CN113012567A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113012567A CN113012567A CN201911318400.6A CN201911318400A CN113012567A CN 113012567 A CN113012567 A CN 113012567A CN 201911318400 A CN201911318400 A CN 201911318400A CN 113012567 A CN113012567 A CN 113012567A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The invention discloses a display panel and a display device. The display panel includes a binding region; the flexible printed circuit board further comprises a supporting substrate, a flexible substrate and a driving chip which are arranged in a stacked mode; a convex structure is formed on the support substrate at a position corresponding to the binding region, and the flexible substrate is in direct contact with the convex structure; the driving unit and the flexible substrate are bound in the binding area. According to the invention, the bulge structure is arranged at the position of the support substrate corresponding to the binding region, and the bulge structure is in direct contact with the flexible substrate, so that the problems of deformation, cracks and the like caused by a high-temperature process in the binding process of the driving chip and the flexible substrate are solved, the bad binding phenomenon caused by alignment errors in the binding process of the flexible substrate is reduced, the preparation yield of the display panel is improved, and the display panel can be ensured to normally display.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a display device.
Background
With the development of display technology, more and more devices such as curved-screen mobile phones and curved-surface televisions with fully flexible display gradually enter the visual field of people, and a display device with fully flexible display needs to use a flexible substrate material as a substrate.
However, in the flexible display device, when the conventional flexible substrate is bonded to the IC, high-temperature processing is required in a bonding process, however, under a high-temperature process condition, the flexible substrate may have problems of shrinkage and expansion, deformation and the like due to a thermal effect, so that the conductive particles between the IC and the flexible substrate are not in good contact, the flexible substrate is prone to crack and the like, the bonding effect of the chip is affected, and the chip may not operate effectively, thereby causing a problem of abnormal display of the display device.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, which are used for solving the problems of deformation, cracks and the like caused by a high-temperature process in the binding process of a driving chip and a flexible substrate and reducing the bad binding phenomenon caused by alignment errors in the binding process of the flexible substrate.
The embodiment of the invention provides a display panel, which comprises a binding area; the flexible printed circuit board further comprises a supporting substrate, a flexible substrate and a driving chip which are arranged in a stacked mode;
a convex structure is formed on the supporting substrate at a position corresponding to the binding region, and the flexible substrate is in direct contact with the convex structure;
the drive chip and the flexible substrate are bound in the binding region.
Optionally, a perpendicular projection of the bonding region on the support substrate is located within a coverage area of the protruding structure.
Optionally, the display panel further includes an adhesive disposed on a surface of the support substrate facing the flexible substrate, where the adhesive covers a region of the support substrate except the protruding structure;
the flexible substrate and the supporting substrate are bonded through the bonding glue.
Optionally, a surface of the adhesive facing the flexible substrate is flush with a surface of the protruding structure facing the flexible substrate.
Optionally, the hardness of the supporting substrate is D1, and the hardness of the flexible substrate is D2, D1> D2.
Optionally, the supporting substrate has a modulus of J1, and the flexible substrate has a modulus of J2, J1> J2.
Optionally, the display panel further includes a first flat area, a second flat area, and a bending area located between the first flat area and the second flat area; the first flat area is used as a display area of the display panel, and the second flat area comprises the binding area;
the flexible substrate is located in the first flat area, the bending area and the second flat area, the support substrate is located in the first flat area and the second flat area, a protruding structure is formed on the support substrate located in the second flat area and corresponding to the binding area, and the flexible substrate located in the second flat area is in direct contact with the protruding structure.
Optionally, the flexible substrate is disposed at the first bonding terminal in the bonding region;
the drive chip comprises a metal substrate and a second binding terminal arranged on one side of the metal substrate;
the first binding terminal and the second binding terminal are bound in the binding region by anisotropic conductive adhesive.
Optionally, the support substrate is a glass substrate.
An embodiment of the present invention provides a display device, including the display panel according to any one of the above embodiments.
