CN113611789B - LED device and manufacturing method thereof - Google Patents
LED device and manufacturing method thereof Download PDFInfo
- Publication number
- CN113611789B CN113611789B CN202111179278.6A CN202111179278A CN113611789B CN 113611789 B CN113611789 B CN 113611789B CN 202111179278 A CN202111179278 A CN 202111179278A CN 113611789 B CN113611789 B CN 113611789B
- Authority
- CN
- China
- Prior art keywords
- mounting
- hole
- heat dissipation
- gear
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention relates to the technical field of LEDs, in particular to an LED device and a manufacturing method thereof. The LED device comprises a shell and an upper end cover, wherein an installation block is fixedly arranged in the shell, a motor groove is formed in the installation block, a motor is installed in the motor groove, a first heat dissipation device is fixedly arranged on the motor, a shaft hole is formed in one side of the installation block, and a second heat dissipation device is connected in the shaft hole in an inserting mode. The manufacturing method of the LED device comprises the following steps: the method comprises the following steps: manufacturing the shell, and step two: manufacturing an upper end cover, and step three: manufacturing and mounting the first gear, and step four: manufacturing an elastic locking device, and a fifth step: installing a first heat dissipation device, and step six: mounting of the mounting frame, and the seventh step: mounting the chip, and step eight: and mounting a second heat dissipation device, and a ninth step: closing the sealing box, and step ten: and closing the shell.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to an LED device and a manufacturing method thereof.
Background
The LED device is a device which is commonly used in our life, the LED device in the prior art has certain disadvantages when in use, the LED device can generate higher temperature after being used for a long time, high temperature can cause certain damage to a chip inside the device, the use of the LED device is not facilitated, the service life of the chip is greatly reduced, in addition, the chip can generate certain static electricity in the working process of the LED device, the static electricity can enable the chip to adsorb dust entering air inside the LED device from a heat dissipation hole, the adsorption of the dust can influence the heat dissipation of the chip to damage the chip more easily, the chip is located inside the LED device, so that the dust is cleaned more trouble, the working efficiency is reduced, and the normal use of the LED device is influenced.
To this end, we propose an LED device to solve the above drawbacks.
Disclosure of Invention
Technical problem to be solved
In order to solve the above problems in the prior art, the present invention provides an LED device and a method for manufacturing the same, so as to solve the above problems in the background art.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
an LED device comprises a shell and an upper end cover, wherein a mounting block is fixedly arranged inside the shell, a motor groove is formed in the mounting block, a motor is arranged in the motor groove, a first heat dissipation device is fixedly arranged on the motor, a shaft hole is formed in one side of the mounting block, a second heat dissipation device is inserted in the shaft hole, a mounting frame is fixedly connected to the mounting block through a screw, the first heat dissipation device is located below the mounting frame, a chip is mounted on the mounting frame, the upper end of the shell is fixedly provided with the upper end cover, a plurality of heat dissipation holes are formed in the upper end cover, and the chip is located right below the heat dissipation holes; the second heat dissipation device comprises a rotating shaft and a sealing box, the rotating shaft is installed in the shaft hole through a bearing, a second gear is fixedly arranged at the upper end of the rotating shaft, and a connecting shaft is fixedly arranged on the upper surface of the second gear; the center position of seal box puts and has seted up the connecting hole, there is the connecting axle through the mechanical seal cooperation in the connecting hole, the fixed negative pressure pipe that is provided with in both sides of seal box, the front end of negative pressure pipe is fixed with the suction box, the seal groove has been seted up to the upper end of seal box.
Preferably, the first heat dissipation device comprises a first gear and a first fan, the first gear is fixedly connected to the motor, a mounting hole is formed in the center of the upper end of the first gear, insertion grooves are symmetrically formed in two sides of the mounting hole, a fixing hole is formed in the vertical direction of the insertion grooves, the fixing hole is located inside the mounting hole, and an elastic locking device is arranged in the mounting hole.
