CN112556594A - Strain field and temperature field coupling measurement method and system fusing infrared information - Google Patents
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- G—PHYSICS
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
- G01B11/162—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by speckle- or shearing interferometry
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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Abstract
The invention belongs to the technical field of digital image correlation methods, and particularly discloses a strain field and temperature field coupling measurement method and system fusing infrared information. The measuring method comprises the following steps: s1 speckle processing is carried out on the sample to be measured to obtain a speckle sample, and an image of the speckle sample at the initial moment is shot as a reference image; s2, stretching the speckle sample, shooting an optical image and an infrared temperature field image in the stretching deformation process, and respectively carrying out correlation matching on the deformed optical images obtained at different moments and reference images at initial moments to obtain three-dimensional strain maps at different moments; s3, compensating the resolution difference of the three-dimensional strain map and the infrared temperature field map of the speckle sample at different moments to enable the images of the three-dimensional strain map and the infrared temperature field map to be the same in size, so that the three-dimensional strain field and the temperature field corresponding to each moment are obtained, and coupling of the strain field and the temperature field is achieved. By the method, the coupling analysis of strain and temperature is realized, the operation is simple, and the measurement precision is high.
Description
Technical Field
The invention belongs to the technical field of digital image correlation methods, and particularly relates to a strain field and temperature field coupling measurement method and system fusing infrared information.
Background
The heat sources of the material in the stretching deformation are as follows: the heat generated by plastic deformation and the heat in the thermoelastic effect. The strain field and the temperature field of the material are observed simultaneously, which has important significance for analyzing the energy change of the material in the deformation process, so that the strain field and the temperature field of the material need to be measured in a coupling manner in the loading process.
In the 'synchronous temperature field and displacement field measuring system and method based on 3D-DIC' (CN201910242084.2) in Fei Qing, Denghuo, and the like, a strain field of a sample is obtained by using a binocular imaging system of two color cameras, the color of a calibration block is shot at different temperatures to obtain a color calibration curve, and the temperature field of the surface of the sample is obtained by comparing the color of temperature indicating paint on the surface of the sample with the color of different temperatures on the color calibration curve. The test system needs to calibrate the color of the calibration block before measurement, the measurement steps are complicated, and a continuous temperature curve is obtained by an interpolation method, so that temperature measurement errors can be introduced.
In "high-speed cutting deformation measuring apparatus based on DIC technique and infrared imaging technique" (CN201720477382.6) manufactured by fangyuan, quee, li and the like, two CCD cameras are used to obtain a strain field of a sample, and an infrared camera is used to obtain a temperature field of a surface of the sample. The test system does not adopt the same algorithm to calibrate the three cameras, distortion errors are easily introduced, the difference of the resolution ratios of a strain diagram and a temperature diagram is not compensated, and the coupling measurement of the strain field and the temperature field cannot be realized.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides a strain field and temperature field coupling measurement method and system fusing infrared information, wherein the strain and temperature corresponding to the sample to be measured at the same moment are obtained by measuring the tensile strain field and the temperature field of the sample to be measured at different moments, so that the coupling of the temperature and the strain is realized, the operation is simple, the precision is higher, and the measurement of heat and deformation in the material deformation process is realized.
In order to achieve the above object, according to the present invention, there is provided a strain field and temperature field coupling measurement method fusing infrared information, the measurement method comprising the steps of:
s1 speckle processing is carried out on the sample to be measured, so as to obtain a speckle sample, and an initial optical image of the speckle sample is shot and is used as a reference image of the speckle sample at the initial moment;
s2, stretching the speckle sample, shooting an optical image and an infrared temperature field image of the speckle sample in the deformation process at different preset sampling moments while stretching, and performing DIC digital image correlation matching on the deformed optical image obtained at different moments and the reference image at the initial moment respectively to obtain three-dimensional strain maps of the speckle sample at different moments;
s3, compensating the resolution difference of the three-dimensional strain map and the infrared temperature field map of the speckle sample at different moments, so that the images of the three-dimensional strain field map and the temperature field map are the same in size, thereby obtaining the three-dimensional strain and temperature field corresponding to the speckle sample at each moment, and realizing the coupling of the strain field and the temperature field.
