CN113383423A

CN113383423A - Electronic component and preparation method thereof, and mold and preparation method thereof

Info

Publication number: CN113383423A
Application number: CN201980090113.6A
Authority: CN
Inventors: 康佳昊; 袁泽; 管曦萌; 魏鹏
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2019-09-06
Filing date: 2019-09-06
Publication date: 2021-09-10
Also published as: WO2021042390A1

Abstract

An electronic component (10) and a preparation method thereof, a mold (20) and a preparation method thereof, wherein the electronic component (10) comprises a first elastic base material (300), a stretchable wire (100), a first functional element (210) and a second functional element (220), the stretchable wire (100), the first functional element (210) and the second functional element (220) are positioned on the same side of the first elastic base material (300), and two opposite ends of the stretchable wire (100) are respectively electrically connected with the first functional element (210) and the second functional element (220). The preparation method of the electronic component (10) is beneficial to improving the preparation yield of the electronic component (10) and is convenient for the mass production of the electronic component (10).

Description

Electronic component and preparation method thereof, and mold and preparation method thereof

Technical Field

The invention relates to the technical field of electronics, in particular to an electronic component and a preparation method thereof, and a mold and a preparation method thereof.

Background

The existing preparation method of the elastic electronic component relies on the elastic substrate too much, the preparation process of the elastic substrate is difficult to be compatible with the preparation process of the existing electronic device, the preparation efficiency of the elastic electronic component is reduced, and the production scale of the elastic electronic component is limited.

Disclosure of Invention

The embodiment of the invention provides an electronic assembly. The electronic assembly comprises a first elastic substrate, a stretchable wire, a first functional element and a second functional element, wherein the stretchable wire, the first functional element and the second functional element are positioned on the same side of the first elastic substrate, and two opposite ends of the stretchable wire are respectively electrically connected with the first functional element and the second functional element.

According to the electronic assembly provided by the embodiment of the application, the stretchable wire, the first functional element and the second functional element are all supported on the first elastic substrate, and the first elastic substrate can support and protect the stretchable wire, the first functional element and the second functional element, so that the service life of the electronic assembly is prolonged.

The embodiment of the invention provides a preparation method of an electronic component. The preparation method of the electronic assembly comprises the following steps:

providing a mould;

forming a stretchable wire on one side of the mold;

forming a first elastic substrate covering the stretchable conductive wire;

the mold is removed.

According to the preparation method of the electronic component, the mold is firstly provided, the stretchable conducting wire is formed on one side of the mold, the first elastic substrate covering the stretchable conducting wire is formed, and finally the mold is removed to obtain the electronic component. The mold is adopted to prepare the electronic component, so that the dependence on the first elastic base material can be reduced, and the large-scale production of the electronic component is facilitated.

Embodiments of the present invention also provide a mold for manufacturing an electronic component, the mold including a substrate and a shaping structure for shaping a stretchable conductive wire.

The embodiment of the invention also provides a preparation method of the mold, the mold is used for preparing the electronic component, and the preparation method of the mold comprises the following steps:

providing a substrate;

forming a photoresist layer covering the substrate;

arranging a light shield on one side of the light resistance layer, which is far away from the substrate, wherein the light shield is provided with gaps which are arranged at intervals;

illuminating the side of the photomask, which is far away from the photoresist;

and etching the photoresist layer formed after the illumination so as to enable the mold to have a shaped structure.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a flowchart of a first method for manufacturing an electronic component according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of an electronic component according to an embodiment of the present disclosure.

Fig. 3 is a schematic structural diagram corresponding to S100 in the method for manufacturing the electronic component in fig. 1.

Fig. 4 is a schematic structural diagram corresponding to S200 of the method for manufacturing the electronic component in fig. 1.

Fig. 5 is a schematic structural diagram of a corresponding method for manufacturing the electronic component in fig. 1.

Fig. 6 is a schematic structural diagram corresponding to S300 of the method for manufacturing the electronic component in fig. 1.

Fig. 7 is a schematic diagram of a corresponding structure of the method for manufacturing the electronic assembly of fig. 1.

Fig. 8 is a schematic structural diagram corresponding to S400 of the method for manufacturing the electronic component in fig. 1.

Fig. 9 is a partial schematic flow chart of a method S200 for manufacturing an electronic component according to an embodiment of the present application.

Fig. 10 is a schematic structural diagram corresponding to S210 in fig. 9.

Fig. 11 is a partial schematic flow chart of a method S200 for manufacturing an electronic component according to an embodiment of the present application.

Fig. 12 is a schematic structural diagram corresponding to S220 in fig. 11.

Fig. 13 is a schematic structural diagram corresponding to S230 in fig. 11.

Fig. 14 is a partial schematic flow chart of a method S200 for manufacturing an electronic component according to an embodiment of the present application.

Fig. 15 is a schematic structural diagram corresponding to S240 in fig. 14.

Fig. 16 is a schematic structural diagram corresponding to S250 in fig. 14.

Fig. 17 is a partial schematic flow chart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

Fig. 18 is a schematic structural diagram corresponding to S260 in fig. 17.

Fig. 19 is a schematic structural diagram corresponding to S270 in fig. 17.

Fig. 20 is a schematic structural diagram corresponding to S280 in fig. 17.

Fig. 21 is a partial schematic flow chart of a method S200 for manufacturing an electronic component according to an embodiment of the present application.

Fig. 22 is a schematic structural diagram corresponding to S201 in fig. 21.

Fig. 23 is a schematic structural diagram corresponding to S202 in fig. 21.

Fig. 24 is a partial schematic flow chart of a method S200 for manufacturing an electronic component according to an embodiment of the present application.

Fig. 25 is a schematic diagram of a structure corresponding to S203 in fig. 23.

Fig. 26 is a schematic structural diagram corresponding to S204 in fig. 24.

Fig. 27 is a partial schematic flow chart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

Fig. 28 is a schematic structural diagram corresponding to S205 in fig. 27.

Fig. 29 is a schematic structural diagram corresponding to S206 in fig. 27.

Fig. 30 is a schematic structural diagram corresponding to S207 in fig. 27.

Fig. 31 is a partial schematic flow chart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

Fig. 32 is a schematic diagram of a structure corresponding to S2001 in fig. 31.

Fig. 33 is a schematic diagram of a structure corresponding to S2002 in fig. 31.

Fig. 34 is a schematic diagram of a structure corresponding to S2003 in fig. 31.

Fig. 35 is a partial schematic flow chart of a method S200 for manufacturing an electronic component in an embodiment of the present application.

Fig. 36 is a schematic structural view corresponding to S2004 in fig. 35.

Fig. 37 is a schematic diagram of a structure corresponding to S2005 in fig. 35.

Fig. 38 is a schematic structural view corresponding to S2006 in fig. 35.

Fig. 39 is a schematic structural diagram corresponding to S2007 in fig. 35.

Fig. 40 is a partial schematic flow chart of a method S200 for manufacturing an electronic component according to an embodiment of the present application.

Fig. 41 is a schematic structural diagram corresponding to S211 in fig. 40.

Fig. 42 is a schematic structural diagram corresponding to S212 in fig. 40.

Fig. 43 is a schematic structural diagram corresponding to S213 in fig. 40.

Fig. 44 is a schematic structural diagram corresponding to S214 in fig. 40.

Fig. 45 is a partial schematic flow chart diagram of a method of manufacturing an electronic component in an embodiment of the present application.

Fig. 46 is a schematic structural diagram corresponding to S110 in fig. 45.

Fig. 47 is a partial schematic flow chart of a method of manufacturing an electronic component in an embodiment of the present application.

Fig. 48 is a schematic structural diagram corresponding to S215 in fig. 47.

Fig. 49 is a schematic structural diagram corresponding to S216 in fig. 47.

Fig. 50 is a schematic structural view corresponding to S217 in fig. 47.

