CN112701461B - 5G millimeter wave super-surface antenna module and mobile device - Google Patents
5G millimeter wave super-surface antenna module and mobile device Download PDFInfo
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- CN112701461B CN112701461B CN202011354002.2A CN202011354002A CN112701461B CN 112701461 B CN112701461 B CN 112701461B CN 202011354002 A CN202011354002 A CN 202011354002A CN 112701461 B CN112701461 B CN 112701461B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The invention discloses a 5G millimeter wave super-surface antenna module and mobile equipment, wherein the module comprises a dielectric layer, at least two super-surface antenna units and a radio frequency chip, wherein the super-surface antenna units are arranged on the dielectric layer; the super-surface antenna unit comprises a super-surface radiation layer and a feed structure, wherein the super-surface radiation layer is arranged on the top surface of the dielectric layer, and the feed structure is arranged in the dielectric layer; a circuit layer is arranged on the bottom surface of the dielectric layer; the radio frequency chip is arranged on the circuit layer; one end of the feed structure is electrically coupled with the super-surface radiation layer, and the other end of the feed structure is connected with the radio frequency chip. The invention can effectively cover the n257, n258, n260 and n261 frequency bands, and the coverage frequency band is wide.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a 5G millimeter wave super-surface antenna module and mobile equipment.
Background
As a research and development focus in the global industry, developing 5G technology to formulate 5G standards has become an industry consensus. The international telecommunications union ITU defines three main application scenarios of 5G in the 22 nd conference of ITU-RWP5D held in month 6 of 2015: enhanced mobile broadband, large-scale machine communication, and high-reliability low-latency communication. The 3 application scenes respectively correspond to different key indexes, wherein the peak speed of the user in the enhanced mobile bandwidth scene is 20Gbps, and the minimum user experience rate is 100Mbps. The unique characteristics of high carrier frequency and large bandwidth of millimeter waves are a main means for realizing the 5G ultra-high data transmission rate. In addition, since the space reserved for the 5G antenna in the future mobile phone is small, the optional positions are not more, so that a miniaturized antenna module is designed.
According to the 3GPP TS38.101-2 5G terminal radio frequency technical specification and the TR38.817 terminal radio frequency technical report, the 5 GmmmmPave antenna needs to cover n257 (26.5-29.5 GHz), n258 (24.25-27.25 GHz) n260 (37-40 GHz) and n261 (27.5-28.35 GHz), and the high-pass antenna module on the market only covers n257 frequency bands (26.5-29.5 GHz). Moreover, the conventional millimeter wave antenna module is large in size and is not suitable for being integrated into a mobile terminal.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the 5G millimeter wave super-surface antenna module and the mobile device are wide in coverage frequency band and small in occupied space.
In order to solve the technical problems, the invention adopts the following technical scheme: A5G millimeter wave super-surface antenna module comprises a dielectric layer, at least two super-surface antenna units and a radio frequency chip, wherein the super-surface antenna units are arranged on the dielectric layer; the super-surface antenna unit comprises a super-surface radiation layer and a feed structure, wherein the super-surface radiation layer is arranged on the top surface of the dielectric layer, and the feed structure is arranged in the dielectric layer; a circuit layer is arranged on the bottom surface of the dielectric layer; the radio frequency chip is arranged on the circuit layer; one end of the feed structure is electrically coupled with the super-surface radiation layer, and the other end of the feed structure is connected with the radio frequency chip.
The invention also provides mobile equipment comprising the 5G millimeter wave super-surface antenna module.
The invention has the beneficial effects that: through adopting super surface antenna to set up the feed structure in the dielectric layer, effectively reduce module overall dimension, narrow the space that millimeter wave array occupy in communications facilities, simplified design degree of difficulty, test degree of difficulty and wave beam management's complexity. The invention can effectively cover the n257, n258, n260 and n261 frequency bands, and the coverage frequency band is wide.
