CN112612143A - Substrate, optical element, electronic device, and method for manufacturing substrate - Google Patents
Substrate, optical element, electronic device, and method for manufacturing substrate Download PDFInfo
- Publication number
- CN112612143A CN112612143A CN202011616831.3A CN202011616831A CN112612143A CN 112612143 A CN112612143 A CN 112612143A CN 202011616831 A CN202011616831 A CN 202011616831A CN 112612143 A CN112612143 A CN 112612143A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- glue layer
- glue
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a substrate, an optical element, an electronic device and a method for manufacturing the substrate. The substrate includes: the central layer is made of PET; the first adhesive layer is connected with one side surface of the central layer; and the second adhesive layer is connected with the surface of one side of the central layer, which is far away from the first adhesive layer. The invention solves the problem that the substrate is easy to warp in the prior art.
Description
Technical Field
The invention relates to the technical field of optical imaging equipment, in particular to a substrate, an optical element, electronic equipment and a manufacturing method of the substrate.
Background
The miniaturization of electronic equipment gradually becomes a development trend, optical modules such as underscreen fingerprints, DOEs (diffractive optical elements), DIFFUSER (light homogenizing sheets) and the like are as light and thin as possible, substrates are often made of ultrathin glass or flexible glass, but the thickness of the glass is mostly about 0.1 mm; if a thinner and thinner PET (with a thickness of 0.01um) is used as the substrate, the problem of warpage and the like can occur due to the over-softness of the PET material.
That is, the substrate in the prior art has a problem of being easily warped.
Disclosure of Invention
The invention mainly aims to provide a substrate, an optical element, an electronic device and a manufacturing method of the substrate, so as to solve the problem that the substrate is easy to warp in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided a substrate comprising: the central layer is made of PET; the first adhesive layer is connected with one side surface of the central layer; and the second adhesive layer is connected with the surface of one side of the central layer, which is far away from the first adhesive layer.
Further, the thickness of the central layer is more than or equal to 0.1um and less than or equal to 50 um; and/or the thickness of the first adhesive layer is more than or equal to 1um and less than or equal to 10 um; and/or the thickness of the second glue layer is more than or equal to 1um and less than or equal to 10 um.
Further, the substrate also comprises an optical film, and the optical film is arranged on one side surface of the first adhesive layer and/or the second adhesive layer away from the central layer; and/or the substrate further comprises a negative uv-curable resin disposed on a surface of the first glue layer and/or the second glue layer on a side remote from the core layer.
Furthermore, the first adhesive layer and the second adhesive layer are made of UV (ultraviolet) adhesive; and/or the thickness of the substrate is greater than or equal to 10um and less than or equal to 1 mm.
According to another aspect of the present invention, there is provided an optical element comprising the substrate described above.
According to another aspect of the present invention, there is provided an electronic device including the above optical element.
According to another aspect of the present invention, there is provided a method for manufacturing a substrate, the substrate is manufactured by the method for manufacturing a substrate, the method for manufacturing a substrate includes: coating a resin material on the substrate to form a substrate with a first glue layer; the PET material is in contact combination with the substrate with the first glue layer; irradiating the PET material and the substrate with the first glue layer by using ultraviolet rays; separating the first adhesive layer from the substrate to form a first adhesive layer and a central layer; coating a resin material on the substrate to form a substrate with a second glue layer; the surface of one side of the central layer, which is far away from the first adhesive layer, is in contact combination with the substrate with the second adhesive layer; irradiating the central layer and the substrate with the second glue layer with ultraviolet rays; and separating the second glue layer from the matrix to form the substrate.
Further, when the resin material is applied to the substrate, spin coating or spray coating is performed.
Further, in the contact bonding of the PET material with the substrate having the first adhesive layer, the first adhesive layer is rolled or hard-contacted so that the PET material is bonded with the first adhesive layer.
Further, in the contact bonding of the surface of the side of the central layer far away from the first adhesive layer and the substrate with the second adhesive layer, the second adhesive layer is rolled or in hard contact so that the central layer is bonded with the second adhesive layer.