Fig. 51 is a schematic structural diagram corresponding to S218 in fig. 47.

Fig. 52 is a partial schematic flow chart diagram illustrating a method of manufacturing an electronic component according to an embodiment of the present application.

Fig. 53 is a schematic structural diagram corresponding to S120 in fig. 52.

Fig. 54 is a schematic structural diagram corresponding to S130 in fig. 52.

Fig. 55 is a partial schematic flow chart diagram illustrating a method of manufacturing an electronic component according to an embodiment of the present application.

Fig. 56 is a schematic structural diagram corresponding to S410 in fig. 55.

Fig. 57 is a schematic structural diagram corresponding to S410 in fig. 55.

Fig. 58 is a partial schematic flow chart diagram illustrating a method of manufacturing an electronic component in an embodiment of the present application.

Fig. 59 is a schematic structural diagram corresponding to S420 in fig. 58.

Fig. 60 is a schematic structural diagram corresponding to S420 in fig. 58.

Fig. 61 is a partial schematic flow chart of a method of manufacturing an electronic component in an embodiment of the present application.

Fig. 62 is a schematic structural view corresponding to S430 in fig. 61.

Fig. 63 is a schematic structural diagram corresponding to S430 in fig. 61.

Fig. 64 is a schematic structural diagram of a first mold according to an embodiment of the present disclosure.

Fig. 65 is a schematic structural diagram of a second mold according to an embodiment of the present application.

Fig. 66 is a schematic structural diagram of a third mold according to an embodiment of the present application.

Fig. 67 is a flowchart of a method for manufacturing a first mold according to an embodiment of the present disclosure.

Fig. 68 is a structural diagram corresponding to W100 in fig. 67.

Fig. 69 is a structural diagram corresponding to W200 in fig. 67.

Fig. 70 is a structural diagram corresponding to W300 in fig. 67.

Fig. 71 is a structural diagram corresponding to W500 in fig. 67.

Fig. 72 is a partial flow chart of a method for manufacturing a mold according to an embodiment of the present disclosure.

Fig. 73 is a schematic diagram of a structure corresponding to W110 in fig. 72.

Fig. 74 is a schematic diagram of a structure corresponding to W120 in fig. 72.

Fig. 75 is a partial flow chart of a method for making a mold provided in an embodiment of the present application.

Fig. 76 is a schematic structural diagram corresponding to W210 in fig. 75.

Fig. 77 is a partial flowchart of a method for manufacturing a mold according to an embodiment of the present disclosure.

Fig. 78 is a structural diagram corresponding to W310 in fig. 77.

Fig. 79 is a schematic structural diagram of an electronic component according to an embodiment of the present application.

Fig. 80 is a schematic structural diagram of another electronic component provided in an embodiment of the present application.

Fig. 81 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 82 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 83 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 84 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 85 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 86 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 87 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Fig. 88 is a schematic structural diagram of another electronic component provided in the embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and fig. 2, fig. 1 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of an electronic component according to an embodiment of the present disclosure. In one embodiment, the electronic assembly 10 includes a first flexible substrate 300 and a stretchable conductive wire 100 disposed on one side of the first flexible substrate 300. When the first elastic substrate 300 is stretched, the stretchable conductive wire 100 is in an elongated state; when the first elastic base material 300 is in a free state, the stretchable conductive wire 100 is in a contracted state. In another embodiment, the electronic assembly 10 further includes a first functional element 210 and a second functional element 220, and the first functional element 210 and the second functional element 220 are electrically connected to two ends of the stretchable conductive wire 100, respectively. It should be noted that the number of the functional elements is not limited to two, that is, the number of the functional elements may be more than two, and if the electronic component is an elastic display screen, the number of the functional elements may be millions, and millions of the functional elements are electrically connected by the stretchable wires to form a mesh structure.

The preparation method of the electronic component includes, but is not limited to, S100, S200, S300, and S400, and the details of S100, S200, S300, and S400 are described below.

S100: a mold 20 is provided. Please refer to fig. 3.

The mold 20 is a tool for manufacturing the electronic component 10, and the mold 20 is used for manufacturing the electronic component 10, so that the structural shape of the electronic component 10 can be accurately controlled, the manufacturing yield of the electronic component 10 can be improved, and the large-scale production of the electronic component 10 can be facilitated.

In one embodiment, S200: a stretchable wire 100 is formed at one side of the mold 20. Please continue to refer to fig. 4.

In another embodiment, a stretchable conductive wire 100 and a first functional element 210 and a second functional element 220 electrically connected to both ends of the stretchable conductive wire 100 are formed at one side of the mold 20. Please continue to refer to fig. 5.

The first functional element 210 may be a control chip, and the second functional element 220 may also be a control chip. The first functional element 210 and the second functional element 220 are electrically connected to both ends of the stretchable wire 100, respectively, and the first functional element 210, the second functional element 220 and the stretchable wire 100 have different stretching rates. That is, the first functional element 210 and the second functional element 220 may be rigid functional elements. The first functional element 210 and the second functional element 220 may have different utilities such as computing, storage, sensing, communication, and the like. The first functional element 210 and the second functional element 220 can be formed directly by bonding, wire bonding, flip-chip packaging, or deposition and photolithography. Wherein, bonding refers to a technique of bonding two homogeneous or heterogeneous semiconductor materials with clean surfaces and flat atomic levels into a whole through van der waals force, molecular force and even atomic force after surface cleaning and activating treatment and direct bonding under certain conditions. Flip-chip packaging refers to depositing solder pads on both ends of the stretchable conductive wire 100 to form solder balls, flipping and positioning the first functional unit 210 and the second functional unit 220 so that the solder balls are opposite to the connectors of the functional units, reflowing the solder balls, and soldering the functional units to the stretchable conductive wire 100. The first functional element 210 and the second functional element 220 may also be various elements having corresponding functions, such as a capacitor, a resistor, an inductor, a conductive wire, a diode, and a transistor. The first functional element 210 and the second functional element 220 may also be made of an elastic or flexible material.

Wherein, the stretchable wire 100 may be metal, conductive ink, etc. The stretchable conductive wire 100 may be formed by a patterning method, and specifically, may be formed by photolithography, printing, or the like. Further, the horizontal pattern of the stretchable wire 100 may be implemented by a patterning process, and the vertical undulation of the stretchable wire 100 may be implemented by the shape of the mold 20.

In one possible embodiment, the stretchable wire 100 is formed at one side of the mold 20, and then the first functional element 210 and the second functional element 220 electrically connected to both ends of the stretchable wire 100 are formed.

In another possible embodiment, the first functional element 210 and the second functional element 220 are formed on one side of the mold 20, and then the stretchable wire 100 is formed between the first functional element 210 and the second functional element 220 such that one end of the stretchable wire 100 is electrically connected to the first functional element 210 and the other end of the stretchable wire 100 is electrically connected to the second functional element 220.

In one embodiment, S300: a first elastic substrate 300 covering the stretchable wire 100 is formed. Please continue to refer to fig. 6.

In another embodiment, a first elastic substrate 300 is formed to cover the first functional element 210, the second functional element 220 and the stretchable conductive wire 100. Please continue to refer to fig. 7.

The first elastic substrate 300 is a carrier for the first functional element 210, the second functional element 220 and the stretchable conductive wire 100. The material of the first elastic substrate 300 may be Thermoplastic polyurethane elastomers (TPU), Polydimethylsiloxane (PDMS), (hydrogenated styrene-butadiene Block copolymer, SEBS), styrene-butadiene-styrene Block copolymer (SBS), or the like.

S400: the mold 20 is removed. Please continue to refer to fig. 8.

By removing the mold 20 to obtain the electronic component 10, the method of removing the mold 20 may be a physical stripping method or a chemical dissolution method, which will be described in detail later and will not be described herein again.

