CN112775569A - Laser drilling method for circuit board - Google Patents
Laser drilling method for circuit board Download PDFInfo
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- CN112775569A CN112775569A CN202011546910.1A CN202011546910A CN112775569A CN 112775569 A CN112775569 A CN 112775569A CN 202011546910 A CN202011546910 A CN 202011546910A CN 112775569 A CN112775569 A CN 112775569A
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- inspection
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000005553 drilling Methods 0.000 title claims abstract description 26
- 238000007689 inspection Methods 0.000 claims abstract description 77
- 239000000047 product Substances 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000011265 semifinished product Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000012790 confirmation Methods 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007373 indentation Methods 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 9
- 238000011179 visual inspection Methods 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 229910052705 radium Inorganic materials 0.000 claims description 6
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims description 3
- 238000010923 batch production Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000011017 operating method Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000012795 verification Methods 0.000 claims description 2
- 230000002950 deficient Effects 0.000 abstract description 19
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser drilling method for a circuit board, and relates to the technical field of laser holes of circuit boards. The invention comprises the steps of confirming the work order, checking the feeding, adjusting the direction of the semi-finished product, checking whether the material and the quantity are consistent with the work order, paying attention to whether the work order is consistent with the outer box feeding checking label, and confirming the energy and the precision, wherein before each operation, whether the energy is in the set acceptable range is firstly confirmed. According to the invention, through adjusting energy, laser can be better selected, the hole breakdown caused by too large energy is reduced, the situation that a through hole is not punched due to too small energy is reduced, the jig plate confirms that the jig can be determined, the increase of defective products caused by the fact that the jig does not process is reduced, the generation of defective products is reduced, the detection of appearance inspection can be carried out, the finished products can be detected, the defective products are not easy to continuously flow downwards, and the resource waste caused by the continuous processing of the defective products is reduced.
Description
Technical Field
The invention belongs to the technical field of laser holes of circuit boards, and particularly relates to a laser drilling method of a circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed circuit board, etc. the circuit board makes the circuit miniaturized and visualized, plays an important role in the mass production of fixed circuit and optimizing the layout of electric appliances, the circuit board can be called as printed circuit board or printed circuit board, the English name is PCB, FPC circuit board and soft and hard combination board-the birth and development of FPC and PCB, the new product of soft and hard combination board is promoted, therefore, the soft and hard combination board is the flexible circuit board and hard circuit board, through the working procedures of pressing, etc., the circuit board with FPC characteristic and PCB characteristic is formed, the laser cutting is that the cut material is irradiated by high-power laser beam with high density, the material is heated to the vaporization temperature quickly, evaporating to form holes, and continuously forming slits with narrow width along with the movement of the light beam to the material to finish the cutting of the material.
Most of the existing laser drilling methods for circuit boards cannot detect defective products in time, cause continuous processing of the defective products, and easily cause waste of resources.
Disclosure of Invention
The invention aims to provide a laser drilling method of a circuit board, which can better select laser by adjusting energy, reduce the situation that holes are punctured due to overlarge energy and through holes are not punctured due to undersize energy, confirm a jig board, determine the jig, reduce the increase of defective products due to the fact that the jig does not process the defective products, reduce the generation of the defective products, detect a finished product by appearance inspection, prevent the defective products from continuously flowing downwards, reduce the resource waste caused by the continuous processing of the defective products and solve the problems in the prior art.
