CN112819482A - Tracing management method and system for chip packaging process - Google Patents
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- 238000007726 management method Methods 0.000 title claims abstract description 31
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- 238000000034 method Methods 0.000 claims abstract description 146
- 230000008569 process Effects 0.000 claims abstract description 122
- 239000000463 material Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 claims abstract description 66
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims description 57
- 238000012545 processing Methods 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 11
- 238000013507 mapping Methods 0.000 claims description 10
- 239000003351 stiffener Substances 0.000 claims description 7
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- 239000000047 product Substances 0.000 description 68
- 235000012773 waffles Nutrition 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
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Abstract
The application discloses a tracing management method and a tracing management system for a chip packaging process, wherein batch number information, material list information and process flow information of products in a corresponding production batch are respectively obtained based on traceable identity information preset by a chip, a substrate, a radiating cover or a reinforcing sheet and a carrier; and when the chip, the substrate, the radiating cover or the reinforcing sheet and the traceable identity information preset by the carrier respectively correspond to the batch number information, the bill of material information and the process flow information of the production batch of products and are matched consistently, respectively carrying out each material mounting process. The method can realize the refined tracing of the single product in the flip-chip packaging process, mix direct materials with wrong use and monitor the process flow of the product with wrong use in time in production.
Description
Technical Field
The present application relates generally to the field of semiconductor manufacturing technologies, and in particular, to a trace back management method and system for a chip packaging process.
Background
In the packaging process of the flip chip, the production is generally carried out by taking batches as units, product tracing and management can only be based on a batch level, tracing of single products can be less achieved, and fine tracing of personnel, machines, materials, technological methods, test methods and other elements involved in the whole production process period of the single products cannot be carried out. When the bad causes or quality problems occur, the bad cause tracing activities are difficult to be rapidly carried out and belong to the responsible person.
In actual production, the production processes from the start of feeding production to the end of packaging are numerous and have a long time span, and many additional actions such as material taking, semi-finished product handling, personnel detection, and storage of products are involved between the production processes. Because of the complexity of the production flow and the dependence on personnel, the production process has the problems of mixed materials by mistake and product process flows by mistake. After the above problems occur, they cannot be monitored in time.
Product loss, material mixing among product batches and missing or repeated work procedures due to human negligence. After the above problems occur, they cannot be monitored in time.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a method and system for trace management of a chip packaging process.
In a first aspect, the present invention provides a tracing management method for a chip packaging process, including:
presetting traceable identity information of a chip, a substrate, a radiating cover or a reinforcing sheet and a carrier;
obtaining traceable identity information preset by a chip, a substrate, a radiating cover or a reinforcing sheet and a carrier;
respectively acquiring batch number information, bill of material information and process flow information of products in corresponding production batches based on the chip, the substrate, the heat dissipation cover or the reinforcing sheet and traceable identity information preset by the carrier;
and when the chip, the substrate, the radiating cover or the reinforcing sheet and the traceable identity information preset by the carrier respectively correspond to the batch number information, the bill of material information and the process flow information of the production batch of products and are matched consistently, respectively carrying out each material mounting process.
In one embodiment, the method further comprises: identifying traceable identity information of a product and a carrier manufactured in the previous material mounting process, and distinguishing position information of the product on the carrier; when the traceable identity information of the carrier is matched with the last material mounting process consistently, the next material mounting process is started.
In one embodiment, when the chip, the substrate, the heat dissipation cover or the stiffener, and the carrier preset traceable identity information respectively correspond to the batch number information, the bill of material information, and the process information of the production batch of products, and are not matched with each other, or when the carrier traceable identity information, the position information of the product on the carrier, and the last material mounting process are not matched with each other, the last material mounting process is terminated.
In one embodiment, the presetting of the traceable identity information of the chip comprises: acquiring first identification information and first position information of each partition based on the wafer mapping chart; and taking the first identification information and the first position information as the traceable identity information of the chip.
In one embodiment, the presetting of the traceable identity information of the chip comprises: acquiring first identification information and first position information of each partition based on the wafer mapping chart; acquiring second identification information and second position information preset on the Zeould component; and binding the first identification information, the first position information, the second identification information and the second position information.