In the embodiment of the invention, the bulge structure is arranged at the position of the support substrate corresponding to the binding region, and the drive chip and the flexible substrate are bound in the binding region, so that the problems of deformation, cracks and the like caused by a high-temperature process in the binding process of the drive chip and the flexible substrate are solved, and the bad binding phenomenon caused by alignment errors in the binding process of the flexible substrate is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the invention;
fig. 2 is a three-dimensional structure diagram of a support substrate and an adhesive in a display panel according to a first embodiment of the invention;
FIG. 3 is a schematic structural diagram of a display panel according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display device in a third embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and as shown in fig. 1, the display panel includes a binding region 10; the display device further comprises a supporting substrate 20, a flexible substrate 30 and a driving chip 40 which are arranged in a stacked mode; a convex structure 210 is formed on the support substrate 20 at a position corresponding to the bonding region 10, and the flexible substrate 30 is in direct contact with the convex structure 210; the driver chip 40 and the flexible substrate 30 are bound in the binding region 10.
The working principle of the display panel is as follows: the display panel includes a display unit (not shown) and a driving chip 40, and the display unit is connected to the driving chip 40 by a flat cable, when the driving chip 40 needs to be bound to the flexible substrate 30 of the display panel. In the binding process of the driving chip 40 and the flexible substrate 30, the display panel may have a high temperature treatment process in the preparation process, and the flexible substrate 30 may deform and crack, which may cause poor binding between the driving chip 40 and the flexible substrate 30, possibly cause the driving chip 40 to operate effectively, and cause the display panel to display normally.
The supporting substrate 20 is creatively arranged on one side of the flexible substrate 30 far away from the driving chip 40, the supporting substrate 20 forms the protruding structure 210 in the binding region 10, the flexible substrate 30 is directly contacted with the protruding structure 210, and the part of the flexible substrate 30 corresponding to the binding region 10 is directly supported and protected, so that the probability of deformation and cracks of the flexible substrate 30 due to a high-temperature process is reduced, the binding yield of the driving chip 40 and the flexible substrate 30 is enhanced, and normal display of a display panel is ensured. Further, through the supporting substrate 20 in binding district 10 formation protruding structure 210, flexible substrate 30 and protruding structure 210 direct contact, the protection is supported to the part that flexible substrate 30 corresponds to binding district 10, when can also lightening flexible substrate 30 and driver chip 40 and tying, it is harder because of driver chip 40 binds the terminal, the softer flexible substrate 30 crack problem that causes of flexible substrate 30, can strengthen driver chip 40 and flexible substrate 30 and bind the yield equally, guarantee that display panel normally shows.
According to the embodiment of the invention, the protruding structure is arranged at the position, corresponding to the binding region, of the supporting substrate and is in direct contact with the flexible substrate, so that the protruding structure can well support and protect the flexible substrate in the binding process of the driving chip and the flexible substrate in the binding region, the problems of deformation, cracks and the like caused by a high-temperature process in the binding process of the driving chip and the flexible substrate are solved, and the bad binding phenomenon caused by alignment errors in the binding process of the flexible substrate is reduced.
Optionally, with continued reference to fig. 1, the flexible substrate 30 is provided with a first binding terminal 310 at the binding region 10; the driving chip 40 includes a metal substrate 410 and a second binding terminal 420 disposed at one side of the metal substrate 410; the first binding terminal 310 and the second binding terminal 420 are bound at the binding region by an anisotropic conductive adhesive.
The first binding terminals 310 and the second binding terminals 420 on one side of the metal substrate 410 of the driver chip 40 are disposed in the binding region 10 of the flexible substrate 30, and the first binding terminals 310 and the second binding terminals 420 correspond to each other one to one. The first binding terminal 310 may be a binding pad disposed on the surface of the flexible substrate 30, and the second binding terminal 420 may be a gold finger disposed on one side of the substrate 410. Because the supporting substrate 20 is provided with the protruding structure 210 on the surface of one side facing the flexible substrate 30, the protruding structure 210 is located in the binding region 10, and the protruding structure 210 is in direct contact with the flexible substrate 30, when the second binding terminal 420 is bound with the first binding terminal 310, the supporting force of the binding region 10 is good, and the problem that the binding of the first binding terminal 310 and the second binding terminal 420 is not firm due to the deformation of the flexible substrate 30 when the binding is performed through the anisotropic conductive adhesive, which causes the binding particle conduction failure, is avoided.
It should be noted that, when the first binding terminal 310 and the second binding terminal 420 are bound and set in the binding region 10 through the anisotropic conductive adhesive, the anisotropic conductive adhesive is conducted in the longitudinal direction and insulated in the transverse direction, so that the first binding terminal 310 and the second binding terminal 420 are ensured to be in one-to-one correspondence in the longitudinal direction when being bound and set, and each binding terminal is in an insulated state in the transverse direction.
