CN113488513B - Display module and preparation method thereof - Google Patents
Display module and preparation method thereof Download PDFInfo
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- CN113488513B CN113488513B CN202110696307.XA CN202110696307A CN113488513B CN 113488513 B CN113488513 B CN 113488513B CN 202110696307 A CN202110696307 A CN 202110696307A CN 113488513 B CN113488513 B CN 113488513B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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Abstract
The application provides a display module and a preparation method. The display module comprises a display panel, wherein the display panel comprises a first area, a second area and a bending area arranged between the first area and the second area; the back plate is arranged on the back surface of the display panel and comprises a first back plate positioned in the first area and a second back plate positioned in the second area; the protective film is arranged on one side of the back plate, which is far away from the display panel; the material thermal expansion coefficient of the second back plate is greater than or equal to that of the protective film, and the material thermal expansion coefficient of the second back plate is less than 10 times that of the protective film, so that the risk that the display panel deforms due to foaming generated in the second area of the display panel when the display panel is subjected to a hot pressing process in the prior art is avoided.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a preparation method thereof.
Background
The large-size folding screen can be folded due to the screen size, is various in folding form, and is more and more accepted and favored by consumers along with the continuous improvement of the quality; however, the disadvantages of the large-sized folding screen in terms of the manufacturing process are still obvious, and many processes need to be improved step by step.
Especially in the process of realizing flexible bending, the rigid substrate (such as Glass substrate) of the display module section in the large-size folding screen is a non-bendable material, the prior art is to peel the rigid substrate and the flexible substrate on the rigid substrate by laser (LLO for short), then attach a layer of backboard on the flexible substrate to protect the flexible display panel, and considering the bending function of the flexible display panel, the backboard is divided into two sections by a slotting method, and a protection film is arranged on one side of the backboard far away from the flexible display panel, the two sections of backboard are respectively attached in the display area and the binding area of the corresponding flexible display panel, but in the actual attaching process, because the integrated circuit and the flexible circuit board are attached in the terminal area and high-temperature hot pressing is needed, at the moment, bubbles are easily generated between the backboard material body and the protection film due to the difference of the thermal expansion coefficients of the two materials, thereby causing the terminal area of the flexible display panel to deform and causing bad phenomena.
Disclosure of Invention
The embodiment of the application provides a display module, a preparation method thereof and a mobile terminal, which are used for avoiding the risk that a bonding area at the end of a display panel is deformed due to bubbles generated when the bonding area of the display panel is attached to devices such as a flip chip film.
An embodiment of the present application provides a display device, including:
the display panel comprises a first area, a second area and a bending area arranged between the first area and the second area;
the back plate is arranged on the back surface of the display panel and comprises a first back plate positioned in the first area and a second back plate positioned in the second area;
the protective film is arranged on one side of the back plate, which is far away from the display panel;
the material thermal expansion coefficient of the second back plate is larger than or equal to that of the protective film, and the material thermal expansion coefficient of the second back plate is smaller than 10 times that of the protective film.
In the display module provided by the embodiment of the application, the material of the protective film and the material of the second back plate are a combination of any two of polyethylene terephthalate, methyl methacrylate and polycarbonate.
In the display module provided by the embodiment of the application, the material of the second back plate is the same as that of the protective film.
In the display module provided by the embodiment of the application, the thickness of the second back plate is greater than that of the first back plate.
In the display module provided by the embodiment of the application, the thickness difference between the second back plate and the first back plate is 10-15 micrometers.
In the display module assembly that this application embodiment provided, the display module assembly still includes and is located first backplate with first glue film between the display panel, and be located the second backplate with second glue film between the display panel, the thickness of second glue film is less than the thickness of first glue film.
In the display module provided by the embodiment of the application, the sum of the thicknesses of the first adhesive layer and the first back plate is equal to the sum of the thicknesses of the second adhesive layer and the second back plate.
