CN113707042A - Light-emitting module, display screen and display - Google Patents

Light-emitting module, display screen and display Download PDF

Info

Publication number
CN113707042A
CN113707042A CN202010440096.9A CN202010440096A CN113707042A CN 113707042 A CN113707042 A CN 113707042A CN 202010440096 A CN202010440096 A CN 202010440096A CN 113707042 A CN113707042 A CN 113707042A
Authority
CN
China
Prior art keywords
light
layer
backlight
pixel
optical isolation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010440096.9A
Other languages
Chinese (zh)
Inventor
顾铁成
刁鸿浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vision Technology Venture Capital Pte Ltd
Beijing Ivisual 3D Technology Co Ltd
Original Assignee
Vision Technology Venture Capital Pte Ltd
Beijing Ivisual 3D Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vision Technology Venture Capital Pte Ltd, Beijing Ivisual 3D Technology Co Ltd filed Critical Vision Technology Venture Capital Pte Ltd
Priority to CN202010440096.9A priority Critical patent/CN113707042A/en
Priority to PCT/CN2021/090661 priority patent/WO2021233104A1/en
Priority to TW110118237A priority patent/TWI776517B/en
Publication of CN113707042A publication Critical patent/CN113707042A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Electroluminescent Light Sources (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

The application relates to the technical field of display, and discloses a light-emitting module, include: a light emitting cell layer including a plurality of light emitting cells; the backlight isolation layer is arranged on the backlight surface of the light emitting unit layer; a light conversion layer including a plurality of pixel units; the light-emitting unit optical isolation structure is arranged between every two adjacent light-emitting units in part or all of the plurality of light-emitting units; in part or all of the plurality of pixel units, a pixel light isolation structure is arranged between two adjacent pixel units. The application discloses light emitting module, through the isolation layer in a poor light, luminescence unit optical isolation structure and the pixel optical isolation structure that set up, the light that avoids luminescence unit and light conversion layer to send as far as possible conducts to undesired direction, is favorable to improving display effect. The application also discloses a display module assembly, a display screen and a display.