In one embodiment, the obtaining of the lot number information, the bill of material information, and the process flow information of the corresponding production lot based on the chip, the substrate, the heat dissipation cover or the stiffener, and the traceable identity information preset by the carrier respectively includes: reading traceable identity information preset by the chip, the substrate, the heat dissipation cover or the reinforcing sheet and the carrier; the chip, the substrate, the heat dissipation cover or the reinforcing sheet and the carrier preset traceable identity information are in butt joint with a pre-generated production management system, and batch number information, material list information and process flow information of products in corresponding production batches are obtained.
In one embodiment, when the chip, the substrate, the heat dissipation cover or the stiffener, and the carrier preset traceable identification information are respectively matched with the lot number information, the bill of material information, and the process flow information of the production lot, respectively, performing each material mounting process includes: when the batch number information, the bill of material information and the process flow information of the production batch products, which correspond to the chip, the substrate and the traceable identity information preset by the carrier, are matched and consistent, a chip mounting procedure is carried out; and when the batch number information, the bill of material information and the process flow information of the batch of products produced by the substrate, the heat dissipation cover or the reinforcing sheet and the traceable identity information preset by the carrier are matched consistently, carrying out a mounting procedure of the heat dissipation cover or the reinforcing sheet.
In one embodiment, the substrate, the heat dissipation cover or the reinforcing sheet, and the carrier have different predetermined traceable identity information.
In a second aspect, the present invention provides a tracing management system for a chip packaging process, including:
the first processing device is configured to preset traceable identity information of the chip, the substrate, the radiating cover or the reinforcing sheet and the carrier; the first identification device is configured to acquire traceable identity information preset by the chip, the substrate, the radiating cover or the reinforcing sheet and the carrier; the second processing device is configured to respectively acquire batch number information, bill of material information and process flow information of products in corresponding production batches based on the chip, the substrate, the heat dissipation cover or the reinforcing sheet and traceable identity information preset by the carrier; and when the chip, the substrate, the radiating cover or the reinforcing sheet and the traceable identity information preset by the carrier respectively correspond to the batch number information, the bill of material information and the process flow information of the production batch of products and are matched consistently, respectively carrying out each material mounting process.
The system further comprises: the second identification device is configured to identify traceable identity information of products and carriers manufactured in the previous material mounting process and distinguish position information of the products on the carriers; when the traceable identity information of the carrier is obtained, the position information of the product on the carrier is matched with the previous material mounting process consistently, and the next material mounting process is carried out.
Compared with the prior art, the invention has the following advantages: the invention respectively obtains batch number information, bill of material information and process flow information of products in corresponding production batches based on the chip, the substrate, the heat dissipation cover or the reinforcing sheet and the traceable identity information preset by the carrier; and when the chip, the substrate, the radiating cover or the reinforcing sheet and the traceable identity information preset by the carrier respectively correspond to the batch number information, the bill of material information and the process flow information of the production batch of products and are matched consistently, respectively carrying out each material mounting process. The method can realize the refined tracing of the single product in the packaging process, mix direct materials with wrong use in the production, and monitor the process flow of the product with wrong use in time.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a flowchart of a trace management method for a chip packaging process according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a chip mounting process during loading a wafer according to an embodiment of the present invention;
fig. 3 is a schematic process diagram of a chip mounting process when a waffle assembly is used for loading according to an embodiment of the invention;
fig. 4 is a schematic process diagram of a mounting process of a heat dissipation cover according to an embodiment of the present invention;
fig. 5 is a schematic process diagram of an indirect material mounting process according to an embodiment of the present invention;
fig. 6 is a block diagram of a tracing management system in a chip packaging process according to an embodiment of the present invention.
In the figure: 1-wafer, 2-waffle-voller assembly, 3-chip, 4-substrate, 5-heat dissipation cover, 6-carrier, 7-production management system, 8-database, 9-mounting equipment and 10-industrial vision equipment.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 shows a flowchart of a trace back management method of a chip packaging process provided in the present application.
In step 110, the traceable identity information of the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 is preset;
in step 120, traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 is obtained;
in step 130, respectively acquiring batch number information, bill of material information and process flow information of products of a corresponding production batch based on traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6;
in step 140, when the batch number information, the bill of material information, and the process flow information of the production batch of products respectively corresponding to the traceable identification information preset by the chip 3, the substrate 4, the heat dissipation cover 5, and the carrier 6 are matched consistently, each material mounting process is performed respectively.