Preferably, the elastic locking device comprises a spring and a supporting block, the lower end of the spring is fixedly arranged at the bottom end of the mounting hole, the upper end of the spring is fixedly connected with the supporting block, and the supporting block is flush with the upper port of the mounting hole in a non-working state.
Preferably, the lower end of the first fan is symmetrically and integrally formed with two fixing blocks, the fixing blocks are inserted into the fixing holes in the working state, and a certain distance is reserved between the first fan and the upper end face of the first gear.
Preferably, the second heat dissipation device further comprises a sealing cover and a second fan, a matching hole is formed in the upper end of the connecting shaft, and a key groove is formed in one side of the inside of the matching hole.
Preferably, the lower end of the second fan is fixedly provided with a connecting key, the second fan is inserted into the matching hole in the working state, the connecting key is inserted into the key groove, and the second fan is fixed into the matching hole through a screw.
Preferably, the lower extreme of sealed lid is fixed and is provided with sealed piece, sealed piece is pegged graft in the seal groove under operating condition, the fixed tuber pipe that is provided with in upper end of sealed lid, the front end of tuber pipe is fixed and is provided with out bellows.
A manufacturing method of an LED device comprises the following operation steps:
the method comprises the following steps: manufacturing a shell: extruding and forming the shell through a die for later use;
step two: manufacturing an upper end cover: extruding and forming the upper end cover by using an upper end cover die, and then forming a plurality of heat dissipation holes on the upper end cover;
step three: manufacturing and mounting of the first gear: arranging a mounting hole on the first gear, arranging splicing grooves on two sides of the mounting hole, and arranging a fixing hole in the vertical direction of the splicing grooves;
step four: manufacturing an elastic locking device: welding one end of the spring to the supporting block, and welding the other end of the spring to the bottom end of the mounting hole;
step five: installation of the first heat dissipation device: the first gear is fixedly welded on a motor shaft, the motor is installed in a motor groove, the first fan is inserted into the installation hole, and the fixing block is inserted into the fixing hole through rotation to realize the fixed connection of the first fan and the first gear;
step six: mounting of a mounting rack: aligning the threaded hole on the mounting frame with the threaded hole on the mounting block, and fixing the mounting frame on the mounting block through a screw;
step seven: mounting of the chip: coating an adhesive on the mounting frame, and then placing the chip on the adhesive to realize the mounting and fixing of the chip;
step eight: and (3) mounting a second heat dissipation device: installing a rotating shaft in the shaft hole through a bearing, then installing a seal box on the connecting shaft through a mechanical seal, and then installing a second fan in the matching hole through a screw;
step nine: closing the sealing box: inserting a sealing block on the sealing cover into a sealing groove on the sealing box, enabling the air outlet box to face the direction of the chip, and then fixedly connecting the sealing cover and the sealing box through screws;
step ten: closing the shell: and fixing the upper end cover screw at the upper end of the shell to close the shell, and finishing assembly.
(III) advantageous effects
The invention has the beneficial effects that:
1. the chip is arranged on the mounting frame, and the first heat dissipation device is arranged below the chip, so that the main heat dissipation effect can be achieved on the chip, and the use safety of the chip is ensured;
2. under the drive of the first heat dissipation device, the second heat dissipation device can assist the chip in heat dissipation from the side surface, so that the chip can be rapidly cooled, dust can be cleaned, the surface of the chip cannot be accumulated, the normal heat dissipation of the chip is affected, and the chip can be cleaned conveniently and rapidly.
Drawings
FIG. 1 is an exploded schematic view of an LED device assembly;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
FIG. 3 is an enlarged schematic view at B of FIG. 1;
FIG. 4 is a schematic diagram of a structure of an LED device;
FIG. 5 is a schematic structural view of the mounting bracket;
FIG. 6 is a schematic view of a half-section of the first gear;
FIG. 7 is a schematic structural view of a seal box;
fig. 8 is a schematic structural view of the sealing cover.
