CN113613462B - Data center heat dissipation method and system - Google Patents

Data center heat dissipation method and system Download PDF

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CN113613462B
CN113613462B CN202110876444.1A CN202110876444A CN113613462B CN 113613462 B CN113613462 B CN 113613462B CN 202110876444 A CN202110876444 A CN 202110876444A CN 113613462 B CN113613462 B CN 113613462B
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heat dissipation
target
feature vector
temperature data
heat
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CN113613462A (en
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张军
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Shanghai DC Science Co Ltd
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Shanghai DC Science Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Thermometers specially adapted for specific purposes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00Measuring quantity of heat
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

According to the data center heat dissipation method and system, the first heat dissipation feature vector and the second heat dissipation feature vector are obtained, a third heat generation area range exists between the first heat generation area range and the second heat generation area range, the first heat dissipation feature vector and the second heat dissipation feature vector are integrated into the first target heat dissipation feature vector, the first target heat dissipation feature vector and corresponding first related temperature data are input into the first target feature vector, the purpose of integrating the first heat dissipation feature vector and the second heat dissipation feature vector according to overheat data is achieved, therefore the temperature feature vector is integrated into a temperature feature vector set, the feature vector data integration capability of the system is optimized, the temperature feature vector can be timely processed, the technical problem that in the prior art, the temperature feature vector set caused by the phenomenon that the frequent temperature is too high in the heat dissipation process cannot be accurately displayed is solved, and the limit pressure caused to the system is further solved.

Description

Data center heat dissipation method and system
Technical Field
The application relates to the technical field of data processing, in particular to a data center heat dissipation method and system.
Background
With the continuous development of the data center, the data volume is continuously increased, so that the heat productivity of the data center is required to be detected, the temperature of the data center can be timely known to perform heat dissipation work, and the work efficiency of the data center is improved, and the paralysis of the data center is avoided. However, there are also some drawbacks in the process of dissipating heat.
Disclosure of Invention
In view of the above, the present application provides a data center heat dissipation method and system.
In a first aspect, a method for dissipating heat in a data center is provided, including:
in the heat dissipation process of target temperature data, a first heat dissipation feature vector is obtained, wherein the first heat dissipation feature vector is obtained by dissipating heat of the target temperature data in a first heat generation area range;
acquiring a second heat radiation characteristic vector, wherein the second heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a second heating area range;
on the premise that a third heating area range exists between the first heating area range and the second heating area range, and the first heating area range, the second heating area range and the third heating area range are overlapped to conform to a preset heating area range, integrating the first heat radiation characteristic vector and the second heat radiation characteristic vector into a first target heat radiation characteristic vector, wherein the third heating area range is the heating area range for overheat heat radiation of the target temperature data;
And inputting the first target heat dissipation characteristic vector and corresponding first related temperature data into a first target characteristic vector, wherein the first related temperature data is used for describing the first target heat dissipation characteristic vector.
Further, the first correlated temperature data includes at least one of:
the heat dissipation device comprises first heat data, first temperature data and first final temperature data, wherein the first heat data represent initial time and end time of the third heat generation area range, the first temperature data comprise primary temperature data and secondary temperature data, the primary temperature data represent all key temperature values in cycle time in the first target heat dissipation feature vector, the secondary temperature data represent key temperature values in the cycle time in the first target heat dissipation feature vector and primary temperature data in a second target heat dissipation feature vector, the first final temperature data comprise final temperature data in the second target heat dissipation feature vector, and the second target heat dissipation feature vector is the last heat dissipation feature vector adjacent to the first target heat dissipation feature vector in time.
Further, after the first target heat dissipation feature vector and the corresponding first related temperature data are input into the first target feature vector, the method further includes:
A third heat radiation characteristic vector is obtained, wherein the third heat radiation characteristic vector is obtained by radiating the target temperature data in a third heating area range, and the third heating area range and the second heating area range are continuous heating area ranges;
acquiring a fourth heat radiation characteristic vector, wherein the fourth heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a fourth heating area range;
integrating the third heat radiation feature vector and the fourth heat radiation feature vector into a third target heat radiation feature vector on the premise that a fifth heat radiation region range exists between the third heat radiation region range and the fourth heat radiation region range, and the third heat radiation region range, the fourth heat radiation region range and the fifth heat radiation region range are overlapped to conform to the preset heat radiation region range, wherein the fifth heat radiation region range is the heat radiation region range for overheat heat radiation of the target temperature data;
and inputting the third target heat dissipation characteristic vector and corresponding second related temperature data into a second target characteristic vector, wherein the second related temperature data is used for describing the third target heat dissipation characteristic vector.