The embodiment of the application further provides a preparation method of the display module, which comprises the following steps:
providing a display panel, wherein the display panel comprises a first area, a second area and a bending area arranged between the first area and the second area;
forming a first back plate positioned in the first area on the back surface of the display panel;
forming a second back plate positioned in the second area on the back surface of the display panel;
and forming a protective film on one sides of the first back plate and the second back plate far away from the display panel, wherein the material thermal expansion coefficient of the second back plate is greater than or equal to that of the protective film, and the material thermal expansion coefficient of the second back plate is less than 10 times that of the protective film.
In the preparation method of the display module provided by the embodiment of the application, the material of the second back plate is the same as that of the protective film, and the second back plate and the protective film are integrally formed by adopting the same process.
In the preparation method of the display module provided by the embodiment of the application, a first back plate located in the first area is formed on the back surface of the display panel; the step of forming a second backplane in the second region on the back side of the display panel comprises:
forming a first glue layer positioned in the first area on the back surface of the display panel;
and forming a second adhesive layer positioned in the second area on the back surface of the display panel, wherein the thickness of the second adhesive layer is smaller than that of the first adhesive layer.
The beneficial effects of the embodiment of the application are as follows: this application is through setting up the material coefficient of thermal expansion of second backplate is greater than or equal to the material coefficient of thermal expansion of protection film, just the material coefficient of thermal expansion of second backplate is less than 10 times the material coefficient of thermal expansion of protection film, thereby avoided among the prior art, work as display panel carries out hot pressing technology, because the protection film with the coefficient of thermal expansion of second backplate is different, consequently is in display panel second district produces the bubble, and then causes the risk that the deformation takes place in display panel second district.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a display module in the prior art;
fig. 2 is a schematic view of a first structure of a display module according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a second structure of a display module according to an embodiment of the present disclosure;
fig. 4 is a schematic block diagram illustrating a process of a method for manufacturing a display module according to the present embodiment;
fig. 5A to 5E are schematic structural diagrams of a display module provided in an embodiment of the present application in a manufacturing process.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
Please refer to fig. 1, which is a schematic structural diagram of a display module in the prior art.
In the prior art, the display module includes a protective film 30, a back plate 20, a display panel 10, a polarizer 40, an optical adhesive 50, and a cover plate 60; the display panel 10 includes a first region 1000, a second region 2000, and a bending region 3000 disposed between the first region 1000 and the second region 2000; the back plate 20 is located at the back of the display panel 10, and the back plate 20 includes a first back plate 21 located in the first region 1000 and a second back plate 22 located in the second region 2000; the polarizer 40, the optical adhesive 50 and the cover plate 60 are sequentially stacked on one side of the light-emitting surface of the display panel 10; the display module further includes a binding element bound to the second region 2000, the binding element is located on a side of the display panel 10 away from the backplane 20, and the binding element includes a flip chip 70, a chip 80, and a flexible circuit board 90.
In the actual bonding process of the bonding element, a hot pressing process is usually adopted to attach the flip chip 70 to the second area 2000 of the display panel 10, the chip 80 is disposed on the side of the flip chip 70 away from the display panel 10, and the flexible circuit board 90 is disposed on the side of the flip chip 70 close to the display panel 10, however, in the second area 2000, bubbles are likely to occur between the second backplane 22 and the protective film 30 due to the difference of the thermal expansion coefficients of the two materials, so that the second area 2000 of the display panel 10 is deformed, and a bad phenomenon is caused. Accordingly, the embodiment of the present application provides a display module and a manufacturing method thereof, so as to avoid a risk that the display panel 10 is deformed due to bubbles generated in the second region 2000 of the display panel 10 when the display panel 10 is subjected to a hot pressing process in the prior art.
