CN112934638B - Repairing method for local damage of atomic oxygen protective layer on surface of organic material - Google Patents

Repairing method for local damage of atomic oxygen protective layer on surface of organic material Download PDF

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CN112934638B
CN112934638B CN201911269437.4A CN201911269437A CN112934638B CN 112934638 B CN112934638 B CN 112934638B CN 201911269437 A CN201911269437 A CN 201911269437A CN 112934638 B CN112934638 B CN 112934638B
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atomic oxygen
protective layer
silane
organic material
oxygen protective
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CN112934638A (en
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宋力昕
谷红宇
张涛
吕少波
张锦麟
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Shanghai Institute of Ceramics of CAS
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/005—Repairing damaged coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2518/00—Other type of polymers
    • B05D2518/10—Silicon-containing polymers
    • B05D2518/12—Ceramic precursors (polysiloxanes, polysilazanes)

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Abstract

The invention relates to a repairing method after local damage of an atomic oxygen protective layer on the surface of an organic material, which comprises the steps of coating a silane solution on the damaged position of the surface of the atomic oxygen protective layer on the surface of the organic material, and then carrying out high-temperature heat treatment at 25-300 ℃ to realize the repairing of the atomic oxygen protective layer, wherein the atomic oxygen protective layer is a silicon-containing film layer; the silane has the chemical formula of (YR) n SiX 4‑n N is more than or equal to 1 and less than or equal to 3, wherein Y is a carbon functional group capable of reacting with an organic material, and preferably at least one of unsaturated isocyanate, amino, epoxy and cyano; x is a silicon functional group capable of reacting with the atomic oxygen barrier layer, preferably at least one of alkoxy, halo, acyloxy, silanol, and hydrosilane.

Description

Repairing method for local damage of atomic oxygen protective layer on surface of organic material
Technical Field
The invention relates to a repairing method of an atomic oxygen protective layer on the surface of an organic material after local damage, belonging to the technical field of space material space environment protection.
Background
The organic material has the advantages of good flexibility, light weight, low cost, easy processing and the like, is an important component in various fields of household appliances, electronic information, automobile industry, aerospace and the like, and has a great role in various fields as an important material closely related to national economy, high-tech technology and modern life. However, atomic oxygen in the low orbital space environment can cause strong oxidation and corrosion of organic materials, directly leading to component failure. The surface protection is an important technology of AO protection, which can provide a barrier between a base material and an AO environment on the premise of not influencing the use performance of the base by preparing a protective layer (comprising a gradual change layer) on the basis of the existing film, thereby avoiding the direct contact between AO and the base and protecting the base from being corroded.
With the rapid development of science and technology and the increasing development and utilization of space resources by human beings, people put forward higher requirements on the service life and stability and reliability of organic materials, however, samples after the surface protection of the organic materials are easy to be locally damaged due to external force in the subsequent integrated processing or in-orbit use process. Due to the undercutting effect of AO, AO undercuts the organic material from the damaged area, which aggravates the erosion of substrate PI. Because the damage is difficult to avoid, it is very important to develop a repairing method after the atomic oxygen protective layer on the surface of the organic material is partially damaged.
Disclosure of Invention
Aiming at the repairing requirement of the atomic oxygen protective layer on the surface of the organic material after local damage, the invention aims to provide the repairing method of the atomic oxygen protective layer on the surface of the organic material after local damage.
The invention provides a repairing method after an atomic oxygen protective layer on the surface of an organic material is partially damaged, which comprises the steps of coating a silane solution on the damaged position of the surface of the atomic oxygen protective layer on the surface of the organic material, and then carrying out high-temperature heat treatment at 25-300 ℃ to realize the repairing of the atomic oxygen protective layer, wherein the atomic oxygen protective layer is a silicon-containing film layer;
the silane has the chemical formula of (YR) n SiX 4-n N is more than or equal to 1 and less than or equal to 3, wherein Y is a carbon functional group capable of reacting with an organic material, and preferably at least one of unsaturated isocyanate, amino, epoxy and cyano; and X is a silicon functional group capable of reacting and bonding with the atomic oxygen protective layer, and is preferably at least one of alkoxy, halogen, acyloxy, silanol and silicon hydride.
