CN113305418A - Coaxial focus searching device for laser processing and laser processing method - Google Patents
Coaxial focus searching device for laser processing and laser processing method Download PDFInfo
- Publication number
- CN113305418A CN113305418A CN202110552901.1A CN202110552901A CN113305418A CN 113305418 A CN113305418 A CN 113305418A CN 202110552901 A CN202110552901 A CN 202110552901A CN 113305418 A CN113305418 A CN 113305418A
- Authority
- CN
- China
- Prior art keywords
- laser
- processing
- laser processing
- focal length
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
Abstract
The invention discloses a coaxial focus searching device for laser processing and a laser processing method, and relates to the technical field of laser processing. The laser processing coaxial focus searching device and the laser processing method provided by the invention can realize coaxial automatic focus searching during processing, thereby solving the problem of poor quality caused by the unevenness of a carrying platform and the warping of supplied materials.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a coaxial focus searching device for laser processing and a laser processing method.
Background
Laser processing is carried out by focusing the energy of light through a lens to achieve high energy density at a focus and relying on the photothermal effect. The laser processing does not need tools, has high processing speed and small surface deformation, and can process various materials. The material is subjected to various processes such as punching, cutting, scribing, welding, heat treatment, etc. with a laser beam.
The processing focus in the existing conventional processing system is a fixed z-axis position configured in advance. If the processing carrying platform is uneven or the supplied materials of the products are warped, the defective rate and the alarm frequency are increased due to the fact that the fixed focal length is used for processing.
Disclosure of Invention
In order to solve the defects of the prior art, the main object of the present invention is to provide a laser processing coaxial focus searching device and a laser processing method, so as to realize coaxial automatic focus searching during processing, thereby solving the problems of uneven platform deck and poor quality caused by incoming material warping.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a laser processing coaxial focus searching device comprises:
the laser processing head is internally provided with a processing light path and is provided with a first beam combining mirror, the first beam combining mirror is positioned in the processing light path, and first laser emitted by the first laser is reflected after being emitted to the first beam combining mirror and is irradiated on the surface of a product through the processing light path;
the laser focus measuring device comprises a second beam combiner and a sensor, and the sensor is used for sending and receiving second laser; the second laser passes through the second beam combiner and the first beam combiner, is overlapped with the processing light path, irradiates the surface of the product and is reflected back to the sensor;
and the controller is used for receiving the focal length measured by the laser focus measuring device in real time and adjusting the Z-axis machining coordinate of the laser machining head according to the focal length information.
Optionally, the second beam combiner adopts a two-color beam combiner, a front-side plated film is arranged on one surface of the second beam combiner facing the sensor, and the front-side plated film is used for increasing the reflectivity of the second laser; and a back antireflection coating is arranged on one surface of the second beam combining mirror, which faces away from the sensor. The double-color-direction beam combining mirror can solve the problem of stray light reflected by an imaging light path and reduce the influence of reflected stray light.
Optionally, an optical filter is disposed between the second beam combiner and the sensor. The optical filter can solve the problem that the second beam combiner cannot singly reflect the second laser.
Optionally, the wavelength of the second laser is 660 nm; the filtering wavelength of the optical filter is 660 nm. The laser of the wave band is easy to be combined with the first laser, and the second laser and the first laser are easy to realize the coaxial and common path (share the same processing light path).
Optionally, the controller comprises a Z-axis adjustment motor for controlling the distance between the laser processing head and the product to enable adjustment of the Z-axis processing coordinate of the laser processing head. Has the advantages of simple structure, accurate control and practicality.
Optionally, the system further comprises an imaging ranging device, wherein the imaging ranging device comprises an imaging device, and the imaging device is coaxially and confocally arranged on the processing light path and is used for judging the focal length. Has the advantages of low cost and simple structure.
Optionally, the imaging device is a CCD camera, and the CCD camera is configured to determine a focal length and send focal length information to the controller. Has the advantages of low cost and wide application.
