CN113086939A

CN113086939A - MEMS device, method of manufacturing the same, and integrated MEMS using the same

Info

Publication number: CN113086939A
Application number: CN202011535133.0A
Authority: CN
Inventors: 张恒中; 黄芝杰; 蔡智雅; 林靖渊
Original assignee: Industrial Technology Research Institute ITRI
Current assignee: Industrial Technology Research Institute ITRI
Priority date: 2019-12-23
Filing date: 2020-12-23
Publication date: 2021-07-09
Anticipated expiration: 2040-12-23
Also published as: TWI765489B; TW202124254A; CN113086937B; CN113086937A; CN113086939B

Abstract

The invention discloses a micro-electromechanical system device, a manufacturing method thereof and an integrated micro-electromechanical system using the same, wherein the micro-electromechanical system device comprises a substrate, and the substrate is provided with at least one contact. The MEMS device also includes a first dielectric layer disposed on the substrate. The MEMS device further comprises at least one metal layer disposed on the first dielectric layer, wherein at least a portion of the metal layer is electrically connected to the contact. The MEMS device comprises a second dielectric layer disposed on the first dielectric layer and the metal layer and having a groove structure. The MEMS device also includes a structural layer disposed on the second dielectric layer and having an opening. The opening is arranged corresponding to the groove structure, and the sectional area of the bottom of the opening is smaller than that of the top of the groove structure. The MEMS device further comprises a filling layer at least partially disposed in the opening and the groove structure. The second dielectric layer, the structural layer and the filling layer define a cavity.

Description

MEMS device, method of manufacturing the same, and integrated MEMS using the same

Technical Field

The present invention relates to a Micro Electro Mechanical System (MEMS) device, a method of manufacturing the same, and an integrated MEMS using the same, and more particularly, to a MEMS device having good sealing quality, a method of manufacturing the same, and an integrated MEMS using the same.

Background

Microelectromechanical Systems (MEMS) devices typically include mechanical elements (fixed and/or movable) to sense a physical condition, such as force, acceleration, pressure, temperature, or vibration, and electronic elements to process electrical signals. Therefore, MEMS devices are often used as sensors and are widely used in applications such as automotive systems, inertial guidance systems, home appliances, protection systems for various devices, and many other industrial, scientific, and engineering systems.

Existing MEMS devices, while generally satisfactory in every respect, are not satisfactory. For example, when the MEMS device is used as a pressure sensor, it may be necessary to provide a hermetic cavity, and thus a good sealing quality is required. However, in order to achieve this, problems such as too long manufacturing process time and complicated manufacturing process may occur in manufacturing the conventional MEMS device.

Disclosure of Invention

In some embodiments of the present invention, by providing the groove structure in the dielectric layer and providing the opening corresponding to the groove structure in the structural layer, the filling layer (i.e. the structure for sealing the hole) can be continuously and uniformly filled in the opening and the groove structure to complete the sealing of the hole. The micro-electro-mechanical system device and the manufacturing method thereof can effectively prevent the generation of a sealing seam (seam) and a hollow structure, thereby improving the sealing quality and the overall stability. In addition, complex manufacturing process is not needed, the manufacturing process time can be effectively shortened, and the cost is reduced.

Embodiments of the invention include a microelectromechanical systems device. The MEMS device includes a substrate having at least one contact. The MEMS device also includes a first dielectric layer disposed on the substrate. The MEMS device further comprises at least one metal layer disposed on the first dielectric layer, wherein at least a portion of the metal layer is electrically connected to the contact. The MEMS device comprises a second dielectric layer disposed on the first dielectric layer and the metal layer and having a groove structure. The MEMS device also includes a structural layer disposed on the second dielectric layer and having an opening. The opening is arranged corresponding to the groove structure, and the sectional area of the bottom of the opening is smaller than that of the top of the groove structure. The MEMS device further comprises a filling layer disposed in the opening and the groove structure. The second dielectric layer, the structural layer and the filling layer define a cavity.

Embodiments of the invention include a method of manufacturing a microelectromechanical systems device. The method for manufacturing the MEMS device comprises providing a substrate having at least one contact. The method of fabricating the MEMS device also includes forming a first dielectric layer on the substrate. The first dielectric layer has at least one via exposing a portion of the top surface of the contact. The method of fabricating the MEMS device further comprises forming at least one metal layer on the first dielectric layer. At least a portion of the metal layer is electrically connected to the contact. The method of fabricating the MEMS device includes forming a second dielectric layer on the first dielectric layer and the metal layer. The second dielectric layer has a groove structure. The method also includes forming a sacrificial layer on the second dielectric layer and in the recess structure. The method further includes forming a structural layer on the second dielectric layer and the sacrificial layer. The method for manufacturing the MEMS device comprises removing a portion of the structural layer to form an opening exposing the sacrificial layer in the groove structure. The method of fabricating the MEMS device also includes removing the sacrificial layer to expose the recess structure. The cross-sectional area of the bottom of the opening is smaller than the cross-sectional area of the top of the groove structure. The method further includes forming a fill layer in the opening and the trench structure. At least part of the filling layer is formed in the opening and the groove structure, and the second dielectric layer, the structural layer and the filling layer define a cavity.

Embodiments of the invention include a method of manufacturing a microelectromechanical systems device. The method for manufacturing the MEMS device comprises providing a substrate having at least one contact. The method of fabricating the MEMS device also includes forming a first dielectric layer on the substrate. The first dielectric layer has at least one via exposing a portion of the top surface of the contact. The method further includes forming at least a first metal layer on the first dielectric layer. At least a portion of the first metal layer is electrically connected to the contact. In addition, the method of fabricating the MEMS device includes forming a second dielectric layer on the first dielectric layer and the first metal layer. The method of fabricating the MEMS device also includes forming a sacrificial layer on the second dielectric layer. The method further includes forming a structural layer over the second dielectric layer and the sacrificial layer. Furthermore, the method of fabricating the MEMS device includes removing a portion of the structural layer to form a first opening exposing a portion of the top surface of the sacrificial layer. The method also includes removing a portion of the sacrificial layer through the first opening to form a second opening that exposes a portion of the top surface of the second dielectric layer. The method further includes removing a portion of the second dielectric layer through the second opening to form a recess structure. The cross-sectional area of the bottom of the first opening is smaller than the cross-sectional area of the top of the groove structure. In addition, the method of fabricating the MEMS device includes removing the sacrificial layer. The method of fabricating the MEMS device also includes forming a fill layer. At least part of the filling layer is formed in the second opening and the groove structure, and the second dielectric layer, the structural layer and the filling layer define a cavity.

