CN1124917C - Laser machining apparatus - Google Patents
Laser machining apparatus Download PDFInfo
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- CN1124917C CN1124917C CN 97182515 CN97182515A CN1124917C CN 1124917 C CN1124917 C CN 1124917C CN 97182515 CN97182515 CN 97182515 CN 97182515 A CN97182515 A CN 97182515A CN 1124917 C CN1124917 C CN 1124917C
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Abstract
The present invention discloses a laser machining apparatus. The present invention comprises a deflector and a focusing lens, wherein the deflector changes the direction of laser output by a laser oscillator; the focusing lens makes the laser which enter by the deflector refracted to form an image on a machining object, namely a work piece. The laser machining apparatus is also provided with a lens position regulating apparatus; according to the temperature of the focusing lens, the lens position regulating apparatus changes the relative positions of lens of the focusing lens composed of multiple lenses; according to the temperature of the focusing lens, the lens position regulating apparatus changes the relative positions of the lenses so that the laser machining apparatus is regulated according to the positions of the lenses to eliminate the temperature changes of the refractivity of the lenses.
Description
Technical field
The present invention relates to laser processing device, particularly for tellite, semiconductor chip resin materials such as (chip) or porcelain (ceramic) material etc. are implemented boring, block, and add the laser processing device of sign (marking) etc.
Background technology
As implementing boring processing, block processing, add laser processing devices such as sign, known structure shown in Figure 46 in the past.
This laser processing device, comprise as optical system: the laser oscillator 1 in the generation source of laser L, and the collimator lens (collimate lens) 2 of adjusting the angle of divergence of laser, and corresponding to the anglec of rotation with the direction of laser L Y-axis inspection stream mirror (galvanomirror) 3 to direction deflection arbitrarily, X-axis inspection stream mirror 4, and adjust the Y-axis inspection according to job sequence and flow mirror 3, the Y-axis inspection scan flow device (galvano scanner) 5 of the anglec of rotation of X-axis inspection stream mirror 4, X-axis inspection scan flow device 6, and inject by Y-axis inspection stream mirror 3 the laser L of X-axis inspection stream mirror 4 deflections and implement the condenser lens 7 etc. of the focusing of laser.
The wavelength of the laser L that is produced by laser oscillator 1 be because the material of workpiece (work) W that processes, and needed Wavelength of Laser is inequality, but uses carbon dioxide laser as laser oscillator 1 mostly.
Condenser lens 7 is for according to the optical lens of injecting angle decision focal position, and corresponding to Y-axis inspection stream mirror 3, the deflection control of X-axis inspection stream mirror 4 is determined injects angle and focal position is changed.
Laser processing device carries the workpiece W that becomes processing object and implements XY worktable (table) device 8 that determining positions moves, via the mobile relative position that changes workpiece W and condenser lens 7 of the axle of XY worktable device 8.The workpiece W of laser L on XY worktable device 8 that is focused on by condenser lens 7 shines.
Near XY worktable device 8,, the vision sensor (vision sensor) 9 of detection by the Working position of the workpiece W of laser L irradiation processing is set as viewing optical system.
Laser processing device is connected with in order to laser oscillator 1, Y-axis inspection scan flow device 5, and X-axis inspection scan flow device 6 is etc. the control device 10 of the numerical control device of the XY worktable device 8 of drive controlling etc.Control device 10 is, the PC-NC that has PC for user interface (user interface) mostly remembers the job sequence of contents such as the position of record processing or its condition in PC in advance.
In laser processing device, as desired processing, it is the tiny hole processing of 50 μ m～200 μ m degree that diameter is arranged, and in this microfabrication, laser beam (laser beam) must be focused on for the very little point (sopt) as lip-deep 50 μ m～200 μ m degree of the workpiece W of processing object.Therefore, use laser to go up the condenser lens 7 that focuses on to workpiece W.
The laser that laser oscillator 1 is exported to the light path of workpiece W guiding is, has the distance of a certain degree, and therefore laser is dispersed in propagating the way, and at Y-axis inspection stream mirror 3, the diameter of light beam scatters on the X-axis inspection stream mirror 4.If as desire to make it to become essential beam diameter, must adjust the angle of divergence of laser.Therefore, place the diameter that collimator lens 3 is set light beam thus in the way of light path.
When the part of the necessity on the workpiece W is desired irradiating laser L, drive Y-axis and examine scan flow device 5, X-axis inspection scan flow device 6 changes Y-axis inspection stream mirror 3 thus, and the X-axis inspection is flowed the anglec of rotation of mirror 4 and made the direction location deflection of laser to needs.The angle θ that the laser of deflection is injected to condenser lens 7 determines the coordinate values on the workpiece W clearly.
Usually, Y-axis inspection scan flow device 5, X-axis inspection scan flow device 6 uses the DC servo motor, uses the servo-controlled method that possesses position detector mostly.In addition, XY worktable device 8 also uses ball bolt (ball screw) servo motor to implement drive controlling mostly.
Y-axis inspection scan flow device 5, X-axis inspection scan flow device 6 can have the high speed position decision of 500 holes/second degree, and XY worktable device 8 can be by the 30m/ translational speed driving of second.In addition, Y-axis inspection scan flow device 5, the determining positions degree of accuracy of X-axis inspection scan flow device 6 and XY worktable device 8, comprehensively can send ± performance of 20 μ m degree is present situation.
Usually, this condenser lens 7, frequency division are transform lens, use the compound lens that is called f θ lens mostly.Figure 47 is that expression f θ lens use the focal position as the situation of condenser lens 7.F θ lens about the laser of injecting by the focal position, have the character of the ratio that can obtain in the image height of injecting angle θ (operating distance) ω of these f θ lens.The relation that following formula is arranged at this moment, as can be known:
ω＝f·θ
In the formula, f is the focal length of f θ lens, and θ is for injecting angle.