Description

Light-emitting module, display screen and display
Technical Field
The application relates to the technical field of display, for example, relate to a luminous module, display module assembly, display screen and display.
Background
In the display field, light emitting units and light conversion layers are commonly used at present to support display.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
some of the light emitted from the light emitting unit and the light conversion layer may be conducted in an undesired direction, and the light conducted in the undesired direction may affect the display effect.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a light-emitting module, a display screen and a display, which are used for solving the technical problem that the display effect is influenced because part of light emitted by a light-emitting unit and a light conversion layer is conducted to an undesirable direction.
The luminous module that this disclosed embodiment provided includes:
a light emitting cell layer including a plurality of light emitting cells;
the backlight isolation layer is arranged on the backlight surface of the light emitting unit layer;
a light conversion layer including a plurality of pixel units;
the light-emitting unit optical isolation structure is arranged between every two adjacent light-emitting units in part or all of the plurality of light-emitting units; in part or all of the plurality of pixel units, a pixel light isolation structure is arranged between two adjacent pixel units.
In some embodiments, the backlight isolation layer may include at least one of a backlight Distributed Bragg Reflector (DBR) reflective layer, a backlight metallic reflective layer, and a backlight absorption layer.
In some embodiments, the backlight spacer layer may include at least one backlight DBR reflective layer. Optionally, the backlight isolation layer may include at least one backlight metal reflective layer. Alternatively, the backlight isolation layer may include at least one backlight absorption layer. Alternatively, the backlight spacer layer may include at least one backlight DBR reflective layer, and at least one backlight metal reflective layer. Alternatively, the backlight spacer layer may include at least one backlight DBR reflective layer and at least one backlight DBR reflective layer. Alternatively, the backlight isolation layer may include at least one backlight metal reflective layer and at least one backlight light absorbing layer. Alternatively, the backlight spacer layer may include at least one backlight DBR reflective layer, at least one backlight metallic reflective layer, and at least one backlight light absorbing layer.
In some embodiments, conductive holes supporting the light emitting cell layers to realize electrical connection may be disposed in the backlight isolation layer.
In some embodiments, the conductive via may be filled with a conductive material, the backlight isolation layer may include at least one of at least one backlight DBR reflective layer and at least one backlight DBR reflective layer, and at least one of the at least one backlight DBR reflective layer and the at least one backlight DBR reflective layer may be in direct contact with the conductive material.
In some embodiments, the conductive hole may be filled with a conductive material, the backlight isolation layer may include at least one backlight metal reflective layer, and an insulating portion may be disposed between the at least one backlight metal reflective layer and the conductive material.
In some embodiments, some or all of the area in the insulator may be provided with an optical isolation material.
In some embodiments, the side of the backlight isolation layer away from the light emitting cell layer may be provided with an electrical connection layer.
In some embodiments, the light emitting cell layer and the electrical connection layer may be electrically connected through the conductive via.
In some embodiments, the backlight isolation layer may include at least one backlight metal reflective layer, and the at least one backlight metal reflective layer may be provided with an insulating layer insulated from the electrical connection layer and the light emitting cell layer.
In some embodiments, the insulating layer may include at least one of:
the first insulating layer is arranged between the backlight metal reflecting layer and the electric connecting layer;
and the second insulating layer is arranged between the backlight metal reflecting layer and the light emitting unit layer.
In some embodiments, a portion or all of the area of at least one of the first and second insulating layers may be provided with an optical isolation material.
In some embodiments, the backlight isolation layer may be directly disposed on the backlight surface of the light emitting cell layer.
In some embodiments, the backlight isolation layer may be attached to a backlight surface of the light emitting cell layer.
In some embodiments, the backlight isolation layer may be disposed on a part or all of the backlight surface of the light emitting cell layer.
In some embodiments, the backlight isolation layer may be disposed in a light-transmitting region of a backlight surface of the light emitting cell layer.
In some embodiments, the light emitting cell optical isolation structure may be disposed at a partial or entire region between adjacent two light emitting cells.
In some embodiments, a light emitting unit interval region may exist between adjacent two light emitting units, and a light emitting unit optical isolation structure may be disposed in a part or all of the light emitting unit interval region.
In some embodiments, the two adjacent light emitting units may include a first light emitting unit, a second light emitting unit, the first light emitting unit may include a first side adjacent to the second light emitting unit, and the second light emitting unit may include a second side adjacent to the first light emitting unit. Alternatively, the light emitting unit optical isolation structure may be disposed on at least one of the first and second faces, or not in contact with the first and second faces.
In some embodiments, the light emitting cell optical isolation structure may be disposed in the light transmissive region of at least one of the first and second faces.
In some embodiments, the light emitting cell optical isolation structure may be in direct contact with the backlight isolation layer, or a gap may exist between the light emitting cell optical isolation structure and the backlight isolation layer.
In some embodiments, the light emitting unit optical isolation structure may include a light emitting unit optical isolation body.
In some embodiments, the light emitting unit optical isolation body may be non-conductive and comprise an optical isolation material.
In some embodiments, the light emitting unit optical isolation body can be electrically conductive. Optionally, the light emitting unit optical isolation structure may further include: the insulation structure sets up in the luminescence unit light isolation main part and needs to insulate between the luminescence unit of luminescence unit light isolation main part.
In some embodiments, an insulating structure may be disposed between the light emitting unit optical isolation body and at least one of the adjacent two light emitting units.
In some embodiments, the insulating structure may cover part or all of the light-emitting unit optical isolation body.
In some embodiments, at least one of the light emitting unit optical isolation body and the insulating structure may include an optical isolation material.
In some embodiments, the insulating structure may contact at least one of the adjacent two light emitting cells. Alternatively, the insulating structure may not contact with the adjacent two light emitting cells.
In some embodiments, some or all of the cross-sectional shape of the light emitting cell optical isolation structure in the light exit direction of the light emitting cell layer may include at least one of a rectangular quadrilateral, a triangle, and a trapezoid.
In some embodiments, a cross-sectional shape of the light emitting cell optical isolation structure in a light exit direction of the light emitting cell layer may include a trapezoid, and an upper base of the trapezoid may face a light exit side of the light emitting cell layer.
In some embodiments, the pixel optical isolation structure may be disposed in a portion or all of a region between two adjacent pixel cells.
In some embodiments, a pixel isolation region may exist between two adjacent pixel units, and a pixel optical isolation structure may be disposed in part or all of the pixel isolation region.
In some embodiments, the two adjacent pixel units may include a first pixel unit and a second pixel unit, the first pixel unit may include a first side adjacent to the second pixel unit, and the second pixel unit may include a second side adjacent to the first pixel unit. Alternatively, the pixel optical isolation structure may be disposed on at least one of the first and second faces, or not in contact with the first and second faces.
In some embodiments, the pixel optical isolation structure can be disposed in the optically transmissive region of at least one of the first and second faces.
In some embodiments, the pixel optical isolation structure can be a single unitary closed structure.
In some embodiments, the pixel optical isolation structure and the light-emitting element optical isolation structure may be integrally formed, or separate from each other.
In some embodiments, the pixel optical isolation structure and the light-emitting element optical isolation structure may be independent of each other. Alternatively, the pixel optical isolation structure and the light emitting cell layer may be in direct contact.
In some embodiments, the pixel optical isolation structure may be in direct contact with the light-emitting element optical isolation structure, or a gap may exist between the pixel optical isolation structure and the light-emitting element optical isolation structure.
In some embodiments, the first contact surface of the pixel optical isolation structure may be in direct contact with the second contact surface of the light-emitting unit optical isolation structure. Alternatively, the area of the first contact surface and the area of the second contact surface may be the same or different.
In some embodiments, the first contact surface of the pixel optical isolation structure and the second contact surface of the light emitting cell optical isolation structure may be in direct contact. Alternatively, the first contact surface and the second contact surface may or may not coincide.
In some embodiments, the pixel optical isolation structure can include a pixel optical isolation body.
In some embodiments, the pixel optical isolation body can include an optical isolation material.
In some embodiments, the pixel optical isolation structure may further comprise: and the spacing structure is arranged between the pixel optical isolation main body and the pixel unit needing optical isolation.
In some embodiments, a spacer structure may be disposed between the pixel optical isolation body and at least one of the two adjacent pixel cells.
In some embodiments, the spacer structure can cover part or all of the pixel optical isolation body.
In some embodiments, at least one of the pixel optically isolating body and the spacer structure can include an optically isolating material.
In some embodiments, the optical isolation material may include at least one of a light absorbing material, a light reflecting material.
In some embodiments, some or all of the cross-sectional shape of the pixel optical isolation structure in the light-in direction of the light conversion layer may include at least one of a right-angled quadrilateral, a triangle, and a trapezoid.
In some embodiments, a cross-sectional shape of the pixel light isolation structure in a light incident direction of the light conversion layer may include a trapezoid, and a lower base of the trapezoid may face a light incident side of the light conversion layer.
In some embodiments, the plurality of pixel units may include: at least one of the pixels and the sub-pixels.
In some embodiments, at least two of the plurality of pixel cells may comprise the same or different light conversion materials.
In some embodiments, a light conversion layer may be disposed on the light emitting cell layer.
In some embodiments, the light conversion layer may be disposed on the light emitting surface of the light emitting unit layer.
In some embodiments, some or all of the plurality of light emitting cells may be an unpackaged structure.
In some embodiments, the plurality of light emitting units may include: at least one of a Light Emitting Diode (LED), a Mini (Mini) LED, and a Micro (Micro) LED.
The display module provided by the embodiment of the disclosure comprises the light-emitting module.
The display screen provided by the embodiment of the disclosure comprises the display module.
The display provided by the embodiment of the disclosure comprises the display screen.
The luminous module, the display screen and the display provided by the embodiment of the disclosure can realize the following technical effects:
through the backlight isolation layer arranged on the backlight surface of the light emitting unit layer, the light emitting unit optical isolation structure is arranged between two adjacent light emitting units in the part or the whole part of the plurality of light emitting units, and the pixel optical isolation structure is arranged between two adjacent pixel units in the part or the whole part of the plurality of pixel units in the light conversion layer, so that the light emitted by the light emitting units and the light conversion layer is prevented from being conducted to an undesirable direction as much as possible, and the display effect is favorably improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
fig. 1 is a schematic structural diagram of a light emitting module provided in an embodiment of the present disclosure;
fig. 2A, fig. 2B, fig. 2C, fig. 2D, fig. 2E, fig. 2F, and fig. 2G are schematic structural diagrams of a backlight isolation layer according to an embodiment of the disclosure;
fig. 3 is another schematic structural diagram of a backlight isolation layer provided in the embodiment of the disclosure;
fig. 4A, 4B, and 4C are schematic views of another structure of the backlight isolation layer provided in the embodiment of the disclosure;
fig. 5 is another schematic structural diagram of a backlight isolation layer provided in the embodiment of the disclosure;
fig. 6A, 6B, 6C, and 6D are schematic structural views of the insulating part provided in the embodiment of the present disclosure;
fig. 7 is another schematic structural diagram of a light emitting module provided in the embodiment of the present disclosure;
fig. 8 is another schematic structural diagram of a light emitting module provided in the embodiment of the present disclosure;
fig. 9 is another schematic structural diagram of a light emitting module provided in the embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of an insulating layer provided by an embodiment of the present disclosure;
fig. 11A, 11B, 11C, 11D, 11E, 11F, 11G, and 11H are schematic views of another structure of the insulating layer according to the embodiment of the disclosure;
fig. 12A, 12B, and 12C are schematic views of another structure of the light emitting module according to the embodiment of the disclosure;
fig. 13A, 13B, and 13C are schematic views of another structure of the light emitting module according to the embodiment of the disclosure;
14A, 14B, 14C are schematic structural diagrams of a light-emitting unit optical isolation structure provided by the embodiment of the disclosure;
15A, 15B, 15C, 15D, 15E are schematic structural views of another light isolation structure of a light emitting unit provided by the embodiment of the present disclosure;
16A, 16B, 16C, 16D are schematic structural views of another light isolation structure of a light emitting unit provided by the embodiment of the present disclosure;
fig. 17A, 17B, 17C, 17D, 17E, 17F, 17G, 17H, 17I, 17J, 17K, 17L, 17M, and 17N are schematic structural diagrams of another light isolation structure of a light emitting unit according to an embodiment of the present disclosure;
FIG. 18 is a schematic structural diagram of an optical isolation body of a light-emitting unit provided by an embodiment of the present disclosure;
FIG. 19 is a schematic view of another structure of a light-emitting unit optical isolation body provided by an embodiment of the present disclosure;
FIG. 20 is a schematic view of another structure of a light-emitting unit optical isolation structure provided by an embodiment of the present disclosure;
21A, 21B, 21C are another structural schematic diagrams of the light-emitting unit optical isolation structure provided by the embodiment of the present disclosure;
22A, 22B, 22C, 22D, 22E are schematic structural views of another light isolation structure of a light emitting unit provided by the embodiment of the present disclosure;
23A, 23B, 23C, 23D, 23E are schematic structural views of another light isolation structure of a light emitting unit provided by the embodiment of the disclosure;
fig. 24A, fig. 24B, fig. 24C, fig. 24D, fig. 24E, fig. 24F, fig. 24G, and fig. 24H are schematic structural diagrams of another light emitting module according to an embodiment of the present disclosure;
25A, 25B, 25C are schematic structural diagrams of a pixel optical isolation structure provided by an embodiment of the disclosure;
26A, 26B, 26C, 26D, 26E are another structural schematic diagrams of a pixel optical isolation structure provided by the embodiment of the disclosure;
27A, 27B, 27C, 27D are another structural schematic diagrams of a pixel optical isolation structure provided by the embodiment of the disclosure;
fig. 28A, 28B, 28C, 28D, 28E, 28F, 28G, 28H, 28I, 28J, 28K, 28L, 28M, 28N are schematic structural diagrams of another pixel optical isolation structure provided by an embodiment of the present disclosure;
29A, 29B are the structural schematic diagrams of luminous element optical isolation structure and pixel optical isolation structure that this disclosed embodiment provided;
30A, 30B, 30C are another structural schematic diagrams of a light-emitting unit optical isolation structure and a pixel optical isolation structure provided by the embodiment of the disclosure;
FIG. 31 is a schematic structural diagram of a pixel optical isolation body provided by an embodiment of the present disclosure;
FIG. 32 is a schematic diagram of another configuration of a pixel optoisolating body provided by an embodiment of the present disclosure;
FIG. 33 is another schematic diagram of a pixel optical isolation structure provided by an embodiment of the present disclosure;
34A, 34B, 34C are another structural schematic diagrams of a pixel optical isolation structure provided by the embodiment of the disclosure;
35A, 35B, 35C, 35D, 35E are another structural schematic diagrams of a pixel optical isolation structure provided by an embodiment of the present disclosure;
36A, 36B, 36C, 36D, 36E are schematic structural views of another pixel optical isolation structure provided by the embodiment of the disclosure;
FIGS. 37A, 37B, 37C and 37D are schematic structural views of an optical isolation material provided by an embodiment of the disclosure;
fig. 38A, 38B, 38C, 38D, 38E, 38F, 38G, and 38H are schematic views of another structure of the light emitting module according to the embodiment of the present disclosure;
fig. 39 is another schematic structural diagram of a light emitting module provided in the embodiment of the present disclosure;
fig. 40 is another schematic structural diagram of a light emitting module provided in the embodiment of the present disclosure;
fig. 41 is a schematic structural diagram of a display module according to an embodiment of the disclosure;
FIG. 42 is a schematic diagram of a display screen provided by an embodiment of the present disclosure;
fig. 43 is a schematic structural diagram of a display provided in an embodiment of the present disclosure.
Reference numerals:
100: a light emitting module; 110: a light emitting cell layer; 111: a light emitting unit; 112: a backlight surface; 1121: a light-transmitting region; 120: a backlight isolation layer; 1201: a layer structure; 121: a backlight DBR reflective layer; 122: a backlight metal reflective layer; 123: a back light absorption layer; 124: a conductive via; 125: a conductive material; 126: an insulating section; 127: an optical isolation material; 128: an insulating layer; 1281: a first insulating layer; 1282: a second insulating layer; 130: an electrical connection layer; 300: a light emitting unit optical isolation structure; 301: the light-emitting unit light isolation body; 302: an optical isolation material; 3021: a light absorbing material; 3022: a light reflective material; 303: an insulating structure; 310: a light emitting unit interval region; 320: a first light emitting unit; 321: a first side; 330: a second light emitting unit; 331: a second face; 333: a light-transmitting region; 334: a light-transmitting region; 340: a second contact surface; a: an upper bottom edge; d: a lower bottom edge; e: a light incident side; p: a planar direction; s: a light-emitting surface; x: a light emitting side; y: the light incidence direction; z: a light emitting direction; EG: an edge; 410: a light conversion layer; 411: a pixel unit; 500: a pixel optical isolation structure; 501: a pixel optical isolation body; 503: a spacer structure; 510: a pixel interval region; 520: a first pixel unit; 521: a first side; 530: a second pixel unit; 531: a second face; 533: a light-transmitting region; 534: a light-transmitting region; 540: a first contact surface; 700: a display module; 800: a display screen; 900: a display.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
Referring to fig. 1, an embodiment of the present disclosure provides a light emitting module 100, including:
a light emitting cell layer 110 including a plurality of light emitting cells 111;
a backlight isolation layer 120 disposed on the backlight surface 112 of the light emitting unit layer 110;
a light conversion layer 410 including a plurality of pixel units 411;
among part or all of the plurality of light emitting units 111, a light emitting unit optical isolation structure 300 is disposed between two adjacent light emitting units 111; in part or all of the plurality of pixel units 411, a pixel optical isolation structure 500 is disposed between two adjacent pixel units 411.
In this way, the backlight isolation layer 120 can prevent light emitted from the light emitting units 111 from being transmitted in an undesired direction as much as possible (for example, light emitted from the light emitting units 111 passes through the backlight surface 112 of the light emitting unit layer 110), the light emitting unit optical isolation structure 300 can prevent light emitted from two adjacent light emitting units 111 from being transmitted in an undesired direction as much as possible (for example, light emitted from two adjacent light emitting units 111 is transmitted to each other), and the pixel optical isolation structure 500 can prevent light emitted from two adjacent pixel units 411 from being transmitted in an undesired direction as much as possible (for example, light emitted from two adjacent pixel units 411 is transmitted to each other), which is beneficial to improving display effect.
Referring to fig. 2A, 2B, 2C, 2D, 2E, 2F, 2G, in some embodiments, the backlight isolation layer 120 may include at least one of a backlight DBR reflective layer 121, a backlight metallic reflective layer 122, a backlight absorbing layer 123.
In some embodiments, the backlight DBR reflective layer 121 may include structures and materials that enable light reflection. Alternatively, the structure and material of the reflective layer 121 of the backlight DBR may be determined according to practical situations such as process requirements, as long as the reflective layer can reflect the light emitted from the light emitting unit layer 110.
In some embodiments, the backlight metal reflective layer 122 may include structures and materials that enable light reflection, such as: at least one of metals such as silver and aluminum. Alternatively, the material of the backlight metal reflective layer 122 may be determined according to practical situations such as process requirements, as long as the material can reflect the light emitted from the light emitting unit layer 110.
In some embodiments, the light absorption layer 123 may include structures and materials capable of light absorption, such as: a resin composition. Alternatively, the material for realizing light absorption may also include a Black Matrix (BM). Alternatively, the structure and material of the back light absorption layer 123 may be determined according to practical conditions such as process requirements, so long as the light emitted from the light emitting unit layer 110 can be absorbed.
In some embodiments, the backlight spacer 120 may include other structures and materials besides at least one of the backlight DBR reflective layer 121, the backlight metal reflective layer 122, and the backlight absorbing layer 123. Alternatively, the backlight spacer 120 may not include any one of the backlight DBR reflective layer 121, the backlight metal reflective layer 122, and the backlight absorption layer 123, but include other structures and materials. Optionally, the structure and material of the backlight isolation layer 120 may be determined according to practical conditions such as process requirements; regardless of the structure and material of the backlight spacer 120, the backlight spacer 120 may be used to separate the light emitted from the light emitting unit layer 110 to prevent the light emitted from the light emitting unit 111 from being transmitted in an undesired direction.