Optionally, the perpendicular projection of the bonding region 10 on the support substrate 20 is located within the coverage area of the protruding structure 210.
The vertical projection of the binding region 10 on the support substrate 20 is located in the coverage area of the protrusion structure 210, that is, the cross-sectional area of the protrusion structure 210 is greater than or equal to the cross-sectional area of the binding region 10, and by setting the cross-sectional area of the protrusion structure 210 to be greater than the cross-sectional area of the binding region 10, when the binding position of the driver chip 40 and the flexible substrate 30 is slightly deviated from the binding region 10 in the binding process, the protrusion structure 210 can also support and protect the flexible substrate 30, thereby reducing the alignment precision in the binding process, reducing the difficulty in the binding process, and improving the binding efficiency.
It should be noted that, the specific values of the cross-sectional area of the protruding structure 210 and the cross-sectional area of the binding region 10 are not limited in the embodiment of the present invention, and since there is an uncertainty factor in the operation and control of the binding process through a machine, the relationship between the cross-sectional area of the protruding structure 210 and the cross-sectional area of the binding region 10 can be set by considering that different area relationships are all within the protection scope of the present invention.
Optionally, with reference to fig. 1 and fig. 2, the display panel may further include an adhesive 50 disposed on a surface of the support substrate 20 facing the flexible substrate 30, the adhesive 50 covers a region of the support substrate 20 except the protruding structures 210, and the flexible substrate 30 is bonded to the support substrate 20 through the adhesive 50.
The supporting substrate 20 forms the protruding structure 210 at the position where the flexible substrate 30 and the driving chip 40 correspond to the bonding area 10, and the protruding structure 210 is in direct contact with the flexible substrate 30, in order to ensure that the protruding structure 210 of the supporting substrate 20 and the flexible substrate 30 in the bonding area is in direct contact with the flexible substrate 30, the adhesive glue 50 may not be disposed on the surface of one side of the protruding structure 210 facing the flexible substrate 30, the adhesive glue 50 is disposed in the area of the supporting substrate 20 except the protruding structure 210, and the adhesive glue 50 covers the area except the protruding structure 210. The bonding glue 50 is arranged to cover the region of the support substrate 20 except the protruding structure 210, so that the bonding of the flexible substrate 30 and the support substrate 20 is ensured, the protruding structure 210 of the support substrate 20 is in direct contact with the flexible substrate 30, and the bonding glue 50 is not arranged between the protruding structure 210 and the flexible substrate 30, so that the bonding glue 50 in the binding region 10 in the preparation process of the flexible display panel is prevented from deforming due to heat, the influence on the flatness of the flexible substrate 30 in the binding region 10 is avoided, and poor binding is caused.
It should be noted that the embodiment of the present invention does not limit the type of the adhesive 50, and any type of adhesive material that can achieve the adhesion between the flexible substrate 30 and the support substrate 20 is within the protection scope of the present invention.
Optionally, the surface of the adhesive 50 facing the flexible substrate 30 is flush with the surface of the protruding structure 210 facing the flexible substrate 30.
The bonding glue 50 is arranged to cover the area of the support substrate 20 except the protruding structure 210, the surface of the bonding glue 50 facing one side of the flexible substrate 30 is flush with the surface of the protruding structure 210 facing one side of the flexible substrate 30, the flatness of the flexible substrate 30 is guaranteed, and the flatness of the surface of the display panel is further guaranteed.
Optionally, the supporting substrate 20 has a hardness of D1, and the flexible substrate 30 has a hardness of D2, D1> D2.
Because the golden finger of driver chip 40 is harder, the binding pad of flexible substrate 30 is softer, and flexible substrate 30 and driver chip 40 not only cause the deformation of flexible substrate 30 easily at the in-process of binding, and the binding pad of binding district 10 can cause the atress inequality because of the deformation of flexible substrate 30 and appear the crack moreover, and then causes to switch on particle and switch on bad scheduling problem. By setting the hardness of the supporting substrate 20 to be D1, the hardness of the flexible substrate 30 to be D2 and the hardness D1 of the supporting substrate 20 to be greater than the hardness D2 of the flexible substrate 30, the supporting force of the flexible substrate 30 in the binding region 10 in the binding process of the flexible substrate 30 and the driving chip 40 is guaranteed to be good, and the problems of poor conduction of crack and ACF particles and the like caused by uneven stress of the bound pad are reduced.
Optionally, the supporting substrate 20 has a modulus of J1, and the flexible substrate 30 has a modulus of J2, J1> J2.