Further, the second related temperature data includes at least one of:
the second heat data represents an initial time, a final time and the first heat data of the fifth heating area range, the second temperature data comprises three-level temperature data and four-level temperature data, the three-level temperature data represents all key temperature values in a cycle time in the second target heat dissipation feature vector, the four-level temperature data represents key temperature values in the cycle time in the third target heat dissipation feature vector and one-level temperature data in a fourth target heat dissipation feature vector, the second final temperature data comprises a final temperature in the third target heat dissipation feature vector, and the fourth target heat dissipation feature vector is a last heat dissipation feature vector adjacent to the third target heat dissipation feature vector in time.
Further, after the second target heat dissipation feature vector and the corresponding second related temperature data are input into the second target feature vector, the method further includes:
On the premise that M target heat dissipation feature vectors exist in the heat dissipation process of the target temperature data, inputting an Mth target heat dissipation feature vector and corresponding Mth related temperature data into a third target feature vector, wherein the Mth related temperature data is used for describing the Mth target heat dissipation feature vector, and M is a positive number greater than or equal to 1; wherein the Mth heat data in the Mth related temperature data comprises heat data of the (M-2) th target heat dissipation characteristic vector and heat data of the Mth target heat dissipation characteristic vector.
In a second aspect, a heat dissipation system of a data center is provided, including a data acquisition end and a data processing terminal, where the data acquisition end is in communication connection with the data processing terminal, and the data processing terminal is specifically configured to:
in the heat dissipation process of target temperature data, a first heat dissipation feature vector is obtained, wherein the first heat dissipation feature vector is obtained by dissipating heat of the target temperature data in a first heat generation area range;
acquiring a second heat radiation characteristic vector, wherein the second heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a second heating area range;
On the premise that a third heating area range exists between the first heating area range and the second heating area range, and the first heating area range, the second heating area range and the third heating area range are overlapped to conform to a preset heating area range, integrating the first heat radiation characteristic vector and the second heat radiation characteristic vector into a first target heat radiation characteristic vector, wherein the third heating area range is the heating area range for overheat heat radiation of the target temperature data;
and inputting the first target heat dissipation characteristic vector and corresponding first related temperature data into a first target characteristic vector, wherein the first related temperature data is used for describing the first target heat dissipation characteristic vector.
Further, the data processing terminal is specifically configured to:
the first correlated temperature data includes at least one of: the heat dissipation device comprises first heat data, first temperature data and first final temperature data, wherein the first heat data represent initial time and end time of the third heat generation area range, the first temperature data comprise primary temperature data and secondary temperature data, the primary temperature data represent all key temperature values in cycle time in the first target heat dissipation feature vector, the secondary temperature data represent key temperature values in the cycle time in the first target heat dissipation feature vector and primary temperature data in a second target heat dissipation feature vector, the first final temperature data comprise final temperature data in the second target heat dissipation feature vector, and the second target heat dissipation feature vector is the last heat dissipation feature vector adjacent to the first target heat dissipation feature vector in time.
Further, the data processing terminal is specifically further configured to:
a third heat radiation characteristic vector is obtained, wherein the third heat radiation characteristic vector is obtained by radiating the target temperature data in a third heating area range, and the third heating area range and the second heating area range are continuous heating area ranges;
acquiring a fourth heat radiation characteristic vector, wherein the fourth heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a fourth heating area range;
integrating the third heat radiation feature vector and the fourth heat radiation feature vector into a third target heat radiation feature vector on the premise that a fifth heat radiation region range exists between the third heat radiation region range and the fourth heat radiation region range, and the third heat radiation region range, the fourth heat radiation region range and the fifth heat radiation region range are overlapped to conform to the preset heat radiation region range, wherein the fifth heat radiation region range is the heat radiation region range for overheat heat radiation of the target temperature data;
and inputting the third target heat dissipation characteristic vector and corresponding second related temperature data into a second target characteristic vector, wherein the second related temperature data is used for describing the third target heat dissipation characteristic vector.
