CN113138045B - Micro-nano optical fiber array stress positioning analysis system - Google Patents
Micro-nano optical fiber array stress positioning analysis system Download PDFInfo
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 91
- 238000004458 analytical method Methods 0.000 title claims abstract description 33
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 claims abstract description 4
- 230000009471 action Effects 0.000 claims description 14
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000001069 Raman spectroscopy Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000002121 nanofiber Substances 0.000 claims 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 2
- 238000005516 engineering process Methods 0.000 abstract description 11
- 238000011161 development Methods 0.000 abstract description 3
- 230000035882 stress Effects 0.000 description 49
- 230000008859 change Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 238000003491 array Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001872 Spider silk Polymers 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/247—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet using distributed sensing elements, e.g. microcapsules
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Abstract
The invention provides a micro-nano optical fiber array stress positioning analysis system, which combines a micro-nano optical fiber array, a planar substrate and a lattice substrate provided with a pressure contact to form a complete signal sensing system. The micro-nano optical fiber array and the conducting optical fiber are communicated to the signal processing module through the optical signal transceiving module, and a complete signal collecting and processing system is obtained. After the optical signal transceiving system sends an optical signal to enter the micro-nano optical fiber array, the external force applied to the lattice substrate is transferred to the pressure contact, so that the phase and the intensity of the transmission optical signal are changed, and then the transmission optical signal is transferred back to the signal collector and is analyzed by the processor, and the purpose of calculating the stress spatial distribution intensity is achieved, thereby achieving the effect of stress positioning analysis. The stress of the specific part can be accurately known through accurate stress positioning analysis, and rapid analysis can be carried out. The system can be directly worn on the fingers or shoulders of a human body or implanted into cell tissues of the human body, and the development of a man-machine interconnection technology is promoted.
Description
Technical Field
The invention belongs to the technical field of sensing, relates to a stress conduction structure consisting of a micro-nano optical fiber array, a conduction optical fiber and a stress contact, and particularly relates to a stress positioning analysis system based on the structure.
Background
As early as the 19 th century, a glass filament-glass fiber was produced which had a high transparency and a thickness similar to that of spider silk, and when light was incident into the glass fiber at an appropriate angle, the light proceeded along the bent glass fiber, which was a model of an early optical fiber. A typical bare optical fiber is generally divided into three layers: a central high-refractive-index glass core (core diameter is generally 50 or 62.5 μm), a low-refractive-index silica glass cladding (diameter is generally 125 μm) in the middle, and a resin coating for reinforcement at the outermost layer. The cladding of the micro-nano optical fiber is generally low-refractive-index media such as air or water, the difference between the fiber core and the cladding is large, and the optical fiber has strong constraint capacity on an optical field, so that the micro-nano optical fiber has low bending loss, is much smaller in transmission loss compared with other micro-nano optical waveguides with the same size, and has wider application prospect.
The existing technologies are mostly multipoint measurement and distributed measurement for pressure (stress). Such as: distributed optical fiber temperature and pressure sensors, wavelength division multiplexing optical fiber hydrogen sensing systems and the like. At present, the existing technologies are mostly multipoint measurement and distributed measurement for pressure (stress). The technology most similar to the technology disclosed by the patent is from laser array sensing system design based on REC technology to stage 10 of infrared and laser engineering 2017. The technology analyzes and provides a sensing system and a demodulation algorithm based on Reconstruction Equivalent Chirp (REC) technology laser array, and provides a high-efficiency algorithm of laser scanning for measuring the displacement of a Fiber Bragg Grating (FBG) caused by external stress. The uniqueness of the system lies in that the array laser channel only needs to tune 0.4nm sampling data, replaces the scanning FBG main power peak, and the algorithm is applicable to any spectral band of the FBG, can be used in the FBG sensing network with multi-channel peak multiplexing, and can accurately position the displacement of the FBG reflection spectrum in the experiment of a single channel and four channels. However, the related "precise positioning" is limited to the structural change corresponding to the grating type inside the optical fiber, and the spatial distribution and precise positioning for the spatial stress cannot be realized well, which limits the application of the related technology in the field of human-computer interaction.
Disclosure of Invention
The invention solves the problems that the traditional optical fiber has weak constraint capacity on an optical field, large transmission loss and can not realize stress spatial distribution strength and positioning, and provides a micro-nano optical fiber array stress positioning analysis system. The invention innovatively provides an array stress positioning system packaged by PDMS, which can better measure and position the stress. The micro-nano optical fiber array and the conducting optical fiber structure are applied to detecting optical signal change difference caused by small change of pressure applied to the module by the outside, so that the spatial distribution strength of stress is analyzed and calculated, the sensing and positioning of the stress of each part are realized, the detection of the force application size, the stress position and the like of arms and fingers of a human body is hopefully realized, and even the system can be integrated into an implantable chip, so that the development of a man-machine interaction technology is promoted.
In order to achieve the purpose, the invention provides a micro-nano optical fiber array stress positioning analysis system, which adopts the following technical scheme: comprises a trigger device and a signal receiving, transmitting and processing device; the trigger device comprises a plane substrate, a symmetrical uniform micro-nano optical fiber array, a dot matrix substrate and a pressure contact; the planar substrate and the lattice substrate are oppositely arranged, the symmetrical uniform micro-nano optical fiber array is arranged on the planar substrate, and the pressure contacts are uniformly distributed on one side of the lattice substrate opposite to the symmetrical uniform micro-nano optical fiber array; the pressure contacts are uniformly distributed along each optical fiber on the symmetrical uniform micro-nano optical fiber array; the signal receiving, transmitting and processing device comprises an optical signal receiving and transmitting module and a signal processing module; the symmetrical uniform micro-nano optical fiber array is communicated with an optical signal transceiving module through a coupler and a conducting optical fiber to form an optical signal transceiving passage, and the optical signal transceiving module is communicated with a signal processing module;
the working flow of the system is as follows: after an optical signal is sent by the optical signal receiving and sending module and enters the symmetrical uniform micro-nano optical fiber array, the external force applied to the lattice substrate is transferred to the pressure contact, and the pressure contact acts on the symmetrical uniform micro-nano optical fiber array downwards, so that the strength and the phase of a forward transmission optical signal of an optical fiber at a corresponding position in the symmetrical uniform micro-nano optical fiber array and the frequency movement amount of a backward scattering optical signal are changed and then transferred back to the signal receiving and sending module, the signal analysis is completed by the signal processing module, and the effect of stress positioning analysis is achieved.
The micro-nano optical fiber array cannot deform under the stress-free condition, and the interior of the micro-nano optical fiber array keeps stable property, so that a constantly-sent optical signal has a stable received signal; when stress acts, the micro-nano optical fiber deforms, so that the phase and the intensity of a transmission light signal are changed, the transmission light signal is transmitted back to the signal collector and is analyzed by the processor, the purpose of calculating the stress spatial distribution intensity is achieved, and the effect of stress positioning analysis is achieved accordingly.
According to the symmetrical uniform micro-nano optical fiber array used in the invention, the micro-nano optical fibers are made of silicon dioxide, the diameter of the micro-nano optical fibers is 1 micrometer, and the distance between every two optical fibers is 5 mm.
The planar substrate used was made of a polymer having a low Young's modulus, and the thickness was 1mm when PDMS was used. The flexibility of the structure is enhanced, so that the structure is more convenient to assemble, and high-precision operation can be performed in the environment with high risk and high-precision operation.
The material of the lattice substrate needs polyimide, the thickness is about 1mm, and the material used by the pressure contact is silicon. The silicon polymer with higher Young modulus increases the measurement accuracy and improves the resolution of the system.
The micro-nano optical fiber arrays are arranged in a right-angle S shape, the diameter of each optical fiber is 1 mu m, and the distance between the array optical fibers is 5 mm.
The size of the optical fiber structure is in the micro-nano level, an optical evanescent field can be generated, and the structure can be subjected to micro deformation. The distance between the arrays is millimeter, so that possible influence caused by the deviation of the installation position of the optical fiber arrays can be avoided. And because the micro-nano optical fiber is not sensitive to radial variation, the influence of temperature can be ignored. The change of the optical evanescent field under the action of the stress is effectively coupled into the nearby optical fiber to form the intensity distribution of the planar optical field with the action stress as the center, thereby realizing the visual monitoring of the stress action field.
The signal processing module completes signal analysis through the frequency movement amount of the backward scattering light signals in combination with Raman scattering and Brillouin scattering, and calculates the action position of stress; meanwhile, the action magnitude and the spatial distribution of the stress are calculated by combining the intensity and the phase of the forward transmission light.
Compared with the prior art, the invention has the beneficial effects that:
1) the symmetrical uniform micro-nano optical fiber array can excite an optical evanescent field and is extremely sensitive to micro stress variation; the visual monitoring of the stress action field can be realized by means of the high-efficiency optical coupling effect between the optical fibers; finally, positioning stress sites by combining with back scattering light; the three factors are combined to improve the reliability of stress detection.
2) The flexibility of the structure is enhanced by the encapsulation of the polymer PDMS, the dissipation of the light path is reduced, the structure can be directly worn on the fingers or shoulders of a human body, high-precision operation of workers in high-risk and high-precision operation environments is facilitated, and dangerous conditions are avoided.
The wearable type stress sensor can be used for wearable type behavior monitoring and auxiliary equipment, the spatial distribution strength of stress is analyzed and calculated through analysis of signals, and sensing and positioning analysis of stress of each part of the space are achieved.
Drawings
Fig. 1 is a stress positioning analysis system of a micro-nano optical fiber array.
In the figure: 1 a planar substrate; 2, symmetrical uniform micro-nano optical fiber arrays; 3, an optical signal receiving and transmitting module; 4 conducting optical fiber A; 5, coupler A; 6, coupler B; 7 a conducting fiber B; 8, a signal processing module; 9 a lattice substrate; 10 pressure contact.
FIG. 2 is a stress distribution characteristic of a micro-nano optical fiber array positioning analysis system under the action of a surface normal force and a sliding shearing force.
In the figure: the gridding divides the response range equivalent to the action of the corresponding force of the single lattice corresponding to the lattice substrate 9.
Detailed Description
The following describes in detail a specific embodiment of the present invention by way of technical documents and drawings.
As shown in the figure, the main body of the micro-nano optical fiber array stress positioning analysis system is a pressure conduction structure formed by coupling a symmetrical uniform micro-nano optical fiber array 2, conducting optical fibers A4 and B7 and a pressure contact 10; the optical signal transceiver module 3 sends out an optical signal, the optical signal enters the symmetrical uniform micro-nano optical fiber array 2 through the conducting optical fiber A4 and the coupler A5, when stress acts on the surface of the lattice substrate 9, the stress is transmitted to different pressure contacts 10, and then the stress acts on the symmetrical uniform micro-nano optical fiber array 2, so that the phase and the intensity of the optical signal in a transmission evanescent field are changed, and meanwhile, a backward scattering optical signal can be generated in the symmetrical uniform micro-nano optical fiber array 2.
The lattice substrate 9 includes a plurality of positioning units, and each positioning unit is formed by a plurality of sites of an optical fiber. When external stress acts on the surface of the lattice substrate 9, the stress acts on the optical fiber through different contact sites, so that an optical evanescent field propagating on the surface of the optical fiber is influenced, and finally, the stress action intensity and range of a specific site are determined through analysis of the intensity and phase of an optical signal. When stress acts on the surface of the dot matrix substrate 9, the corresponding part deforms downwards, the pressure contact 10 acts on the corresponding part of the symmetrical uniform micro-nano optical fiber array 2, so that the phase and the intensity of a transmission light signal of the part are changed, and meanwhile, a backward scattering light signal can be generated in the symmetrical uniform micro-nano optical fiber array 2. The optical evanescent field outside the optical fiber of the symmetrical uniform micro-nano optical fiber array 2 is very sensitive to micro stress change. As shown in fig. 2, when the stress analysis system is subjected to a normal pressure acting field or a sliding shear force acting field, the optical fiber array is acted in the X and Y directions, the optical fibers are arranged into an array type structure at this time, the change of the optical evanescent field under the action of stress can be effectively coupled into the adjacent optical fibers, the intensity distribution of the planar optical field with acting stress as the center is formed, and the visual monitoring of the stress acting field can be realized. The changed transmission light signal is received by the optical signal transceiver module 3 after passing through the coupler B6 and the conducting optical fiber B7, meanwhile, the backward scattered optical signal is received by the optical signal transceiver module 3 after passing through the coupler A5 and the conducting optical fiber A4, the frequency shift amount of the backward scattered optical signal is used for analysis, the signal analysis is completed by combining Raman scattering and Brillouin scattering, and the action position of stress is calculated; meanwhile, the magnitude and the spatial distribution of the stress are calculated by combining the analysis of the intensity and the phase of the forward transmission light.
Because the structure is a symmetrical structure with micro-nano size, the structure is easier to deform under the action of external force, and the sensitivity is relatively high. In addition, the array is packaged by adopting PDMS (polydimethylsiloxane), so that the cost is low, the use is simple, and the likeSilicon waferThe adhesive has the characteristics of good adhesion, good chemical inertness and the like, excellent performance, difficult chemical reaction with other substances, good electrical insulation, weather resistance and hydrophobicity, high shear resistance and high durability. In the aspect of temperature adaptation, the temperature-resistant heat-insulating material can be used for a long time at the temperature of-50 ℃ to 200 ℃, has wide temperature tolerance range and can be suitable for different temperature environments.
In practical application, after being packaged by the polymer PDMS, the flexibility of the structure can be enhanced, the dissipation of a light path is reduced, and the accurate stress positioning analysis can accurately know the stress of the current part so as to perform rapid analysis on a target. Due to the characteristics of small volume and the like, the structure can be embedded into a microchip, so that the structure can be directly worn on the fingers or shoulders of a human body or implanted into cell tissues of the human body, and the development of a human-computer interaction technology is promoted.
Claims (5)
1. A micro-nano optical fiber array stress positioning analysis system is characterized by comprising a triggering device and a signal receiving, transmitting and processing device; the trigger device comprises a plane substrate (1), a symmetrical uniform micro-nano optical fiber array (2), a dot matrix substrate (9) and a pressure contact (10); the planar substrate (1) and the lattice substrate (9) are oppositely arranged, the symmetrical uniform micro-nano fiber array (2) is installed on the planar substrate (1), and the pressure contacts (10) are uniformly distributed on one side of the lattice substrate (9) opposite to the symmetrical uniform micro-nano fiber array (2); the pressure contacts are uniformly distributed along each optical fiber on the symmetrical uniform micro-nano optical fiber array (2); the signal receiving, transmitting and processing device comprises an optical signal receiving and transmitting module (3) and a signal processing module (8); the symmetrical uniform micro-nano optical fiber array (2) is communicated with the optical signal transceiving module (3) through a coupler and a conducting optical fiber to form an optical signal transceiving passage, and the optical signal transceiving module (3) is communicated with the signal processing module (8); the symmetrical uniform micro-nano optical fiber array (2) is made of silicon dioxide, the diameter of the symmetrical uniform micro-nano optical fiber array is 1 mu m, and an optical evanescent field can be excited outside the micro-nano optical fiber; the optical fibers are arranged in a right-angle S shape, and the distance between the optical fibers is 5 mm;
the working flow of the system is as follows: after an optical signal sent by the optical signal transceiving module (3) enters the symmetrical uniform micro-nano optical fiber array (2), an external force applied to the lattice substrate (9) is transferred to the pressure contact (10), and the pressure contact (10) acts on the symmetrical uniform micro-nano optical fiber array (2) downwards, so that the strength and the phase of a forward transmission optical signal of an optical fiber at a corresponding position in the symmetrical uniform micro-nano optical fiber array (2) and the frequency movement amount of a backward scattering optical signal are changed, and then the forward transmission optical signal is transmitted back to the signal transceiving module (3) and signal analysis is completed by the signal processing module (8), and the effect of stress positioning analysis is achieved.
2. The micro-nano optical fiber array stress positioning analysis system according to claim 1, wherein the planar substrate (1) is encapsulated by PDMS.
3. The micro-nano optical fiber array stress positioning analysis system according to claim 2, wherein the planar substrate (1) is encapsulated by PDMS and has a thickness of 1 mm.
4. The micro-nano optical fiber array stress positioning analysis system according to claim 1, wherein the signal processing module (8) completes signal analysis by combining Raman scattering and Brillouin scattering through the frequency movement amount of a backward scattering light signal, and calculates the action position of stress; meanwhile, the action magnitude and the spatial distribution of the stress are calculated by combining the intensity and the phase of the forward transmission light.
5. The micro-nano optical fiber array stress positioning analysis system according to claim 1, wherein the lattice substrate (9) is made of polyimide, the thickness of the lattice substrate is 1mm, and the pressure contact (10) is made of silicon.
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| DE4202185A1 (en) * | 1992-01-28 | 1993-07-29 | Hilti Ag | METHOD FOR FIBER OPTICAL FORCE MEASUREMENT |
| US7295724B2 (en) * | 2004-03-01 | 2007-11-13 | University Of Washington | Polymer based distributive waveguide sensor for pressure and shear measurement |
| CN102636302A (en) * | 2012-03-10 | 2012-08-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | Light beam array membrane stress measuring device |
| US20160327442A1 (en) * | 2015-05-05 | 2016-11-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical fiber strain sensor system and method |
| CN109932112B (en) * | 2019-02-20 | 2021-05-07 | 天津大学 | Two-dimensional surface array force touch sensing method based on optical fiber distributed sensing |
| CN111487000B (en) * | 2020-04-21 | 2021-10-15 | 东北大学 | Vector stress meter based on micro-nano multi-core special optical fiber |
| CN112229549B (en) * | 2020-09-03 | 2021-12-28 | 山东科技大学 | Intelligent optical fiber touch sounding system and method |
| CN112414596A (en) * | 2020-10-26 | 2021-02-26 | 合肥健天电子有限公司 | Optical fiber sensor, system and monitoring method |
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