Further preferably, in step S1, the speckle processing is to first coat the surface of the sample to be measured with white matte paint uniformly, and spray black matte paint on the surface after drying, so as to obtain the speckle sample.
Further preferably, in S2, before capturing the deformed optical image and the infrared temperature field image of the speckle sample, the captured camera needs to be calibrated, so as to obtain the internal and external parameters of the camera.
Further preferably, the calibration plate is a dot calibration plate containing three concentric circles.
Further preferably, in step S3, the compensation for the difference in resolution between the three-dimensional strain optical image and the infrared temperature field image of the speckle sample at different time instants uses a bilinear interpolation method, so as to obtain the three-dimensional strain field and the temperature field of the speckle sample at each time instant.
According to another aspect of the present invention, there is provided a measuring system of the above measuring method, the measuring system including a stretching device, a strain calculating device, and a temperature field collecting device, wherein:
the stretching device is used for stretching the speckle sample; the strain calculation device is used for calculating three-dimensional strain of the speckle sample at different moments, and the temperature field acquisition device is used for acquiring temperature field images of the speckle sample at different moments;
the strain calculation device and the temperature field acquisition device are arranged opposite to the stretching device, the strain calculation device comprises two CCD cameras arranged on the same horizontal line, and the infrared temperature field acquisition device comprises an infrared camera.
Further preferably, the two cameras of the strain calculation device are symmetrically arranged on two sides of the infrared camera, and the optical axis of the infrared camera is perpendicular to the speckle sample, so that the infrared camera shoots the speckle sample from the right front.
Generally, compared with the prior art, the technical scheme of the invention has the following beneficial effects:
1. according to the method, DIC digital image correlation matching is carried out on deformed optical images obtained at different moments and reference optical images at the initial moment respectively, so that the strain of the samples to be measured at different moments is obtained, the temperature fields at corresponding moments are shot simultaneously, and the strain field and the temperature field corresponding to the same moment are obtained, so that coupling of the temperature field and the strain field is realized, and the method is simple to operate, short in time consumption and high in deformation measurement precision;
2. the method comprises the steps of carrying out speckle processing on a sample to be measured so as to obtain speckles on the surface of the sample to be measured, dividing a speckle image into a small subset, carrying out DIC digital image correlation matching in optical images shot by a left camera and a right camera so as to obtain three-dimensional coordinates of the subset, obtaining displacement of the subset in the optical images before and after deformation through correlation matching, and calculating all the subsets so as to realize measurement of full-field three-dimensional strain;
3. according to the invention, the optical axis of the infrared camera is perpendicular to the sample to be measured, so that the infrared camera can shoot the sample to be measured from the front side, the obtained temperature field is more accurate, the CCD cameras are symmetrically arranged at two sides of the infrared camera, the symmetrically arranged cameras realize binocular vision imaging, and after digital correlation matching is carried out, strain three-dimensional measurement can be realized.
Drawings
FIG. 1 is a flow chart of a strain field and temperature field coupling measurement method incorporating infrared information constructed in accordance with a preferred embodiment of the present invention;
FIG. 2 is a schematic diagram of a strain field and temperature field coupling measurement system incorporating infrared information constructed in accordance with a preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a speckle sample constructed in accordance with a preferred embodiment of the invention;
FIG. 4 is a strain distribution plot measured by three-dimensional digital image correlation (3D-DIC) software constructed in accordance with a preferred embodiment of the present invention;
fig. 5 is a temperature distribution diagram after spatial linear interpolation of an infrared image captured by an infrared camera, constructed in accordance with a preferred embodiment of the present invention.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
1-universal tester, 2-sample, 3-CCD camera, 4-infrared camera, 5-tripod, 6-controller and 11-white light source.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1, a strain field and temperature field coupling measurement method with infrared information fused, 3D-DIC refers to a three-dimensional digital image correlation method, comprising the following steps:
step one, after the surface of a sample is cleaned, uniformly coating white matte paint on the surface of the sample, and spraying black matte paint after the sample is dried to obtain a speckle sample.
