CN113518510A - PCB glue removing device and method - Google Patents
PCB glue removing device and method Download PDFInfo
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- CN113518510A CN113518510A CN202010280856.4A CN202010280856A CN113518510A CN 113518510 A CN113518510 A CN 113518510A CN 202010280856 A CN202010280856 A CN 202010280856A CN 113518510 A CN113518510 A CN 113518510A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a PCB glue removing device and a method, wherein the glue removing device comprises a box body, and a first air inlet and a second air outlet are arranged at opposite positions on the box body; the first air inlet and outlet pipeline comprises a first air inlet pipeline and a first air outlet pipeline respectively, and one end of the first air inlet pipeline and one end of the first air outlet pipeline are both connected with the first air inlet and outlet; the second air inlet and outlet pipeline respectively comprises a second air inlet pipeline and a second air outlet pipeline, and one end of the second air inlet pipeline and one end of the second air outlet pipeline are both connected with the second air inlet and outlet; and the controller is in signal connection with the first air inlet and outlet pipeline and the second air inlet and outlet pipeline. According to the invention, the controller controls the first air inlet and outlet pipeline and the second air inlet and outlet pipeline to be matched with each other, so that gas can be input into or discharged out of the box body through the first air inlet and outlet pipe and the second air inlet and outlet pipe which are arranged oppositely, and further the gas can be fully contacted with the PCB after being plasmatized, and further the surface and the hole wall of the PCB can achieve the purpose of uniform glue removal.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a PCB glue removing device and method.
Background
With the continuous development of the circuit board (PCB) industry, materials with higher and higher grades are gradually demanded by the market, high-frequency and high-speed materials are gradually applied to different products by PCB factories, the traditional chemical glue removal can not meet the existing products, and more factories introduce plasma glue removal to replace chemical glue removal.
The plasma glue removing is that a plate needing to be cleaned is placed between a positive electrode and a negative electrode in a machine cabin, under the vacuum condition, high-frequency high voltage (RF) is added between the positive electrode and the negative electrode, meanwhile, oxygen, nitrogen, carbon tetrafluoride, hydrogen and the like are added in proportion, under the action of the high-voltage positive electrode and the negative electrode, the gas is ionized, so that different reactions occur on the surface and in holes of the plate, and the purposes of glue removing, carbide removing and activation are achieved. Because the air supply port of the existing device is arranged at the door, and the air outlet is arranged at the corner of the machine body, the glue removal at different parts of the plate body and different hole walls is not uniform, and the quality of the plate body has problems.
Disclosure of Invention
The invention mainly solves the technical problem of providing a PCB glue removing device and method, and solves the problem of uneven glue removal of different parts and different hole walls of a PCB in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: the PCB glue removing device comprises a box body, wherein the box body is used for accommodating a PCB, a first air inlet and a second air inlet are formed in the box body, and the first air inlet and the second air inlet are arranged oppositely; the first air inlet and outlet pipeline comprises a first air inlet pipeline and a first air outlet pipeline respectively, and one end of the first air inlet pipeline and one end of the first air outlet pipeline are connected with the first air inlet and outlet; the second air inlet and outlet pipeline respectively comprises a second air inlet pipeline and a second air outlet pipeline, and one end of the second air inlet pipeline and one end of the second air outlet pipeline are both connected with the second air inlet and outlet; and the controller is in signal connection with the first air inlet and outlet pipeline and the second air inlet and outlet pipeline so as to control the first air inlet pipeline and the second air outlet pipeline to work simultaneously or control the second air inlet pipeline and the first air outlet pipeline to work simultaneously.
The glue removing device further comprises a control valve, the control valve is arranged on the first air inlet and outlet pipeline and the second air inlet and outlet pipeline, the control valve is used for controlling the gas circulation in the first air inlet and outlet pipeline and the second air inlet and outlet pipeline, and the control valve is in signal connection with the controller.
The control valve comprises a first control valve, a second control valve, a third control valve and a fourth control valve, and the first control valve is arranged on the first air inlet pipeline to control the working state of the first air inlet pipeline; the second control valve is arranged on the first air outlet pipeline to control the working state of the first air outlet pipeline; the third control valve is arranged on the second air inlet pipeline to control the working state of the second air inlet pipeline; and the fourth control valve is arranged on the second air outlet pipeline to control the working state of the second air outlet pipeline.
