CN113163670A - Heat dissipation device, manufacturing method of heat dissipation device and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a heat dissipation device, a manufacturing method of the heat dissipation device and electronic equipment, wherein the heat dissipation device comprises a first substrate and a second substrate arranged opposite to the first substrate, and a gap is formed between the first substrate and the second substrate; a hollow accommodating part arranged at the interval; a heat exchange medium disposed in the hollow accommodating part; the first substrate comprises a first base body and a first micro-structure layer which are arranged in a stacked mode, and a first capillary channel is formed in the first micro-structure layer and communicated with the hollow accommodating portion; the second substrate comprises a second base body and a second microstructure layer which are arranged in a stacked mode, and a second capillary channel is formed in the second microstructure layer and communicated with the hollow accommodating portion; the heat exchange medium flows along the first capillary passage, the second capillary passage and the hollow accommodating part. The embodiment of the application utilizes the microstructure layer to control the structure and the size of the capillary channel, increases the fluidity of the heat exchange medium in the hollow accommodating part, accelerates the heat circulation rate and improves the heat dissipation efficiency of the heat dissipation device.

Description

Heat dissipation device, manufacturing method of heat dissipation device and electronic equipment

Technical Field

The present invention relates to the field of heat conduction technologies, and in particular, to a heat dissipation device, a method for manufacturing the heat dissipation device, and an electronic apparatus.

Background

With the rapid development of electrical technology and information technology, electronic devices have increasingly powerful functions, and their application fields are also spread throughout various industries. The operation of the electronic device inevitably generates heat, and the stability of the electronic device is affected by the over-high temperature, so that the service life of the electronic device is reduced. Therefore, heat dissipation techniques and heat dissipation devices are critical to the safe and efficient use of electronic equipment.

The inventor finds that in the prior art, the heat dissipation modes of the heat pipe and the vapor chamber are both liquid transmission through the inner liquid suction pipe core, and the cooling effect is realized through liquid cooling heat dissipation. However, the wick of the liquid suction pipe has a complex structure, is difficult to process and manufacture, and is difficult to process the pore size distribution meeting the heat dissipation requirement, so that the cooling liquid is difficult to be fully utilized, the temperature uniformity is poor, and finally the heat dissipation efficiency is low.

Disclosure of Invention

In view of the above, the present invention provides a heat dissipation device, a method for manufacturing the heat dissipation device, and an electronic apparatus.

In a first aspect, an embodiment of the present application provides a heat dissipation device, including a first substrate, a second substrate disposed opposite to the first substrate, and a space between the first substrate and the second substrate; a hollow accommodating part arranged at the interval; a heat exchange medium disposed in the hollow accommodating part; the first substrate comprises a first base body and a first micro-structure layer which are arranged in a stacked mode, and a first capillary channel is formed in the first micro-structure layer and communicated with the hollow accommodating portion; the second substrate comprises a second substrate and a second microstructure layer which are stacked, and a second capillary channel is formed in the second microstructure layer and communicated with the hollow accommodating part; the heat exchange medium flows along the first capillary passage, the second capillary passage, and the hollow accommodating portion.

In a second aspect, embodiments of the present application further provide an electronic device, including the heat dissipation device and the heat generating component described in the first aspect.

In a third aspect, an embodiment of the present application further provides a method for manufacturing a heat dissipation device, including:

providing a first substrate and a second substrate;

paving a first metal layer on the surface of the first substrate, and paving a second metal layer on the surface of the second substrate;

arranging a first microstructure layer on at least partial area of the surface of the first metal layer and forming a first capillary channel, and arranging a second microstructure layer on at least partial area of the surface of the second metal layer and forming a second capillary channel; or, firstly, laying a first organic layer on at least partial region of the surface of the first metal layer, laying a second organic layer on at least partial region of the surface of the second metal layer, arranging a first microstructure layer on the surface of the first organic layer and forming a first capillary channel, and arranging a second microstructure layer on the surface of the second organic layer and forming a second capillary channel;

the first microstructure layer and the second microstructure layer are oppositely arranged, the first substrate and the second substrate are combined to form a hollow accommodating part, and a sealing part for sealing the hollow accommodating part is arranged at the joint of the first substrate and the second substrate;

and vacuumizing the hollow accommodating part, injecting a heat exchange medium, and sealing to obtain the heat dissipation device.

By adopting the technical scheme of the embodiment of the application, the first capillary channel is formed in the first micro-structure layer, the second capillary channel is formed in the second micro-structure layer, the structure and the size of the capillary channel are controlled by utilizing the micro-structure layer, the flowability of the heat exchange medium in the hollow accommodating part is increased, the heat circulation rate is increased, and the heat dissipation efficiency of the heat dissipation device is improved.

