CN113376512A - Chip burning test equipment - Google Patents
Chip burning test equipment Download PDFInfo
- Publication number
- CN113376512A CN113376512A CN202110706280.8A CN202110706280A CN113376512A CN 113376512 A CN113376512 A CN 113376512A CN 202110706280 A CN202110706280 A CN 202110706280A CN 113376512 A CN113376512 A CN 113376512A
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- CN
- China
- Prior art keywords
- tray
- chip
- groove
- chips
- host device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 239000000523 sample Substances 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims description 12
- 239000004816 latex Substances 0.000 claims description 3
- 229920000126 latex Polymers 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/61—Installation
- G06F8/63—Image based installation; Cloning; Build to order
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a chip burning test device, which is used for burning or testing a plurality of chips, wherein the chips are respectively placed in a plurality of grooves in a tray; and the chip has a plurality of pins, the chip burns record test equipment includes: a base body; the rail mechanism arranged on the seat body comprises two parallel rails and is used for clamping the tray between the parallel rails; the bottom of the groove in the tray is provided with a plurality of through holes; the probe board is arranged in close contact with the tray and comprises a plurality of probes; the probes on the probe board correspond to the through holes at the bottom of the groove in the tray one by one; the upper probe of the probe board penetrates through the through hole at the bottom of the groove in the tray, penetrates out of the bottom of the groove of the tray and is contacted with the pins on the chip at the bottom of the groove of the tray; the host device is arranged on the base body and is electrically connected with the probe board; the host device is used for testing or burning data of the chips when the pins of the chips contact the probes.
Description
Technical Field
The invention relates to the technical field of chip testing and chip burning, in particular to chip burning testing equipment.
Background
At present, in the burning or testing process of the chip, the burning or testing of the chip can be carried out only for one chip at a time. Although there is equipment among the prior art that can realize that a plurality of chips test or burn simultaneously, in current equipment, need put each chip on the carrier, then overturn, then make the pin and the probe contact of each chip, consequently, need take a long time, simultaneously, in the upset in-process of chip, the position of chip also changes relatively easily, causes the difficulty for next step.
Disclosure of Invention
Technical problem to be solved
In view of the above disadvantages and shortcomings of the prior art, the present invention provides a chip burning test apparatus.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
in a first aspect, an embodiment of the present invention provides a chip burning test apparatus, configured to burn or test a plurality of chips, where the chips are respectively placed in a plurality of grooves in a tray; and the chip has a plurality of pins, the chip burns record test equipment includes:
a base body;
the rail mechanism arranged on the seat body comprises two parallel rails and is used for clamping the tray between the parallel rails;
the bottom of the groove in the tray is provided with a plurality of through holes;
the through holes correspond to the pins of the chip one by one;
the probe board is arranged in close contact with the tray and comprises a plurality of probes;
the probes on the probe board correspond to the through holes at the bottom of the groove in the tray one by one; the upper probe of the probe board penetrates through the through hole at the bottom of the groove in the tray, penetrates out of the bottom of the groove of the tray and is in contact with the pins on the chip at the bottom of the groove of the tray;
the host device is arranged on the base body and is electrically connected with the probe board; the host device is used for testing or burning data of the chips when the pins of the chips contact the probes.
Preferably, the first and second liquid crystal materials are,
the probe board is provided with a plug;
the plug is electrically connected with the probe board through a signal cable.
Preferably, the first and second liquid crystal materials are,
the equipment is also provided with a driving device which is used for driving the tray on the track mechanism to move to a preset position;
the host device is provided with a connector which is used for being correspondingly connected with the plug on the probe card when the tray runs to the preset position.
Preferably, the first and second liquid crystal materials are,
the joint on the host device is a telescopic joint;
when the tray runs to the preset position, the host device controls the joint to extend and is correspondingly connected with the plug on the probe card;
after the burning or testing is completed, the host device controls the connector to contract and separate from the plug on the probe card.
Preferably, the first and second liquid crystal materials are,
the host device is connected with the driving device and used for driving the tray to advance to a preset end position along the parallel tracks after the connectors are separated from the plugs on the probe card.
Preferably, the first and second liquid crystal materials are,
the tray and the probe card are arranged in a matrix shape.
