CN112657817B - Array type ultrasonic transducer and manufacturing method thereof - Google Patents
Array type ultrasonic transducer and manufacturing method thereof Download PDFInfo
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Abstract
The invention provides an array type ultrasonic transducer and a manufacturing method thereof, and an ultrasonic transduction unit provided by the invention can solve the problem of impedance mismatching between the ultrasonic transduction unit and a target object through an acoustic impedance matching layer, improve the output bandwidth and amplitude response of the ultrasonic transduction unit, and increase the imaging resolution and sensitivity of the ultrasonic transduction unit. And the ultrasonic transduction unit can realize the correction of sound field distortion generated during the regulation of beam control, deflection, beam focusing and the like through the surface of the acoustic super-structure, and simultaneously realize the further improvement of the imaging resolution and the signal to noise ratio of the ultrasonic transduction unit. And the array ultrasonic transducer is obtained by arranging the plurality of ultrasonic transduction units in an array, so that the application range and the performance of the array ultrasonic transducer are improved. Meanwhile, the acoustic impedance matching layer is grown by adopting a forward growth process, so that the thickness precision of the acoustic impedance matching layer can be improved, and the performance of the array type ultrasonic transducer is further improved.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to an array type ultrasonic transducer and a manufacturing method thereof.
Background
In recent years, improvements in acoustic matching performance of ultrasonic transducers using novel physical properties and effects of phononic crystal and acoustic metamaterial surfaces have been reported by many scholars. As an artificially synthesized composite structural material, the acoustic metamaterial is composed of sub-wavelength scale structural units (or artificial atoms), and can present equivalent material parameters which are not possessed by natural materials in nature, such as negative mass density, negative elastic modulus, near-zero refractive index, extreme anisotropy and the like. Unlike other artificial materials such as phononic crystals, the macroscopic physical properties of the acoustic metamaterial mainly depend on the local properties of the structural units of the metamaterial rather than the long-range interaction between the structural units. This enables us to design macroscopic material parameters on an "atomic" scale as desired, and to more easily construct spatially graded distributions, thereby achieving anomalous manipulation of acoustic waves. The performance of existing ultrasound transducer devices is yet to be improved.
Disclosure of Invention
In view of this, the present invention provides an array type ultrasonic transducer and a method for manufacturing the same, which effectively solve the technical problems in the prior art, and the array type ultrasonic transducer provided by the present invention has high performance.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
an array type ultrasonic transducer comprising a plurality of ultrasonic transducing units arranged in an array, the ultrasonic transducing units comprising:
the surface of one side of the back lining layer is exposed out of the circuit layer;
the piezoelectric layer is positioned on one side of the backing layer, which is provided with the circuit layer, and comprises a piezoelectric layer body and electrodes positioned on the surface of the piezoelectric layer body, which faces the side of the backing layer, and the surface of the piezoelectric layer body, which faces away from the side of the backing layer;
and an acoustic artifact located on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic superstructure surface; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer, or on a side of the acoustic impedance matching layer facing away from the backing layer.
Optionally, the acoustic impedance matching layer includes a first acoustic impedance matching sublayer to an nth acoustic impedance matching sublayer that are sequentially stacked in a direction from the backing layer to the piezoelectric layer, where N is an integer greater than or equal to 1.
Optionally, the acoustic superstructure surface includes a circular central portion and first to mth circular portions, M being an integer greater than or equal to 1; the first circular ring part surrounds the circular central part, the (i + 1) th circular ring part surrounds the ith circular ring part, annular grooves are formed between the first circular ring part and the circular central part and between the (i + 1) th circular ring part and the ith circular ring part, and i is an integer which is greater than or equal to 1 and less than M;
or the acoustic superstructure surface comprises a plurality of bar-shaped parts arranged side by side, the height of at least one bar-shaped part is different from the heights of the rest bar-shaped parts in the direction from the back lining layer to the piezoelectric layer, and/or the width of at least one bar-shaped part is different from the widths of the rest bar-shaped parts in the arrangement direction of the bar-shaped parts, and/or one side of the bar-shaped part, which is far away from the back lining layer, is in a wedge shape, and/or the bar-shaped part is a hollow bar-shaped part, and/or the material of at least one bar-shaped part is different from the material of the rest bar-shaped parts;
alternatively, the side of the acoustic superstructure surface facing away from the backing layer is an undulating surface.