Drawings

Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings, wherein like reference numerals refer to like or similar features, which is briefly described below to illustrate the technical solutions of the embodiments of the present invention. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

FIG. 2 is a schematic view of the heat dissipation device of FIG. 1 from another perspective;

fig. 3 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application;

fig. 4 is a top view of a first substrate of a heat dissipation device according to another embodiment of the present application;

FIG. 5 is a side view of the first substrate provided in FIG. 4;

fig. 6 is a top view of a second substrate of a heat dissipation device according to another embodiment of the present application;

FIG. 7 is a side view of the second substrate provided in FIG. 6;

fig. 8 is a top view of a first substrate of a heat dissipation device according to another embodiment of the present application;

fig. 9 is a top view of a second substrate of a heat dissipation device according to another embodiment of the present application;

fig. 10 is a top view of a first substrate of a heat dissipation device according to another embodiment of the present application;

FIG. 11 is a cross-sectional view of the heat sink provided in FIG. 10 taken along line A-A;

FIG. 12 is a cross-sectional view of the heat sink provided in FIG. 10 taken along line B-B;

fig. 13 is a top view of a second substrate of a heat dissipation device according to another embodiment of the present application;

FIG. 14 is a cross-sectional view of the heat sink provided in FIG. 13 taken along line C-C;

FIG. 15 is a cross-sectional view of the heat sink provided in FIG. 13 taken along line D-D;

fig. 16 is a top view of a first substrate of a heat dissipation device according to another embodiment of the present application;

FIG. 17 is a side view of the first substrate provided in FIG. 16;

fig. 18 is a top view of a second substrate of a heat dissipation device according to another embodiment of the present application;

FIG. 19 is a side view of the second substrate provided in FIG. 18;

fig. 20 is a flowchart illustrating a method for manufacturing a heat dissipation device according to an embodiment of the disclosure.

Reference numerals:

1-a first substrate; 11-a first substrate; 110-a first surface; 111-a first connection region; 112-a first heat transfer zone; 113-a third capillary channel; 12-a first metal layer; 13-a first microstructure layer; 131-a first split; 132-a first capillary channel; 133-a first organic layer;

2-a second substrate; 21-a second substrate; 210-a second surface; 211-a second attachment zone; 212-second heat transfer zone; 213-a fourth capillary channel; 22-a second metal layer; 23-a second microstructure layer; 231-a second split portion; 232-a second capillary channel; 233 — a second organic layer;

3-a hollow containment; 31-a support;

4-sealing part.

Detailed Description

Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated for convenience in describing the invention and to simplify description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The directional terms appearing in the following description are intended to be illustrative in all directions, and are not intended to limit the specific construction of embodiments of the present invention. In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as either a fixed connection, a removable connection, or an integral connection; can be directly connected or indirectly connected. The specific meaning of the above terms in the present invention can be understood as appropriate to those of ordinary skill in the art.

In the prior art, the heat exchange medium inside the heat dissipation device is often concentrated at one end inside the heat dissipation device, and is difficult to flow to the other end quickly and timely, so that the heat circulation inside the heat dissipation device is slow, and finally, the heat dissipation efficiency is low, and therefore, how to improve the heat dissipation efficiency is a key research point of the heat dissipation device.

The heat dissipation device provided by the technical scheme can be applied to electronic equipment, such as a mobile phone, a tablet computer, a notebook computer, a desktop workstation, and related devices and components with heat dissipation functions and/or heat dissipation requirements. An electronic apparatus includes a heat-generating component including, for example, a processor or the like, and a heat-dissipating module including a heat-dissipating device for dissipating heat from the heat-generating component. The heat dissipation device is high in heat dissipation efficiency, mature in manufacturing process and controllable in production cost, and can prolong the service life of electronic equipment and improve the use experience of a user.

For better understanding of the present invention, the heat dissipation device and the electronic apparatus according to the embodiment of the present invention are described in detail below with reference to fig. 1 to 20.

An embodiment of the present invention provides a heat dissipation apparatus, as shown in fig. 1 to 3, the heat dissipation apparatus includes: the heat exchanger comprises a first substrate 1 and a second substrate 2 arranged opposite to the first substrate 1, wherein a gap is formed between the first substrate 1 and the second substrate 2, a hollow accommodating part 3 is arranged at the gap, and a heat exchange medium is arranged in the hollow accommodating part 3; referring to fig. 4, the first substrate 1 includes a first substrate 11 and a first microstructure layer 13, which are stacked, a first capillary channel 132 is formed in the first microstructure layer 13, and the first capillary channel 132 is communicated with the hollow accommodating portion 3; referring to fig. 7, the second substrate 2 includes a second substrate 21 and a second microstructure layer 23, which are stacked, a second capillary channel 232 is formed in the second microstructure layer 23, and the second capillary channel 232 is communicated with the hollow accommodating portion 3; the heat exchange medium flows along the first capillary passage 132, the second capillary passage 232, and the hollow accommodating part 3. Through the flow of the heat exchange medium, the heat circulation of the first substrate 1 and the second substrate 2 is realized, so that the heat dissipation effect is achieved.