In some embodiments, the backlight spacer layer 120 may completely or proportionally separate the light emitted from the light emitting cell layer 110 in a reflective or absorptive manner, such as: the light emitted from the light emitting cell layer 110 is isolated in equal proportions of 100%, 90%, 80%. Alternatively, the proportion of the light emitted from the isolated light emitting cell layer 110 may be determined according to practical circumstances such as process requirements.
In some embodiments, as shown in fig. 2A, the backlight spacer layer 120 may include at least one backlight DBR reflective layer 121.
In some embodiments, as shown in fig. 2B, the backlight isolation layer 120 may include at least one backlight metal reflective layer 122, such as: one, two, three or more backlight metal reflective layers 122.
In some embodiments, as shown in fig. 2C, the backlight spacer layer 120 may include at least one layer of a backlight absorption layer 123, such as: one, two, three or more layers of the backside light absorption layer 123.
In some embodiments, as shown in fig. 2D, the backlight isolation layer 120 may include at least one backlight DBR reflective layer 121 and at least one backlight metallic reflective layer 122, for example: one, two, three or more backlight DBR reflective layers 121, and one, two, three or more backlight metallic reflective layers 122. Optionally, the hierarchical relationship between each of the at least one backlight DBR reflective layer 121 and the at least one backlight metal reflective layer 122 may be determined according to practical situations such as process requirements, for example: all the backlight DBR reflecting layers 121 of the at least one backlight DBR reflecting layer 121 are relatively intensively disposed, and all the backlight metallic reflecting layers 122 of the at least one backlight metallic reflecting layer 122 are relatively intensively disposed; or, the backlight DBR reflecting layer 121 and the backlight metal reflecting layer 122 are overlapped.
In some embodiments, as shown in fig. 2E, the backlight spacer layer 120 may include at least one backlight DBR reflective layer 121 and at least one backlight absorbing layer 123, for example: one, two, three or more layers of the backlight DBR reflective layer 121, and one, two, three or more layers of the backlight absorbing layer 123. Alternatively, the hierarchical relationship of each of the at least one backlight DBR reflecting layer 121 and the at least one backlight absorbing layer 123 may be determined according to practical situations such as process requirements, for example: all the backlight DBR reflecting layers 121 of the at least one backlight DBR reflecting layers 121 are relatively intensively disposed, and all the back light absorbing layers 123 of the at least one back light absorbing layer 123 are relatively intensively disposed; alternatively, the backlight DBR reflection layer 121 and the backlight absorption layer 123 are overlapped.
In some embodiments, as shown in fig. 2F, the backlight isolation layer 120 may include at least one backlight metal reflective layer 122 and at least one backlight light absorbing layer 123, such as: one, two, three or more layers of a back light metal reflecting layer 122, and one, two, three or more layers of a back light absorbing layer 123. Optionally, the hierarchical relationship of each of the at least one backlight metal reflective layer 122 and the at least one backlight absorbing layer 123 may be determined according to practical situations such as process requirements, for example: all the backlight metallic reflecting layers 122 of the at least one backlight metallic reflecting layer 122 are relatively intensively arranged, and all the backlight absorbing layers 123 of the at least one backlight absorbing layer 123 are relatively intensively arranged; alternatively, the backlight metal reflective layer 122 and the backlight absorption layer 123 are overlapped.
In some embodiments, as shown in fig. 2G, the backlight spacer layer 120 may include at least one backlight DBR reflective layer 121, at least one backlight metallic reflective layer 122, and at least one backlight absorbing layer 123, such as: one, two, three or more backlight DBR reflective layers 121, one, two, three or more backlight metallic reflective layers 122, and one, two, three or more backlight absorbing layers 123. Alternatively, the hierarchical relationship among the at least one backlight DBR reflecting layer 121, the at least one backlight metal reflecting layer 122, and the at least one backlight absorbing layer 123 may be determined according to practical situations such as process requirements, for example: disposing all the backlight DBR reflecting layers 121 of the at least one backlight DBR reflecting layer 121 relatively intensively, disposing all the backlight metallic reflecting layers 122 of the at least one backlight metallic reflecting layer 122 relatively intensively, disposing all the backlight absorbing layers 123 of the at least one backlight absorbing layer 123 relatively intensively; or, at least two of the backlight DBR reflecting layer 121, the backlight metal reflecting layer 122, and the backlight absorbing layer 123 are overlapped.
Referring to fig. 3, in some embodiments, conductive holes 124 supporting the light emitting cell layers 110 to make electrical connection may be disposed in the backlight isolation layer 120. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to practical situations such as process requirements, for example: a plurality of conductive vias 124 may be provided; alternatively, some or all of the plurality of conductive vias 124 may be conductive vias.
Referring to fig. 4A, 4B, and 4C, in some embodiments, the conductive hole 124 may be filled with a conductive material 125, the backlight isolation layer 120 may include at least one of at least one backlight DBR reflecting layer 121 and at least one backlight absorbing layer 123, and at least one of the at least one backlight DBR reflecting layer 121 and the at least one backlight DBR absorbing layer 123 may be in direct contact with the conductive material 125.
In some embodiments, as shown in fig. 4A, the conductive via 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one backlight DBR reflective layer 121. Optionally, a plurality of conductive vias 124 may be provided. Alternatively, some or all of the plurality of conductive vias 124 may be conductive vias capable of penetrating some or all of the backlight DBR reflective layers 121 of at least one of the backlight DBR reflective layers 121. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to actual conditions such as process requirements.
In some embodiments, as shown in fig. 4B, the conductive hole 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one layer of the backlight absorption layer 123. Optionally, a plurality of conductive vias 124 may be provided. Alternatively, some or all of the plurality of conductive vias 124 may be conductive vias capable of penetrating some or all of the at least one layer of the back light absorbing layers 123. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to actual conditions such as process requirements.
In some embodiments, as shown in fig. 4C, the conductive hole 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one backlight DBR reflective layer 121 and at least one backlight DBR reflective layer 123. Optionally, a plurality of conductive vias 124 may be provided. Alternatively, some or all of the plurality of conductive vias 124 may be conductive vias capable of penetrating through all of the backlight DBR reflective layer 121 of the at least one layer and all of the backlight DBR reflective layer 121 and the backlight DBR reflective layer 123 of the at least one layer and the backlight absorbing layer 123 of the at least one layer. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to actual conditions such as process requirements.
Referring to fig. 5, in some embodiments, the conductive hole 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one backlight metal reflective layer 122, and an insulating portion 126 is disposed between the at least one backlight metal reflective layer 122 and the conductive material 125. Alternatively, a plurality of conductive holes 124 may be disposed in the backlight isolation layer 120, and some or all of the plurality of conductive holes 124 may be disposed as shown in fig. 5.
Referring to fig. 6A, 6B, 6C, 6D, in some embodiments, some or all of the area in the insulation 126 is provided with an optical isolation material 127.
In some embodiments, as shown in fig. 6A, both sides of the insulating part 126 may be provided with optical isolation materials 127.
In some embodiments, as shown in fig. 6B, one side of the insulating part 126 may be provided with an optical isolation material 127.
In some embodiments, as shown in fig. 6C, the other side of the insulating part 126, which is opposite to the side in fig. 6B where the optical isolation material 127 is disposed, may be provided with the optical isolation material 127.
In some embodiments, as shown in fig. 6D, all of the regions in the insulation 126 are provided with an optical isolation material 127.
In some embodiments, the area in which the optical isolation material 127 is disposed in the insulating portion 126 may be determined according to actual conditions such as process requirements.
Referring to fig. 7, in some embodiments, a side of the backlight spacer 120 away from the light emitting cell layer 110 may be provided with an electrical connection layer 130.
Referring to fig. 8, in some embodiments, the light emitting cell layer 110 and the electrical connection layer 130 may be electrically connected through the conductive via 124. Alternatively, the electrical connection between the light emitting unit layer 110 and the electrical connection layer 130 may be implemented in other manners besides the conductive via 124 according to practical circumstances such as process requirements.
Referring to fig. 9, in some embodiments, the backlight isolation layer 120 may include at least one backlight metal reflective layer 122, and the at least one backlight metal reflective layer 122 may be provided with an insulating layer 128 insulated from the electrical connection layer 130 and the light emitting cell layer 110.
Referring to fig. 10, in some embodiments, the insulating layer 128 may include at least one of:
a first insulating layer 1281 disposed between the backlight metal reflective layer 122 and the electrical connection layer 130;
and a second insulating layer 1282 disposed between the backlight metal reflective layer 122 and the light emitting cell layer 110.
Referring to fig. 11A, 11B, 11C, 11D, 11E, 11F, 11G, 11H, in some embodiments, a portion or all of at least one of the first insulating layer 1281 and the second insulating layer 1282 may be provided with an optical isolation material 127.
In some embodiments, as shown in FIG. 11A, both sides of the first insulating layer 1281 are provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11B, one side of first insulating layer 1281 is provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11C, the other side of the first insulating layer 1281, opposite the side in FIG. 11B where the optical isolation material 127 is disposed, is provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11D, the entire area of the first insulating layer 1281 is provided with the optical isolation material 127.
In some embodiments, as shown in FIG. 11E, both sides of the second insulating layer 1282 are provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11F, one side of the second insulating layer 1282 is provided with an optical isolation material 127.
In some embodiments, as shown in FIG. 11G, the other side of the second insulating layer 1282 opposite the side in FIG. 11F where the optical isolation material 127 is disposed is provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11H, the entire area of the second insulating layer 1282 is provided with the optical isolation material 127.
In some embodiments, the area in which the optical isolation material 127 is disposed in the insulating layer 128 (e.g., at least one of the first insulating layer 1281 and the second insulating layer 1282) may be determined based on process requirements, among other practical considerations.
In some embodiments, in conjunction with fig. 1, the backlight isolation layer 120 may be directly disposed on the backlight surface 112 of the light emitting cell layer 110. Alternatively, there may be no other devices or structures between the backlight isolation layer 120 and the backlight surface 112 of the light emitting cell layer 110. Alternatively, other devices or structures may be disposed in a part or all of the area between the backlight isolation layer 120 and the backlight surface 112 of the light emitting unit layer 110 according to practical situations such as process requirements.
In some embodiments, the backlight isolation layer 120 may be attached to the backlight surface 112 of the light emitting cell layer 110. Optionally, part or all of the backlight isolation layer 120 may be attached to the backlight surface 112 of the light emitting unit layer 110 according to practical situations such as process requirements. Alternatively, in the case that a portion of the backlight isolation layer 120 is attached to the backlight surface 112 of the light emitting unit layer 110, a portion of the backlight isolation layer 120, which is not attached to the backlight surface 112 of the light emitting unit layer 110, may have a certain distance from the backlight surface 112 of the light emitting unit layer 110. Alternatively, the distance may be set according to actual conditions such as process requirements.
Referring to fig. 12A, 12B, and 12C, in some embodiments, the backlight isolation layer 120 may be disposed on a part or all of the backlight surface 112 of the light emitting cell layer 110.
In some embodiments, as shown in fig. 12A, the backlight isolation layer 120 is disposed on the entire area of the backlight surface 112 of the light emitting cell layer 110.
In some embodiments, as shown in fig. 12B, the backlight isolation layer 120 is disposed on a partial area of the backlight surface 112 of the light emitting cell layer 110, which may be a continuous area. Optionally, the continuous region may include at least one edge EG of the backlight surface 112 of the light emitting cell layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included.
In some embodiments, as shown in fig. 12C, a backlight isolation layer 120 (the backlight isolation layer 120 is surrounded by a dotted line for easy identification) is disposed on a partial region of the backlight surface 112 of the light emitting cell layer 110, which may be a discontinuous region. In this case, the backlight spacer layer 120 may be composed of more than one discontinuous layer structure 1201. Alternatively, at least two discontinuous regions may be provided, at least one of which may include at least one edge EG of the backlight surface 112 of the light emitting unit layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included. Alternatively, the position, number, etc. of discontinuous regions for disposing the backlight surfaces 112 of the light emitting unit layers 110 of the backlight isolation layer 120 may be determined according to practical situations such as process requirements, so as to determine the position, number, etc. of the discontinuous layer structures 1201 constituting the backlight isolation layer 120.
In some embodiments, the backlight isolation layer 120 may be disposed on a part or all of the backlight surface 112 of the light emitting unit layer 110 according to practical situations such as process requirements, so long as the backlight isolation layer 120 can isolate the light emitted from the light emitting unit layer 110 to prevent the light emitted from the light emitting unit 111 from being conducted in an undesired direction.
Referring to fig. 13A, 13B, and 13C, in some embodiments, the backlight isolation layer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110. In some embodiments, as shown in fig. 13A, 13B, and 13C, the arrow pattern exemplarily represents a direction of a portion of the light emitting cell layer 110 toward the backlight spacer 120. Optionally, the light transmissive region 1121 is surrounded by a dotted line for ease of identification.
In some embodiments, as shown in fig. 13A, the light transmissive region 1121 of the backlight surface 112 of the light emitting unit layer 110 includes the entire region of the backlight surface 112 of the light emitting unit layer 110. In this case, the backlight spacer 120 may be disposed on the entire area of the backlight surface 112 of the light emitting cell layer 110, so that the backlight spacer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting cell layer 110.
In some embodiments, as shown in fig. 13B, the light transmissive region 1121 of the backlight surface 112 of the light emitting unit layer 110 includes a partial region of the backlight surface 112 of the light emitting unit layer 110, which may be a continuous region. In this case, the backlight spacer 120 may be disposed on a partial region (e.g., the continuous region) of the backlight surface 112 of the light emitting cell layer 110, so that the backlight spacer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting cell layer 110. Optionally, the continuous region may include at least one edge EG of the backlight surface 112 of the light emitting cell layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included.
In some embodiments, as shown in fig. 13C, the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110 includes a partial region of the backlight surface 112 of the light emitting unit layer 110, which may be a discontinuous region. In this case, the backlight isolation layer 120 may be disposed on a partial region (e.g., the discontinuous region) of the backlight surface 112 of the light emitting cell layer 110, so that the backlight isolation layer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting cell layer 110. Correspondingly, the backlight spacer layer 120 may be composed of more than one non-continuous layer structure 1201. Alternatively, at least two discontinuous regions may be provided, at least one of which may include at least one edge EG of the backlight surface 112 of the light emitting unit layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included. Alternatively, the position, number, etc. of discontinuous regions for disposing the backlight surfaces 112 of the light emitting unit layers 110 of the backlight isolation layer 120 may be determined according to actual light transmittance conditions such as process requirements, so as to determine the position, number, etc. of the discontinuous layer structures 1201 constituting the backlight isolation layer 120.
In some embodiments, the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110 may be determined according to actual light transmission conditions such as process requirements, and the like, and accordingly, the backlight isolation layer 120 is considered to be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110. Alternatively, the light transmission region 1121 may include a part or all of the region of the backlight surface 112 of the light emitting unit layer 110, may be in the form of a continuous region or a discontinuous region, and may determine the corresponding position, number, etc. according to the actual light transmission condition, such as the process requirement, so long as the backlight isolation layer 120 can isolate the light emitted from the light emitting unit layer 110 to avoid the light emitted from the light emitting unit 111 from being transmitted in an undesired direction as much as possible.
Referring to fig. 14A, 14B, and 14C, in some embodiments, the light emitting cell optical isolation structure 300 may be disposed at a partial or entire region between two adjacent light emitting cells 111.
In some embodiments, as shown in fig. 14A, the light-emitting unit optical isolation structure 300 is disposed at a partial region between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and near one of the light-emitting units 111 (the light-emitting unit 111 located on the left side in the figure).
In some embodiments, as shown in fig. 14B, the light-emitting-unit optical isolation structure 300 is disposed in a partial region between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and being opposite to the position where the light-emitting-unit optical isolation structure 300 is located in fig. 14A (close to the light-emitting unit 111 located on the right side in the figure).
In some embodiments, as shown in fig. 14C, the light-emitting unit optical isolation structure 300 is disposed at the entire region between the adjacent two light-emitting units 111.
In some embodiments, the area where the light-emitting unit optical isolation structure 300 is disposed between two adjacent light-emitting units 111 may be determined according to practical situations such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
Referring to fig. 15A, 15B, 15C, 15D, and 15E, in some embodiments, a light emitting unit interval region 310 may exist between two adjacent light emitting units 111, and a light emitting unit optical isolation structure 300 may be disposed in part or all of the light emitting unit interval region 310.
In some embodiments, as shown in fig. 15A, a light emitting unit interval region 310 having a rectangular quadrilateral shape may be used as a light emitting unit interval region between two adjacent light emitting units 111; the light-emitting unit interval region 310 may smoothly connect two adjacent light-emitting units 111, so that the projection formed by the two adjacent light-emitting units 111 and the light-emitting unit interval region 310 may form a regular shape such as a rectangular quadrangle as shown in fig. 15A.
In some embodiments, the light emitting cell spacing region 310 between two adjacent light emitting cells 111 may not have the shape of the light emitting cell spacing region 310 as shown in fig. 15A, but have other shapes such as a circle, an ellipse, a triangle, a trapezoid, and the like. Alternatively, in the case where the light-emitting unit interval region 310 between two adjacent light-emitting units 111 has other shapes such as a circle, an ellipse, a triangle, a trapezoid, etc., it is also possible for the light-emitting unit interval region 310 to smoothly connect two adjacent light-emitting units 111, so that the projection formed by the two adjacent light-emitting units 111 and the light-emitting unit interval region 310 together may form a regular shape such as a rectangular quadrangle as shown in fig. 15A.
In some embodiments, the position, shape, size, etc. of the light emitting unit interval region 310 between two adjacent light emitting units 111 may be determined according to practical situations such as process requirements. Alternatively, regardless of the shape of the light-emitting unit interval region 310 between two adjacent light-emitting units 111, the light-emitting unit interval region 310 having an approximately elliptical shape shown by a dotted line in fig. 15B may also be used as the light-emitting unit interval region between two adjacent light-emitting units 111 for convenience of description.
In some embodiments, as shown in fig. 15C, the light-emitting unit optical isolation structure 300 is disposed at a partial region in the light-emitting unit interval region 310 between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and near one of the light-emitting units 111 (the light-emitting unit 111 located on the left side in the drawing).
In some embodiments, as shown in fig. 15D, the light-emitting-unit optical isolation structure 300 is disposed at a partial region in the light-emitting-unit spacing region 310 between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and being opposite to the position where the light-emitting-unit optical isolation structure 300 is located in fig. 15C (close to the light-emitting unit 111 located at the right side in the figure).
In some embodiments, as shown in fig. 15E, the light-emitting unit optical isolation structure 300 is disposed at all of the light-emitting unit interval regions 310 between the adjacent two light-emitting units 111.
In some embodiments, the position of the light-emitting unit optical isolation structure 300 disposed in the light-emitting unit interval region 310 between two adjacent light-emitting units 111 may be determined according to practical situations such as process requirements, so long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
Referring to fig. 16A, 16B, 16C, and 16D, in some embodiments, two adjacent light emitting units 111 may include a first light emitting unit 320 and a second light emitting unit 330, the first light emitting unit 320 may include a first face 321 adjacent to the second light emitting unit 330, and the second light emitting unit 330 may include a second face 331 adjacent to the first light emitting unit 320. Alternatively, the light emitting unit optical isolation structure 300 may be disposed on at least one of the first and second faces 321 and 331, or not in contact with the first and second faces 321 and 331.
In some embodiments, as shown in fig. 16A, the light-emitting unit optical isolation structure 300 is disposed on the first face 321 of the first light-emitting unit 320, in contact with the first face 321 of the first light-emitting unit 320, and not in contact with the second face 331 of the second light-emitting unit 330.