In order to achieve the purpose, the invention is realized by the following technical scheme:
a laser drilling method for a circuit board comprises the steps of confirming a work order, carrying out feeding inspection, adjusting the direction of a semi-finished product, checking whether materials and the quantity conform to the work order, and paying attention to whether the work order and an outer box feeding inspection label conform;
step two, adjusting energy and confirming precision, wherein whether the energy is in a set acceptable range needs to be confirmed before each operation;
step three, tool plate confirmation, wherein when a new material number is replaced and before each batch of production, whether the tool plate is damaged or not is confirmed, and if the tool plate is damaged, the tool plate is immediately replaced;
formal operation, namely reading the program from a computer stored with the program according to the program file names marked on the work order and the operation flow order;
step five, product inspection, first piece, end piece inspection, laser blind hole first, end piece inspection, sola through-hole inspection, sola blind hole inspection, first piece, end piece inspection include: after the first mould operation is OK, carving a 2 cm-2 cm square in the plate by using a small knife, inspecting the upper and lower apertures by using a metallographic microscope, and recording the measurement result;
step six, appearance inspection, visual inspection of the processed product, no obvious indentation, crease, scratch and poor leak hole, and the pore size specification: within + -10% of the standard pore diameter, the gel shrinkage is less than or equal to 5 μm, and pores are not permeable.
Optionally, the confirming the work order includes: and (3) receiving the cut surplus materials, checking whether the original material numbers, Lot.No., storage date and labels of cutting personnel are marked on the label stickers of the work order and the original material inner tube, checking the feeding by 30 percent, recording the checking condition in a feeding check record, stopping the operation immediately if the process specified by the work order is not met or the product number is not met, and informing a main pipe to process.
Optionally, the feed check comprises: fold, oxidation, crushing, mar, breakage, foreign matter, the selective examination result, every batch need be recorded in the feeding inspection table, and the adjustment semi-manufactured goods direction includes: if the semi-finished products have directionality during single-sheet operation, the partition plate needs to be removed before the operation, and the semi-finished products are adjusted to the same direction.
Optionally, the adjusting energy and the confirming the precision comprise: after the OK is confirmed, the operator can work, wear the gloves according to the regulations, check the gloves once a day, and replace the gloves in time if the gloves are stained or can not be used.
Optionally, the jig plate confirmation comprises: cleaning is performed once before each batch production, cleaning is performed once during medium inspection, cleaning operation is performed once on average at 25pnl, and during production, pressure points or other foreign bodies are found to cause abnormalities, and cleaning operation is performed immediately.
Optionally, the formal operation includes: reading program, transferring program to file, setting parameters, setting machine, trying, starting operation, checking product and finishing record.
Optionally, the program-to-file conversion includes: the PE engineer in the station transfers the file operation program according to the accessory 1 program, and the Laser program is converted into a Laser operation program, and the set parameters comprise: go into corresponding parameter by biotechnology according to copper foil material KEY, the board sets for including: the relevant values are set according to the operating procedures noted in the operating specifications of the laser apparatus.
Optionally, the pilot drilling comprises: trial drilling a semi-finished product, confirming the drilling quality and operation parameters according to the quality confirmation instruction and the reference description, and starting operation, wherein the operation comprises the following steps: pressing green "START" to begin the job, the inspection product comprising: according to the quality confirmation instruction of the drilling operation, the drilling quality is checked, and the checking result and the quantity are recorded in an autonomous checking table, and the recording is completed by the following steps: and counting the finished quantity, marking the finished quantity and the date on the operation flow sheet and the production record sheet, and signing.
Optionally, the product inspection comprises: 2cm is attached in "first article in kind" fence in kind, radium-shine blind hole is first, end inspection includes, first operation is every batch of product inspection, the inspection item is with the autonomous inspection item, it cuts out 2PN and carries out the operation of sola two moulds to get the copper foil, copper at the bottom of the metal image microscope inspection, the microetching bite amount need be controlled in 2um, to the great radium-shine through-hole product of exposed area, except using end light table 100% inspection product, use special supplementary apron inspection product, the apron can cover not process the region, expose the convenient inspection process region inspection of process region, the sola through-hole inspection includes: laser energy is surveyed, is gone up aperture, lower aperture, is not radium thoroughly, hole is inclined to one side, indentation, crease, true circularity confirm, and the inspection of sola blind hole includes: laser energy measurement, upper aperture, lower aperture, no radium penetration, hole deviation, indentation, crease, roundness confirmation, PI residue, copper damage and bottom copper dislocation.
Optionally, the visual inspection comprises: the bottom copper should not be damaged, the lower aperture should be completely on the bottom copper PAD, and the bottom copper should not be out of position.