The method can realize the refined tracing of the single product in the flip-chip packaging process, mix direct materials with wrong use and monitor the process flow of the product with wrong use in time in production.
In other types of chip 3 package structures, the heat dissipation cover 5 may be replaced with a reinforcing sheet.
In this embodiment, each of the materials includes a chip 3, and the traceable identity information of the preset chip 3 may include: acquiring first identification information and first position information of each partition based on the wafer 1 mapping chart; and taking the first identification information and the first position information as the traceable identity information of the chip 3.
In this embodiment, each of the materials includes a chip 3, and the predetermined traceable identity information of the chip 3 may further include: acquiring first identification information and first position information of each partition based on the wafer 1 mapping chart; acquiring second identification information and second position information preset on the Zebra subassembly 2; and binding the first identification information, the first position information, the second identification information and the second position information.
The predetermined traceable identity information of the substrate 4 and the heat dissipation cover 5 may include: unique and continuously traceable two-dimensional code identity information is manufactured at a predefined fixed position of the substrate 4 and the heat dissipation cover 5.
The traceable identity information of the predetermined carrier 6 may include: unique and continuously traceable two-dimensional code identity information is manufactured at a predefined fixed position of the carrier 6.
It should be noted that the traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5, the indirect material and the carrier 6 are different from each other.
It can be seen that the direct material chips 3 can be separated into wafer 1 loading (wafer loading) and waffle pack 2 loading (wafer pack loading).
As shown in fig. 2, in the case of loading the wafer 1, the chip 3 mounting device 9 directly picks up the chip 3 from the wafer 1 and then performs flip-chip packaging, so that the combination of the position information and the identity information of each partition of the wafer mapping (wafer mapping) of the wafer 1 can be directly obtained by the chip 3 mounting device 9, and the obtained combination is used as the traceable identity information of the chip 3.
As shown in fig. 3, in the case of loading the waffle assembly 2, after the wafer 1 is cut, the chip 3 needs to pick up the wafer from the wafer 1 to the waffle assembly 2, a two-dimensional code is not suitable to be produced in consideration of space limitations of the waffle assembly 2, continuously traceable barcode information can be produced at a fixed position on the waffle assembly 2 in advance, position information and identity information of each partition of a mapping diagram (wafermapping) of the wafer 1 can be bound with the barcode of the waffle assembly 2 and relative coordinate information of the waffle assembly 2 by using a chip 3 mounting device 9, and the bound information can be stored as traceable identity information of the chip 3.
In this embodiment, the obtaining of the lot number information, the bill of material information, and the process flow information of the corresponding production lot product based on the traceable identity information preset in the chip 3, the substrate 4, the heat dissipation cover 5, and the carrier 6 respectively includes: reading traceable identity information preset by the chip 3, the substrate, the heat dissipation cover 5 and the carrier 6; the chip 3, the substrate, the heat dissipation cover 5 and the carrier 6 are in butt joint with the pre-generated production management system 7, so as to obtain batch number information, bill of material information and process flow information of the corresponding production batch products.
When the batch number information, the bill of material information and the process flow information of the production batch of products respectively corresponding to the traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 are matched consistently, respectively performing each material mounting process comprises: when the batch number information, the bill of material information and the process flow information of the production batch products corresponding to the traceable identity information preset by the chip 3, the substrate 4 and the carrier 6 are matched consistently, carrying out chip 3 mounting process; and when the batch number information, the bill of material information and the process flow information of the production batch products corresponding to the preset traceable identity information of the substrate 4, the heat dissipation cover 5 and the carrier 6 are matched consistently, carrying out a mounting process of the heat dissipation cover 5.
On the basis of the above embodiment, the method further includes: identifying traceable identity information of a product and a carrier 6 manufactured in the previous material mounting process, and distinguishing position information of the product on the carrier 6; when the traceable identity information of the carrier 6 is matched with the previous material mounting process consistently, the next material mounting process is started.
The information of the products and the carriers 6 is traced, and the problems of product loss, material mixing among product batches and missing of working procedures or repeated working procedures due to human negligence can be monitored in time.
In addition, the tracing of the information of the vehicles 6 can be used as a basis for investigation when mass quality problems occur, for example, if a defect is concentrated in a certain vehicle, the problem may be caused by the vehicle. For example, when the defects are concentrated at the same position of different vehicles, it may be caused by abnormality at a certain position of the machine
On the basis of the above embodiment, when the batch number information, the bill of material information, and the process flow information of the production batch of products corresponding to the traceable identity information of each material and the carrier 6 are not matched with each other, or when the traceable identity information of the carrier and the position information of the product on the carrier are not matched with the previous material mounting process, the material mounting process is stopped.
When the problems of mixed direct materials by mistake, product process flow by mistake, product loss, material mixing among product batches, missing of working procedures or repeated working procedures due to human negligence occur in production, the loss can be timely stopped.
The method may further comprise: and sending an alarm prompt when the material mounting process is stopped.
The direct material mounting process includes a direct material mounting process and an indirect material mounting process.
The chip 3 is mounted and the radiating cover 5 is mounted, namely the direct material mounting process. As shown in fig. 2 to 4, the two-dimensional code identity information of the direct material is read by using the optical detection component of the placement equipment 9; and the corresponding batch number information, the bill of material information and the process flow information of the current product production batch are obtained and compared through the butt joint with the existing production management system 7(MES system). After all the information is matched and consistent, the process can be smoothly started and produced, and simultaneously, traceable identity information records of corresponding direct materials are started, bound and stored in the database 8; if the information matching is unsuccessful, the production cannot be started and the machine is automatically stopped. Therefore, the process flow of mixing key direct materials by mistake and using wrong products is avoided by using a fool-proof means.
As shown in fig. 5, in the gluing or welding process, that is, the indirect material mounting process, at the loading machine of each process, the two-dimensional code identity information on the product and the carrier 6 is read and the position information of the carrier 6 is recorded in a distinguishing manner by using the additionally-installed industrial vision equipment 10, and the production problems such as product loss and falling, material mixing among product batches and the like can be monitored by comparing and checking the two-dimensional code identity information of the previous and subsequent processes and the position information of the product on the carrier 6; if a certain process is missed or repeated due to human negligence, the next process can be detected by comparing the process flow information with the process flow information of the existing production management system 7(MES system) at the loading machine. After the production problem is monitored, early warning or shutdown interception can be carried out according to a preset processing mechanism, and the fool-proof and mistake-proof effects are achieved.
When each material mounting process is performed, traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 can be usually stored in the database 8 so as to be called at any time in the using process. For example: when a chip 3 is mounted, the traceable identity information preset by the chip 3, the substrate 4 and the carrier 6 is uploaded to a database 8; when the mounting process of the heat dissipation cover 5 is carried out, the traceable identity information preset by the substrate 4, the heat dissipation cover 5 and the carrier 6 is uploaded to a database 8.
The following further describes the tracing management method of the chip packaging process provided by the present application with reference to the above embodiments.
Acquiring first identification information and first position information of each partition based on the wafer 1 mapping chart; acquiring second identification information and second position information preset on the Zebra subassembly 2; binding the first identification information, the first position information, the second identification information and the second position information to be used as traceable identity information of the chip 3; manufacturing a unique and continuously traceable two-dimensional code identity information substrate 4 on a predefined fixed position of the substrate 4 as traceable identity information of the substrate 4; unique and continuously traceable two-dimensional code identity information is manufactured at a predefined fixed position of the heat dissipation cover 5 and is used as traceable identity information of the heat dissipation cover 5; unique and continuously traceable two-dimensional code identity information is manufactured on a predefined fixed position of the carrier 6 to serve as traceable identity information of the carrier 6.
Reading traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6; the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 are in butt joint with the pre-generated production management system 7 to obtain batch number information, bill of material information and process flow information of the corresponding production batch products.
And when the batch number information, the bill of material information and the process flow information of the production batch products corresponding to the chip 3, the substrate 4 and the carrier 6 preset traceable identity information are matched consistently, carrying out chip 3 mounting process.
Identifying traceable identity information of a product and a carrier 6 manufactured in the previous material mounting process, and distinguishing position information of the product on the carrier 6; when the traceable identity information of the carrier 6 is obtained, the position information of the product on the carrier 6 is matched with the previous material mounting process consistently, and the mounting process of the heat dissipation cover 5 is carried out.
