CN113314446B - Chip transfer device and chip transfer method - Google Patents
Chip transfer device and chip transfer method Download PDFInfo
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- CN113314446B CN113314446B CN202010133893.2A CN202010133893A CN113314446B CN 113314446 B CN113314446 B CN 113314446B CN 202010133893 A CN202010133893 A CN 202010133893A CN 113314446 B CN113314446 B CN 113314446B
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- 150000004706 metal oxides Chemical class 0.000 description 8
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The invention provides a chip transfer device and a chip transfer method. The chip transfer device is used for transferring chips, and the chip transfer device comprises a transfer substrate, wherein a plurality of grooves are formed in the surface of the transfer substrate, each groove can only accommodate a boss on the surface of a chip main body, and the chip main body is lapped on an opening of the groove. The invention also provides a chip transferring method, a plurality of chips are placed on the surface of the transferring substrate, then shaking is carried out, and the chips move on the surface of the transferring substrate until at least part of bosses fall into grooves. The boss falls into the groove through the screen shaking, so that the chips are located on the transfer substrate, batch transfer of the chips can be realized through moving the transfer substrate, the efficiency of chip transfer is improved, meanwhile, in the screen shaking process, the original positions of the chips on the chip source are disturbed, the influence of regional uneven phenomenon of the chip source can be effectively avoided, and the transfer effect of the chips can be improved.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a chip transfer apparatus and a chip transfer method.
Background
The LED (Light Emitting Diode ) has the advantages of low energy consumption, long service life, no pollution, small volume, rich color and the like, and is widely applied to various lighting and display devices. Micro-LEDs (Micro-LEDs) are LED miniaturization and matrixing technologies, specifically, a high-density Micro-sized LED chip array is integrated on a display panel, where each LED chip is addressable and individually driven to light, and the pixel point distance between two adjacent LED chips can be reduced from millimeter level to micrometer level, so that ultra-small pitch LEDs can be formed, and the display panel achieves ultra-high pixels and ultra-high resolution. In the micro LED packaging process, the number of the chips involved is large, so that the requirement for rapidly transferring a large number of chips is more outstanding, and the requirement for the transfer precision of the chips is higher.
Currently, micro LED batch transfer techniques include precision Pick & Place (Fine Pick & Place) methods, fluid assembly methods, electrode shaker methods, and the like. The precise gripping method refers to precise gripping of a chip by electrostatic adsorption (Static Electrostatic), van der waals force (Van Der Walls force), electromagnetic force (Electromagnetic), magnetic force (Magnetic), or the like. The fluid assembling method and the ball electrode shaking screen method are characterized in that grooves corresponding to chips are formed in a target substrate, and then the whole chips are installed in the grooves.
However, the above-mentioned existing chip transfer method has some problems, which are specifically:
1. for the accurate grabbing method, the amount of one transfer is limited (about hundreds), each transfer needs to be accurately aligned, the transfer efficiency is low, in addition, the method directly adsorbs and transfers the chips according to the original positions of the chips on a chip source (such as a wafer), and if the chip source has regional non-uniformity, similar non-uniformity of products obtained after the transfer, such as micro-LED display panels, can be caused;
2. for the fluid assembly method and the electrode shaking method, the problem of serious chip inversion exists, namely that part of chip electrodes cannot be accurately aligned with electrodes on a substrate, the display effect of a display screen is affected, and if the number of reverse chips is too large, all chips are required to be removed and re-transferred, and the chip transfer efficiency is affected.
Therefore, the existing chip transfer method still has the problems of low transfer efficiency and poor transfer effect (such as uneven pictures and more inverted chips).
Disclosure of Invention
The invention provides a chip transfer device and a chip transfer method, which are used for solving the problems of low transfer efficiency and poor transfer effect during chip batch transfer.
According to an aspect of the present invention, there is provided a chip transfer apparatus for transferring a chip having a chip body and a boss provided on a side surface of the chip body, the chip transfer apparatus including a transfer substrate having a surface provided with a plurality of grooves;
wherein each groove can only accommodate a boss of one chip, and a chip main body connected with the boss is made to ride on an opening of the groove.
Optionally, the maximum width of the boss is smaller than or equal to the minimum width of the groove, and the difference is within a set position precision range.
Optionally, the orthographic projection area of the opening of the groove on the bottom surface of the groove is smaller than the area of the bottom surface of the groove.
Optionally, an included angle formed by the bottom surface of the groove and the side wall of the groove is smaller than or equal to an included angle formed by the end surface, away from the chip main body, of the boss and the side wall of the boss.
Optionally, the orthographic projection area of the opening of the groove on the bottom surface of the groove is larger than the area of the bottom surface of the groove, and the bottom surface of the groove and the end surface of the accommodated boss have the same size at least in one direction.
Optionally, the depth of the groove is greater than or equal to the height of the boss.
Optionally, the longitudinal sections and the cross sections of the boss and the groove are rectangular, trapezoidal, semicircular, semi-elliptical or a combination of more than two kinds.