In the figure:
1. a housing; 11. mounting blocks; 12. a shaft hole; 13. a motor slot; 2. an upper end cover; 21. heat dissipation holes; 3. a chip; 4. a mounting frame; 5. a first gear; 51. mounting holes; 52. inserting grooves; 53. a spring; 54. a support block; 55. a fixing hole; 6. a rotating shaft; 61. a second gear; 62. a connecting shaft; 621. a mating hole; 622. a keyway; 7. a sealing box; 71. a sealing groove; 72. connecting holes; 73. a negative pressure tube; 74. a dust collection box; 8. a sealing cover; 81. an air outlet pipe; 82. an air outlet box; 83. a sealing block; 9. a first fan; 91. a fixed block; 10. a second fan; 101. a connecting key.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
An LED device according to an embodiment of the present invention, as shown in fig. 1-3, includes a housing 1 and an upper end cap 2, a mounting block 11 is fixedly disposed inside the housing 1, a motor slot 13 is disposed on the mounting block 11, a motor is disposed in the motor slot 13, a first heat dissipation device is fixedly disposed on the motor and includes a first gear 5 and a first fan 9, the first gear 5 is fixedly connected to the motor, a mounting hole 51 is disposed at a central position of the first gear 5, insertion slots 52 are symmetrically disposed at two sides of the mounting hole 51, a fixing hole 55 is disposed in a vertical direction of the insertion slot 52, the fixing hole 55 is disposed inside the mounting hole 51, an elastic locking device is disposed in the mounting hole 51 and includes a spring 53 and a supporting block 54, a lower end of the spring 53 is fixedly disposed at a bottom end of the mounting hole 51, and an upper end of the spring 53 is fixedly connected to the supporting block 54, the supporting block 54 is flush with the upper port of the mounting hole 51 in a non-working state, the upper end of the spring 53 is connected with the supporting block 54 in a welding mode, and the lower end of the spring 53 is fixed to the bottom of the mounting hole 51 in a welding mode.
As shown in fig. 2 and 6, the lower end of the first fan 9 is symmetrically and integrally formed with two fixing blocks 91, the fixing blocks 91 are inserted into the fixing holes 55 in the operating state, and a certain distance is provided between the first fan 9 and the upper end face of the first gear 5, when the fixing blocks 91 are inserted into the fixing holes 55, the springs 53 are in a compressed state to tightly abut against the fixing blocks 91 in the fixing holes 55, so that the first fan 9 and the first gear 5 are fixedly connected.
As shown in fig. 1, 3 and 4, a shaft hole 12 is formed in one side of the mounting block 11, a second heat dissipation device is inserted into the shaft hole 12, the second heat dissipation device includes a rotating shaft 6, a seal box 7, a seal cover 8 and a second fan 10, the rotating shaft 6 is mounted in the shaft hole 12 through a bearing, a second gear 61 is fixedly arranged at the upper end of the rotating shaft 6, a connecting shaft 62 is fixedly arranged on the upper surface of the second gear 61, a matching hole 621 is formed in the upper end of the connecting shaft 62, and a key groove 622 is formed in one side of the inside of the matching hole 621.
As shown in fig. 3, a connection key 101 is fixedly disposed at the lower end of the second fan 10, the second fan 10 is inserted into the fitting hole 621 in an operating state, the connection key 101 is inserted into the key slot 622, and the second fan 10 is fixed in the fitting hole 621 by a screw and the screw passes through a through hole of the second fan 10 and is screwed in a threaded hole at the bottom of the fitting hole 621.
As shown in fig. 7, a connection hole 72 is formed in the center of the seal box 7, the connection shaft 62 is fitted in the connection hole 72 through a mechanical seal, negative pressure pipes 73 are fixedly disposed on both sides of the seal box 7, a dust suction box 74 is fixedly disposed at the front end of the negative pressure pipe 73, a seal groove 71 is formed in the upper end of the seal box 7, and a nozzle of the negative pressure pipe 73 in the seal box 7 is located at the lower end of the second fan 10.
