CN112976559A - Alignment method and film pasting method based on linear array CCD - Google Patents
Alignment method and film pasting method based on linear array CCD Download PDFInfo
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- CN112976559A CN112976559A CN202110159961.7A CN202110159961A CN112976559A CN 112976559 A CN112976559 A CN 112976559A CN 202110159961 A CN202110159961 A CN 202110159961A CN 112976559 A CN112976559 A CN 112976559A
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 230000001681 protective effect Effects 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 12
- 239000002699 waste material Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 51
- 238000010030 laminating Methods 0.000 description 7
- 230000006978 adaptation Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Image Processing (AREA)
Abstract
The invention provides a counterpoint method and a film pasting method based on a linear array CCD (charge coupled device) to realize counterpoint of a first base material and a second base material on counterpoint equipment, wherein the counterpoint method comprises the following steps: step 1: defining a coordinate plane, step 2: moving the first substrate; and step 3: acquiring an image of a first substrate; and 4, step 4: acquiring coordinates of four corner points of a first base material; and 5: moving the second substrate; step 6: acquiring an image of a second substrate; and 7: obtaining coordinates of four corner points of the second base material; and 8: rotating the first substrate/second substrate; and step 9: calculating the difference between the coordinates of the four corner points of the first base material and the coordinates of the four corner points of the second base material; step 10: circulating the step 8 and the step 9, and selecting a combination with the minimum difference value among the coordinates of the four corner points as a joint coordinate to complete alignment; the film pasting method is used for realizing the alignment and the lamination of the protective film and the copper plate, is applied to a film pasting machine, and realizes the alignment by the alignment method.
Description
Technical Field
The invention relates to an alignment method and a film pasting method, in particular to an alignment method and a film pasting method based on a linear array CCD.
Background
In the prior art, the film pasting alignment of a single covering film is basically performed manually, or an area array CCD alignment system is used for performing alignment. The manual alignment speed is slow and the cost is high, and the existing laminating machines of the same type in the market all adopt an area array CCD alignment system. The alignment is carried out through the area array CCD alignment system, the coordinates of alignment feature points need to be preset, the product moves to the positions above the alignment feature points through the X axis and the Y axis, 2 points are photographed through the area array CCD alignment system, and the computer analyzes the image obtained according to the coordinates of the X axis and the Y axis where the product is located and the image obtained by the image processing software to obtain the actual coordinates of the cover film or the substrate. The area array CCD alignment system is very troublesome when the product needs to be aligned again during model changing, the position of a proper alignment characteristic point needs to be found out firstly by moving the XY axes, the actual coordinates of the covering film or the base plate are obtained through analysis, the alignment time is long, the efficiency is low, and the area array CCD alignment system takes pictures to obtain a plurality of pictures with small ranges, so that a complete image of the covering film or the base material cannot be obtained, and the base material is deformed due to cold contraction and thermal expansion, so that the two points are aligned to generate a bonding error, and the alignment effect of the area array CCD cannot achieve an ideal effect, so that a new alignment method and a film pasting method need to be provided.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a linear array CCD-based alignment method and a film pasting method.
The invention provides an alignment method based on a linear array CCD, which is applied to alignment equipment to realize the alignment of a first base material and a second base material on the alignment equipment, wherein an alignment device comprises a first linear array CCD image acquisition device, a second CCD image acquisition device, an image processing device and an alignment device, and the alignment method comprises the following steps: step 1: defining a coordinate plane, taking the alignment center of the alignment equipment as an origin, taking an X axis as the moving direction of the first base material, taking a Y axis as the moving direction of the second base material, and taking a Z axis perpendicular to an X, Y axis; step 2: the first substrate moves along the X-axis direction until the rotation center of the first substrate is aligned with the origin; and step 3: the first linear array CCD image acquisition device continuously scans a first base material and the image processing device splices and processes the scanned images into a first image; and 4, step 4: the alignment device acquires four corner coordinates of the first base material according to the first image; and 5: the second substrate moves along the Y-axis direction until the rotation center of the second substrate is aligned with the origin; step 6: the second linear array CCD image acquisition device continuously scans a second base material and the image processing device splices and processes the scanned images into a second image; and 7: the alignment device acquires four corner coordinates of the second base material according to the second image; and 8: rotating the first base material or the second base material clockwise/anticlockwise along the rotation center, and calculating the coordinates of the first base material or the second base material after rotation according to the rotation angle; and step 9: calculating the difference between the coordinates of the four corner points of the first base material and the coordinates of the four corner points of the second base material; step 10: and (6) circulating the steps 8 and 9, selecting a combination with the smallest difference value between the four corner coordinates of the first base material and the four corner coordinates of the second base material as a fitting coordinate, and rotating the first base material and the second base material to complete alignment.