The invention also provides a laser processing method, which comprises the following steps:
emitting second laser light through the sensor and measuring a focal length by using the second laser light;
adjusting the Z-axis machining coordinate of the laser machining head in real time according to the focal length information fed back by the laser focus detector in real time;
the first laser emitted by the first laser irradiates the surface of the product through the processing light path so as to process the product.
Optionally, the method further comprises the steps of:
judging a focal length through an imaging distance measuring device; and adjusting the Z-axis processing coordinate of the laser processing head according to the focal distance information judged by the imaging distance measuring device. The focal length is measured through the imaging distance measuring device and the laser focus measuring device, so that the focal length is more accurately judged.
The invention provides a laser processing coaxial focus searching device and a laser processing method.A laser focus measuring device is additionally arranged to emit second laser, the second laser is overlapped with a processing light path, and is reflected back to the laser focus measuring device after being irradiated on a product through a second beam combining mirror and a first beam combining mirror, and the laser focus measuring device collects real-time processing focus, namely focus information, at the position calculated by the energy feedback value of the second laser reflected back from the surface of the product; and then the controller adjusts the Z-axis processing coordinate of the laser processing head in real time according to the focal length information, so that when the carrying platform is uneven and the supplied materials are warped, the Z-axis processing coordinate can be adjusted in real time according to the surface of the product, and the reject ratio caused by inaccurate processing is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural view of a laser processing apparatus in the prior art;
fig. 2 is a schematic structural view of a laser processing apparatus provided in an embodiment of the present invention;
fig. 3 is a schematic structural view of a laser processing apparatus according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The inventor of the present invention found in long-term research that, as shown in fig. 1, the laser processing device is a schematic structural diagram of a laser processing device in the prior art, and comprises a laser processing head 1 and an imaging distance measuring device 4. The imaging and distance measuring device 4 usually employs an imaging ccd (charge coupled device) camera. When the device is used, after the focal length is manually judged through the imaging CCD camera, the current Z-axis coordinate is memorized and then stored in the parameter file. And in the subsequent equipment processing, the Z-axis coordinate in the parameter file is taken as a processing focus. If the situations of incoming material warping, foreign body unevenness of a carrying platform and the like are met, the alarm frequency and the reject ratio of the equipment can be increased. Based on this, the inventor adds the laser focus finder on this basis to be used for real-time detection focus, realizes adjusting the Z axle processing coordinate of laser processing head 1, in order to avoid this problem.
As shown in fig. 2 and 3, the present invention provides a laser processing coaxial focus searching device, which may generally include: a laser processing head 1, a first laser 12, a laser focus finder 2 and a controller (not shown in the figure). A processing light path is arranged in the laser processing head 1, a first beam combining mirror 11 is arranged on the laser processing head, and the first beam combining mirror 11 is located in the processing light path. The first laser emitted by the first laser 12 is reflected by the first beam combiner 11, and irradiates the surface of the product 3 through the processing optical path, so as to perform laser processing on the product 3. The laser focus finder 2 comprises a second beam combiner 21 and a sensor 22. The sensor 22 is used for emitting and receiving the second laser light. The second laser beam passes through the second beam combiner 21 and the first beam combiner 11, then overlaps with the processing light path, irradiates the surface of the product 3 and is reflected back to the sensor 22. The controller is used for receiving the focal length measured by the laser focus measuring device 2 in real time and adjusting the Z-axis processing coordinate of the laser processing head 1 according to the focal length information, so that the processing position can be automatically calibrated in real time along with the surface change of the product 3 during laser processing, and the equipment alarm and poor processing caused by the conditions of incoming material warping, carrier foreign body unevenness and the like can be avoided.