Further, the data processing terminal is specifically configured to:
the second correlated temperature data includes at least one of: the second heat data represents an initial time, a final time and the first heat data of the fifth heating area range, the second temperature data comprises three-level temperature data and four-level temperature data, the three-level temperature data represents all key temperature values in a cycle time in the second target heat dissipation feature vector, the four-level temperature data represents key temperature values in the cycle time in the third target heat dissipation feature vector and one-level temperature data in a fourth target heat dissipation feature vector, the second final temperature data comprises a final temperature in the third target heat dissipation feature vector, and the fourth target heat dissipation feature vector is a last heat dissipation feature vector adjacent to the third target heat dissipation feature vector in time.
Further, the data processing terminal is specifically further configured to:
on the premise that M target heat dissipation feature vectors exist in the heat dissipation process of the target temperature data, inputting an Mth target heat dissipation feature vector and corresponding Mth related temperature data into a third target feature vector, wherein the Mth related temperature data is used for describing the Mth target heat dissipation feature vector, and M is a positive number greater than or equal to 1; wherein the Mth heat data in the Mth related temperature data comprises heat data of the (M-2) th target heat dissipation characteristic vector and heat data of the Mth target heat dissipation characteristic vector.
According to the data center heat dissipation method and system, the first heat dissipation feature vector is obtained in the heat dissipation process of the target temperature data, the first heat dissipation feature vector is the heat dissipation feature vector obtained by heat dissipation of the target temperature data in the first heat generation region range, the second heat dissipation feature vector is obtained by heat dissipation of the target temperature data in the second heat generation region range, the third heat generation region range exists between the first heat generation region range and the second heat generation region range, the first heat generation region range, the second heat generation region range and the third heat generation region range are overlapped and conform to the preset heat generation region range, the first heat dissipation feature vector and the second heat dissipation feature vector are integrated into the first target heat dissipation feature vector, the third heat generation region range is the heat generation region range of the target temperature data, the first target heat dissipation feature vector and the corresponding first related temperature data are input into the first target feature vector, the first related temperature data are used for describing the first target feature vector, the fact that the first heat generation region range and the second heat generation region range exist between the first heat generation region range and the second heat generation region range exist, the heat generation region range and the second heat generation region range are overlapped and conform to the preset heat generation region range, the heat dissipation feature vector is integrated into the first target temperature data, the heat dissipation feature vector is integrated, the heat dissipation feature vector is achieved, the temperature feature of the temperature feature vector is integrated in the target temperature data is integrated, and the temperature feature vector is integrated, the temperature feature information is high, the temperature feature information is integrated in the temperature feature is integrated, and the temperature feature is high temperature feature information is integrated, and the temperature feature is integrated in the temperature feature is high temperature feature frame is integrated, and the temperature feature is high temperature feature and can be integrated and the temperature feature temperature and is high temperature feature and is integrated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a heat dissipation method of a data center according to an embodiment of the present application.
Fig. 2 is a block diagram of a heat dissipating device for a data center according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a heat dissipation system of a data center according to an embodiment of the present application.
Detailed Description
In order to better understand the technical solutions described above, the following detailed description of the technical solutions of the present application is provided through the accompanying drawings and specific embodiments, and it should be understood that the specific features of the embodiments and embodiments of the present application are detailed descriptions of the technical solutions of the present application, and not limit the technical solutions of the present application, and the technical features of the embodiments and embodiments of the present application may be combined with each other without conflict.
Referring to fig. 1, a method for cooling a data center is shown, which may include the following steps 100 and 200.
Step 100, in the heat dissipation process of the target temperature data, a first heat dissipation feature vector is obtained.
The first heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating the target temperature data in a first heat generation area range.
Step 200, a second heat dissipation feature vector is obtained.
The second heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating the target temperature data in the second heat generation region.
Step 300, integrating the first heat dissipation feature vector and the second heat dissipation feature vector into a first target heat dissipation feature vector on the premise that a third heat generation region range exists between the first heat generation region range and the second heat generation region range, and the first heat generation region range, the second heat generation region range and the third heat generation region range overlap and accord with a preset heat generation region range.
The third heat generation region range is, for example, a heat generation region range in which the target temperature data is overheated and radiated.
Step 400, inputting the first target heat dissipation feature vector and the corresponding first related temperature data into the first target feature vector.
Illustratively, the first correlated temperature data is used to describe the first target heat dissipation feature vector.
