CN113171563A - Manufacturing process of ultrasonic transducer, ultrasonic transducer and nuclear magnetic imaging equipment - Google Patents
Manufacturing process of ultrasonic transducer, ultrasonic transducer and nuclear magnetic imaging equipment Download PDFInfo
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- CN113171563A CN113171563A CN202110285388.4A CN202110285388A CN113171563A CN 113171563 A CN113171563 A CN 113171563A CN 202110285388 A CN202110285388 A CN 202110285388A CN 113171563 A CN113171563 A CN 113171563A
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- focusing body
- element focusing
- ultrasonic transducer
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N7/00—Ultrasound therapy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
Abstract
The invention relates to a manufacturing process of an ultrasonic transducer, the ultrasonic transducer and nuclear magnetic imaging equipment. The manufacturing process of the ultrasonic transducer provided by the invention comprises the following steps: a plurality of pits are circumferentially arranged on the arc surface, and a plurality of array elements are arranged in the pits; adhering adjacent array elements together to form an array element focusing body, and separating the array element focusing body from the arc surface; forming electrodes on the concave and convex surfaces of the array element focusing body respectively; the array element focusing body is contained in the outer shell, and the center line of the array element focusing body coincides with the center line of the outer shell. The arrangement of the arc surface and the relative arc surfaces of the plurality of pits is utilized to improve the accuracy of array element distribution, and the stable-structure array element focusing body is formed between the adjacent array elements. In addition, the array elements are arranged on the complete arc surface by using the pits, so that when the size (such as radian and size) of the arc surface is changed, the focusing radius and the coverage area of the array element focusing body can be changed, and the manufacturing process of the multi-array element transducer is simplified.
Description
Technical Field
The invention relates to the technical field of ultrasonic medical treatment, in particular to a manufacturing process of an ultrasonic transducer, the ultrasonic transducer and nuclear magnetic imaging equipment.
Background
Ultrasound therapy is a non-invasive treatment (also known as non-invasive treatment) technique that treats tissue below a surface without surgical incision or excision to destroy the surface tissue (skin, mucosa, or epithelial tissue) and without puncture. The ultrasonic focusing treatment method with good tissue penetrability, positioning property and energy storage property is widely applied, and the principle of the ultrasonic focusing treatment method is mainly that ultrasonic waves are focused in tissues, and the tissues (such as brain tissues) are awakened or stimulated by utilizing the oscillation principle of the ultrasonic waves, so that the purpose of treatment is achieved. Because the energy of ultrasonic waves penetrating through a human body is very low, no harm is caused to the normal tissues of the human body in the area outside the focus, a brand new treatment mode is formed: treating diseases from inside to outside and keeping superficial tissues non-invasive.
The field of ultrasound medical focusing therapy generally requires the use of transducers, the function of which is to convert electrical input power into mechanical power (i.e., ultrasound) and then transmit it out for therapy. When the transducer is applied to head treatment, the existing multi-array element transducer for MRI/CT guided ultrasonic focusing treatment has the defects of low array element distribution precision and complex manufacturing process.
Disclosure of Invention
Therefore, it is necessary to provide a manufacturing process of an ultrasonic transducer, which aims at the technical problems of low array element distribution precision, complex manufacturing process and the like of the existing multi-array element transducer for MRI/CT guided ultrasonic focusing therapy.
A manufacturing process of an ultrasonic transducer comprises the following steps:
a plurality of pits are circumferentially arranged on the arc surface, and a plurality of array elements are arranged in the pits;
adhering adjacent array elements together to form an array element focusing body, and separating the array element focusing body from the arc surface;
forming electrodes on the concave and convex surfaces of the array element focusing body respectively;
the array element focusing body is contained in the outer shell, and the center line of the array element focusing body coincides with the center line of the outer shell.
In one embodiment, in the step of installing the array elements in the pits, the arc-surface bottom plate is heated, the adhesive softened by heating is coated on the pits and the arc surfaces, and then the array elements are installed in the pits, and the heating is stopped until the adhesive is cooled and solidified.
In one embodiment, in the step of adhering adjacent array elements together to form the array element focusing body, the curing agent is filled in the back gap on the side, away from the pit, of the adjacent array element.
In one embodiment, in the step of detaching the array element focusing body from the arc surface, the adhesive is enabled to lose viscosity by heating the bottom of the arc surface.
In one embodiment, in the step of forming the electrodes on the concave and convex surfaces of the array element focusing body, the conductors are plated on the concave surface of the array element focusing body and the convex surface of the array element focusing body.
In one embodiment, before the step of plating the concave surface of the array element focusing body with the electric conductor, the method further comprises the following steps:
mounting the array element focusing body on a concave retainer;
and curing agents are filled between gaps on one side of the adjacent array elements, which is far away from the concave retainer.