And when the batch number information, the bill of material information and the process flow information of the production batch products corresponding to the preset traceable identity information of the substrate 4, the heat dissipation cover 5 and the carrier 6 are matched consistently, carrying out a mounting process of the heat dissipation cover 5.
When the batch number information, the bill of material information and the process flow information of the production batch of products respectively corresponding to the traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 are not matched in conformity, or when the traceable identity information of the carrier 6, the position information of the product on the carrier 6 is not matched in conformity with the last material mounting process, the material mounting process is stopped.
Fig. 6 shows a trace back management system 600 for the chip packaging process provided in the present application.
The system comprises: the first processing device 610 is configured to preset traceable identity information of the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6; the first identification device 620 is configured to acquire traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6; the second processing device 630 is configured to obtain batch number information, bill of material information, and process flow information of the corresponding production batch of products based on traceable identity information preset in the chip 3, the substrate 4, the heat dissipation cover 5, and the carrier 6; and when the batch number information, the bill of material information and the process flow information of the production batch of products respectively corresponding to the traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 are matched and consistent, respectively carrying out each material mounting process.
It should be noted that the traceable identity information preset in the substrate 4, the heat dissipation cover 5, and the carrier 6 are different from each other.
The system may further comprise: a second recognition device 640 configured to recognize traceable identity information of a product and a carrier 6 manufactured in a previous material mounting process, and distinguish position information of the product on the carrier 6; when the traceable identity information of the carrier 6 is obtained, the position information of the product on the carrier 6 is matched with the previous material mounting process consistently, and the next material mounting process is carried out.
Optionally, the second processing device 630 is further configured to terminate the material mounting process when the batch number information, the bill of material information, and the process flow information of the production batch of products respectively correspond to the traceable identity information preset in the chip 3, the substrate 4, the heat dissipation cover 5, and the carrier 6, and are not matched with each other, or when the traceable identity information of the carrier 6, the position information of the product on the carrier 6, and the last material mounting process are not matched with each other.
The system may further comprise: and the alarm device 11 is configured to give an alarm prompt when the material mounting process is stopped.
Optionally, the first processing device 610 is specifically configured to obtain the first identification information and the first position information of each partition based on the wafer 1 map; and taking the first identification information and the first position information as the traceable identity information of the chip 3.
Optionally, the first processing device 610 is specifically configured to obtain the first identification information and the first position information of each partition based on the wafer 1 map; acquiring second identification information and second position information preset on the Zebra subassembly 2; and binding the first identification information, the first position information, the second identification information and the second position information.
Optionally, the second processing device 630 is specifically configured to read traceable identity information preset by the chip 3, the substrate 4, the heat dissipation cover 5, and the carrier 6; the chip 3, the substrate 4, the heat dissipation cover 5 and the carrier 6 are in butt joint with the pre-generated production management system 7 to obtain batch number information, bill of material information and process flow information of the corresponding production batch products.
Optionally, the second processing device 630 is further specifically configured to perform a chip 3 mounting process when the batch number information, the bill of material information, and the process flow information of the production batch of products respectively corresponding to the traceable identity information preset in the chip 3, the substrate 4, and the carrier 6 are matched and consistent; and when the batch number information, the bill of material information and the process flow information of the production batch products corresponding to the preset traceable identity information of the substrate 4, the heat dissipation cover 5 and the carrier 6 are matched consistently, carrying out a mounting process of the heat dissipation cover 5.
The first processing device 610 and the first recognition device 620 may be integrated on the mounting apparatus 9, and the second processing device 630 and the second recognition device 640 may be integrated on the industrial vision equipment 10. It is also possible to provide the first recognition device 620 and the second recognition device 640 on the mounting equipment 9 and the industrial vision equipment 10, respectively, and separately provide the server-integrated first processing device 610 and the second processing device 630.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A tracing management method for a chip packaging process is characterized by comprising the following steps:
presetting traceable identity information of a chip, a substrate, a radiating cover or a reinforcing sheet and a carrier;
obtaining traceable identity information preset by a chip, a substrate, a radiating cover or a reinforcing sheet and a carrier;
respectively acquiring batch number information, bill of material information and process flow information of products in corresponding production batches based on the chip, the substrate, the heat dissipation cover or the reinforcing sheet and traceable identity information preset by the carrier;
and when the chip, the substrate, the radiating cover or the reinforcing sheet and the traceable identity information preset by the carrier respectively correspond to the batch number information, the bill of material information and the process flow information of the production batch of products and are matched consistently, respectively carrying out each material mounting process.
2. The method for retrospective management of a chip packaging process according to claim 1, further comprising:
identifying traceable identity information of a product and a carrier manufactured in the previous material mounting process, and distinguishing position information of the product on the carrier;
when the traceable identity information of the carrier is matched with the last material mounting process consistently, the next material mounting process is started.
3. The method for tracing management of chip packaging process according to claim 2, wherein when the chip, the substrate, the heat dissipation cover or the stiffener and the carrier preset traceable identity information respectively correspond to the batch number information, the bill of material information and the process information of the production batch of products, or when the carrier traceable identity information, the position information of the product on the carrier does not match with the last material mounting process, the material mounting process is stopped.
4. The method for tracing management of chip packaging process according to claim 1, wherein presetting the traceable identity information of the chip comprises:
acquiring first identification information and first position information of each partition based on the wafer mapping chart;
and taking the first identification information and the first position information as the traceable identity information of the chip.
5. The method for tracing management of chip packaging process according to claim 1, wherein presetting the traceable identity information of the chip comprises:
acquiring first identification information and first position information of each partition based on the wafer mapping chart;
acquiring second identification information and second position information preset on the Zeould component;
and binding the first identification information, the first position information, the second identification information and the second position information.
6. The method for tracing management of chip packaging process according to claim 1, wherein the obtaining of lot number information, bill of material information, and process flow information of the corresponding production lot based on the chip, the substrate, the heat dissipation cover or the stiffener and the carrier preset traceable identity information respectively comprises:
reading traceable identity information preset by the chip, the substrate, the heat dissipation cover or the reinforcing sheet and the carrier;
the chip, the substrate, the heat dissipation cover or the reinforcing sheet and the carrier preset traceable identity information are in butt joint with a pre-generated production management system, and batch number information, material list information and process flow information of products in corresponding production batches are obtained.
7. The method for tracing management of chip packaging process according to claim 1, wherein when the chip, the substrate, the heat dissipation cover or the stiffener and the carrier preset traceable identity information are respectively matched with the lot number information, the bill of material information and the process flow information of the production lot product, respectively performing each material mounting process comprises:
when the batch number information, the bill of material information and the process flow information of the production batch products, which correspond to the chip, the substrate and the traceable identity information preset by the carrier, are matched and consistent, a chip mounting procedure is carried out;
and when the batch number information, the bill of material information and the process flow information of the batch of products produced by the substrate, the heat dissipation cover or the reinforcing sheet and the traceable identity information preset by the carrier are matched consistently, carrying out a mounting procedure of the heat dissipation cover or the reinforcing sheet.
8. The method of claim 1, wherein the substrate, the heat dissipation cover or the stiffener, and the carrier have different predetermined traceable identity information.
9. A tracing management system for a chip packaging process is characterized by comprising:
the first processing device is configured to preset traceable identity information of the chip, the substrate, the radiating cover or the reinforcing sheet and the carrier;
the first identification device is configured to acquire traceable identity information preset by the chip, the substrate, the radiating cover or the reinforcing sheet and the carrier;
the second processing device is configured to respectively acquire batch number information, bill of material information and process flow information of products in corresponding production batches based on the chip, the substrate, the heat dissipation cover or the reinforcing sheet and traceable identity information preset by the carrier;
and when the chip, the substrate, the radiating cover or the reinforcing sheet and the traceable identity information preset by the carrier respectively correspond to the batch number information, the bill of material information and the process flow information of the production batch of products and are matched consistently, respectively carrying out each material mounting process.
10. A trace-back management system for a chip packaging process according to claim 9, further comprising:
the second identification device is configured to identify traceable identity information of products and carriers manufactured in the previous material mounting process and distinguish position information of the products on the carriers;
when the traceable identity information of the carrier is obtained, the position information of the product on the carrier is matched with the previous material mounting process consistently, and the next material mounting process is carried out.
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