Preferably, the step 10 is implemented by repeating the steps 8 and 9 six hundred times, and selecting a combination of the coordinates of the four corner points of the first substrate and the coordinates of the four corner points of the second substrate with the smallest difference as a fitting coordinate to complete alignment, wherein in the step 8, each rotation angle is increased by 0.01 degrees.
Preferably, step 10 is specifically to loop six hundred times steps 8 and 9, select a combination of the minimum difference between the four corner coordinates of the first substrate and the four corner coordinates of the second substrate as an initial fitting coordinate, and complete initial alignment, wherein in step 8, each rotation angle is increased by 0.01 °, after the initial alignment is completed, loop two hundred times steps 8 and 9, select a combination of the minimum difference between the four corner coordinates of the first substrate and the four corner coordinates of the second substrate as a fitting coordinate, and complete alignment, wherein in step 8, each rotation angle is increased by 0.001 °.
Preferably, when the cycle of steps 8 and 9 is performed six hundred times, the first substrate or the second substrate in step 8 rotates three hundred times clockwise and counterclockwise respectively with the rotation center as the starting point.
Preferably, when the cycle of steps 8 and 9 is performed two hundred times, the first substrate or the second substrate in step 8 rotates one hundred times clockwise and counterclockwise respectively with the rotation center as the starting point.
The invention also provides a film pasting method based on the linear array CCD, which is applied to a film pasting machine to realize the film pasting of the alignment of the protection film and the copper plate, wherein the film pasting machine comprises a first linear array CCD image acquisition device, a second CCD image acquisition device, an image processing device and an alignment device, and the alignment of the protection film and the copper plate is realized according to the alignment method based on the linear array CCD.
Preferably, the first linear array CCD image obtaining device is arranged on a moving path of the copper plate, and includes a first linear array CCD camera, a first light source and a first high-speed counter, when the copper plate moves, the first high-speed counter triggers the first linear array CCD camera to continuously scan and obtain images of the copper plate, the second linear array CCD image obtaining device is arranged on a moving path of the protective film, and includes a second linear array camera, a second light source and a second high-speed counter, when the protective film moves, the second high-speed counter triggers the second linear array camera to continuously scan and obtain images of the protective film.
Preferably, the laminator further comprises a residual detection device for detecting whether the protective film has residual waste material according to the image.
Preferably, the laminator further comprises a measuring device for measuring the sizes of the copper plate and the protective film according to the image.
Preferably, the laminator further comprises a direction detection device for detecting the direction of the copper plate and the protection film when performing alignment according to the image.
Preferably, the laminator further comprises a bonding detection device for detecting the bonding degree of the protective film and the copper plate according to the image.
The invention provides a counterpoint method based on a linear array CCD, which obtains a complete substrate image by continuous scanning of a linear array CCD image acquisition device when a substrate moves so as to accurately obtain four corner coordinates of the substrate, circularly calculates the difference value of the four corner coordinates of the two substrates by relative rotation of the two substrates, and takes a group of coordinates with the minimum difference value as final lamination coordinates to realize accurate counterpoint, meanwhile, compared with a planar array CCD image acquisition device, the linear array CCD image acquisition device can be matched with products with different sizes all the time, does not need to adjust the scanning position of the image acquisition device when replacing the substrate, has stronger universality, and finally, the linear array CCD image acquisition device can obtain the complete substrate image which can also be used as the basis of substrate defect detection to further enhance the product yield quality, therefore, the invention provides a film pasting method based on the linear array CCD, can realize accurate counterpoint pad pasting, can detect the integrality of copper and protection film simultaneously, promote the product output quality of laminating machine.
Drawings
FIG. 1 is a diagram of the steps of a method for alignment based on a linear array CCD provided by the invention;
fig. 2 is a diagram of the specific circulation steps of step 8 and step 9 in the alignment method based on the linear array CCD provided by the present invention;
FIG. 3 is a perspective view of an FPC film laminating machine based on a linear array CCD provided by the invention;
FIG. 4 is a top view of an FPC film laminating machine based on linear array CCD provided by the invention;
FIG. 5 is a front view of an FPC film laminating machine based on a linear array CCD provided by the invention;
fig. 6 is a partial perspective view of the first linear CCD image acquisition device of the FPC laminator in fig. 2.
Detailed Description
The alignment method based on the linear array CCD provided by the present invention is further described below with reference to the accompanying drawings, and it should be noted that the technical solution and the design principle of the present invention are explained in detail below only with an optimized technical solution.
Referring to fig. 1, the alignment method based on linear array CCD provided by the present invention is applied to an alignment apparatus to achieve alignment of a first substrate and a second substrate on the alignment apparatus, wherein the alignment apparatus includes a first linear array CCD image obtaining device, a second CCD image obtaining device, an image processing device and an alignment device, and includes the following steps:
step 1: defining a coordinate plane, taking the alignment center of the alignment equipment as an origin, taking an X axis as the moving direction of the first base material, taking a Y axis as the moving direction of the second base material, and taking a Z axis perpendicular to an X, Y axis;
step 2: the first substrate moves along the X-axis direction until the rotation center of the first substrate is aligned with the origin;
and step 3: the first linear array CCD image acquisition device continuously scans a first base material and the image processing device splices and processes the scanned images into a first image;
and 4, step 4: the alignment device acquires four corner coordinates of the first base material according to the first image;
and 5: the second substrate moves along the Y-axis direction until the rotation center of the second substrate is aligned with the origin;
step 6: the second linear array CCD image acquisition device continuously scans a second base material and the image processing device splices and processes the scanned images into a second image;
and 7: the alignment device acquires four corner coordinates of the second base material according to the second image;
and 8: rotating the first base material or the second base material clockwise/anticlockwise along the rotation center, and calculating the coordinates of the first base material or the second base material after rotation according to the rotation angle;
and step 9: calculating the difference between the coordinates of the four corner points of the first base material and the coordinates of the four corner points of the second base material;
step 10: and (6) circulating the steps 8 and 9, selecting a combination with the smallest difference value between the four corner coordinates of the first base material and the four corner coordinates of the second base material as a fitting coordinate, and rotating the first base material and the second base material to complete alignment.
Specifically, with reference to fig. 2, in this embodiment, in step 10, six hundred steps 8 and 9 are first cycled to complete the preliminary alignment, and then two hundred steps 8 and 9 are continuously cycled to complete the final alignment, specifically: when the first six hundred cycles are performed, when the first base material or the second base material in the step 8 rotates, the rotation center is taken as a starting point to rotate clockwise and anticlockwise for three hundred times respectively, each rotation angle is increased by 0.01 degrees, the difference value of coordinates of four corner points between the two base materials is calculated after each rotation is completed, after the six hundred times of cycles are completed, a group of coordinates with the minimum difference value is selected to complete preliminary alignment, and then, the step 8 and the step 9 are continuously circulated for two hundred times, wherein when the first base material or the second base material in the step 8 rotates, the rotation center is taken as the starting point to rotate clockwise and anticlockwise for one hundred times respectively, each rotation angle is increased by 0.001 degrees, each rotation is completed to calculate the difference value of coordinates of four corner points between the two base materials, and after the two hundred times of cycles are completed, a group of coordinates with the minimum difference value is selected. Of course, the final positioning coordinate may be selected by selecting the middle value between the maximum coordinate difference and the minimum coordinate difference as the final positioning coordinate during the circular calculation, and the selection of the final coordinate value is not described herein.
Referring to fig. 3, 4, 5 and 6, an FPC film laminating machine according to an embodiment of the present invention is used for implementing film lamination by alignment of a protection film and a copper plate, and includes a first line CCD image obtaining device 1, a second CCD image obtaining device 2, a copper plate moving shaft 3, a protection film moving shaft 4, a head 5, an alignment platform 6, a copper plate placing table 7, an image processing device (not shown) and an alignment device (not shown), wherein the first line CCD image obtaining device 1 is disposed on a moving path of the copper plate, that is, on the copper plate moving shaft 3, and includes a first CCD line camera 11, a first light source 12 and a first high speed counter (not shown), when the copper plate placing table 7 carries the copper plate to move to the alignment platform 6 along the copper plate moving shaft 3, the first high speed counter triggers the first copper plate CCD line camera 11 to continuously scan the obtained images, the second linear CCD image obtaining device 2 is arranged on the moving path of the protective film, namely on the protective film moving shaft 4, which comprises a second CCD linear array camera, a second light source and a second high-speed counter, when the sticking head 5 absorbs the protective film and moves to the contraposition platform 6 along the protective film moving shaft, the second high-speed counter triggers the second linear array camera to continuously scan and acquire images of the protective film, the second linear array CCD image acquisition device is different from the first linear array CCD image acquisition device in that the first linear array CCD camera is arranged above the copper plate, the first linear array CCD camera continuously scans and acquires the copper plate image from top to bottom when the copper plate passes below the first linear array CCD camera, and the second linear array CCD camera is arranged below the protective film, and when the protective film passes above the second linear array CCD camera, the second linear array CCD camera continuously scans from bottom to top to obtain images of the protective film. Specifically, when the FPC film laminator performs alignment, the alignment method based on the linear array CCD as described above is applied, wherein the copper plate moving axis 3 may be regarded as an X axis, the protection film moving axis 4 may be regarded as a Y axis, and other alignment processes are not repeated herein.
In addition, based on the characteristics of the linear array CCD image acquisition device, since the linear array CCD image acquisition device can acquire a complete image of the protective film and an image of the copper plate, it is preferable that the FPC film laminating machine further comprises a residual detection device, a measurement device, a direction detection device, and a bonding detection device, wherein the residual detection device is used for detecting whether residual waste exists in the protective film according to the image; the measuring device is used for measuring the sizes of the copper plate and the protective film according to the image; the direction detection device is used for detecting the direction of the copper plate and the protective film when the alignment is executed according to the image; and the bonding detection device is used for detecting the bonding degree of the protective film and the copper plate according to the image.
According to the alignment method and the film sticking method based on the linear array CCD, provided by the invention, the alignment and sticking of the base materials are realized by the image acquisition of the whole base material and the alignment of four corner coordinates, so that the film sticking efficiency and the film sticking quality can be greatly improved by the film sticking machine.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (10)
1. An alignment method based on linear array CCD is applied to alignment equipment to realize alignment of a first substrate and a second substrate on the alignment equipment, and is characterized in that an alignment device comprises a first linear array CCD image acquisition device, a second linear array CCD image acquisition device, an image processing device and an alignment device, and the alignment method comprises the following steps:
step 1: defining a coordinate plane, taking the center of an alignment platform of alignment equipment as an origin, taking an X axis as the moving direction of a first base material, taking a Y axis as the moving direction of a second base material, and taking a Z axis perpendicular to an X, Y axis;
step 2: the first substrate moves along the X-axis direction until the rotation center of the first substrate is aligned with the origin;
and step 3: the first linear array CCD image acquisition device continuously scans a first base material and the image processing device splices and processes the scanned images into a first image;
and 4, step 4: the alignment device acquires four corner coordinates of the first base material according to the first image;
and 5: the second substrate moves along the Y-axis direction until the rotation center of the second substrate is aligned with the origin;
step 6: the second linear array CCD image acquisition device continuously scans a second base material and the image processing device splices and processes the scanned images into a second image;
and 7: the alignment device acquires four corner coordinates of the second base material according to the second image;
and 8: rotating the first base material or the second base material clockwise/anticlockwise along the rotation center, and calculating the coordinates of the first base material or the second base material after rotation according to the rotation angle;
and step 9: calculating the difference between the coordinates of the four corner points of the first base material and the coordinates of the four corner points of the second base material;
step 10: and (6) circulating the steps 8 and 9, selecting a combination with the smallest difference value between the four corner coordinates of the first base material and the four corner coordinates of the second base material as a fitting coordinate, and rotating the first base material and the second base material to complete alignment.
2. The alignment method according to claim 1, wherein the step 10 is implemented by repeating the steps 8 and 9 six hundred times, and selecting a combination of the coordinates of the four corner points of the first substrate and the coordinates of the four corner points of the second substrate with the smallest difference as the fitting coordinates to complete alignment, wherein in the step 8, the rotation angle is increased by 0.01 ° each time.
3. The alignment method according to claim 2, wherein the step 10 is specifically implemented by repeating the steps 8 and 9 six hundred times, selecting a combination of the coordinates of the four corner points of the first substrate and the coordinates of the four corner points of the second substrate with the smallest difference as a preliminary alignment coordinate, and completing the preliminary alignment, wherein in the step 8, the rotation angle is increased by 0.01 ° each time, and after completing the preliminary alignment, the steps 8 and 9 are continuously repeated two hundred times, and selecting a combination of the coordinates of the four corner points of the first substrate and the coordinates of the four corner points of the second substrate with the smallest difference as an alignment coordinate, and completing the alignment, wherein in the step 8, the rotation angle is increased by 0.001 ° each time.
4. The alignment method according to claim 2 or 3, wherein six hundred cycles of steps 8 and 9 are performed, and when the first substrate or the second substrate in step 8 rotates, the substrate rotates clockwise and counterclockwise three hundred times respectively with the rotation center as a starting point.
5. The linear array CCD-based alignment method of claim 3, wherein two hundred cycles of steps 8 and 9 are performed, and when the first substrate or the second substrate in step 8 rotates, the substrate rotates clockwise and counterclockwise one hundred times respectively with the rotation center as an initial point.
6. A film sticking method based on a linear array CCD is applied to a film sticking machine to realize the film sticking of a protection film and a copper plate in an alignment way, and is characterized in that the film sticking machine comprises a first linear array CCD image acquisition device, a second linear array CCD image acquisition device, an image processing device and an alignment device, and the protection film and the copper plate realize the alignment according to the alignment method based on the linear array CCD as claimed in any one of claims 1 to 5.
7. The film pasting method based on the line CCD array as claimed in claim 6, wherein the first line CCD image acquisition device is disposed on a moving path of the copper plate and comprises a first line CCD camera, a first light source and a first high-speed counter, when the copper plate moves, the first high-speed counter triggers the first line CCD camera to continuously scan and acquire the image of the copper plate, and the second line CCD image acquisition device is disposed on a moving path of the protective film and comprises a second line CCD camera, a second light source and a second high-speed counter, when the protective film moves, the second high-speed counter triggers the second line CCD camera to continuously scan and acquire the image of the protective film.
8. The film pasting method based on the linear array CCD of claim 6, wherein the film pasting machine further comprises a residual detection device for detecting whether the protective film has residual waste materials according to the image.
9. The film pasting method based on the linear array CCD of claim 7, wherein the film pasting machine further comprises a measuring device for measuring the sizes of the copper plate and the protective film according to the image.
10. The film pasting method based on the linear array CCD of claim 7, wherein the film pasting machine further comprises a direction detection device for detecting the direction of the copper plate and the protection film when performing the alignment according to the image.
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| JP2000076611A (en) * | 1998-09-01 | 2000-03-14 | Seiko Seiki Co Ltd | Device and method for mounting |
| JP2007096069A (en) * | 2005-09-29 | 2007-04-12 | Nikon Corp | Alignment method, overlapping accuracy measurement method, exposure method, alignment apparatus, exposure apparatus, and overlapping accuracy measurement apparatus |
| CN101472394A (en) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Contraposition device |
| CN102152595A (en) * | 2010-12-10 | 2011-08-17 | 苏州凯蒂亚半导体制造设备有限公司 | Method for lamination alignment in manufacturing process of touch screen or flat-panel display |
| CN103640317A (en) * | 2013-12-27 | 2014-03-19 | 东莞市华恒工业自动化集成有限公司 | Full-automatic film sticking machine |
| CN106564267A (en) * | 2016-11-03 | 2017-04-19 | 深圳市伟鸿科科技有限公司 | Backlight CCD laminating technology and backlight CCD laminator |
| CN109191527A (en) * | 2018-11-15 | 2019-01-11 | 凌云光技术集团有限责任公司 | A kind of alignment method and device based on minimum range deviation |
-
2021
- 2021-02-05 CN CN202110159961.7A patent/CN112976559B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000076611A (en) * | 1998-09-01 | 2000-03-14 | Seiko Seiki Co Ltd | Device and method for mounting |
| JP2007096069A (en) * | 2005-09-29 | 2007-04-12 | Nikon Corp | Alignment method, overlapping accuracy measurement method, exposure method, alignment apparatus, exposure apparatus, and overlapping accuracy measurement apparatus |
| CN101472394A (en) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Contraposition device |
| CN102152595A (en) * | 2010-12-10 | 2011-08-17 | 苏州凯蒂亚半导体制造设备有限公司 | Method for lamination alignment in manufacturing process of touch screen or flat-panel display |
| CN103640317A (en) * | 2013-12-27 | 2014-03-19 | 东莞市华恒工业自动化集成有限公司 | Full-automatic film sticking machine |
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| CN112976559B (en) | 2022-11-25 |
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Denomination of invention: A Alignment Method and Coating Method Based on Linear Array CCD Effective date of registration: 20231009 Granted publication date: 20221125 Pledgee: Shanwei Branch of Postal Savings Bank of China Co.,Ltd. Pledgor: Guangdong Kesheng Intelligent Equipment Co.,Ltd. Registration number: Y2023980060361 |