The embodiment of the invention has the following beneficial effects:
according to the embodiment of the invention, by adjusting energy, laser can be better selected, holes are reduced to be punctured due to overlarge energy, and through holes are not punctured due to undersize energy, the jig plate confirms that the jig can be determined, defective products are reduced due to the fact that the jig does not increase, the defective products are reduced, the appearance inspection can detect finished products, the defective products are not prone to flowing downwards, and the resource waste caused by the fact that the defective products are continuously processed is reduced.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
To maintain the following description of the embodiments of the present invention clear and concise, a detailed description of known functions and known components of the invention have been omitted.
In this embodiment, a method for laser drilling a circuit board is provided, including: step one, confirming a work order, carrying out feeding inspection, adjusting the direction of a semi-finished product, checking whether materials and the quantity are consistent with the work order, and paying attention to whether the work order and an outer box feeding inspection label are consistent;
step two, adjusting energy and confirming precision, wherein whether the energy is in a set acceptable range needs to be confirmed before each operation;
step three, tool plate confirmation, wherein when a new material number is replaced and before each batch of production, whether the tool plate is damaged or not is confirmed, and if the tool plate is damaged, the tool plate is immediately replaced;
formal operation, namely reading the program from a computer stored with the program according to the program file names marked on the work order and the operation flow order;
step five, product inspection, first piece, end piece inspection, laser blind hole first, end piece inspection, sola through-hole inspection, sola blind hole inspection, first piece, end piece inspection include: after the first mould operation is OK, carving a 2 cm-2 cm square in the plate by using a small knife, inspecting the upper and lower apertures by using a metallographic microscope, and recording the measurement result;
step six, appearance inspection, visual inspection of the processed product, no obvious indentation, crease, scratch and poor leak hole, and the pore size specification: within + -10% of the standard pore diameter, the gel shrinkage is less than or equal to 5 μm, and pores are not permeable.
The application of one aspect of the embodiment is as follows: when the circuit board needs to be processed, firstly, the material needing to be processed is confirmed, then the direction of the circuit board is adjusted to be consistent, the laser energy is adjusted, the precision is confirmed, a proper jig is selected, formal operation is carried out, a program transfer file, parameters are set, machine setting, drilling trial, operation starting, product inspection and record completion are carried out, and the appearance of the circuit board is inspected.
Through the adjustment energy, can carry out better selection to laser, reduced because the hole that the energy is too big causes is punctured, reduced because the through-hole that the energy undersize caused the condition that is not beaten through, the tool board is confirmed, can confirm the tool, reduced because the tool does not increase to the defective products that causes, reduced the production of defective products, visual inspection's detection can detect the finished product, make the difficult continuation downward flow of defective products, reduced the wasting of resources that the defective products continued to process and caused.
The work order confirmation of the present embodiment includes: and (3) receiving the cut surplus materials, checking whether the original material numbers, Lot.No., storage date and labels of cutting personnel are marked on the label stickers of the work order and the original material inner tube, checking the feeding by 30 percent, recording the checking condition in a feeding check record, stopping the operation immediately if the process specified by the work order is not met or the product number is not met, and informing a main pipe to process.
The feed verification of this example included: fold, oxidation, crushing, mar, breakage, foreign matter, the selective examination result, every batch need be recorded in the feeding inspection table, and the adjustment semi-manufactured goods direction includes: if the semi-finished products have directionality during single-sheet operation, the partition plate needs to be removed before the operation, and the semi-finished products are adjusted to the same direction.
The energy adjustment and precision confirmation of the embodiment comprises the following steps: after the OK is confirmed, the operator can work, wear the gloves according to the regulations, check the gloves once a day, and replace the gloves in time if the gloves are stained or can not be used.
The tool plate confirmation of the embodiment comprises: cleaning is performed once before each batch production, cleaning is performed once during medium inspection, cleaning operation is performed once on average at 25pnl, and during production, pressure points or other foreign bodies are found to cause abnormalities, and cleaning operation is performed immediately.