In some embodiments, as shown in fig. 16B, the light emitting cell optical isolation structure 300 is disposed on the second face 331 of the second light emitting cell 330, in contact with the second face 331 of the second light emitting cell 330, and not in contact with the first face 321 of the first light emitting cell 320.
In some embodiments, as shown in fig. 16C, the light emitting cell optical isolation structure 300 is disposed on the first face 321 of the first light emitting cell 320 and the second face 331 of the second light emitting cell 330, in contact with the first face 321 of the first light emitting cell 320 and in contact with the second face 331 of the second light emitting cell 330.
In some embodiments, as shown in fig. 16D, the light emitting cell optical isolation structure 300 is disposed between the first face 321 of the first light emitting cell 320 and the second face 331 of the second light emitting cell 330, without contacting the first face 321 of the first light emitting cell 320 and without contacting the second face 331 of the second light emitting cell 330.
In some embodiments, the arrangement relationship between the light-emitting unit optical isolation structure 300 and the first and second light-emitting units 320 and 330 may be determined according to actual conditions such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by the first and second light-emitting units 320 and 330 from being conducted in an undesired direction (for example, the light emitted by the first and second light-emitting units 320 and 330 is conducted to each other).
Referring to fig. 17A, 17B, 17C, 17D, 17E, 17F, 17G, 17H, 17I, 17J, 17K, 17L, 17M, and 17N, in some embodiments, the light-emitting unit optical isolation structure 300 may be disposed in a light-transmitting region of at least one of the first and second faces 321 and 331.
In some embodiments, the arrow pattern exemplarily represents a direction in which a part of light of the light emitting unit 111 is conducted outward, as shown in fig. 17A, 17B, 17C, 17D, 17E, 17F, 17G, 17H, 17I, 17J, 17K, 17L, 17M, 17N. Optionally, the light transmissive regions 333, 334 are surrounded by dashed lines for ease of identification.
In some embodiments, as shown in fig. 17A, the light transmitting region 333 of the first face 321 of the first light emitting unit 320 includes the entire region of the first face 321. In this case, the light-emitting unit optical isolation structure 300 may be disposed on and in contact with the entire region of the first face 321, so that the light-emitting unit optical isolation structure 300 may be disposed on the light-transmitting region 333 of the first face 321.
In some embodiments, as shown in fig. 17B, 17C, the light transmitting region 333 of the first face 321 of the first light emitting unit 320 includes a partial region of the first face 321. In this case, the light-emitting-unit optical isolation structure 300 may be disposed at and in contact with a corresponding partial region of the first face 321, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting region 333 of the first face 321.
In some embodiments, as shown in fig. 17D, the light transmission region 334 of the second side 331 of the second light emitting unit 330 includes the entire region of the second side 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on and in contact with the entire area of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting area 334 of the second face 331.
In some embodiments, as shown in fig. 17E, 17F, the light transmission region 334 of the second face 331 of the second light emitting unit 330 includes a partial region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed at a corresponding partial region of the second face 331 and in contact with the corresponding partial region of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting region 334 of the second face 331.
In some embodiments, as shown in fig. 17G, the light-transmitting region 333 of the first face 321 of the first light-emitting unit 320 includes the entire region of the first face 321, and the light-transmitting region 334 of the second face 331 of the second light-emitting unit 330 includes the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on and in contact with the entire regions of the first and second surfaces 321 and 331 so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting region 333 of the first surface 321 and the light-transmitting region 334 of the second surface 331.
In some embodiments, as shown in fig. 17H and 17I, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 coincides with the light-transmitting region 334 of the second side 331 (e.g., at least one of the position, the shape, the area, etc. is the same). In this case, the light-emitting-unit optical isolation structure 300 may be disposed at respective partial regions of the first and second faces 321 and 331, and in contact with the respective partial regions of the first and second faces 321 and 331, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting regions 334 of the first and second faces 321 and 331.
In some embodiments, as shown in fig. 17J, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 is not identical to the light-transmitting region 334 of the second side 331 (e.g., at least one of a position, a shape, an area, etc. is not identical). In this case, the light-emitting-unit optical isolation structure 300 may be disposed at respective partial regions of the first and second faces 321 and 331, and in contact with the respective partial regions of the first and second faces 321 and 331, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting regions 334 of the first and second faces 321 and 331.
In some embodiments, the light-transmitting region 333 of the first face 321 of the first light-emitting unit 320 may include the entire region of the first face 321, and the light-transmitting region 334 of the second face 331 of the second light-emitting unit 330 may include a partial region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on and in contact with the entire region of the first face 321 and the partial region of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting regions 334 of the first face 321 and the second face 331. Alternatively, the light transmission region 333 of the first face 321 of the first light emitting unit 320 may include a partial region of the first face 321, and the light transmission region 334 of the second face 331 of the second light emitting unit 330 may include the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on the partial region of the first face 321 and the entire region of the second face 331, and in contact with the partial region of the first face 321 and the entire region of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting regions 334 of the first face 321 and the second face 331.
In some embodiments, as shown in fig. 17K, the light transmitting region 333 of the first face 321 of the first light emitting unit 320 includes the entire region of the first face 321, and the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed between all regions of the first face 321 and all regions of the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmissive region 333 of the first face 321 and the light-transmissive region 334 of the second face 331.
In some embodiments, as shown in fig. 17L and 17M, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 coincides with the light-transmitting region 334 of the second side 331 (e.g., at least one of the position, the shape, the area, etc. is the same). In this case, the light-emitting-unit optical isolation structure 300 may be disposed between respective partial regions of the first and second faces 321 and 331 without contacting the first and second faces 321 and 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmissive region 333 of the first face 321 and the light-transmissive region 334 of the second face 331.
In some embodiments, as shown in fig. 17N, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 is not identical to the light-transmitting region 334 of the second side 331 (e.g., at least one of a position, a shape, an area, etc. is not identical). In this case, the light-emitting-unit optical isolation structure 300 may be disposed between the respective partial regions of the first face 321 and the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmitting regions 334 of the first face 321 and the second face 331.
In some embodiments, the light-transmitting region 333 of the first face 321 of the first light-emitting unit 320 may include the entire region of the first face 321, and the light-transmitting region 334 of the second face 331 of the second light-emitting unit 330 may include a partial region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed between the entire area of the first face 321 and a partial area of the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmitting areas 334 of the first face 321 and the second face 331. Alternatively, the light transmission region 333 of the first face 321 of the first light emitting unit 320 may include a partial region of the first face 321, and the light transmission region 334 of the second face 331 of the second light emitting unit 330 may include the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed between the partial region of the first face 321 and the entire region of the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmitting regions 334 of the first face 321 and the second face 331.
In some embodiments, the light transmissive regions 333, 334 of the light emitting unit 111 may be continuous regions. In this case, the light-emitting unit optical isolation structure 300 may be disposed on the continuous region with or without contact with the continuous region, so that the light-emitting unit optical isolation structure 300 may be disposed on the light transmitting regions 333, 334 of the light-emitting unit 111. Alternatively, the light transmitting regions 333, 334 of the light emitting unit 111 may be discontinuous regions. In this case, the light-emitting cell optical isolation structure 300 may be disposed at the discontinuous region, and may be in contact with or not in contact with the discontinuous region, so that the light-emitting cell optical isolation structure 300 may be disposed at the light-transmitting regions 333, 334 of the light-emitting cell 111. Alternatively, the positions, the number, and the like of the discontinuous regions for disposing the light-emitting-unit optical isolation structure 300 may be determined according to actual light transmission conditions such as process requirements, so that the light-emitting-unit optical isolation structure 300 may be disposed in the light-transmitting regions 333, 334 of the light-emitting unit 111 which are present in the discontinuous regions.
In some embodiments, the light-transmitting regions 333 and 334 of the light-emitting unit 111 may be determined according to actual light-transmitting conditions such as process requirements, and the like, and accordingly, the light-emitting unit optical isolation structure 300 is considered to be disposed between the light-transmitting regions 333 and 334 of the light-emitting unit 111 or between the light-transmitting regions 333 and 334 of two adjacent light-emitting units 111. Alternatively, the light-transmitting regions 333 and 334 may include part or all of the light-emitting units 111, may be in the form of continuous regions or discontinuous regions, and the corresponding positions, numbers, etc. may be determined according to actual light-transmitting conditions such as process requirements, so long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by the first light-emitting unit 320 and the second light-emitting unit 330 is conducted to each other).
In some embodiments, the light emitting cell optical isolation structure 300 may be in direct contact with the backlight isolation layer 120, or have a gap with the backlight isolation layer 120. Alternatively, in a region where a gap exists between the light emitting cell optical isolation structure 300 and the backlight isolation layer 120, another medium may be present or another structure may be provided. Alternatively, the light-isolating material may be partially or entirely disposed at the gap between the light-emitting unit light-isolating structure 300 and the backlight isolation layer 120.
Referring to fig. 18, in some embodiments, a light emitting unit optical isolation structure 300 may include a light emitting unit optical isolation body 301.
Referring to fig. 19, in some embodiments, a light emitting unit optical isolation body 301 may be non-conductive and include an optical isolation material 302.
Referring to fig. 20, in some embodiments, the light emitting unit optical isolation body 301 may be electrically conductive. Optionally, the light emitting unit optical isolation structure 300 may further include: the insulating structure 303 is provided between the light-emitting unit optical isolation body 301 and the light-emitting unit 111 that needs to be insulated from the light-emitting unit optical isolation body 301.
Referring to fig. 21A, 21B, 21C, in some embodiments, an insulating structure 303 may be disposed between the light-emitting unit optical isolation body 301 and at least one of the adjacent two light-emitting units 111.
In some embodiments, as shown in fig. 21A, in the case where two adjacent light emitting units 111 include a first light emitting unit 320, a second light emitting unit 330, an insulating structure 303 is disposed between the light emitting unit optical isolation body 301 and the first light emitting unit 320.
In some embodiments, as shown in fig. 21B, in the case where two adjacent light emitting units 111 include a first light emitting unit 320, a second light emitting unit 330, an insulating structure 303 is disposed between the light emitting unit optical isolation body 301 and the second light emitting unit 330.
In some embodiments, as shown in fig. 21C, in the case where two adjacent light emitting units 111 include a first light emitting unit 320 and a second light emitting unit 330, an insulating structure 303 is disposed between the light emitting unit optical isolation body 301 and the first light emitting unit 320, and an insulating structure 303 is also disposed between the light emitting unit optical isolation body 301 and the second light emitting unit 330.
In some embodiments, the position of the insulating structure 303 may be considered according to practical situations such as process requirements, as long as the light-emitting unit optical isolation body 301 can be effectively insulated from the adjacent light-emitting unit 111.
Referring to fig. 22A, 22B, 22C, 22D, 22E, in some embodiments, an insulating structure 303 may cover part or all of the light emitting unit optical isolation body 301.
In some embodiments, as shown in fig. 22A, 22B, 22C, 22D, the insulating structure 303 may cover a portion of the light emitting unit optical isolation body 301, for example: the light emitting unit optically isolates one, two, three, or more sides of the body 301.
In some embodiments, as shown in fig. 22E, the insulating structure 303 may cover the entirety of the light emitting unit optical isolation body 301.
In some embodiments, the arrangement of the insulating structure 303 (e.g., covering part or all of the light-emitting unit optical isolation body 301) can be considered according to the actual conditions such as process requirements, so long as the light-emitting unit optical isolation body 301 can be effectively insulated from the adjacent light-emitting unit 111.
In some embodiments, at least one of the light emitting unit optical isolation body 301 and the insulating structure 303 may contain an optical isolation material 302.
Referring to fig. 23A, 23B, 23C, 23D, and 23E, in some embodiments, the insulating structure 303 may contact at least one of the adjacent two light emitting cells 111. Alternatively, the insulating structure 303 may not contact the adjacent two light emitting cells 111.
In some embodiments, as shown in fig. 23A, in the case where two adjacent light emitting cells 111 include a first light emitting cell 320 and a second light emitting cell 330, the insulating structure 303 is in contact with the first light emitting cell 320 and is not in contact with the second light emitting cell 330.
In some embodiments, as shown in fig. 23B, in the case where two adjacent light emitting units 111 include a first light emitting unit 320 and a second light emitting unit 330, the insulating structure 303 is in contact with the second light emitting unit 330 and is not in contact with the first light emitting unit 320.
In some embodiments, as shown in fig. 23C, in the case where the adjacent two light emitting cells 111 include the first light emitting cell 320 and the second light emitting cell 330, the insulating structure 303 as a single body contacts both the first light emitting cell 320 and the second light emitting cell 330.
In some embodiments, as shown in fig. 23D, in the case that the two adjacent light emitting units 111 include the first light emitting unit 320 and the second light emitting unit 330, one insulating structure 303 is in contact with the first light emitting unit 320 and not in contact with the second light emitting unit 330, and the other insulating structure 303 is in contact with the second light emitting unit 330 and not in contact with the first light emitting unit 320, of the two relatively independent insulating structures 303.
In some embodiments, as shown in fig. 23E, in the case where two adjacent light emitting units 111 include the first light emitting unit 320 and the second light emitting unit 330, the insulating structure 303 is not in contact with both the first light emitting unit 320 and the second light emitting unit 330.
In some embodiments, the arrangement of the insulating structure 303 (for example, contacting at least one of the two adjacent light emitting units 111) can be considered according to the actual conditions of the process requirements, etc., as long as the light emitting unit optical isolation body 301 can be effectively insulated from the adjacent light emitting unit 111.
Referring to fig. 24A, 24B, 24C, 24D, 24E, 24F, 24G, and 24H, in some embodiments, some or all of the shapes of the cross-sectional shapes of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 include at least one of a rectangular quadrangle, a triangle, and a trapezoid.
In some embodiments, as shown in fig. 24A, the sectional shape of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 is a rectangular quadrangle.
In some embodiments, as shown in fig. 24B, the sectional shape of the light-emitting unit optical isolation structure 300 in the light outgoing direction Z of the light-emitting unit layer 110 includes two rectangular quadrangles, and the widths of the two rectangular quadrangles in the plane direction P of the light-emitting unit layer 110 are not the same. Alternatively, a rectangular quadrangle having a relatively small width in the plane direction P of the light emitting cell layer 110 may be close to the light emitting side X of the light emitting cell layer 110, and a rectangular quadrangle having a relatively large width in the plane direction P of the light emitting cell layer 110 may be far from the light emitting side X of the light emitting cell layer 110. Alternatively, the relative positional relationship of the two rectangular parallelograms may be reversed from that shown in the figures, for example: the rectangular quadrangle having a relatively large width in the plane direction P of the light emitting cell layer 110 may be close to the light emitting side X of the light emitting cell layer 110, and the rectangular quadrangle having a relatively small width in the plane direction P of the light emitting cell layer 110 may be far from the light emitting side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 24C, the sectional shape of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 is a triangle. Alternatively, one side of the triangle may be away from the light emitting side X of the light emitting cell layer 110. Alternatively, one side of the triangle may be close to the light emitting side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 24D, the sectional shape of the light-emitting unit optical isolation structure 300 in the light-exiting direction Z of the light-emitting unit layer 110 includes a rectangular quadrangle and a triangle. Alternatively, the rectangular quadrangle may be distant from the light emitting side X of the light emitting cell layer 110, and the triangle may be close to the light emitting side X of the light emitting cell layer 110. Alternatively, the relative positional relationship of the rectangular quadrangle and the triangle may be reversed from that shown in the drawings, for example: the triangle may be far away from the light emitting side X of the light emitting cell layer 110, and the rectangular quadrangle may be close to the light emitting side X of the light emitting cell layer 110. Alternatively, one side of the triangle may face the light emitting side X of the light emitting cell layer 110, or face away from the light emitting side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 24E, the light emitting cell optical isolation structure 300 has a trapezoidal cross-sectional shape along the light exit direction Z of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may be directed toward the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face away from the light exit side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 24F, the sectional shape of the light emitting cell optical isolation structure 300 in the light exit direction Z of the light emitting cell layer 110 includes a trapezoid and a rectangular quadrangle. Alternatively, the rectangular quadrangle may be close to the light emitting side X of the light emitting cell layer 110, and the trapezoid may be distant from the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face the light exit side X of the light emitting cell layer 110, or face away from the light exit side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 24G, the sectional shape of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 includes a trapezoid and a rectangular quadrangle. Alternatively, the rectangular quadrangle may be distant from the light emitting side X of the light emitting cell layer 110, and the trapezoid may be close to the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face the light exit side X of the light emitting cell layer 110, or face away from the light exit side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 24H, the sectional shape of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 includes a trapezoid and a triangle. Alternatively, the trapezoid may be distant from the light exit side X of the light emitting unit layer 110, and the triangle may be close to the light exit side X of the light emitting unit layer 110. Alternatively, the relative positional relationship of the trapezoid and the triangle may be reversed from that shown in the drawings, for example: the trapezoid may be close to the light emitting side X of the light emitting cell layer 110, and the triangle may be away from the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face the light exit side X of the light emitting cell layer 110, or face away from the light exit side X of the light emitting cell layer 110. Alternatively, one side of the triangle may face the light emitting side X of the light emitting cell layer 110, or face away from the light emitting side X of the light emitting cell layer 110.
In some embodiments, the cross-sectional shape of the light-emitting unit optical isolation structure 300 along the light-emitting direction Z of the light-emitting unit layer 110 may be considered according to practical situations such as process requirements, so long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
In some embodiments, the light-emitting unit optical isolation structure 300 may include structures and materials that enable optical isolation, such as: at least one of metals such as silver and aluminum. Alternatively, the structure and material of the light-emitting unit optical isolation structure 300 may be determined according to practical situations such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
In some embodiments, the light-emitting unit optical isolation structure 300 may also include other structures and materials capable of performing light absorption, light reflection, and the like, for example: resin compositions, titanium oxides (e.g., TiO2), and the like. Alternatively, the material for realizing light absorption may also include a Black Matrix (BM). Alternatively, the structure and material of the light-emitting unit optical isolation structure 300 may be determined according to practical situations such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
In some embodiments, light conversion layer 410 may implement color conversion of light by means of wavelength selection, for example: at least one of the plurality of pixel units 411 included in the light conversion layer 410 performs color conversion on light from the light emitting unit layer.
Referring to fig. 25A, 25B, 25C, in some embodiments, a pixel optical isolation structure 500 may be disposed in a portion or all of the area between two adjacent pixel cells 411.
In some embodiments, as shown in fig. 25A, the pixel optical isolation structure 500 is disposed in a partial region between two adjacent pixel units 411, the partial region being located between two adjacent pixel units 411 and near one of the pixel units 411 (the pixel unit 411 located on the left side in the figure).