By applying the technical scheme of the invention, the substrate comprises a central layer, a first adhesive layer and a second adhesive layer, wherein the central layer is made of PET; the first adhesive layer is connected with one side surface of the central layer; the second glue film is connected with the surface of one side of the central layer far away from the first glue film.
The first adhesive layer and the second adhesive layer are arranged on the two sides of the central layer, so that the structural strength of the central layer can be increased, the central layer also has strong structural strength under the thinner condition, the warping is not easy to occur, and the working stability of the central layer is ensured. The quantity of the material of the central layer can be reduced by the arrangement, the structural strength of the central layer is increased through the glue layers on the two sides, the production cost is reduced while the structural strength of the substrate is ensured, and the substrate is greatly prevented from warping.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 shows a schematic structural diagram of a substrate according to an alternative embodiment of the present invention; and
FIG. 2 is a view showing a state in which a resin material is coated on a substrate according to an alternative embodiment of the present invention;
FIG. 3 illustrates the resin material of FIG. 2 spin coated on a substrate;
FIG. 4 is a view showing a state in which the first paste layer and the core layer are formed on the substrate of FIG. 3, and the first paste layer and the core layer are imprinted and exposed;
FIG. 5 is a view showing the first adhesive layer of FIG. 4 separated from the substrate;
FIG. 6 is a view showing a state in which a second adhesive layer is formed on the core layer in FIG. 5;
fig. 7 is a view showing a state in which the second adhesive layer is separated from the base in fig. 6.
Wherein the figures include the following reference numerals:
10. a center layer; 20. a first glue layer; 30. a second adhesive layer; 40. a substrate.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present invention, unless specified to the contrary, use of the terms of orientation such as "upper, lower, top, bottom" or the like, generally refer to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
The invention provides a substrate, an optical element, an electronic device and a manufacturing method of the substrate, aiming at solving the problem that the substrate is easy to warp in the prior art.
As shown in fig. 1 to 7, the substrate includes a central layer 10, a first adhesive layer 20 and a second adhesive layer 30, the material of the central layer 10 is PET; the first adhesive layer 20 is connected with one side surface of the central layer 10; the second layer of glue 30 is attached to the surface of the central layer 10 on the side remote from the first layer of glue 20.
Through set up first glue film 20 and second glue film 30 in the both sides of centre layer 10, can increase the structural strength of centre layer 10 for centre layer 10 also has stronger structural strength under thinner condition, and the difficult condition of warping that takes place has guaranteed the stability of centre layer 10 work. The quantity of the material of the central layer 10 can be reduced by the arrangement, the structural strength of the central layer 10 is increased through the glue layers on the two sides, the structural strength of the substrate is ensured, the production cost is reduced, and the substrate is greatly prevented from warping.
Optionally, the thickness of the central layer 10 is 0.1um or more and 50um or less. If the thickness of the central layer 10 is less than 0.1um, the thickness of the central layer 10 is too small, the central layer 10 is easily broken, and the optical performance of the thinner central layer 10 is poor, thereby resulting in poor optical performance of the substrate. If the thickness of the core layer 10 is greater than 50um, the thickness of the core layer 10 is too large, which increases the manufacturing cost of the substrate and is not favorable for the miniaturization of the substrate. Limiting the thickness of the central layer 10 to a range of 0.1um to 50um facilitates miniaturization of the substrate while ensuring the optical performance of the central layer 10. The central layer 10 is capable of providing a supporting force, and the thickness of the central layer 10 determines the overall thickness of the substrate. Of course, the specific thickness of the center layer 10 can be designed according to specific use requirements.