The first control valve and the third control valve are electromagnetic valves, and the second control valve and the fourth control valve are vacuum valves.
The first common pipeline is arranged at one end, close to the first air inlet and outlet, of the first air inlet pipeline and the first air outlet pipeline, and the first common pipeline is connected with the first air inlet and outlet.
And one ends of the second air inlet pipeline and the second air outlet pipeline, which are close to the second air inlet and outlet, are provided with a second common pipeline, and the second common pipeline is connected with the second air inlet and outlet.
Wherein, the vacuum pump is connected to the one end that first business turn over gas port was kept away from to first pipeline of giving vent to anger and the one end that second business turn over gas port was kept away from to the second pipeline of giving vent to anger.
Wherein, the fan is connected to the one end that first business turn over gas port was kept away from to first pipeline of giving vent to anger and the one end that second business turn over gas port was kept away from to the second pipeline of giving vent to anger, and the fan setting is at the air inlet end of vacuum pump.
Wherein, the one end that first inlet duct kept away from first business turn over gas port and the one end that second inlet duct kept away from the second business turn over gas port are connected the gas holder.
In order to solve the above technical problems, the second technical solution adopted by the present invention is: the PCB glue removing method comprises the following steps: placing the PCB in a box body; heating the PCB; controlling gas to be input into the box body from a first gas inlet and outlet of the box body, and removing resin on the PCB and outputting the gas from a second gas inlet and outlet; controlling gas to be input into the box body from a second gas inlet and outlet of the box body, and removing resin on the PCB and then outputting the gas from the first gas inlet and outlet; and inputting gas to clean impurities on the PCB.
The invention has the beneficial effects that: different from the prior art, the PCB glue removing device and the PCB glue removing method are provided, the glue removing device is provided with the box body, the first air inlet and outlet pipeline, the second air inlet and outlet pipeline and the controller, the first air inlet and outlet pipeline and the second air inlet and outlet pipeline are connected with two relative positions of the box body, the first air inlet and outlet pipeline and the second air inlet and outlet pipeline are controlled by the controller to be matched with each other, air flow in the box body is enabled to be parallel to a PCB placed in the box body, air can be input into or discharged out of the box body through the first air inlet and outlet pipe and the second air inlet and outlet pipe which are arranged oppositely, and then the air can be fully contacted with the PCB after being plasmatized, so that the surface and the hole wall of the PCB can achieve the purpose of uniform glue removal, the structure is simple, and the operation is convenient.
Drawings
FIG. 1 is a schematic structural diagram of a PCB glue removing device according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a PCB glue removing method according to an embodiment of the present invention.
Detailed Description
The following describes in detail the embodiments of the present application with reference to the drawings attached hereto.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
In order to make those skilled in the art better understand the technical solution of the present invention, a PCB board glue removing apparatus and method provided by the present invention will be described in further detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a PCB board glue removing device according to an embodiment of the present invention. In this embodiment, a PCB glue removing device includes a box 1, a first air inlet and outlet pipe 2, a second air inlet and outlet pipe 3, and a controller 4.
The box 1 is a rectangular structure, the storage cavity 11 is arranged inside the box 1, the box door is arranged on one side of the box 1, the box 1 is provided with a first air inlet and outlet (not shown in the figure) and a second air inlet and outlet (not shown in the figure), and the first air inlet and outlet and the second air inlet and outlet are arranged at the relative positions of the box 1. Wherein, first business turn over gas port and second business turn over gas port can be the hole that forms on 1 lateral wall of box, also can be the round of arranging that sets up on 1 lateral wall of box, and the sealed cowling can be installed to the outside of 1 first business turn over gas port of box and second business turn over gas port, makes gaseous earlier get into the sealed cowling, and thing chamber 11 is put in the rethread round entering. Put and be used for holding PCB board 6 in the thing chamber 11, PCB board 6 can longitudinal arrangement place in putting thing chamber 11, also can transversely put in putting thing chamber 11. Specifically, a first air inlet and a second air inlet are provided at the top surface and the bottom surface of the case 1, respectively. In another alternative embodiment, the first air inlet and the second air inlet and outlet may be respectively provided on two oppositely disposed side walls of the case 1. As long as the airflow formed between the first air inlet and the second air inlet is parallel to the direction of the PCB board 6 placed in the placing cavity 11. In one embodiment, the chamber 1 is a plasma cleaner.