In some embodiments, as shown in fig. 25B, the pixel optical isolation structure 500 is disposed in a partial region between two adjacent pixel cells 411, the partial region being located between two adjacent pixel cells 411 and opposite to the position where the pixel optical isolation structure 500 is located in fig. 25A (near the pixel cell 411 located on the right side in the figure).
In some embodiments, as shown in fig. 25C, the pixel optical isolation structure 500 is disposed over the entire area between two adjacent pixel cells 411.
In some embodiments, the area where the pixel optical isolation structure 500 is disposed between two adjacent pixel units 411 may be determined according to practical situations such as process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is conducted to each other).
Referring to fig. 26A, 26B, 26C, 26D, and 26E, in some embodiments, a pixel isolation region 510 may exist between two adjacent pixel units 411, and a pixel optical isolation structure 500 may be disposed in a part or all of the pixel isolation region 510.
In some embodiments, as shown in fig. 26A, a pixel spacing region 510 having a rectangular quadrilateral shape may be used as a pixel spacing region between two adjacent pixel units 411; the inter-pixel region 510 may smoothly connect two adjacent pixel units 411, so that the projection formed by the two adjacent pixel units 411 and the inter-pixel region 510 together may form a regular shape such as a rectangular quadrangle as shown in fig. 26A.
In some embodiments, the inter-pixel region 510 between two adjacent pixel units 411 may not have the shape of the inter-pixel region 510 as shown in fig. 26A, but have other shapes such as a circle, an ellipse, a triangle, a trapezoid, and the like. Alternatively, in the case that the inter-pixel region 510 between two adjacent pixel units 411 has other shapes such as a circle, an ellipse, a triangle, a trapezoid, etc., it is also possible for the inter-pixel region 510 to smoothly connect two adjacent pixel units 411, so that the projection formed by two adjacent pixel units 411 and the inter-pixel region 510 together can form a regular shape such as a rectangular quadrangle as shown in fig. 26A.
In some embodiments, the position, shape, size, etc. of the pixel spacing region 510 between two adjacent pixel units 411 may be determined according to practical situations such as process requirements. Alternatively, regardless of the shape of the pixel spacing region 510 between two adjacent pixel units 411, for convenience of description, the pixel spacing region 510 having an approximately elliptical shape shown by a dotted line in fig. 26B may be used as the pixel spacing region between two adjacent pixel units 411.
In some embodiments, as shown in fig. 26C, the pixel optical isolation structure 500 is disposed in a partial region in the pixel isolation region 510 between two adjacent pixel units 411, the partial region being located between two adjacent pixel units 411 and near one of the pixel units 411 (the pixel unit 411 located on the left side in the figure).
In some embodiments, as shown in fig. 26D, the pixel optical isolation structure 500 is disposed in a partial region of the pixel isolation region 510 between two adjacent pixel cells 411, the partial region being located between two adjacent pixel cells 411 and opposite to the position where the pixel optical isolation structure 500 is located in fig. 26C (close to the pixel cell 411 located on the right side in the figure).
In some embodiments, as shown in fig. 26E, the pixel optical isolation structure 500 is disposed in all of the pixel spacing regions 510 between two adjacent pixel cells 411.
In some embodiments, the position of the pixel optical isolation structure 500 in the pixel isolation region 510 between two adjacent pixel units 411 may be determined according to practical situations such as process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is conducted to each other).
Referring to fig. 27A, 27B, 27C, and 27D, in some embodiments, two adjacent pixel units 411 may include a first pixel unit 520 and a second pixel unit 530, the first pixel unit 520 may include a first surface 521 near the second pixel unit 530, and the second pixel unit 530 may include a second surface 531 near the first pixel unit 520. Alternatively, the pixel optical isolation structure 500 may be disposed on at least one of the first side 521 and the second side 531, or not in contact with the first side 521 and the second side 531.
In some embodiments, as shown in fig. 27A, the pixel optical isolation structure 500 is disposed on the first side 521 of the first pixel cell 520 in contact with the first side 521 of the first pixel cell 520 and not in contact with the second side 531 of the second pixel cell 530.
In some embodiments, as shown in fig. 27B, the pixel light isolation structure 500 is disposed on the second side 531 of the second pixel cell 530, in contact with the second side 531 of the second pixel cell 530, and not in contact with the first side 521 of the first pixel cell 520.
In some embodiments, as shown in fig. 27C, the pixel optical isolation structure 500 is disposed on the first side 521 of the first pixel cell 520 and the second side 531 of the second pixel cell 530, in contact with the first side 521 of the first pixel cell 520 and in contact with the second side 531 of the second pixel cell 530.
In some embodiments, as shown in fig. 27D, the pixel light isolation structure 500 is disposed between the first side 521 of the first pixel cell 520 and the second side 531 of the second pixel cell 530, without contacting the first side 521 of the first pixel cell 520 and without contacting the second side 531 of the second pixel cell 530.
In some embodiments, the arrangement relationship between the pixel optical isolation structure 500 and the first and second pixel units 520 and 530 may be determined according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can prevent the light emitted by the first and second pixel units 520 and 530 from being conducted in an undesired direction (for example, the light emitted by the first and second pixel units 520 and 530 are conducted to each other).
Referring to fig. 28A, 28B, 28C, 28D, 28E, 28F, 28G, 28H, 28I, 28J, 28K, 28L, 28M, 28N, in some embodiments, a pixel optical isolation structure 500 may be disposed in the light transmissive region 534 of at least one of the first and second faces 521, 531.
In some embodiments, the arrow pattern exemplarily represents a direction of a part of the light conduction of the pixel unit 411, as shown in fig. 28A, 28B, 28C, 28D, 28E, 28F, 28G, 28H, 28I, 28J, 28K, 28L, 28M, 28N. Optionally, the light- transmissive regions 533, 534 are surrounded by dashed lines for ease of identification.
In some embodiments, as shown in fig. 28A, the light-transmitting region 533 of the first side 521 of the first pixel unit 520 includes the entire region of the first side 521. In this case, the pixel optical isolation structure 500 may be disposed on and in contact with the entire region of the first face 521, so that the pixel optical isolation structure 500 may be disposed on the light-transmitting region 533 of the first face 521.
In some embodiments, as shown in fig. 28B, 28C, the light-transmitting region 533 of the first side 521 of the first pixel unit 520 includes a partial region of the first side 521. In this case, the pixel optical isolation structure 500 may be disposed at and in contact with a corresponding partial region of the first face 521, so that the pixel optical isolation structure 500 may be disposed at the light-transmitting region 533 of the first face 521.
In some embodiments, as shown in fig. 28D, the light transmissive region 534 of the second face 531 of the second pixel unit 530 includes the entire region of the second face 531. In this case, the pixel light isolation structure 500 may be disposed on and in contact with the entire region of the second face 531, so that the pixel light isolation structure 500 may be disposed on the light transmitting region 534 of the second face 531.
In some embodiments, as shown in fig. 28E, 28F, the light transmissive region 534 of the second face 531 of the second pixel unit 530 includes a partial region of the second face 531. In this case, the pixel light-isolation structure 500 may be disposed at and in contact with a corresponding partial region of the second face 531, so that the pixel light-isolation structure 500 may be disposed at the light-transmitting region 534 of the second face 531.
In some embodiments, as shown in fig. 28G, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 includes the entire region of the first side 521, and the light-transmissive region 534 of the second side 531 of the second pixel unit 530 includes the entire region of the second side 531. In this case, the pixel optical isolation structure 500 may be disposed on and in contact with the entire region of the first face 521 and the entire region of the second face 531, so that the pixel optical isolation structure 500 may be disposed on the light-transmissive region 533 of the first face 521 and the light-transmissive region 534 of the second face 531.
In some embodiments, as shown in fig. 28H and 28I, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 includes a partial region of the first side 521, the light-transmissive region 534 of the second side 531 of the second pixel unit 530 includes a partial region of the second side 531, and the light-transmissive region 533 of the first side 521 is coincident with the light-transmissive region 534 of the second side 531 (e.g., at least one of the position, shape, area, etc. is the same). In this case, the pixel optical isolation structure 500 may be disposed at respective partial regions of the first side 521 and the second side 531, and in contact with respective partial regions of the first side 521 and respective partial regions of the second side 531, so that the pixel optical isolation structure 500 may be disposed at the light transmissive region 534 of the first side 521 and the second side 531.
In some embodiments, as shown in fig. 28J, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 includes a partial region of the first side 521, the light-transmissive region 534 of the second side 531 of the second pixel unit 530 includes a partial region of the second side 531, and the light-transmissive region 533 of the first side 521 is not coincident with the light-transmissive region 534 of the second side 531 (e.g., at least one of the position, shape, area, etc. is not the same). In this case, the pixel optical isolation structure 500 may be disposed at respective partial regions of the first side 521 and the second side 531, and in contact with respective partial regions of the first side 521 and respective partial regions of the second side 531, so that the pixel optical isolation structure 500 may be disposed at the light transmissive region 534 of the first side 521 and the second side 531.
In some embodiments, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 may include the entire region of the first side 521, and the light-transmissive region 534 of the second side 531 of the second pixel unit 530 may include a partial region of the second side 531. In this case, the pixel optical isolation structure 500 may be disposed on and in contact with the entire region of the first face 521 and the partial region of the second face 531, so that the pixel optical isolation structure 500 may be disposed on the light transmissive region 534 of the first face 521 and the second face 531. Alternatively, the light-transmitting region 533 of the first side 521 of the first pixel unit 520 may include a partial region of the first side 521, and the light-transmitting region 534 of the second side 531 of the second pixel unit 530 may include the entire region of the second side 531. In this case, the pixel optical isolation structure 500 may be disposed on and in contact with the partial region of the first face 521 and the entire region of the second face 531, so that the pixel optical isolation structure 500 may be disposed on the light transmissive region 534 of the first face 521 and the second face 531.
In some embodiments, as shown in fig. 28K, the light-transmitting region 533 of the first side 521 of the first pixel unit 520 includes the entire region of the first side 521 and the entire region of the second side 531. In this case, the pixel optical isolation structure 500 may be disposed between all regions of the first side 521 and all regions of the second side 531 without contacting the first side 521 and the second side 531, so that the pixel optical isolation structure 500 may be disposed between the light-transmissive region 533 of the first side 521 and the light-transmissive region 534 of the second side 531.
In some embodiments, as shown in fig. 28L and 28M, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 includes a partial region of the first side 521, the light-transmissive region 534 of the second side 531 of the second pixel unit 530 includes a partial region of the second side 531, and the light-transmissive region 533 of the first side 521 is coincident with the light-transmissive region 534 of the second side 531 (e.g., at least one of the position, shape, area, etc. is the same). In this case, the pixel optical isolation structure 500 may be disposed between the respective partial regions of the first and second sides 521 and 531 without contacting the first and second sides 521 and 531, so that the pixel optical isolation structure 500 may be disposed between the light-transmissive region 533 of the first side 521 and the light-transmissive region 534 of the second side 531.
In some embodiments, as shown in fig. 28N, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 includes a partial region of the first side 521, the light-transmissive region 534 of the second side 531 of the second pixel unit 530 includes a partial region of the second side 531, and the light-transmissive region 533 of the first side 521 is not coincident with the light-transmissive region 534 of the second side 531 (e.g., at least one of the position, shape, area, etc. is not the same). In this case, the pixel optical isolation structure 500 may be disposed between the respective partial regions of the first side 521 and the respective partial regions of the second side 531 without contacting the first side 521 and the second side 531, so that the pixel optical isolation structure 500 may be disposed between the light transmissive regions 534 of the first side 521 and the second side 531.
In some embodiments, the light-transmissive region 533 of the first side 521 of the first pixel unit 520 may include the entire region of the first side 521, and the light-transmissive region 534 of the second side 531 of the second pixel unit 530 may include a partial region of the second side 531. In this case, the pixel optical isolation structure 500 may be disposed between the entire region of the first side 521 and a partial region of the second side 531 without contacting the first side 521 and the second side 531, so that the pixel optical isolation structure 500 may be disposed between the light transmissive regions 534 of the first side 521 and the second side 531. Alternatively, the light-transmitting region 533 of the first side 521 of the first pixel unit 520 may include a partial region of the first side 521, and the light-transmitting region 534 of the second side 531 of the second pixel unit 530 may include the entire region of the second side 531. In this case, the pixel optical isolation structure 500 may be disposed between the partial region of the first side 521 and the entire region of the second side 531 without contacting the first side 521 and the second side 531, so that the pixel optical isolation structure 500 may be disposed between the light transmissive regions 534 of the first side 521 and the second side 531.
In some embodiments, the light transmissive regions 533, 534 of the pixel unit 411 may be continuous regions. In this case, the pixel optical isolation structure 500 can be disposed in the continuous region with or without contact with the continuous region, such that the pixel optical isolation structure 500 can be disposed in the light transmissive regions 533, 534 of the pixel cell 411. Alternatively, the light-transmitting regions 533, 534 of the pixel unit 411 may be discontinuous regions. In this case, the pixel optical isolation structure 500 may be disposed in the discontinuous region, with or without contact with the discontinuous region, so that the pixel optical isolation structure 500 may be disposed in the light transmissive regions 533, 534 of the pixel unit 411. Alternatively, the positions, the number, and the like of the discontinuous regions for disposing the pixel optical isolation structure 500 may be determined according to the actual light transmission condition such as the process requirement, so that the pixel optical isolation structure 500 may be disposed on the light-transmitting regions 533, 534 of the pixel unit 411 which are present in the discontinuous regions.
In some embodiments, the light- transmissive regions 533, 534 of the pixel unit 411 may be determined according to actual light-transmissive conditions such as process requirements, and the like, and accordingly, the pixel optical isolation structure 500 is disposed between the light- transmissive regions 533, 534 of the pixel unit 411 or between the light- transmissive regions 533, 534 of two adjacent pixel units 411. Alternatively, the light-transmitting regions 533, 534 may include part or all of the pixel units 411, may be in the form of a continuous region or a discontinuous region, and the corresponding positions, numbers, etc. may be determined according to the actual light-transmitting conditions such as the process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by the two adjacent pixel units 411 from being transmitted in an undesired direction (for example, the light emitted by the first pixel unit 520 and the second pixel unit 530 are transmitted to each other).
In some embodiments, referring to the respective exemplary structures in fig. 1, 25A, 25B, 25C, 26D, 26E, 27A, 27B, 27C, 27D, 28A, 28B, 28C, 28D, 28E, 28F, 28G, 28H, 28I, 28J, 28K, 28L, 28M, 28N, some or all of the pixel optical isolation structures 500 may be a single, integrally closed structure, for example: in a longitudinal cross section of the light emitting module 100, some or all of the pixel optical isolation structures 500 may be a single integral closed structure. Alternatively, some or all of the pixel optical isolation structures 500 may be a complete unitary body, excluding split structures formed by stitching or the like. Alternatively, some or all of the surfaces (or may be referred to as outer contours) in the pixel optical isolation structure 500 may be closed, without openings, such that the corresponding pixel optical isolation structure 500 is formed as a closed structure.
In some embodiments, some or all of the pixel optical isolation structures 500 as a single unitary closed structure can be solid structures, or hollow structures.
In some embodiments, some or all of the pixel optical isolation structures 500 may be different from the complete unitary body described above, but include split structures formed in a tiled or the like manner. Alternatively, some or all of the surfaces (or can be referred to as outer contours) in the pixel optical isolation structure 500 can be non-closed, with openings, such that the pixel optical isolation structure 500 is formed as a non-closed structure (or can be referred to as an open structure).
In some embodiments, part or all of the pixel optical isolation structure 500 may be a single integral closed structure or a non-closed structure according to practical conditions such as process requirements, or part or all of the pixel optical isolation structure 500 may be a solid structure or a hollow structure according to practical conditions such as process requirements, as long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in undesired directions (for example, the light emitted by the first pixel unit 520 and the second pixel unit 530 are conducted to each other).
Referring to fig. 29A, 29B, in some embodiments, the pixel optical isolation structure 500 and the light emitting element optical isolation structure 300 can be integrally formed or separate from each other.
In some embodiments, as shown in FIG. 29A, the pixel optical isolation structure 500 and the light emitting unit optical isolation structure 300 can be integrally formed. Alternatively, in fig. 29A, a dotted line between the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 may indicate that the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 are not two separate structures independent of each other, but one integrated structure, and the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 may be connected at the dotted line to form one integrated structure. Alternatively, in the process of forming the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300, the light-emitting unit optical isolation structure 300 may be formed first and then the pixel optical isolation structure 500 may be formed, or the pixel optical isolation structure 500 may be formed first and then the light-emitting unit optical isolation structure 300 may be formed, or both the light-emitting unit optical isolation structure 300 and the pixel optical isolation structure 500 may be formed.
In some embodiments, as shown in FIG. 29B, the pixel optical isolation structure 500 and the light emitting unit optical isolation structure 300 can be independent of each other. Alternatively, in fig. 29B, a solid line between the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 may indicate that the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 are not one integral structure integrally molded, but two split-type structures independent of each other, and the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 may be separated at the solid line to form the two split-type structures. Alternatively, in the process of forming the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300, the light-emitting unit optical isolation structure 300 may be formed first and then the pixel optical isolation structure 500 may be formed, or the pixel optical isolation structure 500 may be formed first and then the light-emitting unit optical isolation structure 300 may be formed, or both the light-emitting unit optical isolation structure 300 and the pixel optical isolation structure 500 may be formed.
In some embodiments, the pixel optical isolation structure 500 can be molded in one piece with the light-emitting unit optical isolation structure 300, whether the pixel optical isolation structure 500 is integrally molded with the light-emitting unit optical isolation structure 300 or independent of each other.
In some embodiments, the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 may be configured as an integral structure or separate structures independent of each other according to practical situations such as process requirements. Alternatively, the pixel optical isolation structure 500 and the light-emitting unit optical isolation structure 300 may be formed in one step or sequentially according to practical situations such as process requirements.
Referring to fig. 29B, 30A in conjunction with fig. 1, in some embodiments, the pixel optical isolation structure 500 and the light emitting element optical isolation structure 300 can be independent of each other. Alternatively, the pixel optical isolation structure 500 and the light emitting cell layer 110 may be in direct contact.
In some embodiments, whether or not the pixel optical isolation structure 500 is in direct contact with the light emitting cell layer 110, the pixel optical isolation structure 500 and the light emitting cell optical isolation structure 300 may be in direct contact, or a gap may exist between them and the light emitting cell optical isolation structure 300. Alternatively, other media may be present or other structures may be provided in the region where a gap exists between the pixel optical isolation structure 500 and the light emitting cell optical isolation structure 300.
Referring to fig. 30A, 30B, 30C, in some embodiments, the first contact surface 540 of the pixel optical isolation structure 500 can be in direct contact with the second contact surface 340 of the light emitting unit optical isolation structure 300. Alternatively, the area of the first contact surface 540 may be the same as or different from the area of the second contact surface 340.
In some embodiments, as shown in FIG. 30A, the first contact surface 540 of the pixel optical isolation structure 500 is in direct contact with the second contact surface 340 of the light-emitting unit optical isolation structure 300, the area of the first contact surface 540 being the same as the area of the second contact surface 340.
In some embodiments, as shown in FIG. 30B, the first contact surface 540 of the pixel optical isolation structure 500 is in direct contact with the second contact surface 340 of the light emitting cell optical isolation structure 300, the area of the first contact surface 540 being different from the area of the second contact surface 340.
In some embodiments, as shown in FIG. 30C, the first contact surface 540 of the pixel optical isolation structure 500 is in direct contact with the second contact surface 340 of the light-emitting unit optical isolation structure 300, the area of the first contact surface 540 being the same as the area of the second contact surface 340.
Referring to fig. 30A, 30B, 30C, in some embodiments, the first contact surface 540 of the pixel optical isolation structure 500 can be in direct contact with the second contact surface 340 of the light emitting unit optical isolation structure 300. Optionally, the first contact surface 540 may or may not coincide with the second contact surface 340.