Embodiments of the present invention include an integrated mems. The integrated mems comprises a plurality of the aforementioned mems devices. MEMS devices share the same substrate.

Drawings

The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be noted that the various features are not drawn to scale and are merely illustrative examples. In fact, the dimensions of the elements may be exaggerated or minimized to clearly illustrate the technical features of the embodiments of the present invention.

FIGS. 1-8 are schematic cross-sectional views of some embodiments illustrating various stages in the manufacture of a MEMS device;

FIG. 9 is a schematic cross-sectional view of another embodiment showing a groove structure;

FIG. 10 is a schematic cross-sectional view of a groove structure according to yet another embodiment;

FIG. 11 is a cross-sectional schematic diagram of a MEMS device, according to some embodiments;

FIGS. 12-22 are schematic cross-sectional views of some embodiments at various stages in the manufacture of an integrated MEMS;

FIG. 23 is a partial top view of an integrated MEMS;

FIGS. 24-25 are schematic cross-sectional views of some other embodiments at various stages in the manufacture of an integrated MEMS;

fig. 26-29 are cross-sectional views of some other embodiments at various stages in the manufacture of an integrated mems.

Description of the symbols

1: integrated micro-electromechanical system

100,102,106,108,110 MEMS device

10 base plate

12 contact point

20 first dielectric layer

20H through hole

30 metal layer

31 first part

32 second part

40 second dielectric layer

40T top surface

42, 42', 44,46 groove structure

42E,44E tip

42S,44S,46S side wall

42TA Cross-sectional area of the tip

50 sacrificial layer

50R remaining portion of sacrificial layer

50T top surface

52, 52': opening

60 structural layer

60B the bottommost surface of the structural layer

60E1,60E2 end

60T top surface

62 opening of

62BA base cross-sectional area

62TA area of the top

621,622 side wall

64 opening of the container

70 filling layer

72 opening of the container

80 cavity of the container

90 metal layer

90-1 part (a)

90-2 second part

92 third dielectric layer

94 opening

96 metal layer

96-1 part with

96-2 part (a)

D is the direction

d1, d2 distance

g is height

Angle of theta

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. The following disclosure describes specific examples of components and arrangements thereof to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if embodiments of the present invention describe a first feature formed on or above a second feature, that is, embodiments that may include the first feature in direct contact with the second feature, embodiments may also include additional features formed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact.

It should be understood that additional operational steps may be performed before, during, or after the method, and that in other embodiments of the method, portions of the operational steps may be replaced or omitted.

Furthermore, spatially relative terms, such as "under …," "under," "lower," "above …," "over," "upper," and the like, may be used herein to facilitate describing the relationship of one element(s) or feature to another element(s) or feature in the drawings and include different orientations of the device in use or operation and the orientation depicted in the drawings. When the device is turned to a different orientation (rotated 90 degrees or otherwise), the spatially relative adjectives used herein will also be interpreted in terms of the turned orientation.

In the specification, the terms "about", "approximately", "substantial" and "approximately" generally mean within 20%, or within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The quantities given herein are approximate quantities, i.e., the meanings of "about", "about" and "about" are intended to be implied unless otherwise indicated.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The various embodiments disclosed below may repeat reference numerals and/or signs. These iterations are for simplicity and clarity and are not intended to limit the particular relationship between the various embodiments and/or configurations discussed.

Fig. 1-8 are cross-sectional schematic diagrams illustrating various stages in the fabrication of a mems device 100, according to some embodiments. It is to be noted that some parts may be omitted in fig. 1 to 8 in order to more clearly show the features of the embodiment of the present invention.

Referring to fig. 1, first, a substrate 10 is provided, and the substrate 10 may have at least one contact 12. In some embodiments, the substrate 10 may comprise silicon, but the embodiments of the invention are not limited thereto. For example, in some other embodiments, the substrate 10 may comprise some other elemental semiconductor (e.g., germanium). The substrate 10 may also contain a compound semiconductor (e.g., silicon carbide, gallium arsenide, indium arsenide, or indium phosphide). The substrate 10 may also include an alloy semiconductor (e.g., germanium silicide, silicon germanium carbide (sic), gallium arsenide phosphide (gaas), or indium gallium phosphide (ingan)).

In some embodiments, the substrate 10 may comprise a Semiconductor On Insulator (SOI), such as: silicon on insulator or germanium on insulator. The substrate comprising a semiconductor on insulator may comprise a base plate, a buried oxide layer disposed on the base plate, and a semiconductor layer disposed on the buried oxide layer. In some embodiments, the substrate 10 may include a single crystal substrate, a multi-layer substrate (multi-layer substrate), other suitable substrates, or a combination thereof, but the embodiments of the invention are not limited thereto.

In some embodiments, the substrate 10 may include a P-type dopant such as boron, aluminum, gallium, indium, thallium, or an N-type dopant such as arsenic, phosphorus, antimony. These dopants may form doped regions in the substrate 10, which may, for example, form a portion of the contacts 12, although the embodiments of the invention are not limited thereto. In some embodiments, the substrate 10 may be considered a chip (chip) of the MEMS device 100.

Referring to fig. 1, next, a first dielectric layer 20 is formed on the substrate 10. In some embodiments, the material of the first dielectric layer 20 may include an oxide such as silicon oxide, a nitride such as silicon nitride, other suitable materials, or a combination thereof, but the embodiments of the invention are not limited thereto. In some embodiments, the first dielectric layer 20 may be deposited on the substrate 10 by a deposition process, which may include Metal Organic Chemical Vapor Deposition (MOCVD), Atomic Layer Deposition (ALD), Molecular Beam Epitaxy (MBE), Liquid Phase Epitaxy (LPE), similar process, or a combination thereof, but the embodiments of the invention are not limited thereto.

Referring to fig. 2, at least one via 20H is formed in the first dielectric layer 20, and the via 20H may be disposed corresponding to the contact 12 and expose a portion of the top surface of the contact 12. In some embodiments, a patterning process may be performed on the first dielectric layer 20 to form the via 20H. For example, a mask layer (not shown) may be disposed on the first dielectric layer 20, and then an etching process is performed using the mask layer as an etching mask to etch the first dielectric layer 20 into the via hole 20H. In some embodiments, the mask layer may comprise a photoresist, such as a positive photoresist (positive photoresist) or a negative photoresist (negative photoresist). The mask layer may be a single layer or a multi-layer structure. The formation of the mask layer may include a deposition process, a photolithography process, other suitable processes, or a combination thereof, but the embodiment of the invention is not limited thereto.