Optionally, the width of the chip body is 1 μm-1 mm along the direction that the chip body is lapped on the opening of the groove.
Optionally, in the height direction of the boss, the thickness of the chip main body is greater than the maximum dimension between two points at the opening of the groove.
Optionally, in the height direction of the boss, the thickness of the chip body is at least less than 1/2 of the largest dimension of the opening of the groove in one direction, and the sum of the height of the boss and the thickness of the chip body is greater than the largest dimension of the opening of the groove in the one direction.
Optionally, the surface of the transfer substrate is provided with at least two grooves, and the opening shapes of the grooves of different types are different.
Optionally, the chip is a micro LED chip.
According to another aspect of the present invention, there is provided a chip transfer method, using the chip transfer apparatus described above, comprising:
placing a plurality of the chips on the surface of the transfer substrate; and
and (3) carrying out shaking screening to enable the chip to move on the surface of the transfer substrate until at least part of the boss falls into the groove, and taking a chip main body connected with the boss falling into the groove on the opening of the groove.
Optionally, in the step of performing the shaking screen, the chip moves in a direction parallel to the transfer substrate surface and moves vertically up and down on the transfer substrate surface.
Optionally, the movement amplitude of the chip in a direction parallel to the transfer substrate surface is greater than the movement amplitude in a vertical direction of the transfer substrate surface.
Optionally, in the step of performing the shaking screen, a horizontal auxiliary air flow is added to the surface of the transfer substrate.
Optionally, after the shaking screen is completed, the method further comprises:
tilting the transfer substrate, so that among chips on the surface of the transfer substrate, the chips with the bosses not falling into the grooves slide away from the surface of the transfer substrate, and all the bosses falling into the grooves lean against the edges of the opening of the grooves along the same direction.
Optionally, after the chips with the bosses not falling into the grooves slide off the surface of the transfer substrate, the method further includes:
carrying out AOI scanning on the transfer substrate; and
and filling grooves which are not filled with the boss on the transfer substrate based on the result of the AOI scanning.
The chip transferring device of the invention, wherein the surface of the transferring substrate is provided with a plurality of grooves, each groove can only accommodate the boss of one chip, and the chip main body connected with the boss is lapped on the opening of the groove. When the transfer substrate is used for transferring chips, the positions of the grooves can be used as the placement positions of the chips, the bosses fall into the grooves to randomly distribute the positions of the chips, optical alignment is not needed, the efficiency of chip transfer can be improved, the influence of regional non-uniformity of a chip source can be avoided, and the problem of chip inversion during chip transfer can be effectively avoided because the bosses and the chip main body are only provided with the bosses which fall into the grooves, so that the chip transfer effect can be improved.
The chip transferring method of the invention utilizes the chip transferring device, wherein after a plurality of chips are placed on the surface of the transferring substrate, the chips are moved on the surface of the transferring substrate through a shaking screen until at least part of the boss falls into the groove, and a chip main body connected with the boss falling into the groove is lapped on the opening of the groove. The chip transferring method is simple and convenient to operate, chips can be arranged on the transferring substrate according to a certain arrangement mode without optical alignment, so that the chip transferring efficiency is improved, meanwhile, in the process of shaking and screening, the original positions of the chips on the chip source are disturbed, the influence of the regional uneven phenomenon of the chip source can be effectively avoided, and the chip transferring effect can be improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a groove disposed on a transfer substrate in a chip transfer apparatus according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a chip transferred by the chip transfer apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a recess accommodating a bump in a chip transferring apparatus according to an embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a recess accommodating a bump in a chip transferring apparatus according to another embodiment of the present invention.
Fig. 5a is a schematic plan view of grooves and lands and a top view of a chip electrode according to an embodiment of the present invention.
Fig. 5b is a schematic plan view of grooves and lands and a top view of a chip electrode according to another embodiment of the present invention.
Fig. 5c is a schematic plan view of grooves and lands and a top view of a chip electrode according to yet another embodiment of the present invention.
Fig. 6a to 6d are schematic cross-sectional views illustrating steps of forming a groove on a transfer substrate according to an embodiment of the present invention.
Fig. 7a to 7f are schematic cross-sectional views illustrating steps of forming a bump on a chip body according to an embodiment of the present invention.
Fig. 8 is a schematic cross-sectional view of a tilting transfer substrate in a chip transfer method according to an embodiment of the invention.
Fig. 9a to 9g are schematic cross-sectional views illustrating a chip transfer process according to an embodiment of the invention.
Fig. 10 is a schematic diagram of a probability model of a bump falling into (tracking) and leaving (Detrapping) a groove in a chip transfer apparatus according to an embodiment of the present invention.
Reference numerals illustrate:
a 100-semiconductor substrate; 101-chip electrodes; 102-a chip body; 103-chip; 110-a protective layer; 120-boss; 130-a silicon oxide layer; 200-transferring a substrate; 201-a hard plate; 202-a dielectric film; 203-grooves; 204-metal oxide; 301-target substrate electrode.