It can be understood that, when the technical scheme described in the above steps 100-400 is executed, a first heat dissipation feature vector is obtained through heat dissipation of target temperature data in a first heat generation area range in the process of heat dissipation of target temperature data, a second heat dissipation feature vector is obtained, wherein the second heat dissipation feature vector is a heat dissipation feature vector obtained through heat dissipation of target temperature data in a second heat generation area range, a third heat generation area range exists between the first heat generation area range and the second heat generation area range, and the first heat generation area range, the second heat generation area range and the third heat generation area range are overlapped and conform to the preset heat generation area range, the first heat dissipation feature vector and the second heat dissipation feature vector are integrated into the first target heat dissipation feature vector, the third heat generation area range is the heat generation area range of target temperature data overheat heat dissipation, the first target heat dissipation feature vector and corresponding first related temperature data are input into the first target feature vector, the first related temperature data are used for describing the first target feature vector, a third heat generation area range exists between the first heat generation area range and the second heat generation area range, and the first heat generation area range and the second heat generation area range is overlapped and accords with the preset heat generation area range, the heat dissipation feature vector is integrated into the first target temperature heat dissipation feature vector, the heat dissipation feature vector is integrated, and the heat dissipation feature vector is integrated in the heat dissipation feature vector is high, and the heat dissipation feature vector can be integrated, and the heat dissipation feature of the heat dissipation feature vector can be integrated in the current feature vector is more than the current feature vector is achieved, and the temperature feature is integrated, and the temperature feature system can be integrated, and the technical problem is more accurately is more easily achieved, and the high, and the problem can be integrated and the feature and has high temperature feature and can be integrated.
In an alternative embodiment, the first related temperature data includes at least one of the following, and the specific steps are as described in step q 1.
Step q1, first heat data, first temperature data and first final temperature data, wherein the first heat data represents initial time and end time of the third heating area range, the first temperature data comprises primary temperature data and secondary temperature data, the primary temperature data represents all key temperature values in cycle time in the first target heat dissipation feature vector, the secondary temperature data represents key temperature values in cycle time in the first target heat dissipation feature vector and primary temperature data in a second target heat dissipation feature vector, the first final temperature data comprises final temperature data in the second target heat dissipation feature vector, and the second target heat dissipation feature vector is the last heat dissipation feature vector adjacent to the first target heat dissipation feature vector in time.
It can be appreciated that when the technical scheme described in the step q1 is executed, the accuracy of the heat dissipation feature vector is improved through the multi-dimensional data.
Based on the above-mentioned basis, after the first target heat dissipation feature vector and the corresponding first related temperature data are input into the first target feature vector, the following technical solutions described in steps w1 to w4 may be further included.
Step w1, a third heat dissipation feature vector is obtained, wherein the third heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating heat of the target temperature data in a third heat generation area range, and the third heat generation area range and the second heat generation area range are continuous heat generation area ranges.
And step w2, obtaining a fourth heat radiation characteristic vector, wherein the fourth heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a fourth heating area range.
And step w3, integrating the third heat radiation feature vector and the fourth heat radiation feature vector into a third target heat radiation feature vector on the premise that a fifth heat radiation region range exists between the third heat radiation region range and the fourth heat radiation region range, and the third heat radiation region range, the fourth heat radiation region range and the fifth heat radiation region range overlap and accord with the preset heat radiation region range, wherein the fifth heat radiation region range is the heat radiation region range for overheat heat radiation of the target temperature data.
And step w4, inputting the third target heat dissipation characteristic vector and corresponding second related temperature data into a second target characteristic vector, wherein the second related temperature data is used for describing the third target heat dissipation characteristic vector.
It can be appreciated that, when the technical solution described in the above steps w1 to w4 is executed, the integrity of the third target heat dissipation feature vector and the corresponding second related temperature data input into the second target feature vector is improved by acquiring the third heat dissipation feature vector and acquiring the fourth heat dissipation feature vector.
In an alternative embodiment, the second related temperature data includes at least one of the following, and the specific steps are as described in step e 1.
Step e1, second heat data, second temperature data, and second final temperature data, where the second heat data represents an initial time, a final time, and the first heat data of the fifth heat generating region range, the second temperature data includes three-level temperature data and four-level temperature data, the three-level temperature data represents all critical temperature values in a cycle time of the second target heat dissipation feature vector, the four-level temperature data represents critical temperature values in a cycle time of the third target heat dissipation feature vector, and one-level temperature data in a fourth target heat dissipation feature vector, the second final temperature data includes a final temperature in the third target heat dissipation feature vector, and the fourth target heat dissipation feature vector is a last heat dissipation feature vector adjacent to the third target heat dissipation feature vector.