The first air inlet and outlet pipeline 2 comprises a first air inlet pipeline 21 and a first air outlet pipeline 22 respectively, and one end of the first air inlet pipeline 21 and one end of the first air outlet pipeline 22 are connected with a first air inlet and outlet of the box body 1. The other end of the first air outlet pipeline 22 is connected with the vacuum pump 8, and the other end of the first air inlet pipeline 21 is connected with the air storage tank 7. The first gas inlet and outlet pipeline 2 is provided with a control valve (not shown in the figure), the control valve is in signal connection with the controller 4, and the controller 4 controls the gas flowing state in the first gas inlet and outlet pipeline 2 through the control valve. The control valves comprise a first control valve 51 and a second control valve 52, the first control valve 51 is arranged on the first air inlet pipeline 21, and the controller 4 controls whether the gas in the gas storage tank 7 is conveyed into the box body 1 through the first air inlet pipeline 21 or not through the first control valve 51; the second control valve 52 is arranged on the first gas outlet pipeline 22, the controller 4 controls whether the gas in the box body 1 is conveyed out of the box body 1 through the first gas outlet pipeline 22 through the second control valve 52, and the first gas outlet pipeline 22 can be sequentially provided with the fan 9 and the vacuum pump 8. Specifically, the first control valve 51 is a solenoid valve, and the second control valve 52 is a vacuum valve. In an alternative embodiment, the first inlet pipe 21 and the first outlet pipe 22 have a first common pipe 33 at the end near the first inlet/outlet, and the first common pipe 33 is connected to the first inlet/outlet of the box 1.
The second air inlet and outlet pipeline 3 comprises a second air inlet pipeline 31 and a second air outlet pipeline 32 respectively, and one end of the second air inlet pipeline 31 and one end of the second air outlet pipeline 32 are connected with a second air inlet and a second air outlet of the box body 1. The other end of the second air outlet pipeline 32 is connected with the vacuum pump 8, and the other end of the second air inlet pipeline 31 is connected with the air storage tank 7. And a control valve is arranged on the second air inlet and outlet pipeline 3 and is in signal connection with a controller 4, and the controller 4 controls the gas circulation state in the second air inlet and outlet pipeline 3 through the control valve. The control valves further comprise a third control valve 53 and a fourth control valve 54, the third control valve 53 is arranged on the second air inlet pipeline 31, and the controller 4 controls whether the gas in the gas storage tank 7 is conveyed into the box body 1 through the second air inlet pipeline 31 or not through the third control valve 53; the fourth control valve 54 is arranged on the second gas outlet pipeline 32, the controller 4 controls whether the gas in the box body 1 is conveyed out of the box body 1 through the second gas outlet pipeline 32 or not through the fourth control valve 54, and the second gas outlet pipeline 32 can be sequentially provided with the fan 9 and the vacuum pump 8. Specifically, the third control valve 53 is an electromagnetic valve, and the fourth control valve 54 is a vacuum valve. In an alternative embodiment, the ends of the second inlet pipe 31 and the second outlet pipe 32 close to the second inlet and outlet are a second common pipe 34, and the second common pipe 34 is connected to the second inlet and outlet of the tank 1. In an alternative embodiment, the ends of the first and second air inlet pipes 21 and 31 remote from the housing 1 may be a third common pipe 35, and the third common pipe 35 is connected to the air storage tank 7. In another alternative embodiment, the ends of the first outlet pipe 22 and the second outlet pipe 32 away from the box body 1 may be a fourth common pipe 36, and the fourth common pipe 36 is connected with the blower 9 and the vacuum pump 8 in sequence. In particular, the fan 9 may be a roots fan. Through setting up first inlet duct 21 and the first pipeline of giving vent to anger 22 one end sharing pipe, the second inlet duct 31 and the second pipeline of giving vent to anger 32's one end sharing pipe, the other end of first inlet duct 21 and the other end sharing pipe of second inlet duct 31, the other end of first outlet duct 22 and the second pipeline of giving vent to anger 32's other end sharing pipe, can practice thrift installation device's space, practice thrift the cost, and can further guarantee the inside leakproofness of box 1.