The method for manufacturing an electronic component according to an embodiment of the present invention includes providing a mold 20, forming a stretchable conductive wire 100 and a first functional element 210 and a second functional element 220 electrically connected to two ends of the stretchable conductive wire 100 on one side of the mold 20, forming a first elastic substrate 300 covering the first functional element 210, the second functional element 220 and the stretchable conductive wire 100, and removing the mold 20 to obtain the electronic component 10. The mold 20 is used for manufacturing the electronic component 10, so that the dependence on the first elastic base material 300 in the manufacturing process can be reduced, the form of the stretchable lead 100 can be regulated and controlled in a three-dimensional manner, the structure of the electronic component 10 can be regulated and controlled accurately, the manufacturing yield of the electronic component 10 can be improved, and the large-scale production of the electronic component 10 can be facilitated.

With continued reference to fig. 9 and 10, the surface of the mold 20 is provided with a shaped structure a, S200: forming the stretchable conductive wire 100 at one side of the mold 20 includes: the stretchable wire 100 is formed by the shaped structure a.

In one embodiment, the shaped structure a includes a plurality of protruding portions 201 formed on a surface of the mold 20, two adjacent protruding portions 201 are connected smoothly, and the stretchable conductive wire 100 is laid on the protruding portions 201 to form a plurality of curved portions 100a connected smoothly in sequence.

S200 includes, but is not limited to, S210, and details regarding S210 are as follows.

S210: the stretchable conductive wire 100 is laid on the protrusion 201 to form a plurality of bent portions 100a smoothly connected in sequence.

Specifically, two adjacent protruding portions 201 are connected smoothly, that is, the protruding portions 201 have gentle slopes, and the stretchable conductive wire 100 is not easily broken when climbing in subsequent processes, which is helpful to ensure the production yield of the electronic component 10. The smooth connection refers to smooth connection between adjacent convex portions 201, and there is no turning point with abrupt curvature change. Since the adjacent protruding portions 201 are connected smoothly, when the stretchable conductive wire 100 is disposed on the protruding portions 201, the stretchable conductive wire 100 forms the smoothly connected curved portion 100a, i.e., the stretchable conductive wire 100 exhibits a gentle curved state, and at this time, the prepared stretchable conductive wire 100 is not easily broken, which helps to ensure the service life of the electronic component 10.

In another embodiment, the shaped structure a includes wave-shaped grooves opened on the surface of the mold 20, and the tensile wires 100 are formed in the wave-shaped grooves.

With continued reference to fig. 11, in one embodiment, S200 includes, but is not limited to, S220 and S230, which are described in detail below with respect to S220 and S230.

S220: the stretchable conductive wire 100 is formed at one side of the mold 20. Please continue to refer to fig. 12.

S230: the first functional element 210 and the second functional element 220 are formed on a side of the stretchable wire 100 facing away from the mold 20. Please continue to refer to fig. 13.

Specifically, in the present embodiment, the stretchable conductive wire 100 is formed on one side of the mold 20, and then the first functional element 210 and the second functional element 220 are formed on one side of the stretchable conductive wire 100 away from the mold 20, wherein one end of the stretchable conductive wire 100 is electrically connected to the first functional element 210, and the other end of the stretchable conductive wire 100 is electrically connected to the second functional element 220.

With continued reference to fig. 14, in one embodiment, S200 includes, but is not limited to, S240 and S250, which are described in detail below with respect to S240 and S250.

S240: the first functional element 210 and the second functional element 220 are formed at one side of the mold 20. Please continue to refer to fig. 15.

S250: the stretchable conductive wire 100 is formed on a side of the first functional element 210 and the second functional element 220 facing away from the mold 20. Please continue to refer to fig. 16.

Specifically, in the present embodiment, the first functional element 210 and the second functional element 220 are formed on one side of the mold 20, and then the stretchable conductive wire 100 is formed on one side of the first functional element 210 and the second functional element 220 away from the mold 20, wherein one end of the stretchable conductive wire 100 is electrically connected to the first functional element 210, and the other end of the stretchable conductive wire 100 is electrically connected to the second functional element 220. The first functional element 210 and the second functional element 220 are formed on one side of the mold 20, and the stretchable wire 100 is formed on the other side of the first functional element 210 and the second functional element 220 away from the mold 20, wherein the first functional element 210 and the second functional element 220 are made of harder materials, so that the first functional element 210 and the second functional element 220 can be conveniently separated from the mold 20, the preparation yield of the electronic component 10 can be improved, and the mass production of the electronic component 10 can be facilitated.

With continued reference to fig. 17, in one embodiment, S200 includes, but is not limited to, S260, S270, and S280, which are described in detail below with respect to S260, S270, and S280.

S260: the first functional element 210 is formed at one side of the mold 20. Please continue to refer to fig. 18.

S270: the stretchable conductive wire 100 is formed on a side of the first functional element 210 facing away from the mold 20. Please continue to refer to fig. 19.

S280: the second functional element 220 is formed at a side of the stretchable wire 100 facing away from the first functional element 210. Please continue to refer to fig. 20.

Specifically, in the present embodiment, the first functional element 210 is formed on one side of the mold 20, the stretchable conductive wire 100 is formed on the other side of the first functional element 210 facing away from the mold 20, and the second functional element 220 is formed on the other side of the stretchable conductive wire 100 facing away from the first functional element 210, wherein one end of the stretchable conductive wire 100 is electrically connected to the first functional element 210, and the other end of the stretchable conductive wire 100 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are respectively located at opposite sides of the stretchable wire 100, and when it is required to respectively locate the first functional element 210 and the second functional element 220 at opposite sides of the stretchable wire 100, the manufacturing method of the present embodiment may be employed.

With continued reference to fig. 21, 22 and 23, in one embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, and S200 includes, but is not limited to, S201 and S202, which are described in detail below with respect to S201 and S202.

S201: the first conductive line 101 and the second conductive line 102 are formed at one side of the mold 20. Please continue to refer to fig. 22.

S202: the first functional element 210 and the second functional element 220 are formed on a side of the first wire 101 and the second wire 102 facing away from the mold 20. Please continue to refer to fig. 23.

Specifically, in the present embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first conductive wire 101 and the second conductive wire 102 are formed on one side of the mold 20, and then a first functional element 210 and a second functional element 220 are formed on one sides of the first conductive wire 101 and the second conductive wire 102 away from the mold 20, wherein one end of the first conductive wire 101 is electrically connected to the first functional element 210, the other end of the first conductive wire 101 is electrically connected to the second functional element 220, one end of the second conductive wire 102 is electrically connected to the first functional element 210, and the other end of the second conductive wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are both located on the same side of the first conductive line 101, and the first functional element 210 and the second functional element 220 are both located on the same side of the second conductive line 102, and when it is required to dispose the first functional element 210 and the second functional element 220 on the same side of the first conductive line 101 and the second conductive line 102, the manufacturing method of the embodiment may be adopted.

It should be noted that, in this embodiment, there is no primary-secondary branch between the first wire 101 and the second wire 102, the first wire 101 and the second wire 102 are in the same position, each functional element may have 1, 2, or more ports, inputs and outputs the same or different signals, and the corresponding stretchable wires may be 1, 2, or more. Each wire may connect the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal and the first wire 101 is broken, the second wire 102 may be used to electrically connect the first functional element 210 and the second functional element 220. Also, when the first wire 101 and the second wire 102 are connected to the same signal and the second wire 102 is broken, the first wire 101 may be used to electrically connect the first functional element 210 and the second functional element 220.

With continued reference to fig. 24, 25 and 26, in one embodiment, the stretchable conductor 100 includes a first conductor 101 and a second conductor 102 spaced apart from each other, and S200 includes, but is not limited to, S203 and S204, which are described in detail below with respect to S203 and S204.