It can be appreciated that when the technical scheme described in the step e1 is executed, the accuracy of the heat dissipation feature vector is improved through the multi-dimensional data.
Based on the above-mentioned basis, after the second target heat dissipation feature vector and the corresponding second related temperature data are input into the second target feature vector, the technical solution described in the following step r1 may be further included.
Step r1, inputting an Mth target heat dissipation characteristic vector and corresponding Mth related temperature data into a third target characteristic vector on the premise that M target heat dissipation characteristic vectors exist in the heat dissipation process of the target temperature data, wherein the Mth related temperature data is used for describing the Mth target heat dissipation characteristic vector, and M is a positive number greater than or equal to 1; wherein the Mth heat data in the Mth related temperature data comprises heat data of the (M-2) th target heat dissipation characteristic vector and heat data of the Mth target heat dissipation characteristic vector.
It can be appreciated that, when the technical solution described in the above step r1 is executed, the mth relevant temperature data can be accurately input into the third target feature vector through the plurality of target heat dissipation feature vectors.
In a possible embodiment, the technical solutions described in the following step a1 and step a2 may also be included.
Step a1, acquiring relevant temperature data of a target heat dissipation characteristic vector from the target characteristic vector in the process of displaying the target heat dissipation temperature data; the related temperature data are used for describing the target heat dissipation feature vector, the target heat dissipation feature vector is a first heat dissipation feature vector obtained by dissipating heat of the target temperature data in a first heat generation area range and a second heat dissipation feature vector obtained by dissipating heat of the target temperature data in a second heat generation area range, a third heat generation area range exists between the first heat generation area range and the second heat generation area range, and the heat dissipation feature vector obtained by integrating the first heat dissipation feature vector and the second heat dissipation feature vector is integrated on the premise that superposition of the first heat generation area range, the second heat generation area range and the third heat generation area range accords with a preset heat generation area range.
And a2, displaying the target heat dissipation temperature data according to the related temperature data.
It can be appreciated that, when the technical solutions described in the above steps a1 and a2 are executed, the accuracy of displaying the target heat dissipation temperature data is improved by accurately acquiring the relevant temperature data of the target heat dissipation feature vector.
In a possible embodiment, the relevant temperature data includes at least one of the following, and the specific steps are as described in step s 1.
Step s1, the relevant temperature data includes at least one of the following: the heat data represents initial time and final time of the third heating area range, the temperature data comprises primary temperature data and secondary temperature data, the primary temperature data represents all key temperature values in cycle time in the target heat dissipation feature vector, the secondary temperature data represents key temperature values in the cycle time in the target heat dissipation feature vector and primary temperature data in second target heat dissipation temperature data, the final temperature data comprises final temperature data in the second target heat dissipation feature vector, and the second target heat dissipation feature vector is the last heat dissipation feature vector adjacent to the target heat dissipation feature vector in time.
It will be appreciated that, when the technical scheme described in step s1 is executed, the last heat dissipation feature vector adjacent to the target heat dissipation feature vector in time can be accurately determined by the heat data, the temperature data and the final temperature data.
On the basis of the foregoing, please refer to fig. 2 in combination, there is provided a heat dissipation device 200 for a data center, which is applied to a data processing terminal, the device includes:
the first feature obtaining module 210 is configured to obtain a first heat dissipation feature vector during a heat dissipation process of the target temperature data, where the first heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating heat of the target temperature data in a first heat generation area range;
a second feature obtaining module 220, configured to obtain a second heat dissipation feature vector, where the second heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating the target temperature data in a second heating area range;
the feature integration module 230 is configured to integrate the first heat dissipation feature vector and the second heat dissipation feature vector into a first target heat dissipation feature vector on the premise that a third heat dissipation area range exists between the first heat dissipation area range and the second heat dissipation area range, and the first heat dissipation area range, the second heat dissipation area range and the third heat dissipation area range overlap to conform to a preset heat dissipation area range, where the third heat dissipation area range is a heat dissipation area range in which the target temperature data is overheated and dissipated;
The feature input module 240 is configured to input the first target heat dissipation feature vector and corresponding first relevant temperature data into a first target feature vector, where the first relevant temperature data is used to describe the first target heat dissipation feature vector.
On the basis of the above, referring to fig. 3 in combination, there is shown a data center heat dissipation system 300, which includes a processor 310 and a memory 320 in communication with each other, wherein the processor 310 is configured to read and execute a computer program from the memory 320 to implement the above-mentioned method.