As shown in fig. 7 and 8, a sealing block 83 is fixedly disposed at the lower end of the sealing cover 8, the sealing block 83 is inserted into the sealing groove 71 in an operating state, an air outlet pipe 81 is fixedly disposed at the upper end of the sealing cover 8, an air outlet box 82 is fixedly disposed at the front end of the air outlet pipe 81, the air outlet box 82 is disposed at the upper end of the chip 3, and a plurality of air outlets are disposed at the front end of the air outlet box 82 to facilitate dispersing wind to blow to the chip.
As shown in fig. 1 and 5, the upper end of the mounting block 11 is fixedly connected with a mounting rack 4 through screws, the first heat dissipation device is located at the lower end of the mounting rack 4, the chip 3 is mounted at the upper end of the mounting rack 4, the upper end of the casing 1 is fixedly provided with an upper end cover 2, the upper end cover 2 is provided with a plurality of heat dissipation holes 21, and the chip 3 is located under the heat dissipation holes 21.
A manufacturing method of an LED device comprises the following operation steps:
the method comprises the following steps: manufacturing of the shell 1: extruding and forming the shell 1 through a die for later use;
step two: and (3) manufacturing an upper end cover 2: the upper end cover 2 is extruded and formed by using an upper end cover 2 die, and then a plurality of heat dissipation holes 21 are formed in the upper end cover 2;
step three: manufacture and installation of the first gear 5: a mounting hole 51 is formed in the first gear 5, then inserting grooves 52 are formed in two sides of the mounting hole 51, and fixing holes 55 are formed in the vertical direction of the inserting grooves 52;
step four: manufacturing an elastic locking device: one end of the spring 53 is welded and connected with the supporting block 54, and the other end of the spring is welded and fixed at the bottom end of the mounting hole 51;
step five: installation of the first heat dissipation device: the first gear 5 is fixedly welded on a motor shaft, then the motor is installed in the motor groove 13, the first fan 9 is inserted into the installation hole 51, and then the fixing block 91 is inserted into the fixing hole 55 through rotation to realize the fixed connection of the first fan 9 and the first gear 5;
step six: mounting of the mounting frame 4: aligning the threaded hole on the mounting frame 4 with the threaded hole on the mounting block 11, and then fixing the mounting frame 4 on the mounting block 11 through a screw;
step seven: mounting of chip 3: coating an adhesive on the mounting rack 4, and then placing the chip 3 on the adhesive to realize the mounting and fixing of the chip 3;
step eight: and (3) mounting a second heat dissipation device: the rotary shaft 6 is mounted in the shaft hole 12 through a bearing, then the seal box 7 is mounted on the connecting shaft 62 through a mechanical seal, and then the second fan 10 is mounted in the fitting hole 621 through a screw;
step nine: closure of the sealing box 7: inserting a sealing block 83 on the sealing cover 8 into a sealing groove 71 on the sealing box 7, enabling the air outlet box 82 to face the direction of the chip 3, and then fixedly connecting the sealing cover 8 and the sealing box 7 through screws;
step ten: closing of the housing 1: and fixing the upper end cover 2 at the rear end of the shell 1 by screws to close the shell 1, and finishing assembly.
