CN113725390A - Display substrate, preparation method thereof and display device - Google Patents

Abstract

The embodiment of the invention discloses a display substrate, a preparation method thereof and a display device, relates to the technical field of display, and is used for improving the resolution and yield of the display substrate. The preparation method comprises the following steps: providing a back plate; obtaining a pixel defining layer by utilizing a photoetching process; forming a laminated sacrificial layer and a photoresist layer, wherein the photoresist layer is provided with a plurality of second openings, and the orthographic projection of the first openings on the back plate is within the orthographic projection range of the second openings on the back plate; sequentially forming a light-emitting film, a first functional film and a packaging film on one side of the photoresist layer away from the back plate; and stripping the sacrificial layer, removing the sacrificial layer, the photoresist layer and the parts of the luminescent film, the first functional film and the packaging film, which are positioned on the surface of one side of the photoresist layer far away from the back plate, and reserving the parts of the luminescent film, the first functional film and the packaging film, which are positioned in the second opening. The display substrate, the preparation method thereof and the display device provided by the embodiment of the invention are used for image display.

Description

Display substrate, preparation method thereof and display device

Technical Field

The invention relates to the technical field of display, in particular to a display substrate, a preparation method of the display substrate and a display device.

Background

Organic Light Emitting Diodes (OLEDs) have been widely used in the display field because of their advantages of self-luminescence, low driving voltage, high luminous efficiency, fast response speed, flexible display, etc.

Disclosure of Invention

The embodiment of the invention aims to provide a display substrate, a preparation method thereof and a display device, which are used for improving the resolution and yield of the display substrate.

In order to achieve the above purpose, the embodiment of the present invention provides the following technical solutions:

in one aspect, embodiments of the present invention provide a method for manufacturing a display substrate. The preparation method comprises the following steps: a backing plate is provided. Forming a pixel defining thin film on one side of the backboard, and carrying out patterning treatment on the pixel defining thin film by utilizing a photoetching process to form a plurality of first openings so as to obtain a pixel defining layer. And forming a laminated sacrificial layer and a photoresist layer on one side of the pixel defining layer away from the back plate, wherein the photoresist layer is provided with a plurality of second openings, the orthographic projection of the first opening on the back plate is positioned in the orthographic projection range of the second opening on the back plate, and the orthographic projection of the sacrificial layer on the back plate is coincident with the orthographic projection range of the photoresist layer on the back plate or positioned in the orthographic projection range of the photoresist layer on the back plate. And sequentially forming a light-emitting film, a first functional film and a packaging film on one side of the photoresist layer, which is far away from the back plate. And stripping the sacrificial layer, removing the sacrificial layer, the photoresist layer and the parts of the light-emitting film, the first functional film and the packaging film, which are positioned on the surface of one side of the photoresist layer, which is far away from the back plate, and reserving the parts of the light-emitting film, the first functional film and the packaging film, which are positioned in the second opening.

In the method for manufacturing a display substrate according to some embodiments of the present invention, on one hand, the pixel defining layer having the plurality of first openings is manufactured by a photolithography process, so that the size of the plurality of first openings can be less than 1 μm, and then, when the photoresist layer having the second opening exposing at least the first opening and the sacrificial layer are used to realize a lift-off process, so as to retain the portions of the light emitting film, the first functional film, and the encapsulation film located in the second opening, the size of the light emitting region of the formed OLED can be less than 1 μm. Compared with the size of the light emitting region of the OLED formed by adopting the FMM technology, which is about 12 mu m, the number of the sub-pixels which can be formed in the pixel region with the unit size can be obviously increased, and the PPI of the display substrate is further increased. On the other hand, after the luminescent film and the first functional film are formed, the packaging film made of the inorganic material is formed, so that the luminescent film and the first functional film can be protected, the performance of the luminescent film and the performance of the first functional film are not influenced by other chemicals in the subsequent process, the luminescent film and the first functional film are prevented from losing efficacy, and the yield of the display substrate is improved.

In some embodiments, forming the stacked sacrificial layer and photoresist layer comprises: and sequentially forming a sacrificial film and a photoresist film on one side of the pixel defining layer far away from the back plate. And exposing and developing the photoresist film to form a plurality of second openings to obtain the photoresist layer. And developing the sacrificial film to form the sacrificial layer. And under the condition that the orthographic projection of the sacrificial layer on the back plate is positioned in the orthographic projection range of the photoresist layer on the back plate, the part, close to the plurality of second openings, of the sacrificial layer is retracted relative to the photoresist layer.

In some embodiments, the display substrate has a display area and a peripheral area beside the display area. The display substrate comprises a common voltage signal line positioned in the peripheral area. The part of the first functional film, which is positioned in the second opening, forms a first functional part, and a plurality of first functional parts form a first functional layer; the part of the packaging film, which is positioned in the second opening, forms a packaging part, and the packaging parts form a first packaging layer. The preparation method further comprises the following steps: and removing at least a part of the first packaging layer positioned in the peripheral area, and exposing at least a part of the first functional layer. And forming a second functional layer at least on the peripheral area. The second functional layer is in electrical contact with the common voltage signal line and in electrical contact with the first functional layer.

In some embodiments, the method of making further comprises: forming a second packaging layer on one side of the second functional layer far away from the backboard; the second encapsulation layer covers the second functional layer.

In some embodiments, the second opening includes a pixel region and a wiring region connected. At least a portion of the pixel region is located within the first opening. The routing area extends to the peripheral area. The removing at least the part of the first packaging layer, which is located in the peripheral region, comprises: and removing the part of the first packaging layer positioned in the peripheral area, and exposing a part of the first functional layer. The forming of the second functional layer at least in the peripheral region includes: and forming the second functional layer on the peripheral area. The second functional layer covers a portion of the first functional layer exposed and at least a portion of the common voltage signal line.

In some embodiments, orthographic projections of the wiring areas in the at least two second openings formed at different times on the back plate are partially overlapped.

In some embodiments, the second openings are arranged in an array; the removing at least the portion of the first encapsulation layer located in the peripheral region to expose at least a portion of the first functional layer includes: and removing the whole first packaging layer to expose the first functional layer. The forming of the second functional layer at least in the peripheral region includes: and in the peripheral area and the display area, a second functional layer is formed on one side, away from the backboard, of the first functional layer, and the second functional layer covers the first functional layer and at least one part of the common voltage signal line.

In some embodiments, the first functional layer has a high etch selectivity ratio compared to the first encapsulation layer.

In some embodiments, the display substrate has a plurality of sub-pixels to be formed; the plurality of to-be-formed sub-pixels at least include: the display device comprises a plurality of sub-pixels to be formed in a first color, a plurality of sub-pixels to be formed in a second color and a plurality of sub-pixels to be formed in a third color. The preparation method comprises the following steps: and sequentially preparing the plurality of sub-pixels to be formed in the first color, the plurality of sub-pixels to be formed in the second color and the plurality of sub-pixels to be formed in the third color by adopting the steps and repeating the steps.