On the basis of the above, there is also provided a computer readable storage medium on which a computer program stored which, when run, implements the above method.
In summary, based on the above-mentioned scheme, through obtaining the first heat dissipation feature vector in the heat dissipation process of the target temperature data, where the first heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating the target temperature data in the first heat generation region range, obtaining the second heat dissipation feature vector, where the second heat dissipation feature vector is a heat dissipation feature vector obtained by dissipating the target temperature data in the second heat generation region range, and on the premise that there is a third heat generation region range between the first heat generation region range and the second heat generation region range, and that the first heat generation region range, the second heat generation region range, and the third heat generation region range overlap and conform to the preset heat generation region range, integrating the first heat dissipation feature vector and the second heat dissipation feature vector into the first target heat dissipation feature vector, where, the third heating area range is a heating area range of overheat heat dissipation of target temperature data, a first target heat dissipation feature vector and corresponding first related temperature data are input into the first target feature vector, wherein the first related temperature data are used for describing the first target heat dissipation feature vector, the purpose of integrating the first heat dissipation feature vector and the second heat dissipation feature vector according to the overheat data is achieved, therefore, the temperature feature vector is integrated into a temperature feature vector set, the feature vector data integration capacity of a system is optimized, the temperature feature vector can be timely processed, the technical problem that in the prior art, the temperature feature vector set caused by the phenomenon of frequent overhigh temperature in the heat dissipation process cannot be accurately displayed, and the limit pressure caused by the system is further solved.
It should be appreciated that the systems and modules thereof shown above may be implemented in a variety of ways. For example, in some embodiments, the system and its modules may be implemented in hardware, software, or a combination of software and hardware. Wherein the hardware portion may be implemented using dedicated logic; the software portions may then be stored in a memory and executed by a suitable instruction execution system, such as a microprocessor or special purpose design hardware. Those skilled in the art will appreciate that the methods and systems described above may be implemented using computer executable instructions and/or embodied in processor control code, such as provided on a carrier medium such as a magnetic disk, CD or DVD-ROM, a programmable memory such as read only memory (firmware), or a data carrier such as an optical or electronic signal carrier. The system and its modules of the present application may be implemented not only with hardware circuitry, such as very large scale integrated circuits or gate arrays, semiconductors such as logic chips, transistors, etc., or programmable hardware devices such as field programmable gate arrays, programmable logic devices, etc., but also with software, such as executed by various types of processors, and with a combination of the above hardware circuitry and software (e.g., firmware).
It should be noted that, the advantages that may be generated by different embodiments may be different, and in different embodiments, the advantages that may be generated may be any one or a combination of several of the above, or any other possible advantages that may be obtained.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations of the present application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this application, and are therefore within the spirit and scope of the exemplary embodiments of this application.
Meanwhile, the present application uses specific words to describe embodiments of the present application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present application. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present application may be combined as suitable.
Furthermore, those skilled in the art will appreciate that the various aspects of the invention are illustrated and described in the context of a number of patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the present application may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.) or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the present application may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.
The computer storage medium may contain a propagated data signal with the computer program code embodied therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take on a variety of forms, including electro-magnetic, optical, etc., or any suitable combination thereof. A computer storage medium may be any computer readable medium that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code located on a computer storage medium may be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or the like, or a combination of any of the foregoing.
The computer program code necessary for operation of portions of the present application may be written in any one or more programming languages, including an object oriented programming language such as Java, scala, smalltalk, eiffel, JADE, emerald, C ++, c#, vb net, python, etc., a conventional programming language such as C language, visual Basic, fortran 2003, perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, ruby and Groovy, or other programming languages, etc. The program code may execute entirely on the user's computer or as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any form of network, such as a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet), or the use of services such as software as a service (SaaS) in a cloud computing environment.
Furthermore, the order in which the elements and sequences are presented, the use of numerical letters, or other designations are used in the application and are not intended to limit the order in which the processes and methods of the application are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present application. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.
Likewise, it should be noted that in order to simplify the presentation disclosed herein and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the subject application. Indeed, less than all of the features of a single embodiment disclosed above.
In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the numbers allow for adaptive variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations that may be employed in some embodiments to confirm the breadth of the range, in particular embodiments, the setting of such numerical values is as precise as possible.