In the present disclosure, the silane used to repair the atomic oxygen protective layer on the surface of the organic material may be one or more of silicones, and the silane should contain both a carbon functional group capable of reacting with the organic material and a silicon functional group capable of reacting with and bonding to the atomic oxygen protective layer. The carbon functional group capable of reacting with the organic material may be one or more of unsaturated isocyanate, amino, epoxy and other organic carbon functional groups. The silicon functional group capable of reacting and bonding with the original atomic oxygen protective layer can be one or more of silicon functional groups such as alkoxy, halogen, acyloxy, silanol, silicon hydride and the like. It is further preferable to use a combination of silanes in order to reduce the interfacial stress by forming a gradient layer through the difference in the ease of diffusion reaction and the surface energy during the diffusion reaction. And coating a silane solution at the position of the atomic oxygen protective layer (namely the silicon-containing film layer) on the surface of the damaged organic material to ensure that silane is subjected to diffusion reaction to the interior of the organic material and the original AO protective layer, and then further promoting the diffusion reaction of the silane to the interior of the organic material and the original AO protective layer through high-temperature heat treatment at the temperature of 25-300 ℃ to form a continuous silicon-containing film layer again to realize repair.
Preferably, the silane is selected from at least one of isocyanate hydrocarbon silane, amino hydrocarbon silane, epoxy hydrocarbon silane and cyano hydrocarbon silane; preferably, the silane is selected from the group consisting of N-aminoethyl-3-aminopropylmethyldimethoxysilane, aminopropylmethyldiethoxysilane, N-aminoethyl-3-aminopropyltriethoxysilane, and 3-aminopropyltriethoxysilane.
Preferably, the concentration of the silane solution is 5 to 60wt%.
Preferably, the concentrations of N-aminoethyl-3-aminopropylmethyldimethoxysilane, aminopropylmethyldiethoxysilane, N-aminoethyl-3-aminopropyltriethoxysilane and 3-aminopropyltriethoxysilane in the silane solution are (0-30 wt%): (0-30 wt%): (0-30 wt%): (0-30 wt%) and the sum of the concentrations of all the components is 5-60 wt%. The composition and concentration of the silane solution is related to the substrate. The smaller the flexibility and thermal expansion coefficient of the substrate, the higher the proportion of the aminoalkyl silane n =3 so that its three-dimensional degree of crosslinking increases, the hardness increases and the thermal expansion coefficient decreases.
Preferably, the organic material is at least one selected from the group consisting of polyimides, polyesters, epoxies, polyvinyl chlorides, and phenolics.
Preferably, the solvent of the silane solution is at least one selected from the group consisting of ethanol, isopropanol, butanol, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone and tetrahydrofuran.
Preferably, the coating method includes a dipping method, a brushing method, or a spraying method.
Preferably, the temperature of the high-temperature heat treatment is 50-150 ℃.
Preferably, the time of the high-temperature heat treatment may be 1 to 48 hours.
Preferably, the silane solution is coated on the damaged position of the surface of the atomic oxygen protective layer on the surface of the organic material for a plurality of times, the thermal expansion coefficients of the silane and the organic material in the silane solution coated for the first time are controlled to be matched, and from the second time, the R/Si value in the silane coated for each time is less than the R/Si value in the silane coated for the previous time, or the n value in the silane coated for each time is less than the n value in the silane coated for the previous time. If the atomic oxygen protective layer is damaged deeply, the protective layer formed by one-time coating is thinner, and the thickness of the protective layer can be increased by multiple repairs.
Preferably, after the high-temperature heat treatment is finished, stabilizing the repaired atomic oxygen protective layer on the surface of the organic material; the stabilizing treatment is ultraviolet light oxidation treatment or/and heat treatment, preferably ultraviolet light oxidation treatment, and further heat treatment to weaken stress;
the intensity of UV light of the ultraviolet light oxidation treatment is 2-15 mW/cm 2 For 1 to 24 hours;
the temperature of the heat treatment is 100-150 ℃, and the time is 2-48 hours. Then, si and O-rich SiO-like substances can be further formed on the outer surface of the atomic oxygen protective layer through stabilizing treatment x The outermost surface.