In one embodiment, in the step of mounting the array element focusing body on the concave holder, the bottom of the concave holder is heated, the adhesive softened by heating is coated on the surface of the concave holder, and after the array element focusing body is mounted on the concave holder, the heating is stopped until the adhesive is cooled and solidified.
In one embodiment, before the convex surface of the array element focusing body is plated with the electric conductor, the method further comprises the following steps:
separating the array element focusing body from the concave retainer;
turning over the array element focusing body to enable the convex surface of the array element focusing body to face upwards;
and mounting the array element focusing body on a convex retainer.
In one embodiment, in the step of detaching the array element focusing body from the concave holding frame, the adhesive is eliminated by heating the bottom of the concave holding frame.
In one embodiment, in the step of mounting the array element focusing body on the convex holder, the bottom of the convex holder is heated, the adhesive softened by heating is coated on the surface of the convex holder, and after the array element focusing body is mounted on the convex holder, the heating is stopped until the adhesive is cooled and solidified.
In one embodiment, in the step of mounting the outer casing on the side of the convex holder facing the array element focusing body, the bottom of the convex holder is heated, the adhesive softened by heating is coated on the side of the convex holder facing the array element focusing body, and after the outer casing is mounted on the side of the convex holder facing the array element focusing body, the heating is stopped until the adhesive is cooled and solidified.
In one embodiment, after the step of accommodating the array element focusing body in the outer shell, the method further comprises:
welding a control line on the back of the array element;
forming a backing by adhering a curing agent on the convex surface of the array element focusing body, so that the backing adheres to the outer shell and the control line;
heating the bottom of the convex retainer to eliminate the viscosity of the adhesive, and taking down the convex retainer;
and bonding the matching layer to the concave surface of the array element focusing body.
The present invention provides an ultrasonic transducer that can solve at least one of the above-mentioned technical problems.
An ultrasonic transducer is manufactured according to the manufacturing process of the ultrasonic transducer.
The present invention provides a nuclear magnetic imaging apparatus capable of solving at least one of the above-mentioned technical problems.
The nuclear magnetic imaging equipment comprises the ultrasonic transducer and at least three developing balls, wherein the developing balls are arranged on the ultrasonic transducer, and the circle center of a circle formed by the sphere centers of the at least three developing balls coincides with the center of the array element focusing body.
The invention has the beneficial effects that:
the manufacturing process of the ultrasonic transducer provided by the invention comprises the following steps: a plurality of pits are circumferentially arranged on the arc surface, and a plurality of array elements are arranged in the pits; adhering adjacent array elements together to form an array element focusing body, and separating the array element focusing body from the arc surface; forming electrodes on the concave and convex surfaces of the array element focusing body respectively; the array element focusing body is contained in the outer shell, and the center line of the array element focusing body coincides with the center line of the outer shell. Compare in prior art, this ultrasonic transducer's manufacture craft is through setting up a plurality of pits on a complete arc surface, and a plurality of pits arrange along the circumference of arc surface, thereby only need carry out the circumference of pit as the benchmark with the size of arc surface self and the size of pit and arrange, thereby utilize a plurality of pits to bear a plurality of array elements and realize the fixed connection between a plurality of array elements, make a plurality of array elements form overall structure, be convenient for the formation of follow-up electrode and the installation of the relative ultrasonic transducer casing of array element. In the whole manufacturing process, the arrangement of the arc surface and the plurality of pits relative to the arc surface is utilized to improve the accuracy of array element distribution, and any adjacent array elements are convenient to fix to form the array element focusing body with a stable structure. In addition, the array elements are arranged on the complete arc surface by using the pits, so that when the size (such as radian and size) of the arc surface is changed, the focusing radius and the coverage area of the array element focusing body can be changed, and the manufacturing process of the multi-array element transducer is simplified.
The invention provides an ultrasonic transducer, which is manufactured by the manufacturing process of the ultrasonic transducer and can solve at least one technical problem.
The utility model provides a nuclear magnetic imaging device, including above-mentioned ultrasonic transducer, still include two at least developing balls, the developing ball is installed in ultrasonic transducer, and the center of two at least developing balls can be fitted into a circle, and the centre of a circle and the center coincidence of array element focus body of circle, developing ball are used for confirming ultrasonic transducer's position. At least one technical problem described above can be solved.