In other embodiments, the first inlet duct 21 and the first outlet duct 22 may be independent from each other. The first air inlet and outlet on the box body 1 are two, one end of the first air inlet pipeline 21 is connected with one first air inlet and outlet, and one end of the first air outlet pipeline 22 is connected with the other first air inlet and outlet. In another optional embodiment, the second air inlet pipe 31 and the second air outlet pipe 32 may also be disposed independently, two second air inlets and two second air outlets are disposed on the box 1, one end of the second air inlet pipe 31 is connected to one second air inlet and one end of the second air outlet pipe 32 is connected to the other second air inlet and one second air outlet. In another embodiment, when the PCB board 6 is longitudinally placed in the storage cavity 11, two first air inlets and two second air inlets may be respectively disposed at the top and the bottom of the case 1. When the PCB 6 is transversely placed in the storage cavity 11, the two first air inlets and two second air inlets may be respectively disposed on four sidewalls of the box body 1, and may also be disposed on two opposite sidewalls of the box body 1. As long as the first inlet/outlet connected to the first air inlet pipe 21 is disposed opposite to the second inlet/outlet connected to the second air outlet pipe 32, and the second inlet/outlet connected to the second air inlet pipe 32 is disposed opposite to the first inlet/outlet connected to the first air outlet pipe 22. Through setting up first inlet duct 21 and first outlet duct 22 mutually independent, set up second inlet duct 31 and second outlet duct 32 mutually independent, can conveniently maintain and manage each pipeline.
The controller 4 may control the first inlet pipe 21 and the second outlet pipe 32 to operate simultaneously by opening the first control valve 51 and the fourth control valve 54, and may also control the second inlet pipe 31 and the first outlet pipe 22 to operate simultaneously by opening the second control valve 52 and the third control valve 53. Make the interior air current that forms the parallel to PCB board 6 of box 1, and then make the gaseous glue that can evenly remove of plasmatizing to PCB board 6.
In a specific embodiment, a door of the box body 1 is opened, the PCB 6 is longitudinally arranged in the object placing cavity 11, the door is closed, the object placing cavity 11 is in a sealed state, a power supply of the box body 1 is opened, the fan 9 and the vacuum pump 8 are started, in a first stage, the controller 4 controls the first control valve 51 and the fourth control valve 54 to be opened, the second control valve 52 and the third control valve 53 are still in a closed state, gas in the gas storage tank 7 is conveyed into the object placing cavity 11 in the box body 1 through the first gas inlet pipeline 21 arranged at the top of the box body 1, the gas is subjected to glue removing treatment on the surface and the hole wall of the PCB 6 after being plasmatized in the object placing cavity 11, the gas in the object placing cavity 11 is output through the second gas outlet pipeline 32 arranged at the bottom of the box body 1, the gas discharged from the second gas outlet pipeline 32 is pumped out by the fan 9 and the vacuum pump 8, so that a top-down airflow is formed in the object placing cavity 11 to carry out the glue removing treatment on the longitudinally arranged PCB 6, and when the set time is reached, the second stage is started, the controller 4 controls the first control valve 51 and the fourth control valve 54 to be closed, the second control valve 52 and the third control valve 53 to be opened, so that the gas in the gas storage tank 7 is conveyed into the object placing cavity 11 in the box body 1 through the second gas inlet pipeline 31 arranged at the bottom of the box body 1, the gas is subjected to plasma treatment in the object placing cavity 11 and then is subjected to glue removing treatment on the surface and the hole wall of the PCB 6, the gas in the object placing cavity 11 is output through the first gas outlet pipeline 22 arranged at the top of the box body 1, the fan 9 and the vacuum pump 8 pump out the gas discharged from the first gas outlet pipeline 22, so that gas flow from bottom to top is formed in the object placing cavity 11 and is subjected to glue removing treatment on the PCB 6 longitudinally arranged, and after the set time is reached, the controller 4 controls the second control valve 52 and the third control valve 53 to be closed.