Referring to fig. 2 to 4, an embodiment of the present application provides a display module, including a display panel 10, where the display panel 10 includes a first region 1000, a second region 2000, and a bending region 3000 disposed between the first region 1000 and the second region 2000; a back plate 20 disposed on the back surface of the display panel 10, wherein the back plate 20 includes a first back plate 21 located in the first region 1000 and a second back plate 22 located in the second region 2000; a protective film 30 disposed on a side of the back plate 20 away from the display panel 10; wherein the coefficient of thermal expansion of the material of the second back plate 22 is greater than or equal to the coefficient of thermal expansion of the material of the protective film 30, and the coefficient of thermal expansion of the material of the second back plate 22 is less than 10 times of the coefficient of thermal expansion of the material of the protective film 30.
In the embodiment of the present application, by setting the second backplane 22 to be located in the second area 2000 of the display panel 10, the material thermal expansion coefficient of the second backplane 22 is greater than or equal to the material thermal expansion coefficient of the protection film 30, and the material thermal expansion coefficient of the second backplane 22 is less than 10 times of the material thermal expansion coefficient of the protection film 30, thereby avoiding the risk that the second area 2000 of the display panel 10 deforms due to bubbles generated in the second area 2000 of the display panel 10 when the display panel 10 is subjected to the hot pressing process in the prior art because the thermal expansion coefficients of the protection film 30 and the second backplane 22 are different.
The technical solution of the present application will now be described with reference to specific embodiments.
Referring to fig. 2, a first structural diagram of a display module according to an embodiment of the present disclosure is shown.
The embodiment provides a display module, which includes a display panel 10, where the display panel 10 includes a first region 1000, a second region 2000, and a bending region 3000 disposed between the first region 1000 and the second region 2000; a back plate 20 disposed on the back surface of the display panel 10; and the protective film 30 is arranged on one side of the back plate 20 far away from the display panel 10.
It is understood that, in the present embodiment, the display panel 10 may be an Organic Light-Emitting Diode (OLED) display panel 10 or a Light-Emitting Diode (LED) display panel 10, which is not limited in this embodiment, wherein the display panel 10 includes but is not limited to a substrate, a metal layer, an insulating layer, an active layer, and other conventional film layers stacked in sequence, and this embodiment does not have to be described in more detail.
In this embodiment, the display module further includes a chip on film 70 bonded to the second area 2000, and the chip on film 70 is located on a side of the display panel 10 away from the back plate 20. Further, the display module further includes a chip 80 disposed on a side of the chip on film 70 away from the display panel 10, and a flexible circuit board 90 disposed on a side of the chip on film 70 close to the display panel 10.
In this embodiment, the back sheet 20 includes a first back sheet 21 located in the first region 1000 and a second back sheet 22 located in the second region 2000, wherein the second back sheet 22 is located in the second region 2000 of the display panel 10, a material thermal expansion coefficient of the second back sheet 22 is greater than or equal to a material thermal expansion coefficient of the protection film 30, and a material thermal expansion coefficient of the second back sheet 22 is less than 10 times of a material thermal expansion coefficient of the protection film 30.
In the present embodiment, the orthographic projection of the chip on film 70 on the display panel 10 is located in the orthographic projection of the second backplane 22 on the display panel 10; it can be understood that, in the process of manufacturing the conventional display module, when the chip on film 70 is actually attached, a hot pressing process is usually adopted to attach the chip on film 70 to the second area 2000 of the display panel 10, however, in the second area 2000, bubbles are likely to occur between the second back plate 22 and the protective film 30 due to the difference of the thermal expansion coefficients of the two materials, so that the second area 2000 of the display panel 10 is deformed, which causes a bad phenomenon; in the embodiment, the thermal expansion coefficient of the material of the second back plate 22 is greater than or equal to the thermal expansion coefficient of the material of the protective film 30, and the thermal expansion coefficient of the material of the second back plate 22 is less than 10 times of the thermal expansion coefficient of the material of the protective film 30, so that the risk that the second area 2000 of the display panel 10 is deformed due to bubbles generated in the second area 2000 of the display panel 10 due to different thermal expansion coefficients of the protective film 30 and the second back plate 22 when the display panel 10 is subjected to the hot pressing process in the prior art is avoided.
In this embodiment, the material of the first back plate 21 is polyimide; the material of the second back sheet 22 and the material of the protective film 30 are selected from polyethylene terephthalate, methyl methacrylate, and polycarbonateAny two of them, preferably, the material of the second back plate 22 and the material of the protective film 30 are both (1-10) x 10 with the thermal expansion coefficient in the range of 23-100 DEG C-6m/(m.k) Polyethylene terephthalate (PET for short).
It is understood that, in the present embodiment, the thermal expansion coefficients of the material of the second back plate 22 and the material of the protective film 30 are both (1 to 10) × 10 within the range of 23 to 100 ℃-6The m/(m.k) polyethylene terephthalate is used for illustration only, and the embodiment is not particularly limited thereto.
In this embodiment, the material of the second back plate 22 is the same as the material of the protection film 30, so that the thermal expansion coefficient of the material of the second back plate 22 is the same as the thermal expansion coefficient of the material of the protection film 30, thereby maximally avoiding the phenomenon of generating bubbles between the second back plate 22 and the protection film 30 when a hot pressing process is adopted in the display module manufacturing process.
In this embodiment, the display device further includes conventional film layers such as a polarizer 40, an optical adhesive 50, and a cover plate 60 sequentially stacked on one side of the light emitting surface of the display panel 10, which is not described in detail in this embodiment.
Referring to fig. 3, a second structural schematic diagram of a display module according to an embodiment of the present disclosure is shown.
In this embodiment, the structure of the display module is similar to/the same as the first structure of the display module provided in the above embodiment, and please refer to the description of the display module in the above embodiment, which is not repeated herein, and the difference between the two is only:
in this embodiment, the thickness of the second back plate 22 is greater than the thickness of the first back plate 21, and further, the thickness difference between the second back plate 22 and the first back plate 21 is 10 to 15 micrometers. It can be understood that, compared with the prior art, the thickness of the second backplane 22 is equal to the thickness of the first backplane 21, in this embodiment, the thickness difference between the second backplane 22 and the first backplane 21 is set to be 10 micrometers to 15 micrometers, and the thickness of the second backplane 22 is increased, so that the stiffness of the second backplane 22 is enhanced, and further, the second area 2000 is more favorably supported, the capability of the second area 2000 to resist external force deformation is enhanced, when the display panel 10 is subjected to a hot pressing process to bind the flip chip film 70, the thicker second backplane 22 supports the second area 2000, so that the second area 2000 is not easily deformed, and the yield of the product is favorably improved.
In this embodiment, the display module further includes a first adhesive layer 101 located between the first back plate 21 and the display panel 10, and a second adhesive layer 102 located between the second back plate 22 and the display panel 10, wherein the thickness of the second adhesive layer 102 is smaller than that of the first adhesive layer 101.
It is understood that, in the present embodiment, both the first adhesive layer 101 and the second adhesive layer 102 may be an optical adhesive 50 layer or an optical adhesive 50 layer (OCA) or a foam rubber layer (foam). The material of the optical Adhesive 50 layer may be an Optically Clear Adhesive (OCA), and the OCA is a special Adhesive for cementing a transparent optical element, and has the advantages of being colorless and transparent, having a light transmittance of more than 90%, and having good cementing strength, and the optical Adhesive has the viscoelasticity.
Further, the thickness of the first adhesive layer 101 is 25 micrometers, and the thickness of the second adhesive layer 102 is 10 micrometers to 15 micrometers. It can be understood that, in the prior art, the thickness of the first adhesive layer 101 is usually set to be 25 micrometers, and the thickness of the second adhesive layer 102 is set to be 25 micrometers, in this embodiment, by reducing the thickness of the second adhesive layer 102, when the display panel 10 is subjected to the hot pressing process to bind the flip chip film 70, since the thickness of the second adhesive layer 102 is smaller, the deformation amount is smaller during the hot pressing process, thereby being beneficial to maintaining the dimensional stability of the second region 2000 of the display panel 10.
Specifically, in this embodiment, the sum of the thicknesses of the first adhesive layer 101 and the first back plate 21 main body is equal to the sum of the thicknesses of the second adhesive layer 102 and the second back plate 22 main body, which is beneficial to improving the flatness of the display module and avoiding the stress of the display module from concentrating to some film layers, thereby causing the product quality of the display module to be affected.
Referring to fig. 4, a schematic block diagram of a process of manufacturing a display module according to the present embodiment is shown.
The embodiment of the application further provides a manufacturing method of the display module, which comprises the following steps:
step S10: a display panel 10 is provided, wherein the display panel 10 includes a first region 1000, a second region 2000 and a bending region 3000 disposed between the first region 1000 and the second region 2000, as shown in fig. 5A.
It should be noted that the display panel 10 may be an organic Light-Emitting Diode (OLED) display panel 10 or a Light-Emitting Diode (LED) display panel 10, which is not limited in this embodiment, wherein the display panel 10 includes but is not limited to a substrate, a metal layer, an insulating layer, an active layer, and other conventional film layers that are stacked in sequence, and this embodiment does not make much details.
Step S20: a first back plate 21 located in the first region 1000 is formed on the back surface of the display panel 10.
In this embodiment, the step 20 includes the following steps:
step S21: a first glue layer 101 is formed on the back surface of the display panel 10 in the first region 1000.
Step S22: a first back plate 21 is formed on a side of the first adhesive layer 101 away from the display panel 10, as shown in fig. 5B.
Step S30: a second back plate 22 is formed in the second region 2000 at the back of the display panel 10.
In this embodiment, the step 30 includes the following steps:
step S31: a second glue layer 102 is formed on the back surface of the display panel 10 in the second region 2000.
In this embodiment, the thickness of the second adhesive layer 102 is smaller than that of the first adhesive layer 101. Specifically, the thickness of the first adhesive layer 101 is 25 micrometers, and the thickness of the second adhesive layer 102 is 10 micrometers to 15 micrometers. It can be understood that, in the prior art, the thickness of the first adhesive layer 101 is usually set to be 25 micrometers, and the thickness of the second adhesive layer 102 is set to be 25 micrometers, in this embodiment, by reducing the thickness of the second adhesive layer 102, when the display panel 10 is subjected to the hot pressing process to bind the flip chip film 70, since the thickness of the second adhesive layer 102 is smaller, the deformation amount is smaller during the hot pressing process, thereby being beneficial to maintaining the dimensional stability of the second region 2000 of the display panel 10.
Step S32: the second back plate 22 is formed on the side of the second glue layer 102 away from the display panel 10, as shown in fig. 5C.
In this embodiment, the thickness of the second back plate 22 is greater than the thickness of the first back plate 21, and further, the thickness difference between the second back plate 22 and the first back plate 21 is 10 to 15 micrometers. It can be understood that, compared with the prior art, the thickness of the second backplane 22 is equal to the thickness of the first backplane 21, in this embodiment, the thickness difference between the second backplane 22 and the first backplane 21 is set to be 10 micrometers to 15 micrometers, and the thickness of the second backplane 22 is increased, so that the stiffness of the second backplane 22 is enhanced, and further, the second area 2000 is more favorably supported, the capability of the second area 2000 to resist external force deformation is enhanced, when the display panel 10 is subjected to a hot pressing process to bind the flip chip film 70, the thicker second backplane 22 supports the second area 2000, so that the second area 2000 is not easily deformed, and the yield of the product is favorably improved.
In this embodiment, the sum of the thicknesses of the first adhesive layer 101 and the first back plate 21 main body is equal to the sum of the thicknesses of the second adhesive layer 102 and the second back plate 22 main body, which is beneficial to improving the flatness of the display module and avoiding the stress of the display module from concentrating to certain film layers, thereby causing the product quality of the display module to be affected.
Step S40: and forming a protective film 30 on the sides of the first back plate 21 and the second back plate 22 far away from the display panel 10, wherein the coefficient of thermal expansion of the material of the second back plate 22 is greater than or equal to that of the protective film 30, and the coefficient of thermal expansion of the material of the second back plate 22 is less than 10 times that of the protective film 30.
Preferably, in this embodiment, the material of the first back plate 21 is polyimide; the material of the second back plate 22 and the material of the protective film 30 are a combination of any two of polyethylene terephthalate, methyl methacrylate and polycarbonate, and preferably, the material of the second back plate 22 and the material of the protective film 30 both have thermal expansion coefficients within the range of 23-100 ℃ of (1-10) × 10-6m/(m.k) polyethylene terephthalate.
It can be understood that the material of the second back plate 22 is the same as the material of the protective film 30, and the second back plate 22 and the protective film 30 can be integrally formed by the same process, so that the manufacturing process of the display module is simplified, and the manufacturing cost of the display module is saved.
In this embodiment, the method for manufacturing a display module further includes the following steps:
step S50: a flip-chip film 70 is formed on a side of the display panel 10 away from the backplane 20, and the flip-chip film 70 is located in the second area 2000.
Specifically, in the present embodiment, the flip chip film 70 is attached to the second area 2000 of the display panel 10 by a hot pressing process, and it can be understood that in the present embodiment, by setting the thermal expansion coefficient of the material of the second back plate 22 to be greater than or equal to the thermal expansion coefficient of the material of the protective film 30, and setting the thermal expansion coefficient of the material of the second back plate 22 to be less than 10 times of the thermal expansion coefficient of the material of the protective film 30, a risk that the second area 2000 of the display panel 10 is deformed due to bubbles generated in the second area 2000 of the display panel 10 when the display panel 10 is subjected to the hot pressing process because the thermal expansion coefficients of the protective film 30 and the second back plate 22 are different in the prior art is avoided.
Step S60: a chip 80 is formed on the side of the chip on film 70 away from the display panel 10.
Step S70: a flexible circuit board 90 is formed on one side of the chip on film 70 close to the display panel 10, as shown in fig. 5D.
Step S80: a polarizer 40 is formed on the side of the display panel 10 away from the back plate 20.
Step S90: a cover plate 60 is formed on one side of the polarizer 40 away from the display panel 10, and the cover plate 60 and the polarizer 40 are adhered through an optical adhesive 50, as shown in fig. 5E.
The embodiment also provides a mobile terminal, which comprises a terminal main body and the display module in any one of the above embodiments.
The display module has already been described in detail in the above embodiments, and the description is not repeated here.
In specific application, the mobile terminal can be a display screen of a smart phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, intelligent glasses, an intelligent helmet, a desktop computer, an intelligent television or a digital camera and the like.
In summary, the present application provides a display module and a manufacturing method thereof, where the display module includes a display panel, and the display panel includes a first region, a second region, and a bending region disposed between the first region and the second region; the back plate is arranged on the back surface of the display panel and comprises a first back plate positioned in the first area and a second back plate positioned in the second area; the protective film is arranged on one side, far away from the display panel, of the back plate; the material thermal expansion coefficient of the second back plate is greater than or equal to that of the protective film, and the material thermal expansion coefficient of the second back plate is less than 10 times that of the protective film, so that the risk that the display panel deforms due to foaming generated in the second area of the display panel when the display panel is subjected to a hot pressing process in the prior art is avoided.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above embodiments of the present application are described in detail, and specific examples are applied in the present application to explain the principles and implementations of the present application, and the description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (8)
1. A display module, comprising:
the display panel comprises a first area, a second area and a bending area arranged between the first area and the second area;
the back plate is arranged on the back surface of the display panel and comprises a first back plate positioned in the first area and a second back plate positioned in the second area;
the protective film is arranged on one side of the back plate, which is far away from the display panel;
the material thermal expansion coefficient of the second back plate is greater than or equal to that of the protective film, and the material thermal expansion coefficient of the second back plate is less than 10 times that of the protective film;
wherein the material of the second back plate is the same as that of the protective film.
2. The display module according to claim 1, wherein a material of the protective film and a material of the second back plate are a combination of any two of polyethylene terephthalate, methyl methacrylate, and polycarbonate.
3. The display module of claim 1, wherein the second backplane has a thickness greater than a thickness of the first backplane.
4. The display module of claim 3, wherein the thickness difference between the second back plate and the first back plate is 10-15 microns.
5. The display module of claim 3, further comprising a first glue layer between the first back plate and the display panel and a second glue layer between the second back plate and the display panel, wherein the thickness of the second glue layer is less than the thickness of the first glue layer.
6. The display module of claim 5, wherein a sum of thicknesses of the first glue layer and the first backplane is equal to a sum of thicknesses of the second glue layer and the second backplane.
7. A preparation method of a display module is characterized by comprising the following steps:
providing a display panel, wherein the display panel comprises a first area, a second area and a bending area arranged between the first area and the second area;
forming a first back plate positioned in the first area on the back surface of the display panel;
forming a second back plate positioned in the second area on the back surface of the display panel;
and forming a protective film on one side of the first back plate and the second back plate, which is far away from the display panel, wherein the material thermal expansion coefficient of the second back plate is greater than or equal to that of the protective film, the material thermal expansion coefficient of the second back plate is less than 10 times that of the protective film, the material of the second back plate is the same as that of the protective film, and the second back plate and the protective film are integrally formed by adopting the same process.
8. The method for manufacturing a display module according to claim 7, wherein a first back plate is formed on the back surface of the display panel in the first region; the step of forming a second backplane in the second region on the back side of the display panel comprises:
forming a first glue layer positioned in the first area on the back surface of the display panel;
and forming a second adhesive layer positioned in the second area on the back surface of the display panel, wherein the thickness of the second adhesive layer is smaller than that of the first adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110696307.XA CN113488513B (en) | 2021-06-23 | 2021-06-23 | Display module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110696307.XA CN113488513B (en) | 2021-06-23 | 2021-06-23 | Display module and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113488513A CN113488513A (en) | 2021-10-08 |
| CN113488513B true CN113488513B (en) | 2022-05-03 |
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| CN110391200A (en) * | 2019-08-09 | 2019-10-29 | 京东方科技集团股份有限公司 | Show structure and preparation method thereof, display device |
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| JPWO2018043155A1 (en) * | 2016-08-30 | 2019-06-24 | 東レフィルム加工株式会社 | Protective film and laminated film |
| CN108932074B (en) * | 2017-05-27 | 2021-05-25 | 和鑫光电股份有限公司 | Display device |
| US10649267B2 (en) * | 2017-07-19 | 2020-05-12 | Innolux Corporation | Display device and manufacturing method thereof |
| CN108777112B (en) * | 2018-06-06 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof, display module and electronic device |
| CN109148380B (en) * | 2018-08-21 | 2021-02-02 | 武汉华星光电半导体显示技术有限公司 | Display panel, display module and electronic device |
| CN109860255A (en) * | 2019-02-20 | 2019-06-07 | 深圳市华星光电技术有限公司 | The preparation method of flexible display panels |
| CN110890025A (en) * | 2019-11-27 | 2020-03-17 | 京东方科技集团股份有限公司 | Touch display device |
| CN111187576B (en) * | 2020-01-03 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible display device and preparation method thereof |
| CN213183388U (en) * | 2020-11-06 | 2021-05-11 | 京东方科技集团股份有限公司 | Display module and display device |
| CN112863338B (en) * | 2021-01-12 | 2022-05-31 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
| CN112864206B (en) * | 2021-01-20 | 2022-06-10 | 武汉华星光电半导体显示技术有限公司 | Display device |
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| CN110192291A (en) * | 2019-04-16 | 2019-08-30 | 京东方科技集团股份有限公司 | Multilayer film, display panel and its manufacturing method and display equipment |
| CN110391200A (en) * | 2019-08-09 | 2019-10-29 | 京东方科技集团股份有限公司 | Show structure and preparation method thereof, display device |
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