CN113321177B - Flexible MEMS device and electronic equipment - Google Patents
Flexible MEMS device and electronic equipment Download PDFInfo
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- CN113321177B CN113321177B CN202110589849.7A CN202110589849A CN113321177B CN 113321177 B CN113321177 B CN 113321177B CN 202110589849 A CN202110589849 A CN 202110589849A CN 113321177 B CN113321177 B CN 113321177B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
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- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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Abstract
The invention discloses a flexible MEMS device and an electronic apparatus. The flexible MEMS device comprises a substrate base plate, wherein the substrate base plate comprises: the first substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a groove; the second substrate is embedded in the groove, and the Young modulus of the second substrate is larger than that of the first substrate. Therefore, the second substrate with the larger Young modulus and the first substrate with the smaller Young modulus are combined, the first substrate can bear tensile deformation, the second substrate can provide larger rigidity, stress and strain borne by the MEMS component arranged on the second substrate when the flexible MEMS device is integrally subjected to tensile deformation are further reduced, and the MEMS component keeps structure, function and stability.
Description
Technical Field
The present invention relates to the field of MEMS devices, in particular to flexible MEMS devices and electronic devices.
Background
The flexible electronic device can be bent and extended, is efficient, is low in manufacturing cost, can be well attached according to the shape of an application scene (such as a curved surface), does not change the shape of the surface to which the flexible electronic device is attached, and has the advantages of being small in size, light in weight and the like. A Micro Electro Mechanical System (MEMS) device refers to a device using a MEMS, and compared with a MEMS device manufactured based on a silicon substrate or a glass substrate, a flexible thin film MEMS device based on a flexible substrate material has advantages of light weight, easy integration, and the like. However, the flexible thin film MEMS device has certain defects and shortcomings due to the flexible material of the substrate, and the movable component (the movable component refers to a component that can move up and down under the action of voltage) disposed on the flexible substrate, and thus needs to be improved.
Disclosure of Invention
The present invention is based on the discovery and recognition by the inventors of the following facts and problems:
the flexible MEMS (Micro Electro Mechanical System) device combines an MEMS component and a flexible substrate, so that the flexible MEMS device can have better flexibility, can be attached to a curved surface and can keep the shape of the curved surface, but a movable part arranged on the flexible substrate has certain defects, the flexible substrate cannot provide better supporting effect for the MEMS component, when the whole flexible MEMS device is under the stretching effect, the flexible substrate is easy to deform but cannot well support the MEMS component, at the moment, the MEMS component also can deform under the stretching effect, and the structure, the function, the stability and the like of the flexible MEMS device can be adversely affected. The inventors have found that a flexible substrate can be combined with a rigid substrate (where flexibility and rigidity are relative, and young's modulus of the rigid substrate is higher than young's modulus of the flexible substrate), and a MEMS component can be disposed on the rigid substrate, and then combined with the flexible substrate, so that the flexible substrate is soft and stretchable, and is subjected to tensile deformation by the flexible substrate, and the rigid substrate has greater rigidity, and the MEMS component disposed thereon can reduce stress and strain which the MEMS component disposed on the second substrate is subjected to when the flexible MEMS component is subjected to tensile deformation as a whole, and thus the MEMS component can maintain structure, function and stability.
In view of the above, in one aspect of the present invention, a flexible MEMS device is provided. The flexible MEMS device comprises a substrate base plate, wherein the substrate base plate comprises: the first substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a groove; the second substrate is embedded in the groove, and the Young modulus of the second substrate is larger than that of the first substrate. Therefore, the second substrate with the larger Young modulus is combined with the first substrate with the smaller Young modulus, the first substrate can bear tensile deformation, the second substrate can provide larger rigidity, and then stress and strain borne by the MEMS component when the flexible MEMS device integrally bears the tensile deformation are reduced, so that the structure, the function and the stability of the MEMS component are kept, and the flexible MEMS device has better flexibility and stability.