The PCB board gumming device that this embodiment provided, through setting up the box, first business turn over gas pipeline, second business turn over gas pipeline and controller, make first business turn over gas pipeline and second business turn over gas pipeline be connected with two relative positions of box, mutually support through first business turn over gas pipeline of controller control and second business turn over gas pipeline, make the interior gas flow of box be on a parallel with the PCB board of placing in the box, make gas can loop through relative first business turn over gas pipe and the input of second business turn over gas pipe or the discharge box that sets up, and then make gas can be abundant after being plasmatized contact with the PCB board, and then make PCB board surface and pore wall can reach the purpose of evenly removing glue, moreover, the steam generator is simple in structure, and convenient operation.
Referring to fig. 2, fig. 2 is a schematic flow chart illustrating a method for removing glue from a PCB according to an embodiment of the present invention.
A PCB glue removing method is carried out by using the PCB glue removing device in the embodiment, and comprises the following steps:
s1: and placing the PCB in the box body.
Specifically, the PCB board may be placed in the case longitudinally or in the case transversely. As long as the direction that the PCB board was placed is parallel with the air current direction that forms between the first business turn over gas port of box and the second business turn over gas port can.
S2: and heating the PCB.
Specifically, the box body is controlled to be heated, and the PCB is heated. The controller controls gas to be input into the box body from the first gas inlet and outlet through the first control valve, and controls the gas to be discharged from the box body from the second gas inlet and outlet through the fourth control valve, so that air in the box body is discharged. In an alternative embodiment, the controller controls the gas input into the tank through the second gas inlet/outlet port by the third control valve, and controls the gas exhaust from the tank through the first gas inlet/outlet port by the second control valve. In a specific embodiment, the temperature of the box body is controlled to be 85 ℃, the PCB is heated, and a proper temperature condition is provided for the subsequent glue removing operation. Wherein the gas consists of 80% oxygen and 20% nitrogen.
S3: controlling gas to be input into the box body from a first gas inlet and outlet of the box body, and removing resin on the PCB and outputting the gas from a second gas inlet and outlet; and then controlling the gas to be input into the box body from the second gas inlet and outlet of the box body, and removing the resin on the PCB and then outputting the gas from the first gas inlet and outlet.
Specifically, the controller controls gas to be input into the box body from a first gas inlet and outlet connected with a first gas inlet pipeline, the gas is composed of 80% of oxygen, 10% of carbon tetrafluoride and 10% of nitrogen, an RF generator arranged in the box body generates an electric field, and the oxygen and the carbon tetrafluoride generate plasma O under the action of a nitrogen environment and the electric field-And F-Plasma F-And O-Reacts with the resin on the surface and pore walls of the PCB board to produceCarbon dioxide, hydrogen fluoride gas and water, and the generated carbon dioxide and hydrogen fluoride gas are discharged out of the box body through a second gas outlet pipeline connected with a second gas inlet and a second gas outlet. And after the set time is reached, controlling gas to be input into the box body from a second gas inlet and outlet connected with a second gas inlet pipeline, reacting the gas with resin on the PCB after the gas is plasmatized to generate carbon dioxide, hydrogen fluoride gas and water, and discharging the generated carbon dioxide and hydrogen fluoride gas out of the box body through a first gas outlet pipeline connected with a first gas inlet and outlet. The nitrogen, the oxygen and the carbon tetrafluoride are continuously filled into the reactor at the same time according to a set proportion to react, and the generated carbon dioxide and hydrogen fluoride gas are continuously pumped out, so that resin residual glue on the wall of the through hole and the bottom of the blind hole can be effectively removed.
S4: and inputting gas to clean impurities on the PCB.
Specifically, gas is controlled to be input into the box body from a first gas inlet and outlet connected with a first gas inlet pipeline, the gas enters the box body, sundries on the surface of the PCB are blown away, and the gas carrying the blown-away sundries is discharged out of the box body from a second gas inlet and outlet connected with a second gas outlet pipeline. Wherein the gas is preferably pure oxygen.