Drawings
Fig. 1 is a schematic diagram of a mold in a process for manufacturing an ultrasonic transducer according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a mold in a process for manufacturing an ultrasonic transducer according to an embodiment of the present invention;
fig. 3 is a top view and a side view of an array element in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 4 is a schematic layout diagram of pits in a manufacturing process of an ultrasonic transducer provided by an embodiment of the invention;
fig. 5 is a partial cross-sectional view of an array element mounted in a pit in a process for manufacturing an ultrasonic transducer according to an embodiment of the present invention;
fig. 6 is a schematic diagram of filling a curing agent in a gap between the array elements and the array elements adjacent to the convex surface of the array element focusing body in the manufacturing process of the ultrasonic transducer according to the embodiment of the present invention;
fig. 7 is a schematic diagram of an array element focusing body being detached from a mold in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 8 is a schematic diagram of an array element focusing body mounted on a concave protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 9 is a cross-sectional view of an array element focusing body mounted on a concave protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 10 is a schematic view illustrating that curing agents are filled in gaps between the front surfaces of array elements adjacent to the concave surface of the array element focusing body in the manufacturing process of the ultrasonic transducer according to the embodiment of the present invention;
fig. 11 is a cross-sectional view of an array element focusing body being separated from a concave protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 12 is a schematic diagram of an array element focusing body mounted on a convex protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 13 is a front view of an array element focusing body mounted on a convex protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 14 is a schematic view illustrating an outer case mounted on a convex protection frame in a process of manufacturing an ultrasonic transducer according to an embodiment of the present invention;
FIG. 15 is a schematic diagram of an ultrasound transducer in a process for fabricating an ultrasound transducer according to an embodiment of the present invention;
fig. 16 is a front view of an ultrasonic transducer in a process of manufacturing the ultrasonic transducer according to the embodiment of the present invention;
fig. 17 is a top view of an ultrasonic transducer in a process for manufacturing an ultrasonic transducer according to an embodiment of the present invention;
fig. 18 is a partial cross-sectional view of an ultrasonic transducer in a process of manufacturing the ultrasonic transducer according to an embodiment of the present invention;
fig. 19 is a schematic array element arrangement diagram in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention;
fig. 20 is a flowchart of a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention.
Reference numerals: 100-array elements; 110-array element focusing body; 120-array element focusing body convex surface; 130-array element focusing body concave surface; 140-back gap; 150-front gap; 200-a mold; 210-arc surface; 220-pits; 230-a platform; 300-a concave cage; 310-concave arc surface; 320-a first support table; 400-convex cage; 410-convex arc surface; 420-a second support table; 500-an outer shell; 510-a first housing; 511-first tick mark; 520-a second housing; 521-a second tick mark; 522-a mounting plate; 610-control line; 620-backing; 630-matching layer; 640-developing ball; 650-locking the wire buckle; 660-waterproof fixed head; 670-array element arrangement layout; 680-curing agent; 690-fixing element.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, 4, 6 and 14, fig. 1 is a schematic diagram of a mold in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention; fig. 4 is a schematic layout diagram of pits in a manufacturing process of an ultrasonic transducer provided by an embodiment of the invention; fig. 6 is a schematic diagram of filling a curing agent in a gap between the array elements and the array elements adjacent to the convex surface of the array element focusing body in the manufacturing process of the ultrasonic transducer according to the embodiment of the present invention; fig. 14 is a schematic diagram of an ultrasonic transducer provided in an embodiment of the present invention, in which an outer housing is mounted on a convex protection frame in a manufacturing process. An embodiment of the present invention provides a process for manufacturing an ultrasonic transducer, including the following steps: a plurality of pits 220 are circumferentially arranged on the arc surface 210, and a plurality of array elements 100 are mounted in the pits 220; after the adjacent array elements 100 are adhered together to form the array element focusing body 110, the array element focusing body 110 is separated from the arc surface 210; forming electrodes on the concave and convex surfaces of the array element focusing body 110 respectively; the array element focusing body 110 is accommodated in the outer casing 500, and the center line of the array element focusing body 110 coincides with the center line of the outer casing 500.
The design drawing of the ultrasonic transducer is drawn according to the shape to be processed, then each array element 100 is arranged according to the design drawing by using plastic or metal, a pit 220 is processed on the arc surface 210 according to the design drawing, preferably, the pit arrangement drawing is shown in figure 4, the pit arrangement drawing takes 1 as a central point and is arranged in a circumferential mode in a surrounding mode, the array elements on each circle are abutted as far as possible, and the arrangement enables the energy emitted from all directions of the ultrasonic transducer to be consistent, so that the quality of the ultrasonic transducer is improved.
Specifically, arc surface 210 is installed on mould 200, and mould 200 still includes platform 230, and platform 230 sets up in the below of arc surface 210, and platform 230's size is greater than arc surface 210 to the manufacturing process in later stage is convenient for. Preferably, the platform 230 is rectangular.
It should be noted that the size of the arc surface 210 is not fixed, and the radian and size of the arc surface 210 may be adjusted according to the radius of the required ultrasound transducer or the coverage area of the array element 100, so as to manufacture the required ultrasound transducer. Preferably, the array element 100 is designed to be circular, so as to facilitate the arrangement of the pits 220 on the circular arc surface 210.
In the whole manufacturing process, the array element distribution accuracy is improved by utilizing the arrangement of the arc surface and the plurality of pits relative to the arc surface, and any adjacent array elements are conveniently fixed to form the array element focusing body with a stable structure. In addition, the array elements are arranged on the complete arc surface by using the pits, so that when the size (such as radian and size) of the arc surface is changed, the focusing radius and the coverage area of the array element focusing body can be changed, and the manufacturing process of the multi-array element transducer is simplified.