In some embodiments, as shown in FIG. 30A, the first contact surface 540 of the pixel optical isolation structure 500 is in direct contact with the second contact surface 340 of the light-emitting unit optical isolation structure 300, the first contact surface 540 being coincident with the second contact surface 340. Alternatively, the first contact surface 540 may be considered to be completely coincident with the second contact surface 340.
In some embodiments, as shown in FIG. 30B, the first contact surface 540 of the pixel optical isolation structure 500 is in direct contact with the second contact surface 340 of the light emitting unit optical isolation structure 300, the first contact surface 540 being non-coincident with the second contact surface 340. Alternatively, the first contact surface 540 and the second contact surface 340 may be considered to not completely coincide, but partially coincide.
In some embodiments, as shown in FIG. 30C, the first contact surface 540 of the pixel optical isolation structure 500 is in direct contact with the second contact surface 340 of the light-emitting unit optical isolation structure 300, the first contact surface 540 being non-coincident with the second contact surface 340. Alternatively, the first contact surface 540 and the second contact surface 340 may be considered to not completely coincide, but partially coincide.
In some embodiments, the area of the first contact surface 540 and the area of the second contact surface 340 may be the same or different according to the actual process requirements and the like. Optionally, the first contact surface 540 and the second contact surface 340 may be configured to coincide (e.g., completely coincide) or not coincide (e.g., not completely coincide, but partially coincide) according to the practical requirements of the process, etc. Alternatively, in the case where the area of the first contact surface 540 is the same as the area of the second contact surface 340, the first contact surface 540 and the second contact surface 340 may coincide (e.g., completely coincide) or not coincide (e.g., not completely coincide, but partially coincide); in the case where the area of the first contact surface 540 is different from the area of the second contact surface 340, the first contact surface 540 and the second contact surface 340 may not be coincident (e.g., not completely coincident, but partially coincident).
Referring to FIG. 31, in some embodiments, a pixel optical isolation structure 500 can include a pixel optical isolation body 501.
Referring to fig. 32, in some embodiments, a pixel optical isolation body 501 may contain an optical isolation material 302.
Referring to FIG. 33, in some embodiments, the pixel optical isolation structure 500 can further include: the spacer structure 503 is disposed between the pixel optical isolation body 501 and the pixel unit 411 that needs optical isolation.
Referring to fig. 34A, 34B, 34C, in some embodiments, a spacer structure 503 may be disposed between the pixel optical isolation body 501 and at least one of two adjacent pixel cells 411.
In some embodiments, as shown in fig. 34A, in the case where two adjacent pixel cells 411 include a first pixel cell 520, a second pixel cell 530, a spacing structure 503 is disposed between the pixel optical isolation body 501 and the first pixel cell 520.
In some embodiments, as shown in fig. 34B, where two adjacent pixel cells 411 include a first pixel cell 520, a second pixel cell 530, a spacing structure 503 is disposed between the pixel optical isolation body 501 and the second pixel cell 530.
In some embodiments, as shown in fig. 34C, in the case where two adjacent pixel units 411 include a first pixel unit 520 and a second pixel unit 530, a spacer structure 503 is provided between the pixel optical isolation body 501 and the first pixel unit 520, and a spacer structure 503 is also provided between the pixel optical isolation body 501 and the second pixel unit 530.
In some embodiments, the arrangement position of the spacer structure 503 may be considered according to practical situations such as process requirements, as long as the pixel optical isolation body 501 can be spaced apart from the adjacent pixel unit 411.
Referring to fig. 35A, 35B, 35C, 35D, 35E, in some embodiments, the spacing structure 503 may cover part or all of the pixel optical isolation body 501.
In some embodiments, as shown in fig. 35A, 35B, 35C, 35D, the spacer structure 503 may cover a portion of the pixel optical isolation body 501, such as: the pixel light-isolating body 501 has one, two, three, or more sides.
In some embodiments, as shown in fig. 35E, the spacer structure 503 may cover the entirety of the pixel optical isolation body 501.
In some embodiments, the arrangement of the spacer structure 503 (e.g., covering part or all of the pixel optical isolation body 501) may be considered according to the actual conditions such as process requirements, as long as the pixel optical isolation body 501 can be spaced apart from the adjacent pixel units 411.
Referring to fig. 36A, 36B, 36C, 36D, 36E, in some embodiments, the spacing structure 503 may contact at least one of the adjacent two pixel units 411. Alternatively, the spacing structure 503 may not contact the adjacent two pixel units 411.
In some embodiments, as shown in fig. 36A, in the case where the two adjacent pixel units 411 include a first pixel unit 520 and a second pixel unit 530, the spacing structure 503 is in contact with the first pixel unit 520, and is not in contact with the second pixel unit 530.
In some embodiments, as shown in fig. 36B, in the case where the two adjacent pixel units 411 include a first pixel unit 520 and a second pixel unit 530, the spacing structure 503 is in contact with the second pixel unit 530, and is not in contact with the first pixel unit 520.
In some embodiments, as shown in fig. 36C, in the case where the two adjacent pixel units 411 include the first pixel unit 520 and the second pixel unit 530, the spacer structure 503 as a single body contacts both the first pixel unit 520 and the second pixel unit 530.
In some embodiments, as shown in fig. 36D, in the case where the two adjacent pixel units 411 include a first pixel unit 520 and a second pixel unit 530, one of the two relatively independent spacer structures 503 is in contact with the first pixel unit 520 and is not in contact with the second pixel unit 530, and the other spacer structure 503 is in contact with the second pixel unit 530 and is not in contact with the first pixel unit 520.
In some embodiments, as shown in fig. 36E, in the case that the two adjacent pixel units 411 include the first pixel unit 520 and the second pixel unit 530, the spacing structure 503 is not in contact with both the first pixel unit 520 and the second pixel unit 530.
In some embodiments, the arrangement of the spacer structure 503 (for example, contacting at least one of the two adjacent pixel units 411) may be considered according to the practical situation such as the process requirement, as long as the pixel optical isolation body 501 can be spaced apart from the adjacent pixel units 411.
In some embodiments, at least one of the pixel optical isolation body 501 and the spacer structure 503 can include an optical isolation material 302.
Referring to fig. 37A, 37B, 37C, 37D, in some embodiments, optical isolation material 302 may include at least one of a light absorbing material 3021, a light reflecting material 3022.
In some embodiments, as shown in FIG. 37A, optical isolation material 302 may include a light absorbing material 3021.
In some embodiments, as shown in FIG. 37B, the optical isolation material 302 may include an optical reflective material 3022.
In some embodiments, as shown in fig. 37C, 37D, optical isolation material 302 may include a light absorbing material 3021 and a light reflecting material 3022.
In some embodiments, the optical isolation material 302 can be set according to practical situations such as process requirements, as long as the optical isolation material 302 can effectively realize optical isolation. Alternatively, in the case where the light-absorbing material 3021 and the light-reflecting material 3022 are included in the optical isolation material 302, the positions, proportions, and the like of the light-absorbing material 3021 and the light-reflecting material 3022 to be provided may be considered in accordance with practical circumstances such as process requirements.
Referring to fig. 38A, 38B, 38C, 38D, 38E, 38F, 38G, 38H, in some embodiments, some or all of the shapes of the cross-sectional shapes of the pixel light isolation structures 500 in the light entrance direction Y of the light conversion layer 410 may include at least one of a right-angled quadrangle, a triangle, and a trapezoid.
In some embodiments, as shown in fig. 38A, the cross-sectional shape of the pixel optical isolation structure 500 in the light entrance direction Y of the light conversion layer 410 is a rectangular quadrilateral.
In some embodiments, as shown in fig. 38B, the cross-sectional shape of the pixel optical isolation structure 500 in the light entrance direction Y of the light conversion layer 410 includes two rectangular quadrangles, and the widths of the two rectangular quadrangles in the plane direction P of the light conversion layer 410 are different. Alternatively, a rectangular quadrangle having a relatively large width in the plane direction P of the light conversion layer 410 may be close to the light entrance side E of the light conversion layer 410, and a rectangular quadrangle having a relatively small width in the plane direction P of the light conversion layer 410 may be far from the light entrance side E of the light conversion layer 410. Alternatively, the relative positional relationship of the two rectangular parallelograms may be reversed from that shown in the figures, for example: a rectangular quadrangle having a relatively small width in the plane direction P of the light conversion layer 410 may be close to the light incident side E of the light conversion layer 410, and a rectangular quadrangle having a relatively large width in the plane direction P of the light conversion layer 410 may be far from the light incident side E of the light conversion layer 410.
In some embodiments, as shown in fig. 38C, the cross-sectional shape of the pixel light isolation structure 500 in the light entrance direction Y of the light conversion layer 410 is triangular. Alternatively, one side of the triangle may be close to the light incident side E of the light conversion layer 410. Alternatively, one side of the triangle may be away from the light-incident side E of the light conversion layer 410.
In some embodiments, as shown in fig. 38D, the sectional shape of the pixel optical isolation structure 500 in the light entrance direction Y of the light conversion layer 410 includes a rectangular quadrangle and a triangle. Alternatively, the rectangular quadrangle may be close to the light incident side E of the light conversion layer 410 and the triangle may be far from the light incident side E of the light conversion layer 410. Alternatively, the relative positional relationship of the rectangular quadrangle and the triangle may be reversed from that shown in the drawings, for example: the triangle may be close to the light incident side E of the light conversion layer 410, and the rectangular quadrilateral may be far away from the light incident side E of the light conversion layer 410. Alternatively, one side of the triangle may face the light incident side E of the light conversion layer 410, or face away from the light incident side E of the light conversion layer 410.
In some embodiments, as shown in FIG. 38E, the cross-sectional shape of the pixel light isolation structure 500 along the light-in direction Y of the light conversion layer 410 is trapezoidal. Alternatively, the lower base D of the trapezoid may face the light incident side E of the light conversion layer 410. Optionally, the lower base D of the trapezoid may face away from the light incident side E of the light conversion layer 410.
In some embodiments, as shown in fig. 38F, the cross-sectional shape of the pixel light isolation structure 500 in the light entrance direction Y of the light conversion layer 410 includes a trapezoid and a rectangular quadrangle. Alternatively, the rectangular quadrilateral may be away from the light incident side E of the light conversion layer 410 and the trapezoid may be close to the light incident side E of the light conversion layer 410. Alternatively, the lower base D of the trapezoid may face the light incident side E of the light conversion layer 410, or face away from the light incident side E of the light conversion layer 410.
In some embodiments, as shown in fig. 38G, the cross-sectional shape of the pixel optical isolation structure 500 in the light entrance direction Y of the light conversion layer 410 includes a trapezoid and a rectangular quadrangle. Alternatively, the rectangular quadrilateral can be close to the light incident side E of the light conversion layer 410, and the trapezoid can be far from the light incident side E of the light conversion layer 410. Alternatively, the lower base D of the trapezoid may face the light incident side E of the light conversion layer 410, or face away from the light incident side E of the light conversion layer 410.
In some embodiments, as shown in fig. 38H, the cross-sectional shape of the pixel light isolation structure 500 in the light entrance direction Y of the light conversion layer 410 includes a trapezoid and a triangle. Alternatively, the trapezoid may be close to the light incident side E of the light conversion layer 410, and the triangle may be far from the light incident side E of the light conversion layer 410. Alternatively, the relative positional relationship of the trapezoid and the triangle may be reversed from that shown in the drawings, for example: the trapezoid may be away from the light-incident side E of the light conversion layer 410, and the triangle may be close to the light-incident side E of the light conversion layer 410. Alternatively, the lower base D of the trapezoid may face the light incident side E of the light conversion layer 410, or face away from the light incident side E of the light conversion layer 410. Alternatively, one side of the triangle may face the light incident side E of the light conversion layer 410, or face away from the light incident side E of the light conversion layer 410.
In some embodiments, the cross-sectional shape of the pixel optical isolation structure 500 along the light incident direction Y of the light conversion layer 410 can be considered according to practical situations such as process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is conducted to each other).
In some embodiments, the pixel optical isolation structure 500 can include structures and materials that enable optical isolation, such as: at least one of metals such as silver and aluminum. Alternatively, the structure and material of the pixel optical isolation structure 500 may be determined according to practical situations such as process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is conducted to each other).
In some embodiments, the pixel optical isolation structure 500 may also include other structures and materials that can perform the functions of light absorption, light reflection, etc., such as: resin compositions, titanium oxides (e.g., TiO2), and the like. Alternatively, the material for realizing light absorption may also include a Black Matrix (BM). Alternatively, the structure and material of the pixel optical isolation structure 500 may be determined according to practical situations such as process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is conducted to each other).
In some embodiments, the plurality of pixel units 411 may include: at least one of the pixels and the sub-pixels.
In some embodiments, the plurality of pixel units 411 may include at least one pixel. Alternatively, the plurality of pixel units 411 may include at least one sub-pixel. Alternatively, the plurality of pixel units 411 may include at least one pixel, and at least one sub-pixel.
In some embodiments, the pixel units 411 may be arranged according to practical situations such as process requirements, so that the plurality of pixel units 411 include at least one of pixels and sub-pixels. Alternatively, whether pixels or sub-pixels are included, other display (e.g., photo-conversion) structures besides pixels or sub-pixels may be included in the pixel unit 411.
In some embodiments, at least two pixel cells 411 of the plurality of pixel cells 411 may contain the same or different light conversion materials. Alternatively, the main or all components in the light conversion material may include at least one of a phosphor, a quantum dot, and the like.
Referring to fig. 39, in some embodiments, a light conversion layer 410 may be disposed on the light emitting unit layer 110.
In some embodiments, some or all of the pixel optical isolation structures 500 can be in direct contact with the light emitting cell layer 110, or there can be a gap; for example: all of the pixel optical isolation structures 500 are in direct contact with the light emitting cell layer 110, or a portion of the pixel optical isolation structures 500 is in direct contact with the light emitting cell layer 110 and another portion is in gap with the light emitting cell layer 110, or all of the pixel optical isolation structures 500 are in gap with the light emitting cell layer 110. Alternatively, the light-isolating material may be partially or entirely provided at the gap between the pixel light-isolating structure 500 and the light-emitting cell layer 110.
In some embodiments, whether the pixel optical isolation structure 500 is in direct contact with the light emitting unit layer 100 may be considered according to practical situations such as process requirements, so long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (e.g., the light emitted by the first pixel unit 520 and the second pixel unit 530 are conducted to each other).
Referring to fig. 40, in some embodiments, the light conversion layer 410 may be disposed on the light emitting surface S of the light emitting unit layer 110. Alternatively, light from the light emitting unit layer 110 may be incident into the light conversion layer 410 via the light incident side E of the light conversion layer 410.
In some embodiments, some or all of the plurality of light emitting cells 111 may be an unpackaged structure.
In some embodiments, portions of the plurality of light emitting cells 111 may be unpackaged structures. Alternatively, one, two, three, or more of the plurality of light emitting units 111 may be only light emitting units capable of emitting light, which are completely arranged, and have no encapsulation structure such as an encapsulation layer for encapsulating the light emitting units without encapsulation processing, for example: at least one of the plurality of light emitting cells 111 may be a light emitting cell including a first semiconductor layer, an active layer, and a second semiconductor layer (or may further include an electrode) formed based on epitaxial growth or the like, but a package structure such as a package layer that packages the light emitting cell including the first semiconductor layer, the active layer, and the second semiconductor layer (or may further include an electrode) is not formed without a packaging process.
In some embodiments, all of the plurality of light emitting cells 111 may be an unpackaged structure. Alternatively, all of the plurality of light emitting units 111 may be only light emitting units capable of emitting light, which are completely arranged, and have no encapsulation structure such as an encapsulation layer encapsulating the light emitting units without encapsulation processing, for example: all of the plurality of light emitting cells 111 may be light emitting cells including a first semiconductor layer, an active layer, and a second semiconductor layer (or may further include an electrode) formed on the basis of epitaxial growth or the like, but without a packaging process, a packaging structure such as a packaging layer that packages the light emitting cells including the first semiconductor layer, the active layer, and the second semiconductor layer (or may further include an electrode) is not formed.
In some embodiments, some or all of the plurality of light emitting cells 111 may be an encapsulation structure. Alternatively, one, two, three or more of the plurality of light emitting units 111 may not only be the light emitting units capable of emitting light, but also be packaged to form a package structure such as a package layer for packaging the light emitting units, for example: at least one of the light emitting units 111 may be a light emitting unit including a first semiconductor layer, an active layer, and a second semiconductor layer (or may further include an electrode) formed by epitaxial growth or the like, and a package structure such as a package layer that packages the light emitting unit including the first semiconductor layer, the active layer, and the second semiconductor layer (or may further include an electrode) is formed through a packaging process.
In the case where part or all of the plurality of light emitting units 111 are package structures, the package structure in which one or more light emitting units 111 are packaged may be considered as one light emitting unit 111 as a whole, for example: one package structure includes one light emitting unit 111, and the package structure including the one light emitting unit 111 can be regarded as one light emitting unit 111; for another example: three light emitting units 111 are included in one package structure, and the package structure including the three light emitting units 111 can be regarded as one light emitting unit 111.
In some embodiments, part or all of the plurality of light emitting units 111 may be configured as an unpackaged structure according to practical situations such as process requirements, or the like, or part or all of the plurality of light emitting units 111 may be configured as an encapsulated structure according to practical situations such as process requirements, or the like.
In some embodiments, the plurality of light emitting units 111 may include: at least one of LED, Mini LED and Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one LED. Alternatively, the plurality of light emitting units 111 may include at least one Mini LED. Alternatively, the plurality of light emitting units 111 may include at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one LED, and at least one Mini LED. Alternatively, the plurality of light emitting units 111 may include at least one LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one Mini LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one LED, at least one Mini LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include other light emitting devices other than LEDs, Mini LEDs, Micro LEDs.
In some embodiments, the device type of the light emitting unit 111 may be determined according to practical situations such as process requirements, for example: LED, Mini LED, Micro LED or other light emitting device.
Referring to fig. 41, a display module 700 provided by the embodiment of the disclosure includes the light emitting module 100. In some embodiments, the display module 700 may support 3D display.
Referring to fig. 42, a display screen 800 provided by the embodiment of the disclosure includes the display module 700 described above. In some embodiments, display screen 800 may perform a 3D display.
Referring to fig. 43, a display 900 provided by the embodiment of the present disclosure includes the display screen 800 described above. In some embodiments, display 900 may perform 3D display. In some embodiments, the display 900 may also include other components for supporting the normal operation of the display 900, such as: at least one of a communication interface, a frame, a control circuit, and the like.
The embodiment of the present disclosure provides a lighting module, a display screen and a display, through setting up in the backlight isolation layer on the backlight surface of luminescence unit layer, set up luminescence unit optical isolation structure between two adjacent luminescence units in the part or whole of a plurality of luminescence units, and set up pixel optical isolation structure between two adjacent pixel units in the part or whole of a plurality of pixel units in the light conversion layer, avoid as far as possible the light that luminescence unit and light conversion layer sent to undesired direction conduction, be favorable to improving the display effect, still have the possibility of improving light utilization ratio.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising an …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.
Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It is clear to those skilled in the art that, for convenience and brevity of description, the working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit may be merely a division of a logical function, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In the drawings, the width, length, thickness, etc. of structures such as elements or layers may be exaggerated for clarity and descriptive purposes. When an element or layer is referred to as being "disposed on" (or "mounted on," "laid on," "attached to," "coated on," or the like) another element or layer, the element or layer may be directly "disposed on" or "over" the other element or layer, or intervening elements or layers may be present, or even partially embedded in the other element or layer.