According to an embodiment of the present invention, the young's modulus of the second substrate is not less than 100 times the young's modulus of the first substrate.
According to an embodiment of the invention, the young's modulus of the second substrate is not less than 1000 times the young's modulus of the first substrate.
According to an embodiment of the invention, the flexible MEMS device further comprises a MEMS assembly, said MEMS assembly comprising: the first ground wire, the signal transmission structure and the second ground wire are sequentially arranged and are arranged on the surface, far away from the second surface, of the second substrate at intervals, wherein the signal transmission structure comprises a signal transmission line and a dielectric layer, the signal transmission line is arranged on the surface, far away from the second surface, of the second substrate, and the dielectric layer is arranged on the surface, far away from the second substrate, of the signal transmission line; and the membrane bridge is respectively and electrically connected with the first ground wire and the second ground wire, is close to the dielectric layer when voltage acts on the membrane bridge, and is far away from the dielectric layer when the voltage is not applied.
According to an embodiment of the invention, the first substrate comprises silicone rubber.
According to an embodiment of the invention, the second substrate comprises at least one of PET, PI.
According to the embodiment of the invention, when the overall strain of the flexible MEMS device is not higher than 50%, the distance between the surface of the membrane bridge close to the substrate base plate and the surface of the dielectric layer far away from the substrate base plate does not change by more than 6.5%.
According to the embodiment of the invention, when the overall strain of the flexible MEMS device is not higher than 30%, the distance between the surface, close to the substrate, of the membrane bridge and the surface, far away from the substrate, of the dielectric layer does not change by more than 4%.
According to an embodiment of the invention, the flexible MEMS device comprises: a plurality of the grooves disposed on the first surface of the first substrate; the second substrates are embedded in the grooves in a one-to-one correspondence manner; the first ground wires, the signal transmission structures and the second ground wires are sequentially arranged on the surface, away from the second surface, of each second substrate, and one first ground wire, one signal transmission structure and one second ground wire are arranged at intervals; and each signal transmission structure is provided with one membrane bridge in a one-to-one correspondence manner.
In another aspect of the invention, an electronic device is provided. The electronic device comprises a flexible MEMS device as described above. Thus, the electronic device has all the features and advantages of the flexible MEMS device described above, which are not described in detail herein. In general, the electronic device is capable of both withstanding tensile deformation and maintaining the structure, function and stability of the MEMS components.
Drawings
FIG. 1 shows a schematic structural diagram of a flexible MEMS device according to one embodiment of the present invention;
FIG. 2 illustrates a top view of a flexible MEMS device in accordance with another embodiment of the present invention;
FIG. 3 shows a schematic view of a flexible MEMS device in a pressurized state according to yet another embodiment of the present invention;
FIG. 4 shows a schematic structural view of a flexible MEMS device in a pressurized state according to yet another embodiment of the present invention;
FIG. 5 shows a top view of a prior art flexible MEMS device;
FIG. 6 shows a schematic structure of a flexible MEMS device in the prior art;
FIG. 7 shows a schematic diagram of a tensile force of a flexible MEMS device in the prior art;
FIG. 8 illustrates a schematic diagram of a flexible MEMS device under a tensile force in accordance with yet another embodiment of the present invention;
FIG. 9 illustrates a schematic diagram of a flexible MEMS device under a tensile force in accordance with yet another embodiment of the present invention;
FIG. 10 shows finite element simulation results of tensile deformation of a flexible MEMS device according to yet another embodiment of the present invention;
FIG. 11 illustrates a top view of a flexible MEMS device in accordance with yet another embodiment of the present invention;
FIG. 12 illustrates a flexible MEMS device under a tensile force in accordance with another embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In one aspect of the invention, a flexible MEMS device is presented. Referring to fig. 1 and 2 (fig. 2 is a top view of a flexible MEMS device according to an embodiment of the present invention, and fig. 1 can be regarded as a cross-sectional view along AA' of fig. 2), the flexible MEMS device includes a substrate base, wherein the substrate base includes a first substrate 100 and a second substrate 200, the first substrate 100 includes a first surface 110 and a second surface 120 which are oppositely disposed, the first surface 110 has a groove 130, the second substrate 200 is embedded in the groove 130, and a young modulus of the second substrate 200 is greater than a young modulus of the first substrate 100. Therefore, the second substrate with the larger Young modulus is combined with the first substrate with the smaller Young modulus, the first substrate has better flexibility and can bear tensile deformation, the overall flexibility of the flexible MEMS device is improved, the second substrate can provide larger rigidity, the stress and the strain borne by the MEMS component arranged on the second substrate when the flexible MEMS device integrally bears the tensile deformation are further reduced, the structure, the function and the stability of the MEMS component are kept, and the flexible MEMS device integrally has good structure, function and stability.