Optionally, the acoustic impedance matching layer is made of a polymer material or a metal material.
Optionally, the material of the acoustic superstructure surface is a polymer material.
Optionally, the piezoelectric layer body is made of piezoelectric ceramics, a piezoelectric ceramic composite material, a piezoelectric point single crystal material or a piezoelectric single crystal composite material.
Optionally, the backing layer is made of epoxy resin, and the backing layer further includes at least one of tungsten powder and alumina powder.
Optionally, the plurality of ultrasonic transduction units are arranged in a matrix.
Correspondingly, the invention also provides a manufacturing method of the array type ultrasonic transducer, the array type ultrasonic transducer comprises a plurality of ultrasonic transducer units which are arranged in an array, and the manufacturing method of the ultrasonic transducer units comprises the following steps:
forming a back lining layer, wherein the surface of one side of the back lining layer is exposed out of the circuit layer;
forming a piezoelectric layer on one side of the backing layer with the circuit layer, wherein the piezoelectric layer comprises a piezoelectric layer body and electrodes on the surface of the piezoelectric layer body on one side facing the backing layer and the surface on one side facing away from the backing layer;
forming an acoustic artifact on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic super-structure surface which are grown by adopting a forward growth process; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer, or on a side of the acoustic impedance matching layer facing away from the backing layer.
Optionally, the acoustic impedance matching layer grown by using the forward growth process includes:
and growing the acoustic impedance matching layer by adopting a thermal evaporation coating process or a magnetron sputtering process.
Compared with the prior art, the technical scheme provided by the invention at least has the following advantages:
the invention provides an array type ultrasonic transducer and a manufacturing method thereof, wherein the array type ultrasonic transducer comprises a plurality of ultrasonic transducer units which are arranged in an array manner, and the ultrasonic transducer units comprise: the surface of one side of the back lining layer is exposed out of the circuit layer; the piezoelectric layer is positioned on one side of the backing layer, which is provided with the circuit layer, and comprises a piezoelectric layer body and electrodes positioned on the surface of the piezoelectric layer body, which faces the side of the backing layer, and the surface of the piezoelectric layer body, which faces away from the side of the backing layer; and an acoustic artifact located on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic superstructure surface; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer, or on a side of the acoustic impedance matching layer facing away from the backing layer.
From the above, the ultrasonic transduction unit provided by the invention can solve the problem of impedance mismatching between the ultrasonic transduction unit and a target object through the acoustic impedance matching layer, improve the output bandwidth and amplitude response of the ultrasonic transduction unit, and increase the imaging resolution and sensitivity of the ultrasonic transduction unit. And the ultrasonic transduction unit can realize the correction of sound field distortion generated during the regulation of beam control, deflection, beam focusing and the like through the surface of the acoustic super-structure, and simultaneously, the further improvement of the imaging resolution and the signal-to-noise ratio of the ultrasonic transduction unit is realized. And the array ultrasonic transducer is obtained by arranging the plurality of ultrasonic transduction units in an array, so that the application range and the performance of the array ultrasonic transducer are improved. Meanwhile, the acoustic impedance matching layer is grown by adopting a forward growth process, so that the thickness precision of the acoustic impedance matching layer can be improved, and the performance of the array type ultrasonic transducer is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an array type ultrasonic transducer according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an ultrasonic transduction unit according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another ultrasonic transducer unit provided in the embodiment of the present invention;
fig. 4 is a schematic structural diagram of another ultrasonic transducer unit provided in an embodiment of the present invention;
FIG. 5a is a schematic structural diagram of an acoustic metastructure surface according to an embodiment of the present invention;
FIG. 5b is a cross-sectional view along the direction AA' in FIG. 5 a;
FIG. 6 is a schematic structural diagram of another acoustic superstructure surface provided by an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of another acoustic superstructure surface provided by an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of another acoustic superstructure surface provided by an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of another acoustic superstructure surface provided by an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of another acoustic superstructure surface provided by an embodiment of the present invention;
fig. 11 is a schematic structural diagram of another acoustic superstructure surface provided by an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background, in recent years, improvement of acoustic matching performance of ultrasonic transducers using novel physical properties and effects of acoustic metamaterial has been reported by many scholars. Ultrasonic transducers are key components in ultrasound devices and can be used for ultrasound imaging, ultrasound stimulation, ultrasound therapy, acoustic manipulation, and the like. The performance of existing ultrasound transducer devices is yet to be improved.