Specifically, the first microstructure layer 13 and the second microstructure layer 23 are disposed on the first substrate 11 and the second substrate 21 through electroplating, chemical plating, sintering, bonding, or spraying, wherein the first microstructure layer 13 and the second microstructure layer 23 can directly form the first capillary channel 132 and the second capillary channel 232, or the first microstructure layer 13 and the second microstructure layer 23 further form capillary channels with different sizes, structures, and distributions through photolithography or etching, on the basis of the above processes, so as to accelerate a thermal cycle rate of a heat exchange medium for exchanging heat to the other one along one of the evaporation region and the cooling region, thereby improving the overall heat dissipation efficiency of the heat dissipation device. For better understanding of the technical solution, the working principle of the embodiment of the present application is described first, and as shown in fig. 1 to 3, the heat sink has a sealed hollow accommodating portion 3, and the hollow accommodating portion 3 is formed by a first substrate 1 and a second substrate 2 which are oppositely arranged, and a sealing portion 4 which is arranged between the first substrate 1 and the second substrate 2. The sealing portion 4 may be an adhesive or a heat conductive adhesive for bonding the first substrate 1 and the second substrate 2, and the hollow accommodating portion 3 is vacuumized in advance by an opening provided in a side wall of the sealing portion 4, and a heat exchange medium is injected into the opening, and then the opening is sealed. In some embodiments, the heat exchange medium may be water, an aqueous solution, an organic solution, or other fluid capable of transforming from a liquid phase to a gas phase when heated, such as deionized water, ethanol, methanol, or the like. Optionally, the fluid is used as a base fluid, and metal, metal oxide or nonmetal nanoparticles are added to prepare a suspension with a higher thermal conductivity, and the suspension is used as a heat exchange medium. The following description will be given by taking the heat exchange medium as water as an example. It should be noted that, a portion of the hollow accommodating portion 3 of the heat dissipating device, which is closer to the heat generating component, is an evaporation region, a portion of the hollow accommodating portion 3, which is farther from the heat generating component, is a cooling region, the heat exchange medium flows from the cooling region to the evaporation region under the action of capillary attraction of the first capillary channel 132 and/or the second capillary channel 232, after the heat exchange medium located in the evaporation region is heated and vaporized, the air pressure in the inner cavity of the hollow accommodating portion 3 changes, the heat exchange medium in a vaporized state moves toward the cooling region under the action of the air pressure, at this time, the heat exchange medium releases heat and generates condensation, and the heat exchange medium in a liquid state after condensation continues to flow to the evaporation region along the first capillary channel 132 and/or the second capillary channel 232 under the action of the capillary attraction, so as to implement a reciprocating heat cycle. The thermal cycle herein includes heat exchange between the first substrate 1 and the second substrate 2, and heat exchange between the first substrate 1 and the second substrate 2.

Referring to fig. 3 to 4, in some embodiments, the first base 11 has a first surface 110 opposite to the second substrate 2, the first surface 110 is divided into a first heat transfer area 112 and a first connection area 111 distributed successively along a first direction, and the first microstructure layer 13 is disposed on the first heat transfer area 112; referring to fig. 7, the second substrate 21 has a second surface 210 opposite to the first substrate 1, the second surface 210 is divided into a second connection region 211 and a second heat transfer region 212 distributed in succession along the first direction, and the second microstructure layer 23 is disposed in the second heat transfer region 212; the first heat exchange area 112 and the second heat exchange area 212 are arranged opposite to each other, and the hollow accommodating portion 3 is formed between the first heat exchange area 112 and the second heat exchange area 212. The first direction is a direction from one end of the heat dissipation device far away from the heating component to one end of the heat dissipation component close to the heating component. Specifically, the first direction is a direction indicated by an arrow X shown in fig. 1 to 3, in the present embodiment, the first connection region 111 is close to or attached to the heat generating component, since the first connection region 111 and the first heat exchanging region 112 are connected or integrally disposed, heat of the heat generating component is conducted from the first connection region 111 to the first heat exchanging region 112, the heat exchanging medium is attached to the surface of the first base 11 and flows in the first microstructure layer 13 under the capillary suction effect of the first capillary channel 132, so that heat of a region of the first base 11 close to the heat generating component is conducted along the flow direction of the heat exchanging medium; based on a similar principle, the heat exchange medium is attached to the surface of the second substrate 21 and flows in the second microstructure layer 23 under the capillary suction effect of the second capillary channel 232, the heat exchange medium conducts the heat absorbed from the first substrate 11 to the second substrate 21 and conducts the heat of the region of the second substrate 21 close to the heat generating component along the flow direction of the heat exchange medium, because the second heat exchange region 212 and the second connection region 211 are connected or integrally arranged, the heat located in the second heat exchange region 212 is conducted to the second connection region 211, and a large amount of heat is released to the outside from the second connection region 211, so that the heat dissipation function is realized. The heat is conducted in large areas among different areas, so that the surface heat distribution of the first base body 11 and the second base body 21 is more uniform, the local overheating and scalding of the heat dissipation device are avoided, the heat circulation rate is increased, the heat dissipation effect is optimized, and the heat dissipation efficiency and the user experience are improved.

Optionally, the heat dissipation device of this embodiment may further cooperate with an auxiliary heat dissipation device to achieve better heat conduction and heat dissipation effects, where the auxiliary heat dissipation device includes one or a combination of a fan, a metal heat dissipation plate, and a graphite heat dissipation plate. The auxiliary heat dissipation device is disposed in the first connection region 111 and/or the second connection region 211, such as by connecting the first connection region 111 and the heat generating component through a metal heat sink, and transferring heat of the heat generating component to the first connection region 111 through the metal heat sink; then, if the graphite heat sink is disposed in the second connection region 211 of the second surface 210, and the fan is disposed at a position close to the second connection region 211, the fan blows air to a position close to the second connection region 211, so as to accelerate heat transfer from the second connection region 211 to the air, and the heat dissipation capability of the fan and the graphite heat sink is combined with the heat dissipation device, thereby achieving a better heat dissipation effect.

It should be noted that, in some embodiments, the structures and design concepts of the components in the first heat exchange region 112 of the first substrate 1 and the second heat exchange region 212 of the second substrate 2 have similarities, and for avoiding redundant description, when describing these embodiments, the first substrate 1 will be taken as an example for detailed description, and only the second substrate 2 will be briefly described.

Regarding the path forms of the first and second capillary channels 232, the designer may choose the path forms according to two factors, i.e., the shapes of the first and second substrates 11 and 21 and the relative positions of the heat generating components and the heat dissipating devices, and the path forms of the first and second capillary channels 132 and 232 are not particularly limited herein. The designer may, for example, design first capillary passage 132 as a one-dimensional structure extending in a first horizontal plane parallel to first surface 110; alternatively, the first capillary channel 132 is a one-dimensional structure extending in a second direction (arrow Y direction) perpendicular to the first surface 110; alternatively, the first capillary passage 132 is a two-dimensional structure extending along the first horizontal plane and along the second direction. Similar to first capillary passage 132, second capillary passage 232 may be a one-dimensional structure extending in a second horizontal plane parallel to second surface 210; alternatively, the second capillary channel 232 is a one-dimensional structure extending in a third direction (arrow Z direction) perpendicular to the second surface 210; alternatively, the second capillary passage 232 is a two-dimensional structure extending along the second horizontal plane and along the third direction. It should be noted that, since the first capillary channel 132 communicates with the second capillary channel 232 according to the design principle, for convenience of discussion, the first capillary channel 132 and the second capillary channel 232 are collectively referred to as a capillary channel.

The designer can customize the dimensions of the capillary channel, such as its length, width, depth, etc., according to the heat dissipation requirements. Specifically, the depth and width of the first capillary channel 132 are 10 μm to 100 μm; the depth and width of the second capillary channel 232 are 10 μm to 100 μm. According to the principle of capillary action, the narrower the capillary channel, the larger the suction force of the capillary channel to the fluid, and therefore the size of the capillary channel can be changed according to the distance from the heat generating component. For example, different capillary structures are designed in different regions, including but not limited to longer length of capillary channel located at or near the evaporation region, so as to increase the flow path of the heat exchange medium and increase the contact area between the heat exchange medium and the first surface 110 of the first substrate 11, so that the heat is uniformly distributed on the first surface 110 via the flow of the heat exchange medium, and the phenomenon of local overheating is avoided; the width of a capillary channel positioned in the evaporation area or close to the evaporation area is designed to be narrower, so that the capillary suction force of the capillary channel is increased, the heat exchange medium can rapidly flow to the evaporation area under the action of the capillary suction force, and the thermal circulation rate is accelerated; including but not limited to, shallower depths of capillary channels at or near the evaporation zone, making the capillary channels narrower to increase capillary suction and speed thermal cycling rates. Further, the size of the capillary channel may vary in a corresponding gradient depending on the distance from the heat generating component.

Specifically, the width of the capillary channel is distributed in a gradient manner along the reverse direction of the first direction and has a decreasing trend, that is, the closer to the evaporation zone, the narrower the width of the capillary channel is, the larger the capillary suction force is, the heat exchange medium in the liquid phase can rapidly flow to the evaporation zone, the heat in the evaporation zone is absorbed and then converted into the gas phase state, the gas phase heat exchange medium is condensed in the cooling zone and then is converted into the liquid phase again, the liquid phase heat exchange medium in the cooling zone flows to the evaporation zone under the action of the capillary suction force, and the repeated heat circulation is continued.

In some embodiments, referring to fig. 4 and fig. 5, the first microstructure layer 13 includes a plurality of first flow-dividing portions 131 disposed on the first surface 110 and extending toward the second substrate 2, and first capillary channels 132 in a grid-like communication are formed between the plurality of first flow-dividing portions 131. Since the first flow dividing parts 131 have small gaps therebetween and the small gaps are communicated with each other to form a capillary structure, a designer can indirectly adjust the gap structure and size by adjusting the structure of the first flow dividing parts 131 and the position relationship between the first flow dividing parts 131, so as to realize the first capillary channels 132 in different path forms. Compared with a capillary structure obtained by directly performing material reduction treatment on the first substrate 11, the first capillary channel 132 surrounded by the first flow dividing part 131 is easier to form a flow channel with complex branches, the mutually communicated branches enable the shape of the heat exchange medium flowing through the first microstructure layer 13 to be longer, the contact area between the heat exchange medium and the first surface 110 is also increased, and heat is more uniformly distributed on the first surface 110 through the flowing of the heat exchange medium, so that local overheating is avoided. It should be noted that the structural forms of the first branch parts 131 may be the same or different, and are not limited in particular, and the structure of the first branch parts 131 may include one or more of a cylindrical structure, a prismatic structure, a curved top structure and a crotch structure according to actual heat dissipation needs and manufacturing difficulty. For convenience of description, the following description will be made only in a case where each of the first flow dividing parts 131 has the same structure, but is not limited to this case. It should be noted that, since the first capillary channel 132 is formed by the first flow dividing part 131, the structural form and corresponding change of the capillary channel can be realized by designing the first flow dividing part 131.

Specifically, with reference to fig. 6, the distribution density of the first shunting parts 131 on the first surface 110 gradually increases along the first direction. The distribution density of the first flow-dividing portions 131 refers to the number of the first flow-dividing portions 131 in a unit area, and the larger the distribution density of the first flow-dividing portions 131 is, the smaller the gap between adjacent first flow-dividing portions 131 is, the narrower the first capillary channel 132 formed by the first flow-dividing portions 131 is, and thus the larger the capillary suction force is. The arrangement can enable the heat exchange medium to flow from the cooling area to the evaporation area more quickly, and the heat circulation is accelerated.

Based on the above discussion, as shown in fig. 7 to 9, the second microstructure layer 23 may also include a plurality of second flow-dividing portions 231 disposed on the second surface 210 and extending toward the first substrate 1, and second capillary channels 232 in a grid-like communication are formed between the plurality of second flow-dividing portions 231. The structure of the second diverging part 231 may include one or more of a cylindrical structure, a prismatic structure, a curved-top structure, and a crotch structure. The density of the distribution of the second flow dividing parts 231 on the second surface 210 may be gradually increased in the first direction. Similar to the first flow dividing part 131, the above discussion about the first flow dividing part 131 is applied to the second flow dividing part 231, and thus, the description thereof is omitted.

In some embodiments, the first shunt part 131 and the second shunt part 231 are both cylindrical spacers PS pillars (i.e., Photo spacers) in the display panel. The following description will be made only with the first and second flow dividing portions 131 and 231 having the same configuration, and does not represent a limitation on the embodiment itself.

The material of the first flow dividing part 131 and the second flow dividing part 231 may be an organic material or a metal, and the material of the first flow dividing part 131 and the material of the second flow dividing part 231 may be the same or different. The following description will be made only for the case where the first and second flow-dividing portions 131 and 231 are made of the same material, but is not limited to this case.

In some embodiments, the first flow-dividing portion 131 and the second flow-dividing portion 231 are made of a hydrophobic material or have a hydrophobic material coating, such as a hydrophobic resin, a hydrophobic rubber, or other polymer material, for example, the first flow-dividing portion 131 and the second flow-dividing portion 231 are made of polystyrene. When the heat exchange medium flows along the first capillary channel 132, the heat exchange medium contacts the surface of the first shunting part 131 and the first surface 110, and the surface of the first shunting part 131 is made of a hydrophobic material, and the contact angle between the surface and water is an obtuse angle, so that the heat exchange medium can move along the surface of the hydrophobic material more easily, the heat exchange medium is prevented from being adhered to the contact surface, and the heat circulation rate is increased by increasing the fluidity of the heat exchange medium. According to the actual heat dissipation requirement, the first surface 110 of the first substrate 11 may also be coated with a hydrophobic material coating, so as to further increase the overall heat circulation rate of the heat dissipation device; or, the first surface 110 of the first substrate 11 is coated with a hydrophilic material coating, such as one or more of silicon dioxide, titanium dioxide, and aluminum oxide, at this time, the contact angle between the heat exchange medium and the first surface 110 is an acute angle, and the contact area between the heat exchange medium and the first surface 110 is larger, so that the heat exchange medium is more easily adsorbed to the first surface 110 and can take away more heat from the first surface 110; furthermore, the evaporation area and the cooling area may be respectively treated correspondingly, for example, a part of the first surface 110 located in the evaporation area or close to the evaporation area is subjected to hydrophilic treatment, and a part of the first surface 110 located in the cooling area or close to the cooling area is subjected to hydrophobic treatment, so that the heat exchange medium located in the cooling area can rapidly flow to the evaporation area, while the liquid phase heat exchange medium located in the evaporation area can be retained in the evaporation area for a longer time, and more heat can be taken away from the evaporation area. The above discussion can also be applied to the second shunting part 231 and the second surface 210, and thus, the description thereof is omitted.

In some embodiments, referring to fig. 10 to 12, the first substrate 11 is provided with a third capillary channel 113 formed by the first surface 110 and the first substrate 11, and the third capillary channel 113 is communicated with the first capillary channel 132, which is equivalent to extending the depth of the first capillary channel 132, and also expands the space of the hollow accommodating portion 3. At this time, the heat exchange medium may be stored in the third capillary passage 113 so that the hollow accommodating part 3 can accommodate more heat exchange medium, thereby improving the heat dissipation effect. In addition, the heat exchange medium can also flow along the third capillary channel 113, so that a flow path of the heat exchange medium is increased, more heat can be conducted, and a good temperature equalization effect can be realized in the first heat exchange zone 112. It should be noted that, in the case of no structural conflict, the structural design and dimensional change for the first capillary channel 132 can be applied to the third capillary channel 113, and therefore, the description thereof is omitted. For similar reasons, as shown in fig. 13 to 15, the second substrate 21 may also be provided with a fourth capillary channel 213 formed by the second surface 210 to the inner recess of the second substrate 21, and the fourth capillary channel 213 is communicated with the second capillary channel 232. Specifically, an orthographic projection of the first capillary passage 132 in the second direction covers an orthographic projection of the third capillary passage 113 in the second direction; an orthographic projection of the second capillary channel 232 in the second direction covers an orthographic projection of the fourth capillary channel 213 in the second direction.

In some embodiments, the material of the first substrate 11 and the second substrate 21 may be rigid material such as glass, metal, etc., or may be flexible material such as epoxy resin, Polyimide (PI), etc. For example, if the surface of the heat generating component is flat, a metal material with high flatness can be selected as the base material, so as to reduce the contact thermal resistance and ensure the overall structure of the heat dissipating device to be stable. For another example, if the surface of the heat-generating component is vibrating, a flexible substrate having a higher degree of flexibility may be selected. The foregoing is merely exemplary and does not represent a limitation on the choice of matrix material. The materials of the first substrate 11 and the second substrate 21 may be the same or different. Referring to fig. 11 and 14, the first microstructure layer 13 and the second microstructure layer 23 may be made of a metal material to achieve a good thermal conductivity, and further, the thickness of the first microstructure layer 13 and the second microstructure layer 23 may be 1 μm to 20 μm.

In the above embodiments, the first substrate 11 includes the first metal layer 12, and the first metal layer 12 is located on the side facing the second substrate 21. The metal has good heat conductivity and low contact thermal resistance, and is helpful for rapidly conducting the heat of the first connection region 111 to the first heat transfer region 112, preventing local overheating and accelerating heat conduction speed. For similar reasons, the second substrate 21 comprises a second metal layer 22, the second metal layer 22 being located on the side of the second substrate 21 facing the first substrate 11. The second metal layer 22 helps to quickly conduct the heat of the second heat transfer region 212 to the second connection region 211 and release the heat to the outside, thereby improving the heat dissipation efficiency. Specifically, the thickness of the first metal layer 12 and the second metal layer 22 are both in the range of 1 μm to 20 μm.

In some embodiments, referring to fig. 4 and fig. 5, the first microstructure layer 13 is in contact with the first metal layer 12 and is located on a side of the first metal layer 12 away from the first substrate 11, and the heat exchange medium is in contact with the first metal layer 12 and flows on the surface of the first metal layer 12, so as to facilitate rapid heat conduction to the entire first metal layer 12 and achieve uniform temperature. And the metal has hydrophilicity, and the contact area of the first metal layer 12 and the heat exchange medium is large, so that the heat conducted by the heat exchange medium is large, and the heat dissipation effect is improved. For similar reasons, as shown in fig. 7 and 8, the second microstructure layer 23 is in contact with the second metal layer 22 and is located on a side of the second metal layer 22 away from the second substrate 21.

In the above embodiment, referring to fig. 16 and fig. 17, the first microstructure layer 13 further includes a first organic layer 133, the first organic layer 133 is in contact with the first metal layer 12 and located on a side of the first metal layer 12 away from the first substrate 11, and the first shunt portion 131 is in contact with the first organic layer 133 and located on a side of the first organic layer 133 away from the first substrate 11. The first microstructure layer 13 made of organic material is prevented from directly contacting with metal to cause the insecure bonding surface of the first microstructure layer 13 and the metal, so that the first shunt part 131 falls off from the first metal layer 12, and the firmness of the first microstructure layer 13 is enhanced. For similar reasons, as shown in fig. 18 and 19, the second microstructure layer 23 further includes a second organic layer 233, the second organic layer 233 is in contact with the second metal layer 22 and is located on a side of the second metal layer 22 away from the second substrate 21, and the second shunt portion 231 is in contact with the second organic layer 233 and is located on a side of the second organic layer 233 away from the second substrate 21.

In the above embodiment, referring to fig. 16 to fig. 19, the first shunt part 131 and the second shunt part 231 are both organic spheres, the first shunt part 131 and the second shunt part 231 are formed by a spraying process and are respectively attached to the first organic layer 133 and the second organic layer 233, and the surfaces of the spheres are convex curved surfaces, so that the heat exchange medium is not easily attached to the surfaces of the spheres but easily slides down to the first surface 110 along the surfaces of the spheres, thereby increasing the contact area between the heat exchange medium and the first surface 110 and improving the heat dissipation efficiency. Specifically, the first and second flow-dividing portions 131 and 231 are each a silicon sphere having a diameter of 3 to 10 μm.

In the above embodiment, referring to fig. 2, the heat dissipation device further includes a supporting portion 31, the supporting portion 31 is located in the hollow accommodating portion 3 and abuts between the first substrate 1 and the second substrate 2 to perform a supporting and shaping function, so as to improve the stability of the overall structure of the heat dissipation device and prevent the heat dissipation device from being distorted and deformed due to extrusion.

Specifically, referring to fig. 3, the supporting portion 31 abuts between the first microstructure layer 13 and the second microstructure layer 23 to reduce the resistance of the heat exchange medium flowing in the capillary channel.

Alternatively, the supporting portion 31 is a spherical Spacer BS (i.e., Ball Spacer) in the display panel.

Referring to fig. 20, the present application further provides a method for manufacturing a heat dissipation device, in which the method 100 for manufacturing the heat dissipation device of any of the above embodiments includes step S1: the first substrate 11 and the second substrate 21 are provided, and the characteristics of the first substrate 11 are not limited herein, and the first substrate 11 and the second substrate 21 may be a rigid substrate or a flexible substrate.

Optionally, the first substrate and the second substrate are both glass substrates.

In some embodiments, in step S1, the surfaces of the first substrate 11 and the second substrate 21 are subjected to material reduction processing to form a capillary channel structure, specifically, a third capillary channel 113 is formed on the surface of the first substrate 11, and the third capillary channel 113 is located at the first heat transfer area 112 of the first substrate; a fourth capillary channel 213 is formed on the surface of the second substrate 21, and the fourth capillary channel 213 is located in the second heat transfer area 212 of the second substrate.

The material reduction process may be an etching process.

The method 100 further includes step S2: a first metal layer 12 is formed on the surface of a first substrate 11, and a second metal layer 22 is formed on the surface of a second substrate 21.

The surfaces of the first substrate 11 and the second substrate 21 are respectively made into metal layers by chemical plating or electroplating. The surface of the metal layer formed by chemical plating or electroplating has higher flatness, so that the contact thermal resistance can be reduced, and the heat conduction rate can be accelerated.

The method 100 further includes step S3: arranging a first microstructure layer 13 on at least partial area of the surface of the first metal layer 12 and forming a first capillary channel 132, and arranging a second microstructure layer 23 on at least partial area of the surface of the second metal layer 22 and forming a second capillary channel 232;

in some embodiments, the process of providing the first microstructure layer 13 and forming the first capillary channel 132 includes: an original microstructure layer is directly laid on the surface of the first metal layer 12 or the surface of the first organic layer 133, then the original microstructure layer is subjected to material reduction treatment, a plurality of first shunting parts 131 with gaps are obtained after materials are removed, and each first shunting part 131 forms the first microstructure layer 13. The material reduction process may be an etching process.

Alternatively, in some embodiments, the process of providing the first microstructure layer 13 and forming the first capillary channel 132 in step S3 includes: laying a first organic layer 133 on at least a partial area of the surface of the first metal layer 12, and then arranging a first shunt part 131 on the surface of the first organic layer 133 and forming a first capillary channel 132;

specifically, the process of providing the first microstructure layer 13 and forming the first capillary channel 132 includes: the first shunt part 131 is directly disposed on the first metal layer 12 or the first organic layer 133. The first flow-splitting part 131 is to be generated on the surface of the first metal layer 12 or the first organic layer 133 by additive processing such as printing, photo-curing, etc.; the first shunt part 131 may be adhered to the surface of the first metal layer 12 or the first organic layer 133 by a process such as spraying or adhesion.

The second flow dividing part 231 is similar to the first flow dividing part 131, and thus, is not described in detail herein.

In some embodiments, optionally, after step S3, forming a support portion 31 on the first base 11 and/or the second base 21; when the first base 11 and the second base 21 are combined to form the hollow accommodating portion 3, the supporting portion 31 abuts between the first base 11 and the second base 21. The method of forming the supporting portion 31 may be, but not limited to, spraying, welding, etching.

The method 100 further includes step S4: the first microstructure layer 13 is arranged opposite to the second microstructure layer 23, the first substrate 11 is combined with the second substrate 21 to form the hollow accommodating part 3, and the sealing part 4 for sealing the hollow accommodating part 3 is arranged at the joint of the first substrate 11 and the second substrate 21.

In some embodiments, a sealant is used as the sealing portion 4 at the junction of the first substrate 11 and the second substrate 21 for sealing the hollow container 3.

The method 100 further includes step S5: and vacuumizing the hollow accommodating part 3, injecting a heat exchange medium, and sealing to obtain the heat radiating device.

In some embodiments, the specific process of step S5 includes: reserving or opening an opening in the sealing part 4, vacuumizing the opening, injecting a heat exchange medium into the hollow accommodating part 3 through the opening, sealing the opening after the heat exchange medium is injected, and then removing burrs at the opening to perform leveling treatment.

Optionally, the filling amount of the heat exchange medium in the hollow accommodating part 3 is 30% -80%, so that heat can be effectively dissipated, and the heat dissipation device is not too heavy.

The manufacturing method provided by the application is simple, the process is mature, the structure and the size of the formed capillary channel are controllable, the precision is high, and the heat dissipation efficiency is improved by controlling the structure and the size of the capillary channel. The heat dissipation device manufactured by the method is simple in overall structure, light and thin, large-scale industrial mass production can be achieved, and cost is controllable.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the features mentioned in the embodiments can be combined in any manner, as long as there are no structural or technical conflicts. Further, as previously mentioned, it is to be understood that the application is not limited to the forms disclosed herein, and is not to be construed as excluding other embodiments that may be used in various other combinations, modifications, and variations within the scope of the inventive concepts described herein, as may be amended by the above teachings or by the knowledge or knowledge of those in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.

Claims (24)

1. A heat dissipating device, comprising:

a first substrate;

the second substrate is arranged opposite to the first substrate, and a gap is formed between the first substrate and the second substrate;

a hollow accommodating portion provided at the interval;

a heat exchange medium disposed in the hollow accommodating part;

the first substrate comprises a first base body and a first micro-structure layer which are arranged in a stacked mode, and a first capillary channel is formed in the first micro-structure layer and communicated with the hollow accommodating portion;

the second substrate comprises a second substrate and a second microstructure layer which are stacked, and a second capillary channel is formed in the second microstructure layer and communicated with the hollow accommodating part;

the heat exchange medium flows along the first capillary passage, the second capillary passage, and the hollow accommodating portion.

2. The heat dissipation device as claimed in claim 1, wherein the first substrate has a first surface opposite to the second substrate, the first surface is divided into a first heat exchange region and a first connection region along a first direction, the first micro-structural layer is disposed in the first heat exchange region;

the second substrate is provided with a second surface opposite to the first substrate, the second surface is divided into a second connecting area and a second heat exchange area which are distributed in sequence along the first direction, and the second microstructure layer is arranged in the second heat exchange area;

the first heat exchange area and the second heat exchange area are arranged oppositely, and the hollow accommodating part is formed between the first heat exchange area and the second heat exchange area.

3. The heat dissipation device of claim 2, wherein the first capillary channel is a one-dimensional structure extending in a first horizontal plane parallel to the first surface; alternatively, the first and second electrodes may be,

the first capillary channel is a one-dimensional structure extending in a second direction perpendicular to the first surface; alternatively, the first and second electrodes may be,

the first capillary passage is a two-dimensional structure extending along the first horizontal plane and along the second direction.

4. The heat dissipation device of claim 2, wherein the second capillary passage is a one-dimensional structure extending in a second horizontal plane parallel to the second surface; alternatively, the first and second electrodes may be,

the second capillary channel is a one-dimensional structure extending in a third direction perpendicular to the second surface; alternatively, the first and second electrodes may be,

the second capillary channel is a two-dimensional structure extending along the second horizontal plane and along the third direction.

5. The heat dissipation device as claimed in claim 2, wherein the first microstructure layer includes a plurality of first flow-dividing portions disposed on the first surface and extending toward the second substrate, and the first capillary channels are formed in a grid-like communication between the first flow-dividing portions;

the second microstructure layer comprises a plurality of second flow-dividing parts which are arranged on the second surface and extend towards the first substrate, and second capillary channels which are communicated in a grid shape are formed among the second flow-dividing parts.

6. The heat dissipating device of claim 5, wherein the first flow-dividing portion is distributed over the first surface with a density that gradually increases along the first direction.

7. The heat dissipating device of claim 5, wherein the second flow dividing portion is distributed over the second surface with a density that gradually increases along the first direction.

8. The heat dissipating device of claim 5, wherein the structure of the first flow-splitting part comprises one or more of a cylindrical structure, a prismatic structure, a curved-top structure, and a crotch structure;

the structure of the second shunting part comprises one or more of a cylindrical structure, a prismatic structure, a curved top structure and a crotch structure.

9. The heat dissipating device of claim 8, wherein the first flow-dividing portion and the second flow-dividing portion are made of PS columns of column spacers.

10. The heat dissipating device of claim 2, wherein the first substrate is provided with a third capillary channel formed from the first surface to an inner recess of the first substrate, the third capillary channel communicating with the first capillary channel;

the second substrate is provided with a fourth capillary channel formed from the second surface to the inner part of the second substrate in a concave mode, and the fourth capillary channel is communicated with the second capillary channel.

11. The heat dissipating device of claim 10, wherein an orthographic projection of said first capillary channel in said second direction covers an orthographic projection of said third capillary channel in said second direction;

an orthographic projection of the second capillary channel along the second direction covers an orthographic projection of the fourth capillary channel along the second direction.

12. The heat dissipation device as claimed in claim 11, wherein the first micro-structural layer and the second micro-structural layer are both made of metal;

the thicknesses of the first microstructure layer and the second microstructure layer are both 1-20 mu m.

13. The heat dissipating device of any of claims 5 to 9, wherein the first substrate comprises a first metal layer, the first metal layer being located on a side facing the second substrate;

the second substrate includes a second metal layer on a side facing the first substrate.

14. The heat dissipating device of claim 13, wherein the first metal layer and the second metal layer each have a thickness of 1 μm to 20 μm.

15. The heat dissipation device of claim 13, wherein the first microstructure layer is in contact with the first metal layer and is located on a side of the first metal layer away from the first substrate;

the second microstructure layer is in contact with the second metal layer and is positioned on one side of the second metal layer, which is far away from the second substrate.

16. The heat dissipating device of claim 15, wherein the first microstructure layer further comprises a first organic layer in contact with the first metal layer and on a side of the first metal layer remote from the first substrate, and the first shunt is in contact with the first organic layer and on a side of the first organic layer remote from the first metal layer;

the second microstructure layer further comprises a second organic layer, the second organic layer is in contact with the second metal layer and is positioned on one side, far away from the second substrate, of the second metal layer, and the second shunt part is in contact with the second organic layer and is positioned on one side, far away from the second metal layer, of the second organic layer.

17. The heat dissipation device of claim 16, wherein the first shunt portion and the second shunt portion are both organic spheres, and the first shunt portion and the second shunt portion are formed by a spraying process and attached to the first organic layer and the second organic layer, respectively.

18. The heat dissipating device of claim 17, wherein the first flow-dividing portion and the second flow-dividing portion are silicon spheres having a diameter of 3 μm to 10 μm.

19. The heat dissipating device of any of claims 1 to 12, wherein the first capillary channel has a depth and width of 10 μ ι η to 100 μ ι η;

the depth and width of the second capillary channel are 10-100 μm.

20. The heat dissipating device of any one of claims 1 to 12, further comprising a support portion located in the hollow receiving portion and abutting between the first substrate and the second substrate.

21. The heat dissipating device of claim 20, wherein the support portion abuts between the first micro-structural layer and the second micro-structural layer.

22. The heat sink as claimed in claim 21, wherein the support portion is a spherical spacer BS.

23. An electronic device, characterized in that the electronic device comprises the heat dissipating arrangement according to any one of claims 1 to 22.

24. A method of manufacturing a heat dissipation device, the method comprising:

providing a first substrate and a second substrate;

paving a first metal layer on the surface of the first substrate, and paving a second metal layer on the surface of the second substrate;

arranging a first microstructure layer on at least partial area of the surface of the first metal layer and forming a first capillary channel, and arranging a second microstructure layer on at least partial area of the surface of the second metal layer and forming a second capillary channel;

the first microstructure layer and the second microstructure layer are oppositely arranged, the first substrate and the second substrate are combined to form a hollow accommodating part, and a sealing part for sealing the hollow accommodating part is arranged at the joint of the first substrate and the second substrate;

and vacuumizing the hollow accommodating part, injecting a heat exchange medium, and sealing to obtain the heat dissipation device.

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