The working principle is as follows:
after working for a long time, a motor in the housing 1 is started to drive the first gear 5 to rotate, so that the first fan 9 mounted on the first gear 5 is driven by the motor to rotate, the lower side of the chip 3 can be cooled, when the first fan 9 is mounted, the fixing block 91 on the first fan 9 is aligned to the insertion groove 52 on the first gear 5, then the fixing block is pressed into the mounting hole 51, so that the upper end surface of the fixing block 91 is flush with the lower port of the fixing hole 55, then the first fan 9 is rotated to enable the fixing block 91 to rotate to the position of the fixing hole 55, at the moment, the fixing block 91 is positioned under the fixing hole 55, then the first fan 9 is released to ascend under the action of the spring 53, so that the fixing block 91 is tightly clamped in the fixing hole 55 to realize the fixed connection of the first fan 9 and the first gear 5, therefore, the heat dissipation of the chip 3 can be realized by smoothly driving the first fan 9 to rotate by the motor, and since the first gear 5 is meshed with the second gear 61, the rotation of the first gear 5 drives the second gear 61 to rotate, and since the diameter of the first gear 5 is larger than that of the second gear 61, at this time, the rotating speed of the second gear 61 is larger than that of the first gear 5, and the second gear 61 is provided with the second fan 10, so that the second gear 61 drives the second fan 10 to rotate when rotating, and since the second fan 10 is installed inside the seal box 7, and the seal cover 8 is fixed at the upper end of the seal box 7 by screws, since the seal block 83 on the seal cover 8 is inserted in the seal groove 71 on the seal box 7, the sealing effect of the seal box 7 can be ensured, and then since the upper end of the seal cover 8 is fixedly provided with the air outlet pipe 81, the air outlet box 82 at the front end of the air outlet pipe 81 is located at the upper end of the chip 3, so that the air blown by the second fan 10 is blown to the upper surface of the chip 3 from the air outlet box 82, on one hand, the heat dissipation effect on the chip 3 can be achieved, on the other hand, dust adsorbed on the surface of the chip 3 can be blown away, on the other hand, the negative pressure pipes 73 are fixedly arranged on two sides of the sealing box 7, the pipe openings of the negative pressure pipes 73 located inside the sealing box 7 are located on the lower side of the second fan 10, on the other hand, negative pressure can be generated on the lower side of the second fan 10 in a rotating state, and on the other hand, the sealing box 7 is in a sealing state, so that negative pressure is formed in the negative pressure pipes 73, on the other hand, on the basis that the dust suction box 74 is connected to the front end of the negative pressure pipes 73, and the dust suction ports of the dust suction box 74 are located on two sides of the upper surface of the chip 3 and higher than the upper surface of the chip 3, so that the dust blown by the dust suction box 74 can be sucked into the dust suction box 10, and the dust can be prevented from falling onto the chip 3 again or falling onto the chip 3 again On other components inside the housing 1.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.
Claims (8)
1. An LED device comprising a housing (1) and an upper end cap (2), characterized in that: the heat dissipation device comprises a shell (1), and is characterized in that a mounting block (11) is fixedly arranged in the shell (1), a motor groove (13) is formed in the mounting block (11), a motor is arranged in the motor groove (13), a first heat dissipation device is fixedly arranged on the motor, a shaft hole (12) is formed in one side of the mounting block (11), a second heat dissipation device is inserted in the shaft hole (12), a mounting rack (4) is fixedly connected to the mounting block (11) through a screw, the first heat dissipation device is located below the mounting rack (4), a chip (3) is arranged on the mounting rack (4), an upper end cover (2) is fixedly arranged at the upper end of the shell (1), a plurality of heat dissipation holes (21) are formed in the upper end cover (2), and the chip (3) is located under the heat dissipation holes (21);
the second heat dissipation device comprises a rotating shaft (6) and a sealing box (7), the rotating shaft (6) is installed in the shaft hole (12) through a bearing, a second gear (61) is fixedly arranged at the upper end of the rotating shaft (6), and a connecting shaft (62) is fixedly arranged on the upper surface of the second gear (61);
connecting hole (72) have been seted up in the central point of seal box (7) puts, there is connecting axle (62) through the mechanical seal cooperation in connecting hole (72), the fixed negative pressure pipe (73) that is provided with in both sides of seal box (7), the front end of negative pressure pipe (73) is fixed and is provided with dust suction box (74), seal groove (71) have been seted up to the upper end of seal box (7).
2. An LED device according to claim 1, wherein: the first heat dissipation device comprises a first gear (5) and a first fan (9), the first gear (5) is fixedly connected to the motor, a mounting hole (51) is formed in the center of the upper end of the first gear (5), insertion grooves (52) are symmetrically formed in two sides of the mounting hole (51), a fixing hole (55) is formed in the vertical direction of the insertion groove (52), the fixing hole (55) is located inside the mounting hole (51), and an elastic locking device is arranged in the mounting hole (51).