Has the advantages that:
in the invention, the silicon-containing film layer which is formed by the diffusion reaction of silane to the inside of the organic material and the original AO protective layer and is in reaction bonding with the original AO protective layer at the damaged part is repaired, the connection formed by the chemical reaction bonding has better bonding force, the gradual change diffusion layer bonding at the interface caused by the diffusion reaction kinetics is beneficial to increasing the bonding force and avoiding the interface mutation stress, and the invention has the advantages that the common coating does not have;
after the damaged atomic oxygen protective layer on the surface of the organic material is repaired by the method, the surface of the treated organic material has excellent atomic oxygen prevention performance, the organic material can bear multiple cold and hot cycles without generating defects such as cracks, the adhesion force and the heat cycle resistance of the repairing film layer are good, and the method can be used for repairing the surface damage of the atomic oxygen protective layer on the surface of the organic material in the ground integrated processing or transportation process or after the atomic oxygen protective layer runs on a rail.
Drawings
FIG. 1 is a mass loss and Kapton PI mass loss theoretical value curve of a ground AO test performed after repairing a damaged polyimide film surface AO protective layer in example 1;
fig. 2 is an SEM image of the surface of the sample after repair in example 1.
Detailed Description
The present invention is further illustrated by the following examples, which are to be understood as merely illustrative and not restrictive.
According to the method, the atomic oxygen protective layer on the surface of the damaged organic material is coated to enable silane to perform diffusion reaction to the inside of the organic material and the original AO protective layer, then the diffusion reaction of the silane to the inside of the organic material and the original AO protective layer is further promoted through high-temperature heat treatment, and the continuous silicon-containing film layer is formed again to realize repair. The following exemplarily illustrates a specific process of the repairing method.
The silane for repairing the atomic oxygen protective layer on the surface of the organic material can be compared with the silane used for preparing the atomic oxygen protective layer, whether the protective layer can be formed on the surface of the original base material in a bonding mode or not is considered, whether a consistent and continuous film layer can be formed with the original atomic oxygen protective layer or not is also considered, and the original protective layer cannot be influenced. For example, part of the silicon-functional organosilane can form an atomic oxygen protective layer on the surface of polyimide by alkali-acid activation silanization, but the original atomic oxygen protective layer is adversely affected by the alkali-acid activation process, and the silicon-functional organosilane is not suitable for being used as a repairing silane.
The organic material in the atomic oxygen protective layer on the surface of the organic material can be polyimideAnd imines, polyesters, epoxies, polyvinyl chlorides, and phenolics. The atomic oxygen protective layer is a silicon-containing film layer and the like. Can be generally prepared by the activating silanization technology by using silicon functional organosilicon, and then forms SiO-like silicon on the outermost surface by stabilizing treatment x The surface is stabilized by ultraviolet light oxidation treatment, and the intensity of the UV light is 5mW/cm 2 The time period was 2 hours.
In an alternative embodiment, the silane used to repair the atomic oxygen barrier layer on the surface of the organic material may be one or more of silicones, and the silane should include both carbon functional groups capable of reacting with the organic material and silicon functional groups capable of reacting with and bonding with the original atomic oxygen barrier layer. The carbon functional group capable of reacting with the organic material can be one or more of organic carbon functional groups such as unsaturated isocyanate, amino, epoxy and the like, and the silicon functional group capable of reacting and bonding with the original atomic oxygen protective layer can be one or more of silicon functional groups such as alkoxy, halogen, acyloxy, silanol, silicon hydride and the like. A combination of silanes is preferred to form a graded layer to reduce interfacial stress through the ease of diffusion reaction and differences in surface energy during the diffusion reaction. For example, the concentration ratios of N-aminoethyl-3-aminopropylmethyldimethoxysilane, aminopropylmethyldiethoxysilane, N-aminoethyl-3-aminopropyltriethoxysilane, and 3-aminopropyltriethoxysilane in the silane solution may be (1 to 30% by weight), respectively: (1-30 wt%): (1-30 wt%): (1-30 wt%) and the sum of all the components is 5-60 wt%.
In alternative embodiments, the silane solution may employ a variety of solvents including one or more of ethanol, isopropanol, butanol, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, tetrahydrofuran, and the like. Solvents which have some swellability to the organic substrate but which do not affect the bulk properties of the organic substrate after evaporation are preferred.
And (3) coating the silane solution on the surface of the atomic oxygen protective layer of the organic material by a soaking method, a brushing method, a spraying method and the like. The silicon-containing film layer may be further engineered by multiple coating passes, with the silane agents being the same or different, preferably different silane agentsAnd (5) designing a gradient film layer. Silane with (YR) n SiX 4-n It is shown that X is a silicon functional group which can be hydrolyzed, the first spraying agent is preferably a silane agent which is matched with the thermal expansion coefficient of the organic material after reaction, and the R/Si value or n value in the latter spraying silane agent is lower than that in the former spraying. The coating can be carried out in a temperature range of 25 ℃ to 150 ℃, preferably 50 ℃ to 100 ℃ depending on the silane reagent, and is preferably normal temperature in view of cost.
After the coating is finished, high-temperature heat treatment is carried out as soon as possible to promote silane reagent to further diffuse and react into the matrix, and simultaneously volatilize unreacted part of silane reagent or solvent, wherein the temperature is 25-300 ℃, and preferably 50-150 ℃. After high-temperature heat treatment, the silane can be further treated under certain temperature and humidity conditions, so that the silane reagents are fully hydrolyzed and crosslinked. The temperature range is 25 ℃ to 100 ℃, preferably 50 ℃ to 80 ℃. The silicon-containing film layer which is bonded with the organic material and the original atomic oxygen protective layer in a reaction way can be formed through the steps.
In an alternative embodiment, the repaired polyimide flexible substrate sample is further subjected to a stabilization treatment to form a Si, O-rich SiO-like substrate x The outermost surface. According to the difference of the silicon-containing gradient film layers prepared under different conditions, stabilizing treatment modes such as ultraviolet light oxidation and the like can be selected, and stress can be weakened through further heat treatment. Wherein the intensity of UV light for the ultraviolet light oxidation treatment can be 2-15 mW/cm 2 mW/cm 2 The time can be 1 to 24 hours. The temperature of the heat treatment can be 100-150 ℃ and the time can be 2-48 hours.
After the high temperature heat treatment and before the stabilization treatment, further treatment is carried out in the air, ensuring sufficient hydrolytic crosslinking between silane reagents. The treatment temperature can range from 25 ℃ to 100 ℃, preferably from 50 ℃ to 80 ℃. The atmosphere may be an air atmosphere. The humidity conditions may be 45-95% RH%. The time of the preliminary drying treatment may be 12 to 96 hours.
The repairing method has the advantages of simple process, easy implementation, low cost and the like, has little influence on the tensile property and the optical transmittance of the organic material, has good adhesive force and heat-resistant cycle performance of the modified layer, and can be used for repairing the surface damage of the organic material surface atomic oxygen protective layer in the ground integrated processing or transportation process or after in-orbit operation and the like.
The present invention will be described in detail by way of examples. It is also to be understood that the following examples are illustrative of the present invention and are not to be construed as limiting the scope of the invention, and that certain insubstantial modifications and adaptations of the invention by those skilled in the art may be made in light of the above teachings. The specific process parameters and the like of the following examples are also only one example of suitable ranges, i.e., those skilled in the art can select the appropriate ranges through the description herein, and are not limited to the specific values exemplified below.
Example 1
(1) Cutting 2 pieces of 2cm × 2cm polyimide flexible substrates with atomic oxygen protective layers. The atomic oxygen protective layer on the surface of the polyimide flexible substrate is prepared by adopting an activating silanization technology, the surface composition is C, H, O, N and Si, and Si is converted into atomic oxygen inert SiO in an atomic oxygen environment x Atomic oxygen protection is achieved, with Si content around 6 at.%;
(2) Scraping the original atomic oxygen protective layer in a region of 0.5 multiplied by 0.5cm in the middle by adopting a scalpel, and subsequently repairing one region, wherein the Si content of the region is scraped by adopting an XPS test, the test result of a part of the region is about 1at.%, and the Si content of the part of the region is lower than the detection limit;
(3) Spraying and cleaning the surface of the atomic oxygen protective layer by adopting a mixed solution of ethanol and acetone to remove adhesive substances such as debris and the like in the preparation process;
(4) 12% of N-aminoethyl-3-aminopropylmethyldimethoxysilane, 8% of aminopropylmethyldiethoxysilane, 5% of N-aminoethyl-3-aminopropyltriethoxysilane, 5% of 3-aminopropyltriethoxysilane in NMP solution (silane solution) was placed in the reaction chamber 1 and subjected to heat-insulating treatment at 60 ℃;
(5) After a dropper is adopted to absorb the uniformly mixed solution to be dropped in a damaged area of the polyimide flexible substrate, the solution is placed in an oven to be heated to 150 ℃ in a program manner and kept warm for 6 hours to enable silane to be further diffused and reacted, in the high-temperature heat treatment process, the unreacted silane solution can be fully volatilized so as to form a reaction bonded film layer, and then the temperature is reduced along with the oven, so that a repaired polyimide flexible substrate sample is obtained;
(6) Putting the polyimide flexible substrate sample repaired in the step (5) into an ultraviolet irradiation cavity at 5mW/cm 2 (measurement value of UV irradiator) was subjected to stabilization treatment in an atmospheric atmosphere at a UV light intensity for 10 hours.
The surface morphology of the sample is subjected to SEM test, and no obvious crack and other defects are found on the surface, as shown in figure 2. The surface composition of the samples was tested by XPS with Si content around 26at.% at different locations (damaged and undamaged areas). The atomic oxygen ground simulation test device is used for testing the atomic oxygen protective performance of the modified polyimide flexible substrate sample, the mass loss curve after different AO dose irradiation tests is shown in figure 1, compared with the original Kapton type polyimide film in the curve, the mass loss of the repaired sample after AO irradiation is almost unchanged, the atomic oxygen ground simulation test device has excellent atomic oxygen protective performance, and the repair is successfully realized (see figure 1). In addition, the mechanical property, thermal cycle performance and ultraviolet irradiation resistance of the obtained Si group implanted modified polyimide film are further tested, and the influence of the modification technology on the original performance of the PI is small, the change of the tensile property is small, the adhesive force and the heat cycle resistance of a modified layer are good, and the modified layer has excellent ultraviolet irradiation resistance.
Example 2
In this example 2, the repairing process is as follows: 7.5% by weight of N-aminoethyl-3-aminopropylmethyldimethoxysilane, 12.5% by weight of aminopropylmethyldiethoxysilane, 8% by weight of N-aminoethyl-3-aminopropyltriethoxysilane, 2% by weight of 3-aminopropyltriethoxysilane in NMP solution. The surface composition of the samples was tested by XPS with Si content around 26at.% at different locations (damaged and undamaged areas). The atomic oxygen ground simulation test device is used for testing the atomic oxygen protective performance of the modified polyimide flexible substrate sample, no obvious mass loss is found after the sample AO is irradiated after the repair, the modified polyimide flexible substrate sample has excellent atomic oxygen protective performance, and the repair is successfully realized.
Example 3
In this example 3, the repairing process is as follows: 5wt% of N-aminoethyl-3-aminopropylmethyldimethoxysilane, 15wt% of aminopropylmethyldiethoxysilane and 10wt% of N-aminoethyl-3-aminopropyltriethoxysilane in NMP solution. The surface composition of the samples was tested by XPS with Si content around 26at.% at different locations (damaged and undamaged areas). The atomic oxygen ground simulation test device is used for testing the atomic oxygen protective performance of the modified polyimide flexible substrate sample, no obvious mass loss is found after the sample AO is irradiated after the repair, the modified polyimide flexible substrate sample has excellent atomic oxygen protective performance, and the repair is successfully realized.
Example 4
In this example 4, the repairing process is as follows: 8% by weight of N-aminoethyl-3-aminopropylmethyldimethoxysilane, 8% by weight of aminopropylmethyldiethoxysilane, 4% by weight of N-aminoethyl-3-aminopropyltriethoxysilane in NMP to give solution 1;7.5wt% of N-aminoethyl-3-aminopropylmethyldimethoxysilane, 7.5wt% of aminopropylmethyldiethoxysilane, 5wt% of 3-aminopropyltriethoxysilane in NMP solution to obtain solution 2, 6wt% of N-aminoethyl-3-aminopropylmethyldimethoxysilane, 6wt% of aminopropylmethyldiethoxysilane, and 8wt% of N-aminoethyl-3-aminopropyltriethoxysilane in NMP solution to obtain solution 3, 10wt% of aminopropylmethyldiethoxysilane, and 10wt% of 3-aminopropyltriethoxysilane in NMP solution to obtain solution 4; the silane solutions are sequentially applied to the damaged site in the order of 1-2-3-4 during the spraying process. The surface composition of the samples was tested by XPS with Si content around 27at.% at different locations (damaged and undamaged areas). The atomic oxygen ground simulation test device is used for testing the atomic oxygen protective performance of the modified polyimide flexible substrate sample, no obvious mass loss is found after the sample AO is irradiated after the sample is repaired, the sample AO has excellent atomic oxygen protective performance, and the repair is successfully realized.
Finally, it must be said here that: the above embodiments are only used for further detailed description of the technical solutions of the present invention, and should not be understood as limiting the scope of the present invention, and the insubstantial modifications and adaptations made by those skilled in the art according to the above descriptions of the present invention are within the scope of the present invention.

Claims (7)

1. The repairing method is characterized in that silane solution is coated on the damaged position of the surface of the atomic oxygen protective layer on the surface of the organic material, and then high-temperature heat treatment is carried out at the temperature of 25-300 ℃ to realize the repairing of the atomic oxygen protective layer, wherein the atomic oxygen protective layer is a silicon-containing film layer;
the silane is selected from at least one of N-aminoethyl-3-aminopropylmethyldimethoxysilane, aminopropylmethyldiethoxysilane, N-aminoethyl-3-aminopropyltriethoxysilane and 3-aminopropyltriethoxysilane;
coating silane solution on the damaged position of the surface of the atomic oxygen protective layer on the surface of the organic material for multiple times, controlling the thermal expansion coefficients of silane and the organic material in the silane solution coated for the first time to be matched, and controlling the R/Si value in the silane coated for each time from the second time to be less than the R/Si value in the silane coated for the previous time;
after the high-temperature heat treatment is finished, stabilizing the repaired atomic oxygen protective layer on the surface of the organic material; the stabilizing treatment comprises ultraviolet light oxidation treatment and heat treatment;
the intensity of UV light of the ultraviolet light oxidation treatment is 2-15 mW/cm 2 The time is 1 to 24 hours;
the temperature of the heat treatment is 100-150 ℃, and the time is 2-48 hours.
2. The repair method according to claim 1, wherein the concentration of the silane solution is 5 to 60wt%.
3. The repairing method according to claim 1, wherein the concentrations of N-aminoethyl-3-aminopropylmethyldimethoxysilane, aminopropylmethyldiethoxysilane, N-aminoethyl-3-aminopropyltriethoxysilane, and 3-aminopropyltriethoxysilane in said silane solution are (0 to 30 wt%): (0-30 wt%): (0-30 wt%): (0-30 wt%) and the sum of the concentrations of all the components is 5-60 wt%.
4. The repair method according to claim 1, wherein the organic material is at least one selected from the group consisting of polyimides, polyesters, epoxies, polyvinyl chlorides, and phenolics.
5. The repair method according to claim 1, wherein the solvent of the silane solution is at least one selected from the group consisting of ethanol, isopropanol, butanol, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, and tetrahydrofuran.
6. The repair method according to claim 1, wherein the coating method comprises a dipping method, a brushing method, or a spraying method.
7. The repair method according to claim 1, wherein the temperature of the high-temperature heat treatment is 50 ℃ to 150 ℃.
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CN101094937A (en) * 2004-11-10 2007-12-26 凯密特尔股份有限公司 Process for producing a repair coating on a coated metallic surface
CN101426870A (en) * 2006-03-23 2009-05-06 陶氏康宁公司 Coatings with carbinol-functional siloxane resin

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Publication number Priority date Publication date Assignee Title
EP1013347A2 (en) * 1998-12-21 2000-06-28 General Electric Company Method of restoring damaged foul release coating area on a metallic surface
CN1826182A (en) * 2003-07-25 2006-08-30 分析服务和材料公司 Erosion-resistant silicone coatings for protection of fluid-handling parts
CN101094937A (en) * 2004-11-10 2007-12-26 凯密特尔股份有限公司 Process for producing a repair coating on a coated metallic surface
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