In another aspect, an embodiment of the invention provides a display substrate. The display substrate includes: a back plate; a pixel defining layer disposed at one side of the backplane and having a plurality of first openings; the pixel defining layer is formed by a photolithography process; and a light emitting section and a first functional section which are provided at least in the first opening and are stacked in this order; the light emitting section and the first functional section are formed by peeling.

The display substrate has the same beneficial technical effects as the preparation method of the display substrate provided in some embodiments, and details are not repeated herein.

In some embodiments, the display substrate has a display area and a peripheral area beside the display area, the plurality of first functional portions constitute a first functional layer, and the display substrate further includes: a common voltage signal line located in the peripheral region; the second functional layer is arranged on one side, away from the backboard, of the common voltage signal line and the first functional layer and is at least positioned in the peripheral area, wherein the second functional layer is electrically contacted with the common voltage signal line and is electrically contacted with the first functional layer; and an encapsulation layer covering the light emitting section, the first functional section, and the second functional section.

In some embodiments, the first functional portion includes at least a first sub-functional portion located in the first opening, and a second sub-functional portion connected to the first sub-functional portion and extending to the peripheral region. The second functional layer is located in the peripheral region. The encapsulation layer includes a first encapsulation layer and a second encapsulation layer. The first packaging layer covers the part of the first functional layer, which is positioned in the display area, and the second packaging layer covers the part of the second sub-functional part, which extends to the peripheral area, and the second functional layer.

In some embodiments, an orthographic shape of the second sub-functional part on the back plate is L-shaped.

In some embodiments, the common voltage signal lines are respectively located at two opposite sides of the display substrate. At least one second sub-functional portion extends to one of the opposite sides. At least one second sub-functional portion extends toward the other of the opposite sides.

In some embodiments, at least two of the second sub-functional parts are symmetrical with respect to a center line of the display substrate.

In some embodiments, the orthographic projections of at least two of the second sub-functions on the back plate partially overlap.

In some embodiments, the first functional portions are arranged in an array. The second functional layer is located in the display area and the peripheral area. The encapsulation layer covers the second functional layer. The packaging layer is a whole film layer.

In some embodiments, the resolution of the display substrate is greater than 600 PPI.

In another aspect, an embodiment of the present invention provides a display device. The display device comprises the display substrate of any one of the above embodiments.

The array substrate included in the display device has the same structure and beneficial technical effects as those of the array substrate provided in some embodiments, and details are not repeated herein.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in some embodiments of the present invention will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, and the like according to embodiments of the present invention.

FIG. 1 is a flow chart of a method of fabricating a display substrate according to some embodiments of the present invention;

FIG. 2 is a flow chart of another method of fabricating a display substrate according to some embodiments of the present invention;

FIG. 3 is a flowchart of S400 in the flowchart of the method for manufacturing the display substrate shown in FIG. 1;

fig. 4 is a flowchart of S800 and S900 in the flowchart of the method for manufacturing the display substrate shown in fig. 2;

fig. 5 is another flowchart of S800 and S900 in the flowchart of the method of manufacturing the display substrate shown in fig. 2;

FIGS. 6 a-6 s are diagrams illustrating steps in the fabrication of a display substrate according to some embodiments of the present invention;

FIGS. 7 a-7 e are diagrams illustrating steps in another display substrate according to some embodiments of the present invention;

FIGS. 8 a-8 d are diagrams illustrating further steps in the preparation of a display substrate according to some embodiments of the present invention;

FIG. 9 is a block diagram of a display substrate according to some embodiments of the invention;

FIG. 10 is a cross-sectional view of the display substrate shown in FIG. 9 taken along the direction A-A';

FIG. 11 is a block diagram of another display substrate in accordance with some embodiments of the invention;

FIG. 12 is a cross-sectional view of the display substrate shown in FIG. 11 taken along the direction B-B';

fig. 13 is a block diagram of a display device according to some embodiments of the invention.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Throughout the specification and claims, the term "comprising" is to be interpreted in an open, inclusive sense, i.e., as "including, but not limited to," unless the context requires otherwise. In the description herein, the terms "one embodiment," "some embodiments," "an example embodiment," "an example" or "some examples" or the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

Additionally, the use of "based on" means open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values may in practice be based on additional conditions or values beyond those stated.

As used herein, "about" or "approximately" includes the stated values as well as average values within an acceptable deviation range for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

At present, a vapor deposition process is generally adopted to prepare film layers such as a light emitting layer of an OLED. In the process of depositing a film layer such as the light-emitting layer, a Fine Metal Mask (FMM) technique is used. The FMM technology is to punch a thin metal film to form an FMM, align the FMM with an OLED display substrate to be formed, and sequentially evaporate materials of film layers such as a light emitting layer to corresponding positions through holes in the FMM.

Due to the large size of the OLED display substrate and the problems of the FMM technology, such as the stretching, shadowing, and alignment accuracy, the minimum size of the holes of the FMM is about 12 μm, and accordingly, when the FMM technology is applied, the minimum size of the light emitting region of the formed OLED is about 12 μm, which makes it difficult to achieve a high resolution of the sub-Pixels in the OLED display substrate, wherein the limit resolution is about 600PPI (Pixels Per, number of sub-Pixels Per Inch). Due to the limitation of the resolution of the OLED display substrate by the FMM technology, the application range thereof is correspondingly limited.

Based on this, some embodiments of the present invention provide a method for manufacturing a display substrate 100, as shown in fig. 1, the method including: s100 to S600.

S100: as shown in fig. 6a, a back plate 1 is provided.

Illustratively, the backplane 1 includes a substrate, and a pixel circuit layer, a planarization layer, and an anode layer disposed on one side of the substrate.

The structure of the substrate comprises a plurality of structures, and the structures can be selected according to actual needs.

For example, the substrate may be a rigid substrate. The rigid substrate may be, for example, a glass substrate or a PMMA (Polymethyl methacrylate) substrate. In this case, the display substrate 100 may be a rigid display substrate.

As another example, the substrate may be a flexible substrate. The flexible substrate may be, for example, a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate) substrate, or a PI (Polyimide) substrate. In this case, the display substrate 100 may be a flexible display substrate.

Illustratively, the pixel circuit layer may include, for example, a plurality of pixel circuits. Wherein each pixel circuit includes a plurality of thin film transistors. The thin film transistor may include, for example: the semiconductor device comprises an active layer, a grid electrode and a source drain electrode layer which are sequentially stacked, wherein the source drain electrode layer comprises a source electrode and a drain electrode which are arranged on the same layer.

Illustratively, the anode layer includes a plurality of anodes independent of each other, each anode electrically connected to one of the pixel circuits through the planarization layer.

S200: as shown in fig. 6b, a pixel defining thin film is formed on one side of the back plate 1.

For example, in the case where the pixel defining thin film is made of an inorganic material, the pixel defining thin film having a certain thickness may be deposited on one side of the back plate 1 by PVD (Physical Vapor Deposition) or PECVD (Plasma Enhanced Chemical Vapor Deposition).

