CN112828462A - Laser welding equipment for packaging electronic device - Google Patents
Laser welding equipment for packaging electronic device Download PDFInfo
- Publication number
- CN112828462A CN112828462A CN201911156139.4A CN201911156139A CN112828462A CN 112828462 A CN112828462 A CN 112828462A CN 201911156139 A CN201911156139 A CN 201911156139A CN 112828462 A CN112828462 A CN 112828462A
- Authority
- CN
- China
- Prior art keywords
- linear motion
- motion module
- electronic device
- laser welding
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 230000033001 locomotion Effects 0.000 claims abstract description 49
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 230000001681 protective effect Effects 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 11
- 239000000428 dust Substances 0.000 claims description 5
- 230000006872 improvement Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses laser welding equipment for packaging electronic devices, which comprises a laser head, a lifting platform, a first linear motion module arranged on the lifting platform, a second linear motion module arranged on the first linear motion module, a clamp platform arranged on the second linear motion module, and a rotary clamp arranged on the clamp platform, wherein the laser head is positioned above the rotary clamp, the first linear motion module and the second linear motion module are vertically arranged, and an adjusting mechanism for adjusting the pitching angle of the rotary clamp is arranged on the clamp platform. The invention has the advantages of simple structure, suitability for complex parts, good compatibility and the like.
Description
Technical Field
The invention relates to the technical field of electronic device packaging, in particular to laser welding equipment for electronic device packaging.
Background
With the continuous development of laser welding technology and the continuous increase of the global market demand for laser welding equipment, laser welding is widely applied to the fields of aerospace, integrated circuit manufacturing, automobile manufacturing and the like. Compared with the traditional welding, the laser welding has the advantages of high energy concentration, small heat affected zone, narrow heat affected zone, small joint deformation, low energy consumption, high efficiency, cleanness and the like, and can be used for performing deep fusion welding on large components and performing precise welding on micro elements. Laser welding technology is accelerating to penetrate to various application fields, and is gradually becoming one of the basic technologies of modern high-end manufacturing. Along with the development of electronic devices, such as small-sized sensors, infrared devices, microwave assemblies and the like, in the direction of miniaturization and miniaturization, in order to ensure the product quality and the service performance of device packaging, the device packaging is often completed by means of laser welding equipment, a laser head is adopted by a general laser sealing and welding machine to be fixed, the purpose of welding is achieved by moving a workpiece on a two-dimensional platform under the laser head, the mode can only carry out top cover welding on some simple box parts, complex parts needing to be welded on some side walls are difficult to apply, the equipment compatibility is poor (generally, the equipment can only be compatible with a plurality of different products at most), purchase, use and maintenance costs are increased for manufacturers, and the production requirements of large-scale small and medium-sized enterprises can not be met.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide laser welding equipment for electronic device packaging, which has a simple structure, can be suitable for complex parts and has good compatibility.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a laser welding equipment for electron device encapsulation, includes laser head, lift platform, locates the first linear motion module on the lift platform, locates the second linear motion module on the first linear motion module, locates the anchor clamps platform on the second linear motion module and locates the rotary fixture on the anchor clamps platform, the laser head is located the rotary fixture top, the first linear motion module with the second linear motion module is arranged perpendicularly, be equipped with the adjustment mechanism who is used for adjusting rotary fixture every single move angle on the anchor clamps platform.
As a further improvement of the above technical solution: rotary fixture locates on an installation panel, the mounting panel with the anchor clamps platform is articulated, adjustment mechanism includes regulating plate and regulation handle, the regulating plate is located on the anchor clamps platform and with the mounting panel is arranged perpendicularly, the arc adjustment tank has been seted up on the regulating plate, the regulation handle runs through behind the arc adjustment tank with the mounting panel links to each other.
As a further improvement of the above technical solution: the regulating plate upside is the arc, be equipped with on the mounting panel along the gliding location portion of regulating plate upside.
As a further improvement of the above technical solution: the regulating plate upside is equipped with the angle scale, be equipped with the angle pointer on the location portion.
As a further improvement of the above technical solution: the lifting platform is provided with a lifting guide rail.
As a further improvement of the above technical solution: the laser head is provided with a dust suction device.
As a further improvement of the above technical solution: the welding device further comprises a protective door, and a glove device for clamping the welded device is arranged on the protective door.
As a further improvement of the above technical solution: the glove device comprises a glove box, a sliding guide rail and a protective cylinder which are arranged on the glove box, and a baffle which can slide along the sliding guide rail, wherein a glove hole is formed in the protective cylinder.
Compared with the prior art, the invention has the advantages that: according to the laser welding equipment for packaging the electronic device, the lifting platform can realize the movement of the workpiece in the Z-axis direction and is used for welding the device with the step track in the Z-axis direction, the first linear motion module and the second linear motion module can realize the planar motion of the workpiece X, Y in the two-dimensional direction, the rotary clamp can drive the device to rotate around the axis by 360 degrees, and the pitching angle of the rotary clamp is changed through the adjusting mechanism to finish the complex welding work; when the device is used, a proper installation mode is selected for the device to be welded according to the complexity of the welding track of the electronic device to be welded, if the device to be welded only needs relative motion of a clamp platform and a laser head in X, Y, Z three directions, the device to be welded only needs to be fixed on the clamp platform, and equipment continuously sends corresponding control commands to a X, Y, Z three-direction motion servo controller according to the motion equation parameters of the welding track of the device to be welded, wherein the motion of X, Y in the two-dimensional platform direction is mainly completed through two linear motion modules, the control precision is high, the motion in the Z direction mainly pushes the clamp platform to reciprocate in the Z direction through a lifting platform, so that the relative compound motion of the device to be welded and the fixed laser welding head in X, Y, Z three directions is realized; for complex welding work, because a laser head of a common laser sealing welding machine is fixed, the top sealing welding can be only carried out on some simple box-type electronic devices, and complex parts needing to be welded on some side walls are difficult to apply.
Drawings
Fig. 1 is a schematic perspective view of a laser welding apparatus for electronic device packaging according to the present invention.
Fig. 2 is a schematic view of the structure of fig. 1 with a portion of the guard door removed.
Fig. 3 is a side view of fig. 2.
Fig. 4 is a schematic perspective view of the elevating platform of the present invention.
Fig. 5 is a schematic perspective view of an adjusting mechanism according to the present invention.
The reference numerals in the figures denote: 1. a laser head; 11. a dust collection device; 2. a lifting platform; 21. a lifting guide rail; 3. a first linear motion module; 4. a second linear motion module; 5. a clamp platform; 6. rotating the clamp; 61. mounting a plate; 62. a positioning part; 63. an angle pointer; 7. an adjustment mechanism; 71. an adjusting plate; 72. adjusting the handle; 73. an arc-shaped adjusting groove; 74. angle scales; 8. a protective door; 9. a glove device; 91. a glove box; 92. a sliding guide rail; 93. protecting the cylinder; 94. and a baffle plate.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples of the specification.
Fig. 1 to 5 show an embodiment of a laser welding apparatus for electronic device packaging according to the present invention, which includes a laser head 1, a lifting platform 2, a first linear motion module 3 disposed on the lifting platform 2, a second linear motion module 4 disposed on the first linear motion module 3, a fixture platform 5 disposed on the second linear motion module 4, and a rotary fixture 6 disposed on the fixture platform 5, wherein the laser head 1 is located above the rotary fixture 6, the first linear motion module 3 and the second linear motion module 4 are vertically arranged, and the fixture platform 5 is provided with an adjusting mechanism 7 for adjusting a pitch angle of the rotary fixture 6.
According to the laser welding equipment for packaging the electronic device, the lifting platform 2 can move in the Z-axis direction of the device to be welded and is used for welding the device with a step track in the Z-axis direction, the first linear motion module 3 and the second linear motion module 4 can move in a two-dimensional direction of the device to be welded X, Y, the rotary clamp 6 can drive the device to be welded to rotate 360 degrees around an axis, and the pitching angle of the rotary clamp 6 is changed through the adjusting mechanism 7 to complete complex welding work; when in use, a proper installation mode is selected for the welded device according to the complexity of the welding track of the welded electronic device, welding of the device to be welded only requires relative movement of the clamp platform 5 and the laser head 1 in X, Y, Z three directions, only the welded device is fixed on the clamp platform 5, the welding equipment continuously sends corresponding control commands to X, Y, Z three-direction motion servo controllers according to the parameters of the welding track motion equation of the welded device, wherein X, Y the motion of two-dimensional platform direction is mainly accomplished through the first rectilinear motion module 3 and the second rectilinear motion module 4, the control precision is high, the motion of Z axle direction mainly pushes the reciprocating motion of the clamp platform 5 in Z direction through the lifting platform 2, thereby realizing the relative compound movement of the welded part and the fixed laser head 1 in X, Y, Z three directions; for complex welding work, because the laser head 1 of a common laser sealing welding machine is fixed, the top sealing welding can be only carried out on some simple box-type electronic devices, and complex parts needing to be welded on some side walls are difficult to apply, and in order to increase the welding compatibility of the laser welding equipment to electronic devices of different structural types, the rotary clamp 6 is additionally arranged on the laser welding equipment, so that the welded device can automatically rotate 360 degrees along the axis of the rotary clamp 6, and meanwhile, the pitching angle can be changed through the adjusting mechanism 7 to complete complex welding work with multiple degrees of freedom, and the laser sealing welding equipment is simple in structure and good in compatibility.
Further, in this embodiment, the rotating fixture 6 is disposed on a mounting plate 61, the mounting plate 61 is hinged to the fixture platform 5, so that the mounting plate 61 can swing relative to the fixture platform 5, the adjusting mechanism 7 includes an adjusting plate 71 and an adjusting handle 72, the adjusting plate 71 is disposed on the fixture platform 5 and is perpendicular to the mounting plate 61, an arc-shaped adjusting groove 73 is formed in the adjusting plate 71, the adjusting handle 72 penetrates through the arc-shaped adjusting groove 73 and then is connected to the mounting plate 61, and the arc-shaped adjusting groove 73 can position and guide the adjusting handle 72. During adjustment, the adjusting handle 72 is pulled to slide along the arc-shaped adjusting groove 73, so that the mounting plate 61 is driven to swing relative to the clamp platform 5, the pitching angle of the rotary clamp 6 is changed, the structure is simple, and the adjustment is convenient and easy to operate.
Furthermore, in the present embodiment, the upper side of the adjusting plate 71 is arc-shaped, and the mounting plate 61 is provided with a positioning portion 62 sliding along the upper side of the adjusting plate 71. When the adjusting handle 72 drives the mounting plate 61 to swing, the positioning portion 62 slides along the upper side of the adjusting plate 71, so that the mounting plate 61 and the rotary clamp 6 can move more stably and smoothly, and the reliability is higher.
Furthermore, in the present embodiment, an angle scale 74 is disposed on the upper side of the adjusting plate 71, and the angle pointer 63 is disposed on the positioning portion 62. Through angle scale 74 and angle pointer 63, operating personnel can learn the size of rotary fixture 6 every single move angle directly perceivedly, and it is more convenient to use.
In the present embodiment, the elevating platform 2 is preferably provided with an elevating guide rail 21. The lifting guide rail 21 can provide a guiding function for the lifting motion of the lifting platform 2, and the stability of the lifting platform 2 and all parts mounted on the lifting platform 2 in the lifting process is ensured.
In the present embodiment, a dust suction device 11 is preferably provided in the laser head 1. The dust suction device 11 is advantageous for ensuring the cleanness of the welding operation area.
As a preferred technical solution, in this embodiment, the laser welding apparatus for electronic device packaging further includes a protective door 8, and a glove device 9 for clamping a device to be welded is disposed on the protective door 8. The protective door 8 is used for forming a closed welding operation space, and is provided with a glove device 9, so that an operator can conveniently and quickly install a welded device through the glove device 9.
Further, in the present embodiment, the glove box 9 includes a glove box 91, a slide rail 92 and a sheath tube 93 provided on the glove box 91, and a baffle plate 94 slidable along the slide rail 92, and a glove hole is formed in the sheath tube 93. The glove hole is used for providing a channel, so that an operator can conveniently and quickly install a welded device through the glove device 9, the baffle 94 slides along the sliding guide rail 92 to the front of the protective barrel 93 to shield the glove hole in the welding process, the cleanness of the internal environment is guaranteed, and the glove hole is simple and reliable in structure.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make numerous possible variations and modifications to the present invention, or modify equivalent embodiments to equivalent variations, without departing from the scope of the invention, using the teachings disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.
Claims (8)
1. A laser welding apparatus for electronic device packaging, characterized by: including laser head (1), lift platform (2), locate first linear motion module (3) on lift platform (2), locate second linear motion module (4) on first linear motion module (3), locate anchor clamps platform (5) on second linear motion module (4) and locate rotary fixture (6) on anchor clamps platform (5), laser head (1) is located rotary fixture (6) top, first linear motion module (3) with second linear motion module (4) are arranged perpendicularly, be equipped with adjustment mechanism (7) that are used for adjusting rotary fixture (6) every single move angle on anchor clamps platform (5).
2. The laser welding apparatus for electronic device packages according to claim 1, characterized in that: rotary fixture (6) are located on a mounting panel (61), mounting panel (61) with anchor clamps platform (5) are articulated, adjustment mechanism (7) include regulating plate (71) and regulation handle (72), regulating plate (71) are located on anchor clamps platform (5) and with mounting panel (61) are arranged perpendicularly, arc adjustment tank (73) have been seted up on regulating plate (71), regulation handle (72) run through behind arc adjustment tank (73) with mounting panel (61) link to each other.
3. The laser welding apparatus for electronic device packages according to claim 2, characterized in that: regulating plate (71) upside is the arc, be equipped with on mounting panel (61) along regulating plate (71) upside gliding location portion (62).
4. The laser welding apparatus for electronic device packages according to claim 3, characterized in that: adjusting plate (71) upside is equipped with angle scale (74), be equipped with angle pointer (63) on location portion (62).
5. The laser welding apparatus for electronic device packages according to any one of claims 1 to 4, characterized in that: the lifting platform (2) is provided with a lifting guide rail (21).
6. The laser welding apparatus for electronic device packages according to any one of claims 1 to 4, characterized in that: the laser head (1) is provided with a dust suction device (11).
7. The laser welding apparatus for electronic device packages according to any one of claims 1 to 4, characterized in that: the welding device is characterized by further comprising a protective door (8), wherein a glove device (9) used for clamping the welded device is arranged on the protective door (8).
8. The laser welding apparatus for electronic device packages according to claim 7, characterized in that: the glove device (9) comprises a glove box (91), a sliding guide rail (92) and a protective cylinder (93) which are arranged on the glove box (91), and a baffle (94) which can slide along the sliding guide rail (92), wherein a glove hole is formed in the protective cylinder (93).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911156139.4A CN112828462A (en) | 2019-11-22 | 2019-11-22 | Laser welding equipment for packaging electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911156139.4A CN112828462A (en) | 2019-11-22 | 2019-11-22 | Laser welding equipment for packaging electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112828462A true CN112828462A (en) | 2021-05-25 |
Family
ID=75921666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911156139.4A Pending CN112828462A (en) | 2019-11-22 | 2019-11-22 | Laser welding equipment for packaging electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112828462A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115070332A (en) * | 2022-07-27 | 2022-09-20 | 徐州矿达机电科技有限公司 | Automatic welding device of industrial robot |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2614833Y (en) * | 2003-02-17 | 2004-05-12 | 深圳市大族激光科技股份有限公司 | Scale ring rotary marking working table |
| CN201685149U (en) * | 2010-02-03 | 2010-12-29 | 李心智 | High-precision/speed internal circular grinding machine |
| CN201881649U (en) * | 2010-12-03 | 2011-06-29 | 深圳市瑞福达珠宝有限公司 | Adjustable rotating laser marking machine for finger ring marking |
| CN202555932U (en) * | 2012-02-24 | 2012-11-28 | 深圳市联合创新实业有限公司 | Laser soft soldering device |
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN206854845U (en) * | 2017-06-12 | 2018-01-09 | 深圳市铭镭激光设备有限公司 | Fixture and laser soldering device |
| CN208543089U (en) * | 2018-07-31 | 2019-02-26 | 广东国玉科技有限公司 | A kind of motor stator welding equipment |
| CN208556720U (en) * | 2018-07-05 | 2019-03-01 | 金华市高级技工学校 | The universal processing of Milling Motion in Three-axes NC assists universal fixturing |
| CN109807977A (en) * | 2019-04-03 | 2019-05-28 | 南昌汇达知识产权有限公司 | Automatic positioning equipment is used in a kind of processing of plastic pipe |
| CN109865940A (en) * | 2017-12-01 | 2019-06-11 | 中国电子科技集团公司第四十八研究所 | Laser beam welding workstation |
| CN110052766A (en) * | 2019-04-24 | 2019-07-26 | 彭青珍 | Multi-angle regulation clamping device for special piece welding |
-
2019
- 2019-11-22 CN CN201911156139.4A patent/CN112828462A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2614833Y (en) * | 2003-02-17 | 2004-05-12 | 深圳市大族激光科技股份有限公司 | Scale ring rotary marking working table |
| CN201685149U (en) * | 2010-02-03 | 2010-12-29 | 李心智 | High-precision/speed internal circular grinding machine |
| CN201881649U (en) * | 2010-12-03 | 2011-06-29 | 深圳市瑞福达珠宝有限公司 | Adjustable rotating laser marking machine for finger ring marking |
| CN202555932U (en) * | 2012-02-24 | 2012-11-28 | 深圳市联合创新实业有限公司 | Laser soft soldering device |
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN206854845U (en) * | 2017-06-12 | 2018-01-09 | 深圳市铭镭激光设备有限公司 | Fixture and laser soldering device |
| CN109865940A (en) * | 2017-12-01 | 2019-06-11 | 中国电子科技集团公司第四十八研究所 | Laser beam welding workstation |
| CN208556720U (en) * | 2018-07-05 | 2019-03-01 | 金华市高级技工学校 | The universal processing of Milling Motion in Three-axes NC assists universal fixturing |
| CN208543089U (en) * | 2018-07-31 | 2019-02-26 | 广东国玉科技有限公司 | A kind of motor stator welding equipment |
| CN109807977A (en) * | 2019-04-03 | 2019-05-28 | 南昌汇达知识产权有限公司 | Automatic positioning equipment is used in a kind of processing of plastic pipe |
| CN110052766A (en) * | 2019-04-24 | 2019-07-26 | 彭青珍 | Multi-angle regulation clamping device for special piece welding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115070332A (en) * | 2022-07-27 | 2022-09-20 | 徐州矿达机电科技有限公司 | Automatic welding device of industrial robot |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101934447B (en) | Welding machine | |
| CN106216927B (en) | Across gantry tank body robot welding system | |
| CN104084702B (en) | Stainless steel substrate material loading automatic contraposition device | |
| CN102581840B (en) | Paper-based friction plate feeding manipulator | |
| CN103192159A (en) | Workstation system with welding robots for radar structural parts | |
| CN107052624A (en) | Multistation Intelligent welding robot | |
| CN111804515A (en) | 3D following closed loop dispensing equipment for irregular curved surface lens | |
| CN203356958U (en) | X-Y-R three-axis positioning and moving mechanism | |
| CN201613425U (en) | Laser equipment Z-axis adjusting device | |
| CN204868868U (en) | Novel series -parallel connection five -axle linkage intelligence welded platform | |
| CN105799154A (en) | Vibration friction welding machine | |
| CN103862482B (en) | A kind of robot grip repair welding positioning tool | |
| CN206216121U (en) | A kind of battery precision welding process equipment | |
| CN206105266U (en) | Longmen jar body welding system of robot strides | |
| CN205996422U (en) | A kind of Cartesian coordinate type welding robot | |
| CN112828462A (en) | Laser welding equipment for packaging electronic device | |
| CN203184863U (en) | Cantilever type sliding rail mechanism applied to rectangular coordinate system welding robot | |
| CN206047583U (en) | A kind of laser Compound Machining numerically control grinder | |
| CN201665259U (en) | Flexible positioning device | |
| CN211589356U (en) | Orthogonal linear motor platform | |
| RU2756190C1 (en) | Apparatus for secondary positioning of a high-precision mobile robot | |
| CN208051165U (en) | The automatic imprint apparatus of large format sheet metal panel laser | |
| CN206811562U (en) | Special-shaped multifunctional component fixture | |
| CN214023948U (en) | Welding equipment suitable for sensor manufacturing | |
| CN2778404Y (en) | Automatic glue dispenser for head stack assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210525 |
|
| RJ01 | Rejection of invention patent application after publication |