Step two, a tripod is adopted as a supporting device of three cameras, two CCD cameras with the same type and number are symmetrically arranged on the left side and the right side of the tripod, an infrared camera is arranged in the middle of the two CCD cameras, the frame rates of the infrared camera and the CCD cameras are the same, and the solid angles of the three cameras are adjusted to enable the three cameras to shoot clear and complete sample images; in order to facilitate the extraction of the characteristics on the calibration plate and improve the calibration precision, the three cameras are calibrated by adopting the dot calibration plate containing three concentric circles, then a universal testing machine is used for stretching the sample to generate stretching deformation, and the two CCD cameras and the infrared rays synchronously acquire the images of the sample and transmit the images to the controller.
Thirdly, calculating to obtain a strain field of the sample by adopting a 3D-DIC measuring method according to the left and right CCD camera images acquired in the second step; and (3) according to the infrared camera image acquired in the step two, compensating the resolution difference between the infrared camera and the CCD camera by adopting a bilinear interpolation method, so that the temperature image and the strain image have the same size, and linking the temperature and the strain of the material at any position, thereby realizing the coupling measurement of the strain field and the temperature field.
Further, the specific implementation method of the step two is as follows:
step 2.1: layout of three cameras
The two CCD cameras are symmetrically arranged on the left side and the right side of the tripod, the two CCD cameras are kept in the same horizontal line, the optical axes of the cameras are vertical to the short axis of the sample, the distances from the lens of the two cameras to the sample along the optical axis direction are equal, the infrared camera is arranged in the middle of the two CCD cameras, and the optical axis of the infrared camera is vertical to the surface of the sample;
step 2.2: adjusting distance and solid angle between cameras
After the distance from the camera to the surface of the sample is determined, on the premise of ensuring that the distances from the lens of the two CCD cameras to the sample along the optical axis direction are the same, the distance between the two CCD cameras and a space solid angle (15-35 degrees) are adjusted, so that the sample is completely and clearly presented in the view fields of the three cameras;
step 2.3: camera calibration
The position of the calibration plate is reasonably selected, so that the calibration plate is clear and complete and is simultaneously displayed in the view fields of the three cameras, the posture of the calibration plate is changed, the three cameras simultaneously shoot images of the calibration plate, and then the three cameras are calibrated by using the same calibration algorithm;
step 2.4: capturing images
And applying a tensile load to the sample by adopting a universal testing machine, and simultaneously shooting deformation images of the sample by adopting an external signal source synchronous triggering method, and transmitting the images to the controller.
Further, the specific implementation method of the third step is as follows:
step 3.1: strain field calculation
Reasonably setting parameters of 3D-DIC analysis, including subset size, search step length, filtering window size, strain calculation window and the like, wherein the setting of the parameters is determined according to the size of sample speckles and calculation precision requirements, and after the parameters are set, importing the previously calculated calibration data to perform 3D-DIC strain analysis on images acquired by a CCD camera;
step 3.2: coupling of strain field and temperature field
And carrying out spatial interpolation processing on the acquired infrared camera image by using a bilinear interpolation method, compensating the resolution difference between the infrared camera image and the CCD camera image, enabling the temperature image and the strain image to have the same size, and enabling the temperature and the strain at any position of the material to be in one-to-one correspondence, thereby realizing the coupling measurement of the strain field and the temperature field. The expression for bilinear interpolation is as follows:
in the formula, Q11＝(x1,y1)、Q12＝(x1,y2)、Q21＝(x2,y1) And Q22＝(x2,y2) For the values of four pixels of the known function f, f (x, y) is the value at the interpolated pixel point that needs to be solved.
The present invention will be further illustrated with reference to specific examples.
The sample in this example is a rectangular heat shrinkable tube of 12cm by 2.5 cm; speckles are made of black and white matte self-spray paint.
The strain field and temperature field measurement coupling measurement system of the present example, as shown in fig. 2, includes: the device comprises a universal testing machine 1, a sample 2, a CCD camera 3, an infrared camera 4, a tripod 5, a controller 6, a binocular vision calibration plate and a white light source 11; the CCD camera 3 includes a left camera L and a right camera R.
The sample 2 is fixed on the universal testing machine 1 by a clamp, and the controller 6 is connected with the universal testing machine 1 and is used for applying a tensile load to the sample; the CCD camera 3 and the infrared camera 4 have the same frame rate and are arranged on a tripod 5 and used for fixing the cameras and keeping the relative positions of the cameras unchanged; the binocular vision calibration plate is used for calibrating the CCD camera 3 and the infrared camera 4; the controller 6 is connected with the CCD camera 3 and the infrared camera 4 and used for collecting the sample image, analyzing and processing the image and obtaining the strain field and the temperature field of the sample.
The invention relates to a strain field and temperature field coupling measurement system and a measurement method integrating infrared information, which comprises the following specific implementation steps:
step one, preparing a sample.
Aiming at the heat shrinkable tube used in the test, according to the size requirement of a universal testing machine, firstly cutting the heat shrinkable tube into a rectangle of 12cm multiplied by 2.5cm, cleaning off oil stains on the surface of the sample, firstly uniformly spraying white matte paint on the surface of the sample, spraying black matte paint after drying, and preparing a speckle image in the sample 2 as shown in figure 3.
The concrete implementation method of the second step is as follows:
step 2.1: preparation of test environment
Fix sample 2 on universal tester 1 through the anchor clamps, controller 6 control universal tester 1 reciprocates until the sample is just flare-out, and the sample plane is vertical downwards.
Step 2.2: layout installation of three cameras
Two CCD cameras 3 and an infrared camera 4 are installed on a tripod 5, the position of the tripod 5 is adjusted, the optical axes of the three cameras are located at the same height with the center of a sample, the bottom ends of the three cameras are kept horizontal, the two CCD cameras 3 are symmetrically installed on two sides of the tripod, the infrared camera 4 is arranged in the middle of the two CCD cameras 3, the tripod 5 is locked after the positions of the three cameras are adjusted, and the relative positions of the three cameras are kept unchanged.
Step 2.3: adjusting the distance and included angle between three cameras
After the distance from the infrared camera 4 to the sample 2 is determined, the infrared camera 4 is kept at the middle position all the time, the optical axis of the infrared camera 4 is perpendicular to the surface of the sample 2, the distance between the CCD cameras 3 and the included angle between the optical axis of the CCD cameras 3 and the short axis of the sample 2 are adjusted, so that the distances from the two CCD cameras 3 to the short axis of the sample 2 along the optical axis direction are equal (namely, alpha is beta in FIG. 1), the sample 2 can fill the fields of view of the three cameras, and the focal length and the aperture of the CCD cameras 3 are adjusted, so that the sample 2 can be clearly imaged in the three cameras.
Step 2.4: calibrating three cameras
Keeping the relative positions of the cameras unchanged, placing the calibration plate in front of the three cameras, continuously changing the pose of the calibration plate, using the controller 6 to control the three cameras to shoot the calibration plate at the same time, acquiring and storing images, and then calibrating the three cameras by using the same calibration algorithm.
Step 2.5: capturing images
After calibration is completed, the tensile speed and tensile displacement of the universal testing machine 1 are set, the controller 6 is used for controlling the universal testing machine 1 to apply tensile load to the sample 2, and an external signal source synchronous triggering method is adopted, so that the three cameras synchronously acquire images and transmit the images to the controller 6.
The concrete implementation method of the third step is as follows:
step 3.1: strain field calculation
Setting the subset size to be 33 × 33 pixels, the search step length to be 15 pixels, the filtering window to be gaussian filtering, and the strain window to be 5 × 5 pixels, importing the previously calculated calibration data, and performing 3D-DIC analysis on the images acquired by the two CCD cameras to obtain a strain field of the sample 2, wherein the strain image is shown in fig. 3.
Step 3.2: coupling of strain field and temperature field
The infrared image collected by the infrared camera 4 is subjected to spatial interpolation processing by a bilinear interpolation method, the difference of the resolutions of the infrared camera 4 and the two CCD cameras 3 is compensated, so that the temperature distribution image and the strain image have the same size, the compensated temperature image is shown in FIG. 4, the temperature and the strain at any position of the material can be in one-to-one correspondence, and the coupling measurement of the strain field and the temperature field is realized.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A strain field and temperature field coupling measurement method fusing infrared information is characterized by comprising the following steps:
s1 speckle processing is carried out on the sample to be measured, so as to obtain a speckle sample, and an initial optical image of the speckle sample is shot and is used as a reference image of the speckle sample at the initial moment;
s2, stretching the speckle sample, shooting an optical image and an infrared temperature field image of the speckle sample in the deformation process at different preset sampling moments while stretching, and performing DIC digital image correlation matching on the deformed optical image obtained at different moments and the reference image at the initial moment respectively to obtain three-dimensional strain maps of the speckle sample at different moments;
s3, compensating the resolution difference of the three-dimensional strain diagram and the infrared temperature field diagram of the speckle sample at different moments, so that the three-dimensional strain diagram and the temperature field diagram have the same image size, thereby obtaining the three-dimensional strain field and the temperature field of the speckle sample corresponding to each moment and realizing the coupling of the strain field and the temperature field.
2. The method for measuring the coupling of the strain field and the temperature field by fusing the infrared information as claimed in claim 1, wherein the speckle processing is to coat the surface of the sample to be measured with white matte paint uniformly, and spray black matte paint on the surface after drying, so as to obtain the speckle sample in step S1.
3. The method for measuring coupling of strain field and temperature field according to claim 1, wherein in step S2, before capturing the deformed optical image of the speckle sample and the infrared temperature field image, calibration of the captured camera is required to obtain the internal and external parameters of the camera.
4. The method for measuring the coupling of the strain field and the temperature field by fusing the infrared information as claimed in claim 3, wherein the calibration plate is a circular calibration plate comprising three concentric circles.
5. The method for measuring the coupling of the strain field and the temperature field by fusing the infrared information as claimed in claim 1, wherein in step S3, the compensation for the resolution difference between the three-dimensional strain field image and the infrared temperature field image of the speckle sample at different moments is performed by using a bilinear interpolation method, so as to obtain the three-dimensional strain field and the temperature field of the speckle sample at each moment.
6. A measuring system to which the measuring method according to any one of claims 1 to 5 is applied, characterized in that the measuring system comprises a stretching device, a strain calculating device and a temperature field collecting device, wherein:
the stretching device is used for stretching the speckle sample; the strain calculation device is used for calculating three-dimensional strain of the speckle sample at different moments, and the temperature field acquisition device is used for acquiring temperature field images of the speckle sample at different moments;
the strain calculation device and the temperature field acquisition device are arranged opposite to the stretching device, the strain calculation device comprises two CCD cameras arranged on the same horizontal line, and the infrared temperature field acquisition device comprises an infrared camera.
7. The measurement system according to claim 6, wherein the two cameras of the strain calculation device are symmetrically arranged on both sides of the infrared camera, and the optical axis of the infrared camera is perpendicular to the speckle sample, so that the infrared camera photographs the speckle sample from right in front.
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Cited By (5)
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| CN113295209A (en) * | 2021-05-21 | 2021-08-24 | 中国航空工业集团公司北京长城计量测试技术研究所 | Design method of self-adaptive high-precision digital test system and test system |
| CN114088641A (en) * | 2021-11-17 | 2022-02-25 | 山东大学 | Measuring device and method suitable for integration of micro-scale regional strain field and temperature field |
| CN114235885A (en) * | 2021-12-17 | 2022-03-25 | 华中科技大学 | Thermal expansion real-time measurement method based on temperature-sensitive fluorescent speckle and DIC measurement technology |
| CN114964374A (en) * | 2022-05-30 | 2022-08-30 | 中国航空发动机研究院 | Non-contact strain field and temperature field synchronous testing system and testing method thereof |
| CN114993197A (en) * | 2022-06-20 | 2022-09-02 | 北京理工大学 | Curing stress measuring system, curing stress measuring method, device and equipment |
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