Claims (58)

1. A light emitting module, comprising:
a light emitting cell layer including a plurality of light emitting cells;
the backlight isolation layer is arranged on the backlight surface of the light emitting unit layer;
a light conversion layer including a plurality of pixel units;
wherein a light-emitting unit optical isolation structure is arranged between two adjacent light-emitting units in part or all of the plurality of light-emitting units; in part or all of the plurality of pixel units, a pixel light isolation structure is arranged between two adjacent pixel units.
2. The illumination module as claimed in claim 1, wherein the backlight isolation layer comprises at least one of a backlight distributed bragg reflector DBR reflective layer, a backlight metal reflective layer, and a backlight absorption layer.
3. The lighting module according to claim 2,
the backlight isolation layer comprises at least one backlight DBR reflection layer; or
The backlight isolation layer comprises at least one backlight metal reflection layer; or
The backlight isolation layer comprises at least one backlight absorption layer; or
The backlight isolation layer comprises at least one backlight DBR reflection layer and at least one backlight metal reflection layer; or
The backlight isolation layer comprises at least one backlight DBR reflection layer and at least one backlight absorption layer; or
The backlight isolation layer comprises at least one backlight metal reflection layer and at least one backlight absorption layer; or
The backlight isolation layer comprises at least one backlight DBR reflection layer, at least one backlight metal reflection layer and at least one backlight absorption layer.
4. The illumination module according to claim 2 or 3, wherein the backlight isolation layer is provided with conductive holes for supporting the light emitting unit layers to be electrically connected.
5. The illumination module as claimed in claim 4, wherein the conductive holes are filled with a conductive material, the backlight isolation layer comprises at least one of at least one backlight DBR reflective layer and at least one backlight absorption layer, and at least one of the at least one backlight DBR reflective layer and the at least one backlight absorption layer is in direct contact with the conductive material.
6. The lighting module of claim 4, wherein the conductive holes are filled with a conductive material, the backlight isolation layer comprises at least one backlight metal reflective layer, and an insulating portion is disposed between the at least one backlight metal reflective layer and the conductive material.
7. The lighting module of claim 6, wherein part or all of the region in the insulating portion is provided with an optical isolation material.
8. The lighting module according to any one of claims 4 to 7, wherein an electrical connection layer is disposed on a side of the backlight isolation layer away from the light emitting unit layer.
9. The lighting module of claim 8, wherein the light emitting unit layer and the electrical connection layer are electrically connected through the conductive via.
10. The lighting module according to claim 8,
the backlight isolation layer comprises at least one backlight metal reflection layer, and the at least one backlight metal reflection layer is provided with an insulation layer insulated from the electric connection layer and the light emitting unit layer.
11. The lighting module of claim 10, wherein the insulating layer comprises at least one of:
the first insulating layer is arranged between the backlight metal reflecting layer and the electric connecting layer;
and the second insulating layer is arranged between the backlight metal reflecting layer and the light emitting unit layer.
12. The lighting module of claim 11, wherein at least one of the first and second insulating layers is partially or completely provided with an optical isolation material.
13. The lighting module of claim 1, wherein the backlight isolation layer is directly disposed on a backlight surface of the light emitting unit layer.
14. The lighting module of claim 13, wherein the backlight isolation layer is bonded to the backlight surface of the light emitting unit layer.
15. The lighting module of claim 1, wherein the backlight isolation layer is disposed on a part or all of the backlight surface of the light emitting unit layer.
16. The lighting module of claim 15, wherein the backlight isolation layer is disposed in a light-transmitting region of a backlight surface of the light-emitting unit layer.
17. The lighting module according to any one of claims 1 to 16, wherein the light isolation structure of the light emitting unit is disposed in a part or all of the region between two adjacent light emitting units.
18. The lighting module of claim 17, wherein a light emitting unit spacing region is disposed between two adjacent light emitting units, and the light emitting unit optical isolation structure is disposed in part or all of the light emitting unit spacing region.
19. The lighting module of claim 18, wherein the two adjacent lighting units comprise a first lighting unit and a second lighting unit, the first lighting unit comprises a first surface adjacent to the second lighting unit, and the second lighting unit comprises a second surface adjacent to the first lighting unit;
the light-emitting unit optical isolation structure is arranged on at least one of the first surface and the second surface or is not in contact with the first surface and the second surface.
20. The lighting module of claim 19, wherein the light-emitting unit optical isolation structure is disposed in the light-transmissive region of at least one of the first and second surfaces.
21. The lighting module according to any one of claims 17 to 20, wherein the light-emitting unit optical isolation structure is in direct contact with the backlight isolation layer or has a gap with the backlight isolation layer.
22. The lighting module of any one of claims 17 to 20, wherein the lighting unit optical isolation structure comprises a lighting unit optical isolation body.
23. The lighting module of claim 22, wherein the light-isolating body of the lighting unit is non-conductive and comprises a light-isolating material.
24. The lighting module of claim 22, wherein the lighting unit optically isolating body is electrically conductive;
the light-emitting unit optical isolation structure further includes: insulation system, set up in luminescence unit light isolation main part, with need insulate in between the luminescence unit of luminescence unit light isolation main part.
25. The lighting module of claim 24, wherein the insulating structure is disposed between the lighting unit light isolating body and at least one of the two adjacent lighting units.
26. The lighting module of claim 25, wherein the insulating structure covers part or all of the light-isolating body of the lighting unit.
27. The lighting module of claim 24, wherein at least one of the light isolating body and the insulating structure of the lighting unit comprises a light isolating material.
28. The lighting module of claim 24,
the insulating structure is in contact with at least one of the two adjacent light emitting units; or
The insulating structure does not contact the two adjacent light emitting cells.
29. The lighting module of claim 1, wherein some or all of the cross-sectional shapes of the light-emitting unit optical isolation structures along the light-exiting direction of the light-emitting unit layer comprise at least one of a rectangular quadrilateral, a triangle and a trapezoid.
30. The lighting module of claim 29, wherein the cross-sectional shape of the lighting unit optical isolation structure along the light exiting direction of the lighting unit layer comprises a trapezoid, and the upper base of the trapezoid faces the light exiting side of the lighting unit layer.
31. The lighting module of any one of claims 1 to 30, wherein the pixel optical isolation structure is disposed in a part or all of a region between two adjacent pixel units.
32. The lighting module of claim 31, wherein a pixel isolation region is disposed between two adjacent pixel units, and the pixel optical isolation structure is disposed in part or all of the pixel isolation region.
33. The light emitting module of claim 32, wherein the two adjacent pixel units comprise a first pixel unit and a second pixel unit, the first pixel unit comprises a first surface adjacent to the second pixel unit, and the second pixel unit comprises a second surface adjacent to the first pixel unit;
wherein the pixel optical isolation structure is disposed on at least one of the first and second surfaces or does not contact the first and second surfaces.
34. The lighting module of claim 33, wherein the pixel optical isolation structure is disposed in the light transmissive region of at least one of the first and second surfaces.
35. The lighting module of claim 31, wherein the pixel optical isolation structure is a single unitary closed structure.
36. The lighting module of any one of claims 31 to 35, wherein the pixel optical isolation structure is integrally formed with the light-emitting unit optical isolation structure or is separate therefrom.
37. The lighting module of claim 36,
the pixel optical isolation structure and the light-emitting unit optical isolation structure are independent;
the pixel optical isolation structure is in direct contact with the light emitting unit layer.
38. The lighting module of claim 37, wherein the pixel optical isolation structure is in direct contact with the light-emitting unit optical isolation structure or has a gap with the light-emitting unit optical isolation structure.
39. The lighting module of claim 38,
the first contact surface of the pixel optical isolation structure is in direct contact with the second contact surface of the light-emitting unit optical isolation structure;
the area of the first contact surface is the same as or different from the area of the second contact surface.
40. The lighting module of claim 38,
the first contact surface of the pixel optical isolation structure is in direct contact with the second contact surface of the light-emitting unit optical isolation structure;
the first contact surface may or may not coincide with the second contact surface.
41. The lighting module of any one of claims 31 to 40, wherein the pixel optical isolation structure comprises a pixel optical isolation body.
42. The lighting module of claim 41, wherein the pixel optical isolation body comprises an optical isolation material.
43. The lighting module of claim 41, wherein the pixel optical isolation structure further comprises: and the spacing structure is arranged between the pixel optical isolation main body and the pixel unit needing optical isolation.
44. The lighting module of claim 43, wherein the spacer structure is disposed between the pixel optical isolation body and at least one of the two adjacent pixel cells.
45. The lighting module of claim 44, wherein the spacer structure covers part or all of the pixel optical isolation body.
46. The lighting module of claim 43, wherein at least one of the pixel light isolating body and the spacer structure comprises a light isolating material.
47. A lighting module as recited in claim 7, 12, 23, 27, 42 or 46, wherein said optical isolation material comprises at least one of a light absorbing material and a light reflecting material.
48. The lighting module of claim 1, wherein some or all of the cross-sectional shapes of the pixel optical isolation structures along the incident light direction of the light conversion layer comprise at least one of a rectangular quadrilateral, a triangle and a trapezoid.
49. The lighting module of claim 48, wherein the cross-sectional shape of the pixel optical isolation structure along the incident light direction of the light conversion layer comprises a trapezoid, and the lower base of the trapezoid faces the incident light side of the light conversion layer.
50. The illumination module of claim 1, wherein the plurality of pixel units comprises:
at least one of the pixels and the sub-pixels.
51. The light emitting module of claim 50, wherein at least two of the plurality of pixel cells comprise the same or different light conversion materials.
52. The light emitting module according to any one of claims 1 to 51, wherein the light conversion layer is disposed on the light emitting unit layer.
53. The light emitting module as claimed in claim 52, wherein the light conversion layer is disposed on the light emitting surface of the light emitting unit layer.
54. The lighting module of claim 1, wherein some or all of the plurality of lighting units are unpackaged structures.
55. The illumination module of claim 1, wherein the plurality of illumination units comprise:
at least one of a light emitting diode LED, a Mini LED and a Micro LED.
56. A display module comprising the light-emitting module according to any one of claims 1 to 55.
57. A display screen comprising the display module of claim 56.
58. A display comprising a display screen as claimed in claim 57.
CN202010440096.9A 2020-05-22 2020-05-22 Light-emitting module, display screen and display Pending CN113707042A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202010440096.9A CN113707042A (en) 2020-05-22 2020-05-22 Light-emitting module, display screen and display
PCT/CN2021/090661 WO2021233104A1 (en) 2020-05-22 2021-04-28 Light-emitting module, display module, display screen and display
TW110118237A TWI776517B (en) 2020-05-22 2021-05-20 Light-emitting module, display module, display screen and display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010440096.9A CN113707042A (en) 2020-05-22 2020-05-22 Light-emitting module, display screen and display