Condenser lens 7 is identical with general optical glass lens, and it is poor to have receipts, therefore is difficult to keep the relation fully of ω=f θ.Therefore, test is desirable uses deviation to calculate in advance and proofread and correct Y-axis and examine stream mirror 5 with actual deviation mostly, the command value of the deflection angle of X-axis inspection stream mirror 6.
This correction is, (x y) implements correction for condenser lens, determines the command value (X ', Y ') for inflector assembly (Y-axis inspection scan flow device 5, X-axis inspection scan flow device 6) thus for each Working position.About proofreading and correct, implement by the transforms that use matrix mostly, in the decision of this transform, the transform of proofreading and correct is updated to the step that is different from general procedure of processing, the receipts of lens of eliminating this time point thus are poor.
Figure 48 is the step of updating that the receipts difference of expression condenser lens is proofreaied and correct transform.Implementing the situation that the receipts difference of condenser lens 7 proofreaies and correct be by structure shown in Figure 49, implements to proofread and correct with boring via the instruction of the Working position of cancellate pattern shown in Figure 50 (pattern) and processes (step S611).But, since condenser lens 7 have receive poor, the position of actual processing shown in the 51st figure, the position that the grid point that the processing of most serving as reasons is instructed departs from.
Proofread and correct with holing and process when being over, the coordinate values (step S612) in the hole of processing is detected thus by 9 observations of vision sensor in the position in the hole that is processed.Therefore, obtain condenser lens 7 ideals and actual deviate, therefore according to this, the coordinate conversion of the position correction that the execution desire is processed.Coordinate conversion is, implement by the transforms that use matrix mostly, according to the ideal and the actual deviation of condenser lens, implement minimum from multiplication etc. meet action (fitting), obtain the key element (step S613) of matrix by correction matrix calculating.
Condenser lens 7 requires high value transmittance (reflectivity is low) for Wavelength of Laser, and especially in the situation of the normal carbon dioxide laser that uses, the lens material is limited, and generally uses germanium semiconducting crystal materials such as (Germanium-Ge).These materials are, and are very big about the temperature coefficient dn/dT of the refractive index n of decision optical characteristics, understand germanium (Ge) have dn/dT=277 (℃) temperature dependency.
Because the system of laser processing device in the past is by above-described structure, heating via environment temperature or laser processing device itself, the situation of the temperature change of condenser lens 7, cause that about ratio produces the problem of the skew of Working position in temperature change, the phenomenon of the skew of the Working position of per 1 ℃ of generation 10～15 μ m of temperature becomes the bad problem of processing thus.
Result from the skew of Working position of receipts difference of condenser lens 7, can receive difference by the condenser lens of preceding described coordinate conversion proofreaies and correct and compensates, but during the temperature change of the condenser lens 7 of enforcement receipts difference timing, the optics time property variation of condenser lens 7, when temperature raises, shown in Figure 52, cause the shortcoming of the comprehensive processing of shrinking of grid point of implementing actual processing.
In addition, the temperature change of condenser lens 6 not only becomes the change skew of Working position, also causes the change of focal length, and focus point is left by work W surface, causes the bad problem of Working position that takes place thus.
Shown in Figure 53, the temperature of condenser lens 7 is injected in the laser of condenser lens 7 during for T, mode by laser beam La focuses on, and focus point Pa is on the surface of workpiece W, can well processed, but the temperature of condenser lens 7 only changes under the situation of δ T, for the identical laser of injecting the angle, owing to focus on by the mode of laser beam Lb, so the position deviation of δ X takes place in Working position, and, also produce the phenomenon of the height rising δ f of focus point Pb.
Departing from of this Working position, implement to check to confirm its degree of accuracy processing Hou otherwise can't identification as non-, under the state that causes offset in a large number, continue processing, cause the problem of the substrate that a large amount of production and processings are bad thus.
In addition, frequently implement condenser lens and receive the difference timing, can eliminate the skew of Working position, but in fact add man-hour automatically, implement the timing of condenser lens, must shut down, become thus and reduce productive reason.
Owing to there is not the method that departs from detection of automatic execution focal length, must obtain focal length in advance by the actual processing of operating personnel, often the situation of Bian Huaing is not for existing the effective measures for this change.
In addition, tellite is, along with the miniaturization and of electronic circuit, and also the raise processing request of miniaturization and pinpoint accuracyization of high collectivization, boring processing, the requirement benefit of the performance boost of laser processing device is seen rising thus.
The present invention is for solving foregoing problems, the temperature variation that its purpose is to provide the focus characteristics of condenser lens not exist with ... condenser lens also can be by the laser processing device that can implement stable Laser Processing in the good accuracy processing in the long-time continuous running.
Summary of the invention
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of condenser lens of imaging etc., aforementioned condenser lens, have by the lens of multi-disc and form, the lens position adjusting apparatus that relative position between the lens of multi-disc is changed by the condenser lens temperature can provide the focus characteristics of aforementioned condenser lens not exist with ... the laser processing device of the temperature variation of this condenser lens thus.
Therefore, the variance components of focus characteristics is eliminated due to the change of refractive of the lens that temperature variation causes, the focus characteristics of condenser lens does not exist with ... the temperature variation of condenser lens, be unlikely the skew that Working position takes place owing to the heating of the temperature of outer gas or laser machine itself, the result can implement stable Laser Processing.
The present invention, aforementioned lens position adjusting apparatus is provided, temperature meter by the temperature that detects aforementioned condenser lens, and the driving mechanism (actuator) that lens are driven to optical axis direction, and detect the laser processing device that mode that focus that the temperature variation of stating the aforementioned condenser lens of temperature correction of condenser lens before causes departs from is controlled institute's structures such as control circuit of aforementioned driving mechanism corresponding to the aforementioned temperature measuring appliance.
