CN113053765A - Detection equipment for semiconductor diode chip - Google Patents
Detection equipment for semiconductor diode chip Download PDFInfo
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- CN113053765A CN113053765A CN202110248785.4A CN202110248785A CN113053765A CN 113053765 A CN113053765 A CN 113053765A CN 202110248785 A CN202110248785 A CN 202110248785A CN 113053765 A CN113053765 A CN 113053765A
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- probe
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- detection
- manipulator
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- 238000001514 detection method Methods 0.000 title claims abstract description 65
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 239000000523 sample Substances 0.000 claims abstract description 76
- 238000012360 testing method Methods 0.000 claims abstract description 43
- 230000007547 defect Effects 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 25
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 17
- 239000011737 fluorine Substances 0.000 claims abstract description 17
- 238000005485 electric heating Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 4
- 230000002265 prevention Effects 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000013078 crystal Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 101100441413 Caenorhabditis elegans cup-15 gene Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 208000003464 asthenopia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor diode chip detection, in particular to detection equipment for a semiconductor diode chip, which comprises a rack, a feeding mechanical arm, a feeding material box, a feeding suction nozzle sucker, a defect detection camera assembly, a feeding station, a fluorine oil brush assembly, a probe detection station, a probe detection mechanical arm, a probe disc, a probe switching control system and a dotting identification device. The invention achieves the purposes of reducing various mechanical movements in the testing process and greatly improving the testing yield of the diode chip, can also synchronously detect the appearance defects of the chip of the semiconductor diode chip, replaces manual appearance detection and improves the yield and the quality of the chip.
Description
Technical Field
The invention relates to the technical field of semiconductor diode chip detection, in particular to a detection device for a semiconductor diode chip.
Background
Semiconductor diodes, also known as crystal diodes, are semiconductor two-terminal devices in solid-state electronic devices. An electronic component which transmits current in only one direction. It is a device having 2 terminals joined by 1 part number, and has a property of allowing or not allowing a current to flow in accordance with the direction of an applied voltage. The crystal diode is a PN junction formed by a p-type semiconductor and an n-type semiconductor, space charge layers are formed on two sides of the interface of the crystal diode, and a self-established electric field is established. When no external voltage exists, the diffusion current caused by the carrier concentration difference of two sides of the PN junction is equal to the drift current caused by the self-established electric field, and the PN junction is in an electric balance state.
In the production process of semiconductor diodes, the electrical performance and appearance of the diodes need to be tested, so as to improve the quality and performance of the products. However, the current testing action path for diode performance is tedious, which results in a complicated mechanical moving process and a low diode testing yield; in addition, the diode appearance detection in the current industry basically depends on human eyes to observe and identify defects, so that the visual fatigue of an operator and the instability of product quality are caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the detection equipment for the semiconductor diode chip, which achieves the purposes of reducing mechanical movement in the test process and greatly improving the test yield of the diode chip, can synchronously detect the appearance defects of the semiconductor diode chip, replaces manual appearance detection, and improves the yield of the chip and the stability of the product quality.
(II) technical scheme
In order to realize the technical problem, the invention provides the following technical scheme: the utility model provides a check out test set for semiconductor diode chip, includes frame, material loading manipulator, material loading magazine, material loading suction nozzle sucking disc, location camera, defect detection camera subassembly, material loading station, gets mark identification means, fluorine oil brush subassembly, probe detection station, probe detection manipulator, probe dish and probe switching control system, its characterized in that: top and the material loading manipulator in the frame pass through type frame fixed connection, the material loading magazine sets up the inside in the frame, material loading suction nozzle sucking disc sets up on the free end of material loading manipulator, mark device and defect detection camera subassembly set up on the material loading manipulator of dotting, the material loading station sets up the front side in the frame, the fluorine oil brush subassembly sets up in the frame, the equal fixed mounting's of probe detection station and probe detection manipulator rear side in the frame, the probe dish sets up the top at the probe detection station, probe switching control system fixed mounting is in the inside of frame, and through the probe connection on electrically conductive cable and the probe dish, probe switching control system is located the top of probe dish and probe detection station.