Specifically, the thickness of the first adhesive layer 20 is greater than or equal to 1um and less than or equal to 10 um. If the thickness of the first adhesive layer 20 is less than 1um, the first adhesive layer 20 is not easy to completely cover the central layer 10, so that the optical performance of the substrate is affected due to uneven laying of the first adhesive layer 20, and meanwhile, the increased hardness of the central layer 10 is small, so that the substrate is easy to warp. If the thickness of the first adhesive layer 20 is greater than 10um, the thickness of the first adhesive layer 20 is too large, which is not favorable for the miniaturization of the substrate. The thickness of the first adhesive layer is limited within the range of 1um to 10um, so that the first adhesive layer 20 can be completely coated on the surface of the central layer 10, and the substrate is favorably miniaturized.
Specifically, the thickness of the second adhesive layer 30 is greater than or equal to 1um and less than or equal to 10 um. If the thickness of the second adhesive layer 30 is less than 1um, the second adhesive layer 30 is not easy to completely cover the central layer 10, so that the optical performance of the substrate is affected due to the uneven laying of the second adhesive layer 30. If the thickness of the second adhesive layer 30 is greater than 10um, the thickness of the second adhesive layer 30 is too large, which is not favorable for the miniaturization of the substrate. The thickness of the first glue layer is limited within the range of 1um to 10um, so that the second glue layer 30 can be completely coated on the surface of the central layer 10, and the substrate is favorably miniaturized.
Optionally, the substrate further comprises an optical film disposed on a surface of the first glue layer 20 and/or the second glue layer 30 on a side remote from the central layer 10. The optical film can increase the optical effect of the substrate and widen the application range of the substrate. The optical film can be an antireflection film or an antireflection film.
Optionally, the substrate further comprises a negative uv-curable resin disposed on a surface of the first glue layer 20 and/or the second glue layer 30 on a side remote from the core layer 10. The negative ultraviolet curing resin can increase the bonding force between the substrate and other materials, so that the substrate can be bonded with various materials, and the application range of the substrate is increased.
Optionally, the material of the first adhesive layer 20 and the second adhesive layer 30 is UV glue. The first adhesive layer 20 and the second adhesive layer 30 can increase the hardness of the central layer 10, different types of UV adhesives can be selected according to the use requirements of the substrate, and different types of UV adhesives can provide different hardness after being cured, so that the substrate is prevented from warping and the individual requirements of the product are met.
Specifically, the thickness of the substrate is greater than or equal to 10um and less than or equal to 1 mm. The arrangement makes the substrate ultrathin, is beneficial to the miniaturization of the substrate, and can increase the application range of the substrate.
The optical element includes the substrate described above. The optical element with the substrate has the advantages of strong hardness, difficult warping and easy manufacture and miniaturization, so that the optical element can stably work. The optical element can be a display screen, a DOE, a light homogenizing sheet and the like.
The electronic device includes an optical element thereon. The electronic equipment with the optical element has the advantages of good optical performance, small structure and small possibility of warping, and the working time of the electronic equipment can be effectively prolonged. The electronic device may be a mobile phone, a computer, a tablet, etc.
As shown in fig. 2 to 7, the substrate is manufactured by a method for manufacturing a substrate, which includes: coating a resin material on the substrate 40 to form the substrate 40 with the first glue layer 20; the PET material is in contact bonding with the substrate 40 having the first glue layer 20; irradiating the PET material and the substrate 40 with the first glue layer 20 with ultraviolet light; separating the first glue layer 20 from the substrate 40 to form the first glue layer 20 and the central layer 10; coating a resin material on the base 40 to form the base 40 with the second glue layer 30; the surface of the central layer 10 far away from the first adhesive layer 20 is in contact combination with the matrix 40 with the second adhesive layer 30; irradiating the central layer 10 and the substrate 40 having the second glue layer 30 with ultraviolet rays; and separating the second glue layer 30 from the matrix 40 to form the substrate.
The core layer 10 is formed by applying a resin material to the substrate 40 such that the first glue layer 20 is formed on the substrate 40 and the PET material is applied to the surface of the first glue layer 20 remote from the substrate 40. Irradiation of the PET material and the substrate 40 with the first glue layer 20 with uv light enables the resin material to cure to form a fixed form of the first glue layer 20. The first glue layer 20 is separated from the substrate 40, forming the first glue layer 20 and the core layer 10. The second glue layer 30 is obtained in the same way to form the substrate. The method can form an ultra-thin substrate, and the substrate is not warped.
Specifically, the resin material is applied to the substrate 40 by spin coating or spray coating. The spin coating or spray coating can ensure the thickness of the formed first adhesive layer 20 and the uniformity of the first adhesive layer 20, and avoid the first adhesive layer 20 from fluctuating too much on the central layer 10.
Specifically, in the contact bonding of the PET material to the substrate 40 having the first adhesive layer 20, the first adhesive layer 20 is rolled or hard-contacted so that the PET material is bonded to the first adhesive layer 20. The PET material and the first adhesive layer 20 can be tightly combined together by rolling the first adhesive layer 20, and no air gap exists between the central layer 10 and the first adhesive layer 20, so that the adhesive force between the first adhesive layer 20 and the central layer 10 is effectively ensured.
Of course, the first adhesive layer 20 and the central layer 10 may be in hard contact.
It should be noted that the hard contact means that the first glue layer 20 can be flatly coated on the surface of the core layer 10 under the pressure by applying the pressure to the first glue layer 20 by using a hard panel or other surface flatting material.
Specifically, in the contact bonding of the surface of the central layer on the side away from the first adhesive layer 20 to the substrate 40 having the second adhesive layer 30, the central layer 10 is bonded to the second adhesive layer 30 by rolling the second adhesive layer 30 or by hard contact. The PET material and the second adhesive layer 30 can be tightly combined together by rolling the second adhesive layer 30, and no air gap exists between the central layer 10 and the second adhesive layer 30, so that the adhesive force between the second adhesive layer 30 and the central layer 10 is effectively ensured.
Of course, the second adhesive layer 30 and the central layer 10 may be in hard contact.
It should be noted that the hard contact means that the second adhesive layer 30 can be flatly coated on the surface of the core layer 10 under the pressure by applying the pressure to the second adhesive layer 30 by using a hard panel or other surface flatting material.
It is to be understood that the above-described embodiments are only a few, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A substrate, comprising:
a central layer (10), the material of the central layer (10) being PET;
a first glue layer (20), wherein the first glue layer (20) is connected with one side surface of the central layer (10);
the second glue layer (30), the second glue layer (30) with the centre layer (10) keep away from the surface connection of one side of first glue layer (20).
2. The substrate of claim 1,
the thickness of the central layer (10) is more than or equal to 0.1um and less than or equal to 50 um; and/or
The thickness of the first adhesive layer (20) is more than or equal to 1um and less than or equal to 10 um; and/or
The thickness of the second glue layer (30) is more than or equal to 1um and less than or equal to 10 um.
3. The substrate of claim 1,
the substrate further comprises an optical film arranged on a surface of the first glue layer (20) and/or of the second glue layer (30) on a side remote from the central layer (10); and/or
The substrate further comprises a negative uv-curable resin arranged on a surface of the first glue layer (20) and/or the second glue layer (30) on a side remote from the core layer (10).
4. The substrate according to any one of claims 1 to 3,
the first adhesive layer (20) and the second adhesive layer (30) are made of UV (ultraviolet) adhesive; and/or
The thickness of base is more than or equal to 10um and less than or equal to 1 mm.
5. An optical element comprising the substrate according to any one of claims 1 to 4.
6. An electronic device comprising the optical element according to claim 5.
7. A method for manufacturing a substrate, characterized in that the substrate according to any one of claims 1 to 4 is manufactured by the method for manufacturing a substrate, which comprises:
coating a resin material on a base body (40) to form the base body (40) with a first glue layer (20);
-the PET material is bonded in contact with said matrix (40) provided with said first glue layer (20);
irradiating the PET material and the substrate (40) with the first glue layer (20) with UV light;
separating the first glue layer (20) from the base body (40) to form a first glue layer (20) and a central layer (10);
coating a resin material on a base body (40) to form the base body (40) with a second glue layer (30);
the surface of one side of the central layer (10) far away from the first adhesive layer (20) is in contact combination with the substrate (40) provided with the second adhesive layer (30);
irradiating the central layer (10) and the substrate (40) with the second glue layer (30) with ultraviolet light;
separating the second glue layer (30) from the base (40) to form the substrate.
8. The method of claim 7, wherein the resin material is applied to the substrate (40) by spin coating or spray coating.
9. Method for making a substrate according to claim 7, characterized in that in the contact bonding of the PET material with the matrix (40) provided with the first glue layer (20), the first glue layer (20) is rolled or hard-contacted such that the PET material is bonded with the first glue layer (20).
10. Method for making a substrate according to claim 7, characterized in that in the contact bonding of the surface of the central layer (10) on the side remote from the first glue layer (20) with the substrate (40) provided with the second glue layer (30), the rolling or hard contact of the second glue layer (30) causes the bonding of the central layer (10) with the second glue layer (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011616831.3A CN112612143A (en) | 2020-12-30 | 2020-12-30 | Substrate, optical element, electronic device, and method for manufacturing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011616831.3A CN112612143A (en) | 2020-12-30 | 2020-12-30 | Substrate, optical element, electronic device, and method for manufacturing substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112612143A true CN112612143A (en) | 2021-04-06 |
Family
ID=75249789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011616831.3A Pending CN112612143A (en) | 2020-12-30 | 2020-12-30 | Substrate, optical element, electronic device, and method for manufacturing substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112612143A (en) |
-
2020
- 2020-12-30 CN CN202011616831.3A patent/CN112612143A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11069264B2 (en) | Cover structure, manufacturing method thereof and display device | |
| WO2021077593A1 (en) | Foldable support structure and display apparatus | |
| US20050249946A1 (en) | Protection film and method of making the same | |
| KR101235577B1 (en) | Image display panel and manufacturing method thereof | |
| EP1519819B1 (en) | Method of preparing a flexible mold and method of manufacturing a microstructure using the same | |
| CN106853704B (en) | Interior rupture pressure disc and preparation method thereof for more curved surface touch-control display modules | |
| US20120275088A1 (en) | Multi-layer adhesive assemblies for electronic devices | |
| WO2021003876A1 (en) | Optical adhesive, display panel and fabrication method for optical adhesive | |
| US20050212182A1 (en) | Flexible mold and method of manufacturing microstructure using same | |
| TWI436135B (en) | Panel module and manufacturing method thereof | |
| JP6322871B2 (en) | Flexographic printing plate and manufacturing method thereof, and manufacturing method of liquid crystal display element | |
| JP6400008B2 (en) | Laminated body including pressure-sensitive adhesive layer and method for producing the same | |
| EP3809167B1 (en) | Method of forming antireflection optical body, display panel, and optical film | |
| WO2020042168A1 (en) | Flexible protective film, curved display screen, and terminal | |
| US20210129468A1 (en) | Method of forming antireflection optical body, and display panel | |
| KR20130063448A (en) | Resin original plate for printing and method for manufacturing the same | |
| CN213814162U (en) | Substrate, optical element, and electronic device | |
| CN206475518U (en) | Interior rupture pressure disc for many curved surface touch-control display modules | |
| CN110611039A (en) | Manufacturing method of flexible OLED display device and flexible OLED display device | |
| US10317617B2 (en) | Display device and method for preparing the same | |
| CN112612143A (en) | Substrate, optical element, electronic device, and method for manufacturing substrate | |
| TW201719200A (en) | Unitary optical film assembly and method of making | |
| WO2018132994A1 (en) | Fingerprint recognition device and manufacturing method therefor | |
| CN216183379U (en) | Ultra-thin glass cover plate | |
| KR101317790B1 (en) | Adhesive Chuck and Method for Manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |