CN112577971A - Detection method, system and equipment - Google Patents
Detection method, system and equipment Download PDFInfo
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- CN112577971A CN112577971A CN201910945756.6A CN201910945756A CN112577971A CN 112577971 A CN112577971 A CN 112577971A CN 201910945756 A CN201910945756 A CN 201910945756A CN 112577971 A CN112577971 A CN 112577971A
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- 239000000523 sample Substances 0.000 claims abstract description 147
- 238000012216 screening Methods 0.000 claims abstract description 38
- 238000012163 sequencing technique Methods 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 claims description 107
- 238000000034 method Methods 0.000 claims description 33
- 238000012552 review Methods 0.000 claims description 25
- 238000004590 computer program Methods 0.000 claims description 19
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- 239000012491 analyte Substances 0.000 description 2
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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Abstract
A detection method comprises the following steps: acquiring a first defect set to be retested included in the object to be tested; screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be detected to obtain a second defect set; and sequencing the second defect set according to the movement direction of the object to be detected, and rechecking the sequenced defect sets by a rechecking probe, so that the defect detection efficiency can be effectively improved.
Description
Technical Field
The application belongs to the field of display screen detection, and particularly relates to a detection method, a detection system and detection equipment.
Background
Along with the wide use of smart machine, also more and more to the quantity of display screen, especially all higher and more to OLED demand's quantity and quality, need carry out the defect detection to OLED panel in process of production, guarantee the quality of parts. How to improve the detection speed and detection accuracy of the OLED panel is the main research direction at present.
The existing detection steps of the OLED panel generally comprise the steps of firstly scanning and fully detecting the surface of an OLED substrate; the defects obtained by full inspection are screened to obtain the defects to be rechecked, the defects to be rechecked are detected according to the detection path of the defects to be rechecked, the defects to be rechecked can be effectively rechecked, and the defects to be rechecked are calculated more complexly when the paths of the defects to be rechecked are determined by the rechecking probe, so that the detection efficiency is not improved.
Disclosure of Invention
In view of this, embodiments of the present application provide a detection method, system and device, so as to solve the problem in the prior art that the detection efficiency is not high.
A first aspect of an embodiment of the present application provides a detection method, where a detection device implementing the detection method includes a motion platform for bearing and moving an object to be detected, and a retest probe for performing retest on the object to be detected, where the detection method includes:
acquiring a first defect set to be retested included in the object to be tested;
screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be detected to obtain a second defect set;
and sequencing the second defect set according to the movement direction of the object to be detected, and performing rechecking on the sequenced defect sets by using a rechecking probe.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the detection apparatus includes a full-inspection module for performing initial inspection on an object to be inspected, and the step of acquiring a first defect set to be retested, included in the object to be inspected, includes:
acquiring a third defect set determined by the full inspection module;
sorting the defects in the third defect set according to the defect values;
and screening out a first preset number of defects with larger defect values according to the sorted defects to generate the first defect set.
With reference to the first aspect, in a second possible implementation manner of the first aspect, the detection apparatus includes a full inspection module configured to perform initial inspection on the object to be inspected, where the first defect set is generated from defects acquired by the full inspection module before a current re-inspection round in the multiple rounds of re-inspection;
or when the full inspection and the re-inspection are performed simultaneously, generating the first defect set by the defects acquired by the full inspection module before the current re-inspection round in the multi-round re-inspection, and adding the defects acquired by the full inspection in the screening process in the first defect set.
With reference to the first aspect, in a third possible implementation manner of the first aspect, the step of performing screening processing on the first defect set according to the position of the first defect set, the position of the review probe, and the moving direction of the object to be detected to obtain a second defect set includes:
acquiring a defect positioned on a first side of the reinspection probe according to the movement direction of the object to be detected, wherein the first side is the movement direction side of the reinspection probe;
a second defect set is determined based on the acquired defects.
With reference to the third possible implementation manner of the first aspect, in a fourth possible implementation manner of the first aspect, the determining that the first movement direction of the object to be detected is a positive X coordinate axis direction, the second movement direction is a negative X coordinate axis direction, the obtaining, according to the movement direction of the object to be detected, a defect of which a position is located on a first side of the reinspection probe, where the step of the first side being the movement direction side of the reinspection probe includes:
when the movement direction is a first movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the reinspection probe;
and when the movement direction is a second movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the reinspection probe.
With reference to the third possible implementation manner of the first aspect, in a fifth possible implementation manner of the first aspect, the detection apparatus includes a full-inspection module for performing initial inspection on the object to be inspected, the re-inspection probe includes a first re-inspection probe and a second re-inspection probe, and the first re-inspection probe and the second re-inspection probe are respectively distributed on two sides of the full-inspection module, and the method further includes:
determining a first reinspection area according to the detection range of the first reinspection probe, and determining a second reinspection area according to the detection range of the second reinspection probe;
and determining an overlapping area according to the first re-inspection area and the second re-inspection area, and distributing the defects of the overlapping area to the first re-inspection probe or the second re-inspection probe according to a preset distribution rule.
With reference to the fifth possible implementation manner of the first aspect, in a sixth possible implementation manner of the first aspect, the step of assigning the defect of the overlap region to the first review probe or the second review probe according to a preset assignment rule includes:
and distributing the defects in the overlapped area to the first re-inspection probe and the second re-inspection probe according to the preset number detected by the first re-inspection probe and the second re-inspection probe in the re-inspection and the number of the re-inspection defects determined by the non-overlapped area.
With reference to the fifth possible implementation manner of the first aspect, in a seventh possible implementation manner of the first aspect, when the object to be detected reciprocates, the full inspection module disposed in the middle detects the entire area of the object to be detected.
With reference to the first aspect, in an eighth possible implementation manner of the first aspect, the screening the first defect set according to the position of the first defect set, the position of the review probe, and the moving direction of the object to be tested, and the step of obtaining the second defect set includes:
and screening the defects in the second defect set according to the distance between the defects in the second defect set.
With reference to the eighth possible implementation manner of the first aspect, in a ninth possible implementation manner of the first aspect, the step of determining that the first moving direction of the object to be tested is a positive X coordinate axis direction, and the second moving direction is a negative X coordinate axis direction, and the step of screening the defects in the second defect set according to the distance between the defects in the second defect set includes:
acquiring an ith defect in a second defect set according to the sequence of the second defect set, wherein i is a sequence of the sequence in the second defect set and is greater than or equal to 2;
if the ith defect and the current position of the reinspection probe belong to different pre-divided units to be detected, acquiring the theoretical Y-axis speed of the current position of the reinspection probe moving to the ith defect according to the movement speed of the moving platform;
if the theoretical Y-axis speed is higher than the current Y-axis speed of the rechecking probe, screening the ith defect;
if the theoretical Y-axis speed is less than or equal to the current Y-axis speed of the reinspection probe, controlling the reinspection probe to move to the ith defect position according to the current Y-axis speed;
and repeating the steps to screen the (i + 1) th defect until the defects in the second defect set are screened.
With reference to the first aspect, in a tenth possible implementation manner of the first aspect, a moving direction of the object to be tested is different from a moving direction of the review probe and is independent of the moving direction of the review probe.
With reference to the first aspect, in an eleventh possible implementation manner of the first aspect, the step of rechecking, by a rechecking probe, the sorted defect set includes:
and rechecking the defects in the second defect set according to the preset rechecking number corresponding to the current rechecking in the multiple rechecking.
A second aspect of the embodiments of the present application provides a detection system, where a detection device implementing the detection method includes a motion platform for bearing and moving an object to be detected, and a retest probe for performing retest on the object to be detected, and the detection system includes:
the first defect set acquisition unit is used for acquiring a first defect set to be rechecked, which is included in the object to be detected;
the second defect set acquisition unit is used for screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the motion direction of the object to be detected to acquire a second defect set;
and the rechecking unit is used for sequencing the second defect set according to the movement direction of the object to be detected and rechecking the sequenced defect sets by a rechecking probe.
A third aspect of embodiments of the present application provides a detection apparatus, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the detection method according to any one of the first aspect when executing the computer program.
A fourth aspect of embodiments of the present application provides a computer-readable storage medium, which stores a computer program, which when executed by a processor implements the steps of the detection method according to any one of the first aspect.
Compared with the prior art, the embodiment of the application has the advantages that: the method comprises the steps of obtaining a first defect set to be rechecked, obtaining a second defect set corresponding to a rechecking probe according to the position of the first defect set, the position of the rechecking probe and the movement direction of an object to be detected, sequencing the second defect set according to the movement direction of the object to be detected, and rechecking the sequenced defect sets by the rechecking probe, so that the path planning of the defects to be rechecked is simpler, and the defect detection efficiency is improved.
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In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic diagram of a detection system according to an embodiment of the present disclosure;
fig. 2 is a schematic flow chart illustrating an implementation of a defect detection method according to an embodiment of the present application;
fig. 3 is a schematic flowchart of an implementation flow of a method for screening and updating the first defect set according to an embodiment of the present application;
fig. 4 is a schematic flow chart of an implementation of a method for screening defects in a second defect set according to an embodiment of the present application;
FIG. 5 is a schematic view of a detection system provided by an embodiment of the present application;
fig. 6 is a schematic diagram of a detection apparatus provided in an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
In order to explain the technical solution described in the present application, the following description will be given by way of specific examples.
Fig. 1 is a schematic plan view of an apparatus for implementing the defect detection method, as shown in fig. 1, the detection apparatus includes a motion table 1, the motion table can carry and move an object to be detected, a full-inspection module 2 provided with a full-inspection probe 21 and a re-inspection module 3 provided with a re-inspection probe 31 are disposed above the motion table (in fig. 1, a first re-inspection module and a second re-inspection module are respectively disposed on two sides of the full-inspection module).
Assuming that the moving direction of the object to be measured is the X-axis direction, the object to be measured can move alternately along the first moving direction and the second moving direction of the X-axis direction. And determining that the direction vertical to the X-axis direction is the Y-axis direction on the plane of the object to be detected. The rechecking module 3 is provided with one rechecking probe (schematically shown as 1 probe, actually, a plurality of probes may be provided) which can move along the Y-axis direction. The full inspection probe comprises a plurality of probes which are uniformly distributed on the full inspection shaft. The full-detection device and the rechecking device can be carried out simultaneously, namely, the rechecking device can carry out rechecking analysis on the defects detected by the full-detection device.
The motion platform comprises a first end and a second end, when the object to be detected moves in a reciprocating mode, namely the object to be detected moves from the first end to the second end, the full detection probe in the full detection module can detect all the defects of the object to be detected in all the areas of the object to be detected, and a first defect set is obtained. At this time, the rechecking modules arranged at the two sides of the full-detection module can respectively determine a first rechecking area and a second rechecking area according to the movement range of the object to be detected. If the first re-detection area and the second re-detection area are not overlapped, the defects to be re-detected in the first re-detection area can be re-detected by the first re-detection probe, and the defects to be re-detected in the second re-detection area can be re-detected by the second re-detection probe. If the first reinspection area and the second reinspection area are partially overlapped, the defects of the non-overlapped areas can be distributed to the reinspection probes in the corresponding reinspection modules for reinspection. For the defects in the overlapping area, the defects in the overlapping area can be allocated according to a preset allocation rule, for example, according to a preset number of the defects required to be re-inspected by the first re-inspection probe in the current round and a preset number of the defects required to be re-inspected by the second re-inspection probe in the current round.
In this embodiment, the moving directions of the object to be tested, i.e. the first moving direction and the second moving direction, may be different from the moving direction of the retest probe. For example, in fig. 1, the moving direction of the object to be tested is perpendicular to the moving direction of the retest probe and is independent of the moving direction of the retest probe. Of course, the included angle between the moving direction of the object to be detected and the moving direction of the reinspection probe can be other angles.
Fig. 2 is a schematic view of an implementation flow of a detection method based on the detection device shown in fig. 1 according to an embodiment of the present application, which is detailed as follows:
in step S201, a first defect set to be retested included in the object to be tested is obtained;
specifically, the analyte described in the embodiments of the three applications may have periodicity, for example: the object to be tested can be divided into a plurality of units to be tested, and the units to be tested are periodically arranged to form the object to be tested. In other embodiments, the analyte may not have periodicity.
Specifically, the object to be measured according to the embodiment of the present application may be an OLED (Organic Light-Emitting Diode) panel, an LCD (Liquid Crystal Display) panel, and the like. Each object to be tested can comprise a plurality of units to be tested which can be used for the display screen of the electronic product. For example, the unit to be tested may be a screen of a smart phone, or may also be a screen of a display. The size of the unit under test may also assume a variety of different sizes, depending on the size requirements of different electronic devices.
The defects of the object to be measured can comprise one or more of dust, pollutants, pits or bulges on the surface of the screen.
When the defect information of the object to be detected is obtained, the object to be detected can be detected, and the detection information of the object to be detected is obtained. For example, the detection information of the surface of the object to be detected may be determined by scanning the image of the object to be detected through full detection, performing gray scale analysis on the scanned image, and the like.
The detection information may include gray values of pixels of the image of the object to be detected and position information of points of the object to be detected.
And analyzing and processing the detection information according to a preset screening rule to obtain the defects of the object to be detected, and forming a first defect set according to the obtained defects.
The step of analyzing the process comprises: according to a first preset screening rule, performing cluster analysis on each pixel point of the image of the object to be detected to obtain a defect to be detected; and screening the undetermined defect according to a second preset screening rule and the size of the undetermined defect and/or the gray value of the defect image to obtain the defect of the object to be detected.
The first preset screening rule comprises: the gray value of the pixel point of the image in the region to be detected is within a first gray value range. According to different defect types, a plurality of different first gray value ranges can be determined, and the pixels of the image of the region to be detected are clustered through the plurality of first gray value ranges to obtain the undetermined defect formed by a plurality of different pixel point sets.
The second preset screening rule comprises: the size of the pending defect is within a predetermined range; and/or the gray value of the pixel point to be determined is within a second gray value range.
The parameters that determine the predetermined range may include one or more of length, width, radius, area, etc. of the defect.
After the screened defects are obtained, the object to be tested can be further divided into a plurality of units to be tested, the units to be tested to which the screened defects belong are determined, the defect values of the units to be tested are obtained according to the defect values of the defects included in the units to be tested, the units to be tested are sorted according to the defect values of the units to be tested, the defect with the larger defect value in one or more units to be tested with the larger defect value is obtained to serve as a re-inspection defect, and a first defect set is formed by a plurality of re-inspection defects. Wherein the defect value of the defect may be determined according to the average gray value of the defect and the size of the defect. The defect of the unit under test may be a sum of defect values of all or a predetermined number of defects in the unit under test.
As an implementation manner in the present application, a defect weight corresponding to a defect value of a unit to be tested may be dynamically allocated according to the number of the retest defects screened out from the unit to be tested, and the defect weight is gradually reduced along with the number of the retest defects screened out from the unit to be tested. And dynamically updating the defect values of the units to be detected according to the defect weight values so as to update the sequencing of the defect values of the units to be detected and obtain the defects included in different units to be detected as rechecking defects, thereby being beneficial to more uniformly obtaining the defects included in the units to be detected.
Specifically, a specific process of acquiring the first defect set may be as shown in fig. 3, and includes:
in step S301, a third defect set determined by the full inspection module is obtained;
the influence factors of the defect value of the defect to be rechecked may include the size of the defect, the average gray value of the pixel point corresponding to the defect, and the like. The step of obtaining the defect value of a single defect in the third defect set comprises: and weighting the defect value influence factors of the first defect set to obtain the defect value of the defect to be rechecked.
In step S302, sorting the defects in the third defect set according to the defect values;
according to the calculated defect value of each defect to be rechecked in the third defect set, sorting may be performed in a descending order so as to intercept the sorted defects to be rechecked, for example, to intercept a first predetermined number of defects to be rechecked.
In step S303, a first predetermined number of defects with larger defect values are screened out according to the sorted defects to generate the first defect set.
Screening out a first preset number of defects according to the sorted defects, wherein the first preset number of defects are to-be-inspected defects which are sequentially intercepted from large to small, and generating a first defect set according to the intercepted to-be-inspected defects with the first preset number.
In step S202, a first defect set is screened according to the position of the first defect set, the position of the rechecking probe, and the movement direction of the object to be detected, so as to obtain a second defect set;
when the first defect set corresponding to the reinspection probe is obtained, the position of the reinspection probe, the motion direction of the object to be detected and the position of the first defect set can be acquired in real time in the detection process.
When the moving direction of the object to be detected (for example, the feeding direction of the object to be detected) is set as the X-axis direction of the coordinate system, the rechecking probe can move in the Y-axis direction, so that the object to be detected can be comprehensively covered and detected in the Y-axis direction. And according to the reciprocating motion of the motion platform, partial or whole area coverage of the X-axis direction of the object to be measured can be realized.
The moving direction of the object to be measured, that is, the conveying direction of the conveyor belt on the moving table for conveying the object to be measured to perform the detection, as shown in the figure, the moving direction of the object to be measured may include a first moving direction and a second moving direction, which correspond to the negative direction of the X axis and the positive direction of the X axis, respectively.
The first defect set may be generated for defects acquired by the full inspection module before a current review pass in the multi-pass review. Or when the full inspection and the re-inspection are carried out simultaneously, the first defect set is generated by the defects acquired by the full inspection module before the current re-inspection round in the multi-round re-inspection, and the defects acquired by the full inspection in the round screening process are added in the first defect set, at the moment, the defects screened by the round re-inspection module can be sorted in the axial direction, the number of the defects to be detected in the round is set, and the detection path is planned according to the movement speed of the motion platform and the movement speed of the re-inspection module, so that the preset number of the defects can be detected in the round.
The first defect set may also be defects detected by the full inspection module in the current round, which are added in the re-inspection process, that is, the defects detected by the full inspection module before the current round and the defects detected in real time in the current round.
After the first defect set is determined, the defects needing to be rechecked in the current round can be determined according to the movement direction of the object to be detected. Namely, according to the movement direction of the object to be detected, the defect of which the position is located on one side of the re-detection probe relative to the movement direction of the object to be detected is obtained, namely: the X coordinate is about to be consistent with the X-axis coordinate of the rechecking probe.
Specifically, according to the feeding direction of the object to be detected is the X-axis negative direction, the moving direction of the reinspection probe is the Y-axis direction, and the acquisition of the second defect set includes:
when the movement direction is a first movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the reinspection probe;
and when the movement direction is a second movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the reinspection probe.
For example, the Position RC1Position (RC1X, RC1Y) of the first review probe reviewCamera1 and the Position RC2Position (RC2X, RC2Y) of the second review probe reviewCamera2 are acquired.
A defect set RC1DefectCollection attributed to the first review probe reviewCamera1 and a defect set RC2DefectCollection attributed to the second review probe reviewCamera2 are defined. And judging the moving direction of the object to be detected, if the object to be detected moves in a positive direction (X-axis negative direction), the defects in the defect set RC1Defect Collection belonging to the first re-detection probe must meet the condition that the coordinates in the X direction are larger than the X-axis coordinate RC1X of the first re-detection probe, and the defects in the defect set RC2Defect Collection belonging to the second re-detection probe must meet the condition that the coordinates in the X direction are larger than the X-axis coordinate RC2X of the second re-detection probe. Similarly, if the object to be tested moves reversely, the defect in the defect set RC1DefectCollection attributed to the first reinspection probe must satisfy the condition that the coordinate in the X direction is smaller than the X-axis coordinate RC1X of the first reinspection probe, and the defect in the defect set RC2DefectCollection attributed to the second reinspection probe must satisfy the condition that the coordinate in the X direction is smaller than the X-axis coordinate RC2X of the second reinspection probe.
Wherein defects in the first review region that can only be covered by the field of view of the first review probe RC1 are detected by RC 1; defects in the second review region that can only be covered by the field of view of the second review probe RC2 are detected by RC 2. For the defects in the overlapped part of the view field of the RC1 and the view field of the RC2, the probe allocation of the overlapped area is related to the screening logic of the retest defects with preset number, and after the defects of the overlapped area are allocated, the number of the defects detected by the two probes is the preset number.
In step S203, the second defect set is sorted according to the movement direction of the object to be detected, and the sorted defect set is rechecked by a rechecking probe.
And sorting the defects in the defect set RC1Defect Collection belonging to the first re-inspection probe and the defect set RC2Defect Collection belonging to the second re-inspection probe, if the object to be detected moves in the forward direction, sorting the defects in the second defect set in an ascending order in the X direction, and if the object to be detected moves in the reverse direction, sorting the defects in the second defect set in a descending order in the X direction. If the rechecking module comprises a first rechecking module and a second rechecking module which are respectively arranged at two sides of the full-inspection module, the second defect set can comprise a second left defect set and a second right defect set, and the second left defect set and the second right defect set are respectively sorted according to the movement direction of the object to be detected.
In addition, when the defects in the second defect set are sorted and rechecked, the number of the defects in the current round of rechecking can be determined in each round of rechecking, the number of the defects needing to be rechecked by the first rechecking probe and the second rechecking probe can be set according to the set number needing to be rechecked, the rechecked defects are recorded, and repeated rechecking of the defects is avoided. And the defects in the first re-inspection area and the second re-inspection area can be selected according to the set number of the defects needing to be re-inspected in the current round.
Before rechecking the sorted defects, the method may further include a step of screening the defects in the second defect set, as shown in fig. 4, where the step includes:
in step S401, according to the sorting of the second defect set, an ith defect in the second defect set is obtained, where i is a sorted sequence in the second defect set, and i is greater than or equal to 2;
specifically, if i is equal to 1, that is, when a first defect in the second defect set is acquired, the rechecking probe corresponding to the first defect may be directly controlled to move to the position of the first defect for rechecking. And if i is 2, when the second defect is screened, the position corresponding to the re-inspection probe is the position of the first defect.
If the second defect is screened, the rechecking probe still stays at the position of the first defect, and whether a third defect needs to be screened is judged by the rechecking probe at the position of the first defect.
If the second defect is not screened, the rechecking probe is moved to the position of the second defect for rechecking.
In step S402, if the ith defect and the current position of the reinspection probe belong to different pre-divided units to be detected, acquiring the theoretical Y-axis speed of the current position of the reinspection probe moving to the ith defect according to the movement speed of the moving platform;
and if the ith defect and the current position of the rechecking probe corresponding to the ith defect belong to the same pre-divided unit to be detected, directly screening the ith defect.
If the detected units do not belong to the same pre-divided unit to be detected, the time from the position of the rechecking probe to the ith defect can be as follows by taking the speed speedX of the X axis as a reference (namely the moving speed of the moving table): tx | Aix-Cx |/speedX, where Aix is the X-axis coordinate of the ith defect and Cx is the X-axis coordinate of the review probe, and then the theoretical Y-axis velocity moving from the review probe position to the ith defect is calculated as:
TargetSpeedY＝|Ay-Cy|/Tx
wherein TargetSpeedY is the theoretical Y-axis speed.
In step S403, if the theoretical Y-axis speed is greater than the current Y-axis speed of the review probe, screening out the ith defect;
in step S404, if the theoretical Y-axis speed is less than or equal to the current Y-axis speed of the review probe, controlling the review probe to move to the ith defect position according to the current Y-axis speed;
and comparing the theoretical Y-axis speed with the current Y-axis speed, and screening out the ith defect if the theoretical Y-axis speed is greater than the current Y-axis speed. If the theoretical Y-axis speed is less than or equal to the current Y-axis speed of the re-inspection probe, controlling the re-inspection probe to move to the ith defect position according to the current Y-axis speed
In step S405, the above steps are repeated to screen the i +1 th defect until the defects in the second defect set are screened.
And comparing the sorted 2 nd defects in the second defect set, and screening one by one until the Nth defects in the second defect set are screened, wherein N is the number of the defects in the second defect set.
In addition, if two reinspection probes are used for reinspection, the defects of the screened processing can be recorded, and the two reinspection probes are prevented from repeatedly carrying out detection screening.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
Fig. 5 is a schematic view of a detection system provided in an embodiment of the present application, where the detection system includes:
a first defect set acquiring unit 501, configured to acquire a first defect set to be retested included in the object to be tested;
a second defect set obtaining unit 502, configured to perform screening processing on the first defect set according to the position of the first defect set, the position of the re-inspection probe, and the motion direction of the object to be detected, so as to obtain a second defect set;
and a rechecking unit 503, configured to sort the second defect set according to the movement direction of the object to be detected, and recheck the sorted defect set by using a rechecking probe.
The detection system corresponds to the detection method described in fig. 2.
Fig. 6 is a schematic diagram of a detection apparatus provided in an embodiment of the present application. As shown in fig. 6, the detection apparatus 6 of this embodiment includes: a processor 60, a memory 61 and a computer program 62, such as a detection program, stored in said memory 61 and executable on said processor 60. The processor 60, when executing the computer program 62, implements the steps in the various detection method embodiments described above, such as the steps 101 to 103 shown in fig. 1. Alternatively, the processor 60, when executing the computer program 62, implements the functions of each module/unit in the above-mentioned device embodiments, for example, the functions of the modules 501 to 503 shown in fig. 5.
Illustratively, the computer program 62 may be partitioned into one or more modules/units that are stored in the memory 61 and executed by the processor 60 to accomplish the present application. The one or more modules/units may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution of the computer program 62 in the detection device 6. For example, the computer program 62 may be divided into units with specific functions as follows:
the first defect set acquisition unit is used for acquiring a first defect set to be rechecked, which is included in the object to be detected;
the second defect set acquisition unit is used for screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the motion direction of the object to be detected to acquire a second defect set;
and the rechecking unit is used for sequencing the second defect set according to the movement direction of the object to be detected and rechecking the sequenced defect sets by a rechecking probe.
The detection device may include, but is not limited to, a processor 60, a memory 61. Those skilled in the art will appreciate that fig. 6 is merely an example of a detection device 6, and does not constitute a limitation of the detection device 6, and may include more or less components than those shown, or some components in combination, or different components, for example, the detection device may also include an input-output device, a network access device, a bus, etc.
The Processor 60 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 61 may be an internal storage unit of the detection device 6, such as a hard disk or a memory of the detection device 6. The memory 61 may also be an external storage device of the detection device 6, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the detection device 6. Further, the memory 61 may also include both an internal storage unit and an external storage device of the detection device 6. The memory 61 is used for storing the computer program and other programs and data required by the detection device. The memory 61 may also be used to temporarily store data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus/terminal device and method may be implemented in other ways. For example, the above-described embodiments of the apparatus/terminal device are merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated modules/units, if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, all or part of the flow in the method of the embodiments described above can be realized by a computer program, which can be stored in a computer-readable storage medium and can realize the steps of the embodiments of the methods described above when the computer program is executed by a processor. . Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain other components which may be suitably increased or decreased as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media which may not include electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (15)
1. A detection method is characterized in that detection equipment for implementing the detection method comprises a motion platform for bearing and moving an object to be detected and a rechecking probe for rechecking the object to be detected, and the detection method comprises the following steps:
acquiring a first defect set to be retested included in the object to be tested;
screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be detected to obtain a second defect set;
and sequencing the second defect set according to the movement direction of the object to be detected, and performing rechecking on the sequenced defect sets by using a rechecking probe.
2. The inspection method according to claim 1, wherein the inspection apparatus includes a full inspection module for performing an initial inspection on the object to be inspected, and the step of acquiring the first defect set to be re-inspected included in the object to be inspected includes:
acquiring a third defect set determined by the full inspection module;
sorting the defects in the third defect set according to the defect values;
and screening out a first preset number of defects with larger defect values according to the sorted defects to generate the first defect set.
3. The inspection method of claim 1, wherein the inspection apparatus comprises a full inspection module for performing an initial inspection of the object, wherein the first defect set is generated from defects acquired by the full inspection module before a current re-inspection round of the plurality of rounds of re-inspection;
or when the full inspection and the re-inspection are performed simultaneously, generating the first defect set by the defects acquired by the full inspection module before the current re-inspection round in the multi-round re-inspection, and adding the defects acquired by the full inspection in the screening process in the first defect set.
4. The inspection method according to claim 1, wherein the step of screening the first defect set according to the position of the first defect set, the position of the re-inspection probe and the moving direction of the object to be inspected to obtain the second defect set comprises:
acquiring a defect positioned on a first side of the reinspection probe according to the movement direction of the object to be detected, wherein the first side is the movement direction side of the reinspection probe;
a second defect set is determined based on the acquired defects.
5. The detecting method according to claim 4, wherein the step of determining that the first moving direction of the object is a positive X-coordinate axis direction and the second moving direction is a negative X-coordinate axis direction, and the step of obtaining the defect located at the first side of the re-inspection probe according to the moving direction of the object, the first side being the moving direction side of the re-inspection probe comprises:
when the movement direction is a first movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the reinspection probe;
and when the movement direction is a second movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the reinspection probe.
6. The inspection method of claim 4, wherein the review probe includes a first review probe and a second review probe, the method further comprising:
determining a first reinspection area according to the detection range of the first reinspection probe, and determining a second reinspection area according to the detection range of the second reinspection probe;
and determining an overlapping area according to the first re-inspection area and the second re-inspection area, and distributing the defects of the overlapping area to the first re-inspection probe or the second re-inspection probe according to a preset distribution rule.
7. The inspection method according to claim 6, wherein the step of assigning the defects of the overlapping area to the first or second review probe according to a preset assignment rule comprises:
and distributing the defects in the overlapped area to the first re-inspection probe and the second re-inspection probe according to the preset number detected by the first re-inspection probe and the second re-inspection probe in the re-inspection and the number of the re-inspection defects determined by the non-overlapped area.
8. The detection method according to claim 6, wherein the detection device comprises a full detection module for performing initial detection on the object to be detected, and the full detection module arranged in the middle detects the whole area of the object to be detected when the object to be detected performs reciprocating motion.
9. The inspection method according to claim 1, wherein the step of screening the first defect set according to the position of the first defect set, the position of the re-inspection probe and the moving direction of the object to be inspected to obtain the second defect set comprises:
and screening the defects in the second defect set according to the distance between the defects in the second defect set.
10. The detecting method according to claim 9, wherein the step of determining that the first moving direction of the object is a positive direction of an X coordinate axis, the moving direction of the re-inspection probe is a direction of a Y axis, and the step of screening the defects in the second defect set according to the distances between the defects in the second defect set comprises:
acquiring an ith defect in a second defect set according to the sequence of the second defect set, wherein i is a sequence of the sequence in the second defect set and is greater than or equal to 2;
if the ith defect and the current position of the reinspection probe belong to different pre-divided units to be detected, acquiring the theoretical Y-axis speed of the current position of the reinspection probe moving to the ith defect according to the movement speed of the moving platform;
if the theoretical Y-axis speed is higher than the current Y-axis speed of the rechecking probe, screening the ith defect;
if the theoretical Y-axis speed is less than or equal to the current Y-axis speed of the reinspection probe, controlling the reinspection probe to move to the ith defect position according to the current Y-axis speed;
and repeating the steps to screen the (i + 1) th defect until the defects in the second defect set are screened.
11. The detection method according to claim 1, wherein the moving direction of the object to be detected is different from the moving direction of the reinspection probe and is independent of the moving direction of the reinspection probe.
12. The inspection method of claim 1, wherein the step of rechecking the sorted set of defects with a rechecking probe comprises:
and rechecking the defects in the second defect set according to the preset rechecking number corresponding to the current rechecking in the multiple rechecking.
13. A detection system is characterized in that detection equipment for implementing the detection method comprises a motion platform for bearing and moving an object to be detected and a rechecking probe for rechecking the object to be detected, and the detection system comprises:
the first defect set acquisition unit is used for acquiring a first defect set to be rechecked, which is included in the object to be detected;
the second defect set acquisition unit is used for screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the motion direction of the object to be detected to acquire a second defect set;
and the rechecking unit is used for sequencing the second defect set according to the movement direction of the object to be detected and rechecking the sequenced defect sets by a rechecking probe.
14. A detection device, characterized in that the detection device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor realizes the steps of the detection method according to any one of claims 1 to 11 when executing the computer program.
15. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the detection method according to any one of claims 1 to 11.
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