Referring to fig. 1, 2, 3 and 4, fig. 2 is a cross-sectional view of a mold in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention; fig. 3 is a top view and a side view of an array element in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention. In one embodiment, in the step of mounting the array elements 100 in the concave pit 220, the bottom plate of the arc surface 210 is heated, the adhesive softened by heating is coated on the concave pit and the arc surface, and after the array elements are mounted in the concave pit, the heating is stopped until the adhesive is cooled and solidified.
Specifically, with the pit 220 of arc surface 210 inside and outside and the even adhesive that paints of whole arcwall face for cylindrical array element 100 installs in pit 220 back, and array element 100 deviates from the surface of pit 220 one side and can form level and smooth arc, thereby the ultrasonic transducer that the post manufacture of being convenient for formed can accurately focus.
Further, the adhesive can soften and lose viscidity when meeting heat, and when the bottom low temperature heating to platform 230, the adhesive that paints in arcwall face and the pit 220 is the softened state, does not have viscidity, then evenly is covered with cylindrical array element 100 according to the pit 220 of arcwall face, all places array element 100 in the pit 220 on the mould 200 after, stops mould 200 and heats, waits for after the adhesive solidification, the adhesive has viscidity again to with stable being fixed in the pit 220 of array element 100. Preferably, the binder is paraffin wax.
Referring to fig. 5 and 6, fig. 5 is a partial cross-sectional view illustrating that array elements are mounted in a pit in the manufacturing process of the ultrasonic transducer according to the embodiment of the present invention. In one embodiment, in the step of adhering the adjacent array elements 100 together to form the array element focusing body 110, the curing agent 680 is filled in the gap on the side of the adjacent array element 100 away from the concave pit 220.
Specifically, after the paraffin applied to the arc surface 210 and the pit 220 of the mold 200 is cured, the curing agent 680 is filled in a gap on one side of the adjacent array element 100 away from the pit 220, so that the array elements 100 on the arc surface 210 can be adhered together to form the array element focusing body 110. This procedure requires attention: in the process of filling the gaps, the curing agent 680 is aligned with the cambered surface of the array element 100 as much as possible so as to ensure the roundness of the cambered surface at the back in the later period. For convenience of description, the gap on the side of the adjacent array element 100 away from the pit 220 is defined as the back gap 140, and the gap on the side of the adjacent array element 100 close to the pit 220 is defined as the front gap 150.
Referring to fig. 7, fig. 7 is a schematic diagram illustrating that the array element focusing body is detached from the mold in the manufacturing process of the ultrasonic transducer according to the embodiment of the present invention. In one embodiment, in the step of detaching the array element focusing body 110 from the arc surface 210, the adhesive is made to lose its viscosity by applying heat to the bottom of the arc surface 210.
Specifically, after the bottom of the mold 200 is heated to melt the adhesive, the platform 230 is held by hand, and the mold 200 is inverted, and the array element focusing body 110 is separated from the mold 200 due to gravity. It should be noted that, because the curing agent 680 is only filled in the back gap 140 of the adjacent array element 100, and because the wall of the pit 220 blocks, the curing agent 680 is not filled in the front gap 150 of the adjacent array element 100, the adhesion between the adjacent array elements 100 is unstable, and because the wall of the pit 220 rubs against the array element 100, force needs to be applied to the array element focusing body 110 to separate the array element focusing body 110 from the mold 200. Therefore, the mold 200 is inverted, the array element focusing body 110 is separated from the mold 200 by the gravity of the array element 100, and the phenomenon that the radian of all the array elements 100 arranged in a radian is changed due to the fact that a certain part of the array element focusing body 110 is applied with force is avoided, so that the focusing of the transducer is influenced. And the whole process needs to be handled lightly.
Referring to fig. 8, 9, 10, 11, 12 and 13, fig. 8 is a schematic diagram illustrating an array element focusing body mounted on a concave protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention; fig. 9 is a cross-sectional view of an array element focusing body mounted on a concave protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention; fig. 10 is a schematic view illustrating that curing agents are filled in gaps between the front surfaces of array elements adjacent to the concave surface of the array element focusing body in the manufacturing process of the ultrasonic transducer according to the embodiment of the present invention; fig. 11 is a cross-sectional view of an array element focusing body being separated from a concave protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention; fig. 12 is a schematic diagram of an array element focusing body mounted on a convex protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention; fig. 13 is a front view of an array element focusing body mounted on a convex protection frame in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention. In one embodiment, in the step of forming the electrodes on the concave and convex surfaces of the array focusing body 110, the conductor is plated on the concave surface 130 and the convex surface 120 of the array focusing body.
Specifically, the entire surfaces of the array element focusing body concave surface 130 and the array element focusing body convex surface 120 are plated with an electric conductor, preferably, the electric conductor is gold because the electric conductivity of gold is good, wherein, the gold is plated by means of magnetron sputtering.