Each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., cited in this application is hereby incorporated by reference in its entirety. Except for application history documents that are inconsistent or conflicting with the present application, documents that are currently or later attached to this application for which the broadest scope of the claims to the present application is limited. It is noted that the descriptions, definitions, and/or terms used in the subject matter of this application are subject to such descriptions, definitions, and/or terms if they are inconsistent or conflicting with such descriptions, definitions, and/or terms.
Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of this application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present application may be considered in keeping with the teachings of the present application. Accordingly, embodiments of the present application are not limited to only the embodiments explicitly described and depicted herein.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.

Claims (10)

1. A method of cooling a data center, comprising:
in the heat dissipation process of target temperature data, a first heat dissipation feature vector is obtained, wherein the first heat dissipation feature vector is obtained by dissipating heat of the target temperature data in a first heat generation area range;
acquiring a second heat radiation characteristic vector, wherein the second heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a second heating area range;
on the premise that a third heating area range exists between the first heating area range and the second heating area range, and the first heating area range, the second heating area range and the third heating area range are overlapped to conform to a preset heating area range, integrating the first heat radiation characteristic vector and the second heat radiation characteristic vector into a first target heat radiation characteristic vector, wherein the third heating area range is the heating area range for overheat heat radiation of the target temperature data;
and inputting the first target heat dissipation characteristic vector and corresponding first related temperature data into a first target characteristic vector, wherein the first related temperature data is used for describing the first target heat dissipation characteristic vector.
2. The method of claim 1, wherein the first correlated temperature data comprises at least one of:
the heat dissipation device comprises first heat data, first temperature data and first final temperature data, wherein the first heat data represent initial time and end time of the third heat generation area range, the first temperature data comprise primary temperature data and secondary temperature data, the primary temperature data represent all key temperature values in cycle time in the first target heat dissipation feature vector, the secondary temperature data represent key temperature values in the cycle time in the first target heat dissipation feature vector and primary temperature data in a second target heat dissipation feature vector, the first final temperature data comprise final temperature data in the second target heat dissipation feature vector, and the second target heat dissipation feature vector is the last heat dissipation feature vector adjacent to the first target heat dissipation feature vector in time.
3. The method of claim 2, wherein after the inputting the first target heat dissipation feature vector and the corresponding first related temperature data into the first target feature vector, the method further comprises:
A third heat radiation characteristic vector is obtained, wherein the third heat radiation characteristic vector is obtained by radiating the target temperature data in a third heating area range, and the third heating area range and the second heating area range are continuous heating area ranges;
acquiring a fourth heat radiation characteristic vector, wherein the fourth heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a fourth heating area range;
integrating the third heat radiation feature vector and the fourth heat radiation feature vector into a third target heat radiation feature vector on the premise that a fifth heat radiation region range exists between the third heat radiation region range and the fourth heat radiation region range, and the third heat radiation region range, the fourth heat radiation region range and the fifth heat radiation region range are overlapped to conform to the preset heat radiation region range, wherein the fifth heat radiation region range is the heat radiation region range for overheat heat radiation of the target temperature data;
and inputting the third target heat dissipation characteristic vector and corresponding second related temperature data into a second target characteristic vector, wherein the second related temperature data is used for describing the third target heat dissipation characteristic vector.
4. A method according to claim 3, wherein the second related temperature data comprises at least one of:
the second heat data represents an initial time, a final time and the first heat data of the fifth heating area range, the second temperature data comprises three-level temperature data and four-level temperature data, the three-level temperature data represents all key temperature values in a cycle time of the third target heat dissipation feature vector, the four-level temperature data represents key temperature values in the cycle time of the third target heat dissipation feature vector and one-level temperature data in a fourth target heat dissipation feature vector, the second final temperature data comprises a final temperature of the third target heat dissipation feature vector, and the fourth target heat dissipation feature vector is a last heat dissipation feature vector adjacent to the third target heat dissipation feature vector.
5. The method of claim 4, wherein after the third target heat dissipation feature vector and corresponding second related temperature data are entered into the second target feature vector, the method further comprises:
On the premise that M target heat dissipation feature vectors exist in the heat dissipation process of the target temperature data, inputting an Mth target heat dissipation feature vector and corresponding relevant temperature data into a third target feature vector, wherein the relevant temperature data corresponding to the Mth target heat dissipation feature vector is used for describing the Mth target heat dissipation feature vector, and M is a positive number greater than or equal to 1; wherein the mth heat data in the related temperature data corresponding to the mth target heat dissipation feature vector includes the heat data of the (M-2) th target heat dissipation feature vector and the heat data of the mth target heat dissipation feature vector.