It should be noted that the first surface 110 of the first substrate 100 includes planar portions on both sides of the groove, as well as sidewalls of the groove 130 and a bottom surface of the groove 130.
According to the embodiment of the invention, the second substrate 200 is embedded in the groove 130, so that the surface of the second substrate, which is far away from the second surface, is flush with the first surface of the first substrate, which is not provided with the groove part, that is, the depth of the groove is consistent with the thickness of the second substrate, and thus, the surface flatness of the flexible MEMS device can be ensured, and the structural stability of the flexible MEMS device can be better improved.
According to an embodiment of the present invention, the young's modulus of the second substrate 200 is not less than 100 times the young's modulus of the first substrate 100. Therefore, the Young modulus of the second substrate is obviously higher than that of the first substrate, the second substrate can provide higher rigidity and better support for the MEMS component, and the first substrate can bear the stretching effect, so that the flexibility and stability of the flexible MEMS device can be improved, and the overall performance of the device can be improved.
According to an embodiment of the present invention, the young's modulus of the second substrate 200 is not lower than 1000 times of the young's modulus of the first substrate 100, for example, the young's modulus of the second substrate 200 is 1000 times, 2000 times, 5000 times, 10000 times, etc. of the young's modulus of the first substrate 100, the young's modulus of the second substrate may be more different from the young's modulus of the first substrate, the first substrate provides better flexibility for the flexible MEMS device, and the second substrate provides better support for the MEMS component disposed thereon. Therefore, the stability of the flexible MEMS device can be improved, and meanwhile, the good flexibility of the flexible MEMS device is ensured.
According to the embodiment of the invention, the first substrate may include a silicone rubber material, and specifically may include at least one of Silbine, ecoflex, and Dragonskin, which have relatively good flexibility and can withstand relatively large tensile deformation, so that the flexible MEMS device as a whole has relatively good flexibility. According to some embodiments of the present invention, silbin may be Silbin 4320A/B, etc., ecoflex may be Ecoflex 00-10, ecoflex 00-20, ecoflex 00-30, ecoflex 00-50, etc., and Dragnkin may be Dragnkin 20, dragnkin 30, etc. The first substrate may also be made of other materials with lower young's modulus, and those skilled in the art can select the material according to the actual design requirement.
According to other embodiments of the present invention, the second substrate includes at least one of PET (polyethylene terephthalate) and PI (polyimide), and the material has a higher young modulus compared to the material of the first substrate, which can provide a better supporting effect for the MEMS component, and is beneficial to improving the overall structure, function and stability of the flexible MEMS device. The second substrate may also be made of other materials with higher young's modulus, and those skilled in the art can select the material according to the actual design requirement.