In the method for removing glue from a PCB provided in this embodiment, the PCB is placed in a box body, the PCB is heated, gas is controlled to be input into the box body from a first gas inlet and outlet of the box body, and the gas is output from a second gas inlet and outlet after resin on the PCB is removed; controlling gas to be input into the box body from a second gas inlet and outlet of the box body, and removing resin on the PCB and then outputting the gas from the first gas inlet and outlet; then clear up the debris on the PCB board, make gaseous first business turn over trachea and the input of second business turn over trachea and second business turn over trachea or the discharge box that loops through relative setting, and then make gaseous can be abundant after being plasmatized contact with the PCB board, and then make PCB board surface and pore wall can reach the purpose of evenly removing glue.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a PCB board removes mucilage binding and puts which characterized in that, it includes to remove the mucilage binding:
the PCB board packaging box comprises a box body, a first PCB board packaging box body and a second PCB board packaging box body, wherein the box body is used for accommodating a PCB board, a first air inlet and a second air inlet and outlet are formed in the box body, and the first air inlet and outlet and the second air inlet and outlet are arranged oppositely;
the first air inlet and outlet pipeline comprises a first air inlet pipeline and a first air outlet pipeline respectively, and one end of the first air inlet pipeline and one end of the first air outlet pipeline are both connected with the first air inlet and outlet;
the second air inlet and outlet pipeline respectively comprises a second air inlet pipeline and a second air outlet pipeline, and one end of the second air inlet pipeline and one end of the second air outlet pipeline are both connected with the second air inlet and outlet;
and the controller is in signal connection with the first air inlet and outlet pipeline and the second air inlet and outlet pipeline so as to control the first air inlet pipeline and the second air outlet pipeline to work simultaneously, or the second air inlet pipeline and the first air outlet pipeline to work simultaneously.
2. The PCB glue removing device of claim 1, further comprising a control valve, wherein the control valve is disposed on the first air inlet/outlet pipeline and the second air inlet/outlet pipeline, the control valve is used for controlling the gas circulation in the first air inlet/outlet pipeline and the second air inlet/outlet pipeline, and the control valve is in signal connection with the controller.
3. The PCB glue removing device of claim 2, wherein the control valve comprises a first control valve, a second control valve, a third control valve and a fourth control valve, the first control valve is arranged on the first air inlet pipeline to control the working state of the first air inlet pipeline; the second control valve is arranged on the first air outlet pipeline to control the working state of the first air outlet pipeline; the third control valve is arranged on the second air inlet pipeline to control the working state of the second air inlet pipeline; and the fourth control valve is arranged on the second air outlet pipeline to control the working state of the second air outlet pipeline.
4. The PCB glue removing device of claim 3, wherein the first control valve and the third control valve are solenoid valves, and the second control valve and the fourth control valve are vacuum valves.
5. The PCB glue removing device of claim 1, wherein one end of the first air inlet pipe and one end of the first air outlet pipe close to the first air inlet and outlet are a first common pipe, and the first common pipe is connected with the first air inlet and outlet.
6. The PCB glue removing device of claim 1, wherein one end of the second air inlet pipe and one end of the second air outlet pipe close to the second air inlet and outlet are a second common pipe, and the second common pipe is connected with the second air inlet and outlet.
7. The PCB glue removing device of claim 1, wherein one end of the first air outlet pipeline away from the first air inlet and one end of the second air outlet pipeline away from the second air inlet and outlet are connected with a vacuum pump.
8. The PCB glue removing device of claim 7, wherein one end of the first air outlet pipeline away from the first air inlet and one end of the second air outlet pipeline away from the second air inlet and outlet are connected with a fan, and the fan is arranged at an air inlet end of the vacuum pump.
9. The PCB glue removing device of claim 1, wherein one end of the first air inlet pipeline away from the first air inlet and one end of the second air inlet pipeline away from the second air inlet are connected with an air storage tank.
10. A method for removing glue of a PCB is characterized by comprising the following steps:
placing the PCB in a box body;
heating the PCB;
controlling gas to be input into the box body from a first gas inlet and outlet of the box body, and after resin on the PCB is removed, outputting the gas from a second gas inlet and outlet; controlling gas to be input into the box body from the second gas inlet and outlet of the box body, and removing resin on the PCB and then outputting the gas from the first gas inlet and outlet;
and inputting gas to clean impurities on the PCB.
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| CN202010280856.4A CN113518510B (en) | 2020-04-10 | 2020-04-10 | PCB glue removing device and method |
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