Preferably, the first and second liquid crystal materials are,
after the chips are respectively placed in the grooves in the tray, the chips are arranged in a straight line.
Preferably, the apparatus further comprises:
and the pressing plate is hinged with the tray and used for fixing the chip in the groove of the tray.
Preferably, the first and second liquid crystal materials are,
the pressing plate is provided with alignment convex parts which correspond to the tray grooves one to one; the alignment convex part is used for abutting against the chip in the groove.
Preferably, the material of the para-convex part is latex.
(III) advantageous effects
The invention has the beneficial effects that: according to the chip burning test equipment, the tray is adopted to bear the chip, the bottom of the groove in the tray is provided with the through holes, and the probes on the probe board correspond to the through holes in the bottom of the groove in the tray one by one; and the upper probe of the probe board passes through the through hole at the bottom of the groove in the tray, is exposed out of the bottom of the groove of the tray and is contacted with the pins on the chip at the bottom of the groove of the tray.
Drawings
FIG. 1 is a schematic structural diagram of a chip burning test apparatus according to the present invention;
FIG. 2 is a schematic view of a tray of the present invention;
FIG. 3 is a schematic structural view of a tray and a probe card of the present invention closely attached to each other and loaded with chips;
fig. 4 is a schematic structural view of a probe card according to the present invention.
[ description of reference ]
10: a base body;
20: a track mechanism;
30: a tray;
40: a host device;
50: a probe card.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Referring to fig. 1, the present embodiment provides a chip burning test apparatus for burning or testing a plurality of chips, wherein the plurality of chips are respectively disposed in a plurality of grooves in a tray; and the chip has a plurality of pins, the chip burns record test equipment includes:
a base body 10; and the track mechanism 20 arranged on the base body comprises two parallel tracks, and the tray is clamped between the parallel tracks.
Referring to fig. 2, the bottom of the groove in the tray 30 has a plurality of through holes.
And the through holes correspond to the pins of the chip one to one.
And a probe card 50 closely attached to the tray, the probe card including a plurality of probes.
The probes on the probe board correspond to the through holes at the bottom of the groove in the tray one by one; the upper probe of the probe board penetrates through the through hole at the bottom of the groove in the tray, penetrates out of the bottom of the groove of the tray and is in contact with the pins on the chip at the bottom of the groove of the tray;
a host device 40 disposed on the base and electrically connected to the probe card; the host device is used for testing or burning data of the chips when the pins of the chips contact the probes.
In this embodiment, referring to fig. 4, the probe card 50 has a plug thereon; the plug is electrically connected to the probe card 50 through a signal cable.
In this embodiment, the apparatus further has a driving device for driving the tray on the rail mechanism to move to a predetermined position.
The host device is provided with a connector which is used for being correspondingly connected with the plug on the probe card when the tray runs to the preset position.
In this embodiment, the connector on the host device is a retractable connector; when the tray runs to the preset position, the host device controls the joint to extend and is correspondingly connected with the plug on the probe card; after the burning or testing is completed, the host device controls the connector to contract and separate from the plug on the probe card.
In this embodiment, the host device is connected to the driving device, and is configured to drive the tray to advance to a predetermined end position along the parallel tracks after the connectors are separated from the plugs on the probe card.
In this embodiment, the tray and the probe card are arranged in a matrix shape.
In this embodiment, after the chips are respectively placed in the grooves in the tray, the chips are arranged in a straight line.
In this embodiment, the apparatus further includes: and the pressing plate is hinged with the tray and used for fixing the chip in the groove of the tray.
In this embodiment, the pressing plate has alignment protrusions corresponding to the tray grooves one to one; the alignment convex part is used for abutting against the chip in the groove.
In this embodiment, the material of the alignment convex part is latex.
In the chip burning test equipment in the embodiment, the tray is adopted to bear the chip, the bottom of the groove in the tray is provided with the through holes, and the probes on the probe board correspond to the through holes at the bottom of the groove in the tray one by one; and the upper probe of the probe board passes through the through hole at the bottom of the groove in the tray, is exposed out of the bottom of the groove of the tray and is contacted with the pins on the chip at the bottom of the groove of the tray.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.
Claims (10)
1. A chip burning test device is used for burning or testing a plurality of chips, wherein the chips are respectively placed in a plurality of grooves in a tray; and the chip has a plurality of pins, its characterized in that, chip burns record test equipment includes:
a base body;
the rail mechanism arranged on the seat body comprises two parallel rails and is used for clamping the tray between the parallel rails;
the bottom of the groove in the tray is provided with a plurality of through holes;
the through holes correspond to the pins of the chip one by one;
the probe board is arranged in close contact with the tray and comprises a plurality of probes;
the probes on the probe board correspond to the through holes at the bottom of the groove in the tray one by one; the upper probe of the probe board penetrates through the through hole at the bottom of the groove in the tray, penetrates out of the bottom of the groove of the tray and is in contact with the pins on the chip at the bottom of the groove of the tray;
the host device is arranged on the base body and is electrically connected with the probe board; the host device is used for testing or burning data of the chips when the pins of the chips contact the probes.
2. The apparatus of claim 1,
the probe board is provided with a plug;
the plug is electrically connected with the probe board through a signal cable.
3. The apparatus of claim 2,
the equipment is also provided with a driving device which is used for driving the tray on the track mechanism to move to a preset position;
the host device is provided with a connector which is used for being correspondingly connected with the plug on the probe card when the tray runs to the preset position.
4. The apparatus of claim 3,
the joint on the host device is a telescopic joint;
when the tray runs to the preset position, the host device controls the joint to extend and is correspondingly connected with the plug on the probe card;
after the burning or testing is completed, the host device controls the connector to contract and separate from the plug on the probe card.
5. The apparatus of claim 4,
the host device is connected with the driving device and used for driving the tray to advance to a preset end position along the parallel tracks after the connectors are separated from the plugs on the probe card.
6. The apparatus of claim 5,
the tray and the probe card are arranged in a matrix shape.
7. The apparatus of claim 6,
after the chips are respectively placed in the grooves in the tray, the chips are arranged in a straight line.
8. The apparatus of claim 7, further comprising:
and the pressing plate is hinged with the tray and used for fixing the chip in the groove of the tray.
9. The apparatus of claim 8,
the pressing plate is provided with alignment convex parts which correspond to the tray grooves one to one; the alignment convex part is used for abutting against the chip in the groove.
10. The apparatus of claim 9, wherein the material of the alignment protrusion is latex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110706280.8A CN113376512A (en) | 2021-06-24 | 2021-06-24 | Chip burning test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110706280.8A CN113376512A (en) | 2021-06-24 | 2021-06-24 | Chip burning test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113376512A true CN113376512A (en) | 2021-09-10 |
Family
ID=77578959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110706280.8A Pending CN113376512A (en) | 2021-06-24 | 2021-06-24 | Chip burning test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113376512A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062739A (en) * | 2021-10-29 | 2022-02-18 | 深圳市智链信息技术有限公司 | Automatic burn and record and detect frock |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203071048U (en) * | 2012-12-27 | 2013-07-17 | 标准科技股份有限公司 | Chip testing machine |
| CN206020364U (en) * | 2016-07-11 | 2017-03-15 | 泰州市维科特仪器仪表有限公司 | A kind of portable high frequency senses moisture teller |
| CN108318799A (en) * | 2017-01-17 | 2018-07-24 | 崇碁科技股份有限公司 | Burning chip test equipment and method |
-
2021
- 2021-06-24 CN CN202110706280.8A patent/CN113376512A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203071048U (en) * | 2012-12-27 | 2013-07-17 | 标准科技股份有限公司 | Chip testing machine |
| CN206020364U (en) * | 2016-07-11 | 2017-03-15 | 泰州市维科特仪器仪表有限公司 | A kind of portable high frequency senses moisture teller |
| CN108318799A (en) * | 2017-01-17 | 2018-07-24 | 崇碁科技股份有限公司 | Burning chip test equipment and method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062739A (en) * | 2021-10-29 | 2022-02-18 | 深圳市智链信息技术有限公司 | Automatic burn and record and detect frock |
| CN114062739B (en) * | 2021-10-29 | 2024-03-19 | 深圳市智链信息技术有限公司 | Automatic burn and detect frock |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210910 |
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| RJ01 | Rejection of invention patent application after publication |