For example, in the case where the pixel defining thin film is made of an organic material, a coating process may be performed on one side of the rear plate 1 to form a pixel defining thin film having a certain thickness.

Illustratively, the pixel defining film covers the anode layer.

S300: as shown in fig. 6c, the pixel defining thin film is patterned by a photolithography process to form a plurality of first openings G1, resulting in a pixel defining layer 2.

For example, in the case where the pixel defining thin film is made of an inorganic material, the photolithography process may include: coating photoresist on the pixel defining film, then arranging a mask plate on one side of the photoresist far away from the substrate, exposing and developing the photoresist through the mask plate, removing the exposed part in the photoresist, and reserving the unexposed part in the photoresist, thereby forming the patterned photoresist; then, the pixel defining film is etched by using the patterned photoresist as a mask, and a portion of the pixel defining film, which is not covered by the patterned photoresist, is removed to form a plurality of first openings G1, thereby obtaining the pixel defining layer 2. Finally, the array substrate to be formed can be placed into a stripping solution to dissolve and strip the patterned photoresist layer.

For example, in the case where the pixel defining thin film is made of an organic material, the photolithography process may include: a mask is disposed on the side of the pixel defining film away from the back plate 1, the pixel defining film is exposed and developed through the mask, the exposed portion of the pixel defining film is removed, the unexposed portion of the pixel defining film is retained, and a plurality of first openings G1 are formed, so that the pixel defining layer 2 is obtained.

In the photolithography process, the exposure size at the time of exposure may be 1 μm or less, so that the size of the first opening G1 formed by the photolithography process may be 1 μm or less.

It will be understood by those skilled in the art that the light emitting region of the OLED corresponds to the region of the first opening G1 described above. Wherein one first opening G1 may correspond to one anode.

S400: as shown in fig. 6f, a sacrificial layer 3 and a photoresist layer 4 are formed in a stack on the side of the pixel defining layer 2 remote from the backplane 1. The photoresist layer 4 has a plurality of second openings G2, and the orthographic projection of the first opening G1 on the backplate 1 is within the orthographic projection range of the second opening G2 on the backplate 1. The orthographic projection of the sacrificial layer 3 on the back plate 1 is coincident with the orthographic projection range of the photoresist layer 4 on the back plate 1, or is positioned in the orthographic projection range of the photoresist layer 4 on the back plate 1.

The sacrificial layer 3 may be formed of LOR (Lift-off resist) glue, and the LOR glue may be formed of a fluorine-containing resist that does not affect the characteristics of the light-emitting material.

For example, one second opening G2 may correspond to one first opening G1.

The number of the second openings G2 is equal to or less than the number of the first openings G1. In the case that the number of the second openings G2 is less than the number of the first openings G1, the method for manufacturing the display substrate 100 can refer to the following description, and the description thereof is omitted.

By positioning the orthographic projection of the first opening G1 on the backplate 1 within the orthographic projection range of the second opening G2 on the backplate 1, the second opening G2 can at least expose the first opening G1, so that other film layers (such as a light-emitting film) formed in subsequent processes can be ensured to at least cover the first opening G1.

By making the orthographic projection of the sacrificial layer 3 on the back plate 1 coincide with the orthographic projection range of the photoresist layer 4 on the back plate 1, or locating in the orthographic projection range of the photoresist layer 4 on the back plate 1, it can be ensured that no sacrificial layer 3 material is contained in the second opening G2 area, thereby avoiding the sacrificial layer 3 material from affecting the characteristics of other film layers formed subsequently in the second opening G2 area, and ensuring that these film layers have better flatness and structural stability.

In some examples, as shown in fig. 3, S400 includes: s410 to S430.

S410: as shown in fig. 6d, a sacrificial film and a photoresist film are sequentially formed on the side of the pixel defining layer 2 away from the backplate 1.

For example, a sacrificial film and a photoresist film having a certain thickness may be sequentially formed using a coating process. The coating process may include, for example, a coating process, a spot coating process, and the like.

S420: as shown in fig. 6e, the photoresist film is exposed and developed to form a plurality of second openings G2, thereby obtaining the photoresist layer 4.

For the above process, reference may be specifically made to the photolithography process in S300 under the condition that the pixel defining thin film is made of an organic material, and details are not described here.

S430: as shown in fig. 6f, the sacrificial film is developed to form a sacrificial layer 3. In case that the orthographic projection of the sacrificial layer 3 on the back plate 1 is within the orthographic projection range of the photoresist layer 4 on the back plate 1, the portion of the sacrificial layer 3 near the plurality of second openings G2 is indented with respect to the photoresist layer 4.

Illustratively, the sacrificial film can be developed in a developer, wherein the developer is generally matched with the material of the sacrificial film, the sacrificial film can be removed without affecting other film layers, and the removal amount of the sacrificial film can be controlled by controlling the thickness of the sacrificial film and the development time for developing the sacrificial film according to actual needs.

For example, in the case that the material of the sacrificial film is LOR glue, the developing solution is LOR developing solution matched with the LOR glue.

It will be appreciated that the developer first removes the sacrificial film exposed in the area of the second opening G2, and when the sacrificial film exposed in the area of the second opening G2 is removed, the development is stopped, so that the orthographic projection of the sacrificial layer 3 on the backplate 1 coincides with the orthographic projection of the photoresist layer 4 on the backplate 1.

If the developing process is continued, the developing solution starts to remove the sacrificial film on the side of the photoresist layer 4 close to the back plate 1, and by controlling the suitable developing time, the orthographic projection of the sacrificial layer 3 on the back plate 1 can be located within the orthographic projection range of the photoresist layer 4 on the back plate 1, and the portions of the sacrificial layer 3 close to the plurality of second openings G2 are retracted relative to the photoresist layer 4, so as to form a structure similar to a T-shaped pillar. In the case where the thickness of the sacrificial film is fixed, the receding distance increases as the development time is longer, and in the case where the development time is fixed, the receding distance increases as the thickness of the sacrificial film is smaller. The retraction distance can be set according to actual needs.

Under the condition that the orthographic projection of the sacrificial layer 3 on the backboard 1 is within the orthographic projection range of the photoresist layer 4 on the backboard 1, when other film layers are formed in the subsequent process, the film layer in the area of the second opening G2 and the film layer in the area of the second opening G2 can be disconnected, and the film layer in the area of the second opening G2 and the film layer in the area of the second opening G2 can be further ensured to be disconnected by controlling the thickness of the sacrificial film and the developing time to form a proper retraction distance.

S500: as shown in fig. 6g, a light emitting film, a first functional film and an encapsulation film are sequentially formed on the side of the photoresist layer 4 away from the back plate 1.

For example, the light emitting film, the first functional film, and the encapsulation film with a certain thickness may be sequentially formed by evaporation using an OPEN MASK process. Here, as shown in fig. 6G, a portion of the light emitting film, the first functional film, and the encapsulation film located inside the second opening G2 is, for example, disconnected from a portion located outside the second opening G2.