Further, the material loading manipulator is located above the material loading material box and the material loading station, the dotting identification device and the defect detection camera assembly are fixedly connected to the material loading manipulator, the positioning camera is located above the material loading station, and the fluorine oil brush assembly is located on the side of the material loading station.
Furthermore, a feeding station assembly, a positioning assembly and a dotting identification station assembly are arranged on the feeding station; and a probe disc and a manipulator assembly thereof are arranged on the probe detection station.
Further, an electric heating station is arranged in the frame, a blanking station is arranged beside the electric heating station, a blanking suction nozzle sucker is arranged on the blanking station, and a failed-alignment blanking station is arranged on the blanking station.
Further, a probe disc is arranged in the machine frame, and protective gas such as nitrogen for preventing high-pressure ignition can be connected to the probe disc.
Further, a fluorine oil spraying assembly is arranged in the machine frame, and fluorine oil is uniformly sprayed on the surface of the wafer when the wafer is tested.
(III) advantageous effects
The invention provides a detection device for a semiconductor diode chip, which has the following beneficial effects:
1. the invention can synchronously detect the electrical property test and the chip appearance defect of the semiconductor diode chip, reduces the multiple mechanical movements in the test process by using the multi-pin probe disc design and the probe switching control system, greatly improves the yield of the chip test, and also carries out the appearance defect detection on the chip at another station while testing the electrical property of the crystal grain, thereby replacing the manual appearance detection, improving the yield and the quality of the chip and realizing the full-automatic production of the electrical property test and the appearance defect detection of the wafer chip.
2. The invention captures the image of the wafer chip through the positioning camera, and the image identifies the positioning software function to achieve the accurate alignment between the wafer and the probe plate, so that the electrode of the diode wafer is contacted with the probe to provide a test loop, and simultaneously, the position of the chip is sent to a software system of the test equipment to realize the automatic test, and the test result is stored in a database system for managing test data.
3. The probe disc and the wafer are parallel, the vertical distance between the probe disc and the wafer is generally less than 10mm, the probe disc can be connected with nitrogen or similar high-pressure ignition-proof protective gas, and the space between the probe disc and the wafer is filled with the protective gas during testing, so that the probability of high-pressure ignition discharge in the chip testing process is effectively reduced, and the detection performance and the product yield of the point testing machine are improved.
4. The defect detection camera assembly 5 captures a high-resolution image of the appearance of the diode chip, and identifies the appearance defects of the chip through image processing software.
5. The invention can also spray fluorine oil on the wafer, the fluorine oil has excellent dielectric property, excellent chemical inertia, excellent electrical insulation property and excellent high and low temperature resistance, has no corrosion to electronic components, does not influence various parameters of the electronic components, can form effective high-voltage protection performance on the wafer, and effectively reduces the probability of firing and discharging at high voltage in the chip test process, thereby improving the detection performance of the spot tester and the product yield.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is a front view of the structure of the present invention;
fig. 3 is a top view of the structure of the present invention.