In some embodiments, the deposition process comprises spin-on coating (spin-on), Chemical Vapor Deposition (CVD), atomic layer deposition, similar processes, or combinations thereof. In some embodiments, the photolithography process may include photoresist coating (e.g., spin coating), soft baking (soft baking), mask alignment (mask alignment), exposure (exposure), post-exposure baking (PEB), development (leveling), cleaning (drying), drying (e.g., hard baking), other suitable processes, or a combination thereof, but the embodiments of the invention are not limited thereto.

In some embodiments, the etching process may include a dry etching process, a wet etching process, or a combination thereof. For example, the dry etching process may include Reactive Ion Etching (RIE), Inductively Coupled Plasma (ICP) etching, Neutron Beam Etching (NBE), Electron Cyclotron Resonance (ECR) etching, a similar etching process, or a combination thereof, but the embodiment of the invention is not limited thereto.

Referring to fig. 2, a metal layer 30 is formed on the first dielectric layer 20, wherein at least a portion of the metal layer 30 is electrically connected to the contact 12. Specifically, as shown in fig. 2, the metal layer 30 includes a first portion 31 and a second portion 32, the first portion 31 directly contacts the contact 12 through the via 20H of the first dielectric layer 20, and the second portion 32 is separated from the contact 12 by the first dielectric layer 20. That is, the first portion 31 of the metal layer 30 can be electrically connected to the contact 12, and the second portion 32 of the metal layer 30 can be electrically insulated from the contact 12, but the embodiment of the invention is not limited thereto. For example, the first portion 31 of the metal layer 30 may be used to electrically connect the contact 12 with a subsequently formed structure.

In some embodiments, the material of the metal layer 30 may include gold (Au), nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), copper (Cu), other suitable materials, alloys thereof, or combinations thereof, but the embodiments of the invention are not limited thereto. In some embodiments, the metal material may be formed on the first dielectric layer 20 by physical vapor deposition, chemical vapor deposition, atomic layer deposition, evaporation (evaporation), sputtering (sputtering), similar manufacturing processes, or a combination thereof, but the embodiment of the invention is not limited thereto. Next, a patterning process is performed on the metal material to form a first portion 31 and a second portion 32 of the metal layer 30 as shown in fig. 2. The patterning process is similar to the above, and thus is not described in detail.

Referring to fig. 3, a second dielectric layer 40 is formed on the first dielectric layer 20 and the metal layer 30, wherein the second dielectric layer 40 has a recess structure 42. Similarly, the material of the second dielectric layer 40 may include an oxide such as silicon oxide, a nitride such as silicon nitride, other suitable materials, or a combination thereof, but the embodiments of the invention are not limited thereto. In some embodiments, the material of the second dielectric layer 40 may be the same as or different from that of the first dielectric layer 20, depending on the actual requirement. In some embodiments, the second dielectric layer 40 may be deposited on the first dielectric layer 20 and the metal layer 30 by a deposition process, which is exemplary as described above and thus not described herein. In addition, the second dielectric layer 40 may be subjected to a patterning process to form the groove structure 42. For example, a mask layer (not shown) may be disposed on the second dielectric layer 40, and then an etching process may be performed using the mask layer as an etching mask to form the groove structure 42. In some embodiments, the etching process may include a dry etching process, a wet etching process, or a combination thereof.

As shown in fig. 3, in some embodiments, the recess structure 42 of the second dielectric layer 40 may expose a portion of the top surface of the first dielectric layer 20, but the embodiment of the invention is not limited thereto. In some embodiments, the recess structure 42 may also be disposed above the first dielectric layer 20 without exposing the first dielectric layer 20; alternatively, the groove structure 42 may also expose a portion of the top surface of the second portion 32 of the metal layer 30, which may depend on the actual requirement.

In some embodiments, the sidewalls 42S of the recess structure 42 may be substantially perpendicular to the top surfaces of the first dielectric layer 20 and the second dielectric layer 40, but the embodiment of the invention is not limited thereto. In the embodiment shown in fig. 3, the groove structure 42 may have a constant cross-sectional area. That is, the cross-sectional area of the trench structure 42 at different depths may be substantially the same as the cross-sectional area 42TA of the top of the trench structure 42, but the embodiment of the invention is not limited thereto.

Referring to fig. 4, a sacrificial layer 50 is formed on the second dielectric layer 40 and in the recess structure 42. Specifically, the sacrificial layer 50 may be formed on the bottom surface and a portion of the sidewalls 42S of the recess structure 42 and on a portion of the top surface of the second dielectric layer 40. In some embodiments, the material of the sacrificial layer 50 may include silicon oxide, photoresist, polyimide (polyimide), germanium, other suitable materials, or combinations thereof, but the embodiments of the invention are not limited thereto. In some embodiments, the sacrificial layer 50 and the first dielectric layer 20, the metal layer 30, and the second dielectric layer 40 may have a high etch selectivity. Therefore, the first dielectric layer 20, the metal layer 30 and the second dielectric layer 40 can be prevented from being damaged in the subsequent process of removing the sacrificial layer 50. In some embodiments, the sacrificial layer 50 may be formed on the second dielectric layer 40 and in the recess structure 42 by a deposition process, which is exemplary as described above and thus not described herein.

Referring to fig. 5, a structural layer 60 is formed on the second dielectric layer 40 and the sacrificial layer 50. Specifically, the structure layer 60 may be formed on the top surface of the second dielectric layer 40 and the top surface of the sacrificial layer 50, and fill the remaining space of the groove structure 42. In some embodiments, the material of the structural layer 60 may include polysilicon, epitaxial silicon, silicon germanium, other suitable semiconductor materials, or a combination thereof, but the embodiments of the invention are not limited thereto. In some embodiments, the structure layer 60 and the sacrificial layer 50 may also have a high etching selectivity. In some embodiments, the structural layer 60 may be formed on the second dielectric layer 40 and the sacrificial layer 50 and in the groove structure 42 by a deposition process, which is exemplary as described above and thus not repeated herein. In some embodiments, the structural layer 60 can be considered a portion of a microelectromechanical substrate.

Referring to FIG. 6, a portion of the structural layer 60 is removed to form an opening 62. Specifically, the opening 62 corresponds to the groove structure 42 (i.e., the opening 62 is located above the groove structure 42), and the opening 62 may expose the sacrificial layer 50 located in the groove structure 42. In some embodiments, a patterning process may be performed on the structure layer 60 to form the opening 62. For example, a mask layer (not shown) may be disposed on the structural layer 60, and then a dry etching process is performed using the mask layer as an etching mask to form the opening 62 in the structural layer 60. Here, the etching gas used in the dry etching process includes, for example, CF₄、O₂、SF₆、C₄F₈、Ar、Cl₂、BCl₃Other suitable etching gases, or combinations thereof, but the embodiments of the invention are not limited thereto.