It should be noted that the present invention is only schematically illustrated by sequentially forming three layers, i.e., the light emitting film, the first functional film and the encapsulation film, on the side of the photoresist layer 4 away from the backplane 1, but the number and the types of the layers are not limited, and those skilled in the art may also arrange other layers according to actual needs. For example, a CPL (Capping Layer) film may be formed between the first functional film and the encapsulation film to form a CPL Layer in a subsequent process, so as to improve the light extraction efficiency of the OLED; for another example, at least one of an electron injection film, an electron transport film, and a hole blocking film may be formed between the first functional film and the light emitting film to form at least one of an electron injection layer, an electron transport layer, and a hole blocking layer in a subsequent process, so as to improve the light emitting efficiency of the OLED; for another example, at least one of an electron blocking film, a hole transporting film and a hole injecting film may be formed on a side of the light emitting film close to the backplane 1, so as to form at least one of an electron blocking layer, a hole transporting layer and a hole injecting layer in a subsequent process, thereby improving the light emitting efficiency of the OLED.

S600: as shown in fig. 6h and 6i, the sacrificial layer 3 is stripped, the sacrificial layer 3, the photoresist layer 4, and the portions of the light-emitting film, the first functional film and the encapsulation film on the side surface of the photoresist layer 4 away from the backplane 1 are removed, and the portions of the light-emitting film, the first functional film and the encapsulation film inside the second opening G2 are remained.

For example, a portion of the sacrificial layer 3 on the side close to the pixel defining layer 2 may be dissolved by a developer, so that the remaining portion of the sacrificial layer 3, the photoresist layer 4 and the light emitting film, and a portion of the first functional film and the encapsulation film on the surface of the photoresist layer 4 on the side away from the backplane 1 are separated from the pixel defining layer 2, and then the photoresist layer 4 and a portion of the light emitting film, the first functional film and the encapsulation film on the surface of the photoresist layer 4 on the side away from the backplane 1 are stripped while the remaining sacrificial layer 3 is stripped. After the peeling is completed, the light emitting film, the first functional film, and the portion of the encapsulation film located in the second opening G2 are left.

It should be noted that, since the second openings G2 expose at least the corresponding first openings G1, the remaining portions of the light-emitting film, the first functional film and the encapsulation film, which are located in the second openings G2, can cover at least the first openings G1 after the sacrificial layer 3 is stripped. Since the size of the first opening G1 may be up to 1 μm or less, the size of the light emitting region of the OLED may be 1 μm or less. Therefore, compared with the size of the light emitting region of the OLED formed by using the FMM technology being about 12 μm, the size of the light emitting region of each OLED formed by the technical solution of the present invention can be up to 1 μm or less, so that more OLEDs can be formed (i.e., more sub-pixels can be formed) in a unit size of pixel region, that is, the PPI of the display substrate can be improved.

The materials of the encapsulation film formed in S500 include: and inorganic materials such as silicon oxide, silicon nitride, or silicon oxynitride. By forming the encapsulation film on the side of the light-emitting film and the first functional film away from the back plate 1, the light-emitting film and the first functional film can be protected by the encapsulation film, and the performance of the light-emitting film and the first functional film is not affected by other chemicals in the subsequent process (for example, S600), so that the light-emitting film and the first functional film are prevented from failing, and the yield of the display substrate 100 is improved.

Therefore, in the method for manufacturing the display substrate 100 according to some embodiments of the present invention, on one hand, the pixel defining layer 2 having the plurality of first openings G1 is manufactured through a photolithography process, such that the size of the plurality of first openings G1 can be less than 1 μm, and further, when the photoresist layer having the second opening G2 exposing at least the first opening G1 and the sacrificial layer are used to implement a lift-off process, such that the size of the light emitting region of the formed OLED can be less than 1 μm while the portions of the light emitting film, the first functional film and the encapsulation film located in the second opening G2 are retained. Compared with the size of the light emitting region of the OLED formed by adopting the FMM technology, which is about 12 mu m, the number of the sub-pixels which can be formed in the pixel region with the unit size can be obviously increased, and the PPI of the display substrate is further increased. On the other hand, after the light-emitting film and the first functional film are formed, the encapsulation film made of an inorganic material is formed, so that the light-emitting film and the first functional film can be protected, and the performance of the light-emitting film and the first functional film is not affected by other chemicals in the subsequent process, thereby preventing the light-emitting film and the first functional film from failing and improving the yield of the display substrate 100.

In some examples, the display substrate 100 has a plurality of to-be-formed sub-pixels including at least: the display device comprises a plurality of sub-pixels to be formed in a first color, a plurality of sub-pixels to be formed in a second color and a plurality of sub-pixels to be formed in a third color.

Illustratively, the plurality of to-be-formed sub-pixels include: the display device comprises a plurality of sub-pixels to be formed in a first color, a plurality of sub-pixels to be formed in a second color and a plurality of sub-pixels to be formed in a third color. Wherein the first color, the second color, and the third color are red, green, and blue, respectively.

Illustratively, the plurality of to-be-formed sub-pixels include: the display device comprises a plurality of sub-pixels to be formed in a first color, a plurality of sub-pixels to be formed in a second color, a plurality of sub-pixels to be formed in a third color and a plurality of sub-pixels to be formed in a fourth color. Wherein the first color, the second color, the third color, and the fourth color are red, green, blue, and white, respectively.

Next, a method for manufacturing a display substrate is schematically described by taking as an example that the plurality of to-be-formed sub-pixels include a plurality of first-color to-be-formed sub-pixels, a plurality of second-color to-be-formed sub-pixels, and a plurality of third-color to-be-formed sub-pixels.

Illustratively, the above preparation method further includes S700.

S700: as shown in fig. 6j to 6S, a plurality of first color to-be-formed sub-pixels, a plurality of second color to-be-formed sub-pixels, and a plurality of third color to-be-formed sub-pixels are sequentially prepared by using the above steps S400 to S600 and repeating the above steps S400 to S600.

For example, as shown in fig. 6d to 6i, using the above steps S400 to S600, a plurality of first color to-be-formed sub-pixels may be prepared. In S400, the number of the second openings G2 of the photoresist layer 4 is smaller than the number of the first openings G1 of the pixel defining layer 2. The number of the second openings G2 of the photoresist layer 4 is, for example, one third of the number of the first openings G1 of the pixel defining layer 2.

As shown in fig. 6j to 6n, after the above steps S400 to S600 are repeated for the first time, a plurality of sub-pixels to be formed of the second color may be prepared and formed. In S400 of the first repetition, the number of the second openings G2 of the photoresist layer 4 is smaller than the number of the first openings G1 of the pixel defining layer 2. The number of the second openings G2 of the photoresist layer 4 is, for example, one third of the number of the first openings G1 of the pixel defining layer 2.

After repeating the above steps S400 to S600 for the second time, as shown in fig. 6o to 6S, a plurality of sub-pixels to be formed of the third color may be prepared and formed. In S400 of the second repetition, the number of the second openings G2 of the photoresist layer 4 is smaller than the number of the first openings G1 of the pixel defining layer 2. The number of the second openings G2 of the photoresist layer 4 is, for example, one third of the number of the first openings G1 of the pixel defining layer 2.

It should be noted that, in the case where the plurality of to-be-formed subpixels include subpixels to be formed of more colors, the above steps S400 to S600 may be continuously repeated to prepare to-be-formed subpixels forming a plurality of other colors. At this time, the number of the plurality of second openings G2 provided in the photoresist layer 4 may be selectively set according to actual needs each time the photoresist layer 4 is formed.

It should be understood by those skilled in the art that the layout of the sub-pixels to be formed in a certain color can be completed through the subsequent steps by controlling the opening positions of the plurality of second openings G2 in S400 to make the opening positions of the plurality of second openings G2 correspond to the formation positions of the sub-pixels to be formed in the certain color. Therefore, the method for manufacturing a display substrate according to the embodiments of the present invention does not limit the specific layout manner of the sub-pixels with multiple colors, and those skilled in the art can design the layout manner of the sub-pixels with multiple colors according to actual requirements.

It should be noted that, in each repetition of step S500, an encapsulation film is formed on a side of the light-emitting film and the first functional film away from the back plate 1, so that in the process of repeating steps S400 to S600, the light-emitting film and the first functional film can be protected by the encapsulation film, and the light-emitting film and the first functional film are protected from being corroded by other chemicals, so as to prevent the light-emitting film and the first functional film from failing, and improve the yield of the display substrate 100.

In some examples, as shown in fig. 7a, the display substrate 100 has a display area AA and a peripheral area SS beside the display area AA. The display substrate 100 includes the common voltage signal line 5 in the peripheral region SS. As shown in fig. 6s, the portions of the plurality of first functional films located in the second openings G2 constitute the first functional parts 31, the plurality of first functional parts 31 constitute the first functional layer 6, and the portions of the plurality of encapsulation films located in the second openings G2 constitute the first encapsulation layer 7. As shown in fig. 2, the preparation method further includes: and S800 to S900.

S800: as shown in fig. 7c or fig. 8b, at least a portion of the first encapsulation layer 7 located in the peripheral region SS is removed, and at least a portion of the first functional layer 6 is exposed.

For example, as shown in fig. 7c, only the portion of the first functional layer 6 in the peripheral area SS may be exposed, and at this time, only the portion of the first encapsulation layer 7 in the peripheral area SS may be removed.

Illustratively, as shown in fig. 8b, the whole of the first functional layer 6 may be exposed, and at this time, the whole of the first encapsulation layer 7 may be removed.

For example, the first encapsulation layer 7 may be removed by etching using an etching process.

S900: as shown in fig. 7d or fig. 8c, the second functional layer 8 is formed at least in the peripheral region SS; the second functional layer 8 is in electrical contact with the common voltage signal line 5 and with the first functional layer 6.

For example, a second functional layer may be formed by vapor deposition using a mask in a region corresponding to the exposed portion of the first functional layer 6, and the second functional layer 8 may be brought into electrical contact with the common voltage signal line 5, so that a voltage signal may be transmitted to the second functional layer 8 through the common voltage signal line 5.

The specific structure of the second opening G2 is not limited in the present invention, and can be selectively set according to actual needs.

In some examples, as shown in fig. 7a to 7e, the second opening G2 includes a pixel region M and a routing region N connected, at least a portion of the pixel region M is located in the first opening G1, and the routing region N extends to the peripheral region SS. At this time, the second opening G2 not only exposes the first opening G1, but also exposes a portion of the pixel defining layer 2.

Based on this, as shown in fig. 4, S800 may include S810, and S900 may include S910.

S810: as shown in fig. 7b and 7c, a portion of the first encapsulation layer 7 located in the peripheral region SS is removed, exposing a portion of the first functional layer 6.

Illustratively, the material of the first functional layer 6 includes: indium tin oxide, aluminum, silver, magnesium-silver alloy, aluminum-lithium alloy, and the like.

At this time, a layer of photoresist may be coated on a side of the first encapsulation layer 7 away from the backplane 1, after exposure and development, a portion of the photoresist corresponding to a portion of the first encapsulation layer 7 located in the peripheral region SS is removed to form a patterned photoresist, and then the patterned photoresist is used as a mask to etch the first encapsulation layer 7, so as to remove the portion of the first encapsulation layer 7 located in the peripheral region SS and expose a portion of the first functional layer 6.

It should be noted that, in the process of etching the first encapsulation layer 7, since the portion of the first functional layer 6 located in the peripheral region SS is exposed, the transmittance of the portion of the first functional layer 6 located in the peripheral region SS may be affected by the etching process, but since the etching region is located in the peripheral region SS far away from the display region AA, the decrease in transmittance does not affect the light emitting performance of the display region AA.

S910: as shown in fig. 7d, the second functional layer 8 is formed in the peripheral area SS. The second functional layer 8 covers a part of the exposed first functional layer 6 and at least a part of the common voltage signal line 5.

Illustratively, the second functional layer 8 may be formed using the same materials as the first functional layer 6 described above.

For example, the second functional layer 8 may be formed by evaporation in the peripheral region SS by an OPEN MASK process.

In this example, the first functional layer 6 may serve as a cathode, for example, and the second functional layer 8 may serve as a connecting portion. By covering the exposed portion of the first functional layer 6 and at least a portion of the common voltage signal line 5 with the second functional layer 8, the first functional layer 6 can be brought into electrical contact with the common voltage signal line 5 through the second functional layer 8, so that the common voltage signal can be supplied to the first functional layer 6 sequentially through the common voltage signal line 5 and the second functional layer 8.

The arrangement mode of the routing area N in the second opening G2 is not limited, and may be selected and arranged according to actual needs.

Illustratively, the orthographic projection of the routing area N in the second openings G2 on the backboard 1 is L-shaped.

For example, orthographic projections of the routing areas N in the plurality of second openings G2 on the backboard 1 do not overlap.

For example, orthographic projections of the routing areas N in the at least two second openings G2 formed at different times on the backboard 1 partially overlap. Thus, the film layers formed in the wiring region N subsequently can be mutually covered to save space.

It should be noted that the at least two second openings G2 formed at different times means that the at least two second openings G2 formed in step S400 are differently repeated in the case that the number of the second openings G2 is smaller than the number of the first openings G1.

It should be further noted that the film layer subsequently formed in the second opening G2 may include a plurality of stacked film layers, and the orthographic projection shapes of the plurality of film layers on the back plate 1 may be the same, for example.

It should be noted that the routing areas N in the different second openings G2 may partially cover each other, but need to be separated at a position close to the common voltage signal lines 5 located in the peripheral area SS, that is, at a position close to the common voltage signal lines 5 located in the peripheral area SS, orthographic projections of the routing areas N in the different second openings G2 on the backplane 1 do not overlap, so that it is ensured that the first functional layers 6 formed in the different second openings G2 can all form electrical contact with the common voltage signal lines 5 located in the peripheral area SS in the subsequent process.

In some examples, as shown in fig. 8a, the second openings G2 are arranged in an array, and in this case, the second opening G2 is shaped like a block, for example, to expose the first opening G1 and a portion of the pixel defining layer 2 around the first opening G1.

Based on this, as shown in fig. 5, the above S800 may include S810 ', and S900 may include S910'.

S810': as shown in fig. 8b, the first encapsulating layer 7 is entirely removed, exposing the first functional layer 6.

Illustratively, the first functional layer 6 may act as an etch stop layer, and the first functional layer 6 has a high etch selectivity compared to the first encapsulation layer 7.

For example, when the material of the first sealing layer 7 is an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride, the material of the first functional layer 6 may be Indium Tin Oxide (ITO), for example.

For example, an etching process may be used to etch away the entirety of the first encapsulation layer 7 and expose the entirety of the first functional layer 6.

It should be noted that, in the process of etching the whole first encapsulation layer 7, since the first functional layer 6 has a higher etching selectivity than the first encapsulation layer 7, the first encapsulation layer 7 can be etched while the first functional layer 6 is prevented from being etched, and then the first functional layer 6 can be used to protect the light emitting part 31 located on one side of the first functional layer 6 close to the backplane 1 from being etched, so as to ensure that the performance of the light emitting part 31 is not damaged, and thus the yield of the display substrate 100 is improved.

S910': as shown in fig. 8c, in the peripheral area SS and the display area AA, the second functional layer 8 is formed on the side of the first functional layer 6 away from the backsheet 1. The second functional layer 8 covers at least a part of the common voltage signal line 5.

Exemplary materials for the second functional layer 8 include: indium Tin Oxide (ITO), aluminum, silver, magnesium-silver alloy, aluminum-lithium alloy, and the like.

For example, the second functional layer 8 may be formed by vapor deposition on the entire surface of the first functional layer 6 remote from the backsheet 1.

The second functional layer 8 may serve as a cathode, and the second functional layer 8 and the common voltage signal line 5 are brought into electrical contact by covering at least a part of the common voltage signal line 5 with the second functional layer 8, so that the second functional layer 8 can be supplied with a common voltage signal through the common voltage signal line 5.

In the case that the first functional layer 6 is made of a transparent and conductive material (e.g., ITO), the etching stopper layer can serve as an electron transport layer to transport electrons, thereby improving the light emitting efficiency of the OLED.

It should be noted that, after step S900, the preparation of the cathode is completed. In this case, the anode, the light emitting portion 31, and the cathode may constitute, for example, a light emitting device.

In some examples, as shown in fig. 2, the above preparation method further includes step S1000.

S1000: as shown in fig. 7e or fig. 8d, a second encapsulating layer 9 is formed on the side of the second functional layer 8 away from the backsheet 1, and the second encapsulating layer 9 covers the second functional layer 8.

For example, as shown in fig. 7e, in the case that S800 includes S810, and S900 includes S910, by forming the second encapsulating layer 9 on the side of the second functional layer 8 away from the backsheet 1, it is possible to prevent water and/or oxygen from attacking the second functional layer 8 and further attacking the first functional layer 6 electrically contacting with the second functional layer 8, so as to disable the light emitting device.

For example, as shown in fig. 8d, in the case that S800 includes S810 ', and S900 includes S910', by forming the second encapsulation layer 9 on the side of the second functional layer 8 away from the backsheet 1, it is possible to prevent water and/or oxygen from attacking the second functional layer 8, and thus the light emitting device is disabled.

Some embodiments of the present invention provide a display substrate 100, as shown in fig. 9 or 11, the display substrate 100 includes: a back plate 1; a pixel defining layer 2 disposed at one side of the backplate 1 and having a plurality of first openings G1, wherein the pixel defining layer 2 is formed through a photolithography process; and a light emitting part 21 and a first functional part 31 which are provided at least in the first opening G1 and are stacked in this order, the light emitting part 21 and the first functional part 31 being formed by being peeled off.

In some examples, the structure of the back plate 1 may adopt the structure mentioned in the above embodiments, and is not described herein again.

For example, the light emitting part 21 and the first functional part 31 may be both located in the first opening G1, or may be partially overlapped on a side of the pixel defining layer 2 away from the backplane 1.

The display substrate 100 has the same advantages as the preparation method of the display substrate 100 described in some embodiments, and the description thereof is omitted.

In some examples, as shown in fig. 9 to 12, the display substrate 100 has a display area AA and a peripheral area SS beside the display area AA. The plurality of first functional portions 31 constitute the first functional layer 6. The display substrate 100 further includes a common voltage signal line 5 located in the peripheral region SS, and a second functional layer 8 disposed on the common voltage signal line 5 and the first functional layer 6 away from the backplane and located at least in the peripheral region SS; and an encapsulating layer 30 covering the light emitting section 21, the first functional section 31, and the second functional layer 8. Wherein the second functional layer 8 is in electrical contact with the common voltage signal line 5 and with the first functional layer 6.

The shape of the display area AA may include various shapes, which are not limited in the present invention, and may be set according to actual needs. Illustratively, the shape of the display area AA may be any one of an ellipse, a trapezoid, and a rectangle.

The position relationship between the peripheral area SS and the display area AA is not exclusive, and for example, the peripheral area SS may be located on one side of the display area AA, on two sides of the display area AA, on three sides of the display area AA, or around the display area AA.

As shown in fig. 9 and 11, the structure of the display substrate 100 is schematically illustrated in the present invention by taking an example in which the display area AA is rectangular and the peripheral area SS surrounds the display area AA.

The number of the common voltage signal lines 5 is not limited, and the common voltage signal lines can be selectively arranged according to actual needs. For example, the number of the common voltage signal lines 5 may be one or two.

The shape and arrangement mode of the common voltage signal line 5 are not limited, and the common voltage signal line can be selectively arranged according to actual needs.

Illustratively, in the case where the number of the common voltage signal lines 5 is one, the shape of the common voltage signal lines 5 may be, for example, a bar shape or a C-shape. In the case where the common voltage signal lines 5 have a bar shape, one common voltage signal line 5 may be distributed on any one side of the display substrate 100. In the case where the common voltage signal lines 5 have a C-shape, one common voltage signal line 5 may surround a portion of the display area AA, and an opening direction thereof may be directed toward any one side of the display substrate 100.

For example, in the case that the number of the common voltage signal lines 5 is two, the shape of the common voltage signal lines 5 may be a bar shape, for example, and in this case, the two common voltage signal lines 5 may be distributed on two opposite sides of the display substrate 100, or the two common voltage signal lines 5 may be distributed on the same side of the display substrate 100, for example.

Based on the above structure, the first functional layer 6 can be electrically contacted with the common voltage signal line 5 through the second functional layer 8, so that the common voltage signal can be transmitted sequentially through the common voltage signal line 5, the second functional layer 8 and the first functional layer 6. Furthermore, by covering the second functional layer 8 with the encapsulating layer 30, water and/or oxygen is prevented from attacking the second functional layer 8 and thus the first functional layer 6 which is in electrical contact with the second functional layer 8.

The shape of the first functional layer 6 is not limited in the present invention, and can be selected and set according to actual needs.

In one example, as shown in fig. 11 and 12, the plurality of first functional portions 31 are arranged in an array, the second functional layer 8 is located in the display area AA and the peripheral area SS, the encapsulation layer 30 covers the second functional layer 8, and the encapsulation layer 30 is a whole film layer.

Illustratively, the first functional portions 31 are, for example, block-shaped and are provided independently of each other.

Illustratively, the first functional layer 6 may serve as an electron input layer and the second functional layer 8 may serve as a cathode. At this time, the cathode is located in the display area AA and the peripheral area SS, a portion of the cathode located in the display area AA may directly cover the plurality of first functional portions included in the first functional layer 6 and directly make electrical contact with the plurality of first functional portions, and a portion of the cathode located in the peripheral area SS may directly make electrical contact with the common voltage signal line 5 located in the peripheral area SS.

By having the encapsulation layer 30 cover the second functional layer 8, water and/or oxygen can be prevented from attacking the second functional layer 8, rendering the OLED useless.

In another example, as shown in fig. 9 and 10, the first functional portion 31 includes a first sub-functional portion 311 at least located in the first opening G1, and a second sub-functional portion 312 connected to the first sub-functional portion 311 and extending to the peripheral region SS. The second functional layer 8 is located in the peripheral region SS. The encapsulation layer 30 includes a first encapsulation layer 7 and a second encapsulation layer 9, the first encapsulation layer 7 covers a portion of the first functional layer 6 located in the display area AA, and the second encapsulation layer 9 covers a portion of the second sub-functional portion 312 extending to the peripheral area SS and the second functional layer 8.

The manner of extending the second sub-functional portion 312 to the peripheral region SS is not limited in the present invention, and may be selectively set according to actual requirements.

Illustratively, the orthographic projection shape of the second sub-functional part 312 on the backboard 1 is linear and extends to the peripheral area SS in the linear direction.

Illustratively, the orthographic projection shape of the second sub-functional part 312 on the back panel 1 is L-shaped and extends to the peripheral area SS in the direction of a fold line.

In this case, the present invention does not limit the specific direction of the fold line, and the fold line can be selectively set according to actual needs. As shown in fig. 9, the extending direction of the common voltage signal line 5 is the second direction Y, and the direction perpendicular to the extending direction of the common voltage signal line 5 is the first direction X. For example, the direction of the broken line may be: firstly along the positive direction of the second direction Y and then along the positive direction of the first direction X; or, firstly along the reverse direction of the second direction Y, and then along the positive direction of the first direction X; or, firstly along the positive direction of the second direction Y, and then along the negative direction of the first direction X; alternatively, the first direction Y is opposite to the second direction Y, and then the second direction X is opposite to the first direction X.

Illustratively, the first functional layer 6 may serve as a cathode and the second functional layer 8 may serve as a junction. At this time, the first functional layer 6 may make electrical contact with the common voltage signal line 5 located in the peripheral region SS through the second functional layer 8.

For example, the second functional layer 8 may be located on a side of the first encapsulation layer 8 away from the backsheet 1, and the second encapsulation layer 9 is located on a side of the second functional layer 8 away from the backsheet 1.

Through the cooperation of the first packaging layer 7 and the second packaging layer 9, the first functional layer 6 and the second functional layer 8 can be completely packaged, so that the second functional layer 8 can be prevented from being corroded by water and/or oxygen, the first functional layer 6 in electrical contact with the second functional layer 8 is corroded, and the light-emitting device fails.

The following description is schematically made by taking an example in which the number of the common voltage signal lines 5 is two, the common voltage signal lines are rectangular, and are distributed on two opposite sides of the display substrate 100, and the orthographic projection shape of the second sub-functional section 312 on the rear plate 1 is L-shaped.

Illustratively, the orthographic projections of at least two second sub-functions 312 on the backboard 1 partially overlap. For the related description herein, reference may be made to the above related description of overlapping of orthographic projections of the routing areas N on the back plate 1 in the at least two second openings G2 formed at different times, and details are not repeated herein.

Illustratively, the common voltage signal lines 5 are respectively located at opposite sides of the display substrate 100. Wherein the at least one second sub-functional portion 312 extends to one of the two opposing sides, and the at least one second sub-functional portion 312 extends to the other of the two opposing sides.

Illustratively, one second sub-function portion 312 extends to one of the opposite sides or a plurality of second sub-function portions 312 extends to one of the opposite sides.

Illustratively, one second sub-function portion 312 extends toward the other of the two opposing sides or a plurality of second sub-function portions 312 extends toward the other of the two opposing sides.

By arranging the common voltage signal lines 5 on the two opposite sides of the display substrate 100, one end of the second sub-function portion 312 can follow the principle of nearby wiring in the process of extending to the peripheral region SS, so that the wiring can be saved, and the distribution of the wiring is facilitated.

Illustratively, as shown in fig. 9, the at least two second sub-functional portions 312 are symmetrical with respect to the center line L of the display substrate 100.

Illustratively, the two second sub-functional portions 312 are symmetrical with respect to the center line L of the display substrate 100.

Illustratively, the plurality of second sub-functional portions 312 are symmetrical with respect to the center line L of the display substrate 100.

As shown in fig. 9, the central line is, for example, a straight line passing through the midpoint of the display substrate 100 and parallel to the second direction Y.

Therefore, the layout of the traces on the display substrate 100 is simple, the process is simplified, and the yield of the display substrate is improved.

In some examples, the resolution of the display substrate 100 is greater than 600 PPI.

For example, the resolution of the display substrate 100 may be 600PPI, 800PPI, 1000PPI, 2000PPI, 3000PPI, or the like.

In some embodiments, a display device 1000 is provided, the display device 1000 comprising the display substrate 100 according to any of the above embodiments.

The display substrate 100 included in the display device 1000 has the same structure and advantages as the display substrate 100 provided in some embodiments, and since the structure and advantages of the display substrate 100 have been described in detail in some embodiments, no further description is provided herein.