Therefore, the mode that the focus that causes corresponding to the temperature variation of the temperature correction condenser lens of the condenser lens that temperature meter detected departs from is because the action of driving mechanism makes lens to the optical axis direction displacement, can avoid the focus characteristics of condenser lens to exist with ... the temperature variation of condenser lens thus, therefore no longer take place because the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes, the result can implement stable Laser Processing.
The present invention can provide aforementioned driving mechanism, the feed bolt mechanism that moves to optical axis direction by lens, and aforementioned feed bolt mechanism is implemented the laser processing device that motor constituted that rotation drives.
Therefore, can lens be moved really to optical axis direction by the feed bolt mechanism.
The present invention can provide and state the laser processing device of driving mechanism by the piezoelectric element structure.
Therefore, can lens be moved to optical axis direction by piezoelectric element.
The present invention can provide aforementioned lens position adjusting apparatus, and by the maintenance accessory structure that keeps lens, stretching via the temperature of aforementioned maintenance accessory itself makes the laser processing device of aforementioned lens to the optical axis direction displacement by the material structure with temperature dependency.
Therefore, the temperature of maintenance accessory itself is flexible to make lens to the optical axis direction displacement, because this displacement departs from the caused focus of temperature variation of condenser lens and is proofreaied and correct, can avoid the focus characteristics of condenser lens to exist with ... the temperature variation of condenser lens thus, no longer make the Working position skew owing to the heating of the temperature of outer gas or laser machine itself thus, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of the condenser lens of imaging, can provide, at aforementioned condenser lens, except the convex lens group group that focuses on usefulness is gone into the concavees lens that temperature compensation is used, eliminate the temperature variation of the refractive index of aforementioned convex lens group via the temperature variation of the refractive index of aforementioned concavees lens, make the focus characteristics of aforementioned condenser lens not exist with ... the laser processing device of the temperature variation of this condenser lens thus.
Therefore, eliminate the temperature variation of the refractive index of convex lens group via the temperature variation of the refractive index of concavees lens, can avoid the focus characteristics of condenser lens to exist with ... the temperature variation of condenser lens, therefore, do not need special control system, be unlikely because the heating of the temperature of outer gas or laser machine itself causes the skew of Working position, the result can implement the Laser Processing of stable pinpoint accuracy.The present invention can provide, and the convex lens group of aforementioned condenser lens is made of zinc selenide, and aforementioned concavees lens are the laser processing device by germanium constituted.
Therefore, temperature variation by the refractive index of concavees lens is eliminated the temperature variation of the refractive index of convex lens group really, avoid the focus characteristics of condenser lens to exist with ... the temperature variation of condenser lens, be unlikely the skew of the Working position that the heating by the temperature of outer gas or laser machine itself causes thus, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on processing object in the laser processing device of condenser lens of imaging etc., the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and show the laser processing device that is detected the temperature indicator of the temperature of stating condenser lens before by the aforementioned temperature measuring appliance.
Therefore, the temperature of the condenser lens that is detected by temperature meter is shown in temperature indicator, and the result can clearly show the temperature of condenser lens to the operating personnel.
The present invention can provide the aforementioned temperature display to have involution button (reset button), the laser processing device of the temperature variation that the condenser lens temperature when showing the involution push-botton operation causes.
Therefore, the temperature variation that the condenser lens temperature when temperature indicator shows the involution push-botton operation causes, the temperature variation that the result causes in the time of can clearly informing the involution push-botton operation of condenser lens for the operating personnel.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of condenser lens of imaging etc., can provide, the temperature meter that possesses the temperature that detects aforementioned condenser lens, and the temperature variation of aforementioned condenser lens surmount in advance to be determined allowable value the time send the laser processing device of the warning device etc. of warning.
Therefore, when the temperature variation of condenser lens exceeded the allowable value that is predetermined, warning device sends reported to the police and the situation that the temperature variation of condenser lens exceeds the allowable value that is predetermined is reported to the police to the operating personnel.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly imports and on the processing object workpiece in the laser processing device of the condenser lens of imaging, the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and the laser processing device that heats the heating arrangement etc. of aforementioned condenser lens by the mode that the condenser lens temperature that the aforementioned temperature measuring appliance detected remains in predetermined certain value.
Therefore, make the condenser lens temperature remain in predetermined certain value via heating arrangement heating condenser lens, can avoid taking place the temperature change of the focus characteristics of condenser lens, be unlikely because the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of the condenser lens of imaging, the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and the laser processing device of temperature control equipment that remains in the cold aforementioned condenser lens of mode of predetermined certain value by the condenser lens temperature that the aforementioned temperature measuring appliance is detected.
Therefore, make condenser lens remain in predetermined certain value via the cold condenser lens of temperature control equipment, avoid the temperature change of condenser lens generation focus characteristics thus, be unlikely because the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, it is the laser processing device of Peltier (Peltier) element that the aforementioned temperature control device can be provided.
Therefore, owing to Peltier (Peltier) element cooling condenser lens makes the condenser lens temperature remain in predetermined certain value, can avoid the temperature change of condenser lens generation focus characteristics thus, be unlikely because the heating of the temperature of outer gas or laser machine itself causes the skew of Working position, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make the laser refraction that aforementioned inflector assembly injects and on the processing object workpiece, in the laser processing device of the condenser lens of imaging, can provide to possess the laser processing device of aforementioned condenser lens by the heat-proof device of outer air bound heat.
Therefore, prevent that by the heat-proof device execution condenser lens is subjected to the heat-blocking action of outside heat transfer, suppress the change of condenser lens occurrence temperature thus, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, the outer cylinder body of aforementioned heat-proof device by the outside that centers on condenser lens can be provided, and the heat-barrier material that is filled in drawn fixed insulated space between aforementioned condenser lens and aforementioned outer cylinder body, and the laser processing device of window seal pad institute's structures such as (window screeningplate) of the laser light transmission that disposes of the mode of the top and bottom of airtight aforementioned insulated space.