Referring to fig. 7, the sacrificial layer 50 is removed. Specifically, the sacrificial layer 50 in the recess structure 42 and between the second dielectric layer 40 and the structural layer 60 is removed to expose the recess structure 42. For example, the sacrificial layer 50 may be subjected to a wet etching process,to remove the sacrificial layer 50. Here, the etching solution used in the wet etching process includes, for example, sulfuric acid (H)₂SO₄) Phosphoric acid (H)₃PO₄) Hydrofluoric acid (HF), hydrogen peroxide (H)₂O₂) Ammonia water (NH)₄OH), etc., but the embodiments of the present invention are not limited thereto. Since the sacrificial layer 50 has a high etching selectivity with respect to the first dielectric layer 20, the metal layer 30, the second dielectric layer 40 and the structural layer 60, the first dielectric layer 20, the metal layer 30, the second dielectric layer 40 and the structural layer 60 are prevented from being damaged during the process of removing the sacrificial layer 50. In some embodiments, portions of the sacrificial layer 50 may also be retained. For example, as shown in fig. 7, the remaining sacrificial layer 50 can be regarded as a sacrificial layer remaining portion 50R, and the sacrificial layer remaining portion 50R is located between the second dielectric layer 40 and the structural layer 60, but the embodiment of the invention is not limited thereto. In some other embodiments, the sacrificial layer 50 may be completely removed.

As shown in fig. 7, in some embodiments, the cross-sectional area 62BA of the bottom of opening 62 is less than the cross-sectional area of the top 42TA of recess structure 42. Since the sacrificial layer 50 occupies a part of the space between the second dielectric layer 40 and the structural layer 60 in the previous step, the sidewall 621 of the opening 62 and the bottom-most portion of the sidewall 622 are not located on the same plane after the sacrificial layer 50 is removed. Here, the bottommost surface 60B of the structural layer 60 is extended, and the sidewall 621 of the opening 62 is extended, and the cross-sectional area of the bottommost portion of the space surrounded by the two extended surfaces and the sidewall 622 of the opening 62 can be defined as the cross-sectional area 62BA (shown in fig. 7) of the bottom of the opening 62.

As shown in fig. 7, in some embodiments, the cross-sectional area 62BA of the bottom of the opening 62 is smaller than the cross-sectional area 62TA of the top of the opening 62. Specifically, the cross-sectional area of the opening 62 at different depths is not constant, and may be continuously variable. For example, as shown in fig. 7, in the cross section at this stage, the sidewall 621 and the sidewall 622 of the opening 62 may be two slopes, but the embodiment of the invention is not limited thereto.

Referring to fig. 8, a filling layer 70 is formed to form a mems device 100 according to an embodiment of the invention. Specifically, at least a portion of the filling layer 70 may be formed in the opening 62 and the groove structure 42, i.e., the space between the opening 62 and the groove structure 42 may be continuously formed and filled, so that the second dielectric layer 40, the structure layer 60 and the filling layer 70 may define a cavity 80. In other words, the cavity 80 may partially or completely replace the space originally occupied by the sacrificial layer 50 between the second dielectric layer 40 and the structural layer 60. That is, the cavity 80 is located between the second dielectric layer 40, the structural layer 60 and the filling layer 70. Furthermore, as shown in fig. 8, in some embodiments, the cavity 80 is located between the second dielectric layer 40, the sacrificial layer remaining portion 50R, the structural layer 60 and the filling layer 70, and thus, the height g of the cavity 80 may be substantially equal to the thickness of the sacrificial layer remaining portion 50R.

In some embodiments, the material of the filling layer 70 may include silicon oxide, silicon nitride, photoresist, polyimide, other suitable materials, or a combination thereof, but the embodiments of the invention are not limited thereto. In some embodiments, a filling layer 70 may be formed in the opening 62 and the groove structure 42 by a deposition process, which is exemplary as described above and thus not described in detail. Here, the filling layer 70 may be regarded as a hole sealing structure of the mems device 100. In addition, as shown in fig. 8, a partial filling layer 70 may also be formed on the structural layer 60, but the embodiment of the invention is not limited thereto.

As shown in fig. 8, in some embodiments, the recess structure 42 exposes a portion of the top surface of the first dielectric layer 20, so that the filling layer 70 can directly contact the first dielectric layer 20, but the embodiment of the invention is not limited thereto. In other embodiments, the recess structure 42 may be disposed above the first dielectric layer 20 without exposing the first dielectric layer 20, so that the filling layer 70 may directly contact the second dielectric layer 40.

In a typical mems device without a groove structure, a sealing seam is easily formed in the process of forming (depositing) the filling layer 70 because the forming (depositing) speed of the portion corresponding to the center of the opening 62 is faster than the forming (depositing) speed of the portion away from the center of the opening 62. In contrast, since the mems device 100 of the embodiment of the invention includes the groove structure 42 corresponding to the opening 62, the generation of the sealing seam can be effectively prevented.

Furthermore, in some embodiments of the present invention, since the cross-sectional area 62BA at the bottom of the opening 62 is smaller than the cross-sectional area 62TA at the top of the opening 62, the filling layer 70 can be formed in the opening 62 more uniformly, and the hollow structure caused by early closing before the filling layer 70 fills the trench structure 42 and the opening 62 is avoided.

Therefore, in the mems device 100 according to the embodiment of the invention, the filling layer 70 (i.e. the structure for sealing the hole) can continuously and uniformly fill the opening 62 and the groove structure 42 by disposing the groove structure 42 in the second dielectric layer 40 and disposing the opening 62 corresponding to the groove structure 42 in the structure layer 60, so as to complete the sealing. That is, the mems device 100 and the method for manufacturing the same according to the embodiments of the invention can effectively prevent the generation of the sealing seams and the hollow structures, thereby improving the sealing quality and the overall stability of the mems device 100. In addition, complex manufacturing process is not needed, the manufacturing process time can be effectively shortened, and the cost is reduced.

As shown in fig. 8, in some embodiments, the projection of the opening 62 of the structure layer 60 in the groove structure 42 has an end portion 60E1 (or 60E2), and the shortest distance D1 (or D2) between the end portion 60E1 (or 60E2) and the top end 42E of the groove structure 42 in the direction D parallel to the top surface of the second dielectric layer 40 (or the bottom-most surface 60B of the structure layer 60) is greater than or equal to the thickness of the sacrificial layer 50 (or the remaining portion 50R of the sacrificial layer) (i.e., the height g of the cavity 80), which is not limited by the embodiment of the present invention. In the embodiment of the invention, the shortest distance D1 (or D2) between the end portion 60E1 (or 60E2) and the top end 42E of the groove structure 42 in the direction D parallel to the top surface of the second dielectric layer 40 (or the bottom-most surface 60B of the structure layer 60) can be adjusted according to the depth of the groove structure 42, which is not described herein again.

In the above embodiments, the sidewall 42S of the groove structure 42 is substantially perpendicular to the top surfaces of the first dielectric layer 20 and the second dielectric layer 40, but the embodiment of the invention is not limited thereto. Fig. 9 is a schematic cross-sectional view of a groove structure 44 according to another embodiment. Meanwhile, in order to show the features of the groove structure 44 more clearly, other parts adjacent to the groove structure 44 are also illustrated in fig. 9.

Referring to fig. 9, the sidewalls 44S of the recess structure 44 are not perpendicular to the top surface of the second dielectric layer 40. In some embodiments, the angle θ between the top surface of the second dielectric layer 40 and the sidewall 44S of the groove structure 44 may be between 90 and 150 degrees, but the embodiment of the invention is not limited thereto. When the angle θ between the top surface of the second dielectric layer 40 and the sidewall 44S of the groove structure 44 is 90 degrees, the sidewall 44S of the groove structure 44 is substantially perpendicular to the top surface of the second dielectric layer 40.

Similarly, the projection of the opening 62 of the structure layer 60 in the groove structure 44 has an end portion 60E1 (or 60E2), and the shortest distance D1 (or D2) between the end portion 60E1 (or 60E2) and the top end 44E of the groove structure 44 in the direction D parallel to the top surface of the second dielectric layer 40 is greater than or equal to the thickness of the sacrificial layer 50 (or the remaining sacrificial layer portion 50R) (i.e., the height g of the cavity 80), which is not repeated herein.

Fig. 10 is a schematic cross-sectional view of a groove structure 46 according to yet another embodiment. Referring to fig. 10, the sidewall 46S of the groove structure 46 may have a curvature. The embodiments of fig. 9 and fig. 10 show different examples of the groove structure according to the embodiments of the present invention, but the groove structure according to the embodiments of the present invention can be formed in other shapes according to actual requirements.

FIG. 11 is a cross-sectional schematic diagram illustrating a MEMS device 102, according to some embodiments. The structure and manufacturing method of the mems device 102 shown in fig. 11 are similar to the mems device 100 shown in fig. 8, except that the groove structure 42 of the mems device 102 exposes a portion of the top surface of the second portion 32 of the metal layer 30, so that the filling layer 70 can directly contact a portion of the metal layer 30 (i.e., the second portion 32 of the metal layer 30), but the embodiment of the invention is not limited thereto.

Fig. 12-22 are cross-sectional schematic diagrams illustrating various stages in the manufacture of an integrated mems 1, according to some embodiments. Fig. 23 is a partial top view of integrated mems 1. Similarly, some components may be omitted from fig. 1-23 in order to more clearly show the features of the embodiments of the present invention.

In some embodiments of the present disclosure, integrated mems 1 may include multiple mems devices (e.g., mems device 106 and mems device 108). The MEMS devices may be similar to the MEMS device 100 shown in FIG. 8 or the MEMS device 102 shown in FIG. 11, and may be formed by the manufacturing method shown in FIGS. 1-8, but the embodiment of the invention is not limited thereto. Fig. 12-22 may present a different method of fabricating the mems device 106 and the mems device 108 than the embodiments shown in fig. 1-8.

Referring to fig. 12, first, a substrate 10 is provided, and the substrate 10 may have a plurality of contacts 12. Next, a first dielectric layer 20 is formed on the substrate 10. Examples of the materials and the forming methods of the substrate 10 and the first dielectric layer 20 are as described above, and will not be described herein.

Referring to fig. 13, a plurality of via holes 20H are formed in the first dielectric layer 20, and the via holes 20H may be disposed corresponding to the contacts 12 and expose portions of the top surfaces of the contacts 12. Next, a metal layer 30 is formed on the first dielectric layer 20, wherein at least a portion of the metal layer 30 is electrically connected to the contact 12. Specifically, as shown in fig. 13, the metal layer 30 includes a plurality of first portions 31 and a plurality of second portions 32, the first portions 31 are in direct contact with the contacts 12 through the vias 20H of the first dielectric layer 20, and the second portions 32 are separated from the contacts 12 through the first dielectric layer 20. That is, the first portion 31 of the metal layer 30 can be electrically connected to the contact 12, and the second portion 32 of the metal layer 30 can be electrically insulated from the contact 12, but the embodiment of the invention is not limited thereto. Examples of the materials and forming methods of the first dielectric layer 20 and the metal layer 30 are as described above, and are not repeated herein.

Referring to fig. 14, a second dielectric layer 40 is formed on the first dielectric layer 20 and the metal layer 30. Next, a sacrificial layer 50 is formed on the second dielectric layer 40. Similarly, the sacrificial layer 50 and the first dielectric layer 20, the metal layer 30 and the second dielectric layer 40 may have a high etching selectivity. Therefore, the first dielectric layer 20, the metal layer 30 and the second dielectric layer 40 can be prevented from being damaged in the subsequent process of removing the sacrificial layer 50. Examples of the materials and forming methods of the second dielectric layer 40 and the sacrificial layer 50 are as described above, and are not repeated herein.

Referring to fig. 15, a structural layer 60 is formed on the second dielectric layer 40 and the sacrificial layer 50. Similarly, the structural layer 60 and the sacrificial layer 50 may also have a high etching selectivity, and the structural layer 60 may be considered as a part of the microelectromechanical substrate. Examples of the material and the forming method of the structural layer 60 are as described above, and will not be described herein.

Referring to FIG. 16, a portion of the structural layer 60 is removed to form an opening 62. As shown in fig. 16, the opening 62 may expose a portion of the top surface 50T of the sacrificial layer 50. In some embodiments, a patterning process may be performed on the structural layer 60 to remove a portion of the structural layer 60 and form the opening 62. Examples of the patterning process are as described above, and are not described herein. In addition, as shown in fig. 16, the opening 64 may be formed simultaneously when the patterning process is performed on the structure layer 60. The opening 64 may expose a portion of the top surface 40T of the second dielectric layer 40, and the opening 64 may separate the subsequently formed mems device 106 from the mems device 108, but the embodiment of the invention is not limited thereto.

Referring to fig. 17, a portion of the sacrificial layer 50 is removed through the opening 62 to form an opening 52, the opening 52 exposing a portion of the top surface 40T of the second dielectric layer 40. For example, a patterning process may be performed on the sacrificial layer 50 to remove portions of the sacrificial layer 50 and form the openings 52. Examples of the patterning process are as described above, and are not described herein.

Referring to fig. 18, a portion of the second dielectric layer 40 is removed through the opening 52 to form a recess structure 42. For example, a patterning process (e.g., including a lateral etching process) may be performed on the second dielectric layer 40 to remove portions of the second dielectric layer 40 and form the recess structure 42. Examples of the patterning process are as described above, and are not described herein.

Referring to fig. 19, the sacrificial layer 50 is removed. For example, the sacrificial layer 50 may be subjected to a wet etching process to remove the sacrificial layer 50. The example of the wet etching process is as described above, and will not be described herein. Similarly, since the sacrificial layer 50 has a high etching selectivity to the first dielectric layer 20, the metal layer 30, the second dielectric layer 40 and the structural layer 60, the first dielectric layer 20, the metal layer 30, the second dielectric layer 40 and the structural layer 60 are prevented from being damaged during the process of removing the sacrificial layer 50. In the embodiment, the sacrificial layer 50 can be completely removed, but the embodiment of the invention is not limited thereto. In some other embodiments, portions of the sacrificial layer 50 may also be retained.

As shown in fig. 19, in some embodiments, the cross-sectional area 62BA of the bottom of opening 62 is less than the cross-sectional area of the top 42TA of recess structure 42. Further, in some embodiments, the cross-sectional area 62BA of the bottom of the opening 62 is less than the cross-sectional area 62TA of the top of the opening 62. Specifically, the cross-sectional area of the opening 62 at different depths is not constant, and may be continuously variable. For example, as shown in fig. 19, in the cross section at this stage, the sidewall 621 and the sidewall 622 of the opening 62 may be two slopes, but the embodiment of the invention is not limited thereto.

In the present embodiment, the sidewall 42S of the groove structure 42 is substantially perpendicular to the top surface 40T of the second dielectric layer 40 (and/or the top surface of the first dielectric layer 20), but the present invention is not limited thereto. In some other embodiments, the wet etching process may be adjusted (or controlled) to make the groove structure 42 similar to the groove structure 44 shown in fig. 9 or the groove structure 46 shown in fig. 10. The shape and depth of the groove structure 42 can be adjusted according to actual requirements.

Referring to fig. 20, a filling layer 70 is formed. Specifically, at least a portion of the filling layer 70 may be formed in the opening 62 and the groove structure 42, i.e., the space between the opening 62 and the groove structure 42 may be continuously formed and filled, so that the second dielectric layer 40, the structure layer 60 and the filling layer 70 may define a cavity 80. In other words, the cavity 80 may partially or completely replace the space originally occupied by the sacrificial layer 50 between the second dielectric layer 40 and the structural layer 60. That is, the cavity 80 is located between the second dielectric layer 40, the structural layer 60 and the filling layer 70. Examples of the material and the forming method of the filling layer 70 are as described above, and will not be described herein.

The filling layer 70 can be regarded as a sealing structure of the

mems devices

106 and 108. In addition, as shown in fig. 20, a part of the filling layer 70 may also be formed on the structural layer 60 and on a part of the top surface 40T of the second dielectric layer 40 exposed by the opening 64 and the sidewall of the opening 64, but the embodiment of the invention is not limited thereto.

As shown in fig. 20, in some embodiments, the recess structure 42 may be disposed above the first dielectric layer 20 without exposing the first dielectric layer 20, and thus the filling layer 70 may directly contact the second dielectric layer 40, but the embodiment of the invention is not limited thereto.

In a micro-electro-mechanical system (device) generally having no groove structure, in the process of forming (depositing) the filling layer 70, since the forming (depositing) speed of the portion corresponding to the center of the opening 62 is faster than that of the portion away from the center of the opening 62, the sealing joint is easily formed. In contrast, in the present embodiment, the groove structure 42 is formed through the opening 52, and the opening 52 is formed through the opening 62, so that the groove structure 42 can correspond to the opening 62. Therefore, the groove structure 42 can effectively prevent the generation of the sealing joint when the filling layer 70 is formed.

At this stage, the mems device 106 of the integrated mems 1 is completed. In some embodiments, the MEMS device 106 can be a pressure sensor, but the invention is not limited thereto. In the subsequent stages of fig. 21-22, this is done for the mems device 108.

Referring to fig. 21, in some embodiments, a portion of the fill layer 70 may be removed to form an opening 72, the opening 72 exposing a portion of the top surface 60T of the structural layer 60. For example, as shown in FIG. 21, a portion of the fill layer 70 where the MEMS device 108 is intended to be formed may be removed to form the opening 72, but the fill layer 70 where the MEMS device 106 is intended to be formed remains intact.

Next, a metal layer 90 may be formed on the filling layer 70, wherein at least a portion of the metal layer 90 is formed in the opening 72. Specifically, as shown in FIG. 21, the metal layer 90 may include a first portion 90-1 and a second portion 90-2, the first portion 90-1 directly contacts the structural layer 60 (i.e., the first portion 90-1 may be disposed in the opening 72), and the second portion 90-2 directly contacts the filling layer 70. The material and forming method of the metal layer 90 may be the same as or similar to those of the metal layer 30, and are not repeated herein.

Referring to fig. 22, in some embodiments, a third dielectric layer 92 may be formed on the filling layer 70 and the metal layer 90. Specifically, as shown in fig. 22, the third dielectric layer 92 may cover the filling layer 70 and the metal layer 90, but the embodiment of the invention is not limited thereto. Examples of the material and the forming method of the third dielectric layer 92 may be the same as or similar to those of the first dielectric layer 20 or the second dielectric layer 40, and are not repeated herein.

At this stage, the mems device 108 of the integrated mems 1 is completed. In some embodiments, the MEMS device 108 can be a temperature sensor (temperature sensor), but the invention is not limited thereto.

Referring to fig. 22 and 23, integrated mems 1 may include mems device 106 and mems device 108. The MEMS device 106 and the MEMS device 108 may share the same substrate 10. Additionally, MEMS device 106 can function as a pressure sensor, while MEMS device 108 can function as a temperature sensor. That is, according to some embodiments of the present invention, at least two different structural or functional mems devices may be formed simultaneously in the integrated mems 1. In contrast, in conventional mems, different mems devices need to be formed separately and then integrated with each other through another circuit board. Compared with the conventional mems, the manufacturing method of the embodiment of the invention can effectively reduce the overall size of the integrated mems 1 and simplify the manufacturing process steps.

It should be noted that the position and shape of the cavity 80 are not limited to those shown in fig. 23, and can be adjusted according to actual requirements.

Fig. 24-25 are schematic cross-sectional views of an integrated mems 1 at various stages of fabrication, according to some other embodiments. For example, the steps shown in fig. 24 to 25 may replace the steps shown in fig. 17 to 18, but the embodiment of the invention is not limited thereto. In addition, fig. 24-25 are only shown as a mems device, which may represent mems device 106 or mems device 108.

Referring to fig. 24, portions of the sacrificial layer 50 are removed through the openings 62 to form openings 52'. Here, the top area of the opening 52' is not equal to the bottom area of the opening 62. In this step, the position and depth of the subsequently formed recess structure are determined, for example, as shown in fig. 24, in the present embodiment, the opening 52' may expose a portion of the top surface 20T of the first dielectric layer 20, but the embodiment of the invention is not limited thereto.

Referring to fig. 25, a patterning process (e.g., including a lateral etching process) is performed on the second dielectric layer 40 through the opening 52 'to remove a portion of the second dielectric layer 40 and form a recess structure 42'. Next, the sacrificial layer 50 may be (partially or completely) removed and a filling layer 70 may be formed, following the steps of fig. 19 and 20. In the present embodiment, the recess structure 42' may expose a portion of the top surface of the first dielectric layer 20, and thus the filling layer 70 may directly contact the first dielectric layer 20, but the embodiment of the invention is not limited thereto.

Fig. 26-29 are schematic cross-sectional views of an integrated mems 1 at various stages of fabrication, according to some other embodiments. For example, the steps shown in fig. 26 to 29 may replace the steps shown in fig. 21 to 22, but the embodiment of the invention is not limited thereto. In addition, FIG. 29 shows only one MEMS device 110, and the MEMS device 110 can replace the MEMS device 106 or the MEMS device 108 shown in FIG. 22.

Referring to fig. 26, in some embodiments, a portion of the fill layer 70 may be removed to form an opening 72, the opening 72 exposing a portion of the top surface 60T of the structural layer 60. Next, a metal layer 90 may be formed on the filling layer 70, and the metal layer 90 is formed in the opening 72.

Referring to fig. 27, in some embodiments, a third dielectric layer 92 may be formed on the filling layer 70 and the metal layer 90. Specifically, as shown in fig. 27, the third dielectric layer 92 may cover the filling layer 70 and the metal layer 90, but the embodiment of the invention is not limited thereto.

Referring to fig. 28, in some embodiments, a portion of the third dielectric layer 92 may be removed to form an opening 94, and the opening 94 exposes a portion of the top surface 90T of the metal layer 90.

Next, a metal layer 96 may be formed on the third dielectric layer 92, wherein at least a portion of the metal layer 96 is formed in the opening 94. Specifically, as shown in fig. 28, the metal layer 96 may include a first portion 96-1 and a second portion 96-2, the first portion 96-1 is electrically connected to the metal layer 90 (i.e., the first portion 96-1 may be disposed in the opening 94 and directly contact the metal layer 90), and the second portion 96-2 is electrically insulated from the metal layer 90. Examples of the material and the forming method of the metal layer 96 may be the same as or similar to those of the metal layer 30 or the metal layer 90, and are not repeated herein.

Referring to FIG. 29, in some embodiments, a moisture-absorbing layer 98 can be formed on the second portion 96-2 of the metal layer 96 to form the MEMS device 110. In some embodiments, the material of the moisture absorption layer 98 may include LiCl, Se, Ge, TiO₂、ZnCr₂O₄、MgCr₂O₄、Al₂O₃Epoxy, porous metal oxide film, etc., but the present invention is not limited thereto. In some embodiments, the moisture absorption layer 98 may be formed on the second portion 96-2 of the metal layer 96 by a deposition process and a patterning process, but the embodiment of the invention is not limited thereto.

In some embodiments, the MEMS device 110 can be, for example, a humidity sensor (humidity sensor), but the invention is not limited thereto. In some other embodiments, the MEMS device 110 may be, for example, a gas sensor. For example, the sensing material of the gas sensor may comprise WO₃、SnO₂However, the embodiments of the present invention are not limited thereto. MEMS device 110 can replace at least one of MEMS device 106 and MEMS device 108 shown in FIG. 22, orBoth of these are stored in the integrated mems 1 shown in fig. 22. That is, in the embodiment of the present invention, the integrated mems 1 may integrate mems devices having different sensing functions.

In summary, in some embodiments of the invention, by providing the groove structure in the second dielectric layer and providing the opening corresponding to the groove structure in the structural layer, the filling layer (i.e. the structure for sealing the hole) can be continuously and uniformly filled in the opening and the groove structure, so as to complete the sealing of the hole. In addition, the micro-electro-mechanical system device and the manufacturing method thereof can effectively prevent the generation of hole sealing seams and hollow structures, thereby improving the hole sealing quality and improving the overall stability. In addition, complex manufacturing process is not needed, the manufacturing process time can be effectively shortened, and the cost is reduced.

Furthermore, according to some embodiments of the present invention, at least two different structural or functional mems devices may be formed simultaneously in the integrated mems 1. Compared with the traditional micro-electromechanical system, the manufacturing method of the embodiment of the invention can effectively reduce the whole size of the integrated micro-electromechanical system and simplify the manufacturing process steps.

The components of several embodiments are summarized above so that those skilled in the art can more easily understand the aspects of the embodiments of the present invention. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present invention should be subject to the definition of the appended claims. In addition, although the present invention has been disclosed in terms of several preferred embodiments, it is not intended to be limited thereto.

Reference throughout this specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present invention should be or are in any single embodiment of the invention. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, discussion of the features and advantages, and similar language, throughout this specification may, but do not necessarily, refer to the same embodiment.

Furthermore, the described features, advantages, and characteristics of the invention may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize, in light of the description herein, that the invention may be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the invention.

Claims

1. A microelectromechanical systems device, comprising:

a substrate having at least one contact;

a first dielectric layer disposed on the substrate;

at least one first metal layer disposed on the first dielectric layer, wherein at least a portion of the first metal layer is electrically connected to the contact;

a second dielectric layer disposed on the first dielectric layer and the first metal layer and having a groove structure;

a structural layer disposed on the second dielectric layer and having an opening, wherein the opening is disposed corresponding to the groove structure, and a cross-sectional area of a bottom of the opening is smaller than a cross-sectional area of a top of the groove structure; and

a filling layer at least partially disposed in the opening and the groove structure,

wherein the second dielectric layer, the structural layer and the filling layer define a cavity.

2. The mems device of claim 1, wherein the cross-sectional area of the bottom of the opening is smaller than the cross-sectional area of the top of the opening.

3. The mems device of claim 2, wherein the filler layer directly contacts the first dielectric layer or the second dielectric layer.

4. The microelectromechanical systems device of claim 2, further comprising:

the remaining part of the sacrificial layer is arranged between the second dielectric layer and the structural layer,

wherein the cavity is located between the second dielectric layer, the remaining portion of the sacrificial layer, the structural layer and the filling layer.

5. The mems device of claim 4, wherein the projection of the opening of the structural layer into the recess structure has an end portion, and the shortest distance between the end portion and the top end of the recess structure in a direction parallel to the top surface of the second dielectric layer is greater than or equal to the thickness of the remaining portion of the sacrificial layer.

6. The mems device of claim 2, wherein the angle between the top surface of the second dielectric layer and the sidewall of the recess structure is between 90 and 150 degrees.

7. The mems device of claim 2, wherein the sidewalls of the recess structure have a curvature.

8. The mems device of claim 2, wherein the first metal layer comprises a first portion and a second portion, the first portion being electrically connected to the contact, the second portion being electrically insulated from the contact.

9. The mems device of claim 8, wherein the filler layer directly contacts the second portion.

10. The mems device of claim 1, wherein a portion of the filler layer is disposed on the structural layer.

11. A method of manufacturing a microelectromechanical systems device, comprising:

providing a substrate, wherein the substrate is provided with at least one contact;

forming a first dielectric layer on the substrate, wherein the first dielectric layer has at least one via exposing a portion of the top surface of the contact;

forming at least one metal layer on the first dielectric layer, wherein at least a portion of the metal layer is electrically connected to the contact;

forming a second dielectric layer on the first dielectric layer and the metal layer, wherein the second dielectric layer has a groove structure;

forming a sacrificial layer on the second dielectric layer and in the groove structure;

forming a structural layer on the second dielectric layer and the sacrificial layer;

removing a portion of the structural layer to form an opening exposing the sacrificial layer in the recess structure;

removing the sacrificial layer to expose the groove structure, wherein the cross-sectional area of the bottom of the opening is smaller than that of the top of the groove structure; and

and forming a filling layer, wherein at least part of the filling layer is formed in the opening and the groove structure, and the second dielectric layer, the structural layer and the filling layer define a cavity.

12. The method of claim 11, wherein a cross-sectional area of a bottom of the opening is smaller than a cross-sectional area of a top of the opening.

13. The method of claim 12, wherein the filler layer directly contacts the first dielectric layer or the second dielectric layer.

14. The method of claim 12, wherein a projection of the opening of the structural layer into the recess structure has an end portion, and a shortest distance between the end portion and a top end of the recess structure in a direction parallel to a top surface of the second dielectric layer is greater than or equal to a thickness of the sacrificial layer.

15. The method of claim 12, wherein an angle between the top surface of the second dielectric layer and the sidewall of the recess structure is between 90 and 150 degrees.

16. The method of claim 12, wherein the sidewalls of the trench structure have a curvature.

17. The method of claim 11, wherein in the step of forming the second dielectric layer, the recess structure of the second dielectric layer exposes a portion of the top surface of the metal layer.

18. The method of claim 17, wherein the metal layer comprises a first portion and a second portion, the first portion being electrically connected to the contact, the second portion being electrically insulated from the contact.

19. The method of claim 18, wherein the fill layer directly contacts the second portion.

20. A method of manufacturing a microelectromechanical systems device, comprising:

forming at least one first metal layer on the first dielectric layer, wherein at least a portion of the first metal layer is electrically connected to the contact;

forming a second dielectric layer on the first dielectric layer and the first metal layer;

forming a sacrificial layer on the second dielectric layer;

removing a portion of the structural layer to form a first opening, the first opening exposing a portion of the top surface of the sacrificial layer;

removing a portion of the sacrificial layer through the first opening to form a second opening, the second opening exposing a portion of the top surface of the second dielectric layer;

removing a portion of the second dielectric layer through the second opening to form a recess structure; wherein the cross-sectional area of the bottom of the first opening is smaller than the cross-sectional area of the top of the groove structure;

removing the sacrificial layer; and

and forming a filling layer, wherein at least part of the filling layer is formed in the second opening and the groove structure, and the second dielectric layer, the structural layer and the filling layer define a cavity.

21. The method of claim 20, wherein a cross-sectional area of a bottom of the first opening is smaller than a cross-sectional area of a top of the first opening.

22. The method of manufacturing a microelectromechanical systems device of claim 20, further comprising:

removing a portion of the fill layer to form a third opening, the third opening exposing a portion of the top surface of the structural layer; and

and forming a second metal layer on the filling layer, wherein at least part of the second metal layer is formed in the third opening.

23. The method of claim 22, wherein the second metal layer comprises a first portion and a second portion, the first portion being in direct contact with the structural layer and the second portion being in direct contact with the filler layer.

24. The method of manufacturing a microelectromechanical systems device of claim 22, further comprising:

and forming a third dielectric layer on the filling layer and the second metal layer.

25. The method of manufacturing a microelectromechanical systems device of claim 24, further comprising:

removing a portion of the third dielectric layer to form a fourth opening, the fourth opening exposing a portion of the top surface of the second metal layer; and

a third metal layer is formed on the third dielectric layer, wherein at least a portion of the third metal layer is formed in the fourth opening.

26. The method of claim 25, wherein the third metal layer comprises a first portion electrically connected to the second metal layer and a second portion electrically isolated from the second metal layer.

27. The method of manufacturing a microelectromechanical systems device of claim 26, further comprising:

a moisture absorption layer is formed on the second portion.

28. An integrated microelectromechanical system, comprising:

a plurality of MEMS devices according to any of claims 1-10,

wherein the MEMS devices share the same substrate.

29. The integrated mems of claim 28, wherein one of the mems devices further comprises:

and the second metal layer is arranged on part of the top surface of the structural layer.

30. The integrated mems of claim 29, wherein the second metal layer comprises a first portion and a second portion, the first portion in direct contact with the structural layer, the second portion in direct contact with the filler layer.

31. The integrated mems of claim 29, wherein one of the mems devices further comprises:

the third dielectric layer is arranged on the filling layer and the second metal layer.

32. The integrated mems of claim 31, wherein one of the mems devices further comprises:

a third metal layer, wherein at least a portion of the third metal layer is disposed on a portion of the top surface of the second metal layer.

33. The integrated mems of claim 32, wherein the third metal layer comprises a first portion electrically connected to the second metal layer and a second portion electrically insulated from the second metal layer.

34. The integrated mems of claim 32, further comprising:

and the moisture absorption layer is arranged on the second part.