CN113727526B - Windowing method for circuit board protection layer - Google Patents
Windowing method for circuit board protection layer Download PDFInfo
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- CN113727526B CN113727526B CN202111011590.4A CN202111011590A CN113727526B CN 113727526 B CN113727526 B CN 113727526B CN 202111011590 A CN202111011590 A CN 202111011590A CN 113727526 B CN113727526 B CN 113727526B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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Abstract
The invention relates to the technical field of circuit board processing, and discloses a circuit board protective layer windowing method, wherein a first processing area and a second processing area are arranged on a protective film according to the windowing position on a circuit board, so that the second processing area is arranged along the periphery of the first processing area, and a first processing parameter and a second processing parameter of a laser processing device are respectively arranged according to the first processing area and the second processing area.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a windowing method for a circuit board protection layer.
Background
At present, the process sequence adopted for windowing the circuit board is that the opening of the protective film is firstly carried out, then the protective film with the opening is attached to the circuit layer, in the actual application scene, the alignment precision error of the windowing mode is about 300um, meanwhile, the alignment precision is determined by multiple factors in the production process of the flexible board, the control difficulty is high, and the design of the flexible board circuit is restricted to be more precise and finer.
Therefore, it is necessary to provide a new windowing scheme for the protective layer of the circuit board to solve the above problems.
Disclosure of Invention
In view of this, the object of the present invention is: a high-precision windowing method for a circuit board protection layer is provided.
In order to achieve one or a part or all of the above objects or other objects, the present invention provides a method for opening a window of a circuit board protection layer, comprising the following steps: arranging a protective film on a circuit layer of a circuit board for lamination; a first processing area and a second processing area are arranged on the protective film according to the windowing position on the circuit board, and the second processing area is arranged along the periphery of the first processing area; setting first processing parameters of the laser processing device according to the first processing area, and setting second processing parameters of the laser processing device according to the second processing area; the laser processing device processes the first processing area line by line according to the first processing parameters; the laser processing device processes the second processing area along the periphery of the first processing area according to the second processing parameters.
Optionally, when the first processing area and the second processing area are processed, a buffer area is arranged between the first processing area and the second processing area, and the buffer area is used for accelerating the laser processing device, so that the laser processing device reaches set processing parameters when moving to a processing position.
Optionally, the processing the first processing area by the laser processing device includes: the first processing area comprises a first starting side and a first ending side, the laser processing device processes the first processing area line by line on the first starting side, after the Nth line is processed, the laser processing device returns to the first starting side from the first ending side, moves to the (n+1) th line from the first starting side and processes until the first processing area is processed.
Optionally, the processing the second processing area by the laser processing device includes: the laser processing device processes the second processing area along the periphery of the first processing area.
Optionally, the laser processing device processes the second processing area around the periphery of the first processing area for a plurality of times.
Optionally, the laser processing device finishes processing the second processing area around the periphery of the first processing area, including:
and the laser processing device processes the second processing area along the periphery of the first processing area according to an annular processing path.
Optionally, the processing parameters include: cutting length L, cutting width H, repetition number C, spot diameter D, filling interval Y, cutting speed V, processing time T and spot overlapping rate beta, wherein the parameters meet the following relation:
optionally, the processing parameters further include a light emitting frequency f, and when the processing area is S, the time T required for processing the area S is:
optionally, the processing parameters further include a light spot distance X, the light spot overlapping rate is β, and the light spot overlapping rate β and the light spot distance X satisfy the following relationship:
optionally, the processing parameters further include a focal length offset Z, a focal length of the focusing lens is F, a diameter of an incident beam is L, a laser wavelength is λ, a divergence angle of a focusing light spot is θ, and a theoretical light spot diameter size is K, where the above parameters satisfy the following relation:
D＝Z×tanθ；
D<K。
the implementation of the invention has the following beneficial effects:
the first processing area and the second processing area are arranged on the protective film according to the position of windowing on the circuit board, so that the second processing area is arranged along the periphery of the first processing area, the first processing parameter and the second processing parameter of the laser processing device are respectively arranged according to the first processing area and the second processing area, the laser processing device processes the first processing area row by row according to the first processing parameter, and processes the second processing area along the periphery of the first processing area according to the second processing parameter, thereby realizing windowing processing of the circuit board.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flowchart of a method for opening a protective layer of a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a processing route of a method for windowing a circuit board protective layer according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another processing path of the method for windowing a circuit board protective layer according to an embodiment of the present invention;
FIG. 4 is a diagram showing a processing area of a circuit board protective layer windowing method according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an actual processing effect of the method for windowing a circuit board protective layer according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if a directional indication (such as up, down, left, right, front, and rear … …) is referred to in the embodiment of the present invention, the directional indication is merely used to explain a relative positional relationship, a movement condition, and the like between the components in a specific posture (shown in the drawings), and if the specific posture is changed, the directional indication is correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
According to the embodiment of the invention, different materials are electrified, the laser accurate control energy and the numerical control system are utilized to control the light spot overlapping rate, so that the laser light spot completely spreads over the whole windowing range, and finally, compared with the existing windowing laser processing process of the protective film, the windowing laser processing process of the protective film can be used for greatly improving the line width and line distance of the circuit board and solving the problem of processing the protective film of the high-precision circuit board in the scheme of laminating the protective film on the circuit layer. The following examples are provided to illustrate the invention.
Fig. 1 is a flowchart of an embodiment of a method for opening a protective layer of a circuit board according to the present invention, and referring to fig. 1, the method for opening a protective layer of a circuit board includes the following steps:
s10: the protective film is arranged on the circuit layer of the circuit board and pressed, so that the protective film and the circuit layer are pressed into an integrated structure to form the circuit board.
S20: the first processing area and the second processing area are arranged on the protective film according to the windowing position on the circuit board, and the second processing area is arranged along the periphery of the first processing area, so that the second processing area surrounds the first processing area in the first processing area.
S30: the first processing parameters of the laser processing device are set according to the first processing area, and the second processing parameters of the laser processing device are set according to the second processing area, so that the laser processing device can accurately perform processing operation according to design requirements.
S40: the laser processing apparatus processes the first processing area line by line according to the set first processing parameters, taking the embodiment in fig. 2 as an example, specifically, after the laser processing apparatus processes one line from the first starting side 11 to the first ending side 12 of the first processing area S1, the laser processing apparatus quickly returns to the first starting side 11 from the first ending side 12 in a non-processing state, and then the laser processing apparatus operates until the set processing parameters are reached to process the next line in the first processing area, and the steps are repeated until the first processing area is processed.
It should be noted that, the first start side and the first end side described in the above embodiments are only for illustration, and are not limited in nature.
S50: the laser processing device processes the second processing area S2 circle by circle along the periphery of the first processing area S1 according to the set second processing parameters until the second processing area S2 is processed. The peripheral edge here refers to the peripheral edge, that is, the peripheral edge of the first processing area.
Compared with the existing windowing processing method that the protective film is firstly processed and windowed and then the protective film and the circuit layer are pressed together, the processing parameters of the laser processing device are set according to the difference of material melting points on the circuit board, so that the laser processing device only removes specific materials such as the protective film according to the preset processing parameters, windowing operation of the protective film can be realized under the condition that other parts of the circuit board are not damaged, compared with the former windowing operation, the windowing processing method of the invention firstly presses and windowes, and in the windowing process, the progressive processing area and the progressive processing area are divided, so that the windowing precision of the protective film is improved from hundreds of micrometers to tens of micrometers, the line width and line spacing of the circuit board are greatly improved, and high-precision circuit board processing is realized.
In the practical application scene, in the prior art, the window opening and attaching process is firstly processed on the protective film, the alignment precision error is about 300um, meanwhile, the alignment precision in the flexible circuit board production is determined by multiple factors, the control difficulty is high, the embodiment of the invention aims at the alignment precision problem in the flexible circuit board production process, and the laser processing method for reversely stripping the protective film on the protective film opening process improves the protective film opening precision to 30um level, solves the precision alignment problem in the flexible circuit board production, improves the line width and line distance of the circuit design, and realizes the production and processing of the flexible circuit board with high precision.
Fig. 2 is a schematic diagram of a processing route of a method for windowing a protective layer of a circuit board according to an embodiment of the present invention, referring to fig. 2, when a first processing area S1 and a second processing area S2 are processed, a buffer area 10 is disposed between the first processing area S1 and the second processing area S2, and the buffer area 10 is used for accelerating a laser processing device, so that the laser processing device reaches set processing parameters when moving to a processing position. Specifically, the setting of the buffer zone 10 can accelerate the laser head of the laser processing device from the speed of 0 to the set speed, and the laser processing energy is increased from 0 to the set energy value, so that the laser processing device can reach the set processing parameters when reaching the processing area through the acceleration preparation of the buffer zone 10, and the processing effect of windowing the protective layer is ensured.
The laser processing device processes the first processing area S1, wherein the first processing area S1 comprises a first starting side 11 and a first ending side 12, the laser processing device processes the first processing area line by line at the first starting side, after the nth line is processed, the laser processing device returns to the first starting side 11 from the first ending side 12, moves to the n+1th line from the first starting side and processes until the first processing area is processed, wherein N is a positive integer more than or equal to 1. The laser processing device performs speed and energy accumulation on the first start side 11, and the processing device performs deceleration and energy attenuation on the first end side 12. The buffer area is arranged, so that the laser processing device can reliably reach set processing parameters when entering the set position, and the windowing consistency of the protective film is ensured.
Further, the laser processing device processes the second processing area S2, which includes, the laser processing device processes the second processing area S2 along the periphery of the first processing area S1, and more, the periphery of the first processing area S1 is smoother by performing multiple processes around the periphery of the first processing area S1, so that the windowing quality of the circuit board protective layer is improved.
The laser processing device finishes processing the second processing area S2 around the periphery of the first processing area S1, and the laser processing device processes the second processing area S2 along the periphery of the first processing area S1 according to an annular processing path, or alternatively, the annular processing path can process the second processing area S2 by an annular processing path distributed at equal intervals.
In some embodiments, the processing parameters of the laser processing device include a cutting length L, a cutting width H, a repetition number C, a spot diameter D, a filling pitch Y, a cutting speed V, and a processing time T, which satisfy the following relationship:
the processing time required for processing a single line is:
the time for processing the fixed area is as follows:
in the above embodiment, according to the length L, the cutting width H, the repetition number C, and the spot diameter D of the protective film to be cut, by setting the cutting speed V and the spot overlapping rate β, the required processing time is accurately calculated, so that on one hand, the processing man-hour of the laser processing apparatus is conveniently adjusted, and on the other hand, the numerical value of the processing parameter is conveniently adjusted according to the different usage scenarios to adapt to more processing scenarios, so as to improve the applicability and flexibility of practical application.
In some embodiments, the light output frequency of the laser processing apparatus is f, the processing area is set to be S, and the time T required for processing the area S is:
in this embodiment, the processing time T of the processing area S is adjusted by adjusting the light emitting frequency f, the processing speed V, the spot diameter D, and the repetition number C, so that the time required for completing the processing area with the processing area S can be seen from the above relation, the larger the D value is, the smaller the processing time T is, and since the laser is gaussian light, the size of the spot diameter D is adjusted by the focal offset Z, the spot size of the gaussian light is symmetrical along the focal point, and meanwhile, the removal depth of the single-point spot is determined by the offset of the laser power and the focal offset Z, so that the opening effect of the protective film is further determined.
In some embodiments, spot spacing X, spot overlap ratio β; further, the filling pitch Y in the above implementation can be understood as: the distance between the corresponding adjacent laser spots on the adjacent paths in the walk-through path during the processing of the laser processing device, as shown in fig. 3, further, the above parameters satisfy the following relationship:
if X is more than D, beta is zero, and the more reasonable value range of beta is more than or equal to 50 percent and less than or equal to 90 percent, so that the processing diameter of a laser spot is more than or equal to the distance between adjacent processing paths, the processed part can be completely cut off without residues after the spot is processed by a plurality of processing paths, the distance between the adjacent processing paths is prevented from being more than the processing diameter of the spot, and the part to be processed cannot be effectively cut off, thereby ensuring the reliability of processing quality.
In some embodiments, the processing parameters further include a focal length offset Z, a focusing lens focal length F, an incident beam diameter L, a laser wavelength λ, a divergence angle θ of the focused spot, and a theoretical spot diameter size K, which satisfy the following relationship:
D＝Z×tanθ；
D<K。
in the above embodiment, the method for windowing the circuit board protection layer can reliably implement processing operation on the circuit board protection layer, and ensure the windowing effect of the circuit board protection layer.
Fig. 3 is a schematic diagram of another processing path of the circuit board protective layer windowing method according to an embodiment of the present invention, fig. 4 is a graph of a processing area marking of the circuit board protective layer windowing method of fig. 3, referring to fig. 3 and fig. 4, compared with a circular structure presented by the first processing area S1 and the second processing area S2 in fig. 2, fig. 3 and fig. 4 show that the other first processing area S1 is rectangular, the second processing area S2 is also a schematic diagram of a rectangular structure, the laser processing device in the first starting side, that is, the buffer area 111 accelerates and increases the energy of the laser to a set processing parameter, after finishing the first line, decelerates at the first ending side 112, reduces the laser power, then accelerates and increases the energy of the laser to the set processing parameter from the first ending side 112 to the second starting side 121, after finishing the second line, decelerates at the second ending side 122, reduces the laser power, and processes the adjacent two lines in one processing cycle, so that the first line and the second line are processed in line by line, the first line are processed, and the rest of the first line are processed repeatedly until the first line is processed, and the rest is processed, and the processing effect is equal, and the processing is completed in the first line is completely processed, and the first line is completely processed.
After the first processing area S1 is processed, processing is performed along the periphery of the first processing area S1 from the inner side of the second processing area S2 to the outside in a circle-by-circle manner, specifically, the innermost ring 21 is processed along the annular processing path closest to the first processing area S1 along the periphery of the second processing area S2, the secondary inner ring 22 is processed after the processing of the innermost ring 21 is completed, and the stable and reliable processing of the circuit board protective layer is realized until the processing of the rest of the processing areas of the second processing area is completed in a circle-by-circle manner.
Fig. 5 is a schematic diagram of an actual processing effect of the method for windowing a circuit board protective layer according to an embodiment of the present invention, and referring to fig. 5, the actual processing effect of the circuit board protective layer is complete in windowing form, and the peripheral area is smooth.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. The method for windowing the circuit board protective layer is characterized by comprising the following steps:
arranging a protective film on a circuit layer of a circuit board and pressing;
a first processing area and a second processing area are arranged on the protective film according to the windowing position on the circuit board, and the second processing area is arranged along the periphery of the first processing area;
setting first processing parameters of the laser processing device according to the first processing area, and setting second processing parameters of the laser processing device according to the second processing area;
the laser processing device processes the first processing area line by line according to the first processing parameters;
the laser processing device processes the second processing area along the periphery of the first processing area according to the second processing parameters;
wherein, when processing the first processing zone and the second processing zone, the method further comprises:
and a buffer area is arranged between the first processing area and the second processing area and is used for accelerating the laser processing device, so that the laser processing device reaches set processing parameters when moving to a processing position.
2. The method of windowing a protective layer of a circuit board according to claim 1, wherein the processing of the first processing region by the laser processing device includes:
the first processing area comprises a first starting side and a first ending side, and the laser processing device processes the first processing area line by line at the first starting side;
after the Nth row is processed, the laser processing device returns to the first starting side from the first ending side, and moves to the (n+1) th row from the first starting side for processing until the first processing area is processed.
3. The method of windowing a protective layer of a circuit board according to claim 2, wherein the processing of the second processing region by the laser processing device includes:
the laser processing device processes the second processing area along the periphery of the first processing area.
4. A wiring board protective layer windowing method as in claim 3, wherein the laser processing device is subjected to a plurality of processes around the periphery of the first processing region to finish the processing of the second processing region.
5. The method of windowing a protective layer of a circuit board according to claim 4, wherein the laser processing device surrounds a periphery of the first processing region to finish processing the second processing region, comprising:
the laser processing device processes the second processing area along the periphery of the first processing area according to an annular processing path.
6. The method for opening a protective layer of a circuit board according to claim 1, wherein the processing parameters include: cutting length L, cutting width H, repetition number C, spot diameter D, filling pitch Y, cutting speed V and processing time T, and the parameters meet the following relation:
7. the method for opening a window on a circuit board protective layer according to claim 6, wherein the processing parameters further include a light emitting frequency f, and when the processing area is S, a time T required for processing the area S is:
8. the method for windowing a protective layer of a circuit board according to claim 7, wherein the processing parameters further comprise a light spot distance X and a light spot overlapping rate β, and the light spot overlapping rate β and the light spot distance X satisfy the following relationship:
9. the method for opening a window of a circuit board protective layer according to claim 8, wherein the processing parameters further include a focal length offset Z, a focal length F of a focusing lens, an incident beam diameter L, a laser wavelength λ, a divergence angle θ of a focusing light spot, and a theoretical light spot diameter size K, and the above parameters satisfy the following relation:
D＝Z×tanθ；
D<K。
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| CN101450423B (en) * | 2008-12-24 | 2011-08-03 | 深圳市大族激光科技股份有限公司 | Laser cutting method |
| CN104066275A (en) * | 2013-03-21 | 2014-09-24 | 毅嘉科技股份有限公司 | Opening method for insulation protective layer of circuit board |
| CN205282511U (en) * | 2016-01-13 | 2016-06-01 | 鄂尔多斯市源盛光电有限责任公司 | OLED packaging structure and display device |
| JP6647888B2 (en) * | 2016-01-29 | 2020-02-14 | ビアメカニクス株式会社 | Laser processing method and laser processing apparatus |
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| CN108098138A (en) * | 2017-12-27 | 2018-06-01 | 武汉帝尔激光科技股份有限公司 | A kind of closed loop control method and equipment of laser high-speed processing intermittent line |
| CN108925061A (en) * | 2018-07-31 | 2018-11-30 | 王俊 | A kind of production method of PCB soldermask layer |
| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN112045323A (en) * | 2020-09-15 | 2020-12-08 | 英诺激光科技股份有限公司 | Double-laser-head windowing method and device |
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