3. An LED device according to claim 2, wherein: the elastic locking device comprises a spring (53) and a supporting block (54), the lower end of the spring (53) is fixedly arranged at the bottom end of the mounting hole (51), the upper end of the spring (53) is fixedly connected with the supporting block (54), and the supporting block (54) is flush with the upper port of the mounting hole (51) in a non-working state.
4. An LED device according to claim 2, wherein: the lower end of the first fan (9) is symmetrically and integrally formed with two fixing blocks (91), the fixing blocks (91) are inserted into the fixing holes (55) in the working state, and a certain distance is reserved between the first fan (9) and the upper end face of the first gear (5).
5. An LED device according to claim 1, wherein: the second heat dissipation device further comprises a sealing cover (8) and a second fan (10), a matching hole (621) is formed in the upper end of the connecting shaft (62), and a key groove (622) is formed in one side of the inside of the matching hole (621).
6. An LED device according to claim 5, wherein: the lower end of the second fan (10) is fixedly provided with a connecting key (101), the second fan (10) is inserted into the matching hole (621) in the working state, the connecting key (101) is inserted into the key groove (622), and the second fan (10) is fixed into the matching hole (621) through a screw.
7. An LED device according to claim 5, wherein: the fixed sealed piece (83) that is provided with of lower extreme of sealed lid (8), peg graft in seal groove (71) under operating condition sealed piece (83), the fixed tuber pipe (81) that is provided with in upper end of sealed lid (8), the front end of going out tuber pipe (81) is fixed and is provided with out bellows (82).
8. A method of manufacturing a LED device according to any of claims 1-7, comprising the following operative steps:
the method comprises the following steps: manufacturing a shell (1): the shell (1) is extruded and formed through a die for standby;
step two: manufacturing an upper end cover (2): the upper end cover (2) is extruded and formed by an upper end cover (2) mould, and then a plurality of heat dissipation holes (21) are formed in the upper end cover (2);
step three: manufacturing and mounting of the first gear (5): arranging a mounting hole (51) on the first gear (5), arranging splicing grooves (52) on two sides of the mounting hole (51), and arranging a fixing hole (55) in the vertical direction of the splicing grooves (52);
step four: manufacturing an elastic locking device: one end of the spring (53) is welded and connected with the supporting block (54), and the other end of the spring is welded and fixed at the bottom end of the mounting hole (51);
step five: installation of the first heat dissipation device: the first gear (5) is fixedly welded on a motor shaft, the motor is installed in a motor groove (13), the first fan (9) is inserted into the installation hole (51), and then the fixing block (91) is inserted into the fixing hole (55) through rotation to realize the fixed connection of the first fan (9) and the first gear (5);
step six: mounting of the mounting rack (4): aligning the threaded hole on the mounting frame (4) with the threaded hole on the mounting block (11), and fixing the mounting frame (4) on the mounting block (11) through a screw;
step seven: mounting of the chip (3): coating an adhesive on the mounting rack (4), and then placing the chip (3) on the adhesive to realize the mounting and fixing of the chip (3);
step eight: and (3) mounting a second heat dissipation device: installing a rotating shaft (6) in the shaft hole (12) through a bearing, then installing a seal box (7) on the connecting shaft (62) through a mechanical seal, and then installing a second fan (10) in the matching hole (621) through a screw;
step nine: closing of the sealing box (7): inserting a sealing block (83) on the sealing cover (8) into a sealing groove (71) on the sealing box (7) to enable the air box (82) to face the direction of the chip (3), and then fixedly connecting the sealing cover (8) with the sealing box (7) through screws;