In some examples, as shown in fig. 13, display device 1000 may be any device that displays text or images, whether in motion (e.g., video) or stationary (e.g., still images). More particularly, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, Personal Digital Assistants (PDAs), hand-held or portable computers, Global Positioning System (GPS) receivers/navigators, cameras, motion Picture Experts Group (MP 4) video players, video cameras, game consoles, wrist watches, clocks, calculators, television monitors, computer monitors, automobile displays (e.g., odometer display, etc.), navigators, cockpit controls and/or displays, displays of camera views (e.g., displays of rear view cameras in vehicles), electronic photographs, electronic billboards or signs, video game consoles, and the like, Projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images for a piece of jewelry), and the like.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art will appreciate that changes or substitutions within the technical scope of the present disclosure are included in the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (19)

1. A preparation method of a display substrate is characterized by comprising the following steps:

providing a back plate;

forming a pixel defining thin film on one side of the back plate;

patterning the pixel defining film by utilizing a photoetching process to form a plurality of first openings so as to obtain a pixel defining layer;

forming a sacrificial layer and a photoresist layer stacked on one side of the pixel defining layer away from the back plate; wherein the photoresist layer is provided with a plurality of second openings, and the orthographic projection of the first openings on the back plate is positioned in the orthographic projection range of the second openings on the back plate; the orthographic projection of the sacrificial layer on the back plate is coincident with the orthographic projection range of the photoresist layer on the back plate, or is positioned in the orthographic projection range of the photoresist layer on the back plate;

sequentially forming a light-emitting film, a first functional film and a packaging film on one side of the photoresist layer, which is far away from the backboard;

and stripping the sacrificial layer, removing the sacrificial layer, the photoresist layer and the parts of the light-emitting film, the first functional film and the packaging film, which are positioned on the surface of one side of the photoresist layer, which is far away from the back plate, and reserving the parts of the light-emitting film, the first functional film and the packaging film, which are positioned in the second opening.

2. The method of claim 1, wherein forming the stacked sacrificial layer and photoresist layer comprises:

sequentially forming a sacrificial film and a photoresist film on one side of the pixel defining layer away from the back plate;

exposing and developing the photoresist film to form a plurality of second openings to obtain the photoresist layer;

developing the sacrificial film to form the sacrificial layer; and under the condition that the orthographic projection of the sacrificial layer on the back plate is positioned in the orthographic projection range of the photoresist layer on the back plate, the part, close to the plurality of second openings, of the sacrificial layer is retracted relative to the photoresist layer.

3. The method according to claim 1, wherein the display substrate has a display region and a peripheral region beside the display region; the display substrate comprises a common voltage signal line positioned in the peripheral area;

the part of the first functional film, which is positioned in the second opening, forms a first functional part, and a plurality of first functional parts form a first functional layer; the part of the packaging film, which is positioned in the second opening, forms a packaging part, and a plurality of packaging parts form a first packaging layer;

the preparation method further comprises the following steps:

removing at least a part of the first packaging layer positioned in the peripheral area, and exposing at least a part of the first functional layer;

forming a second functional layer at least in the peripheral region; the second functional layer is in electrical contact with the common voltage signal line and in electrical contact with the first functional layer.

4. The method of manufacturing according to claim 3, further comprising:

forming a second packaging layer on one side of the second functional layer far away from the backboard; the second encapsulation layer covers the second functional layer.

5. The manufacturing method according to any one of claims 1 to 4, wherein the second opening includes a pixel region and a wiring region which are connected; at least a portion of the pixel region is located within the first opening; the wiring area extends to the peripheral area;

the removing at least the part of the first packaging layer, which is located in the peripheral region, comprises:

removing a part of the first packaging layer, which is positioned in the peripheral area, and exposing a part of the first functional layer;

the forming of the second functional layer at least in the peripheral region includes:

forming the second functional layer on the peripheral area; the second functional layer covers a portion of the first functional layer exposed and at least a portion of the common voltage signal line.

6. The manufacturing method according to claim 5, wherein orthographic projections of the wiring areas in the at least two second openings formed at different times on the back plate partially overlap.

7. The method according to any one of claims 1 to 4, wherein the second openings are arranged in an array;

the removing at least the portion of the first encapsulation layer located in the peripheral region to expose at least a portion of the first functional layer includes:

removing the whole first packaging layer to expose the first functional layer;

the forming of the second functional layer at least in the peripheral region includes:

forming a second functional layer on one side, away from the back plate, of the first functional layer in the peripheral area and the display area; the second functional layer covers the first functional layer and at least a part of the common voltage signal line.

8. The method according to claim 7, wherein the first functional layer has a higher etching selectivity than the first encapsulation layer.

9. The manufacturing method according to claim 1, wherein the display substrate has a plurality of sub-pixels to be formed; the plurality of to-be-formed sub-pixels at least include: the display device comprises a plurality of sub-pixels to be formed in a first color, a plurality of sub-pixels to be formed in a second color and a plurality of sub-pixels to be formed in a third color;

the preparation method comprises the following steps: and sequentially preparing the plurality of sub-pixels to be formed in the first color, the plurality of sub-pixels to be formed in the second color and the plurality of sub-pixels to be formed in the third color by adopting the steps and repeating the steps.

10. A display substrate, comprising:

a back plate;

a pixel defining layer disposed at one side of the backplane and having a plurality of first openings; the pixel defining layer is formed by a photolithography process; and the number of the first and second groups,

a light emitting section and a first functional section which are provided at least in the first opening and are stacked in this order; the light emitting section and the first functional section are formed by peeling.

11. The display substrate according to claim 10, wherein the display substrate has a display area and a peripheral area beside the display area;

the plurality of first functional portions constitute a first functional layer;

the display substrate further includes:

a common voltage signal line located in the peripheral region;

the second functional layer is arranged on one side, away from the backboard, of the common voltage signal line and the first functional layer and is at least positioned in the peripheral area; the second functional layer is in electrical contact with the common voltage signal line and in electrical contact with the first functional layer; and the number of the first and second groups,

and an encapsulation layer covering the light emitting section, the first functional section, and the second functional section.

12. The display substrate according to claim 11, wherein the first functional portion comprises at least a first sub-functional portion located in the first opening and a second sub-functional portion connected to the first sub-functional portion and extending to the peripheral region;

the second functional layer is positioned in the peripheral area;

the packaging layer comprises a first packaging layer and a second packaging layer; the first packaging layer covers the part of the first functional layer, which is positioned in the display area, and the second packaging layer covers the part of the second sub-functional part, which extends to the peripheral area, and the second functional layer.

13. The display substrate according to claim 12, wherein an orthographic shape of the second sub-function portion on the rear plate is L-shaped.

14. The display substrate according to claim 12, wherein the common voltage signal lines are respectively located at opposite sides of the display substrate;

at least one second sub-functional portion extending to one of the opposite sides;

at least one second sub-functional portion extends toward the other of the opposite sides.

15. The display substrate of claim 14, wherein at least two of the second sub-functional portions are symmetrical about a center line of the display substrate.

16. The display substrate of claim 12, wherein orthographic projections of at least two of the second sub-functional parts on the back plate partially overlap.

17. The display substrate according to claim 11, wherein the first functional portions are arranged in an array;

the second functional layer is positioned in the display area and the peripheral area;

the packaging layer is a whole film layer.

18. The display substrate of claim 10, wherein the display substrate has a resolution greater than 600 PPI.

19. A display device, characterized in that the display device comprises: a display substrate according to any one of claims 10 to 18.

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