Based on this, the embodiment of the invention provides an array type ultrasonic transducer and a manufacturing method thereof, which effectively solve the technical problems in the prior art, and the array type ultrasonic transducer provided by the embodiment of the invention has high performance.
To achieve the above object, the technical solutions provided by the embodiments of the present invention are described in detail below, specifically with reference to fig. 1 to 11.
Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of an array-type ultrasonic transducer according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of an ultrasonic transduction unit according to an embodiment of the present invention, and fig. 3 is a schematic structural diagram of another ultrasonic transduction unit according to an embodiment of the present invention. Wherein, array ultrasonic transducer includes a plurality of ultrasonic transduction units 100 that are arranged in an array, the ultrasonic transduction unit includes:
and a backing layer 110, wherein the surface of one side of the backing layer 110 is exposed out of the circuit layer.
The piezoelectric layer 120 is located on the side of the backing layer 110 having the circuit layer, and the piezoelectric layer 120 includes a piezoelectric layer body, and electrodes located on the surface of the piezoelectric layer body facing the backing layer 110 and the surface facing away from the backing layer 110.
And an acoustic artificial structure 130 located on a side of the piezoelectric layer 120 facing away from the backing layer 110, the acoustic artificial structure 130 comprising: acoustic impedance matching layer 131 and acoustic superstructure surface 132; wherein the acoustic superstructure surface 132 is located between the acoustic impedance matching layer 131 and the piezoelectric layer 120 (as shown in FIG. 2). Or the acoustic superstructure surface 132 is located on the side of the acoustic impedance matching layer 131 facing away from the backing layer 110 (as shown in fig. 3).
In an embodiment of the present invention, the plurality of ultrasonic transducing units provided by the present invention may be arranged in a matrix, and the present invention is not particularly limited.
It can be understood that the ultrasonic transduction unit provided by the embodiment of the present invention can solve the problem of impedance mismatch between the ultrasonic transduction unit and a target object through the acoustic impedance matching layer, improve the output bandwidth and amplitude response of the ultrasonic transduction unit, and increase the imaging resolution and sensitivity of the ultrasonic transduction unit. And the ultrasonic transduction unit can realize the correction of sound field distortion generated during the regulation of beam control, deflection, beam focusing and the like through the surface of the acoustic super-structure, and simultaneously, the further improvement of the imaging resolution and the signal-to-noise ratio of the ultrasonic transduction unit is realized. And the array ultrasonic transducer is obtained by arranging the plurality of ultrasonic transduction units in an array, so that the application range and the performance of the array ultrasonic transducer are improved. Meanwhile, the acoustic impedance matching layer is grown by adopting a forward growth process, so that the thickness precision of the acoustic impedance matching layer can be improved, and the performance of the array type ultrasonic transducer is further improved.
Furthermore, the ultrasonic transduction unit provided by the embodiment of the invention can also realize the sub-wavelength focusing and super-imaging effects breaking through the diffraction limit through the acoustic artificial structure.
In an embodiment of the present invention, the acoustic impedance matching layer provided in the embodiment of the present invention is used to match impedance between the ultrasonic transduction unit and the target object, where the acoustic impedance matching unit may be a single-layer structure, or the acoustic impedance matching unit may also be a plurality of laminated structures. As shown in fig. 4, a schematic structural diagram of another ultrasonic transduction unit provided in an embodiment of the present invention is shown, wherein the acoustic impedance matching layer 131 provided in the embodiment of the present invention includes a first acoustic impedance matching sublayer 1311 to an nth acoustic impedance matching sublayer 131N that are sequentially stacked in a direction from the backing layer 110 to the piezoelectric layer 120, where N is an integer greater than or equal to 1.
In an embodiment of the present invention, the acoustic super-structure surface provided in the embodiment of the present invention is used to change transmission characteristics of sound waves, such as reflection focusing at any point, perfect sound absorption at low frequency, self-bending sound beam, spiral sound wave, and asymmetric transmission of sound energy, and the structure of the acoustic super-structure surface is not particularly limited in the embodiment of the present invention, and may be a multi-turn nested structure, a multilayer structure, a gradient structure, and the like. As shown in fig. 5a and 5b, fig. 5a is a schematic structural diagram of an acoustic metamaterial surface according to an embodiment of the present invention, and fig. 5b is a sectional view along the AA' direction in fig. 5a, wherein the acoustic metamaterial surface 132 according to an embodiment of the present invention includes a circular central portion 1320 and first to mth circular ring portions 1321 to 132M, where M is an integer greater than or equal to 1.
The first annular portion 1321 surrounds the circular center portion 1320, the i +1 th annular portion surrounds the i-th annular portion, annular grooves are formed between the first annular portion 1321 and the circular center portion 1320 and between the i +1 th annular portion and the i-th annular portion, and i is an integer greater than or equal to 1 and less than M.
It can be understood that the depth of the groove structure between the first circular ring portion and the circular central portion and the depth of the groove structure between the (i + 1) th circular ring portion and the ith circular ring portion provided in the embodiment of the present invention are not particularly limited, and the groove structure can penetrate through the surface of the acoustic superstructure, which needs to be specifically designed according to practical applications.
Alternatively, as shown in fig. 6, the acoustic superstructure surface comprises a plurality of bars 132a arranged side by side, and in the direction from the backing layer to the piezoelectric layer, the height h1 of at least one bar 132a is different from the heights of the rest bars 132a (specifically, a gradient arrangement may be adopted, if necessary, wherein the height of each bar is specifically adjusted according to the actual application), and/or, as shown in fig. 7, in the arrangement direction of the plurality of bars, the width h2 of at least one bar 132a is different from the widths of the rest bars (wherein the width of each bar is specifically adjusted according to the actual application), and/or, as shown in fig. 8, the side of the bar 132a facing away from the backing layer is wedge-shaped (wherein the wedge angle of each bar is specifically adjusted according to the actual application). And/or, as shown in fig. 9, the strip portions 132a are hollow strip portions, and/or at least one strip portion is made of a material different from the material of the other strip portions.
Alternatively, as shown in fig. 10, the side of the acoustic metamaterial surface 132 facing away from the backing layer is an undulating surface, and the present invention is not particularly limited thereto, and the acoustic metamaterial surface can be specifically shaped as desired.
The ultrasonic transduction unit comprises a backing layer, a piezoelectric layer, an acoustic impedance matching layer, an acoustic superstructure surface and the like, and in order to research the influence of each layer structure on the electrical and acoustic performance of the ultrasonic transduction unit, a physical model which is structurally equivalent to the ultrasonic transduction unit is firstly established. The main structure of the ultrasonic transduction unit comprises a piezoelectric layer, an acoustic impedance matching layer, an acoustic ultrastructure surface and a backing layer, and therefore the relation between the acoustic impedance matching of the ultrasonic transduction unit and structural parameters of all layers is modeled and analyzed on the basis of a microwave transmission line theory through a Mason electromechanical equivalent circuit. The mechanical vibration of each layer is equivalent to a part of a circuit, the acoustic impedance matching network theory is applied to the parameter design of the acoustic impedance matching layer, and meanwhile, the acoustic wave transmission efficiency under the action of the acoustic impedance matching layer is calculated by utilizing a transmission matrix. The static capacitor C of the piezoelectric layer material provided by the embodiment of the invention0Electromechanical conversion coefficient N and longitudinal wave velocity CpWave number k and acoustic impedance ZpComprises the following steps:
N＝h33C0
k＝ω/cp
Zp＝ρcp
where rho, A, tp、
h33、
Respectively representing the density, the area, the thickness, the elastic rigidity constant, the piezoelectric constant and the dielectric constant of the piezoelectric layer material, and further obtaining the optimal parameters by optimizing the material of the piezoelectric layer.
And, the embodiment of the present invention takes the example where the acoustic impedance matching layer includes a first acoustic impedance matching sublayer to a third acoustic impedance matching sublayer, where Z isaMatching the acoustic impedance of the sub-layer, Z, to the first acoustic impedancebMatching the acoustic impedance, Z, of the sub-layer to the second acoustic impedancecMatching the acoustic impedance of the sub-layer, Z, for the third acoustic impedancelAcoustic impedance, t, of a propagation medium between the acoustic impedance matching layer and the target objectaIs the thickness of the first acoustic impedance matching sublayer, tbIs the thickness of the second acoustic impedance matching sublayer, tcIs the thickness, k, of the third acoustic impedance matching sublayeraWave number, k, of first acoustic impedance matching sublayerbWave number, k, of the second acoustic impedance matching sublayercFor the wavenumber of the third acoustic impedance matching sublayer, the equivalent input impedance (Z) matched for each layer is derived by the equivalent circuitin1For the equivalent input impedance, Z, of the first acoustic impedance matching sublayerin2Is the equivalent input impedance, Z, of the second acoustic impedance matching sublayerin3Equivalent input impedance of the third acoustic impedance matching sublayer) are:
the material selection and thickness parameters of each acoustic impedance matching sublayer are determined through calculation, and then a finite element model is established through finite element simulation software (such as COMSOL Multiphysics) to carry out sound field analysis, so that the effect of the acoustic impedance matching layers is further optimized. Optionally, the acoustic impedance matching layer provided by the embodiment of the present invention is made of a polymer material (where the acoustic impedance matching layer made of a polymer material may be prepared by using a forward growth technique of thermal evaporation coating) or a metal material (where the acoustic impedance matching layer made of a metal material may be prepared by using a forward growth technique of magnetron sputtering). Specifically, the material of the acoustic impedance matching layer provided in the embodiment of the present invention may be parylene or gold, and other materials may also be used in other embodiments of the present invention, which is not limited in particular.
And the acoustic super-structure surface provided by the embodiment of the invention can comprise a circular central part, a first circular ring part and a second circular ring part, wherein a theoretical model of a plane fresnel acoustic lens of the acoustic super-structure surface of the circular structure is established by taking kirchhoff diffraction theory and fresnel zone plate theory as principles, and the acoustic artificial focusing structure parameter can enable a sound field of an ultrasonic energy conversion unit to generate a focusing effect when meeting the following formula as known by a half-wave band method:
where F represents the designed focal length, λ represents the wavelength of the acoustic wave in the transmission medium, and m (m is 1,2,3 …) represents the number of turns of the circular structure (i.e. the circular center part is the first turn, the first annular part is the second turn, and so on, as shown in fig. 11), the more the number of turns, the higher the transmission efficiency of the acoustic wave, but at the same time, the fresnel acoustic lens becomes complicated to manufacture. For example, when an m (e.g., m-3) turn of the acoustic metamaterial surface is fabricated on the ultrasonic transduction unit, the thickness h of the acoustic metamaterial surface can be designed by the following formula:
where c0 is the speed of sound of the propagation medium between the ultrasound transducing unit and the target object, c1 is the speed of sound of the material of the acoustic metamaterial surface,
representing the phase change of the acoustic wave as it exits through the acoustic superstructure surface. Optionally, the acoustic superstructure surface provided in the embodiment of the present invention may be made of a polymer material, specifically parylene, where, considering that the transmission efficiency of sound waves is also affected by acoustic impedance of the material, on the basis of theoretical calculation based on an acoustic artificial structure and finite element simulation verification, for example, parylene having acoustic impedance parameters closer to water is selected as a material for preparing the acoustic superstructure surface, and the acoustic superstructure surface may be specifically manufactured by using a high-precision photolithography micromachining technology or a 3D printing technology, so as to ensure high manufacturing precision; the present invention is not limited to the specific examples, and other materials may be used in other embodiments of the present invention.
In addition, the piezoelectric layer body provided by the embodiment of the invention is made of piezoelectric ceramics, a piezoelectric ceramic composite material, a piezoelectric point single crystal material or a piezoelectric single crystal composite material. Optionally, the backing layer provided by the embodiment of the invention comprises epoxy resin, and the backing layer further comprises at least one of tungsten powder and alumina powder, specifically, the epoxy resin, the tungsten powder and the alumina powder can be formed into a mixed material.
Correspondingly, the embodiment of the invention also provides a manufacturing method of the array type ultrasonic transducer, the array type ultrasonic transducer comprises a plurality of ultrasonic transducer units which are arranged in an array, and the manufacturing method of the ultrasonic transducer units comprises the following steps:
forming a back lining layer, wherein the surface of one side of the back lining layer is exposed out of the circuit layer;
forming a piezoelectric layer on one side of the backing layer with the circuit layer, wherein the piezoelectric layer comprises a piezoelectric layer body and electrodes on the surface of the piezoelectric layer body on one side facing the backing layer and the surface on one side facing away from the backing layer;
forming an acoustic artifact on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic super-structure surface which are grown by adopting a forward growth process; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer, or on a side of the acoustic impedance matching layer facing away from the backing layer.
It can be understood that after the plurality of ultrasonic transduction units are obtained by the above manufacturing method, all the ultrasonic transduction units are arranged according to a preset arrangement mode to obtain the array type ultrasonic transducer.
In an embodiment of the present invention, the acoustic impedance matching layer grown by using the forward growth process includes:
the acoustic impedance matching layer is grown by adopting a thermal evaporation coating process or a magnetron sputtering process, and a preparation process is specifically selected according to specific materials of the acoustic impedance matching degree, so that the invention is not particularly limited.
The embodiment of the invention provides an array type ultrasonic transducer and a manufacturing method thereof, wherein the array type ultrasonic transducer comprises a plurality of ultrasonic transducer units which are arranged in an array mode, and the ultrasonic transducer units comprise: the surface of one side of the back lining layer is exposed out of the circuit layer; the piezoelectric layer is positioned on one side of the backing layer, which is provided with the circuit layer, and comprises a piezoelectric layer body and electrodes positioned on the surface of the piezoelectric layer body, which faces the side of the backing layer, and the surface of the piezoelectric layer body, which faces away from the side of the backing layer; and an acoustic artifact located on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic superstructure surface; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer, or on a side of the acoustic impedance matching layer facing away from the backing layer.
As can be seen from the above, the ultrasonic transduction unit provided in the embodiment of the present invention can solve the problem of impedance mismatch between the ultrasonic transduction unit and the target object through the acoustic impedance matching layer, improve the output bandwidth and the amplitude response of the ultrasonic transduction unit, and increase the imaging resolution and the sensitivity of the ultrasonic transduction unit. And the ultrasonic transduction unit can realize the correction of sound field distortion generated during the regulation of beam control, deflection, beam focusing and the like through the surface of the acoustic super-structure, and simultaneously, the further improvement of the imaging resolution and the signal-to-noise ratio of the ultrasonic transduction unit is realized. And the array ultrasonic transducer is obtained by arranging the plurality of ultrasonic transduction units in an array, so that the application range and the performance of the array ultrasonic transducer are improved. Meanwhile, the acoustic impedance matching layer is grown by adopting a forward growth process, so that the thickness precision of the acoustic impedance matching layer can be improved, and the performance of the array type ultrasonic transducer is further improved.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. An array type ultrasonic transducer, comprising a plurality of ultrasonic transduction units arranged in an array, the ultrasonic transduction units comprising:
the surface of one side of the back lining layer is exposed out of the circuit layer;
the piezoelectric layer is positioned on one side of the backing layer, which is provided with the circuit layer, and comprises a piezoelectric layer body and electrodes positioned on the surface of the piezoelectric layer body, which faces the side of the backing layer, and the surface of the piezoelectric layer body, which faces away from the side of the backing layer;
and an acoustic artifact located on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic superstructure surface; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer or on a side of the acoustic impedance matching layer facing away from the backing layer;
the acoustic superstructure surface comprises a circular central part and first to Mth circular parts, wherein M is an integer greater than or equal to 1; the first circular ring part surrounds the circular central part, the (i + 1) th circular ring part surrounds the ith circular ring part, annular grooves are formed between the first circular ring part and the circular central part and between the (i + 1) th circular ring part and the ith circular ring part, and i is an integer which is greater than or equal to 1 and less than M;
or the acoustic superstructure surface comprises a plurality of bar-shaped parts arranged side by side, the height of at least one bar-shaped part is different from the heights of the rest bar-shaped parts in the direction from the back lining layer to the piezoelectric layer, and/or the width of at least one bar-shaped part is different from the widths of the rest bar-shaped parts in the arrangement direction of the bar-shaped parts, and/or one side of the bar-shaped part, which is far away from the back lining layer, is in a wedge shape, and/or the bar-shaped part is a hollow bar-shaped part, and/or the material of at least one bar-shaped part is different from the material of the rest bar-shaped parts;
alternatively, the side of the acoustic superstructure surface facing away from the backing layer is an undulating surface.
2. The array ultrasonic transducer of claim 1, wherein the acoustic impedance matching layers comprise a first acoustic impedance matching sublayer to an Nth acoustic impedance matching sublayer sequentially stacked along a direction from the backing layer to the piezoelectric layer, and N is an integer greater than or equal to 1.
3. The array ultrasonic transducer according to claim 1, wherein the acoustic impedance matching layer is made of polymer material or metal material.
4. The array ultrasound transducer of claim 1, wherein the acoustic ultrasound structure surface is a polymer material.
5. The array ultrasonic transducer of claim 1, wherein the piezoelectric layer body is made of piezoelectric ceramic, piezoelectric ceramic composite material, piezoelectric single crystal material or piezoelectric single crystal composite material.
6. The array ultrasonic transducer according to claim 1, wherein the backing layer comprises epoxy resin, and the backing layer further comprises at least one of tungsten powder and alumina powder.
7. The array ultrasonic transducer of claim 1, wherein the plurality of ultrasonic transducing units are arranged in a matrix.
8. A method for manufacturing an array type ultrasonic transducer is characterized in that the array type ultrasonic transducer comprises a plurality of ultrasonic transduction units which are arranged in an array, and the method for manufacturing the ultrasonic transduction units comprises the following steps:
forming a back lining layer, wherein the surface of one side of the back lining layer is exposed out of the circuit layer;
forming a piezoelectric layer on one side of the backing layer with the circuit layer, wherein the piezoelectric layer comprises a piezoelectric layer body and electrodes on the surface of the piezoelectric layer body on one side facing the backing layer and the surface on one side facing away from the backing layer;
forming an acoustic artifact on a side of the piezoelectric layer facing away from the backing layer, the acoustic artifact comprising: an acoustic impedance matching layer and an acoustic super-structure surface which are grown by adopting a forward growth process; wherein the acoustic superstructure surface is located between the acoustic impedance matching layer and the piezoelectric layer or on a side of the acoustic impedance matching layer facing away from the backing layer;
wherein the acoustic superstructure surface comprises a circular central part and first to Mth circular parts, M is an integer greater than or equal to 1; the first circular ring part surrounds the circular central part, the (i + 1) th circular ring part surrounds the ith circular ring part, annular grooves are formed between the first circular ring part and the circular central part and between the (i + 1) th circular ring part and the ith circular ring part, and i is an integer which is greater than or equal to 1 and less than M;
or the acoustic superstructure surface comprises a plurality of bar-shaped parts arranged side by side, the height of at least one bar-shaped part is different from the heights of the rest bar-shaped parts in the direction from the back lining layer to the piezoelectric layer, and/or the width of at least one bar-shaped part is different from the widths of the rest bar-shaped parts in the arrangement direction of the bar-shaped parts, and/or one side of the bar-shaped part, which is far away from the back lining layer, is in a wedge shape, and/or the bar-shaped part is a hollow bar-shaped part, and/or the material of at least one bar-shaped part is different from the material of the rest bar-shaped parts;
alternatively, the side of the acoustic superstructure surface facing away from the backing layer is an undulating surface.
9. The method for manufacturing the array ultrasonic transducer according to claim 8, wherein the acoustic impedance matching layer grown by the forward growth process comprises:
and growing the acoustic impedance matching layer by adopting a thermal evaporation coating process or a magnetron sputtering process.
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| CN114713159B (en) * | 2022-03-09 | 2023-05-23 | 南京师范大学 | Three-dimensional acoustic forceps emitter, three-dimensional focusing acoustic forceps control system and application thereof |
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