Detailed Description
The chip transferring apparatus and the chip transferring method according to the present invention will be described in further detail with reference to the accompanying drawings and the specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention. For clarity, in all the drawings for assisting in the description of the embodiments of the present invention, the same reference numerals are given to the same components in principle, and the repetitive description thereof will be omitted.
It is to be understood that the various embodiments are merely exemplary implementations of the manufacturing and application embodiments and are not to be construed as limiting the scope of the invention in its manufacture and application. Moreover, the description of the embodiments is only for the purpose of more clearly explaining the gist of the present invention, but the technical features of each embodiment are not unique to the embodiment, and all the features of each embodiment may also be regarded as features of one general embodiment. In some implementations, technical features in the following embodiments may also be related and inspired to form a new embodiment.
Example 1
The embodiment mainly describes a chip transfer device, which can solve the problems of low transfer efficiency and poor transfer effect when chips are transferred in batches. The specific description is as follows.
The chip transfer device in this embodiment is used for transferring the chip that has the chip main part and sets up the boss of chip main part one side surface, the chip transfer device includes transferring the base plate, it is provided with a plurality of recesses to transfer the base plate surface, wherein, every the recess only can hold the boss of chip to make the chip main part that is connected with the boss take on the opening of recess.
In this embodiment, the chip is, for example, a micro LED chip, and the chip may further include a chip electrode for forming an electrical connection with a target substrate electrode on the target substrate, a boss of the chip is disposed on the other side opposite to the chip electrode, and, according to a requirement of bonding with the target substrate and in order to avoid damage to the electrode during the chip transferring process, a protection layer is disposed on the other side surface of the chip body opposite to the boss, and the protection layer covers the chip body surface between the chip electrode and the chip electrode. However, in other embodiments, the bumps on the surface of the chip body may be provided on the same side of the chip body as the chip electrodes.
In order to enable the boss to fall into the groove, the maximum width of the boss is smaller than or equal to the minimum width of the groove, and the difference is within the range of the set position precision. Preferably, the width of the chip body is 1 μm to 1mm in a direction in which the chip body is mounted on the opening of the recess.
In order to enable the boss falling into the groove to move within the precision range limited by the groove, the orthographic projection area of the opening of the groove on the bottom surface of the groove can be smaller than the area of the bottom surface of the groove; the included angle formed by the bottom surface of the groove and the side wall of the groove can be smaller than or equal to the included angle formed by the end surface, away from the chip main body, of the boss and the side wall of the boss.
In order to improve the chip transfer precision, the orthographic projection area of the opening of the groove on the bottom surface of the groove can be larger than the area of the bottom surface of the groove, and the bottom surface of the groove and the end surface of the accommodating boss can be equal in size at least in one direction, so that the precision of the chip seat in the groove is improved, and the chip transfer precision can be improved. In this embodiment, the depth of the groove may be greater than or equal to the height of the boss.
Specifically, the longitudinal sections of the boss and the groove may be rectangular, trapezoidal, semicircular, semi-elliptical, or a combination thereof, both in the direction perpendicular to the surface of the chip main body and in the direction perpendicular to the surface of the transfer substrate. The cross-sections of the lands and grooves may be rectangular, trapezoidal, semi-circular, semi-elliptical, or a combination thereof, in a direction parallel to the surface of the chip body and in a direction parallel to the surface of the transfer substrate.
In order to prevent the chip from being inverted in the groove on the transfer substrate, the thickness of the chip main body in the height direction of the boss can be larger than the maximum size between two points at the opening of the groove so as to prevent the chip main body from falling into the groove; alternatively, in the height direction of the boss, the thickness of the chip body is at least less than 1/2 of the largest dimension of the opening of the recess in one direction, and the sum of the height of the boss and the thickness of the chip body is greater than the largest dimension of the opening of the recess in the one direction.
In this embodiment, the surface of the transfer substrate may be provided with at least two kinds of grooves, and the opening shapes of the different kinds of grooves are different. The chip transferring device can be used for transferring various chips due to the fact that the grooves with various opening shapes are formed in the transferring substrate. For example, in realizing the full-color function of a display screen, three kinds of micro LED chips, each of which emits light in a different color, need to be transferred. In order to transfer the three micro LED chips simultaneously, grooves with three opening shapes are formed in the transfer substrate, the shapes of bosses on the three micro LED chips are different from each other corresponding to the three grooves, and one boss shape corresponds to only one groove, so that the effect of chip transfer is prevented from being influenced by the fact that the bosses on the chips fall into the grooves which do not correspond to the bosses by mistake.
In order to make the characteristics of the chip transfer apparatus clearer, the chip transfer apparatus will be described below taking a case where the longitudinal section of the groove perpendicular to the surface of the transfer substrate is trapezoidal as an example.
Fig. 1 is a schematic cross-sectional view of a groove disposed on a transfer substrate in a chip transfer apparatus according to an embodiment of the invention. Fig. 2 is a schematic cross-sectional view of a chip transferred by the chip transfer apparatus according to an embodiment of the present invention. As shown in fig. 1 and 2, in the present embodiment, the longitudinal section of the boss is trapezoidal in the direction perpendicular to the surface of the chip main body, and the longitudinal section of the groove is also trapezoidal in the direction perpendicular to the surface of the transfer substrate.
Specifically, for the cross section of the groove in the direction perpendicular to the surface of the transfer substrate, the opening width of the groove is d4, the width of the bottom of the groove is d5, the depth of the groove is h2, and the included angle formed by the bottom surface of the groove and the side wall of the groove is β, wherein in this embodiment, d4< d5, i.e., the longitudinal section of the groove is inverted trapezoid. For the section of the boss in the direction perpendicular to the surface of the chip main body, the width of the end face of the boss, which is contacted with the chip main body, is d2, the width of the end face of the boss, which is far away from the chip main body, is d3, the height of the boss on the chip is h1, and the included angle formed by the end face of the boss, which is far away from the chip main body, and the side wall of the boss is alpha, wherein d2 is less than d3, namely the longitudinal section of the boss is in a positive trapezoid shape; in this direction, the width of the chip body is d1, and the thickness h3 of the chip body (if a protective layer is formed on the surface of the chip body, h3 includes the thickness of the protective layer). More specifically, in this embodiment, in order to make the boss more likely to fall into the recess than the chip body, d1 may be greater than d3, so that d1> d3> d2; in order to make the boss smoothly drop into the groove, d3 may be smaller than d4 so that d5> d4> d3; in order to prevent the chip from inverting in the recess, d1 may be greater than d4; in order to make the boss less likely to escape from the recess, the included angle β may be smaller than the included angle α. Preferably, d1 is in the range of 1 μm to <1 mm; h1 is equal to h2 and h1 and h2 are at least less than 1/2d1; in order to prevent the chip from falling into the recess in an incorrect posture, h3 may be greater than d4; or h3 is at least less than 1/2d4 so that the chip can move to adjust to the correct posture after falling into the groove in the incorrect posture.
Fig. 3 is a schematic cross-sectional view of a recess accommodating a bump in a chip transferring apparatus according to an embodiment of the invention. The advantage of the positive trapezoid shape in the longitudinal section of the boss and the inverted trapezoid shape in the longitudinal section of the groove will be described below with reference to fig. 3. As shown in fig. 3, after the bump on the chip falls into the groove, the positive trapezoid boss and the inverted trapezoid groove on the chip form a dovetail mortise structure, so that the bump can be effectively reduced from escaping from the groove, and the chip transfer efficiency is improved.
Fig. 4 is a schematic cross-sectional view of a recess accommodating a bump in a chip transferring apparatus according to another embodiment of the present invention. In order to prevent the boss from falling into the groove and then moving too much in the groove, in this embodiment, the bottom of the groove of the transfer substrate is designed to be folded back, that is, a side wall is additionally arranged on the side wall and the bottom of the inverted trapezoid groove in fig. 1, the additionally arranged side wall is opposite to an included angle beta formed by the bottom of the original groove and the side wall of the groove, preferably, as shown in fig. 4, the additionally arranged side wall and the bottom of the groove form an included angle larger than 90 degrees, in the direction perpendicular to the surface of the transfer substrate, the additionally arranged side wall can enable the width of the bottom of the groove to be consistent with the width of the boss away from the end face of the chip, so that the boss can slide to the bottom of the groove after falling into the groove, and the movement of the boss in the groove is limited by the bottom of the groove, thereby improving the positioning precision of the chip on the transfer substrate and improving the precision of the chip transfer.
Fig. 5a is a schematic plan view of grooves and lands and a top view of a chip electrode according to an embodiment of the present invention. Fig. 5b is a schematic plan view of grooves and lands and a top view of a chip electrode according to another embodiment of the present invention. Fig. 5c is a schematic plan view of grooves and lands and a top view of a chip electrode according to yet another embodiment of the present invention. Cross-sectional patterns of the lands and grooves are described below in connection with fig. 5 a-5 c.
Specifically, if the chip electrode is not available after rotating by a certain angle within 360 °, the plane patterns of the boss and the groove should also be designed to be patterns that do not overlap with the original patterns after rotating by a certain angle within 360 °, and as an example, when the chip electrode is two circles with different diameters, as illustrated on the right side of fig. 5a, the cross sections of the boss and the groove may be trapezoidal, as illustrated on the left side of fig. 5 a. If the chip electrode is still available after rotating by a certain angle within 360 degrees, the plane patterns of the boss and the groove should also be designed into patterns which are overlapped with the original patterns after rotating by a certain angle within 360 degrees, as an example, when the plane patterns of the chip electrode are two small circles symmetrically distributed on two sides of a big circle as illustrated in the right side of fig. 5b, the chip electrode is the same as the original patterns after rotating by 180 degrees, as illustrated in the left side of fig. 5b, and the cross sections of the boss and the groove can be elliptical. If the planar pattern of the chip electrode is still available after rotating by any angle within 360 °, the planar patterns of the boss and the groove may be designed to have any shape without affecting the use of the chip electrode, as an example, as illustrated in the right side of fig. 5c, the planar pattern of the chip electrode is annular, as illustrated in the left side of fig. 5c, and the cross sections of the boss and the groove may be circular.