In the figure: 1. a frame; 2. a feeding manipulator; 3. a feeding material box; 4. a feeding suction nozzle sucker; 5. a defect detection camera assembly; 6. a feeding station; 7. a fluorine oil brush assembly; 8. a probe detection station; 9. a probe detection manipulator; 10. a probe plate; 11. a probe switching control system; 12. positioning a camera; 13. an electrical heating station; 14. a blanking station; 15. a feeding suction nozzle sucker; 16. aligning a failure station; 18. dotting identification device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a detection device for semiconductor diode chips comprises a rack 1, a feeding manipulator 2, a feeding magazine 3, a feeding suction nozzle sucker 4, a positioning camera 12, a defect detection camera assembly 5, a feeding station 6, a fluorine oil brush assembly 7, a probe detection station 8, a probe detection manipulator 9, a probe disc 10, a dotting identification device 18 and a probe switching control system 11, wherein the top of the rack 1 is fixedly connected with the feeding manipulator 2 through a shaped frame, the feeding magazine 3 is arranged inside the rack 1, the feeding suction nozzle sucker 4 is arranged at the free end of the feeding manipulator 2, the dotting identification device 18 and the defect detection camera assembly 5 are arranged on the feeding manipulator 2, the feeding station 6 is arranged at the front side of the rack 1, the fluorine oil brush assembly 7 is arranged on the rack 1, the probe detection station 8 and the probe detection manipulator 9 are both fixedly arranged at the rear side of the rack 1, the probe plate 10 is arranged above the probe detection station 8, and the probe switching control system 11 is arranged above the probe plate 10 and is connected with probes on the probe plate 10 through conductive cables; the feeding manipulator 2 is positioned above the feeding material box 3 and the feeding station 6, the defect detection camera assembly 5 is fixedly connected to the feeding manipulator 2, and the fluorine oil brush assembly 7 is positioned on the side of the feeding station 6; a feeding, positioning and dotting identification station component is arranged on the feeding station 6; a probe disc and a manipulator assembly thereof are arranged on the probe detection station 8; the probe disc can be accessed with nitrogen or similar high-pressure ignition-proof protective gas; an electric heating station 13 is arranged in the frame 1, a blanking station 14 is arranged beside the electric heating station 13, a blanking suction nozzle suction cup 15 is arranged on the blanking station 14, and an alignment failure station 16 is arranged on the part of the feeding station; a fluorine oil spraying component is arranged in the frame 1; the equipment is used for achieving accurate alignment between a wafer and a probe disc through image capture of a positioning camera 12 and an image identification and positioning software function, enabling electrodes of a diode wafer to be in contact with a probe, providing a test loop, sending a logic position to a diode wafer test equipment software system, storing a test result into a database system for managing test data, and enabling a probe switching control system 11 to be located above a probe detection station 8 and to be connected with probes on the probe disc 10 through conductive cables. The defect detection camera assembly 5 captures a high-resolution image of the appearance of the diode chip, and the chip appearance defects are identified through image processing software. The invention can synchronously detect the electrical property test and the chip appearance defect of the semiconductor diode chip, reduces the multiple mechanical movements in the test process by using the multi-pin probe disc design and the probe switching control system, greatly improves the yield of the chip test, and also carries out the appearance defect detection on the chip at another station while testing the electrical property of the crystal grain, thereby replacing the manual appearance detection, improving the yield and the quality of the chip and realizing the full-automatic production of the electrical property test and the appearance defect detection of the wafer chip.
The probe plate 10 can be connected with nitrogen or similar high-pressure ignition-proof protective gas, for example, the space between the probe plate and the wafer is filled with the protective gas during testing, so that the probability of high-pressure ignition and discharge in the chip testing process is effectively reduced, and the detection performance and the product yield of the point testing machine are improved.
The feeding manipulator 2, the defect detection camera assembly 5 and the dotting mark 18 are all positioned above the top of the feeding station 6, the fluorine oil brush assembly 7 is positioned at the side position of the feeding station 6, the fluorine oil has excellent dielectric property, excellent chemical inertness, excellent electrical insulation and excellent high and low temperature resistance, has no corrosion to electronic components, does not influence various parameters of the electronic components, can form effective high-voltage protection performance to wafers, effectively reduces the probability of high-voltage discharge in the process of testing chips, therefore, the detection performance of the point detection machine is improved, a feeding station 6 is provided with a feeding, positioning and marking station assembly, an electric heating station 13 is arranged behind a feeding suction nozzle sucker 4, a blanking station 14 is arranged beside the electric heating station 13, a blanking suction nozzle sucker 15 is arranged on the blanking station 14, and an alignment failure station 16 is arranged near the feeding station 6.
The invention can synchronously detect the electrical property test and the chip appearance defect of the semiconductor diode chip, reduces a plurality of mechanical movements in the test process by using a multi-probe disc design and a quick probe switching control system, greatly improves the yield of the chip test, and also can detect the appearance defect of the chip at another station while testing the electrical property of the crystal grain, thereby replacing the manual appearance detection, improving the yield and the quality of the chip and realizing the full-automatic production of the electrical property test and the appearance defect detection of the wafer chip.
The invention uses two stations to complete the feeding of chips, the positioning of wafers, the electrical property test, the appearance detection and the dotting identification of bad chips. The invention can also use three or more than three stations to complete all functions of the full-automatic detection of the diode chip.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a check out test set for semiconductor diode chip, includes frame (1), material loading manipulator (2), material loading magazine (3), material loading suction nozzle sucking disc (4), defect detection camera subassembly (5), material loading station (6), location camera (12), probe detection station (8), probe detection manipulator (9), probe dish (10), dotting identification device (18) and probe switching control system (11), its characterized in that: the rack (1) is fixedly connected with the feeding manipulator (2) through a molding frame, the feeding material box (3) is arranged inside the rack (1), the feeding suction nozzle sucker (4) is arranged on the free end of the feeding manipulator (2), the dotting identification device (18) and the defect detection camera assembly (5) are arranged on the feeding manipulator (2), the feeding station (6) is arranged in the frame (1), the probe detection station (8) and the probe detection manipulator (9) are both fixedly arranged on the frame (1), the probe plate (10) is arranged above the probe detection station (8), the probe switching system (11) is connected with the probes on the probe plate (10) through conductive cables, the positioning camera (12) is fixedly arranged in the frame (1) and is positioned above the feeding station (6).
2. The inspection apparatus for semiconductor diode chips as claimed in claim 1, wherein: the feeding station (6) is provided with a feeding, positioning, defect detection, station assembly and a manipulator assembly; and a probe disc and a manipulator assembly thereof are arranged on the probe detection station (8).
3. The inspection apparatus for semiconductor diode chips as claimed in claim 1, wherein: high-pressure sparking prevention protective gas can be connected into the probe disc, and the protective gas is injected into a space between the probe disc and the wafer during wafer testing, so that the high-pressure sparking prevention effect is achieved.
4. The inspection apparatus for semiconductor diode chips as claimed in claim 1, wherein: the automatic feeding machine is characterized in that an electric heating station (13) is arranged in the rack (1), a blanking station (14) is arranged beside the electric heating station (13), a blanking suction nozzle suction cup (15) is arranged on the blanking station (14), and an alignment failure station (16) is arranged beside the feeding station (6).
5. The inspection apparatus for semiconductor diode chips as claimed in claim 1, wherein: be provided with spraying fluorine oil subassembly (7) in frame (1), evenly spray fluorine oil to the wafer surface when testing the wafer, play the effect of preventing high pressure striking sparks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110248785.4A CN113053765A (en) | 2021-03-08 | 2021-03-08 | Detection equipment for semiconductor diode chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110248785.4A CN113053765A (en) | 2021-03-08 | 2021-03-08 | Detection equipment for semiconductor diode chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113053765A true CN113053765A (en) | 2021-06-29 |
Family
ID=76510507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110248785.4A Pending CN113053765A (en) | 2021-03-08 | 2021-03-08 | Detection equipment for semiconductor diode chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113053765A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113671331A (en) * | 2021-09-07 | 2021-11-19 | 无锡昌鼎电子有限公司 | Semiconductor high-voltage insulation test equipment |
| CN115400985A (en) * | 2022-08-29 | 2022-11-29 | 深圳市立能威微电子有限公司 | Chip double-type sorting detection device |
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2021
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113671331A (en) * | 2021-09-07 | 2021-11-19 | 无锡昌鼎电子有限公司 | Semiconductor high-voltage insulation test equipment |
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| CN115400985A (en) * | 2022-08-29 | 2022-11-29 | 深圳市立能威微电子有限公司 | Chip double-type sorting detection device |
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