The formal work of the present embodiment includes: reading program, transferring program to file, setting parameters, setting machine, trying, starting operation, checking product and finishing record.
The program-to-file conversion of the embodiment includes: the PE engineer in the station transfers the file operation program according to the accessory 1 program, and the Laser program is converted into a Laser operation program, and the set parameters comprise: go into corresponding parameter by biotechnology according to copper foil material KEY, the board sets for including: the relevant values are set according to the operating procedures noted in the operating specifications of the laser apparatus.
The pilot drill of the present embodiment includes: trial drilling a semi-finished product, confirming the drilling quality and operation parameters according to the quality confirmation instruction and the reference description, and starting operation, wherein the operation comprises the following steps: pressing green "START" to begin the job, the inspection product comprising: according to the quality confirmation instruction of the drilling operation, the drilling quality is checked, and the checking result and the quantity are recorded in an autonomous checking table, and the recording is completed by the following steps: and counting the finished quantity, marking the finished quantity and the date on the operation flow sheet and the production record sheet, and signing.
The product inspection of this embodiment includes: 2cm is attached in "first article in kind" fence in kind, radium-shine blind hole is first, end inspection includes, first operation is every batch of product inspection, the inspection item is with the autonomous inspection item, it cuts out 2PN and carries out the operation of sola two moulds to get the copper foil, copper at the bottom of the metal image microscope inspection, the microetching bite amount need be controlled in 2um, to the great radium-shine through-hole product of exposed area, except using end light table 100% inspection product, use special supplementary apron inspection product, the apron can cover not process the region, expose the convenient inspection process region inspection of process region, the sola through-hole inspection includes: laser energy is surveyed, is gone up aperture, lower aperture, is not radium thoroughly, hole is inclined to one side, indentation, crease, true circularity confirm, and the inspection of sola blind hole includes: laser energy measurement, upper aperture, lower aperture, no radium penetration, hole deviation, indentation, crease, roundness confirmation, PI residue, copper damage and bottom copper dislocation.
The visual inspection of the present embodiment includes: the bottom copper should not be damaged, the lower aperture should be completely on the bottom copper PAD, and the bottom copper should not be out of position.
The above embodiments may be combined with each other.
It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be practiced in sequences other than those described herein.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are only for convenience in describing the present invention and simplifying the description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Claims (10)
1. A laser drilling method of a circuit board comprises the following steps:
step one, confirming a work order, carrying out feeding inspection, adjusting the direction of a semi-finished product, checking whether materials and the quantity are consistent with the work order, and paying attention to whether the work order and an outer box feeding inspection label are consistent;
step two, adjusting energy and confirming precision, wherein whether the energy is in a set acceptable range needs to be confirmed before each operation;
step three, tool plate confirmation, wherein when a new material number is replaced and before each batch of production, whether the tool plate is damaged or not is confirmed, and if the tool plate is damaged, the tool plate is immediately replaced;
formal operation, namely reading the program from a computer stored with the program according to the program file names marked on the work order and the operation flow order;
step five, product inspection, first piece, end piece inspection, laser blind hole first, end piece inspection, sola through-hole inspection, sola blind hole inspection, first piece, end piece inspection include: after the first mould operation is OK, carving a 2 cm-2 cm square in the plate by using a small knife, inspecting the upper and lower apertures by using a metallographic microscope, and recording the measurement result;
step six, appearance inspection, visual inspection of the processed product, no obvious indentation, crease, scratch and poor leak hole, and the pore size specification: within + -10% of the standard pore diameter, the gel shrinkage is less than or equal to 5 μm, and pores are not permeable.
2. The method of claim 1, wherein the step of validating the work order comprises: and (3) receiving the cut surplus materials, checking whether the original material numbers, Lot.No., storage date and labels of cutting personnel are marked on the label stickers of the work order and the original material inner tube, checking the feeding by 30 percent, recording the checking condition in a feeding check record, stopping the operation immediately if the process specified by the work order is not met or the product number is not met, and informing a main pipe to process.
3. The method of claim 1, wherein the feeding inspection comprises: fold, oxidation, crushing, mar, breakage, foreign matter, the selective examination result, every batch need be recorded in the feeding inspection table, and the adjustment semi-manufactured goods direction includes: if the semi-finished products have directionality during single-sheet operation, the partition plate needs to be removed before the operation, and the semi-finished products are adjusted to the same direction.
4. The method of claim 1, wherein the adjusting the energy and the confirming the accuracy comprises: after the OK is confirmed, the operator can work, wear the gloves according to the regulations, check the gloves once a day, and replace the gloves in time if the gloves are stained or can not be used.
5. The method of claim 1, wherein the tool board verification comprises: cleaning is performed once before each batch production, cleaning is performed once during medium inspection, cleaning operation is performed once on average at 25pnl, and during production, pressure points or other foreign bodies are found to cause abnormalities, and cleaning operation is performed immediately.
6. The method of claim 1, wherein the formal operations comprise: reading program, transferring program to file, setting parameters, setting machine, trying, starting operation, checking product and finishing record.
7. The method of claim 6, wherein the program converting step comprises: the PE engineer in the station transfers the file operation program according to the accessory 1 program, and the Laser program is converted into a Laser operation program, and the set parameters comprise: go into corresponding parameter by biotechnology according to copper foil material KEY, the board sets for including: the relevant values are set according to the operating procedures noted in the operating specifications of the laser apparatus.
8. The laser drilling method of a circuit board according to claim 6, wherein the pilot drilling comprises: trial drilling a semi-finished product, confirming the drilling quality and operation parameters according to the quality confirmation instruction and the reference description, and starting operation, wherein the operation comprises the following steps: pressing green "START" to begin the job, the inspection product comprising: according to the quality confirmation instruction of the drilling operation, the drilling quality is checked, and the checking result and the quantity are recorded in an autonomous checking table, and the recording is completed by the following steps: and counting the finished quantity, marking the finished quantity and the date on the operation flow sheet and the production record sheet, and signing.
9. The method of claim 1, wherein the product inspection comprises: 2cm is attached in "first article in kind" fence in kind, radium-shine blind hole is first, end inspection includes, first operation is every batch of product inspection, the inspection item is with the autonomous inspection item, it cuts out 2PN and carries out the operation of sola two moulds to get the copper foil, copper at the bottom of the metal image microscope inspection, the microetching bite amount need be controlled in 2um, to the great radium-shine through-hole product of exposed area, except using end light table 100% inspection product, use special supplementary apron inspection product, the apron can cover not process the region, expose the convenient inspection process region inspection of process region, the sola through-hole inspection includes: laser energy is surveyed, is gone up aperture, lower aperture, is not radium thoroughly, hole is inclined to one side, indentation, crease, true circularity confirm, and the inspection of sola blind hole includes: laser energy measurement, upper aperture, lower aperture, no radium penetration, hole deviation, indentation, crease, roundness confirmation, PI residue, copper damage and bottom copper dislocation.
10. The laser drilling method of a circuit board according to claim 1, wherein the visual inspection comprises: the bottom copper should not be damaged, the lower aperture should be completely on the bottom copper PAD, and the bottom copper should not be out of position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011546910.1A CN112775569A (en) | 2020-12-24 | 2020-12-24 | Laser drilling method for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011546910.1A CN112775569A (en) | 2020-12-24 | 2020-12-24 | Laser drilling method for circuit board |
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| CN112775569A true CN112775569A (en) | 2021-05-11 |
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| CN202011546910.1A Pending CN112775569A (en) | 2020-12-24 | 2020-12-24 | Laser drilling method for circuit board |
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2020
- 2020-12-24 CN CN202011546910.1A patent/CN112775569A/en active Pending
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| DE102005007441A1 (en) * | 2005-02-18 | 2006-03-23 | Daimlerchrysler Ag | Work piece dimension checking gauge comprises separate laser sintered parts on fixing hole raster plate |
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Application publication date: 20210511 |