Modulus refers to the ratio of stress to strain of a material under stress. The modulus can be regarded as an index for measuring the difficulty of the material in elastic deformation, and the larger the modulus is, the larger the stress for causing the material to generate certain elastic deformation is, i.e. the higher the rigidity of the material is, i.e. the smaller the elastic deformation is generated under the action of certain stress. Because the golden finger of driver chip 40 is harder, the binding pad of flexible substrate 30 is softer, and flexible substrate 30 and driver chip 40 not only cause the deformation of flexible substrate 30 easily at the in-process of binding, and the binding pad of binding district 10 can cause the atress inequality because of the deformation of flexible substrate 30 and appear the crack moreover, and then causes to switch on particle and switch on bad scheduling problem. By setting the modulus of the support substrate 20 to be J1, the modulus of the flexible substrate 30 to be J2, and the modulus J1 of the support substrate 20 to be greater than the modulus J2 of the flexible substrate 30, it is ensured that the support force of the flexible substrate 30 in the binding region 10 is better in the binding process between the flexible substrate 30 and the driver chip 40, and the problems of poor conduction of crack and ACF particles and the like caused by uneven stress of the bound pad are reduced.
Alternatively, the support substrate 20 is a glass substrate.
The supporting substrate 20 is selected to be a glass substrate, so that the surface of the flexible substrate 30 is smooth and does not crack or bend under the high-temperature operation of the preparation process in the preparation process of the flexible display panel, and therefore the firmness of the binding of the first binding terminal 310 and the second binding terminal 420 through the anisotropic conductive adhesive in the binding process of the flexible substrate 30 and the driving chip 40 is ensured, the problem of poor conduction of binding particles is reduced, and the display effect of the display panel is improved.
It should be noted that the material type of the supporting substrate 20 is not limited in the embodiments of the present invention, and any material type that can realize supporting the substrate on the flexible substrate 30 is within the protection scope of the present invention.
Example two
On the basis of the foregoing embodiment, fig. 3 is a schematic structural diagram of a display panel according to a second embodiment of the present invention, as shown in fig. 3, the display panel further includes a first flat region 100, a second flat region 200, and a bending region 300 located between the first flat region 100 and the second flat region 200; the first flat area 100 is used as a display area 110 of the display panel, and the second flat area 200 includes a binding area 10; the flexible substrate 30 is located in the first flat area 100, the bending area 300 and the second flat area 200, the support substrate 20 is located in the first flat area 100 and the second flat area 200, a protruding structure 210 is formed on the support substrate 20 of the second flat area 200 at a position corresponding to the binding area 10, and the flexible substrate 30 located in the second flat area 200 is in direct contact with the protruding structure 210.
As shown in fig. 3, the display panel includes a display area 110 located in the first flat area 100 and a binding area 10 located in the second flat area 200, the support substrate 20 of the first flat area 100 is in direct contact with the flexible substrate 30, and the support substrate 20 does not form a protruding structure, the support substrate 20 of the bending area 300 is disposed according to a bending angle (not shown in the figure), and the flexible substrate 30 of the second flat area 200 is formed by bending the flexible substrate 30 of the first flat area 100 through the bending area 300. The supporting substrate 20 is arranged on the surface, opposite to the first flat area 100, of the second flat area 200, the protruding structure 210 is formed on the supporting substrate 20 corresponding to the binding area 10, the flexible substrate 30 located in the second flat area 200 is in direct contact with the protruding structure 210, the flexible substrate 30 is directly supported and protected corresponding to the binding area 10, the probability that the flexible substrate 30 is deformed and cracked due to a high-temperature process is reduced, the binding yield of the driving chip 40 and the flexible substrate 30 is improved, and normal display of a display panel is guaranteed. Further, through the supporting substrate 20 in binding district 10 formation protruding structure 210, flexible substrate 30 and protruding structure 210 direct contact, the protection is supported to the part that flexible substrate 30 corresponds to binding district 10, when can also lightening flexible substrate 30 and driver chip 40 and tying, it is harder because of driver chip 40 binds the terminal, the softer flexible substrate 30 crack problem that causes of flexible substrate 30, can strengthen driver chip 40 and flexible substrate 30 and bind the yield equally, guarantee that display panel normally shows.
On the other hand, since the display area 110 is provided with a plurality of pixel units (not shown in the figure), the plurality of pixel units in the display area 100 are connected with the driving chip 40 through the flat cables, and the flat cables connecting the plurality of pixel units with the driving chip 40 can be bent towards the second flat area 200 through the bending area, so that the wide screen effect of the display device is realized, and the screen occupation ratio of the display device is increased.
It should be noted that the flexible substrate 30 is bent to a side away from the display area, and the second flat area 200 is provided with the protruding structure 210 at a position corresponding to the bonding area 10 of the support substrate 20, while the display area 100 is provided with no protruding structure 210 on the support substrate 20. When the position of the bonding region 10 changes, the protruding structure 210 changes with the change of the position of the bonding region 10, and the position of the protruding structure 210 is not limited in the present invention.
According to the embodiment of the invention, the flexible substrate is bent to the side far away from the display area, the protruding structure is arranged at the position, corresponding to the binding area, of the support substrate of the second flat area, and the protruding structure is in direct contact with the flexible substrate, so that in the binding process of the drive chip and the flexible substrate in the binding area, the protruding structure can well support and protect the flexible substrate, and the binding area is located in the second flat area, the problems of deformation, cracks and the like caused by a high-temperature process in the binding process of the drive chip and the flexible substrate are solved, the bad binding phenomenon caused by alignment errors in the binding process of the flexible substrate is reduced, the wide screen effect of the display device is realized, and the screen occupation ratio of the display device is increased.
EXAMPLE III
The embodiment of the invention also provides a display device which comprises the display panel of any one of the embodiments. Fig. 4 is a schematic view of a display device according to an embodiment of the present invention, and referring to fig. 4, the display device includes a display panel according to any one of the embodiments, where the display device may be a mobile phone as shown in fig. 4, or may be a computer, a television, an intelligent wearable display device, and the like, and the embodiment of the present invention is not limited thereto.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A display panel, comprising a bonding area; the flexible printed circuit board further comprises a supporting substrate, a flexible substrate and a driving chip which are arranged in a stacked mode;
a convex structure is formed on the supporting substrate at a position corresponding to the binding region, and the flexible substrate is in direct contact with the convex structure;
the drive chip and the flexible substrate are bound in the binding region.
2. The display panel of claim 1, wherein a perpendicular projection of the bonding region on the support substrate is located within a footprint of the raised structure.
3. The display panel according to claim 1, wherein the display panel further comprises an adhesive glue disposed on a surface of the support substrate facing the flexible substrate, the adhesive glue covering a region of the support substrate other than the raised structures;
the flexible substrate and the supporting substrate are bonded through the bonding glue.
4. The display panel according to claim 3, wherein a surface of the adhesive glue facing the flexible substrate is flush with a surface of the protruding structure facing the flexible substrate.
5. The display panel of claim 1, wherein the supporting substrate has a hardness of D1, and the flexible substrate has a hardness of D2, D1> D2.
6. The display panel of claim 1, wherein the supporting substrate has a modulus of J1, and the flexible substrate has a modulus of J2, J1> J2.
7. The display panel of claim 1, wherein the display panel further comprises a first flat region, a second flat region, and a bend region between the first flat region and the second flat region; the first flat area is used as a display area of the display panel, and the second flat area comprises the binding area;
the flexible substrate is located in the first flat area, the bending area and the second flat area, the support substrate is located in the first flat area and the second flat area, a protruding structure is formed on the support substrate located in the second flat area and corresponding to the binding area, and the flexible substrate located in the second flat area is in direct contact with the protruding structure.
8. The display panel according to claim 1, wherein the flexible substrate is provided at a first bonding terminal at the bonding region;
the drive chip comprises a metal substrate and a second binding terminal arranged on one side of the metal substrate;
the first binding terminal and the second binding terminal are bound in the binding region by anisotropic conductive adhesive.
9. The display panel according to claim 1, wherein the support substrate is a glass substrate.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911318400.6A CN113012567A (en) | 2019-12-19 | 2019-12-19 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911318400.6A CN113012567A (en) | 2019-12-19 | 2019-12-19 | Display panel and display device |
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| CN113012567A true CN113012567A (en) | 2021-06-22 |
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| CN201911318400.6A Pending CN113012567A (en) | 2019-12-19 | 2019-12-19 | Display panel and display device |
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Cited By (1)
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| CN114842760A (en) * | 2022-04-14 | 2022-08-02 | 京东方科技集团股份有限公司 | Display module and display device |
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Application publication date: 20210622 |
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