According to an embodiment of the present invention, referring to fig. 1 and 2, the flexible MEMS device further includes a MEMS assembly including: the first ground line 300, the signal transmission structure 500 and the second ground line 400, wherein the first ground line 300, the signal transmission structure 500 and the second ground line 300 are sequentially arranged and spaced apart from each other on the surface of the second substrate 200 away from the second surface 120, the signal transmission structure 500 comprises a signal transmission line 510 and a dielectric layer 520, the signal transmission line 510 is arranged on the surface of the second substrate 200 away from the second surface 120, and the dielectric layer 520 is arranged on the surface of the signal transmission line 510 away from the second substrate 200; a membrane bridge 600, the membrane bridge 600 being electrically connected to the first ground line 300 and the second ground line 400, respectively, and the membrane bridge 600 being close to the dielectric layer 520 when a voltage is applied to the membrane bridge and the signal transmission line 510, and the membrane bridge 600 being far from the dielectric layer 520 when a voltage is not applied to the membrane bridge and the signal transmission line 510, i.e. the membrane bridge 600 is not close to the dielectric layer 520 (as shown in fig. 1), and defining a membrane bridge height as a distance between a surface of the membrane bridge close to the first substrate and a surface of the dielectric layer far from the first substrate, so that the membrane bridge height is h in a non-pressurized state 0 (as shown in FIG. 1), the membrane bridge height is less than or equal to h in the pressurized state 3 (see FIGS. 3 and 4, where the membrane bridge height in FIG. 3 is h 3 And the membrane bridge height is 0 in fig. 4, i.e., membrane bridge 600 is in contact with dielectric layer 520). Thus, the flexible MEMS device has the function of an MEMS component, and can make the membrane bridge close to or even contact with the dielectric layer when a certain voltage is applied, and make the membrane bridge far away from the dielectric layer when no voltage is applied, namely the membrane bridge height is kept to be h 0 The MEMS component is arranged on the second substrate with larger Young modulus, the second substrate can provide better support and higher rigidity for the MEMS component, the stress and strain borne by the MEMS component when the flexible MEMS component is integrally stretched and deformed are reduced, particularly the stress and strain borne by the membrane bridge are reduced, the shape and the function of the MEMS component can be kept, and the first substrate with smaller Young modulus can also be used for keeping the shape and the function of the MEMS componentSo as to bear the tensile action and ensure that the whole flexible MEMS device has better flexibility.
It should be further noted that when a voltage is applied to the film bridge and the signal transmission line 510, the film bridge 600 is close to the dielectric layer 520, and the film bridge height is less than or equal to h 3 It is clear that h 3 Less than h 0 ，h 3 May or may not be zero (i.e., the film bridge 600 is in direct contact with the dielectric layer 520, as shown in FIG. 4), where h 3 The specific value of (a) is determined according to the actual conditions such as the material of the membrane bridge, the thickness of the membrane bridge and the like, and there is no limitation requirement here as long as the use function of the flexible MEMS device can be realized.
The magnitude of the applied voltage may be set according to specific conditions such as the material and thickness of the membrane bridge 600, and is not particularly limited in the present invention. The thickness of the first substrate and the second substrate is not particularly limited in the present invention, and may be set by those skilled in the art according to the actual conditions such as the young's modulus of the first substrate and the second substrate. In addition, the first ground line, the second ground line, the signal transmission line and the film bridge are all made of metal, and specific materials are not particularly limited in the present invention, and can be selected and set by a person skilled in the art according to actual situations. The dielectric layer is made of an insulating material, and is not particularly limited in the present invention, and may be silicon nitride, silicon oxynitride, or the like, and those skilled in the art may select the dielectric layer according to actual design requirements. The specific size of the dielectric layer is not particularly limited as long as the film bridge can electrically insulate the signal transmission line from the film bridge, and in some embodiments, as shown in the top views of fig. 2, 8, 11, and 12, the area of the orthographic projection of the dielectric layer 520 on the substrate is smaller than or equal to the area of the overlapping region of the orthographic projection of the signal transmission line 510 on the substrate and the orthographic projection of the film bridge 600 on the substrate, that is, in the top view, the dielectric layer 520 is covered by the film bridge 600; in other embodiments, the area of the orthographic projection of the dielectric layer on the substrate base plate may be slightly larger than the area of the overlapping area of the orthographic projection of the signal transmission line 510 on the substrate base plate and the orthographic projection of the film bridge 600 on the substrate base plate, so as to better avoid the film bridge from directly contacting the signal transmission line 510 when the dielectric layer contacts the film bridge.