Drawings
Fig. 1 is a schematic structural diagram of a 5G millimeter wave super-surface antenna module according to a first embodiment of the present invention;
fig. 2 is a schematic side view of a 5G millimeter wave super-surface antenna module according to a first embodiment of the present invention;
fig. 3 is a schematic bottom view of a 5G millimeter wave super-surface antenna module according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure of a super-surface radiation layer according to a first embodiment of the present invention;
FIG. 5 is a perspective view of a dielectric layer on top of a supersurface radiating layer and one end of a feed structure in accordance with an embodiment of the invention;
fig. 6 is an S-parameter diagram of a 5G millimeter wave super-surface antenna module according to a first embodiment of the present invention.
Description of the reference numerals:
1. a dielectric layer; 2. a super-surface antenna unit; 3. a circuit layer; 4. a radio frequency chip; 5. a digital circuit integrated chip; 6. a power chip;
21. a super surface radiation layer; 22. a feed structure;
211. a radiation unit; 212. a first slit; 213. a second slit;
221. a feed line; 222. and (5) metal branches.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1, a 5G millimeter wave super-surface antenna module includes a dielectric layer, at least two super-surface antenna units disposed on the dielectric layer, and a radio frequency chip; the super-surface antenna unit comprises a super-surface radiation layer and a feed structure, wherein the super-surface radiation layer is arranged on the top surface of the dielectric layer, and the feed structure is arranged in the dielectric layer; a circuit layer is arranged on the bottom surface of the dielectric layer; the radio frequency chip is arranged on the circuit layer; one end of the feed structure is electrically coupled with the super-surface radiation layer, and the other end of the feed structure is connected with the radio frequency chip.
From the above description, the beneficial effects of the invention are as follows: the coverage frequency band is wide, and the occupied space is small.
Further, the super-surface radiation layer comprises a plurality of radiation units, the plurality of radiation units are distributed in an array, gaps are arranged among the plurality of radiation units, each gap comprises at least one first gap and at least one second gap, and the first gaps and the second gaps are perpendicularly intersected.
Further, the plurality of radiation units are distributed in an n×n array, and the number of the first slits and the number of the second slits are n-1.
Further, the width of the first gap and/or the second gap is not uniform.
From the above description, it is clear that a plurality of radiation modes can be excited, thereby realizing ultra-wideband.
Further, the feed structure comprises a feed line and a metal branch; one end of the feeder line is electrically coupled with the super-surface radiation layer, and the other end of the feeder line is connected with the radio frequency chip; the metal branch is arranged at one end of the feeder line; one end of the feeder line is parallel to the first gap, and the metal branch is perpendicular to one end of the feeder line and corresponds to the second gap.
Further, the number of the metal branches is the same as the number of the second slits; the projection of the metal branch on the top surface of the dielectric layer is overlapped with the projection of the second gap on the top surface of the dielectric layer, and the projection of the metal branch on the top surface of the dielectric layer is perpendicularly intersected with the projection of each first gap on the top surface of the dielectric layer.
It can be seen from the above description that by providing the metal branch, it is ensured that all the radiating elements can be fed in a coupled manner, so that the antenna performance is improved, and at the same time, the metal branch also has the function of adjusting impedance.
Further, the radiating element is square.
Further, the circuit comprises a digital circuit integrated chip and a power chip, wherein the digital circuit integrated chip and the power chip are arranged on the circuit layer; the digital circuit integrated chip and the power chip are respectively and electrically connected with the radio frequency chip.
As can be seen from the above description, the digital integrated circuit chip can control the amplitude and phase of the signal of the radio frequency chip; the power chip can provide power for the radio frequency chip.
The invention also provides mobile equipment comprising the 5G millimeter wave super-surface antenna module.
Example 1
Referring to fig. 1-6, a first embodiment of the present invention is as follows: A5G millimeter wave super-surface antenna module is applicable to handheld equipment of a 5G millimeter wave communication system.
As shown in fig. 1, the super-surface antenna unit 2 comprises a dielectric layer 1 and at least two super-surface antenna units 2 arranged on the dielectric layer 1. The present embodiment is exemplified as including 4 super-surface antenna elements. Further, a circle of metal posts which are arranged at intervals are arranged around the ultra-surface antenna unit, and gaps among the metal posts can be set according to requirements. The metal pillars may be implemented by forming metallized vias on the dielectric layer.