Specifically, as shown in fig. 2, the specific working process of the coaxial focus finding device for laser processing provided by the present invention is as follows:
in laser processing, a first laser 12 emits a first laser, which is reflected by a first beam combiner 11 and then irradiates and focuses on the surface of a product 3 (i.e., an object to be processed, such as sapphire, a sapphire with a ground and thinned surface, and the like, and the surface precision error of the product is about +/-10 um) to process the product 3; the sensor 22 emits a second laser (or a light beam), the second laser is reflected by the second beam combiner 21, then is transmitted by the first beam combiner 11, and then is irradiated on the surface of the product 3, and then is reflected, the reflected second laser returns to the sensor 22 along the original path, and the sensor 22 collects the real-time processing focus at the calculated energy feedback value of the second laser reflected by the surface of the product 3, namely the focal length information; after the controller acquires the focal length information, the Z-axis machining coordinate of the laser machining head 1 is adjusted in real time, so that in the machining process, first laser is always focused on the surface of a product 3, the machining precision is improved, and the problem of the product fraction defective of a warping area caused by overhigh warping height of an incoming material product is solved.
In the present invention, the first laser beam emitted from the first laser 12 has a wavelength of 1064nm, and the second laser beam has a wavelength of 660 nm.
In an alternative embodiment, the second beam combiner 21 is a two-color beam combiner. The front side of the second beam combiner 21 facing the sensor 22 is provided with a front side coating. The front surface is coated to increase the reflectivity of the second laser. Optionally, the reflectivity of the front surface coating film to the second laser is greater than 90%, and the transmittance of the front surface coating film to the light beam with the wavelength of 400-1000nm is greater than 95%. The surface of the second beam combiner 21, which faces away from the sensor 22, is provided with a back antireflection coating. The back antireflection coating is used for increasing the transmittance of the light beam when the imaging distance measuring device 4 images. Optionally, the transmittance of the back antireflection coating film to the light beam with the wavelength of 400-.
In practical use, due to the problem of the material coating process, the current front coating can only reflect 660 ± 30nm wavelength band, and cannot singly reflect 660nm infrared light, so the optical filter 23 is arranged between the second beam combiner 21 and the sensor 22. Optionally, the filter 23 has a filter wavelength of 660 nm.
In a specific embodiment, the sensor 22 is an ATF4 AUTO FOCUS sensor, which can emit a semicircular light spot with a 660nm waveband, the semicircular light spot is reflected to a sapphire product through a reflector, the sapphire material has reflectivity, the sensor 22 collects 660nm infrared laser reflected by the surface of the product 3 at different height positions, and then the FOCUS and focal length information is calculated by an upper computer according to the energy value and the position of the collected infrared laser.
In one particular embodiment, the controller includes a Z-axis adjustment motor (not shown). The Z-axis adjusting motor is used for controlling the distance between the laser processing head 1 and the product 3 so as to adjust the Z-axis processing coordinate of the laser processing head 1. It is to be understood that the controller may also control the Z-axis machining coordinate of the laser machining head 1 by other control mechanisms known to those skilled in the art, and the manner in which the control is implemented is not limited thereto. For example, the controller may be a PLC (programmable logic controller) that drives the laser processing head 1 to move by a motor or drives the stage to move.
In another embodiment, as shown in fig. 3, the present invention provides a laser processing coaxial focus searching device, further comprising an imaging distance measuring device 4. The imaging range finder device 4 includes an imaging device. The imaging device is coaxially and confocally arranged on the processing light path and used for judging the focal length. Optionally, the imaging device is a CCD camera, and the CCD camera is used for manually determining the focal length and sending the focal length information to the controller. The CCD camera has the advantages of low cost and wide application. Through setting up two sets of mutually independent focus detection device of formation of image range unit 4 and laser focus finder 2, can make the focus detect more accurately. In addition, the laser focus detector 2 can be directly added on the existing laser processing device, so that the improvement and the upgrade of the existing laser processing device can be realized, and the laser processing device has the advantage of low cost.
The invention also provides a laser processing method, which comprises the following steps:
emitting a second laser light by the sensor 22 and measuring a focal length using the second laser light;
adjusting the Z-axis machining coordinate of the laser machining head 1 in real time according to the focal length information fed back by the laser focus detector 2 in real time;
the first laser light emitted by the first laser 12 is irradiated on the surface of the product through the processing optical path to process the product.
Optionally, before laser processing, firstly, manually judging the focal length by an imaging distance measuring device 4; and adjusting the Z-axis processing coordinate of the laser processing head according to the focal distance information judged by the imaging distance measuring device.
The specific process comprises the following steps: before laser processing, firstly, manually judging the focal length by an imaging distance measuring device 4; and adjusting the Z-axis processing coordinate of the laser processing head according to the focal distance information judged by the imaging distance measuring device. Then, during laser processing, the first laser 12 emits first laser, and the first laser is reflected by the first beam combiner 11 and then irradiates and focuses on the surface of the product 3 (such as sapphire, sapphire with a ground and thinned surface, and the like, and the surface precision error of the product is about +/-10 um) so as to process the product 3; the sensor 22 emits a second laser (or a light beam), the second laser is reflected by the second beam combiner 21, then is transmitted by the first beam combiner 11, and then is irradiated on the surface of the product 3, and then is reflected, the reflected second laser returns to the sensor 22 along the original path, and the sensor 22 collects the real-time processing focus at the calculated energy feedback value of the second laser reflected by the surface of the product 3, namely the focal length information; after the controller acquires the focal length information, the Z-axis machining coordinate of the laser machining head 1 is adjusted in real time, so that in the machining process, first laser is always focused on the surface of a product 3, the machining precision is improved, and the problem of the product fraction defective of a warping area caused by overhigh warping height of an incoming material product is solved.
According to the coaxial focus searching device and the laser processing method for laser processing, provided by the invention, after the laser focus detector 2 is used for real-time focus detection and focusing, the focus searching accuracy error of a product 3 can be reduced to be within +/-0.5 um, and coaxial real-time distance measurement processing is realized; the high-precision and quick real-time distance measurement and focus searching are realized, and the problem of defective rate of products in a warping area caused by overhigh warping height of incoming material products is solved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. A laser processing coaxial focus searching device is characterized by comprising:
the laser processing head is internally provided with a processing light path and is provided with a first beam combining mirror, the first beam combining mirror is positioned in the processing light path, and first laser emitted by the first laser is reflected after being emitted to the first beam combining mirror and is irradiated on the surface of a product through the processing light path;
the laser focus measuring device comprises a second beam combiner and a sensor, and the sensor is used for sending and receiving second laser; the second laser passes through the second beam combiner and the first beam combiner, is overlapped with the processing light path, irradiates the surface of the product and is reflected back to the sensor;
and the controller is used for receiving the focal length measured by the laser focus measuring device in real time and adjusting the Z-axis machining coordinate of the laser machining head according to the focal length information.
2. The laser processing coaxial focus searching device according to claim 1, wherein the second beam combining mirror is a two-color beam combining mirror, and a front surface coating is disposed on a surface of the second beam combining mirror facing the sensor, and the front surface coating is used for increasing the reflectivity of the second laser; and a back antireflection coating is arranged on one surface of the second beam combining mirror, which faces away from the sensor.
3. The laser processing coaxial focus searching device according to claim 1 or 2, wherein a filter is arranged between the second beam combiner and the sensor.
4. The laser processing coaxial focus searching device according to claim 3, wherein the wavelength of the second laser is 660 nm; the filtering wavelength of the optical filter is 660 nm.
5. The laser processing coaxial focus searching device according to claim 1 or 2, wherein the controller comprises a Z-axis adjusting motor, and the Z-axis adjusting motor is used for controlling the distance between the laser processing head and a product so as to realize adjustment of the Z-axis processing coordinate of the laser processing head.
6. The laser processing coaxial focus searching device according to claim 1 or 2, further comprising an imaging distance measuring device, wherein the imaging distance measuring device comprises an imaging device, and the imaging device is coaxially and confocally arranged on the processing optical path for determining a focal length.
7. The laser processing coaxial focus searching device according to claim 6, wherein the imaging device is a CCD camera, and the CCD camera is used for distinguishing a focal length and sending focal length information to the controller.
8. A laser processing method, characterized by comprising the steps of:
emitting second laser light through the sensor and measuring a focal length by using the second laser light;
adjusting the Z-axis machining coordinate of the laser machining head in real time according to the focal length information fed back by the laser focus detector in real time;
the first laser emitted by the first laser irradiates the surface of the product through the processing light path so as to process the product.
9. The laser processing method according to claim 8, further comprising the steps of:
judging a focal length through an imaging distance measuring device; and adjusting the Z-axis processing coordinate of the laser processing head according to the focal distance information judged by the imaging distance measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110552901.1A CN113305418A (en) | 2021-05-20 | 2021-05-20 | Coaxial focus searching device for laser processing and laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110552901.1A CN113305418A (en) | 2021-05-20 | 2021-05-20 | Coaxial focus searching device for laser processing and laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113305418A true CN113305418A (en) | 2021-08-27 |
Family
ID=77373840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110552901.1A Pending CN113305418A (en) | 2021-05-20 | 2021-05-20 | Coaxial focus searching device for laser processing and laser processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113305418A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945777A (en) * | 2023-02-07 | 2023-04-11 | 中国重汽集团济南动力有限公司 | Laser processing automatic focusing method and system based on coaxial visual detection |
| CN116765643A (en) * | 2023-07-10 | 2023-09-19 | 广州市凯枫智能科技有限公司 | Light beam adjustment and light signal processing method and device based on welding detection light path |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204621356U (en) * | 2015-04-02 | 2015-09-09 | 大族激光科技产业集团股份有限公司 | A kind of laser instrument seek burnt system |
| CN104972221A (en) * | 2014-04-03 | 2015-10-14 | 苏州天弘激光股份有限公司 | Laser machining equipment and laser machining focus looking-for method |
| CN105252144A (en) * | 2014-07-17 | 2016-01-20 | 大族激光科技产业集团股份有限公司 | High-precision laser follow-up cutting head and monitoring and automatic focus finding method thereof |
| CN106216831A (en) * | 2016-08-22 | 2016-12-14 | 大族激光科技产业集团股份有限公司 | Laser-processing system and laser focusing method |
| CN109465540A (en) * | 2018-12-28 | 2019-03-15 | 恩利克（浙江）智能装备有限公司 | The device and method of automatic real time calibration hot spot when laser processing |
| CN109799075A (en) * | 2019-02-22 | 2019-05-24 | 苏州迅镭激光科技有限公司 | The measuring device and measuring method of thermal lens focal variation in a kind of laser Machining head |
| CN111360396A (en) * | 2020-04-22 | 2020-07-03 | 长春德信光电技术有限公司 | Coaxial distance measuring laser processing head |
| CN211669428U (en) * | 2019-12-31 | 2020-10-13 | 武汉华工激光工程有限责任公司 | Automatic focusing device based on inner coaxial vision |
| CN112091414A (en) * | 2020-10-13 | 2020-12-18 | 温州大学 | Automatic focusing calibration device and method for special-shaped curved surface laser processing |
-
2021
- 2021-05-20 CN CN202110552901.1A patent/CN113305418A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104972221A (en) * | 2014-04-03 | 2015-10-14 | 苏州天弘激光股份有限公司 | Laser machining equipment and laser machining focus looking-for method |
| CN105252144A (en) * | 2014-07-17 | 2016-01-20 | 大族激光科技产业集团股份有限公司 | High-precision laser follow-up cutting head and monitoring and automatic focus finding method thereof |
| CN204621356U (en) * | 2015-04-02 | 2015-09-09 | 大族激光科技产业集团股份有限公司 | A kind of laser instrument seek burnt system |
| CN106216831A (en) * | 2016-08-22 | 2016-12-14 | 大族激光科技产业集团股份有限公司 | Laser-processing system and laser focusing method |
| CN109465540A (en) * | 2018-12-28 | 2019-03-15 | 恩利克（浙江）智能装备有限公司 | The device and method of automatic real time calibration hot spot when laser processing |
| CN109799075A (en) * | 2019-02-22 | 2019-05-24 | 苏州迅镭激光科技有限公司 | The measuring device and measuring method of thermal lens focal variation in a kind of laser Machining head |
| CN211669428U (en) * | 2019-12-31 | 2020-10-13 | 武汉华工激光工程有限责任公司 | Automatic focusing device based on inner coaxial vision |
| CN111360396A (en) * | 2020-04-22 | 2020-07-03 | 长春德信光电技术有限公司 | Coaxial distance measuring laser processing head |
| CN112091414A (en) * | 2020-10-13 | 2020-12-18 | 温州大学 | Automatic focusing calibration device and method for special-shaped curved surface laser processing |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945777A (en) * | 2023-02-07 | 2023-04-11 | 中国重汽集团济南动力有限公司 | Laser processing automatic focusing method and system based on coaxial visual detection |
| CN115945777B (en) * | 2023-02-07 | 2024-04-12 | 中国重汽集团济南动力有限公司 | Laser processing automatic focus searching method and system based on coaxial vision detection |
| CN116765643A (en) * | 2023-07-10 | 2023-09-19 | 广州市凯枫智能科技有限公司 | Light beam adjustment and light signal processing method and device based on welding detection light path |
| CN116765643B (en) * | 2023-07-10 | 2024-03-12 | 普希斯(广州)科技股份有限公司 | Light beam adjustment and light signal processing method and device based on welding detection light path |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20220152738A1 (en) | Device for the additive production of three-dimensional components | |
| US7499185B2 (en) | Measuring device for workpiece held on chuck table | |
| JP2720744B2 (en) | Laser processing machine | |
| US9685355B2 (en) | Laser dicing device and dicing method | |
| CN105643110B (en) | A kind of precise laser cutting system | |
| US8124909B2 (en) | Laser processing apparatus | |
| US9610729B2 (en) | Device and method for performing and monitoring a plastic laser transmission welding process | |
| CN106984813A (en) | A kind of melt-processed process coaxial monitoring method and device in selective laser | |
| CN107088706B (en) | Multipoint sensing laser scanning processing system | |
| CN110142503B (en) | Defocusing compensation system for laser cutting and compensation method thereof | |
| CN113305418A (en) | Coaxial focus searching device for laser processing and laser processing method | |
| US11007608B2 (en) | Laser machining device warning of anomaly in external optical system before laser machining | |
| WO2018000974A1 (en) | Laser processing method and device for removing thin film or coating | |
| CN101856773A (en) | Focusing positioning method based on initial laser processing position and laser processing device | |
| CN1136487A (en) | Laser working system | |
| CN112828448B (en) | Three-dimensional scanning imaging processing equipment and processing method based on vibrating mirror | |
| CN201693290U (en) | Laser processing device | |
| US20230330773A1 (en) | Laser processing device | |
| KR20170030100A (en) | Laser processing apparatus and laser processing method | |
| CN109799074A (en) | A kind of optical thin film laser damage threshold rapid measurement device | |
| Kratzsch et al. | Coaxial process control during laser beam welding of tailored blanks | |
| JP5420890B2 (en) | Device for measuring the height position of the workpiece held on the chuck table | |
| KR101279578B1 (en) | Auto focusing apparatus for laser processing and auto focusing method using the same | |
| CN212470240U (en) | Light beam pointing stability monitoring and feedback device | |
| JP6576061B2 (en) | Laser beam intensity distribution measuring apparatus and laser beam intensity distribution measuring method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210827 |