The following is a detailed description of the principle of the invention that enables the structure, function and stability of a flexible MEMS device to be maintained:
in the prior art, the MEMS component is disposed on the flexible substrate, and referring to fig. 5 and fig. 6 (fig. 5 is a top view of a flexible MEMS device in the prior art, and fig. 6 can be seen as a cross-sectional view along BB' of fig. 5), in this solution, the MEMS component is disposed on the surface of the first substrate 100, that is, the flexible substrate is only used as a support, and the flexible substrate can bear a stretching action. Referring to fig. 6 and 7, fig. 6 is a schematic structural view of a flexible MEMS device before a tensile force is applied, and fig. 7 is a schematic structural view of the device after the tensile force is applied, wherein the direction indicated by the arrow is the direction of the tensile force, and it can be seen by comparison that after the tensile force is applied, the first substrate 100 is subjected to tensile deformation, the distances between the first ground line 300 and the second ground line 400 and the signal transmission structure 500 are also significantly increased, and the distance between the surface of the membrane bridge 600 close to the first substrate 100 and the surface of the dielectric layer 520 far from the first substrate is significantly decreased (from h) 0 Is reduced to h 2 ) In severe cases, the film bridge may even come into contact with the dielectric layer when unpressurized, i.e. h 2 To zero, the membrane bridge is obviously deformed under the condition of no voltage application, and the further stretching even leads to the defects of membrane bridge fracture and the like, so that the MEMS component in the technical scheme can not well maintain the original shape and function under the stretching action, and the structure, the function and the stability are difficult to maintain.
In the invention, the second substrate with the larger Young modulus is combined with the first substrate with the smaller Young modulus, the MEMS component is arranged on the second substrate, when the flexible MEMS device is integrally stretched, the first substrate with the smaller Young modulus can bear tensile deformation, the second substrate with the larger Young modulus can provide larger rigidity, and the MEMS component is arranged on the second substrate with the larger Young modulus, so that the stress and strain borne by the MEMS component when the flexible MEMS device is integrally stretched and deformed can be effectively reduced, particularly the stress and strain borne by the membrane bridge can be reduced, the shape and functional stability of the MEMS component can be kept, and the integral function and stability of the flexible MEMS device can be improved. Referring to fig. 1, 8 and 9, fig. 1 is a schematic structural diagram of a flexible MEMS device according to an embodiment of the present invention, and fig. 8 and 9 are schematic structural diagrams of the device when the device is under a tensile force, where after the device is under a tensile force, the first substrate 100 with a smaller young's modulus undergoes a larger deformation, but since the MEMS component is disposed on the second substrate 200 with a higher young's modulus, the amount of deformation of the MEMS component is small, that is, the relative positions of the first ground line 300, the signal transmission structure 500 and the second ground line 400 are changed little or substantially unchanged compared to the position before the tensile force, and the position of the membrane bridge 600 is changed little or substantially unchanged compared to the position before the tensile force, so that the amount of change in the distance between the surface of the membrane bridge 600 close to the substrate and the surface of the dielectric layer 520 far from the substrate is small or negligible (the change in the height of the membrane bridge is caused by the changes of the positions of the signal transmission structure 500 and the membrane bridge 600 before and after the tensile force). Therefore, the first substrate with the smaller Young modulus and the second substrate with the larger Young modulus are combined, and the MEMS component is arranged on the second substrate with the larger Young modulus, so that the flexible MEMS device has better flexibility, can bear larger tensile acting force on the whole, can keep the structure, the function and the stability of the MEMS component, and has good structure, function and stability.
The flexible MEMS device can well maintain the stability: according to some embodiments of the present invention, when the overall strain of the flexible MEMS device is not higher than 30%, the variation of the spacing between the surface of the membrane bridge close to the base substrate and the surface of the dielectric layer far from the base substrate is not more than 4%, i.e. (h) 0 -h 1 )/h 0 Less than or equal to 4 percent. According to further embodiments of the present invention, the spacing between the surface of the membrane bridge near the substrate base and the surface of the dielectric layer away from the substrate base does not vary by more than 6.5% when the overall strain of the flexible MEMS device is not higher than 50%. It will be understood by those skilled in the art that the change in the spacing between the surface of the membrane bridge adjacent the base substrate and the surface of the dielectric layer remote from the base substrate means that the membrane bridge is adjacent the substrate after being subjected to a tensile forceThe spacing between the surface of the base substrate and the surface of the dielectric layer distal from the base substrate varies relative to the spacing between the surface of the membrane bridge proximal to the base substrate and the surface of the dielectric layer distal from the base substrate prior to the tensile force.
According to an embodiment of the present invention, referring to fig. 1 and 9, when not subjected to a stretching action, referring to fig. 1, the surface of the membrane bridge 600 close to the base substrate is spaced apart from the surface of the dielectric layer 520 away from the base substrate by a distance h 0 After a certain tensile force is applied, the surface of the film bridge 600 close to the substrate and the surface of the dielectric layer 520 far from the substrate are spaced by h 1 I.e. the variation of the height of the membrane bridge is h 0 -h 1 . In a specific embodiment, a tensile deformation finite element simulation is performed on the flexible MEMS device, as shown in fig. 10, when the overall strain of the flexible MEMS device is 0, the membrane bridge height is 1.75 micrometers, and when the overall strain of the flexible MEMS device is 30%, the membrane bridge height is 1.69 micrometers, and the variation of the membrane bridge height is only 3.4% by calculation; and when the overall strain of the flexible MEMS device is 50%, the height of the membrane bridge is 1.64 micrometers, and the variation of the height of the membrane bridge is only 6.3% by calculation. From the finite element simulation result, when the flexible MEMS device of the present invention integrally bears a large tensile strain, the variation of the membrane bridge height is relatively small, and the structure, function and stability of the MEMS component can be maintained, without the occurrence of a situation in which the MEMS component in the prior art in fig. 5 is significantly deformed by a tensile acting force. In fig. 8, the abscissa represents the overall strain of the flexible MEMS device under the stretching force, and the displacement of the film bridge refers to the displacement generated by the displacement of the position of the film bridge under the stretching force relative to the position of the film bridge under the non-stretching force, that is, the displacement of the film bridge under the non-stretching force is set to be 0.
Referring to fig. 11 and 12, according to an embodiment of the present invention, the flexible MEMS device includes: a plurality of grooves disposed on a first surface of the first substrate 100; the plurality of second substrates 200 are embedded in the plurality of grooves in a one-to-one correspondence manner, that is, one groove is correspondingly provided with one second substrate; a plurality of first ground lines 300, a plurality of signal transmission structures (the signal transmission structures include signal transmission lines 510 and dielectric layers 520, the dielectric layers are covered by the film bridges in the top view, and therefore, the dielectric layers are not shown in the figure), and a plurality of second ground lines 400, wherein one first ground line 300, one signal transmission structure, and one second ground line 400 are sequentially arranged and spaced apart on the surface of each second substrate 200 away from the second surface; a plurality of membrane bridges 600, one membrane bridge 600 being provided in one-to-one correspondence with each signal transmission structure. Therefore, each second substrate is provided with one MEMS component, namely, the flexible MEMS device comprises a plurality of MEMS components arranged at intervals, the second substrate has a large Young modulus and can provide a good supporting effect for the MEMS components, the first substrate has good flexibility and can bear large tensile deformation, and the overall performance of the flexible MEMS device is improved.
The specific number and arrangement of the plurality of MEMS components are not particularly limited, and those skilled in the art can arrange and arrange the MEMS components according to actual needs. In some embodiments, the MEMS components may be distributed in an array of rows and columns as shown in fig. 11 and 12; in other embodiments, the plurality of MEMS components may be irregularly arranged.
Fig. 12 is a schematic structural view of a flexible MEMS device under tension, wherein a plurality of MEMS components are provided, a first substrate can undergo tensile deformation, and each MEMS component is supported by a corresponding second substrate, which can ensure the structure, function and stability of the MEMS component.
The specific type of the flexible MEMS device is not particularly limited in the present invention, and may include, but is not limited to, a phase shifter, a reconfigurable antenna, a switch, a reconfigurable communication device based on a switch structure, and the like, and those skilled in the art may select the flexible MEMS device according to the actual situation.
In another aspect of the invention, an electronic device is provided. The electronic device comprises a flexible MEMS device as described above. Thus, the electronic device has all the features and advantages of the flexible MEMS device described above, which are not described in detail herein. In general, the electronic device is capable of both withstanding tensile deformation and maintaining the structure, function and stability of the MEMS components.
In the description herein, reference to the description of "an embodiment," "one embodiment," "another embodiment," "yet another embodiment," "some embodiments," "some specific embodiments," "other specific embodiments," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" in this specification are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (7)
1. A flexible MEMS device, comprising a substrate base plate, the substrate base plate comprising:
the first substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a groove;
the second substrate is embedded in the groove, the side wall of the second substrate is in contact with the side wall of the groove, the Young modulus of the second substrate is larger than that of the first substrate,
the first substrate comprises silicon rubber, and the second substrate comprises at least one of PET and PI;
the flexible MEMS device further includes a MEMS assembly comprising:
the first ground wire, the signal transmission structure and the second ground wire are sequentially arranged and are arranged on the surface, far away from the second surface, of the second substrate at intervals, wherein the signal transmission structure comprises a signal transmission line and a dielectric layer, the signal transmission line is arranged on the surface, far away from the second surface, of the second substrate, and the dielectric layer is arranged on the surface, far away from the second substrate, of the signal transmission line;
and the membrane bridge is respectively and electrically connected with the first ground wire and the second ground wire, is close to the dielectric layer when voltage acts on the membrane bridge, and is far away from the dielectric layer when the voltage is not applied.
2. The MEMS device, as recited in claim 1, wherein the young's modulus of the second substrate is not less than 100 times the young's modulus of the first substrate.
3. The flexible MEMS device of claim 2, wherein the young's modulus of the second substrate is not less than 1000 times the young's modulus of the first substrate.
4. The flexible MEMS device of any one of claims 1-3, wherein a spacing between a surface of the membrane bridge proximate to the substrate base plate and a surface of the dielectric layer distal from the substrate base plate does not vary by more than 6.5% at an overall strain of the flexible MEMS device of not more than 50%.
5. The flexible MEMS device of claim 4, wherein a spacing between a surface of the membrane bridge proximate to the substrate base plate and a surface of the dielectric layer distal from the substrate base plate does not vary by more than 4% at an overall strain of the flexible MEMS device of not more than 30%.
6. The flexible MEMS device of claim 1, comprising:
a plurality of the grooves disposed on the first surface of the first substrate;
the second substrates are embedded in the grooves in a one-to-one correspondence manner;
the first ground wires, the signal transmission structures and the second ground wires are sequentially arranged on the surface, away from the second surface, of each second substrate, and one first ground wire, one signal transmission structure and one second ground wire are arranged at intervals;
and each signal transmission structure is provided with one membrane bridge in a one-to-one correspondence manner.
7. An electronic device comprising the flexible MEMS device according to any one of claims 1 to 6.
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