CN112572638A

CN112572638A - Wave soldering carrier return device

Info

Publication number: CN112572638A
Application number: CN201910930267.3A
Authority: CN
Inventors: 艾书义; 黄金华; 潘乃营
Original assignee: Hongfujin Precision Electronics Tianjin Co Ltd
Current assignee: Hongfujin Precision Electronics Tianjin Co Ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2021-03-30

Abstract

A wave-soldering carrier pass-back device comprises a carrier frame and an AGV, wherein the carrier frame comprises an upper layer carrier and a lower layer base frame, the upper layer carrier is used for bearing products, a traction mechanism is arranged on the AGV, a hanging mechanism is arranged on the lower layer base frame, and the traction mechanism can be matched with the hanging mechanism to enable the AGV to be in butt joint with the carrier frame; after butt joint, the AGV can drive in the operation process carrier frame moves together. According to the wave-soldering carrier return device, the carrier frame is arranged into an upper layer and a lower layer, and the wave-soldering furnace passing carrier, namely the upper layer carrier frame, can be quickly and accurately recovered and conveyed by utilizing the butt joint of the AGV and the lower layer base frame of the carrier frame, so that the furnace passing carrier can be recycled.

Description

Wave soldering carrier return device

Technical Field

The invention relates to the technical field of wave-soldering carrier conveying equipment, in particular to a wave-soldering carrier return device.

Background

Wave soldering is the soldering process in which the soldering surface of a plug-in board is directly contacted with high-temperature liquid tin to achieve the purpose of soldering, the high-temperature liquid tin keeps an inclined surface, and the liquid tin forms a wave-like phenomenon by a special device, so the wave soldering is called as wave soldering, and the main material of the wave soldering is a soldering tin bar. The carrier is a consumable product, and is mainly used for replacing a tool for manual work to complete certain mechanical actions in a factory. A furnace passing carrier used in wave soldering of PCBs is a carrier used in wave soldering process operation, and the existing furnace passing carrier has no recovery device after wave soldering and can only be carried back and forth manually, so that labor cost is wasted, and working strength is increased.

Disclosure of Invention

In view of the above, there is a need to provide a wave soldering carrier returning device, which can rapidly and accurately automatically recover and transport a wave soldering furnace carrier, so as to realize recycling of the furnace carrier, thereby solving the above-mentioned technical problems.

A wave-soldering carrier pass-back device comprises a carrier frame and an AGV, wherein the carrier frame comprises an upper layer carrier and a lower layer base frame, the upper layer carrier is used for bearing products, a traction mechanism is arranged on the AGV, a hanging mechanism is arranged on the lower layer base frame, and the traction mechanism can be matched with the hanging mechanism to enable the AGV to be in butt joint with the carrier frame; after butt joint, the AGV can drive in the operation process carrier frame moves together.

Further, carrier frame is still including hanging the backup plate, the upper strata carrier frame is located hang the upper surface of backup plate, it locates to hang the mechanism hang the lower surface of backup plate, drive mechanism telescopically locates the top of AGV.

Furthermore, the traction mechanism adopts a traction column, and the hanging mechanism comprises a clamping piece; draw the post when stretching out the card go into in order to realize in the card the AGV with the butt joint of carrier frame, draw the post and withdraw from when retracting the card and hold the piece in order to realize the AGV with the separation of carrier frame.

Furthermore, the clamping piece consists of a plurality of clamping plates, and the hanging mechanism further comprises a fixing plate arranged on the hanging plate; one end of each clamping plate is installed on the fixing plate, the other ends of the clamping plates are oppositely arranged to form a clamping space in a surrounding mode, and the clamping space is used for containing the extending traction columns.

Further, the clamping piece is composed of four clamping plates.

Furthermore, two fluency strips are arranged on the AGV and are respectively arranged on two opposite sides of the outer shell of the AGV; still be equipped with two deflector on the bed frame of lower floor, each the deflector corresponds one of them fluency strip sets up for with fluency strip cooperation is in order to lead at the butt joint in-process the AGV.

Further, the bottom of lower floor's bed frame is equipped with a plurality of universal wheels, and after accomplishing the butt joint, the universal wheel with AGV's bottom gyro wheel is located same horizontal plane, and is convenient AGV drives carrier frame motion.

Compared with the prior art, the wave-soldering carrier return device disclosed by the invention has the advantages that the carrier frame is arranged into the upper layer and the lower layer, and the wave-soldering furnace passing carrier, namely the upper layer carrier frame, can be quickly and accurately recovered and conveyed by utilizing the butt joint of the AGV and the lower layer base frame of the carrier frame, so that the furnace passing carrier can be recycled.

Drawings

Fig. 1 is a perspective view of a wave soldering carrier return device according to an embodiment of the invention.

Fig. 2 is a partially exploded view of the wave solder carrier return apparatus shown in fig. 1.

Fig. 3 is a schematic perspective view of the AGV and carrier rack interface of the wave soldering carrier pass back device shown in fig. 1.

Description of the main elements

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

The wave-soldering carrier pass-back device comprises a carrier frame and an AGV, wherein the carrier frame comprises an upper layer carrier and a lower layer base frame, the upper layer carrier is used for bearing a product, a traction mechanism is arranged on the AGV, a hanging and leaning mechanism is arranged on the lower layer base frame, and the traction mechanism can be matched with the hanging and leaning mechanism to enable the AGV to be in butt joint with the carrier frame; after butt joint, the AGV can drive in the operation process carrier frame moves together.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. In the following embodiments, features of the embodiments may be combined with each other without conflict.

Referring to fig. 1 to 3, a wave soldering carrier returning device 10 provided by the present invention includes a carrier rack 1 and an AGV2(Automatic Guided Vehicle). The carrier frame 1 comprises an upper carrier 11 and a lower base frame 12. The upper layer carrier 11 is used for carrying products (not shown) to be wave-soldered, the lower layer base frame 12 is used for being butted with the AGV2, and after the butting, the AGV2 can drive the carrier frame 1 to move together in the operation process.

Specifically, be equipped with drive mechanism 3 on AGV2, be equipped with on the bed frame 12 of lower floor and hang and lean on mechanism 4, drive mechanism 3 can with hang and lean on the cooperation of mechanism 4 so that AGV2 with carrier frame 1 docks.

The carrier frame 1 further comprises a hanging plate 5, and the upper-layer carrier frame 11 and the lower-layer base frame 12 are respectively arranged on the upper side and the lower side of the hanging plate 5. In particular, the upper layer carriage 11 is provided on the upper surface 51 of the hang-up plate 5. The hanging mechanism 4 is arranged on the lower surface 52 of the hanging plate 5 and is positioned inside the lower-layer pedestal 12, and the traction mechanism 3 is telescopically arranged on the top of the AGV2 and is used for being butted with the hanging mechanism 4.

In the present embodiment, the traction mechanism 3 employs two traction columns 31, and the attachment mechanism 4 includes two retainers 41. When the traction column 31 extends out, the traction column is clamped into the corresponding clamping piece 41 to realize the butt joint of the AGV2 and the carrier frame 1, and when the traction column 31 retracts, the traction column withdraws from the corresponding clamping piece 41 to realize the separation of the AGV2 and the carrier frame 1. It is understood that in other embodiments, the number of the traction column 31 and the retainer 41 may be one or more.

In this embodiment, each of the retaining members 41 is composed of a plurality of clamping plates 411, and the hanging mechanism 4 further includes a fixing plate 42 disposed on the hanging plate 5; one end of each of the clamping plates 411 is mounted on the fixing plate 42, and the other ends of the clamping plates 411 are disposed opposite to each other to form a clamping space 412 in an enclosing manner, and the clamping space 412 is used for accommodating the extending traction column 31. In the present embodiment, the retainer 41 is composed of four catch plates 411.

It will be appreciated that in other embodiments, the AGV2 and the carrier rack 1 may interface in other configurations, for example, the traction mechanism 3 and the docking mechanism 4 may each be a hook and an attachment loop.

Preferably, two fluency strips 6 are also provided on AGV 2. Two said flues 6 are provided on opposite sides of the outer shell of AGV2, respectively; two guide plates 7 are also provided on the lower pedestal 12, each guide plate 7 corresponding to one of the fluerails 6 for cooperating with the fluerails 6 to guide the AGV2 during docking.

Preferably, the bottom of lower floor's bed frame 12 is equipped with a plurality of universal wheels 8, and after accomplishing the butt joint, universal wheel 8 with the bottom gyro wheel of AGV2 is located same horizontal plane, so that the AGV2 drives carrier frame 1 motion.

It will be appreciated that various functional modules may also be provided on the AGV2, such as: a communication module, which is connected to a computer for real-time monitoring of the power, operating conditions, alarm conditions, etc. of the AGV 2; a remote start module that enables an operator to start the AGV2 through a matching dedicated remote control; the voice prompt module can remind an operator to complete corresponding actions through voice at a station, so that the AGV2 is prevented from staying at a certain station for too long time; the voice external module can be used for externally connecting an audio file through a USB flash disk, and running music, prompt tone free selection and the like are realized.

Compared with the prior art, the wave-soldering carrier return device 10 of the invention has the advantages that the carrier frame 1 is arranged into the upper layer and the lower layer, and the wave-soldering furnace passing carrier, namely the upper layer carrier 11, can be quickly and accurately recovered and conveyed by butting the AGV2 and the lower layer base frame 12 of the carrier frame 1, so that the furnace passing carrier can be recycled.

It is understood that various other changes and modifications may be made by those skilled in the art based on the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the claims of the present invention.

Claims

1. The wave-soldering carrier return device comprises a carrier frame and is characterized by further comprising an AGV, wherein the carrier frame comprises an upper layer carrier and a lower layer base frame, the upper layer carrier is used for bearing products, a traction mechanism is arranged on the AGV, a hanging mechanism is arranged on the lower layer base frame, and the traction mechanism can be matched with the hanging mechanism to enable the AGV to be in butt joint with the carrier frame; after butt joint, the AGV can drive in the operation process carrier frame moves together.

2. The wave soldering carrier pass-back device as claimed in claim 1, wherein the carrier rack further comprises a hanging plate, the upper layer carrier is arranged on the upper surface of the hanging plate, the hanging mechanism is arranged on the lower surface of the hanging plate, and the traction mechanism is telescopically arranged on the top of the AGV.

3. The wave soldering carrier pass-back device as claimed in claim 2, wherein the pulling mechanism employs a pulling column, and the engaging mechanism includes a catch; draw the post when stretching out the card go into in order to realize in the card the AGV with the butt joint of carrier frame, draw the post and withdraw from when retracting the card and hold the piece in order to realize the AGV with the separation of carrier frame.

4. The wave-soldering carrier pass-back device as claimed in claim 3, wherein the retaining member is composed of a plurality of retaining plates, and the engaging mechanism further comprises a fixing plate disposed on the engaging plate; one end of each clamping plate is installed on the fixing plate, the other ends of the clamping plates are oppositely arranged to form a clamping space in a surrounding mode, and the clamping space is used for containing the extending traction columns.

5. The wave solder carrier return apparatus of claim 4 wherein the retainer is comprised of four of the snap-ins.

6. The wave-soldering carrier pass-back device as claimed in claim 1, wherein the AGV is further provided with two flues respectively disposed on two opposite sides of the outer shell of the AGV; still be equipped with two deflector on the bed frame of lower floor, each the deflector corresponds one of them fluency strip sets up for with fluency strip cooperation is in order to lead at the butt joint in-process the AGV.

7. The wave soldering carrier pass-back device as claimed in claim 1, wherein the bottom of the lower base frame is provided with a plurality of universal wheels, and after the docking is completed, the universal wheels and the bottom rollers of the AGV are located at the same horizontal plane, so that the AGV can drive the carrier frame to move.