step ten: closing of the housing (1): and fixing the upper end cover (2) at the upper end of the shell (1) by screws to close the shell (1) so as to finish the assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111179278.6A CN113611789B (en) | 2021-10-11 | 2021-10-11 | LED device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111179278.6A CN113611789B (en) | 2021-10-11 | 2021-10-11 | LED device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113611789A CN113611789A (en) | 2021-11-05 |
| CN113611789B true CN113611789B (en) | 2021-12-03 |
Family
ID=78343543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111179278.6A Active CN113611789B (en) | 2021-10-11 | 2021-10-11 | LED device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113611789B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207796746U (en) * | 2018-01-31 | 2018-08-31 | 广东蜀华照明科技有限公司 | A kind of LED projector lamp having heat sinking function |
| CN211952340U (en) * | 2020-04-26 | 2020-11-17 | 深圳市佰菲特光电科技有限公司 | LED line lamp with good heat dissipation effect |
| CN213207432U (en) * | 2020-10-09 | 2021-05-14 | 深圳市心新居家照明科技有限公司 | LED cabinet lamp with sterilization function |
| CN113390048A (en) * | 2021-05-25 | 2021-09-14 | 吕思宇 | Wisdom street lamp based on thing networking |
-
2021
- 2021-10-11 CN CN202111179278.6A patent/CN113611789B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207796746U (en) * | 2018-01-31 | 2018-08-31 | 广东蜀华照明科技有限公司 | A kind of LED projector lamp having heat sinking function |
| CN211952340U (en) * | 2020-04-26 | 2020-11-17 | 深圳市佰菲特光电科技有限公司 | LED line lamp with good heat dissipation effect |
| CN213207432U (en) * | 2020-10-09 | 2021-05-14 | 深圳市心新居家照明科技有限公司 | LED cabinet lamp with sterilization function |
| CN113390048A (en) * | 2021-05-25 | 2021-09-14 | 吕思宇 | Wisdom street lamp based on thing networking |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113611789A (en) | 2021-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113611789B (en) | LED device and manufacturing method thereof | |
| CN112018935B (en) | Motor casing | |
| CN215138229U (en) | PM 2.5's adsorption equipment | |
| CN213655129U (en) | Novel screw blower | |
| CN110935693A (en) | Dust remover for cleaning main board | |
| CN220816006U (en) | Fan and fan lamp with humidification function | |
| CN220567179U (en) | High-efficient heat dissipation LED lamp pearl device | |
| CN214111935U (en) | Dust removal mechanism of solvent-free film laminating machine | |
| CN216229238U (en) | Novel portable all-round operation panel of electric power marketing | |
| CN114094477B (en) | Energy-saving integrated installation device for electric power and electric elements | |
| CN219572342U (en) | Air source heat pump with good heat dissipation effect | |
| CN220491866U (en) | Chip dust removal carrier and chip dust removal equipment thereof | |
| CN215335894U (en) | Line lamp that can multiple mode is connected | |
| CN220036941U (en) | Rotor assembly of Roots vacuum pump | |
| CN215979900U (en) | Dustproof oilless screw vacuum pump | |
| CN218240990U (en) | Intelligent community face recognition device with dustproof mechanism | |
| CN220553883U (en) | Vibrating motor with dustproof function | |
| CN219437432U (en) | Photoelectric converter with efficient heat dissipation structure | |
| CN116598644B (en) | Explosion-proof heat-insulating flame-retardant power battery and battery pack | |
| CN217302672U (en) | LED headlight module for automobile | |
| CN215478255U (en) | Vacuum generating device for paper mold production | |
| CN219715906U (en) | Heat dissipation accessory and camera | |
| CN216584721U (en) | Cooling and noise reducing device for large tempering furnace | |
| CN216569740U (en) | Vacuum cleaner | |
| CN212341828U (en) | Novel wind scooper of computer host |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 199 Haixing North Road, Haimen Street, Haimen District, Nantong City, Jiangsu Province 226100 Patentee after: Nantong Baoheng industry and Trade Co.,Ltd. Address before: 226100 No.199, Haixing North Road, Haimen street, Haimen City, Nantong City, Jiangsu Province Patentee before: Nantong Baoheng industry and Trade Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |