shield, and a gear suitable for being meshed with the rack is arranged on the motor.

A fourth aspect of the present disclosure provides an electronic device, comprising: one or more processors; a memory for storing one or more programs, wherein the one or more programs, when executed by the one or more processors, cause the one or more processors to perform the above-described temperature control method for a room.

The fifth aspect of the present disclosure also provides a computer-readable storage medium having stored thereon executable instructions that, when executed by a processor, cause the processor to perform the above-described temperature control method for a room.

A sixth aspect of the present disclosure also provides a computer program product comprising a computer program which, when executed by a processor, implements the above temperature control method for a room.

According to the method, a plurality of cabinets are numbered sequentially from 1 to N through a cabinet-based placing sequence, wherein N is an integer; acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than 1 and less than N, and is an integer; respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet, and respectively determining the temperature influence coefficient a of the M-1 th cabinet on the M cabinet and the temperature influence coefficient b of the M +1 th cabinet on the M cabinet based on the stacking heights; according to said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M(ii) a And determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet, thereby realizing the adjustment of the temperature of the machine cabinet in the machine room. It can be understood that, when the temperature of the machine room is adjusted in the embodiment of the disclosure, the traditional mode of integrally adjusting the indoor temperature of the whole machine room is not adopted, but the temperature of each cabinet is monitored and calculated through a sensor, and when the monitored temperature of the cabinets does not accord with the preset temperature value, the corresponding temperature of the cabinets is adjusted through a refrigerating device, so that the temperature of a single cabinet in the machine room is accurately adjusted, and the problem of high energy consumption of the machine room caused by the integral adjusting mode is avoided. Further, when the temperature of the cabinet is calculated, in order to ensure the accuracy of the obtained current temperature of the cabinet, the influence of the adjacent cabinet of the current cabinet on the temperature of the current cabinet is introduced when the temperature of the current cabinet is calculated, the heat productivity of the adjacent cabinet is judged by detecting the stacking height of the servers in the adjacent cabinet, and then the temperature influence coefficient on the current cabinet is determined.

Drawings

The foregoing and other objects, features and advantages of the disclosure will be apparent from the following description of embodiments of the disclosure, which proceeds with reference to the accompanying drawings, in which:

fig. 1 schematically illustrates an application scenario diagram of a temperature control method, apparatus, device, medium and program product for a computer room according to an embodiment of the present disclosure;

fig. 2 schematically shows a flow chart of a temperature control method for a machine room according to an embodiment of the present disclosure;

fig. 3 schematically shows a flow chart of another temperature control method for a machine room according to an embodiment of the present disclosure;

fig. 4 schematically shows a flow chart of another temperature control method for a machine room according to an embodiment of the present disclosure;

fig. 5 schematically shows a block diagram of a temperature control device for a machine room according to an embodiment of the present disclosure;

fig. 6 schematically shows a structural schematic diagram of a machine room according to an embodiment of the present disclosure;

fig. 7 schematically shows an exploded view of a wind outlet floor in a machine room according to an embodiment of the disclosure;

figure 8 schematically shows a cross-sectional view of a machine room according to an embodiment of the present disclosure;

fig. 9 schematically shows a structural schematic diagram of a controller in a machine room according to an embodiment of the present disclosure;

fig. 10 schematically illustrates a block diagram of a computer system suitable for implementing a temperature control method for a room according to an embodiment of the present disclosure.

Description of reference numerals:

5, a cabinet;

6-position detection means;

7-a temperature sensor;

8-a refrigeration device; 81-air outlet floor; 82-a cooling device; 83-a scaffold; 84-air duct; 811-a first ventilation board; 812-an air outlet; 813-wind screen; 814-air passing holes; 815-a second vent plate; 816-air inlet; 817-gear; 818-a rack;

9-a controller.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.

Where a convention analogous to "at least one of A, B and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B and C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).

The detailed background may include other technical problems than those which are exclusively addressed.

The embodiment of the disclosure provides a temperature control method for a machine room, which includes numbering a plurality of machine cabinets in sequence from 1 to N based on a placement sequence of the machine cabinets, wherein N is an integer; acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value detected by the sensor on the Mth cabinet，t_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than 1 and less than N, and is an integer; respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet, and respectively determining the temperature influence coefficient a of the M-1 th cabinet on the M cabinet and the temperature influence coefficient b of the M +1 th cabinet on the M cabinet based on the stacking heights; according to said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M(ii) a And determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet, thereby realizing the adjustment of the temperature of the machine cabinet in the machine room.

It should be noted that the temperature control method for the machine room provided by the embodiment of the present disclosure may be used in the aspects related to the transmission of the micro service data by the big data and the distributed technology, and may also be used in various fields other than the big data and the distributed technology, such as the financial field.

Fig. 1 schematically shows an application scenario diagram of a temperature control method for a computer room according to an embodiment of the present disclosure.

As shown in fig. 1, the application scenario 100 according to this embodiment includes

cabinets

101, 102, 103 disposed in a machine room. The network 104 is used to provide the medium of communication links between the

racks

101, 102, 103 and the central server 105. Network 104 may include various connection types, such as wired, wireless communication links, or fiber optic cables, to name a few.

The

racks

101, 102, 103 implement information interaction with the central server 105 through the network 104, so as to implement monitoring and adjusting of the central server 105 on the temperature states of the

racks

101, 102, 103. The

cabinets

101, 102, 103 are provided with devices such as temperature sensors for detecting temperature signals thereof. The type of

cabinet

101, 102, 103 may be a server cabinet, a network cabinet, a console cabinet, etc

The central server 105 may be a server that provides various services, such as a back-office management server (for example only) that performs computational processing on the temperature information provided by the

racks

101, 102, 103. The background management server may analyze and process the received data such as the temperature information, and feed back a processing result (e.g., a webpage, information, or data obtained or generated according to a user request) to the cabinet.

It should be noted that the temperature control method for the computer room provided by the embodiment of the present disclosure may be generally executed by the central server 105. Accordingly, the temperature control device for the computer room provided by the embodiment of the present disclosure may be generally disposed in the central server 105. The temperature control method of the computer room provided by the embodiment of the present disclosure may also be performed by a server or a server cluster different from the server and capable of communicating with the

cabinets

101, 102, 103 and/or the central server 105. Accordingly, the temperature control device for the computer room provided by the embodiment of the present disclosure may also be disposed in a server or a server cluster different from the server and capable of communicating with the

cabinets

101, 102, 103 and/or the central server 105.

It should be understood that the number of racks, networks, and central servers in fig. 1 is merely illustrative. There may be any number of racks and central servers, as desired for implementation.

A temperature control method for a machine room according to an embodiment of the present disclosure will be described in detail below with reference to fig. 2 to 4 based on the scenario described in fig. 1.

Fig. 2 schematically shows a flow chart of a temperature control method for a machine room according to an embodiment of the present disclosure.

As shown in fig. 2, the temperature control method for a machine room of this embodiment includes operations S210 to S250.

In operation S210, a plurality of cabinets are sequentially numbered 1 to N, N being an integer, based on a placement order of the cabinets.

The machine room in the embodiment of the disclosure is a machine room of a large-scale data center, and a plurality of cabinets are placed in the machine room. The placing sequence of the cabinets is the placing mode of the cabinets in the machine room, and the placing sequence can be a permutation and combination mode, or star-shaped distribution, or concentric circle distribution, and the like.

The embodiment of the disclosure is described in a manner that the placement order of the cabinets is a permutation and combination. A plurality of cabinets constitute one row, and multiseriate cabinet is row and arranges, and based on this, the numbering mode in the embodiment of this disclosure is, to the cabinet of one of them row, from the head of a row to the tail serial number of being 1 to N in proper order, can set up corresponding row number in addition between different rows and distinguish. In the present disclosure, when the temperature of the cabinet in the machine room is calculated, only one column of the temperature is taken as an object for research and implementation.

It is understood that N is a positive integer, and in order to facilitate the description of the interaction between adjacent cabinets in the following, N is preferably a positive integer greater than 1 in the embodiment of the present disclosure.

In operation S220, temperature data t is acquired_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively represents the temperature values detected by the temperature sensors on the M-1 th cabinet and the M +1 th cabinet, wherein M is an integer and is more than 1 and less than N.

Temperature data t in embodiments of the present disclosure_m，t_m-1And t_m+1The acquisition mode of (2) is that a temperature sensor is arranged on each cabinet, and the arrangement position of the temperature sensor can be the bottom, the side part or the upper part of the inner side of the cabinet.

It can be understood that the advantage of setting up a temperature sensor on single rack lies in can saving the cost that the sensor set up, but, the rack is mostly the box that has a take the altitude, and the actual temperature value of current rack can not be reflected well to the temperature that single-point detected, and this disclosed at least one advantage lies in can calculating the actual temperature value of current rack as far as possible on the basis of single temperature sensor detects the rack temperature.

It can be understood that according to the placement sequence of the cabinets, the (M-1) th cabinet and the (M + 1) th cabinet are adjacent cabinets on the left and right sides of the (M) th cabinet respectively. Further, based on the one-to-one correspondence relationship between the temperature sensors and the cabinets, the temperature sensors may be numbered directly in the server in the embodiment of the present disclosure to identify the corresponding cabinets.

In operation S230, stack heights of servers on the M-1 th rack and the M +1 th rack are respectively obtained, and a temperature influence coefficient a of the M-1 th rack on the M-th rack and a temperature influence coefficient b of the M +1 th rack on the M-th rack are respectively determined based on the stack heights.

In the embodiment of the present disclosure, obtaining the stacking height of the server on the M-1 th cabinet and the M +1 th cabinet is implemented by using a position sensor, such as a photoelectric sensor, a laser sensor, or a mechanical contact sensor.

It is understood that, as shown in fig. 3, in order to implement the arrangement of the position sensor on the cabinet to monitor different stacking heights of the servers on the cabinet, the embodiment of the present disclosure further includes an operation S260.

In operation S260, the height of the cabinet is divided into a plurality of consecutive height intervals according to the standard height U of the server.

It will be appreciated that the servers are modular with standard heights of 1U, 2U, 4U, etc. and that the overall height of the cabinet is designed to be related to the standard height of the servers for better housing the servers. Based on this, in the embodiment of the present disclosure, one of the height division modes of the total height of the cabinet based on the standard height U of the server may be: from the bottom end of the cabinet, the cabinet is sequentially provided with (0, 3U), (3U, 6U), (6U, 9U), (9U, 12U), (12U, 24U) and (24U, 36U). As a variant, the division of the height interval may be adaptively divided according to the specific placement of the servers in the cabinet, and the basic requirement is that the stacking height of the servers in the cabinet can be detected by the position sensor.

In the embodiments of the present disclosure, position sensors are respectively disposed in the height interval ranges, the position sensors can detect whether a server is placed in the height interval, and determine a stacking height from the height interval in which the server is determined to be placed according to a detection result of the position sensors, for example, if the position sensors in the height interval (0, 3U), [3U, 6U), [6U, 9U), [9U, 12U) have a trigger, the stacking height of the server in the cabinet can be determined to be 12U. In the embodiment of the disclosure, the position sensor is preferably arranged at the bottom of the height interval to ensure that the temperature of the cabinet can be effectively adjusted.

It can be understood that the operation S260 is performed in an effect that when the overall temperature of the cabinet M, i.e. the actual temperature in the above, is measured, the heat generated by the servers in the cabinets on two adjacent sides of the cabinet M also has an influence on the temperature of the cabinet M, so that the overall temperature of the cabinet M is further optimized in the method of the present disclosure at least in terms of the influence of the adjacent cabinets of the cabinet M on the temperature of the cabinet M.

It is understood that, as shown in fig. 4, in order to determine the influence between adjacent cabinets, operation S270 is further included in the embodiment of the present disclosure.

In operation S270, different temperature influence coefficients are respectively set for a plurality of the height sections, and the values of the temperature influence coefficients depend on at least the heat generation amounts of the servers in the different height sections.

It can be understood that the heating value of the server is positively correlated with the stacking height, and the stacking height is large, which means that the number of servers placed in the current cabinet is large, and the heat generated by the corresponding current cabinet is large. Based on this, in the embodiment of the disclosure, different temperature influence coefficients are set for different height sections, and the larger the height section is, the larger the temperature influence coefficient is, and further, the temperature influence coefficient may be determined according to the height section corresponding to the stacking height.

It will be appreciated that the value of the temperature coefficient also depends on the efficiency of heat transfer between adjacent cabinets. For example, when the temperature of the cabinet M-1 is higher than that of the cabinet M, the heat in the cabinet M-1 will be conducted into the cabinet M, and based on the principle that there is heat loss in the heat conduction process, the corresponding heat transfer efficiency can be determined by means of field test. Further, the stack height and heat transfer efficiency may be considered in combination when determining the temperature coefficient of influence. As the height intervals (0, 3U), [3U, 6U), [6U, 9U), [9U, 12U) divided as described above, the corresponding temperature influence coefficients may be: 1/3 × 0, 1/3 × 1/8, 1/3 × 1/4, 1/3 × 3/8, 1/3 × 1/2, 1/3 × 3/4, 1/3 × 1.

It should be noted that, for the cabinets located at the column head and the column tail, such as cabinet 1, the adjacent cabinet M-1 is cabinet 0, at this time, zero value processing is performed on cabinet 0, the substitution calculation is performed, and the processing manner of the cabinet at the column tail is the same, which is not described in detail.

In operation S240, according to the temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M。

Bulk temperature T in embodiments of the present disclosure_MThe calculation formula of (2) is as follows: t is_M＝t_m+(t_m-1-t_m)*a+(t_m+1-t_m) B. This formula represents the overall temperature of the cabinet M including the local temperature t detected using the temperature sensor_mAnd the heat transfer brought by the temperature difference between the adjacent cabinet M and the adjacent cabinet M +1 and the adjacent cabinet M.

In operation S250, the bulk temperature T is determined_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet.

In the embodiment of the disclosure, the refrigeration device comprises a plurality of air outlet floors arranged below the cabinet, each air outlet floor comprises a first ventilation board fixedly arranged and a wind shield arranged below the first ventilation board, the wind shields are driven by the motors to move in a translation mode relative to the first ventilation board, and the motors to be adjusted can be determined by determining the serial numbers of the cabinet based on the corresponding relation between the cabinet and the air outlet floors and the one-to-one corresponding relation between the air outlet floors and the motors. In order to realize the method, the corresponding relation can be recorded into the server in advance for storage, so that the relevant data can be directly called when the temperature is adjusted.

It will be appreciated that after determining the bulk temperature of the cabinet M, the server calculates the bulk temperature T_MAnd adjusting the size of the air outlet on the air outlet floor according to the difference value of the preset temperature of the cabinet M. More specifically, when the difference calculated by the temperatures of the plurality of cabinets is obtained, the rotation angle of the motor can be adjusted by adopting a PID algorithm, and then the wind shield is adjusted relative to the first ventilationThe translation distance of board, and then the size of adjusting the air outlet on the first ventilating board, the air output of adjusting air outlet department cold wind realizes the temperature regulation to rack M, and the temperature of rack M who calculates up to the circulated detection once more accords with preset temperature, then stops accommodation process.

It should be noted that, for simplicity of illustration, the mth cabinet is expressed as the cabinet M, the M-1 cabinet is expressed as the cabinet M-1, and the M +1 cabinet is expressed as the cabinet M + 1.

Based on the temperature control method for the machine room, the disclosure also provides a temperature control device for the machine room. The apparatus will be described in detail below with reference to fig. 5.

Fig. 5 schematically shows a block diagram of a temperature control device for a machine room according to an embodiment of the present disclosure.

As shown in fig. 5, the module 300 of the embodiment includes an identification module 301, a temperature acquisition module 302, a server stack height acquisition module 303, a temperature influence coefficient determination module 304, an overall temperature calculation module 305, and an overall temperature calculation module 306.

The identification module 301 is configured to number, in sequence, the multiple cabinets from 1 to N based on the placement order of the cabinets, and is adapted to perform step S210 in the foregoing;

a temperature obtaining module 302 for obtaining temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on the (M-1) th cabinet and the (M + 1) th cabinet, wherein M is more than or equal to 1 and less than or equal to N, and is suitable for executing the step S220;

a server stacking height obtaining module 303, configured to obtain stacking heights of servers on the M-1 th cabinet and the M +1 th cabinet, respectively, and adapted to perform step S230 in the foregoing;

a temperature influence coefficient determining module 304, configured to determine a temperature influence coefficient a of the mth cabinet caused by the M-1 th cabinet and a temperature influence coefficient b of the M +1 th cabinet caused by the mth cabinet based on the stacking height, respectively, and adapted to perform step S230 in the foregoing;

a bulk temperature calculation module 305 for calculating a bulk temperature from said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_MAdapted to perform step S240 of the above;

a bulk temperature calculation module 306 for determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet, wherein the difference value is equal to the preset temperature of the machine cabinet, and the step S250 is suitable for being executed.

According to the temperature control method for the machine room, the plurality of machine cabinets are sequentially numbered from 1 to N based on the placement sequence of the machine cabinets, wherein N is an integer; acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than 1 and less than N, and is an integer; respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet, and respectively determining the temperature influence coefficient a of the M-1 th cabinet on the M cabinet and the temperature influence coefficient b of the M +1 th cabinet on the M cabinet based on the stacking heights; according to said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M(ii) a And determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet, thereby realizing the adjustment of the temperature of the machine cabinet in the machine room. It can be understood that, in the embodiment of the disclosure, when the temperature of the machine room is adjusted, instead of the traditional method of integrally adjusting the indoor temperature of the whole machine room, the temperature of each cabinet is monitored and calculated by the sensor, and when the monitored temperature of the cabinets does not meet the preset temperature value, the corresponding temperature of the cabinets is adjusted by the refrigerating device, so that the aim of adjusting the temperature of the cabinets is achievedThe accurate adjustment of single rack temperature in the computer lab has avoided the high energy consumption problem of computer lab that whole regulation mode leads to. Further, when the temperature of the cabinet is calculated, in order to ensure the accuracy of the obtained current temperature of the cabinet, the influence of the adjacent cabinet of the current cabinet on the temperature of the current cabinet is introduced when the temperature of the current cabinet is calculated, the heat productivity of the adjacent cabinet is judged by detecting the stacking height of the servers in the adjacent cabinet, and then the temperature influence coefficient on the current cabinet is determined.

According to the embodiment of the present disclosure, any plurality of the identification module 301, the temperature obtaining module 302, the server stack height obtaining module 303, the temperature influence coefficient determining module 304, the overall temperature calculating module 305, and the overall temperature calculating module 306 may be combined and implemented in one module, or any one of the modules may be split into a plurality of modules. Alternatively, at least part of the functionality of one or more of these modules may be combined with at least part of the functionality of the other modules and implemented in one module. According to an embodiment of the present disclosure, at least one of the identification module 301, the temperature obtaining module 302, the server stack height obtaining module 303, the temperature influence coefficient determining module 304, the overall temperature calculating module 305, and the overall temperature calculating module 306 may be at least partially implemented as a hardware circuit, such as a Field Programmable Gate Array (FPGA), a Programmable Logic Array (PLA), a system on a chip, a system on a substrate, a system on a package, an Application Specific Integrated Circuit (ASIC), or may be implemented by hardware or firmware in any other reasonable manner of integrating or packaging a circuit, or implemented by any one of three implementation manners of software, hardware, and firmware, or by a suitable combination of any of them. Alternatively, at least one of the identification module 301, the temperature acquisition module 302, the server stack height acquisition module 303, the temperature impact coefficient determination module 304, the bulk temperature calculation module 305, the bulk temperature calculation module 306 may be at least partially implemented as a computer program module which, when executed, may perform a corresponding function.

Fig. 6 to 9 schematically show structural diagrams of a machine room constructed based on a temperature control method for the machine room according to an embodiment of the present disclosure.

Referring to fig. 6, the machine room in the embodiment of the present disclosure includes a plurality of cabinets 5, the plurality of cabinets 5 are arranged in the machine room side by side, specifically, the plurality of cabinets 5 are constructed into two rows, the two rows of cabinets 5 are arranged at intervals, and the intervals are constructed as walkways, so as to facilitate daily work activities of operators. One end of the walkway is provided with a door body to facilitate the entrance and exit of personnel.

It should be noted that the type of the cabinet 5 in the embodiment of the present disclosure is a server cabinet 5, and various servers are suitable to be placed in the cabinet.

With continued reference to fig. 6, each cabinet 5 is provided with: temperature sensor 7, temperature sensor 7 are used for detecting the real-time temperature of rack 5, and temperature sensor 7 sets up in the intermediate position department of the medial surface of rack 5 in the embodiment of this disclosure, and the quantity is one. Each cabinet 5 is further provided with a plurality of position detecting devices 6 for detecting the stacking height of the servers in the cabinet 5, specifically, the position detecting devices 6 are configured as position sensors, a plurality of continuous height intervals are divided in the height direction of the cabinet 5 according to the standard height U of the servers, and the position sensors are respectively arranged on the cabinet 5 corresponding to the height intervals. Wherein the server is a standard piece having a standard height of 1U, 2U, 4U, etc., and for better accommodating the server, the designed total height of the cabinet 5 is related to the standard height of the server. Based on this, one of the height division of the total height of the cabinet 5 based on the standard height U of the server in the embodiment of the present disclosure may be: from the bottom end of the cabinet 5, the parts are (0, 3U), (3U, 6U), (6U, 9U), (9U, 12U), (12U, 24U) and (24U, 36U) in sequence. As a variant, the division of the height interval may be adaptively divided according to the specific placement of the servers in the cabinet 5, and the basic requirement is that the stacking height of the servers in the cabinet 5 can be detected by the position sensor.

As shown in fig. 7 and 8, the machine room further includes: and the refrigerating device 8 is used for regulating the temperature of the cabinet 5. The refrigeration apparatus 8 includes: cooling device 82 for the preparation reduces the cold wind of rack 5 temperature, and cooling device 82 specifically can be the precision air conditioner commonly used, and the precision air conditioner refrigerates the air in the external world to produce cold wind, and the precision air conditioner setting is in the outside of computer lab, in order to avoid the occupation to computer lab inner space.

Referring to fig. 8, the bottom of the machine room is hollowed, and an air outlet floor 81 and a bracket 83 are disposed at the bottom of the machine room, wherein the air outlet floor 81 is disposed on the bracket 83 below the cabinet 5, and is used for guiding the cool air to the cabinet 5, and the cabinet 5 is disposed on the air outlet floor 81. And a quasi-viaduct structure is constructed by a combination structure of a plurality of brackets 83 and a plurality of air outlet floors 81 to form an air duct 84. The air duct 84 communicates the cooling device 82 with the air outlet floor 81, and is used for guiding the cool air to the cabinet 5 through the air outlet floor 81, as shown by the arrow in fig. 8.

Referring to fig. 7, in the embodiment of the present disclosure, the air outlet floor 81 includes: the first ventilation board 811, the second ventilation board 815 and the wind screen 813 are arranged in this order from top to bottom. Specifically, the first ventilation plate 811 is fixed to the bracket 83, and is provided with an air outlet 812. First ventilating board 811 is the square plate structure of steel panel processing, and evenly processing has a plurality of circular shape air outlets 812 on it, and air outlet 812 sets up towards rack 5. Four brackets 83 are provided at four corners of the first ventilation board 811, respectively, and both are fixed by screws.

Furthermore, the wind deflector 813 is movably disposed below the first ventilation board 811, and has an air passing opening 814 corresponding to the air outlet 812, and the wind deflector 813 is driven by a motor to perform a translational motion relative to the first ventilation board 811. The material of the wind deflector 813 may be a light aluminum alloy or a synthetic plastic to reduce the driving force required to drive the wind deflector to move. The wind deflector 813 is also a plate-shaped structure, and a plurality of air passing openings 814 are formed in the wind deflector 813, and it should be noted that the shapes and sizes of the air passing openings 814 and the air outlet 812 do not need to adopt a uniform design, such as the shape of the middle air outlet 812 is circular, and the shape of the air passing openings 814 in the wind deflector 813 can be a long hole, etc.

In order to realize the movement of the wind shielding plate 813, the wind outlet floor 81 in the embodiment of the present disclosure further includes: and the second vent plate 815 is arranged below the wind shield 813 and fixed on the bracket 83, and the second vent plate 815 is provided with an air inlet 816 suitable for communicating with the air duct 84. The second vent plate 815 is also a square plate made of steel plate, and a plurality of square air inlets 816 are uniformly formed thereon, so that the cold air from the cooling device 82 enters the air outlet floor 81 through the air inlets 816. Four brackets 83 are provided at four corners of the second vent plate 815, respectively, and both are fixed by screws. The motor is arranged on the second vent plate 815, a rack 818 is arranged in the middle of the end face of the wind shield 813 facing the second vent plate 815, a gear 817 suitable for being meshed with the rack 818 is arranged on the motor, and when the motor rotates, the gear 817 on the motor is meshed with the rack 818 on the wind shield 813 to drive the rack 818 to move, so that the wind shield 813 is driven to move.

Referring to fig. 9, the machine room in the embodiment of the present disclosure further includes a controller 9 adapted to execute a temperature control method for the machine room. The controller 9 includes: CPU control module, PID regulation control module, wireless communication module, power conversion module, display or control panel. The control process of the controller 9 is as follows:

the temperature sensor 7 and the position sensor on the cabinet 5 upload the detection temperature of the current cabinet 5 and the stacking height information of the server to the CPU control module through the wireless communication module, the CPU control module calculates the overall temperature of the current cabinet 5 according to a built-in algorithm, calculates the temperature difference between the overall temperature of the current cabinet 5 and the preset temperature of the cabinet 5 prestored in the CPU, and determines the rotating speed of the stepping motor according to the temperature difference. And the calculated rotating speed is sent to a PID adjusting module through a wireless communication module, and the PID adjusting module adjusts the rotating speed of the motor on the air outlet floor 81 corresponding to the current cabinet 5 according to the rotating speed. The CPU control module can also be in communication connection with the precision air conditioner so as to control the refrigeration temperature, the air output and the like of the precision air conditioner. The power supply conversion module provides electric energy for the CPU control module, the precision air conditioner, the PID regulation control module, the wireless communication module and the like. The display or the control panel is used for displaying the temperature state of each cabinet and facilitating the checking and operation of the related parameters, equipment states and the like of the cabinets by operators, such as the working state of the temperature sensor.

Fig. 10 schematically shows a block diagram of an electronic device for a temperature control method of a room according to an embodiment of the present disclosure.

As shown in fig. 10, an electronic device 400 according to an embodiment of the present disclosure includes a processor 401 that can perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM)402 or a program loaded from a storage section 408 into a Random Access Memory (RAM) 403. Processor 401 may include, for example, a general purpose microprocessor (e.g., a CPU), an instruction set processor and/or associated chipset, and/or a special purpose microprocessor (e.g., an Application Specific Integrated Circuit (ASIC)), among others. The processor 401 may also include onboard memory for caching purposes. Processor 401 may include a single processing unit or multiple processing units for performing the different actions of the method flows in accordance with embodiments of the present disclosure.

In the RAM 403, various programs and data necessary for the operation of the electronic apparatus 400 are stored. The processor 401, ROM 402 and RAM 403 are connected to each other by a bus 404. The processor 401 performs various operations of the method flows according to the embodiments of the present disclosure by executing programs in the ROM 402 and/or the RAM 403. Note that the programs may also be stored in one or more memories other than the ROM 402 and RAM 403. The processor 401 may also perform various operations of the method flows according to embodiments of the present disclosure by executing programs stored in the one or more memories.

According to an embodiment of the present disclosure, electronic device 400 may also include an input/output (I/O) interface 405, input/output (I/O) interface 405 also being connected to bus 404. Electronic device 400 may also include one or more of the following components connected to I/O interface 405: an input section 406 including a keyboard, a mouse, and the like; an output section 407 including a display device such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage section 408 including a hard disk and the like; and a communication section 405 including a network interface card such as a LAN card, a modem, or the like. The communication section 405 performs communication processing via a network such as the internet. A driver 410 is also connected to the I/O interface 405 as needed. A removable medium 411 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 410 as necessary, so that a computer program read out therefrom is mounted into the storage section 408 as necessary.

The present disclosure also provides a computer-readable storage medium, which may be contained in the apparatus/device/system described in the above embodiments; or may exist separately and not be assembled into the device/apparatus/system. The computer-readable storage medium carries one or more programs which, when executed, implement the method according to an embodiment of the disclosure.

According to embodiments of the present disclosure, the computer-readable storage medium may be a non-volatile computer-readable storage medium, which may include, for example but is not limited to: a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present disclosure, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. For example, according to embodiments of the present disclosure, a computer-readable storage medium may include ROM 402 and/or RAM 403 and/or one or more memories other than ROM 402 and RAM 403 described above.

Embodiments of the present disclosure also include a computer program product comprising a computer program containing program code for performing the method illustrated in the flow chart. When the computer program product runs in a computer system, the program code is used for causing the computer system to realize the item recommendation method provided by the embodiment of the disclosure.

The computer program performs the above-described functions defined in the system/apparatus of the embodiments of the present disclosure when executed by the processor 401. The systems, apparatuses, modules, units, etc. described above may be implemented by computer program modules according to embodiments of the present disclosure.

In one embodiment, the computer program may be hosted on a tangible storage medium such as an optical storage device, a magnetic storage device, or the like. In another embodiment, the computer program may also be transmitted, distributed in the form of a signal on a network medium, downloaded and installed through the communication section 405, and/or installed from the removable medium 411. The computer program containing program code may be transmitted using any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the foregoing.

In such an embodiment, the computer program may be downloaded and installed from a network through the communication section 405 and/or installed from the removable medium 411. The computer program, when executed by the processor 401, performs the above-described functions defined in the system of the embodiments of the present disclosure. The systems, devices, apparatuses, modules, units, etc. described above may be implemented by computer program modules according to embodiments of the present disclosure.

In accordance with embodiments of the present disclosure, program code for executing computer programs provided by embodiments of the present disclosure may be written in any combination of one or more programming languages, and in particular, these computer programs may be implemented using high level procedural and/or object oriented programming languages, and/or assembly/machine languages. The programming language includes, but is not limited to, programming languages such as Java, C + +, python, the "C" language, or the like. The program code may execute entirely on the user computing device, partly on the user device, partly on a remote computing device, or entirely on the remote computing device or server. In the case of a remote computing device, the remote computing device may be connected to the user computing device through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computing device (e.g., through the internet using an internet service provider).

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.

The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.

Claims

1. A temperature control method for a machine room in which a plurality of cabinets and refrigeration units are disposed, the method comprising:

numbering a plurality of cabinets in sequence from 1 to N based on the placement order of the cabinets, wherein N is an integer;

acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than 1 and less than N, and is an integer;

respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet, and respectively determining the temperature influence coefficient a of the M-1 th cabinet on the M cabinet and the temperature influence coefficient b of the M +1 th cabinet on the M cabinet based on the stacking heights;

according to said temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M(ii) a And

determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet.

2. Temperature control method for a machine room according to claim 1, characterized in that said temperature data t is based on_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_MThe method comprises the following steps:

T_M＝t_m+(t_m-1-t_m)*a+(t_m+1-t_m)*b。

3. the temperature control method for the machine room according to claim 1, further comprising: dividing the height of the cabinet into a plurality of continuous height intervals according to the standard height U of the server;

the respectively obtaining the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet comprises: respectively arranging position sensors in the range of the height interval, wherein the position sensors are used for detecting whether the server is placed in the height interval; and determining the stacking height from the height interval in which the server is determined to be placed according to the detection result of the position sensor.

4. The temperature control method for a machine room according to claim 3, wherein the dividing the height of the cabinet into a plurality of consecutive height intervals according to the standard height U of the server comprises: the height interval is (0, 3U), (3U, 6U), (6U, 9U), (9U, 12U), (12U, 24U) and (24U, 36U) from the bottom end of the cabinet upwards in sequence.

5. The temperature control method for the machine room according to claim 3, further comprising: setting different temperature influence coefficients for the plurality of height sections respectively, wherein the values of the temperature influence coefficients at least depend on the heating values of the servers in the different height sections;

the determining the temperature influence coefficient a of the M-1 th cabinet on the Mth cabinet and the temperature influence coefficient b of the M +1 th cabinet on the Mth cabinet respectively based on the stacking heights comprises:

and determining the temperature influence coefficient according to the height interval corresponding to the stacking height.

6. The temperature control method for a machine room according to claim 5, wherein the value of the temperature coefficient is further dependent on the heat transfer efficiency between adjacent cabinets.

7. The temperature control method for the machine room according to claim 6, wherein the cooling device comprises a plurality of air outlet floors arranged below the cabinets, and the controlling the working state of the cooling device in the machine room according to the difference value to adjust the overall temperature of the Mth cabinet comprises:

determining an air outlet floor corresponding to the Mth cabinet according to the serial number of the Mth cabinet; and

and adjusting the size of an air outlet on the air outlet floor according to the difference.

8. The temperature control method for the machine room according to claim 7, wherein the air outlet floor comprises a first ventilation board fixedly arranged and a wind deflector arranged below the first ventilation board, wherein the wind deflector is driven by a motor to move in a translation manner relative to the first ventilation board, and the adjusting the size of the air outlet on the air outlet floor according to the difference comprises:

and adjusting the rotation angle of the motor by adopting a PID algorithm according to the difference value so as to adjust the translation distance of the wind shield relative to the first ventilation board.

9. A temperature control device for a machine room, comprising:

the equipment comprises an identification module, a storage module and a processing module, wherein the identification module is used for numbering a plurality of equipment cabinets from 1 to N in sequence based on the placement sequence of the equipment cabinets;

a temperature acquisition module for acquiring temperature data t_m，t_m-1And t_m+1Wherein t is_mRepresenting the temperature value, t, detected by the sensor on the Mth cabinet_m-1And t_m+1Respectively representing temperature values detected by temperature sensors on an M-1 th cabinet and an M +1 th cabinet, wherein M is more than or equal to 1 and less than or equal to N;

the server stacking height acquisition module is used for respectively acquiring the stacking heights of the servers on the M-1 th cabinet and the M +1 th cabinet;

a temperature influence coefficient determining module, configured to determine a temperature influence coefficient a of the M-1 th cabinet on the mth cabinet and a temperature influence coefficient b of the M +1 th cabinet on the mth cabinet, respectively, based on the stacking height;

an integral temperature calculation module for calculating the integral temperature according to the temperature data t_m，t_m-1And t_m+1And the temperature influence coefficients a and b calculate the integral temperature T of the Mth cabinet_M；

A bulk temperature adjustment module for determining the bulk temperature T_MAnd controlling the working state of a refrigerating device in the machine room according to the difference value so as to adjust the overall temperature of the Mth machine cabinet.

10. A machine room, comprising:

a plurality of cabinets, a plurality of cabinets set up side by side in the computer lab, every all be provided with on the cabinet:

a temperature sensor for detecting a real-time temperature of the cabinet;

a plurality of position detection devices for detecting a stacking height of the servers within the cabinet;

the machine room further comprises:

the refrigerating device is used for adjusting the temperature of the cabinet;

a controller adapted to perform the temperature control method for a machine room of any one of claims 1-8.

11. The machine room of claim 10, wherein the position detecting device is configured as a position sensor, the height direction of the cabinet is divided into a plurality of consecutive height sections according to a standard height U of the server, and a plurality of the position sensors are respectively disposed on the cabinet corresponding to the height sections.

12. The machine room of claim 11, wherein the cooling device comprises:

the cooling device is used for preparing cold air for reducing the temperature of the cabinet;

the air outlet floor is arranged on the bracket below the cabinet and used for guiding the cold air to flow to the cabinet;

and the air duct is arranged between the cooling device and the air outlet floor and used for circulating the cold air.

13. The machine room of claim 12, wherein the air outlet floor comprises:

the first ventilating plate is fixed on the support and provided with an air outlet, and the air outlet is arranged towards the cabinet;

the wind shield is movably arranged below the first ventilation plate, an air outlet corresponding to the air outlet is formed in the wind shield, and the wind shield does translational motion relative to the first ventilation plate under the driving of a motor.

14. The machine room of claim 13, wherein the outlet floor further comprises:

the second ventilating plate is arranged below the wind shield and fixed on the bracket, and an air inlet suitable for being communicated with the air channel is formed in the second ventilating plate; wherein the content of the first and second substances,

the motor is arranged on the second ventilating plate, a rack is arranged in the middle of the end face, facing the second ventilating plate, of the wind shield, and a gear suitable for being meshed with the rack is arranged on the motor.

15. An electronic device, comprising:

one or more processors;

a storage device for storing one or more programs,

wherein the one or more programs, when executed by the one or more processors, cause the one or more processors to perform the method of any of claims 1-8.

16. A computer readable storage medium having stored thereon executable instructions which, when executed by a processor, cause the processor to perform the method of any one of claims 1 to 8.

17. A computer program product comprising a computer program which, when executed by a processor, implements a method according to any one of claims 1 to 8.