Publications (1)

Publication Number Publication Date
CN113707042A true CN113707042A (en) 2021-11-26

Family

ID=78646135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010440096.9A Pending CN113707042A (en) 2020-05-22 2020-05-22 Light-emitting module, display screen and display

Country Status (3)

Country Link
CN (1) CN113707042A (en)
TW (1) TWI776517B (en)
WO (1) WO2021233104A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2505118T3 (en) * 2003-11-21 2014-10-09 Visual Physics, Llc Imaging system and micro-optical security
JP4924941B2 (en) * 2006-10-13 2012-04-25 Ｎｌｔテクノロジー株式会社 Optical elements, illumination optical devices, display devices, and electronic devices.
US9496524B2 (en) * 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
CN104143564A (en) * 2014-07-22 2014-11-12 京东方科技集团股份有限公司 OLED panel and display device
TW201727275A (en) * 2015-11-05 2017-08-01 康寧公司 Light-emitting unit with fresnel optical system and light-emitting apparatus and display system using same
CN105607346A (en) * 2016-03-28 2016-05-25 深圳市华星光电技术有限公司 Graphene backlight module and liquid crystal display device
CN106833649A (en) * 2017-02-15 2017-06-13 纳晶科技股份有限公司 Embedded photoluminescent material, the preparation method of light conversion film piece, light conversion film piece and display device
KR102451309B1 (en) * 2017-10-31 2022-10-05 엘지디스플레이 주식회사 Backlight unit and liquid crystal display using the same
CN108279528B (en) * 2018-01-17 2021-05-28 惠州市华星光电技术有限公司 Backlight source
KR102600928B1 (en) * 2018-07-05 2023-11-14 삼성디스플레이 주식회사 Light emitting display device and fabricating method of the same
CN209216471U (en) * 2018-11-08 2019-08-06 深圳市瑞丰光电子股份有限公司 A kind of light source assembly, backlight module and display module
CN209044246U (en) * 2018-12-13 2019-06-28 信利半导体有限公司 Array substrate, liquid crystal display panel and liquid crystal display
CN109509781A (en) * 2018-12-29 2019-03-22 Oppo广东移动通信有限公司 OLED pixel structure, OLED display screen and electronic equipment
CN110416247B (en) * 2019-07-31 2021-09-14 成都辰显光电有限公司 Display assembly, display panel and display device
CN210323689U (en) * 2019-09-18 2020-04-14 昆山维信诺科技有限公司 Composite quantum dot film layer and display device
CN212624645U (en) * 2020-05-22 2021-02-26 北京芯海视界三维科技有限公司 Light-emitting module, display screen and display

Also Published As

Publication number Publication date
TWI776517B (en) 2022-09-01
WO2021233104A1 (en) 2021-11-25
TW202144824A (en) 2021-12-01

Similar Documents

Publication Publication Date Title
CN212624645U (en) Light-emitting module, display screen and display
CN212624643U (en) Light-emitting module, display screen and display
CN112713228B (en) Light emitting unit, light emitting device, and display device
CN108735786B (en) Organic light emitting display panel and organic light emitting display device
CN103210510B (en) Opto-electronic semiconductor module
CN108400155B (en) OLED double-sided display panel and preparation method thereof
CN102007608A (en) Led light source device, backlight device and liquid crystal display device
CN212624646U (en) Light-emitting module, display screen and display
CN212624642U (en) Light-emitting module, display screen and display
CN212624644U (en) Light-emitting module, display screen and display
CN111416031A (en) Double-side miniature LED display
TWI802322B (en) Light emitting modules, display modules, display screens and monitors
CN112736169A (en) Light emitting device and display apparatus
CN113707042A (en) Light-emitting module, display screen and display
EP2815437B1 (en) Light-emitting diode and method of manufacturing a light-emitting diode
CN113707041A (en) Light-emitting module, display screen and display
CN113707039A (en) Light-emitting module, display screen and display
CN113707038A (en) Light-emitting module, display screen and display
CN212230428U (en) Display module and display panel
CN113707037A (en) Light-emitting module, display screen and display
US20230352638A1 (en) Display panel and display apparatus
US11211533B2 (en) Optoelectronic component and display device
CN112713143A (en) Light emitting device and display device
WO2023089947A1 (en) Semiconductor light emitting device and semiconductor light emitting module
CN114122217A (en) Light emitting device and display apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination