CN113458580A - Joining device - Google Patents
Joining device Download PDFInfo
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- CN113458580A CN113458580A CN202010236332.5A CN202010236332A CN113458580A CN 113458580 A CN113458580 A CN 113458580A CN 202010236332 A CN202010236332 A CN 202010236332A CN 113458580 A CN113458580 A CN 113458580A
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- pair
- metal plates
- metal plate
- heat
- joining device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
A joining device is provided which joins a pair of metal plates to each other. The bonding apparatus includes a plurality of processing units. One of the plurality of processing units is a heat and pressure processing unit. The heating and pressurizing treatment section includes a heating section for heating the pair of metal plates and a pressurizing section for pressurizing the pair of metal plates.
Description
Technical Field
The present invention relates to a joining device.
Background
Conventionally, various apparatuses for joining metals have been known. For example, there are substrate bonding apparatuses as follows: the surface of the sputter-etched first base material and a second base material having sputter particles made of the material of the first base material adhered to the surface thereof are pressed against each other so as to overlap each other, whereby the first base material and the second base material are bonded to each other at normal temperature. The substrate bonding apparatus supplies a gas such as argon gas to a chamber in a high vacuum environment, thereby performing sputter etching of a first substrate and adhesion of sputtered particles to a second substrate simultaneously in the chamber. Further, the substrate bonding apparatus bonds the first substrate and the second substrate after stopping the supply of the gas. (see, for example, Japanese patent laid-open publication Nos. 2018-18997)
Patent document 1: japanese patent laid-open publication No. 2018-18997
However, the above bonding needs to be performed in a chamber under a high vacuum environment. Therefore, a dedicated device and a substrate for adjusting the bonding environment are required, and the time required for the treatment may also become long. Therefore, the metal joining cannot be easily and quickly performed, and the cost required for the joining process may also become high.
Disclosure of Invention
The purpose of the present invention is to easily join a pair of metal plates.
An exemplary joining device of the present invention joins a pair of metal plates to each other. The bonding apparatus includes a plurality of processing units. One of the plurality of processing units is a heat and pressure processing unit. The heating and pressurizing treatment section includes a heating section for heating the pair of metal plates and a pressurizing section for pressurizing the pair of metal plates.
According to the exemplary joining device of the present invention, a pair of metal plates can be easily joined.
Drawings
Fig. 1 is a conceptual diagram illustrating an example of the internal structure of the joining device.
Fig. 2 is a perspective view of the engagement device.
Fig. 3A is a perspective view of the heat conductive member.
FIG. 3B is a sectional view taken along line A-A showing a structural example of the heat conductive member.
Fig. 3C is a cross-sectional view showing an example of a joining structure at a contact portion where a pair of metal plates contact each other.
Fig. 4 is a conceptual diagram illustrating a configuration example of the heat and pressure treatment unit.
Fig. 5 is a conceptual diagram illustrating another configuration example of the heat and pressure treatment unit.
Fig. 6 is a plan view of the first heating part.
Description of the reference symbols
100: an engaging device; 110: a processing unit; 111: a conveyance processing unit; 112: a heat and pressure treatment section; 113: a pretreatment section; 114: a post-processing section; 5: a heat conductive member; 6: a heat generating source; 51: a pair of metal plates; 51 a: a heated portion; 51 b: a heat dissipating section; 510: a space; 511: a first metal plate; 512: a second metal plate; 513: a contact portion; 52: a working medium; 53: a core structure; 1: a heating section; 11: a first heating section; 12: a second heating section; 2: a pressurization part; 20: a fixed part; 21: a first pressurization part; 22: a second pressurization part; 120: a carrying mechanism; 130: a working chamber; 131: a carrying port; g: an inert gas; cr: and (4) crystallizing the grains.
Detailed Description
The following describes exemplary embodiments with reference to the drawings.
In the present specification, the direction in which the first metal plate 511 and the second metal plate 512 face each other in the heat conduction member 5 and the joining device 100 is referred to as the "vertical direction". The direction from the first metal plate 511 to the second metal plate 512 in the vertical direction is referred to as "upper", and the direction from the second metal plate 512 to the first metal plate 511 is referred to as "lower". In each component, an upper end is referred to as an "upper end", and a lower end is referred to as a "lower end". In addition, among the surfaces of the respective components, the surface facing upward is referred to as "upper surface", and the surface facing downward is referred to as "lower surface".
The matters described above are not strictly applied to the case of being incorporated into an actual apparatus.
< 1. embodiment >
< 1-1. coupling device
Fig. 1 is a conceptual diagram illustrating an example of the internal structure of the joining apparatus 100. Fig. 2 is a perspective view of the joining device 100. The joining device 100 joins the pair of metal plates 51 to each other. The details of the pair of metal plates 51 will be described later.
The bonding apparatus 100 includes a plurality of processing units 110. Further, the joining device 100 includes a conveyance mechanism 120 and a working chamber 130.
< 1-1-1. multiple processing sections >
In the present embodiment, one processing unit 110 of the plurality of processing units 110 is a conveyance processing unit 111. In the conveyance processing unit 111, the pair of metal plates 51 can enter and exit through a conveyance port 131 formed in a side surface of the working chamber 130. For example, in the conveyance processing unit 111, the pair of metal plates 51 that are not joined are carried into the conveyance mechanism 120. Then, in the conveyance processing unit 111, the pair of joined metal plates 51 are taken out from the conveyance mechanism 120 and replaced with, for example, a pair of metal plates 51 that are not joined.
One of the plurality of processing units 110 is a heat and pressure processing unit 112. The heat and pressure processing unit 112 heats and presses the pair of metal plates 51. Hereinafter, the process of heating and pressing the pair of metal plates 51 is referred to as "heating and pressing process". Thereby, the heat and pressure treatment portion 112 bonds the contact portions 513 where the pair of metal plates 51 contact each other. The structure of the heat and pressure treatment section 112 will be described later.
One of the plurality of processing units 110 is a preprocessing unit 113. The pretreatment unit 113 performs a pretreatment of heat-pressure treatment on the pair of metal plates 51. The treatment performed in the pretreatment is not particularly limited. In the pretreatment, for example, the pair of metal plates 51 may be aligned. Alternatively, in the pretreatment, the pair of metal plates 51 may be subjected to machining such as cutting.
One of the plurality of processing units 110 is a post-processing unit 114. The post-treatment unit 114 performs post-treatment of heat-pressing the pair of metal plates 51. The treatment to be carried out in the post-treatment is not particularly limited. In the post-processing, for example, burrs or the like of a joint portion where the pair of metal plates 51 are joined to each other may be removed, or the pair of metal plates 51 may be polished.
In this way, the plurality of processing units 110 are composed of the conveyance processing unit 111, the heating and pressing processing unit 112, the pre-processing unit 113, and the post-processing unit 114. In other words, the bonding apparatus 100 includes a conveyance processing unit 111, a heating/pressing processing unit 112, a pre-processing unit 113, and a post-processing unit 114.
The plurality of processing units 110 are arranged in the circumferential direction. The circumferential direction is based on a direction in which the pair of metal plates 51 face each other. In the present embodiment, the circumferential direction is based on the vertical direction of the joining device 100 disposed on the ground. In the present embodiment, the vertical direction is parallel to the vertical direction. By arranging a plurality of processing units 110 in the circumferential direction, each processing unit 110 can be arranged in a smaller space. Therefore, the joining device 100 can be made more compact.
< 1-1-2. carrying mechanism >
As described above, the bonding apparatus 100 includes the conveyance mechanism 120. The conveying mechanism 120 is rotatable in the circumferential direction and conveys the pair of metal plates 51 to the respective processing units 110. More specifically, the conveying mechanism 120 rotates in the circumferential direction in a turntable manner. The conveying mechanism 120 conveys the pair of metal plates 51 arranged in each processing unit 110 from the processing unit 110 in which the pair of metal plates 51 are arranged to the processing unit 110 arranged adjacent to the processing unit in one circumferential direction. For example, the pair of metal plates 51 provided in the conveyance mechanism 120 and not joined to each other are conveyed to the front processing unit 113 by the conveyance processing unit 111 by the rotation of the conveyance mechanism 120. The pair of unbonded metal plates 51 subjected to the heat and pressure treatment in the pretreatment section 113 are conveyed to the heat and pressure treatment section 112. The pair of metal plates 51 joined by the heat and pressure treatment unit 112 are conveyed to the post-treatment unit 114. The pair of joined metal plates 51 subjected to the post-treatment of the heat and pressure treatment by the post-treatment unit 114 are conveyed to the conveyance unit 111, and are replaced with the pair of metal plates 51 that are not joined. In this way, the pair of metal plates 51 can be conveyed to the respective processing units 110 by the rotation of the conveying mechanism 120 in the circumferential direction. Therefore, for example, the pair of joined metal plates 51 can be returned to the conveyance processing unit 111.
Here, as shown in fig. 1, the plurality of processing units 110 are preferably arranged at equal intervals in the circumferential direction. In this way, the conveying mechanism 120 can convey the pair of metal plates 51 disposed in each processing unit 110 at the same time interval. Further, as in the present embodiment, when the pair of metal plates 51 are conveyed to the respective processing units 110 arranged at equal intervals by the rotation of the conveying mechanism 120 in the circumferential direction, the processing time in the respective processing units 110 including the conveying time can be made to be the same length of time.
< 1-1-3. working chamber >
As described above, the bonding apparatus 100 includes the working chamber 130 filled with the inert gas G. The plurality of processing units 110 are disposed in the working chamber 130. In the present embodiment, the conveyance processing unit 111, the heating and pressurizing processing unit 112, the pre-processing unit 113, and the post-processing unit 114 are disposed in the working chamber 130. Thus, the pair of metal plates 51 subjected to the heat and pressure treatment can be prevented from being oxidized.
The air pressure inside the working chamber 130 is higher than the air pressure outside the working chamber 130. This can suppress the inflow of outside air into the working chamber 130. Therefore, the decrease in the concentration of the inert gas G in the working chamber 130 can be suppressed. Further, dust, moisture, and the like can be prevented from flowing into the interior from the outside of the working chamber 130.
The inert gas G is preferably nitrogen or argon. By using nitrogen or argon, which is inexpensive, as the inert gas G, the cost required for the process of joining the pair of metal plates 51 can be reduced. Therefore, the productivity of the joining device 100 can be improved. However, the inert gas G is not limited to this example. The inert gas G may be another inert gas such as He, or may be a gas which is less chemically reactive with the pair of metal plates 51.
< 1-2 > A pair of metal plates
Next, a description will be given of a pair of metal plates 51 and a joining structure thereof with reference to fig. 3A to 3C. Fig. 3A is a perspective view of the heat conductive member 5. Fig. 3B is a sectional view taken along line a-a showing a structural example of the heat conductive member 5. Fig. 3C is a cross-sectional view showing an example of a joint structure in the contact portion 513 where the pair of metal plates 51 contact each other.
As shown in fig. 3A and 3B, the pair of metal plates 51 has a first metal plate 511 and a second metal plate 512. A contact portion 513 where the first metal plate 511 and the second metal plate 512 contact each other is bonded by the bonding apparatus 100. In the present embodiment, the pair of metal plates 51 after bonding is used as a casing of the heat conductive member 5 such as a steam chamber. That is, the bonding apparatus 100 according to the present embodiment may be at least a part of an apparatus for manufacturing the heat conductive member 5. However, this example does not limit the use of the joining device 100.
The heat conductive member 5 is used for heat dissipation of the heat generating source 6, for example. As shown in fig. 3B, in the heat conduction member 5, the working medium 52 and the core structure 53 are enclosed in a sealed space 510 inside the pair of metal plates 51. The working medium 52 is vaporized by heat transferred from the heat generating source 6 in the vicinity of the heated portion 51a of the pair of metal plates 51 in contact with the heat generating source 6, and is evaporated in the space 510. The working medium 52 is cooled and liquefied in the heat radiating portion 51b of the pair of metal plates 51 which is apart from the heated portion 51 a. The core structure 53 returns the liquefied working medium 52 to the vicinity of the heated portion 51 a.
When the pair of metal plates 51 are joined, the metal structure of the pair of metal plates 51 at the contact portion 513 is gradually reconfigured by the heat and pressure treatment at the heat and pressure treatment portion 112. Here, it is assumed that the heating and pressing treatment is performed at a predetermined temperature and pressure for several hours or more, and the metal atoms of the first metal plate 511 diffuse into the metal structure of the second metal plate 512, and the metal atoms of the second metal plate 512 diffuse into the metal structure of the first metal plate 511. Further, the interface between the first metal plate 511 and the second metal plate 512 at the contact portion 513 is completely eliminated, and the two are joined.
In contrast, in the present embodiment, by adjusting the heat and pressure treatment conditions in the heat and pressure treatment unit 112, as shown in fig. 3C, the interface portion between the first metal plate 511 and the second metal plate 512 at the contact portion 513 disappears. As a result, a junction structure having the first region a1 and the second region a2 is formed in the contact portion 513. In the first region a1, crystal grains Cr are generated by the reconstruction of the metal structure. The crystal grains Cr are present so as to cross the metal structure of the first metal plate 511 and the metal structure of the second metal plate 512. On the other hand, in the second region a2, the metal structure is not reformed, and a contact surface where the first metal plate 511 and the second metal plate 512 contact each other remains. Such a bonding structure can be formed by more relaxed processing conditions, in particular, at lower temperature conditions and in a shorter processing time, as compared with the case where the interface at the contact portion 513 is completely disappeared.
The contact portion 513 having such a bonding structure has high shielding property. For example, in the first region a1, the interface between the first metal plate 511 and the second metal plate 512 disappears, and both are joined by strong metal bonding, and therefore permeation of a fluid such as the liquefied or vaporized working medium 52 is highly suppressed. In the second region a2, the first metal plate 511 and the second metal plate 512 are not completely separated but bonded by a weak metal bond, and therefore have a sufficient permeation suppression effect on liquid and high-temperature gas. Therefore, the space sealed by the above-described joint structure has high sealing performance against a fluid such as the liquefied or vaporized working medium 52.
< 1-3 > heating and pressurizing treatment part
Next, the heat and pressure treatment unit 112 will be described with reference to fig. 4 and 5. Fig. 4 is a conceptual diagram illustrating a configuration example of the heat and pressure treatment unit 112. Fig. 5 is a conceptual diagram illustrating another configuration example of the heat and pressure treatment unit 112.
As shown in fig. 4 and 5, the heat and pressure treatment section 112 includes a heating section 1 and a pressure section 2. In other words, the bonding apparatus 100 includes the heating section 1 and the pressing section 2. The heating unit 1 heats the pair of metal plates 51. The pressurizing portion 2 pressurizes the pair of metal plates 51, and particularly pressurizes a contact portion 513 where the pair of metal plates 51 contact each other. The heat and pressure treatment unit 112 heats and presses the contact portions 513 of the pair of metal plates 51, thereby forming the above-described bonding structure at the contact portions 513 (see fig. 3C). Thereby, the pair of metal plates 51 can be easily and tightly bonded to each other.
< 1-2-1. heating section >
The heating unit 1 is disposed between the pair of metal plates 51 and the pressing unit 2. The heating section 1 has a first heating section 11 and a second heating section 12. The first heating unit 11 is disposed below the pair of metal plates 51. The second heating unit 12 is disposed above the pair of metal plates 51. When the pair of metal plates 51 are subjected to the heat and pressure treatment, the first heating unit 11 is in contact with the first metal plate 511, and the second heating unit 12 is in contact with the second metal plate 512.
The first heating part 11 heats the first metal plate 511 to a first temperature. The second heating part 12 heats the second metal plate 512 to a second temperature. The first temperature and the second temperature may be the same or may not be used. For example, when the first metal plate 511 and the second metal plate 512 are made of the same material, both may be at the same temperature or at different temperatures. When the first metal plate 511 and the second metal plate 512 are made of different materials, they may be at the same temperature or at different temperatures.
The first temperature is not higher than the melting point of the first metal plate 511. The first temperature is preferably 0.5 times or more and 1 time or less the melting point of the first metal plate 511. The first temperature is more preferably 0.5 times or more and 0.6 times or less the melting point of the first metal plate 511.
The second temperature is equal to or lower than the melting point of the second metal plate 512. The second temperature is preferably 0.5 times or more and 1 time or less the melting point of the second metal plate 512. The second temperature is more preferably 0.5 times or more and 0.6 times or less the melting point of the second metal plate 512.
In this way, the pair of metal plates 51 can be joined to each other at a lower temperature and in a shorter processing time than in diffusion joining or the like, without using a joining material such as a brazing material. Therefore, the joining process by the heat and pressure treatment of the pair of metal plates 51 can be performed easily and at low cost. This can further improve the productivity of the joining device 100.
Next, the configurations of the first heating unit 11 and the second heating unit 12 will be described. In the present embodiment, the first heating section 11 has the same configuration as the second heating section 12 except that the configuration is reversed from the top to the bottom. Hereinafter, the configuration of the first heating section 11 and the second heating section 12 will be described as the configuration of the heating section 1.
As shown in fig. 4 and 5, the heating unit 1 includes a heat conductor 1a and a heat source 1 b. More specifically, the first heating unit 11 and the second heating unit 12 have a heat conductor 1a and a heat source 1b, respectively. In the present embodiment, the heat conductor 1a is a metal block using stainless steel, and transfers heat emitted from the heat source 1b to the pair of metal plates 51. The heat source 1b can generate heat and release the generated heat to the heat conductor 1 a. In the present embodiment, the heat source 1b is a sheath heater and is disposed inside the heat conductor 1 a. However, the heat source 1b is not limited to the example of the present embodiment. The heat source 1b may be disposed outside the heating unit 1, or may be disposed outside the bonding apparatus 100. The heat source 1b may be a heating element other than the sheath heater or a heat supply source.
When viewed in the vertical direction, the planar dimension of the facing surfaces of the thermal conductor 1a facing the pair of metal plates 51 is larger than the planar dimension of the pair of metal plates 51 heated by the heating unit 1. For example, in the first heating unit 11, when viewed in the vertical direction, the planar dimension of the facing surface of the first heating unit 11 facing the first metal plate 511 of the heat conductor 1a is larger than the planar dimension of the first metal plate 511 heated by the first heating unit 11. The same applies to the second heating section 12. In this way, when the pair of metal plates 51 are subjected to the heat and pressure treatment, the pair of metal plates 51 can be disposed at positions inside the outer edge portions of the facing surfaces of the thermal conductor 1 a. In other words, when viewed in the vertical direction, the pair of metal plates 51 can be entirely overlapped on the surfaces of the thermal conductor 1a facing the pair of metal plates 51. Therefore, the heat generated by the heat source 1b can be more uniformly transferred to the pair of metal plates 51 on the facing surface of the heat conductor 1 a.
Further, when viewed in the vertical direction, the area of the heating unit 1 in which the heat source 1b is disposed is larger than the planar dimensions of the pair of metal plates 51 heated by the heating unit 1. For example, as shown in fig. 6, when viewed in the vertical direction, the area Ah in the first heating unit 11 where the heat source 1b is arranged is larger than the planar size of the first metal plate 511. Similarly, when viewed in the vertical direction, the area of the second heating unit 12 in which the heat source 1b is disposed is larger than the planar size of the second metal plate 512.
In this way, when the pair of metal plates 51 are heated, the pair of metal plates 51 can be arranged at a position inside the region where the heat source 1b is arranged. In other words, when viewed in the vertical direction, the pair of metal plates 51 can be entirely overlapped with the above-described region. Therefore, in the facing surface of the thermal conductor 1a, the variation in the heat conducted from the heat source 1b to the pair of metal plates 51 through the thermal conductor 1a can be further reduced. This enables the heat generated by the heat source 1b to be more uniformly transferred to the pair of metal plates 51.
< 1-2-2. pressurization part >
In fig. 4, the pressing portion 2 has a fixing portion 20 and a first pressing portion 21. The fixing unit 20 is disposed below the first heating unit 11, and is fixed to, for example, a gantry or a floor of the joining apparatus 100. The first pressing section 21 is disposed above the second heating section 12, and is vertically movable together with the second heating section 12. The first pressing portion 21 moves downward to press the second metal plate 512 toward the first metal plate 511. Thereby, the contact portion 513 where the first metal plate 511 and the second metal plate 512 are in contact with each other is joined by heat and pressure treatment.
The configuration of the pressurizing unit 2 is not limited to the example shown in fig. 4. As shown in fig. 5, the pressurizing unit 2 may have a second pressurizing unit 22 instead of the fixing unit 20 shown in fig. 4. In fig. 5, the second pressure section 22 is disposed below the first heating section 11 and is vertically movable together with the first heating section 11. The second pressing portion 22 moves upward to press the first metal plate 511 toward the second metal plate 512. Alternatively, the pressurizing unit 2 may have a fixing unit that does not pressurize the pair of metal plates 51 instead of the first pressurizing unit 21, in addition to the second pressurizing unit 22, without being limited to the examples shown in fig. 4 and 5.
That is, the pressurizing unit 2 may have at least one of the first pressurizing unit 21 and the second pressurizing unit 22. The first pressing portion 21 presses one metal plate 51 of the pair of metal plates 51 toward the other metal plate 51. The second pressing portion 22 presses the other metal plate 51 of the pair of metal plates 51 toward the one metal plate 51. In this way, the heat and pressure processing unit 112 can press the pair of heated metal plates 51 from one side or both sides.
< 2. other >)
The embodiments of the present invention have been described above. Further, those skilled in the art will appreciate that the above embodiments are illustrative, and various modifications can be made to the respective components and combinations of the respective processes, and the present invention is within the scope of the present invention.
Industrial applicability
The present invention can be used, for example, for a device for joining metals.
Claims (9)
1. A bonding apparatus for bonding a pair of metal plates to each other, comprising a plurality of processing units,
one of the plurality of processing sections is a heat and pressure processing section,
the heat and pressure treatment section includes:
a heating unit that heats the pair of metal plates; and
and a pressing section that presses the pair of metal plates.
2. The joining device of claim 1,
the plurality of processing portions are arranged in a circumferential direction with respect to a direction in which the pair of metal plates face each other.
3. The joining device of claim 1,
the joining device further includes a carrying mechanism capable of rotating in the circumferential direction,
the conveying mechanism conveys the pair of metal plates to the respective processing units.
4. The joining device according to claim 2 or 3,
the plurality of processing units are arranged at equal intervals in the circumferential direction.
5. The joining device according to any one of claims 1 to 4,
the joining device also has a working chamber filled with an inert gas,
the plurality of processing units are disposed in the working chamber.
6. The joining device of claim 5,
the inert gas is nitrogen or argon.
7. The joining device according to any one of claims 1 to 6,
the pressing portion has at least either one of a first pressing portion that presses one of the pair of metal plates toward the other metal plate and a second pressing portion that presses the other of the pair of metal plates toward the one metal plate.
8. The joining device according to any one of claims 1 to 7,
a pair of the metal plates has a first metal plate and a second metal plate,
the heating part has a first heating part that heats the first metal plate to a first temperature,
the first temperature is not higher than the melting point of the first metal plate.
9. The joining device of claim 8,
the heating part further has a second heating part that heats the second metal plate to a second temperature,
the second temperature is not higher than the melting point of the second metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010236332.5A CN113458580A (en) | 2020-03-30 | 2020-03-30 | Joining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010236332.5A CN113458580A (en) | 2020-03-30 | 2020-03-30 | Joining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113458580A true CN113458580A (en) | 2021-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010236332.5A Pending CN113458580A (en) | 2020-03-30 | 2020-03-30 | Joining device |
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| CN (1) | CN113458580A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022107462A1 (en) | 2022-03-29 | 2023-10-05 | Pva Industrial Vacuum Systems Gmbh | High temperature joining furnace |
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| CN1698190A (en) * | 2003-07-02 | 2005-11-16 | 东京毅力科创株式会社 | Joining method and joining device |
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| CN102832148A (en) * | 2011-06-13 | 2012-12-19 | 株式会社村田制作所 | Joint apparatus and joint method |
| KR20160033528A (en) * | 2014-09-18 | 2016-03-28 | 주식회사 성우하이텍 | Welding method for steel sheet and carbon fiber reinforced plastics sheet |
| TW201642379A (en) * | 2015-01-16 | 2016-12-01 | 東京威力科創股份有限公司 | Bonding system and bonding method |
| CN106471611A (en) * | 2015-03-31 | 2017-03-01 | 新电元工业株式会社 | Engagement device, joint method and presser unit |
| CN106605296A (en) * | 2015-03-31 | 2017-04-26 | 新电元工业株式会社 | Pressurization unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1698190A (en) * | 2003-07-02 | 2005-11-16 | 东京毅力科创株式会社 | Joining method and joining device |
| CN1927572A (en) * | 2005-09-05 | 2007-03-14 | 小松产机株式会社 | Press forming device |
| CN102832148A (en) * | 2011-06-13 | 2012-12-19 | 株式会社村田制作所 | Joint apparatus and joint method |
| KR20160033528A (en) * | 2014-09-18 | 2016-03-28 | 주식회사 성우하이텍 | Welding method for steel sheet and carbon fiber reinforced plastics sheet |
| TW201642379A (en) * | 2015-01-16 | 2016-12-01 | 東京威力科創股份有限公司 | Bonding system and bonding method |
| CN106471611A (en) * | 2015-03-31 | 2017-03-01 | 新电元工业株式会社 | Engagement device, joint method and presser unit |
| CN106605296A (en) * | 2015-03-31 | 2017-04-26 | 新电元工业株式会社 | Pressurization unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022107462A1 (en) | 2022-03-29 | 2023-10-05 | Pva Industrial Vacuum Systems Gmbh | High temperature joining furnace |
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Application publication date: 20211001 |