The chip transferring device of the invention, wherein the surface of the transferring substrate is provided with a plurality of grooves, each groove can only accommodate the boss of one chip, and the chip main body connected with the boss is lapped on the opening of the groove. When the transfer substrate is used for transferring chips, the positions of the grooves can be used as the placement positions of the chips, the bosses fall into the grooves to randomly distribute the positions of the chips, optical alignment is not needed, the efficiency of chip transfer can be improved, the influence of regional non-uniformity of a chip source can be avoided, and the problem of chip inversion during chip transfer can be effectively avoided because the bosses and the chip main body are only provided with the bosses which fall into the grooves, so that the chip transfer effect can be improved.
Further, when the opening shapes of the grooves of the plurality of types are different, corresponding bosses of the different shapes are arranged on the surfaces of the plurality of types of chips, one type of boss corresponds to one type of groove, and the plurality of types of chips can be transferred by using the chip transfer device, and the transfer efficiency is high and the transfer effect is good.
Example two
The present embodiment mainly describes a method for manufacturing a chip transferring device, which can be used to manufacture the chip transferring device according to the first embodiment.
The chip transfer device in this embodiment may be used for transferring a chip having a chip body and a boss provided on a side surface of the chip body, the chip transfer device including a transfer substrate provided with a plurality of grooves on a surface thereof, wherein each of the grooves is capable of accommodating only one boss of the chip and such that the chip body connected to the boss rides on an opening of the groove.
In this embodiment, the longitudinal sections of the boss and the recess may be trapezoidal in both the direction perpendicular to the surface of the chip main body and the direction perpendicular to the surface of the transfer substrate. More specifically, for the longitudinal section of the groove, the opening width of the groove is smaller than the width of the bottom surface of the groove, i.e. the longitudinal section of the groove is in an inverted trapezoid shape.
Fig. 6a to 6d are schematic cross-sectional views illustrating steps of forming a groove on a transfer substrate according to an embodiment of the present invention. The following describes a method for manufacturing the chip transferring device in the present embodiment with reference to fig. 6a to 6 d. The manufacturing method of the chip transfer device may include the steps of:
s01: as shown in fig. 6a, a hard flat plate 201 is provided, a dielectric film 202 is formed on a surface of one side of the hard flat plate 201, and the thickness of the dielectric film 202 is set according to the depth of the groove, preferably, the thickness of the dielectric film may be equal to the depth of the groove;
s02: as shown in fig. 6b, a photoresist is coated on the surface of the dielectric film 202 and developed, and then the dielectric film is etched to form a bump, wherein the cross-sectional shape of the bump is the same as the cross-sectional shape of the groove;
s03: as shown in fig. 6c, the metal oxide 204 is filled between the bumps, and the metal oxide 204 is planarized to make the metal oxide surface flush with the bump surface;
s04: as shown in fig. 6d, the bump is etched away, forming the groove 203.
In this embodiment, the transfer substrate may be a hard plate. The fill material between the bumps may be a metal oxide, however, in other embodiments, the metal oxide may be other material as long as the fill material is not affected when the dielectric film is removed.
Fig. 7a to 7f are schematic views illustrating forming a boss on a chip body according to an embodiment of the invention. Referring to fig. 7a to 7f, the present embodiment further provides a method for manufacturing a boss with a regular trapezoid longitudinal section, which may include:
s11: providing a semiconductor substrate, as shown in fig. 7a, wherein a plurality of connected chips are formed on the semiconductor substrate 100, the semiconductor substrate 100 comprises a front surface and a back surface which are opposite, the chips comprise chip electrodes 101, the chip electrodes 101 are exposed on the front surface of the semiconductor substrate, a protective layer 110 is formed on the front surface of the semiconductor substrate, and the protective layer 110 covers the surface of the semiconductor substrate between the chip electrodes and the chip electrodes;
s12: as shown in fig. 7b, a silicon oxide layer 130 is deposited on the back surface, and the thickness of the silicon oxide layer may be set according to the height of the boss;
s13: as shown in fig. 7c, a patterned mask layer is formed on the surface of the silicon oxide layer 130, the silicon oxide layer is etched by using the mask layer, etching holes with the same shape as the boss are etched, and then the mask layer is removed;
s14: as shown in fig. 7d, the etching holes may be filled with metal oxide, and the metal oxide may be planarized to make the surface of the metal oxide flush with the surface of the silicon oxide layer 130;
s15: as shown in fig. 7e, dicing is performed from the front surface of the semiconductor substrate 100, the dicing stopping at the silicon oxide layer 130;
s16: as shown in fig. 7f, the remaining silicon oxide layer 130 is removed to form the bumps 120, resulting in individual chips 103.
Example III
The present embodiment mainly describes a chip transfer method, and the chip transfer apparatus described in the first embodiment can be used. According to the chip transferring method, the boss falls into the groove through the screen shaking, so that the chips are located on the transferring substrate, batch transferring of the chips can be achieved through moving the transferring substrate, the chip transferring efficiency is improved, meanwhile, in the screen shaking process, the original positions of the chips on the chip sources are disturbed, the influence of regional non-uniformity phenomenon of the chip sources can be effectively avoided, and the transferring effect of the chips can be improved.
The chip transfer method of the present embodiment includes the steps of:
a first step of: placing a plurality of the chips on the surface of the transfer substrate;
and a second step of: and (3) carrying out shaking screening to enable the chip to move on the surface of the transfer substrate until at least part of the boss falls into the groove, and taking a chip main body connected with the boss falling into the groove on the opening of the groove.
Specifically, in the second step, the chip can be moved in a direction parallel to the surface of the transfer substrate by shaking the screen, and can also move vertically up and down on the surface of the transfer substrate. Wherein the movement amplitude of the chip in the direction parallel to the transfer substrate surface may be larger than the movement amplitude in the vertical direction of the transfer substrate surface.
In order to increase the degree of freedom of movement of the chips on the surface of the transfer substrate, the chip transfer method of the present embodiment may further include, in the step of performing the shaking, adding a horizontal auxiliary air flow to the surface of the transfer substrate. The auxiliary airflow is added in the process of shaking the screen, the degree of freedom of movement of the chips on the surface of the transfer substrate is increased, the change of the position relation among the chips is increased, the original positions of the chips on the chip source can be further disturbed, the influence of the phenomenon of regional non-uniformity of the chip source can be effectively avoided, and the effect of batch transfer of the chips is improved. In addition, the degree of freedom of movement of the chip on the surface of the transfer substrate is increased, the probability that the boss on the surface of the chip falls into the groove on the transfer substrate can be increased, and the efficiency of chip transfer is improved.
After the second step is finished, the chip transferring method may further include: tilting the transfer substrate can cause the chips on the surface of the transfer substrate, in which the bosses do not fall into the grooves, to slide away from the surface of the transfer substrate, and can cause all the bosses falling into the grooves to lean against the edges of the opening of the grooves in the same direction. FIG. 8 is a schematic cross-sectional view illustrating the tilting of a transfer substrate according to an embodiment of the invention. Tilting the transfer substrate, as shown in fig. 8, may cause the chips with the bosses not falling into the grooves to slide off the surface of the transfer substrate; and tilting the transfer substrate again before the chip electrode and the target substrate electrode are precisely aligned, so that all the bosses falling into the grooves can lean against the edges of the opening of the grooves along the same direction. The positioning of the chip on the transfer substrate is limited by the boss on the chip and the groove on the transfer substrate, when all bosses lean against the edge of the opening of the groove along the same direction, the positioning precision of the chip on the transfer substrate can be converted into the manufacturing precision of the boss and the groove, the boss and the groove can be manufactured by photoetching and etching technology, and the precision of the boss and the groove can be controlled above submicron level, so that the precision of batch transfer of the chips can be improved by tilting the transfer substrate.
In this embodiment, the chip transferring method may further include, after the chip with the boss not falling into the groove slides off the surface of the transferring substrate, performing AOI scanning on the transferring substrate, and based on a result of the AOI scanning, filling the groove with the boss on the transferring substrate. In addition, the transfer substrate is subjected to AOI scanning, chips with incorrect seating modes on the transfer substrate can be found, and the chips with incorrect seating modes can be corrected. Because the AOI inspection flow is added in the chip transferring process, the chip on the transferring substrate can be corrected and the groove on the transferring substrate can be filled, the accuracy of chip transferring can be improved, the chip batch transferring effect can be improved, and the quality of the product obtained after chip transferring and packaging can be improved.
In this embodiment, in order to understand the real-time condition that the boss falls into the groove in the process of shaking the screen, CCD (Charge Coupled Device) may be utilized to monitor the condition that the boss falls into the groove in real time. According to the real-time condition that the boss falls into the recess, the size of the auxiliary air current of horizontal direction can be adjusted, the amplitude of shaking screen can also be adjusted to adjust the multidirectional motion amplitude of chip on transferring the base plate surface, thereby can accelerate the boss on the chip and fall into the speed of transferring the recess on the base plate, improve the efficiency that the chip was transferred.
In another embodiment of the present invention, more than one chip to be transferred may be transferred by using the chip transfer device of the first embodiment, and grooves with different opening shapes are provided on the transfer substrate in the chip transfer device. The chip transfer method of the present embodiment will be described below by taking three kinds of chips to be transferred as examples.
In this embodiment, in order to transfer different kinds of chips, the following steps may be adopted:
s21: sorting the boss sizes of the surfaces of the three chip main bodies in the direction that the chip main bodies are lapped on the opening of the groove;
s22: placing the chip with the largest size of the boss on the surface of the transfer substrate, and carrying out shaking screening to enable the chip to move on the surface of the transfer substrate until at least part of the boss falls into a corresponding groove, and taking a chip main body connected with the boss falling into the groove on an opening of the groove;
s23: tilting the transfer substrate to enable the chips, of which the bosses do not fall into the grooves, on the surface of the transfer substrate to slide away from the surface of the transfer substrate;
s24: horizontally placing the transfer substrate, placing the chips with the second size sequence of the bosses on the transfer substrate, and shaking until at least part of the bosses fall into the corresponding grooves;
s25: and removing the chips with the minimum size, which are not dropped into the grooves, on the surface of the transfer substrate, placing the chips with the minimum size on the surface of the transfer substrate, and carrying out shaking screening to enable the bosses on the surface of the chips to drop into the grooves.
By the chip transfer method, batch transfer of various chips can be realized, the transfer efficiency is high, the transfer effect is good, and more specifically, the full-color function of the display screen can be realized.
Fig. 9a to 9g are schematic cross-sectional views illustrating a chip transfer process according to an embodiment of the invention. The process of performing chip transfer and bonding using the chip transfer method of the present embodiment is described below with reference to fig. 9a to 9 g.
Specifically, the chip transfer and bonding using the chip transfer method of the present embodiment may include the following processes:
firstly, as shown in fig. 9a and 9b, placing a plurality of chips on the surface of a transfer substrate, and then shaking the chips so that the chips move on the surface of the transfer substrate until at least part of the boss 120 falls into the groove 203, and the chip main body connected with the boss falling into the groove is lapped on the opening of the groove;
next, as shown in fig. 9c, the chip is transferred to a target area by using the transfer substrate, and before the chip electrode and the target substrate electrode are precisely aligned, the protective layer 110 on the surface of the chip is removed, so as to expose the surface of the chip electrode 101;
then, as shown in fig. 9d, after removing the protective layer 110, the transfer substrate 200 carrying the chips is opposed to the target substrate, and the chip electrodes 101 on the respective chips are aligned with the target substrate electrodes 301;
next, as shown in fig. 9e and 9f, the chip electrode 101 and the target substrate electrode 301 are bonded, and the transfer substrate 200 is removed;
finally, as shown in fig. 9g, after removing the transfer substrate 200, the bumps 120 on the chip are etched away.
Fig. 10 is a schematic diagram of a probability model of a bump falling into (tracking) and leaving (Detrapping) a groove in a chip transfer apparatus according to an embodiment of the present invention. The probability number model of the land falling into and leaving the groove is described below in connection with fig. 10. As shown in fig. 10, the capture probability r of the notch capture chip trap ＝C 1 n v n c Probability r of chip escaping from groove detrap ＝C 2 n 0 Probability of final filling of grooves
Wherein n is v Indicating the number of grooves, n c Representing the number of chips, n o C represents the number of chips falling into the grooves 1 Representing the capture probability constant, C 2 Represents the escape probability constant, K represents the capture probability constant C 1 And escape probability constant C 2 Is a ratio of (2).
According to the groove final filling probability C fill The following can be concluded:
(1) If the boss is to fill the groove, C fill Approaching 1, C is needed 1 The numerical value is as large as possible, C 2 Close to 0;
(2) When critical dimensions such as d in the chip lands and grooves 3 、d 4 、h 1 、h 2 After the determination, C is no matter whether the longitudinal section of the boss is a positive trapezoid and the longitudinal section of the groove is an inverted trapezoid 1 Are all basically equivalent to C fill Has no influence, i.e. the specific shape of the longitudinal section of the boss and the groove has an influence on C fill The influence of the step (a) is not great, and the bosses on the chip can fall into and fill the grooves only by reasonably designing the sizes of the bosses, that is to say, the chip transfer method provided by the embodiment has feasibility;
(3) Because tangential force can be generated by the shaking screen, when the regular trapezoid boss and the inverted trapezoid groove escape from the groove, a unilateral dovetail mortise structure can be formed, and the matching of the rectangular boss and the rectangular groove is used as a comparison example, so that the tensile pulling capacity of the mortise structure is stronger than that of the rectangular straight tenon, the longitudinal section of the groove is designed to be inverted trapezoid, and the longitudinal section of the boss is designed to be regular trapezoid, so that C can be caused 2 And the escape probability of the boss can be obviously reduced when the groove is more approximate to 0, and the final filling probability of the groove is improved.
The chip transfer method of the embodiment has the following advantages: on the one hand, the chip boss falls into the groove through the shaking screen, and then the chips are transferred by moving the transfer substrate, so that batch transfer of the chips can be realized, and the efficiency of chip transfer is improved; on the other hand, the original positions of the chips on the chip source can be disturbed through the screen shaking, the influence of the phenomenon of regional non-uniformity of the chip source can be effectively avoided, the chip transferring effect can be improved, in addition, the horizontal auxiliary air flow is added to the surface of the transferring substrate during screen shaking, the movement freedom degree of the chips during screen shaking can be increased, the probability that the boss falls into the groove can be increased, the speed that the boss falls into the groove can be accelerated, and the efficiency of chip batch transferring can be improved; on the other hand, through the size limitation of the boss on the chip and the groove on the transfer substrate in all directions, the chip can not fall into the groove in an incorrect posture, the inversion problem during chip transfer can be effectively avoided, and the boss and the groove can be formed through an etching process, so that the manufacturing precision of the boss and the groove is high, the chip can be positioned on the transfer substrate with high precision, and the precision of chip batch transfer is improved.
The foregoing description is only illustrative of the preferred embodiments of the present invention, and is not intended to limit the scope of the claims, and any person skilled in the art may make any possible variations and modifications to the technical solution of the present invention using the method and technical content disclosed above without departing from the spirit and scope of the invention, so any simple modification, equivalent variation and modification made to the above embodiments according to the technical matter of the present invention fall within the scope of the technical solution of the present invention.
Claims (16)
1. The chip transfer device is characterized by being used for transferring a chip, wherein the chip is provided with a chip main body and a boss arranged on one side surface of the chip main body, the chip transfer device comprises a transfer substrate, and a plurality of grooves are formed in the surface of the transfer substrate;
wherein each groove can only accommodate a boss of one chip, and a chip main body connected with the boss is lapped on an opening of the groove; the orthographic projection area of the opening of the groove on the bottom surface of the groove is smaller than the area of the bottom surface of the groove, and the included angle formed by the bottom surface of the groove and the side wall of the groove is smaller than or equal to the included angle formed by the end surface of the boss, which is far away from the chip main body, and the side wall of the boss.
2. The chip transfer apparatus of claim 1, wherein a maximum width of the boss is equal to or less than a minimum width of the recess, and the difference is within a set positional accuracy.
3. The chip transfer apparatus of claim 2, wherein an orthographic projection area of an opening of the recess at a bottom surface of the recess is larger than an area of the bottom surface of the recess, and a dimension of the bottom surface of the recess and an end surface of the accommodated boss is equal in at least one direction.
4. The chip transfer apparatus of claim 1, wherein a depth of the recess is equal to or greater than a height of the boss.
5. The chip transfer apparatus of claim 1, wherein the longitudinal cross-section, of the boss and the recess are rectangular, trapezoidal, semi-circular, semi-elliptical, or a combination of two or more.
6. The chip transfer apparatus according to claim 1, wherein a width of the chip main body is 1 μm to 1mm in a direction in which the chip main body is mounted on an opening of the recess.
7. The chip transfer apparatus of claim 1, wherein a thickness of the chip body in a height direction of the boss is greater than a maximum dimension between two points at an opening of the recess.
8. The chip transfer apparatus of claim 1, wherein in a height direction of the boss, a thickness of the chip body is at least less than 1/2 of a largest dimension of an opening of the recess in one direction, and a sum of the height of the boss and the thickness of the chip body is greater than the largest dimension of the recess opening in the one direction.
9. The chip transfer apparatus according to any one of claims 1 to 8, wherein the transfer substrate surface is provided with at least two kinds of grooves, and the opening shapes of the different kinds of grooves are different.
10. The chip transfer apparatus of any one of claims 1 to 8, wherein the chip is a micro LED chip.
11. A chip transfer method using the chip transfer apparatus according to any one of claims 1 to 10, comprising:
placing a plurality of the chips on the surface of the transfer substrate; and
and (3) carrying out shaking screening to enable the chip to move on the surface of the transfer substrate until at least part of the boss falls into the groove, and taking a chip main body connected with the boss falling into the groove on the opening of the groove.
12. The chip transferring method as claimed in claim 11, wherein in the step of performing the shaking screen, the chip moves in a direction parallel to the surface of the transfer substrate and moves vertically up and down on the surface of the transfer substrate.
13. The chip transfer method of claim 12, wherein the chips have a greater amplitude of motion in a direction parallel to the transfer substrate surface than in a vertical direction of the transfer substrate surface.
14. The chip transfer method of claim 11, wherein in the step of performing a shaking screen, a horizontal auxiliary air flow is added to the transfer substrate surface.
15. The chip transfer method of claim 11, further comprising, after the shaking screen is completed:
tilting the transfer substrate, so that among chips on the surface of the transfer substrate, the chips with the bosses not falling into the grooves slide away from the surface of the transfer substrate, and all the bosses falling into the grooves lean against the edges of the opening of the grooves along the same direction.
16. The chip transfer method of claim 15, further comprising, after the chips with the lands not falling into the grooves slide off the transfer substrate surface:
carrying out AOI scanning on the transfer substrate; and
and filling grooves which are not filled with the boss on the transfer substrate based on the result of the AOI scanning.
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| CN114335262A (en) * | 2021-12-29 | 2022-04-12 | 深圳市思坦科技有限公司 | Transfer device and LED chip transfer method |
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| WO2015008870A2 (en) * | 2013-07-16 | 2015-01-22 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing same |
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