S203: the first functional element 210 and the second functional element 220 are formed at one side of the mold 20. Please continue to refer to fig. 25.

S204: the first wire 101 and the second wire 102 are formed on a side of the first functional element 210 and the second functional element 220 facing away from the mold 20. Please continue to refer to fig. 26.

Specifically, in the present embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, a first functional element 210 and a second functional element 220 are formed on one side of the mold 20, and then the first conductive wire 101 and the second conductive wire 102 are formed on the side of the first functional element 210 and the second functional element 220 away from the mold 20, wherein one end of the first conductive wire 101 is electrically connected to the first functional element 210, the other end of the first conductive wire 101 is electrically connected to the second functional element 220, one end of the second conductive wire 102 is electrically connected to the first functional element 210, and the other end of the second conductive wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are both located on the same side of the first conductive line 101, and the first functional element 210 and the second functional element 220 are both located on the same side of the second conductive line 102, and when it is required to dispose the first functional element 210 and the second functional element 220 on the same side of the first conductive line 101 and the second conductive line 102, the manufacturing method of the embodiment may be adopted.

Further, the hardness of the first functional element 210 and the second functional element 220 is greater than that of the stretchable wire 100, and with the manufacturing method of this embodiment, the first functional element 210 and the second functional element 220 are formed on one side of the mold 20, and then the first wire 101 and the second wire 102 are formed on one side of the first functional element 210 and the second functional element 220 away from the mold 20, because the first functional element 210 and the second functional element 220 are made of harder materials, the first functional element 210 and the second functional element 220 can be separated from the mold 20, which is beneficial to improving the manufacturing yield of the electronic assembly 10 and facilitating mass production of the electronic assembly 10. Furthermore, in this embodiment, there is no primary-secondary branch between the first conductive line 101 and the second conductive line 102, the first conductive line 101 and the second conductive line 102 are in the same position, each functional element may have 1, 2, or more ports for inputting and outputting the same or different signals, and the corresponding stretchable conductive lines may be 1, 2, or more. Each wire may connect the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal and the first wire 101 is broken, the second wire 102 may be used to electrically connect the first functional element 210 and the second functional element 220. Also, when the first wire 101 and the second wire 102 are connected to the same signal and the second wire 102 is broken, the first wire 101 may be used to electrically connect the first functional element 210 and the second functional element 220.

With continued reference to fig. 27, 28, 29 and 30, in one embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, and S200 includes, but is not limited to, S205, S206 and S207, which are described in detail below with respect to S205, S206 and S207.

S205: the first functional element 210 is formed at one side of the mold 20. Please continue to refer to fig. 28.

S206: the first conductor 101 and the second conductor 102 are formed on the side of the first functional element 210 facing away from the mold 20. Please continue to refer to fig. 29.

S207: the second functional element 220 is formed on a side of the first conductive line 101 and the second conductive line 102 facing away from the first functional element 210. Please continue to refer to fig. 30.

Specifically, in the present embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, a first functional element 210 is formed on one side of the mold 20, then the first conductive wire 101 and the second conductive wire 102 are formed on one side of the first functional element 210 away from the mold 20, and finally a second functional element 220 is formed on one side of the first conductive wire 101 and the second conductive wire 102 away from the first functional element 210, wherein one end of the first conductive wire 101 is electrically connected to the first functional element 210, the other end of the first conductive wire 101 is electrically connected to the second functional element 220, one end of the second conductive wire 102 is electrically connected to the first functional element 210, and the other end of the second conductive wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are respectively located at two opposite sides of the first conductive line 101, and the first functional element 210 and the second functional element 220 are respectively located at two opposite sides of the second conductive line 102, and when it is required to dispose both the first functional element 210 and the second functional element 220 at two opposite sides of the first conductive line 101 and the second conductive line 102, the preparation method of the embodiment may be adopted.

Further, in this embodiment, there is no primary-secondary branch between the first conductive line 101 and the second conductive line 102, the first conductive line 101 and the second conductive line 102 are in the same position, each functional element may have 1, 2, or more ports for inputting and outputting the same or different signals, and the corresponding stretchable conductive lines may be 1, 2, or more. Each wire may connect the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal and the first wire 101 is broken, the second wire 102 may be used to electrically connect the first functional element 210 and the second functional element 220. Also, when the first wire 101 and the second wire 102 are connected to the same signal and the second wire 102 is broken, the first wire 101 may be used to electrically connect the first functional element 210 and the second functional element 220.

With continued reference to fig. 31, 32, 33 and 34, in one embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, S200 includes, but is not limited to, S2001, S2002 and S2003, which are described in detail below with respect to S2001, S2002 and S2003.

S2001: the first conductive line 101 is formed at one side of the mold 20. Please continue to refer to fig. 32.

S2002: the first functional element 210 and the second functional element 220 are formed on a side of the first conductor 101 facing away from the mold 20. Please continue to refer to fig. 33.

S2003: a second conductor 102 is formed on a side of the first functional element 210 and the second functional element 220 facing away from the first conductor 101. Please continue to refer to fig. 34.

Specifically, in the present embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first conductive wire 101 is formed on one side of the mold 20, then a first functional element 210 and a second functional element 220 are formed on one side of the first conductive wire 101 away from the mold 20, and finally a second conductive wire 102 is formed on one side of the first functional element 210 and the second functional element 220 away from the first conductive wire 101, wherein one end of the first conductive wire 101 is electrically connected to the first functional element 210, the other end of the first conductive wire 101 is electrically connected to the second functional element 220, one end of the second conductive wire 102 is electrically connected to the first functional element 210, and the other end of the second conductive wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210 and the second functional element 220 are located between the first wire 101 and the second wire 102, and when it is necessary to dispose both the first functional element 210 and the second functional element 220 between the first wire 101 and the second wire 102, the manufacturing method of the present embodiment may be employed.

With continued reference to fig. 35, 36, 37, 38 and 39, in one embodiment, the stretchable wire 100 includes a first wire 101 and a second wire 102 arranged at intervals, S200 includes, but is not limited to, S2004, S2005, S2006 and S2007, and the details regarding S2004, S2005, S2006 and S2007 are as follows.

S2004: the first conductive line 101 is formed at one side of the mold 20. Please continue to refer to fig. 36.

S2005: the first functional element 210 is formed on a side of the first conductor 101 facing away from the mold 20. Please continue to refer to fig. 37.

S2006: a second conductor 102 is formed on a side of the first functional element 210 facing away from the first conductor 101. Please continue with fig. 38.

S2007: a second functional element 220 is formed on a side of the second conductive line 102 facing away from the first functional element 210. Please continue to refer to fig. 39.

Specifically, in the present embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first conductive wire 101 is formed on one side of the mold 20, then a first functional element 210 is formed on one side of the first conductive wire 101 facing away from the mold 20, then a second conductive wire 102 is formed on one side of the first functional element 210 facing away from the first conductive wire 101, and finally a second functional element 220 is formed on one side of the second conductive wire 102 facing away from the first functional element 210, wherein one end of the first conductive wire 101 is electrically connected to the first functional element 210, the other end of the first conductive wire 101 is electrically connected to the second functional element 220, one end of the second conductive wire 102 is electrically connected to the first functional element 210, and the other end of the second conductive wire 102 is electrically connected to the second functional element 220. At this time, the first conductive line 101, the first functional element 210, the second conductive line 102, and the second functional element 220 are sequentially staggered and stacked, and when it is necessary to sequentially stagger and stack the first conductive line 101, the first functional element 210, the second conductive line 102, and the second functional element 220, the manufacturing method of this embodiment may be adopted.

With continued reference to fig. 40, 41, 42, 43 and 44, in one embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, S200 includes, but is not limited to, S211, S212, S213 and S214, and details regarding S211, S212, S213 and S214 are described below.

S211: the first functional element 210 is formed at one side of the mold 20. Please continue to refer to fig. 41.

S212: the first conductor 101 is formed on a side of the first functional element 210 facing away from the mold 20. Please continue to refer to fig. 42.

S213: a second functional element 220 is formed on a side of the first conductor 101 facing away from the first functional element 210. Please continue to refer to fig. 43.

S214: a second conductor 102 is formed on a side of the second functional element 220 facing away from the first conductor 101. Please continue to refer to fig. 44.

Specifically, in the present embodiment, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, a first functional element 210 is formed on one side of the mold 20, then the first conductive wire 101 is formed on one side of the first functional element 210 facing away from the mold 20, then a second functional element 220 is formed on one side of the first conductive wire 101 facing away from the first functional element 210, and finally the second conductive wire 102 is formed on one side of the second functional element 220 facing away from the first conductive wire 101, wherein one end of the first conductive wire 101 is electrically connected to the first functional element 210, the other end of the first conductive wire 101 is electrically connected to the second functional element 220, one end of the second conductive wire 102 is electrically connected to the first functional element 210, and the other end of the second conductive wire 102 is electrically connected to the second functional element 220. At this time, the first functional element 210, the first conductive line 101, the second functional element 220, and the second conductive line 102 are sequentially staggered and stacked, and when it is necessary to sequentially stagger and stack the first functional element 210, the first conductive line 101, the second functional element 220, and the second conductive line 102, the manufacturing method of the present embodiment may be adopted.

Referring still to fig. 45, in one embodiment, before S200, the method for manufacturing the electronic device further includes, but is not limited to, S110, and the details about S110 are described below.

S110: a sacrificial layer 400 is formed covering the mold 20. Please continue to refer to fig. 46.

Wherein the sacrificial layer 400 may be dissolved by a specific liquid or etched by a gas.

Specifically, the material of the sacrificial layer 400 may be inorganic salts, inorganic oxides, organic polymers, metals, and the like. The sacrificial layer 400 may be dissolved by a specific liquid or etched by a gas, such as: inorganic salts can be dissolved by water, inorganic oxides can be dissolved by acids, alkalis, etc., organic polymers can be dissolved by organic solutions, developers, etc., and metals can be dissolved by acids, alkalis, etc.

With continued reference to FIG. 47, the S200 includes, but is not limited to, S215 and S216, and details regarding S215 and S216 are described below.

S215: a stretchable wire 100 is formed on a surface of the sacrificial layer 400. Please continue to refer to fig. 48.

S216: a first functional element 210 and a second functional element 220 electrically connected to both ends of the tensile conductive wire 100 are formed. Please continue to refer to fig. 49.

The S300 includes, but is not limited to, S317, and details regarding S317 are as follows.

S317: a first elastic substrate 300 is formed to cover the first functional element 210, the second functional element 220 and the stretchable conductive wire 100. Please continue to refer to fig. 50.

The S400 includes but is not limited to S418, and details regarding S418 are described below.

S418: the sacrificial layer 400 (not shown) is dissolved to separate the mold 20 and the electronic component 10. Please continue to refer to fig. 51.

Specifically, in this embodiment, the sacrificial layer 400 covering the mold 20 is formed, the sacrificial layer 400 may be dissolved by a liquid or etched by a gas, the stretchable conductive wire 100 covering the sacrificial layer 400 is formed, the first functional element 210 and the second functional element 220 electrically connected to opposite ends of the stretchable conductive wire 100 are formed together, the first elastic substrate 300 covering the first functional element 210, the second functional element 220 and the stretchable conductive wire 100 is formed, and the sacrificial layer 400 between the mold 20 and the stretchable conductive wire 100 is removed, so that the mold 20 and the electronic component 10 may be separated, and the electronic component 10 may be obtained.

Wherein the first elastic substrate 300 can encapsulate and protect the first functional element 210, the second functional element 220 and the stretchable wire 100. The material of the first elastic base 300 may be rubber, silicone, thermoplastic elastomer, or the like. The first elastic base 300 may be formed by coating, vapor deposition, casting, stamping, or the like.

Referring still to fig. 52, in one embodiment, before S200, the method for manufacturing the electronic device further includes, but is not limited to, S120 and S130, and the details about S120 and S130 are described below.

S120: a flexible substrate 410 is formed overlying the mold 20. Please continue to refer to fig. 53.

The material of the flexible substrate 410 may be a polyimide film. The flexible substrate 410 may be formed by coating, evaporation, or the like.

S130: the flexible substrate 410 is subjected to a patterning process. Please continue to refer to fig. 54.

The flexible substrate 410 may be patterned by photolithography, screen printing, inkjet printing, or the like. Because the electronic component is sequentially laminated by the flexible substrate, the stretchable lead wire, the functional element and the first elastic substrate, the stretchable lead wire and the functional element can be wrapped between the flexible substrate and the first elastic substrate, and the electronic component has a protection effect

It is understood that, in other embodiments, after the step S120, the stretchable conductive wire 100 is directly formed on the flexible substrate 410, and then the flexible substrate 410 and the stretchable conductive wire 100 are simultaneously patterned, so that a process is omitted and the manufacturing process is simplified. It is noted that the flexible substrate 410 and the stretchable wire 100 may be patterned simultaneously, in which case they are the same shape; the flexible substrate 410 may be patterned first and then the stretchable wire 100 may be patterned, in which case the shapes of the two may be the same or different; the stretchable wire 100 may be patterned first and then the flexible substrate 410 may be patterned, in which case the two may be the same or different in shape.

With continued reference to fig. 55, in one embodiment, the mold 20 is made of a dissolvable material, and S400 includes, but is not limited to S410, which is described in detail below with respect to S410.

S410: the mold 20 is dissolved. Please continue to refer to fig. 56 and 57.

Specifically, in the present embodiment, the mold 20 is made of a dissolvable material, and the mold 20 itself can be dissolved in a specific liquid or etched by a gas. The mold 20 formed by the preparation and the mold 20 in the electronic component 10 are dissolved, whereby the individual electronic component 10 can be obtained.

Further, the material of the mold 20 may be thermoplastic polyurethane elastomer rubber. The mold 20 may be dissolved by a strongly polar organic solvent, such as: dimethylformamide (DMF), butanone, cyclohexanone, acetone, ethyl acetate, toluene, and the like.

With continued reference to fig. 58, in one embodiment, the surface adhesion of the mold 20 is less than the predetermined threshold, and S400 further includes, but is not limited to, S420, which is described in detail below with respect to S420.

S420: mechanical stripping is used to separate the mold 20 and the electronic component 10. Please continue to refer to fig. 59 and 60.

Specifically, in the present embodiment, the surface adhesion of the mold 20 is less than the predetermined threshold, that is, the mold 20 has a low adhesion surface, that is, the surface adhesion of the mold 20 is weaker, and in this case, it is considered that the mold 20 and the electronic component 10 are separated by mechanical peeling. I.e. the electronic component 10 is peeled off from the surface of the mould 20 by means of a pulling force, so that a separate electronic component 10 is obtained.

With continued reference to fig. 61, in one embodiment, S400 further includes, but is not limited to, S430, and details regarding S430 are described below.

S430: laser ablation is used to separate the mold 20 and the electronic component 10. Please continue to refer to fig. 62 and 63.

Specifically, in the present embodiment, laser ablation is performed on the connection portion of the electronic component 10 and the mold 20 to separate the mold 20 and the electronic component 10, thereby obtaining an independent electronic component 10.

With continued reference to fig. 64, the present embodiment further provides a mold 20, the mold 20 is used for manufacturing an electronic component 10, the mold 20 includes a substrate 202 and a shaping structure a, and the shaping structure a is used for shaping the stretchable conductive wire 100.

In one embodiment, the shaped structure A comprises wave-shaped grooves formed in the surface of the substrate 202.

In another embodiment, the shaped structure a includes a plurality of protrusions 201 formed on the surface of the substrate 202, the plurality of protrusions 201 are arranged at intervals on the surface of the substrate 202, and a smooth connection is formed between two adjacent protrusions 201.

Specifically, two adjacent protruding portions 201 are connected smoothly, that is, the protruding portions 201 have gentle slopes, and the stretchable conductive wire 100 is not easily broken when climbing in subsequent processes, which is helpful to ensure the production yield of the electronic component 10. The smooth connection refers to smooth connection between adjacent convex portions 201, and there is no turning point with abrupt curvature change.

Further, since the adjacent protruding portions 201 are connected smoothly, when the stretchable conductive wire 100 is disposed on the protruding portions 201, the stretchable conductive wire 100 forms the smoothly connected curved portion 100a, i.e., the stretchable conductive wire 100 exhibits a gentle curved state, and at this time, the prepared stretchable conductive wire 100 is not easily broken, which helps to ensure the service life of the electronic component 10.

With reference to fig. 65, the substrate 202 includes a first base plate 202a and a second base plate 202b, which are stacked, a surface of the second base plate 202b facing away from the first base plate 202a has the protrusion 201, and the first base plate 202a and the second base plate 202b are independent structures.

Specifically, in this embodiment, the substrate 202 includes a first substrate 202a and a second substrate 202b stacked, and the protrusion 201 is disposed on a surface of the second substrate 202b facing away from the first substrate 202a, in this case, the first substrate 202a may be a rigid substrate, the second substrate 202b may be a dissolvable substrate, the protrusion 201 is disposed on a surface of the second substrate 202b facing away from the first substrate 202a, and the second substrate 202b and the protrusion 201 may be dissolved in a subsequent step of separating the electronic component 10 from the protrusion 201, so as to obtain the independent electronic component 10.

Referring to fig. 64 again, the substrate 202 and the protrusion 201 are integrally formed.

Specifically, the mold 20 is an integrated structure, that is, the substrate 202 and the protrusion 201 are formed together in the same processing step, in this case, the entire mold 20 may be made of a dissolvable material, and the entire mold 20 may be dissolved in a subsequent step of separating the electronic component 10 from the mold 20, so as to obtain the individual electronic component 10.

Referring to fig. 66, in one embodiment, a plurality of the protruding portions 201 are arranged on the surface of the substrate 202, and two adjacent protruding portions 201 are connected smoothly.

Specifically, since the adjacent protruding portions 201 are connected smoothly, when the stretchable conductive wire 100 is disposed on the protruding portions 201, the stretchable conductive wire 100 forms the smoothly connected curved portion 100a, i.e., the stretchable conductive wire 100 exhibits a gentle curved state, and at this time, the prepared stretchable conductive wire 100 is not easily broken, which helps to ensure the service life of the electronic component 10.

Furthermore, the protruding portion 201 has a gentle slope, so that the stretchable wire 100 is not easily broken when climbing in the subsequent process, which is helpful to ensure the production yield of the electronic component 10. The smooth connection refers to smooth connection between adjacent convex portions 201, and there is no turning point with abrupt curvature change.

With continued reference to fig. 67, embodiments of the present application further provide a method for preparing a mold 20, wherein the mold 20 is used for preparing an electronic component 10, the method for preparing the mold 20 includes, but is not limited to, W100, W200, W300, W400, and W500, and the details regarding W100, W200, W300, W400, and W500 are described below.

W100: a substrate 500 is provided. Please continue to refer to fig. 68.

Wherein the substrate 500 may be a rigid substrate 500.

W200: a photoresist layer 510 is formed overlying the substrate 500. Please continue to refer to fig. 69.

Specifically, in this embodiment, the photoresist layer 510 may be a "positive photoresist", the developed photoresist has a narrow top and a wide bottom in cross section, and a sidewall with a certain slope, and the protruding portion 201 on the mold 20 after etching also has a gentle slope. In the subsequent process, the lead is not easy to break when climbing. It is understood that in other embodiments, the photoresist layer 510 may be a "negative photoresist".

The photoresist can be divided into two types, namely positive photoresist and negative photoresist, the positive photoresist, i.e. the part irradiated by light, can be removed by the developing solution, and the unexposed photoresist can not be removed by the developing solution. On the contrary, the negative photoresist is not removed by the developer in the irradiated portion, and the rest of the area not irradiated by the light is removed by the developer.

W300: a mask 520 is disposed on a side of the photoresist layer 510 away from the substrate 500, and the mask 520 has gaps 521 arranged at intervals. Please continue to refer to fig. 70.

W400: light is applied to the side of the mask 520 facing away from the photoresist.

W500: the photoresist layer 510 formed after the light irradiation is etched to make the mold 20 have a shaped structure a. Please continue to refer to fig. 71.

Specifically, the light irradiated on the mask 520 cannot pass through the mask 520, and the light irradiated on the gaps of the mask 520 can pass through the mask 520, so that the photoresist layer 510 under the mask 520 can be etched, thereby obtaining the mold 20 with a specific shape.

With continued reference to fig. 72, 73 and 74, in one embodiment, the substrate 500 includes a first sub-substrate 501 and a second sub-substrate 502, W100 includes, but is not limited to, W110 and W120, as described in detail below with respect to W110 and W120.

W110: a first sub-substrate 501 is provided.

W120: a second sub-substrate 502 is formed covering the first sub-substrate 501.

Specifically, in the present embodiment, the substrate 500 includes a first sub-substrate 501 and a second sub-substrate 502 which are stacked, and the first sub-substrate 501 and the second sub-substrate 502 are independent from each other. The first sub-substrate 501 may be a rigid substrate, the second sub-substrate 502 may be a dissolvable material, and the second sub-substrate 502 may be dissolved in the subsequent step of separating the electronic component 10 from the mold 20 to obtain the independent electronic component 10.

With continued reference to fig. 75, W200 includes, but is not limited to, W210, and details regarding W210 are provided below.

W210: a photoresist layer 510 is formed to cover the second sub-substrate 502. Please continue to refer to fig. 76.

Specifically, in this embodiment, the photoresist layer 510 may be a "positive photoresist", the photoresist section after development is narrow at the top and wide at the bottom, and the sidewall has a certain slope, and the protruding portion 201 on the second sub-substrate 502 after etching also has a gentle slope. In the subsequent process, the lead is not easy to break when climbing. It is understood that in other embodiments, the photoresist layer 510 may be a "negative photoresist".

With continued reference to fig. 77, W300 includes, but is not limited to, W310, and details regarding W310 are described below.

W310: a mask 520 is disposed on a side of the photoresist layer 510 away from the second sub-substrate 502. Please continue to refer to fig. 78.

Referring to fig. 79, an electronic component 10 according to an embodiment of the present application includes a first elastic substrate 300, a stretchable conductive wire 100, a first functional element 210, and a second functional element 220, wherein the stretchable conductive wire 100, the first functional element 210, and the second functional element 220 are located on a same side of the first elastic substrate 300, and two opposite ends of the stretchable conductive wire 100 are electrically connected to the first functional element 210 and the second functional element 220, respectively.

In one embodiment, the first functional element 210 and the second functional element 220 are located on one side of the first elastic substrate 300, and the stretchable conductive wire 100 is located on one side of the first functional element 210 and the second functional element 220 facing away from the first elastic substrate 300. It should be noted that the number of the functional elements is not limited to two, that is, the number of the functional elements may be more than two, and if the electronic component is an elastic display screen, the number of the functional elements may be millions, and millions of the functional elements are electrically connected by the stretchable wires to form a mesh structure.

In the electronic component 10 provided in the embodiment of the present application, the stretchable wire 100, the first functional element 210, and the second functional element 220 are all supported on the first elastic substrate 300, and the first elastic substrate 300 can support and protect the stretchable wire 100, the first functional element 210, and the second functional element 220, which is helpful for prolonging the service life of the electronic component 10.

With continued reference to fig. 80, the stretchable wire 100 is disposed on a side of the first elastic substrate 300, and the first functional element 210 and the second functional element 220 are disposed on a side of the stretchable wire 100 facing away from the first elastic substrate 300.

Referring to fig. 81, the first functional element 210 is disposed on a side of the first elastic substrate 300, the stretchable conductive wire 100 is disposed on a side of the first functional element 210 facing away from the first elastic substrate 300, and the second functional element 220 is disposed on a side of the stretchable conductive wire 100 facing away from the first functional element 210.

With reference to fig. 82, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first conductive wire 101 and the second conductive wire 102 are located on a side of the first elastic substrate 300, and the first functional element 210 and the second functional element 220 are located on a side of the first conductive wire 101 and the second conductive wire 102 facing away from the first elastic substrate 300.

In this embodiment, there is no primary-secondary branch between the first conductive line 101 and the second conductive line 102, the first conductive line 101 and the second conductive line 102 are in the same position, each functional element may have 1, 2, or more ports for inputting and outputting the same or different signals, and the corresponding stretchable conductive lines may be 1, 2, or more. Each wire may connect the same or different signals. When the first wire 101 and the second wire 102 are connected to the same signal and the first wire 101 is broken, the second wire 102 may be used to electrically connect the first functional element 210 and the second functional element 220. Also, when the first wire 101 and the second wire 102 are connected to the same signal and the second wire 102 is broken, the first wire 101 may be used to electrically connect the first functional element 210 and the second functional element 220.

With reference to fig. 83, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first functional element 210 and the second functional element 220 are located on a side of the first elastic substrate 300, and the first conductive wire 101 and the second conductive wire 102 are located on a side of the first functional element 210 and the second functional element 220 facing away from the first elastic substrate 300.

With reference to fig. 84, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first functional element 210 is located on a side of the first elastic substrate 300, the first conductive wire 101 and the second conductive wire 102 are located on a side of the first functional element 210 facing away from the first elastic substrate 300, and the second functional element 220 is located on a side of the first conductive wire 101 and the second conductive wire 102 facing away from the first functional element 210.

With reference to fig. 85, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first conductive wire 101 is located on a side of the first elastic substrate 300, the first functional element 210 and the second functional element 220 are located on a side of the first conductive wire 101 facing away from the first elastic substrate 300, and the second conductive wire 102 is located on a side of the first functional element 210 and the second functional element 220 facing away from the first conductive wire 101.

With reference to fig. 86, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first conductive wire 101 is located on a side of the first elastic substrate 300, the first functional element 210 is located on a side of the first conductive wire 101 facing away from the first elastic substrate 300, the second conductive wire 102 is located on a side of the first functional element 210 facing away from the first conductive wire 101, and the second functional element 220 is located on a side of the second conductive wire 102 facing away from the first functional element 210.

Referring to fig. 87, the stretchable conductive wire 100 includes a first conductive wire 101 and a second conductive wire 102 arranged at intervals, the first functional element 210 is located on a side of the first elastic substrate 300, the first conductive wire 101 is located on a side of the first functional element 210 facing away from the first elastic substrate 300, the second functional element 220 is located on a side of the first conductive wire 101 facing away from the first functional element 210, and the second conductive wire 102 is located on a side of the second functional element 220 facing away from the first conductive wire 101.

With continued reference to fig. 88, the electronic assembly 10 further includes a second elastic substrate 310, the stretchable conductive wire 100, the first functional element 210 and the second functional element 220 are disposed between the second elastic substrate 310 and the first elastic substrate 300, and the second elastic substrate 310 and the first elastic substrate 300 cooperate to form a package protection for the stretchable conductive wire 100, the first functional element 210 and the second functional element 220.

In the electronic component 10 of the embodiment of the present application, the stretchable conductive wire 100, the first functional element 210 and the second functional element 220 are disposed between the first elastic substrate 300 and the second elastic substrate 310, and the stretchable conductive wire 100, the first functional element 210 and the second functional element 220 are encapsulated and protected by the first elastic substrate 300 and the second elastic substrate 310, so that the service life of the electronic component 10 can be prolonged.

In addition, it should be noted that the electronic assembly 10 may also include a flexible substrate 410, the flexible substrate 410 is enclosed between the first elastic substrate 300 and the second elastic substrate 310, and the flexible substrate 410 is located on a side of the stretchable conductor 100 away from the first elastic substrate 300.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily made by those skilled in the art within the technical scope of the present invention will be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

An electronic assembly, comprising a first elastic substrate, a stretchable wire, a first functional element and a second functional element, wherein the stretchable wire, the first functional element and the second functional element are located on the same side of the first elastic substrate, and two opposite ends of the stretchable wire are electrically connected to the first functional element and the second functional element, respectively.
The electronic assembly of claim 1, wherein the stretchable conductive thread is located on a side of the first elastomeric substrate, and the first functional element and the second functional element are located on a side of the stretchable conductive thread facing away from the first elastomeric substrate.
The electronic assembly of claim 1, wherein the first functional element and the second functional element are located on a side of the first elastomeric substrate, and the stretchable conductive wire is located on a side of the first functional element and the second functional element facing away from the first elastomeric substrate.
The electronic assembly of claim 1, wherein the first functional element is located on a side of the first elastomeric substrate, the stretchable conductive wire is located on a side of the first functional element facing away from the first elastomeric substrate, and the second functional element is located on a side of the stretchable conductive wire facing away from the first functional element.
The electronic assembly of claim 1, wherein the stretchable conductive traces comprise first and second conductive traces arranged in a spaced apart relationship, the first and second conductive traces being disposed on a side of the first flexible substrate, and the first and second functional elements being disposed on a side of the first and second conductive traces facing away from the first flexible substrate.
The electronic assembly of claim 1, wherein the stretchable conductive traces comprise first and second conductive traces arranged in a spaced apart relationship, the first and second functional elements being located on a side of the first elastomeric substrate, the first and second conductive traces being located on a side of the first and second functional elements facing away from the first elastomeric substrate.
The electronic assembly of claim 1, wherein the stretchable conductive traces comprise first and second conductive traces arranged at intervals, the first functional element is located on a side of the first flexible substrate, the first and second conductive traces are located on a side of the first functional element facing away from the first flexible substrate, and the second functional element is located on a side of the first and second conductive traces facing away from the first functional element.
The electronic assembly of claim 1, wherein the stretchable conductive traces comprise first and second conductive traces arranged at intervals, the first conductive trace being on a side of the first flexible substrate, the first and second functional elements being on a side of the first conductive trace facing away from the first flexible substrate, and the second conductive trace being on a side of the first and second functional elements facing away from the first conductive trace.
The electronic assembly of claim 1, wherein the stretchable conductive wire comprises a first conductive wire and a second conductive wire arranged at intervals, the first conductive wire is located on a side of the first elastic substrate, the first functional element is located on a side of the first conductive wire facing away from the first elastic substrate, the second conductive wire is located on a side of the first functional element facing away from the first conductive wire, and the second functional element is located on a side of the second conductive wire facing away from the first functional element.
The electronic assembly of claim 1, wherein the stretchable conductive wire comprises a first conductive wire and a second conductive wire arranged at intervals, the first functional element is located on a side of the first elastic substrate, the first conductive wire is located on a side of the first functional element facing away from the first elastic substrate, the second functional element is located on a side of the first conductive wire facing away from the first functional element, and the second conductive wire is located on a side of the second functional element facing away from the first conductive wire.
The electronic assembly of claim 1, further comprising a flexible substrate on a side of the stretchable conductive wire distal from the first elastomeric substrate.
The electronic assembly of any of claims 1-11, further comprising a second elastomeric substrate, wherein the stretchable conductive wire, the first functional element, and the second functional element are positioned between the second elastomeric substrate and the first elastomeric substrate, and wherein the second elastomeric substrate and the first elastomeric substrate cooperate to provide encapsulation protection for the stretchable conductive wire, the first functional element, and the second functional element.
A method of making an electronic assembly, comprising:

providing a mould;

forming a stretchable wire on one side of the mold;

forming a first elastic substrate covering the stretchable conductive wire;

the mold is removed.
The method of manufacturing an electronic assembly according to claim 13, wherein the surface of the mold is provided with a shaped structure, and the forming of the stretchable conductive wire on one side of the mold comprises: a stretchable wire is formed through the shaped structure.
The method of making an electronic assembly of claim 13, further comprising forming a flexible substrate covering the mold prior to forming the stretchable conductive wire on the one side of the mold.
The method for manufacturing an electronic component according to claim 14, wherein the shaped structure comprises a plurality of protruding portions formed on a surface of a mold, the protruding portions are smoothly connected to each other, and the stretchable conductive wire is disposed on the protruding portions to form a plurality of curved portions which are smoothly connected to each other in sequence.
The method of making an electronic assembly of claim 14, wherein the shaped structure comprises a wave shaped groove formed in a surface of the mold, and wherein the tensile wires are formed in the wave shaped groove.
The method of manufacturing an electronic assembly according to any one of claims 13 to 17, wherein opposite ends of the stretchable wire are connected to the first functional element and the second functional element, respectively.
The method of making an electronic assembly of claim 18, wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire comprises:

forming the stretchable conductive wire at one side of the mold;

forming the first functional element and the second functional element on a side of the stretchable conductive wire facing away from the mold.
The method of making an electronic assembly of claim 18, wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire comprises:

forming the first functional element and the second functional element on one side of the mold;

forming the stretchable conductive wire on a side of the first functional element and the second functional element facing away from the mold.
The method of making an electronic assembly of claim 18, wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire comprises:

forming the first functional element on one side of the mold;

forming the stretchable conductive wire on a side of the first functional element facing away from the mold;

the second functional element is formed on a side of the stretchable wire facing away from the first functional element.
The method of manufacturing an electronic assembly as claimed in claim 18, wherein the stretchable conductive wire includes a first conductive wire and a second conductive wire arranged at intervals, and wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire respectively comprises:

forming the first and second conductive lines at one side of the mold;

forming the first and second functional elements on a side of the first and second conductive lines facing away from the mold.
The method of manufacturing an electronic assembly as claimed in claim 18, wherein the stretchable conductive wire includes a first conductive wire and a second conductive wire arranged at intervals, and wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire respectively comprises:

forming the first functional element and the second functional element on one side of the mold;

forming the first and second conductive lines on a side of the first and second functional elements facing away from the mold.
The method of manufacturing an electronic assembly as claimed in claim 18, wherein the stretchable conductive wire includes a first conductive wire and a second conductive wire arranged at intervals, and wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire respectively comprises:

forming the first functional element on one side of the mold;

forming the first and second conductive lines on a side of the first functional element facing away from the mold;

the second functional element is formed on a side of the first conductive line and the second conductive line facing away from the first functional element.
The method of manufacturing an electronic assembly as claimed in claim 18, wherein the stretchable conductive wire includes a first conductive wire and a second conductive wire arranged at intervals, and wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire respectively comprises:

forming the first conductive line at one side of the mold;

forming the first functional element and the second functional element on a side of the first conductive line facing away from the mold;

a second conductive line is formed on a side of the first functional element and the second functional element facing away from the first conductive line.
The method of manufacturing an electronic assembly as claimed in claim 18, wherein the stretchable conductive wire includes a first conductive wire and a second conductive wire arranged at intervals, and wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire respectively comprises:

forming the first conductive line at one side of the mold;

forming the first functional element on a side of the first wire facing away from the mold;

forming a second conductive line on a side of the first functional element facing away from the first conductive line;

and forming a second functional element on the side of the second lead wire, which is far away from the first functional element.
The method of manufacturing an electronic assembly as claimed in claim 18, wherein the stretchable conductive wire includes a first conductive wire and a second conductive wire arranged at intervals, and wherein connecting the first functional element and the second functional element to opposite ends of the stretchable conductive wire respectively comprises:

forming the first functional element on one side of the mold;

forming the first conductive line on a side of the first functional element facing away from the mold;

forming a second functional element on a side of the first conductive line facing away from the first functional element;

and forming a second lead on the side of the second functional element, which faces away from the first lead.
The method of manufacturing an electronic assembly according to claim 18, wherein before the providing the mold and the connecting the first functional element and the second functional element to the opposite ends of the stretchable conductive wire, respectively, the method further comprises:

forming a sacrificial layer covering the mold;

the opposite ends of the stretchable wire are respectively connected with a first functional element and a second functional element, and the stretchable wire comprises:

forming a stretchable wire on the surface of the sacrificial layer;

forming a first functional element and a second functional element electrically connected to both ends of the stretchable wire;

forming a first elastic substrate covering the first functional element, the second functional element and the stretchable conductive wire;

dissolving the sacrificial layer to separate the mold and the electronic component.
The method of manufacturing an electronic assembly according to claim 13, wherein the mold is made of a dissolvable material, and wherein the removing the mold comprises: and dissolving the mould.
The method of manufacturing an electronic assembly according to claim 13, wherein the mold has a surface adhesion of less than a predetermined threshold, and wherein the removing the mold further comprises: mechanical stripping is used to separate the mold from the electronic component.
The method of making an electronic assembly of claim 13, wherein said "removing said mold" further comprises: laser ablation is used to separate the mold from the electronic assembly.
A mold for use in the manufacture of an electronic assembly, the mold comprising a substrate and a shaping structure for shaping a stretchable wire.
The mold of claim 32, wherein the shaped structure comprises a wave shaped groove formed in the surface of the substrate.
The mold of claim 32, wherein the shaped structure comprises a plurality of protrusions formed on the surface of the substrate, the plurality of protrusions being spaced apart from each other on the surface of the substrate, and a smooth connection is formed between two adjacent protrusions.
The mold of claim 34, wherein the substrate comprises a first base plate and a second base plate arranged in a stack, a surface of the second base plate facing away from the first base plate having the protrusions, the first base plate and the second base plate being independent structures.
A mold as in claim 34 wherein said substrate and said raised portion are integrally formed.
The mold of claim 34, wherein a plurality of said protrusions are arranged on the surface of said substrate, and adjacent two of said protrusions are connected smoothly.
A method of making a mold for making an electronic assembly, the method comprising:

providing a substrate;

forming a photoresist layer covering the substrate;

arranging a light shield on one side of the light resistance layer, which is far away from the substrate, wherein the light shield is provided with gaps which are arranged at intervals;

illuminating the side of the photomask, which is far away from the photoresist;

and etching the photoresist layer formed after the illumination so as to enable the mold to have a shaped structure.
The method of making a mold according to claim 38, wherein the shaped structure comprises wave shaped grooves formed in the surface of the substrate.
The method of claim 38, wherein the shaped structure comprises a plurality of protrusions formed on the surface of the substrate, and the protrusions are smoothly connected to each other.
The method of making a mold according to claim 38, wherein the substrate comprises a first sub-substrate and a second sub-substrate,

the providing a substrate includes:

providing a first sub-substrate;

forming a second sub-substrate covering the first sub-substrate;

the forming a photoresist layer covering the substrate includes:

forming a photoresist layer covering the second sub-substrate;

the step of arranging a light shield on one side of the light resistance layer departing from the substrate comprises the following steps:

and arranging a photomask on one side of the photoresist layer departing from the second sub-substrate.