As shown in fig. 2, the super-surface antenna unit 2 includes a super-surface radiation layer 21 and a feed structure 22, where the super-surface radiation layer 21 is disposed on the top surface of the dielectric layer 1, and the feed structure 22 is disposed in the dielectric layer 1. The bottom surface of the dielectric layer 1 is provided with a circuit layer 3; the module further comprises a radio frequency chip 4, a digital circuit integrated chip 5 and a power chip 6, wherein the radio frequency chip 4, the digital circuit integrated chip 5 and the power chip 6 are arranged on the circuit layer 3. In an alternative embodiment, the three chips are each connected to the circuit layer by BGA solder balls. The digital circuit integrated chip 5 and the power chip 6 are respectively and electrically connected with the radio frequency chip 4, and the radio frequency chip 4 is respectively connected with each super-surface antenna unit 2. Specifically, the radio frequency chip 4 is connected to the feed structure 22 of each of the super surface antenna units 2; i.e. one end of the feed structure 22 is electrically coupled to the super surface radiation layer 21 and the other end is connected to the radio frequency chip 4. Preferably, the other end of the feed structure is connected to the circuit layer and then to the radio frequency chip via a line on the circuit layer. A schematic diagram of the circuit layer is shown in fig. 3.
The radio frequency chip is used for providing signals for the antenna; and the RF chip comprises elements such as a phase shifter and an amplifier, wherein the phase shifter is used for providing phase difference between antenna units to realize the beam scanning capability, and the amplifier is used for compensating the loss of the phase shifter. The digital integrated circuit chip is used for controlling the amplitude and the phase of the signal of the radio frequency chip and is equivalent to a digital switch of a circuit such as an amplifier, a low-noise amplifier and the like in the radio frequency chip. And the power supply chip is used for providing power supply for the radio frequency chip.
As shown in fig. 4, the super-surface radiation layer 21 includes a plurality of radiation units 211, the plurality of radiation units 211 are distributed in an array, and gaps are disposed between the plurality of radiation units 211, the gaps include at least one first gap 212 and at least one second gap 213, and the first gap 212 and the second gap 213 intersect perpendicularly.
In an alternative embodiment, the plurality of radiating elements are distributed in an n x n array, the slits comprising n-1 first slits parallel to each other and n-1 second slits parallel to each other, n being an integer greater than 1.
In this embodiment, the super-surface radiation layer includes 9 square radiation units and is distributed in a 3×3 array, where 4 slots (i.e., two first slots and two second slots) in a groined shape are provided, and the width of the slots is not uniform.
In a specific implementation, a 3cm×3cm metal sheet may be divided into 9 small metal sheets by 4 uneven slits, so as to obtain the super surface radiation layer of this embodiment, which may excite multiple radiation modes, thereby implementing an ultra wideband (also called a super surface antenna). The division into 9 pieces is in consideration of the difficulty of process realization, the width of the gap is 0.8-1mm, 16 or 25 small metal pieces can be theoretically divided into the small metal pieces, and the bandwidth performance is better through different gaps, but the size of the gap is difficult to process.
Further, the feed structure comprises a feed line and a metal branch; one end of the feeder line is electrically coupled with the super-surface radiation layer, and the other end of the feeder line is connected with the radio frequency chip; the metal branch is arranged at one end of the feeder line, which is close to the super-surface radiation layer. The metal branch is perpendicular to one end of the feeder line and corresponds to the first gap or the second gap. Namely, when one end of the feeder line is parallel to the first gap, the metal branch corresponds to the second gap; when one end of the feeder line is parallel to the second gap, the metal branch corresponds to the first gap. The present embodiment will be described by taking the former example.
In this embodiment, one end of the feeder is disposed on an inner surface of the top surface of the dielectric layer. As shown in fig. 5, the feeder line 221 is provided with two parallel metal branches 222 at one end near the super-surface radiation layer, and the center point of the metal branch 222 is connected with the feeder line 221; the projection of one end of the feeder line 221 on the top surface of the dielectric layer overlaps with the central line of the projection of the super surface radiation layer on the top surface of the dielectric layer, and is parallel to the projection of the first slit 212 on the top surface of the dielectric layer; the projections of the two metal branches 222 on the top surface of the dielectric layer overlap with the projections of the two second slits 213 on the top surface of the dielectric layer respectively, and perpendicularly intersect with the projections of the two first slits 212 on the top surface of the dielectric layer respectively.
Preferably, the lengths of the two metal branches may be the same.
Fig. 6 is an S parameter schematic diagram of a 5G millimeter wave super-surface antenna module according to this embodiment, where S44 coincides with S11, S33 coincides with S22, the operating frequency is 22.5-32GHz, and it can be seen that the loss in the 37-40GHz band is less than-10 dB, that is, it covers 4 bands of n257 (26.5-29.5 GHz), n258 (24.25-27.25 GHz), n260 (37-40 GHz) and n261 (27.5-28.35 GHz), and meets the requirement of a 5GmmWave antenna.
In summary, the 5G millimeter wave super-surface antenna module and the mobile device provided by the invention can effectively cover n257 (26.5-29.5 GHz), n258 (24.25-27.25 GHz), n260 (37-40 GHz) and n261 (27.5-28.35 GHz), and have wide coverage frequency bands; the whole size is small and can be based on a PCB, so that the subsequent integration with a chip is facilitated; in addition, the space occupied by the millimeter wave array in the communication equipment is narrowed, and the design difficulty, the test difficulty and the complexity of beam management are simplified.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent changes made by the specification and drawings of the present invention, or direct or indirect application in the relevant art, are included in the scope of the present invention.
Claims (7)
1. The 5G millimeter wave super-surface antenna module is characterized by comprising a dielectric layer, at least two super-surface antenna units and a radio frequency chip, wherein the super-surface antenna units are arranged on the dielectric layer; the super-surface antenna unit comprises a super-surface radiation layer and a feed structure, wherein the super-surface radiation layer is arranged on the top surface of the dielectric layer, and the feed structure is arranged in the dielectric layer; a circuit layer is arranged on the bottom surface of the dielectric layer; the radio frequency chip is arranged on the circuit layer; one end of the feed structure is electrically coupled with the super-surface radiation layer, and the other end of the feed structure is connected with the radio frequency chip;
the super-surface radiation layer comprises a plurality of radiation units, the plurality of radiation units are distributed in an array, gaps are arranged among the plurality of radiation units, each gap comprises at least one first gap and at least one second gap, and the first gaps and the second gaps are vertically intersected;
the feed structure comprises a feed line and a metal branch; one end of the feeder line is electrically coupled with the super-surface radiation layer, and the other end of the feeder line is connected with the radio frequency chip; the metal branch is arranged at one end of the feeder line; one end of the feeder line is parallel to the first gap, and the metal branch is perpendicular to one end of the feeder line and corresponds to the second gap.
2. The 5G millimeter wave super surface antenna module of claim 1, wherein the plurality of radiating elements are distributed in an n x n array, and the number of the first slots and the second slots is n-1.
3. The 5G millimeter wave super surface antenna module of claim 1, wherein the width of the first slot and/or the second slot is non-uniform.
4. The 5G millimeter wave super surface antenna module of claim 1, wherein the number of metal branches is the same as the number of second slots; the projection of the metal branch on the top surface of the dielectric layer is overlapped with the projection of the second gap on the top surface of the dielectric layer, and the projection of the metal branch on the top surface of the dielectric layer is perpendicularly intersected with the projection of each first gap on the top surface of the dielectric layer.
5. The 5G millimeter wave super surface antenna module of claim 1, wherein said radiating element is square.
6. The 5G millimeter wave subsurface antenna module according to any one of claims 1-5, further comprising a digital circuit integrated chip and a power chip disposed on the circuit layer; the digital circuit integrated chip and the power chip are respectively and electrically connected with the radio frequency chip.
7. A mobile device comprising a 5G millimeter wave super surface antenna module as claimed in any one of claims 1 to 6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011354002.2A CN112701461B (en) | 2020-11-27 | 2020-11-27 | 5G millimeter wave super-surface antenna module and mobile device |
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| CN202011354002.2A CN112701461B (en) | 2020-11-27 | 2020-11-27 | 5G millimeter wave super-surface antenna module and mobile device |
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| CN112701461A CN112701461A (en) | 2021-04-23 |
| CN112701461B true CN112701461B (en) | 2023-07-18 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE9903167D0 (en) * | 1999-09-08 | 1999-09-08 | Ericsson Telefon Ab L M | Distribution network, and antenna device comprising such distribution network |
| RU2156525C2 (en) * | 1998-11-27 | 2000-09-20 | Орлов Александр Борисович | Microstrip antenna array |
| CN105789906A (en) * | 2016-03-03 | 2016-07-20 | 电子科技大学 | 2D phase gradient super-surface composite structure |
| CN106025563A (en) * | 2016-05-30 | 2016-10-12 | 电子科技大学 | Graphene high-impedance surface for direction pattern-reconfigurable antenna |
| CN106356618A (en) * | 2016-09-26 | 2017-01-25 | 东南大学 | Micro wave high-frequency-band dual polarization small base station plate antenna |
| CN207651669U (en) * | 2017-12-30 | 2018-07-24 | 深圳市东信通电子科技有限公司 | Automobile-used super surface micro-strip radio-frequency antenna |
| CN109687165A (en) * | 2018-12-29 | 2019-04-26 | 瑞声科技（南京）有限公司 | Millimeter wave array antenna mould group and mobile terminal |
| EP3490057A1 (en) * | 2017-11-28 | 2019-05-29 | Samsung Electronics Co., Ltd. | Antenna system for transmitting and receiving mm-wave signal |
| CN209766650U (en) * | 2019-05-16 | 2019-12-10 | 东南大学 | one-bit liquid crystal-based digital super surface |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9172145B2 (en) * | 2006-09-21 | 2015-10-27 | Raytheon Company | Transmit/receive daughter card with integral circulator |
-
2020
- 2020-11-27 CN CN202011354002.2A patent/CN112701461B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2156525C2 (en) * | 1998-11-27 | 2000-09-20 | Орлов Александр Борисович | Microstrip antenna array |
| SE9903167D0 (en) * | 1999-09-08 | 1999-09-08 | Ericsson Telefon Ab L M | Distribution network, and antenna device comprising such distribution network |
| CN105789906A (en) * | 2016-03-03 | 2016-07-20 | 电子科技大学 | 2D phase gradient super-surface composite structure |
| CN106025563A (en) * | 2016-05-30 | 2016-10-12 | 电子科技大学 | Graphene high-impedance surface for direction pattern-reconfigurable antenna |
| CN106356618A (en) * | 2016-09-26 | 2017-01-25 | 东南大学 | Micro wave high-frequency-band dual polarization small base station plate antenna |
| EP3490057A1 (en) * | 2017-11-28 | 2019-05-29 | Samsung Electronics Co., Ltd. | Antenna system for transmitting and receiving mm-wave signal |
| CN207651669U (en) * | 2017-12-30 | 2018-07-24 | 深圳市东信通电子科技有限公司 | Automobile-used super surface micro-strip radio-frequency antenna |
| CN109687165A (en) * | 2018-12-29 | 2019-04-26 | 瑞声科技（南京）有限公司 | Millimeter wave array antenna mould group and mobile terminal |
| CN209766650U (en) * | 2019-05-16 | 2019-12-10 | 东南大学 | one-bit liquid crystal-based digital super surface |
Non-Patent Citations (1)
| Title |
|---|
| 《Broadband CPW-Fed Aperture Coupled Metasurface Antenna》;Junfang Wang;Hang Wong,Zhuoqiao Ji,Yongle Wu;《IEEE Antennas and Wireless Propagation Letters》;20190127;第18卷(第3期);参见第517页右栏最后一段-第518页右栏第1段，图1-5 * |
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