6. The heat dissipation system of the data center is characterized by comprising a data acquisition end and a data processing terminal, wherein the data acquisition end is in communication connection with the data processing terminal, and the data processing terminal is specifically used for:
in the heat dissipation process of target temperature data, a first heat dissipation feature vector is obtained, wherein the first heat dissipation feature vector is obtained by dissipating heat of the target temperature data in a first heat generation area range;
acquiring a second heat radiation characteristic vector, wherein the second heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a second heating area range;
On the premise that a third heating area range exists between the first heating area range and the second heating area range, and the first heating area range, the second heating area range and the third heating area range are overlapped to conform to a preset heating area range, integrating the first heat radiation characteristic vector and the second heat radiation characteristic vector into a first target heat radiation characteristic vector, wherein the third heating area range is the heating area range for overheat heat radiation of the target temperature data;
and inputting the first target heat dissipation characteristic vector and corresponding first related temperature data into a first target characteristic vector, wherein the first related temperature data is used for describing the first target heat dissipation characteristic vector.
7. The system according to claim 6, wherein the data processing terminal is specifically configured to:
the first correlated temperature data includes at least one of: the heat dissipation device comprises first heat data, first temperature data and first final temperature data, wherein the first heat data represent initial time and end time of the third heat generation area range, the first temperature data comprise primary temperature data and secondary temperature data, the primary temperature data represent all key temperature values in cycle time in the first target heat dissipation feature vector, the secondary temperature data represent key temperature values in the cycle time in the first target heat dissipation feature vector and primary temperature data in a second target heat dissipation feature vector, the first final temperature data comprise final temperature data in the second target heat dissipation feature vector, and the second target heat dissipation feature vector is the last heat dissipation feature vector adjacent to the first target heat dissipation feature vector in time.
8. The system according to claim 7, wherein the data processing terminal is further specifically configured to:
a third heat radiation characteristic vector is obtained, wherein the third heat radiation characteristic vector is obtained by radiating the target temperature data in a third heating area range, and the third heating area range and the second heating area range are continuous heating area ranges;
acquiring a fourth heat radiation characteristic vector, wherein the fourth heat radiation characteristic vector is a heat radiation characteristic vector obtained by radiating the target temperature data in a fourth heating area range;
integrating the third heat radiation feature vector and the fourth heat radiation feature vector into a third target heat radiation feature vector on the premise that a fifth heat radiation region range exists between the third heat radiation region range and the fourth heat radiation region range, and the third heat radiation region range, the fourth heat radiation region range and the fifth heat radiation region range are overlapped to conform to the preset heat radiation region range, wherein the fifth heat radiation region range is the heat radiation region range for overheat heat radiation of the target temperature data;
and inputting the third target heat dissipation characteristic vector and corresponding second related temperature data into a second target characteristic vector, wherein the second related temperature data is used for describing the third target heat dissipation characteristic vector.
9. The system according to claim 8, wherein the data processing terminal is specifically configured to:
the second correlated temperature data includes at least one of: the second heat data represents an initial time, a final time and the first heat data of the fifth heating area range, the second temperature data comprises three-level temperature data and four-level temperature data, the three-level temperature data represents all key temperature values in a cycle time of the third target heat dissipation feature vector, the four-level temperature data represents key temperature values in the cycle time of the third target heat dissipation feature vector and one-level temperature data in a fourth target heat dissipation feature vector, the second final temperature data comprises a final temperature of the third target heat dissipation feature vector, and the fourth target heat dissipation feature vector is a last heat dissipation feature vector adjacent to the third target heat dissipation feature vector.
10. The system according to claim 9, wherein the data processing terminal is further specifically configured to:
On the premise that M target heat dissipation feature vectors exist in the heat dissipation process of the target temperature data, inputting an Mth target heat dissipation feature vector and corresponding relevant temperature data into a third target feature vector, wherein the relevant temperature data corresponding to the Mth target heat dissipation feature vector is used for describing the Mth target heat dissipation feature vector, and M is a positive number greater than or equal to 1; wherein the mth heat data in the related temperature data corresponding to the mth target heat dissipation feature vector includes the heat data of the (M-2) th target heat dissipation feature vector and the heat data of the mth target heat dissipation feature vector.
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