Referring to fig. 8, 9 and 10, in one embodiment, before the step of plating the concave surface 130 of the array element focusing body with the conductive body, the method further includes: mounting the array element focusing body 110 on the concave retainer 300; and curing agents 680 are filled between gaps on the sides of the adjacent array elements 100 far away from the concave surface retainer (300).
Specifically, the concave holder 300 comprises a concave arc surface 310 and a first support table 320, the first support table 320 is arranged below the concave arc surface 310, the concave arc surface 310 is matched with the array element focusing body convex surface 120, when the array element focusing body 110 is arranged on the concave holder, the curing agent 680 is filled between the front gaps 150 of the adjacent array elements 100, and the concave holder can support the array element focusing body 110 and does not influence the arc shape of the array element focusing body 110.
Further, the curing agent 680 is filled between the gaps 150 on the front surfaces of the adjacent array elements 100, so that the real surfaces and the back surfaces of the adjacent array elements 100 can be stably connected, and the phenomenon that the array elements 100 move in the subsequent process is avoided, so that the radian of the array element focusing body 110 is changed.
Referring to fig. 8 and 9, in one embodiment, in the step of mounting the array element focusing body 110 on the concave holder 300, the bottom of the concave holder 300 is heated, the adhesive softened by heating is applied to the surface of the concave holder 300, and after the array element focusing body 110 is mounted on the concave holder 300, the heating is stopped until the adhesive is cooled and solidified.
Specifically, paraffin is smeared on the concave arc surface 310 during heating, so that the paraffin is melted, after the array element focusing body 110 is placed on the concave arc surface 310, the first supporting table 320 is stopped from being heated, so that the paraffin is solidified, and the array element focusing body 110 is positioned on the concave arc surface 310.
Referring to fig. 11, 12 and 13, in one embodiment, before the array element focusing body convex surface 120 is plated with the electric conductor, the method further includes: separating the array element focusing body 110 from the concave surface retainer 300; turning the array element focusing body 110 to enable the convex surface 130 of the array element focusing body to face upwards; the array element focusing body 110 is mounted to the convex holder 400.
Specifically, after the array element focusing body 110 is separated from the concave holder 300, the array element focusing body 110 is turned over, so that the array element focusing body convex surface 130 faces upwards, then the array element focusing body concave surface 130 is abutted against the convex holder 400 and is installed on the convex holder 400, so that the array element focusing body convex surface 120 can face upwards, and therefore gold plating of the array element focusing body convex surface 120 is facilitated.
Referring to fig. 11, in one embodiment, in the step of detaching the array element focusing body 110 from the concave holder 300, the adhesive is removed by applying heat to the bottom of the concave holder 300.
Specifically, the bottom of the first supporting table 320 is heated, so that the paraffin on the concave arc surface 310 is melted, thereby facilitating the array element focusing body 110 to separate from the concave holding frame 300. Because the front and back gaps 140 of the adjacent array elements 100 are filled with the curing agent 680, the adhesion between the adjacent array elements 100 is reliable, and the array elements 100 are in contact with the concave cambered surface 310, no friction force is caused to the array elements 100, so that the concave retainer 300 does not need to be inverted, and the array element focusing body 110 can be easily taken down.
Referring to fig. 12 and 13, in one embodiment, in the step of mounting the array element focusing body 110 on the convex holder 400, the bottom of the convex holder 400 is heated, the heat-softened adhesive is applied to the side of the convex holder 400 facing the array element focusing body 110, and after the outer casing 500 is mounted on the side of the convex holder 400 facing the array element focusing body 110, the heating is stopped until the adhesive is cooled and solidified.
Specifically, the convex retainer 400 includes convex cambered surface 410 and a second support platform 420, the second support platform 420 is disposed below the convex cambered surface 410, the convex cambered surface 410 is adapted to the concave surface 130 of the array element focusing body, when the array element focusing body 110 is disposed on the convex retainer 400, the curing agent 680 is filled between the front gaps 150 of the adjacent array elements 100, and the convex retainer 400 can support the array element focusing body 110 and does not influence the arc shape of the array element focusing body 110.
Further, the paraffin is smeared on the convex arc surface 410 in heating, so that the paraffin is melted, after the array element focusing body 110 is placed on the convex arc surface 410, the heating of the second support frame is stopped, so that the paraffin is solidified, and the array element focusing body 110 is positioned on the convex arc surface 410.
Referring to fig. 14, in one embodiment, in the step of accommodating the array element focusing body 110 in the outer casing 500, the outer casing 500 is mounted on the convex holder 400 on the side facing the array element focusing body 110.
Specifically, the outer casing 500 is mounted on a side of the second support platform 420 facing the array focusing body 110, such that the array focusing body 110 is accommodated in the outer casing 500, and the center line of the array focusing body 110 coincides with the center line of the outer casing 500.
With continued reference to fig. 14, in one embodiment, during the step of mounting the outer casing 500 on the side of the convex retainer 400 facing the array element focusing body 110, heat is applied to the bottom of the convex retainer 400 and an adhesive is applied to the outer edge of the convex retainer 400.
Specifically, the paraffin is smeared on the outer edge of one side of the second supporting table 420 facing the array element focusing body 110 during heating, so that the paraffin is melted, then the outer shell 500 is installed on one side of the second supporting table 420 facing the array element focusing body 110, and then the position is adjusted, so that after the center lines of the array element focusing body 110 and the outer shell 500 are overlapped, the heating is stopped, and the paraffin is solidified, so that the outer shell 500 is installed on the second supporting table 420.
Referring to fig. 15 and 18, fig. 15 is a schematic diagram of an ultrasonic transducer in a manufacturing process of the ultrasonic transducer according to an embodiment of the present invention; fig. 18 is a partial cross-sectional view of an ultrasonic transducer in a process for manufacturing the ultrasonic transducer according to an embodiment of the present invention. In one embodiment, after the step of accommodating the array element focusing body 110 in the outer shell 500, the method further includes: welding control lines 610 to the back of the array element 100; forming a backing 620 by bonding the curing agent 680 on the array element focusing body convex surface 120, so that the backing 620 bonds the outer shell 500 and the control wire 610; heating the bottom of the convex retainer 400 to make the adhesive disappear, and taking down the convex retainer 400; the matching layer 630 is bonded to the array element focal body concave surface 130.
Specifically, the mold 200 is formed such that the array elements 100 are arranged with the welding control lines 610 such that each array element has an independent control line 610, and thus can be independently controlled. Wherein, form backing 620 at array element focus body convex surface 120 bonding through curing agent 680 for backing 620 bonding shell body 500 and control line 610, thereby can play the guard action to array element focus body 110, avoid array element 100 in the in-process that switches on, shake about taking place, lead to separation between the adjacent array element 100, thereby lead to the distribution precision of array element 100 to reduce. Meanwhile, the backing 620 can also play a role in protecting the control line 610, and can prevent the control line 610 from being separated from the array element 100 under the action of external force, thereby causing poor contact.
Further, since the array element focusing body 110 is also in contact with the convex arc surface 410, and the convex arc surface 410 does not cause resistance to the array element focusing body 110, the situation that the array element focusing body 110 is separated from the convex holder 400 is similar to the situation that the array element focusing body is separated from the concave holder 300, and therefore, the description is omitted.
In addition, the matching layer 630 is made of a shielding material, and is used for shielding the gold plating on the concave arc surface 310 of the array element 100 and preventing the gold plating from generating an interaction force with a magnetic field, so that any influence on later imaging during MRI/CT guided imaging is caused, and misjudgment is caused.
It should be noted that, because of the high magnetic field forces during MRI/CT imaging guidance, the device is designed with consideration given to the choice of materials that do not interact with the magnetic field.
Referring to fig. 16, 17 and 19, fig. 16 is a front view of an ultrasonic transducer in a manufacturing process of the ultrasonic transducer according to an embodiment of the present invention; fig. 17 is a top view of an ultrasonic transducer in a process for manufacturing an ultrasonic transducer according to an embodiment of the present invention; fig. 19 is a schematic layout diagram of array elements in a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention. In one embodiment, the process for manufacturing the ultrasonic transducer further comprises: dividing the array elements 100 on the surface of the array element focusing body 110 and forming an array element arrangement diagram 670; calculating the focusing condition of the array element 100 based on the array element arrangement diagram 670; and simulating to obtain simulation data based on the focusing condition of the array elements. Specifically, the above process can be directly divided, calculated and simulated by software, and the simulation can be applied to actual medical treatment operation after the simulation is completed.
Referring to fig. 15, fig. 16, fig. 17, fig. 18 and fig. 19, in one embodiment, after the step of calculating the focusing condition of the array element 100 by the array element layout 670, the method further includes outputting the data of the array element layout 670 and the focusing data of the array element 100. Furthermore, a plurality of groups of important software simulation basic parameters such as the deflection angle of the focusing point of the array element 100 and the effective square area data of each array element 100 can be output, so that data support can be provided for the accuracy of the data simulated by the whole ultrasonic transducer array element 100.
Referring to fig. 16 and 18, the ultrasonic transducer provided by the present invention is manufactured according to the manufacturing process of the ultrasonic transducer described above. The distribution position of the array element 100 in the ultrasonic transducer is accurate, the focusing radius of the array element focusing body 110 is large, the coverage area is large, the manufacturing process is simple, and the practicability is high.
Specifically, the ultrasound transducer further includes a wire-locking buckle 650, the wire-locking buckle 650 being used to bring the control wires 610 together. The number of the wire locking buckles 650 may be one or more, as long as the control wires 610 can be gathered together.
Further, the outer case 500 is divided into a first case 510 and a second case 520, the second case 520 is disposed above the first case 510, and the first case 510 is connected to the array focusing body 110. The first scale mark 511 and the second scale mark 521 are arranged on the outer sides of the first shell 510 and the second shell 520 along the vertical direction, and when the second shell 520 is mounted on the first shell 510, the second scale mark 521 of the second shell 520 is overlapped with the first scale mark 511 of the first shell 510, so that the position needing to be adjusted can be clearly identified when the focal length is adjusted.
Furthermore, the ultrasonic transducer further comprises a waterproof fixing head 660 and a fixing piece 690, wherein the second housing 520 further comprises a mounting plate 522, an opening is formed in the mounting plate 522, the waterproof fixing head 660 is mounted on the opening of the mounting plate 522, the gathered control wire 610 penetrates through the waterproof fixing head 660 by the locking buckle 650 so as to be connected with an external control member, and the fixing piece 690 is used for locking the locking buckle 650 at the upper end of the waterproof fixing head 660 so as to prevent water or other liquid from flowing back into the interior of the transducer. Preferably, the retainer 690 is a nut.
Referring to fig. 16, 17 and 18, in one embodiment, the present invention provides a nuclear magnetic imaging apparatus, which includes the above-mentioned ultrasonic transducer, and further includes at least three developing balls 640, the developing balls 640 are mounted on the ultrasonic transducer, and the center of a circle formed by the centers of the at least three developing balls 640 coincides with the central axis of the array focusing body 110.
Specifically, the mounting plate 522 is provided with a mounting groove matched with the developing balls 640, and after the developing balls 640 are mounted in the mounting groove, the central points of the plurality of developing balls 640 are on the same plane. Preferably, the plane fitted by the spherical centers of the plurality of developing balls 640 coincides with the plane on the side where the mounting groove of the mounting plate 522 is provided, so that the distance between the spherical center of the circle fitted by the spherical centers of the developing balls 640 and the focal point of the array element 100 can be conveniently determined, and the distance can be used for determining the position of the ultrasonic transducer through the developing balls 640. The ultrasonic transducer in the nuclear magnetic imaging device is combined with the developing ball 640, and all materials are plastic materials (except for the transducer elements), so that the whole ultrasonic transducer can be completely fused with the MRI device, and the focus point of the transducer can be calculated immediately as long as the transducer is moved.
Referring to fig. 20, fig. 20 is a flowchart of a manufacturing process of an ultrasonic transducer according to an embodiment of the present invention. The whole manufacturing process comprises the following steps:
arranging a pit 220 on the arc surface 210 along the circumferential direction according to a design drawing, heating the bottom plate of the arc surface 210, coating the adhesive softened by heating on the pit 220 and the arc surface 210, mounting the array elements 100 in the pit 220, and stopping heating until the adhesive is cooled and solidified, so that the array elements 100 are fixed in the pit 220; filling a curing agent 680 in the back gap 140 of the adjacent array element 100, so that after the adjacent array elements 100 are bonded together to form the array element focusing body 110, heating the bottom of the arc surface 210 to enable the adhesive to be softened and have no viscosity, and separating the array element focusing body 110 from the arc surface 210; heating the bottom of the concave retainer 300, smearing the adhesive softened by heating on the surface of the concave retainer 300, then installing the array element focusing body 110 on the concave retainer 300, stopping heating, and cooling and solidifying the adhesive, so that the array element focusing body 110 is fixed on the concave retainer 300; filling a curing agent 680 between the gaps 150 on the front surfaces of the adjacent array elements 100, plating gold on the concave surfaces 130 of the array element focusing bodies, and heating the bottoms of the concave surface retainers 300 to ensure that the viscosity of the adhesive disappears, so that the array element focusing bodies 110 are separated from the concave surface retainers 300; heating the bottom of the convex holder 400, smearing the adhesive which is softened by heating on the surface of the convex holder 400, then installing the array element focusing body 110 on the convex holder 400, stopping heating until the adhesive is cooled and solidified, so that the array element focusing body 110 is fixed on the convex holder 400, and plating gold on the convex surface 130 of the array element focusing body to respectively form electrodes on the concave and convex surfaces of the array element focusing body 110; heating the bottom of the convex retainer 400, applying the adhesive softened by heating to the side of the convex retainer 400 facing the array element focusing body 110, installing the outer shell 500 on the side of the convex retainer 400 facing the array element focusing body 110, stopping heating, cooling and solidifying the adhesive, accommodating the focusing body 110 in the outer shell 500, and coinciding the central lines of the array element focusing body 110 and the outer shell 500. Welding control lines 610 to the back of the array element 100; forming a backing 620 by bonding the curing agent 680 on the array element focusing body convex surface 120, so that the backing 620 is bonded with the outer shell 500 and the control wire 610; heating the bottom of the convex retainer 400 to make the adhesive soften and lose viscosity, and taking down the convex retainer 400; the matching layer 630 is bonded to the array element focal volume concave surface 130 to form an ultrasonic transducer.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (14)
1. The manufacturing process of the ultrasonic transducer is characterized by comprising the following steps of:
a plurality of pits (220) are circumferentially arranged on the arc surface (210), and a plurality of array elements (100) are arranged in the pits (220);
after the adjacent array elements (100) are stuck together to form the array element focusing body (110), the array element focusing body (110) is separated from the arc surface (210);
forming electrodes on the concave-convex two surfaces of the array element focusing body (110) respectively;
the array element focusing body (110) is accommodated in the outer shell (500), and the center lines of the array element focusing body (110) and the outer shell (500) are superposed.
2. The manufacturing process of the ultrasonic transducer according to claim 1, wherein in the step of mounting the plurality of array elements (100) in the concave pit (220), the bottom plate of the arc surface (210) is heated, the adhesive softened by heating is coated on the concave pit (220) and the arc surface (210), and after the plurality of array elements (100) are mounted in the concave pit (220), the heating is stopped to allow the adhesive to cool and solidify.
3. The manufacturing process of the ultrasonic transducer according to claim 1, wherein in the step of adhering the adjacent array elements (100) together to form the array element focusing body (110), a curing agent (680) is filled in a gap on a side of the adjacent array element (100) far away from the pit (220).
4. The manufacturing process of the ultrasonic transducer according to claim 1, wherein in the step of detaching the array element focusing body (110) from the arc surface (210), the adhesive is made to lose its viscosity by heating the bottom of the arc surface (210).
5. The process for manufacturing an ultrasonic transducer according to claim 1, wherein in the step of forming electrodes on both concave and convex surfaces of the array element focusing body (110), the concave surface (130) of the array element focusing body and the convex surface (120) of the array element focusing body are plated with the electric conductors.
6. The process for manufacturing an ultrasonic transducer according to claim 5, wherein before the step of plating the concave surface (130) of the array element focusing body with the electric conductor, the process further comprises:
mounting the array element focusing body (110) on a concave retainer (300);
and curing agents (680) are filled between gaps on the sides of the adjacent array elements (100) far away from the concave surface retainer (300).
7. The manufacturing process of the ultrasonic transducer according to claim 6, wherein in the step of mounting the array element focusing body (110) on the concave holder (300), the bottom of the concave holder (300) is heated, the adhesive softened by heating is coated on the surface of the concave holder (300), and after the array element focusing body (110) is mounted on the concave holder (300), the heating is stopped until the adhesive is cooled and solidified.
8. The process of claim 5, wherein before plating the conductor on the array element focusing body convex surface (130), further comprising:
separating the array element focusing body (110) from the concave retainer (300);
turning the array element focusing body (110) to enable the convex surface (130) of the array element focusing body to face upwards;
the array element focusing body (110) is mounted on a convex retainer (400).
9. The process for manufacturing an ultrasonic transducer according to claim 8, wherein in the step of detaching the array element focusing body (110) from the concave holding frame (300), the adhesive is made to lose its viscosity by heating the bottom of the concave holding frame (300).
10. The manufacturing process of the ultrasonic transducer according to claim 8, wherein in the step of mounting the array element focusing body (110) on the convex holder (400), the bottom of the convex holder (400) is heated, the adhesive softened by heating is coated on the surface of the convex holder (400), and after the array element focusing body (110) is mounted on the convex holder (400), the heating is stopped until the adhesive is cooled and solidified.
11. The manufacturing process of the ultrasonic transducer according to claim 1, wherein in the step of accommodating the array element focusing body (110) in the outer casing (500), the bottom of the convex holder (400) is heated, the adhesive softened by heating is coated on the side of the convex holder (400) facing the array element focusing body (110), and after the outer casing (500) is installed on the side of the convex holder (400) facing the array element focusing body (110), the heating is stopped until the adhesive is cooled and solidified.
12. The process for manufacturing an ultrasonic transducer according to claim 1, wherein after the step of accommodating the array element focusing body (110) in the outer shell (500), the process further comprises:
welding a control line (610) to the back of the array element (100);
forming a backing (620) by adhering a curing agent (680) on the array element focusing body convex surface (120), so that the backing (620) adheres the outer shell (500) and the control line (610);
heating the bottom of the convex retainer (400) to eliminate the viscosity of the adhesive, and removing the convex retainer (400);
and bonding a matching layer (630) to the concave surface (130) of the array element focusing body.
13. An ultrasonic transducer, characterized in that it is manufactured according to the manufacturing process of the ultrasonic transducer according to any one of claims 1-12.
14. A nuclear magnetic imaging apparatus, comprising the ultrasound transducer of claim 13, and further comprising at least three developing balls (640), wherein the developing balls (640) are mounted on the ultrasound transducer, and the center of a circle formed by the centers of the at least three developing balls (640) coincides with the central axis of the array focusing body (110).
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