Therefore, prevent the heat-blocking action of condenser lens by the heat-barrier material execution by the heat transfer of outer gas, suppress the temperature change of condenser lens generation focus characteristics thus, prevent that Working position is subjected to the change of outer temperature degree and is offset, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide aforementioned heat-proof device to be, the laser processing device that the heat insulation accessory that the lens of structure condenser lens form via heat-barrier material is supported.
Therefore, implement the heat-blocking action of condenser lens via heat insulation accessory by the heat transfer that prevents outer gas, suppress the temperature change of condenser lens generation focus characteristics thus, prevent that Working position is subjected to the change of outside temperature and is offset, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide to comprise that aforementioned heat-proof device is to have most projections, implements the some contact for the lens of aforementioned condenser lens and keeps the laser processing device of entirety of lens package (lens mount) accessory of these lens via end before the aforementioned projection.
Therefore, lens become a contact, make lens holder (lensholder) and lens between heat transfer almost disappear, suppress the temperature change of condenser lens generation focus characteristics thus, heat transfer by outer gas is suppressed for lens, can prevent that Working position is subjected to the skew of the temperature change of outer gas, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide aforementioned heat insulation accessory to be, has outstanding bar, implements the line contact for the lens of aforementioned condenser lens and keeps the laser processing device of the entirety of lens package accessory of these lens via end before the aforementioned outstanding bar.
Therefore, lens become the line contact and support, heat transfer between lens holder and lens almost disappears, heat transfer for the outer gas of lens is suppressed, suppress the temperature change that the collection characteristic takes place condenser lens, prevent Working position owing to the temperature change of outer gas is offset, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, the convex lens structures of aforementioned condenser lens by multi-disc can be provided, wherein the convex lens of topmost and foot are for being not easy to exist with ... the lens material manufacturing of temperature by optical characteristics, the convex lens that are disposed at center section are to be existed with ... the laser processing device of the made of temperature easily by optical characteristics.
Therefore, the convex lens of topmost and foot become thermal boundary wall (heatbarrier), about be configured in optical characteristics exist with ... among the lens material of temperature easily between the convex lens of part, execution by outer gas conduct heat and prevent heat insulation, suppress the temperature change of condenser lens generation focus characteristics, prevent Working position be subjected to outer gas temperature change and be offset, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide the convex lens that are disposed at aforementioned centre, makes end before the aforementioned outstanding bar implement the laser processing device that the entirety of lens package accessory of line contact is kept for condenser lens by having outstanding bar.
Therefore, be suppressed for the heat transfer of sending here by the convex lens of intermediate configurations, suppress the focus characteristics occurrence temperature change of condenser lens thus, can prevent that Working position is subjected to the temperature change of outer gas and is offset, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of the condenser lens of imaging, the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and the laser processing device of temperature adjustment device etc. of environment temperature of adjusting the configuration portion of aforementioned condenser lens by the condenser lens temperature that keeps the aforementioned temperature measuring appliance to be detected in the mode of certain value.
Therefore, the temperature of condenser lens remains in predetermined certain value, the situation of the focus characteristics occurrence temperature of condenser lens change can be avoided, and the skew of the caused Working position of heating of the temperature of outer gas or laser machine itself does not take place, and the result implements and stablizes and the Laser Processing of pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on processing object in the laser processing device of condenser lens of imaging etc., can provide to possess to adjust and inject in the angle of the laser of aforementioned laser lens, the change of eliminating the condenser lens temperature thus causes that the elimination mechanism of the variation of the optical characteristics of stating condenser lens before is the laser processing device of characteristic.
Therefore, inject in the angle of the laser of condenser lens via eliminating institutional adjustment, the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes no longer takes place, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide the aforementioned mechanism of eliminating to be the laser processing device of correction for the amount of deflection instruction means for correcting of the command value of the amount of deflection of aforementioned inflector assembly.
Therefore, by the command value of amount of deflection instruction correction for the amount of deflection of inflector assembly, because this correction is injected in the angle of the laser of condenser lens and is adjusted, because the variation of the optical characteristics of the caused condenser lens of change of this angular setting condenser lens temperature is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes no longer takes place, and can implement the Laser Processing of stable pinpoint accuracy thus.
The present invention, temperature meter with the temperature that detects aforementioned condenser lens can be provided, and the correction parameter that aforementioned amount of deflection instruction means for correcting is set for the temperature of the condenser lens that detected corresponding to the aforementioned temperature measuring appliance is proofreaied and correct the laser processing device of command value of the amount of deflection of aforementioned inflector assembly.
Therefore, amount of deflection instruction means for correcting is, the correction parameter of setting corresponding to condenser lens temperature that the aforementioned temperature measuring appliance detected via aforementioned amount of deflection instruction means for correcting is proofreaied and correct the command value for the amount of deflection of inflector assembly, because this correction, inject in the angle of the laser of condenser lens and be adjusted, the variation of optical characteristics of the condenser lens that change causes of condenser lens temperature is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes no longer takes place thus, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, it is the laser processing device that the coordinate conversion of the coordinate conversion function that obtained by the Working position error of fixed point processing of the correction of amount of deflection instruction is implemented that aforementioned amount of deflection instruction means for correcting can be provided.
Therefore, the command value for the amount of deflection of inflector assembly is proofreaied and correct in the coordinate conversion of the coordinate conversion function that the Working position error that amount of deflection command value means for correcting is processed via fixed point is obtained, inject in the angle of the laser of condenser lens via this correction adjustment, because this angular setting is eliminated the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes, the change etc. of the caused processing unit (plant) of heating of the temperature of outer gas or laser machine itself no longer takes place thus, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, the laser processing device that can provide aforementioned amount of deflection instruction means for correcting that the correction of amount of deflection instruction is implemented by the correction matrix of the Working position error acquisition of fixed point processing.
Therefore, the command value for the amount of deflection of inflector assembly is proofreaied and correct in the coordinate conversion of the correction matrix that the Working position error of being processed via fixed point by amount of deflection instruction means for correcting is obtained, inject in the angle of the laser of condenser lens via this correction adjustment, the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes etc. no longer takes place thus, also can proofread and correct fully for nonlinear position deviation, the result can implement the Laser Processing of pinpoint accuracy.
The present invention can provide, aforementioned coordinate conversion function or aforementioned corrected matrix, and whenever in Laser Processing, the laser processing device that before Laser Processing, in advance upgrades.
Therefore, whenever when Laser Processing, prior to Laser Processing coordinate conversion function or correction matrix are upgraded, proofread and correct via implementing for the amount of deflection instruction of the inflector assembly of coordinate conversion function that upgrades or correction matrix, eliminate the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes thus, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes etc. no longer takes place, and the result implements the Laser Processing of stable pinpoint accuracy.
The present invention, temperature meter with the temperature that detects aforementioned condenser lens can be provided, aforementioned coordinate conversion function or aforementioned corrected matrix, the laser processing device that upgrades prior to Laser Processing when more than condenser lens temperature that the aforementioned temperature measuring appliance is detected is by predetermined value, changing.
Therefore, have when changing more than the predetermined value by the condenser lens temperature that temperature meter detected, coordinate conversion function or correction matrix upgrade, proofread and correct via amount of deflection instruction for the inflector assembly of coordinate conversion function that upgrades or correction matrix, the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes no longer takes place thus, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide aforementioned coordinate conversion function or aforementioned corrected matrix, by the laser processing device of the time renewal that is predetermined.
Therefore, by preset time coordinate conversion function or correction matrix are upgraded, implement correction via coordinate conversion function that upgrades or correction matrix for the amount of deflection instruction of inflector assembly, the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes no longer takes place thus, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide aforementioned coordinate conversion function or aforementioned corrected matrix, whenever the laser processing device that upgrades through the schedule time time.
Therefore, every when the schedule time, to periodically update coordinate conversion function or correction matrix, implement correction via coordinate conversion function that upgrades or correction matrix for the amount of deflection instruction of inflector assembly, the variation of the optical characteristics of the condenser lens that the condenser lens temperature change causes is eliminated, the no longer skew of the caused Working position of heating of the temperature of the outer gas of generation or laser machine itself thus, the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, the correction matrix of obtaining in advance under each condenser lens temperature can be provided, temperature meter with the temperature that detects aforementioned condenser lens uses the laser processing device of the correction matrix of the condenser lens temperature that is detected corresponding to the aforementioned temperature measuring appliance for special Cheng.
Therefore, proofread and correct via implementing for the amount of deflection instruction of the inflector assembly of the correction matrix of each the condenser lens temperature that obtains in advance, therefore add man-hour at every turn, the variation of the optical characteristics of the condenser lens that the processing of unnecessary renewal correction matrix can cause the change of condenser lens temperature is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes etc. no longer takes place, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide aforementioned elimination mechanism to comprise the laser processing device of the variable gain setting device of setting corresponding to the condenser lens variable temperatures that temperature meter detected for the gain (gain) of the command value of the amount of deflection of aforementioned inflector assembly.
Therefore, gain adjustment via the amount of deflection command value of variable gain setting device, implement the correction of amount of deflection instruction, the variation of the optical characteristics of the condenser lens that the change of condenser lens temperature causes is eliminated, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes etc. no longer takes place thus, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention can provide aforementioned elimination mechanism to be, has to adjust the laser processing device of injecting in the curved mirror (knee bendmirror) of elbow of the angle of the laser of aforementioned inflector assembly.
Therefore, inject in the angle of the laser of inflector assembly via the curved mirror adjustment of elbow, the variation of the optical characteristics of the condenser lens that the change through adjusting elimination condenser lens temperature thus causes, the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes etc. no longer takes place thus, and the result can implement the Laser Processing of stable pinpoint accuracy.
The present invention, inflector assembly in the direction that comprises the laser that the variation laser oscillator is exported, and make laser refraction that aforementioned inflector assembly imports and on the processing object workpiece in the laser processing device of the condenser lens of imaging, the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and state the position command of the temperature correction of condenser lens before detecting for the processing object workpiece of aforementioned condenser lens corresponding to the aforementioned temperature measuring appliance, before causing, the change of eliminating the condenser lens temperature thus states the laser processing device of processing worktable driving command means for correcting etc. of variation of the optical characteristics of condenser lens.
Therefore, worktable driving command means for correcting is corresponding to the position command of condenser lens temperature correction processing object workpiece, the moving change of temperature of the Working position due to the change of the optical characteristics of the condenser lens that the change of condenser lens temperature is caused via this position correction is eliminated, can avoid the skew of the caused Working position of heating of the temperature of outer gas or laser machine itself thus, the result can implement the Laser Processing of pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of the condenser lens of imaging, the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and the Wavelength of Laser of being exported, the mode of variation of stating the optical characteristics of condenser lens before being caused by the change of the temperature of eliminating condenser lens is implemented the laser processing device of the variable wavelength laser oscillator of variable setting etc. corresponding to the condenser lens temperature that the aforementioned temperature measuring appliance detected.
Therefore, can result from the wavelength of mode setting laser of the caused offset of change of optical characteristics of condenser lens of temperature change of condenser lens by elimination, the result can not suffer the influence of temperature change of condenser lens by the stable Laser Processing of implementing pinpoint accuracy of good accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of condenser lens of imaging etc., the temperature meter that possesses the temperature that detects aforementioned condenser lens can be provided, and adjust distance between aforementioned condenser lens and inflector assembly corresponding to the condenser lens temperature that the aforementioned temperature measuring appliance is detected, before causing, the change of eliminating the condenser lens temperature thus states the laser processing device of elimination mechanism etc. of variation of the optical characteristics of condenser lens.
Therefore, via eliminating mechanism, corresponding to the distance between condenser lens temperature adjustment condenser lens and inflector assembly, the variation of the optical characteristics of the condenser lens that causes of the change of condenser lens temperature is eliminated thus, avoid the skew of the Working position that the heating of the temperature of outer gas or laser machine itself causes, the result can implement the Laser Processing of pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of the condenser lens of imaging, can provide the temperature meter that possesses the temperature that detects aforementioned condenser lens, and the mode of variable quantity that the focal length of condenser lens is stated in the change of eliminating the condenser lens temperature before causing is surveyed condenser lens temperature that device the detected laser processing device with the switching phototube (adaptive optics) of the angle of divergence of adjusting laser etc. corresponding to aforementioned temperature.
Therefore, via the switching phototube corresponding to the condenser lens temperature to adjust the angle of divergence of laser, the location dimension of focus point can be held on the surface of the work via this adjustment, even there is the temperature change of condenser lens also can implement the Laser Processing of stable pinpoint accuracy thus.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of condenser lens of imaging etc., can provide the temperature meter that possesses the temperature that detects aforementioned condenser lens, and the change of eliminating the condenser lens temperature is stated the mode of variable quantity of focal length of condenser lens before causing corresponding to condenser lens temperature that the aforementioned temperature measuring appliance the detected laser processing device with the collimator lens position adjusting mechanism of the position of adjustment collimator lens etc.
Therefore, implement the position of collimator lens adjusts via collimator lens position adjustment machine, adjust the change of the focal length that the temperature change for condenser lens causes thus, adjust the dispersion angle of laser and the location dimension of focus point is held on the surface of the work, even the temperature change of condenser lens is arranged thus, also can implement the Laser Processing of stable pinpoint accuracy.
The present invention, at the inflector assembly that comprises that the direction that makes the laser that laser oscillator exports changes, and make laser refraction that aforementioned inflector assembly injects and on the processing object workpiece in the laser processing device of condenser lens of imaging etc., can provide, the temperature meter that possesses the temperature that detects aforementioned condenser lens, and eliminate the mode of variable quantity that the focal length of condenser lens is stated in the condenser lens temperature change before causing, adjustment is by the laser processing device of aforementioned condenser lens to the processing height of table adjusting mechanism of the distance of processing object workpiece etc.
Therefore, because processing height of table adjusting mechanism is adjusted the distance of condenser lens to the processing object workpiece, through adjusting thus and the location dimension of focus point can being held on the surface of the work, even there is the temperature change of condenser lens also can implement the Laser Processing of stable pinpoint accuracy thus.
Brief Description Of Drawings
Fig. 1 is the one-piece construction figure of the embodiment 1 of expression laser processing device of the present invention.
Fig. 2 is the condenser lens structural drawing partly of the embodiment 1 of expression laser processing device of the present invention.
Fig. 3 is the condenser lens structural drawing partly of the embodiment 2 of expression laser processing device of the present invention.
Fig. 4 is the condenser lens structural drawing partly of the embodiment 3 of expression laser processing device of the present invention.
Fig. 5 is the condenser lens structural drawing partly of the embodiment 4 of expression laser processing device of the present invention.
Fig. 6 is the stereographic map of major part of the embodiment 5 of expression laser processing device of the present invention.
Fig. 7 is the stereographic map of major part of variation of the embodiment 5 of expression laser processing device of the present invention.
Fig. 8 is the structural drawing of major part of the embodiment 6 of expression laser processing device of the present invention.
Fig. 9 is the process flow diagram of motion flow of the embodiment 6 of expression laser processing device of the present invention.
Figure 10 is the condenser lens structural drawing partly of the embodiment 7 of expression laser processing device of the present invention.
Figure 11 is the structural drawing of major part of the embodiment 7 of laser processing device of the present invention.
Figure 12 is the structural drawing of major part of the embodiment 8 of laser processing device of the present invention.
Figure 13 is the condenser lens stereographic map partly of the embodiment 9 of expression laser processing device of the present invention.Figure 14 is the condenser lens cut-open view partly of the embodiment 9 of expression laser processing device of the present invention.Figure 15 is the condenser lens cut-open view partly of the embodiment 10 of expression laser processing device of the present invention.
Figure 16 is the condenser lens cut-open view partly of the embodiment 11 of expression laser processing device of the present invention.
Figure 17 is the condenser lens stereographic map partly of the embodiment 11 of expression laser processing device of the present invention.
Figure 18 is the cut-open view of condenser lens part of variation of the embodiment 11 of expression laser processing device of the present invention.
Figure 19 is the condenser lens cut-open view partly of the embodiment 12 of expression laser processing device of the present invention.
Figure 20 is the condenser lens cut-open view partly of the embodiment 13 of expression laser processing device of the present invention.
Figure 21 is the structural drawing of the embodiment 14 of laser processing device of the present invention.
Figure 22 is the cut-open view of variation of the embodiment 14 of expression laser processing device of the present invention.
Figure 23 is the one-piece construction figure of the embodiment 15 of expression laser processing device of the present invention.
Figure 24 is the structural drawing of major part of the embodiment 15 of expression laser processing device of the present invention.
Figure 25 is the process flow diagram of motion flow of the embodiment 15 of expression laser processing device of the present invention.
Figure 26 is the process flow diagram of Laser Processing of the embodiment 15 of laser processing device of the present invention.
Figure 27 is the process flow diagram of other motion flows of the embodiment 15 of expression laser processing device of the present invention.
Figure 28 is that the condenser lens of the embodiment 15 of expression laser processing device of the present invention is proofreaied and correct the process flow diagram that upgrades.
Figure 29 is the process flow diagram of other Laser Processings of the embodiment 15 of laser processing device of the present invention.
Figure 30 is the key diagram of obtaining step of correction matrix among the embodiment 15 of expression laser processing device of the present invention.
Figure 31 is the process flow diagram of other Laser Processings among the embodiment 15 of laser processing device of the present invention.
Figure 32 is the key diagram of temperature correction form of the embodiment 15 of expression laser processing device of the present invention.
Figure 33 is the process flow diagram of obtaining of the correction matrix of the embodiment 15 of laser processing device of the present invention.
Figure 34 is the structural drawing of variation of the embodiment 15 of expression laser processing device of the present invention.
Figure 35 is the process flow diagram of other motion flows of the embodiment 15 of expression laser processing device of the present invention.
Figure 36 is the process flow diagram of other motion flows of the embodiment 15 of expression laser processing device of the present invention.
Figure 37 is the block scheme of the embodiment 16 of expression laser processing device of the present invention.
Figure 38 is the structural drawing of the embodiment 17 of expression laser processing device of the present invention.
Figure 39 is the structural drawing of the embodiment 18 of expression laser processing device of the present invention.
Figure 40 is the structural drawing of the embodiment 19 of expression laser processing device of the present invention.
Figure 41 is the structural drawing of the embodiment 20 of expression laser processing device of the present invention.
Figure 42 is the structural drawing of the embodiment 21 of expression laser processing device of the present invention.
Figure 43 is the key diagram of the relation of the expression angle of divergence of laser and focalizer.
Figure 44 is the structural drawing of the embodiment 22 of expression laser processing device of the present invention.
Figure 45 is the structural drawing of the embodiment 23 of expression laser processing device of the present invention.
Figure 46 is a structural drawing of representing laser processing device in the past.
Figure 47 is the key diagram of the focal position characteristic of expression f θ lens.
Figure 48 is that the expression condenser lens is proofreaied and correct the process flow diagram of updating steps.
Figure 49 is the key diagram of the gist of expression fixed position processing.
Figure 50 is the key diagram of expression fixed position processing.
Figure 51 is the key diagram of the mismachining tolerance in the processing of expression fixed position.
Figure 52 is a key diagram of representing the position deviation of laser processing device in the past.
Figure 53 is the key diagram that the focal position in the expression laser processing device changes.
The optimal morphology that carries out an invention
Below, with reference to accompanying drawing illustrated embodiments of the present invention is described.And, in following illustrated embodiments of the invention, to aforementioned in the past same structure division or equal part, additional aforementioned identical in the past label, and omit the explanation of its repetition.
Fig. 1 is the one-piece construction figure of the embodiment 1 of expression laser processing device of the present invention.
The laser processing device of embodiment 1 by the mode of the temperature variation of the refractive index of the lens of eliminating the structure condenser lens, has relative position between the lens of the multi-disc that makes condenser lens by the lens position adjusting apparatus of condenser lens temperature variation.
In Fig. 1, condenser lens is by label 20 expressions.Condenser lens 20 is f θ lens, injects via Y-axis inspection stream mirror 3 the laser L of 4 deflections of X-axis inspection stream mirror and implement the focusing of laser equally with device in the past.
The laser processing device of present embodiment, the focus of the condenser lens 20 of the temperature variation of condenser lens 20 depart from via automatic focus (focusing) compensation correction.
Therefore, condenser lens 20, lens holder (lens holder) (lens barrel) 21 with tubular of fixed configurations, and the fixed lens 22 that is fixed on lens holder 21, and the lens holder 23 that moves the tubular that may be provided with for lens holder 21 with optical axis direction (being above-below direction among the figure), and the moving lens 24 that is fixed on moving lens retainer 23, and the lens driver (actuator) 25 of the power driving device (power driver) that drives to optical axis direction of moving lens retainer 23 etc.
This condenser lens 20 makes moving lens retainer 23 to the optical axis direction displacement by lens driver 25, and the optical position of the optical axis direction of moving lens 24 is changed.Also promptly, because implementing, the change in location of the optical axis direction of moving lens 24 focuses on (focusing).
Imbed temperature-sensitive sticker 26 for lens holder 21, temperature-sensitive sticker 26 detects the temperature of condenser lens 20, especially detects the temperature of lens body, produces the signal along with the lens temperature thus.The lens temperature signal that temperature-sensitive sticker 26 is produced is for to import to control circuit.
Therefore, move to optical axis direction corresponding to temperature variation moving lens 24, when even fixed lens 22 or moving lens 24 have the material structure of temperature dependency by refractive index, the focal length f of condenser lens 20 is not acted upon by temperature changes and can remains in certain value.This is the temperature compensation of the focusing (focusing) of expression condenser lens 20.
Therefore, heating via environment temperature or laser processing device itself, even the temperature change of condenser lens 20, the focus characteristics of condenser lens 20 does not exist with ... temperature variation, no longer, also can implement the trickle processing of pinpoint accuracy in the long-time continuous running because focal length departs from the change that causes Working position.
Fig. 2 is the concrete example of expression lens driver 25.Moving lens retainer 23 is hung via feed spiral (helicoid) 32 and to be closed in lens holder 21, thus via the rotation around the central axis to optical axis direction reciprocating action.The peripheral part mint-mark gear 29 of moving lens retainer 23, the driven wheel 31 of CD-ROM drive motor 30 is engaged in this gear 29.
In this structure, drive CD-ROM drive motor 30 via driver (driver) 28, moving lens 23 rotations thus, this rotatablely moves and is transformed to rectilinear motion via feed spiral 32 with pinpoint accuracy, and moving lens retainer 23 moves to optical axis direction thus.
Therefore, control circuit 27 is, supply with command signals via the command signal that the bias Δ f with the focal length f of the condenser lens 20 that temperature difference produced eliminates to driver 28, the focal length f of condenser lens 20 has nothing to do and remains in certain value in temperature variation thus.
Fig. 3 is the embodiment 2 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the focus of the caused condenser lens 20 of the temperature variation of condenser lens 20 departs from by automatic focus proofreaies and correct, moving lens 24 is for to be held in lens holder 21 by 33 of piezoelectricity (piezo) elements, via the electricity distortion effect moving lens 24 of piezoelectric element 33 directly to the optical axis direction displacement.
Therefore, corresponding to temperature variation moving lens 24 is moved to optical axis direction, no matter the focal length f of condenser lens 20 all remains in certain value for any temperature variation, even because the heating of environment temperature or laser processing device itself, when making the temperature change of condenser lens 20, no longer produce focal length and depart from caused Working position skew, even in the long-time continuous running, also can implement the trickle processing of pinpoint accuracy.
In addition, piezoelectric element 33 uses the driving power as moving lens 24, so simple structure, can implement accurate lens position adjustment.
Fig. 4 is the embodiment 3 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the focus of the condenser lens 20 that the temperature variation of condenser lens 20 causes departs from by automatic focus proofreaies and correct, moving lens 24 is to keep accessory 34 to be supported by lens holder 21 by the temperature retractility, is optical axis direction because the temperature retractility keep the temperature of accessory 34 to stretch to make moving lens 24 direct displacements.
The temperature retractility keeps accessory 34, select its thermal expansivity for fixed lens 22, the temperature characterisitic of moving lens 24 (rate of temperature change of focal length f) becomes the material of negative value, for example can be by kalzit structures such as (CaCO3), the retractility of temperature variation makes moving lens 24 to the optical axis direction displacement.
Therefore, can move to optical axis direction corresponding to the movable contact shoe 24 of temperature variation, no matter the focal length f of condenser lens 20 all remains in certain value for any temperature variation, heating via environment temperature or laser processing device itself, during the temperature change of condenser lens 20, no longer because focal length departs from the skew of the Working position that causes, even also can implement the trickle processing of pinpoint accuracy in the long-time continuous running.
In addition, only keep the setting of accessory 34, do not need to possess control circuit in addition, can make the temperature compensation of condenser lens, implement by very simple structure by the temperature retractility.
Fig. 5 is the embodiment 4 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the focus of the condenser lens 20 that the temperature variation of condenser lens 20 causes departs from the combined compensation by lens.
The change of refractive rate several times that concavees lens 36 are caused by temperature are greater than the optical crystal material structure of the germanium (Germanium) of the optical crystal material of zinc selenide, via the temperature variation of refractive index own, the mode effect of the change of refractive that the temperature of elimination convex lens group 35 causes.
Therefore, lens arrangement is only arranged, unnecessaryly become special control circuit, the focal length f of condenser lens 20 has nothing to do and remains in certain value in temperature variation, heating via environment temperature or laser processing device itself, during the temperature change of condenser lens 20, do not produce focal length and depart from caused Working position skew, even can implement the trickle processing of pinpoint accuracy in the long-time continuous running yet.
Fig. 6 is the embodiment 5 of expression laser processing device of the present invention.
The laser processing device of present embodiment is the temperature control device of vehicle with condenser lens 20, and the temperature-sensitive sticker 26 that is arranged on condenser lens 20 is wired to temperature indicator 37.The temperature of the condenser lens 20 that temperature indicator 37 is detected for temperature-sensitive sticker 26 is shown with digital type by Celsius.
Temperature indicator 37 is installed in the position that the operating personnel sees easily, makes the temperature variation of the condenser lens 20 that the heating of the change of outer gas or laser processing device itself causes make operating personnel's easy identification thus.Therefore, the operating personnel is finding that condenser lens 20 has under the situation of change of temperature, and is bad for preventing processing, stops laser processing device in advance.
Represent that as Fig. 7 temperature indicator 37 can be provided with involution button (reset button) 38, temperature indicator 37 is represented its temperature variation by the temperature of the time point of pressing involution button 38.
Therefore, the unnecessary preference temperature of often remembering condenser lens 20 of operating personnel, the temperature difference of only noting temperature indicator 37 gets final product to represent the running of implementing laser processing device, condenser lens 20 the situation of often change produce Working position skew etc. and take place to process bad before, can be by the own occurrence temperature change of condenser lens 20 identifications, proofread and correct via the optical characteristics of test condenser lens 20, promptly can eliminate temperature change, thus for preventing that the generation of processing defective products from contributing to some extent.
Fig. 8 is the embodiment 6 of expression laser processing device of the present invention.
The laser processing device of present embodiment also has the temperature control device of vehicle of condenser lens 20, and the temperature-sensitive sticker 26 that is arranged on condenser lens 20 is wired to the control circuit 39 that controlling alarm is used.Control circuit 39 wiring hummers (buzzer) 40.
Control circuit 39, design temperature T0 and allowable temperature Td are implemented parameter setting, the detected temperatures T of the condenser lens 20 that execution temperature-sensitive sticker 26 is detected and the comparison of design temperature T0, when this difference exceeds allowable temperature difference Td, hummer 40 is sounded, and the processing halt instruction is to the mode structure of control device 10 (with reference to Fig. 1) output of laser processing device.
Fig. 9 is the treatment scheme of expression controlling alarm.At first, implement the judgement whether absolute value of (detected temperatures T)-(design temperature T0) exceeds allowable temperature difference Td.(step S10) (detected temperatures T)-design temperature T0) absolute value is not that the above situation of allowable temperature difference Td is (step S10 negates), continues execution processing (step S11), and aforementioned temperature is differentiated repetitiousness execution always to processing end of a period (step S12) thus.
To this, the absolute value of (detected temperatures T)-(design temperature T0) is allowable temperature Td when above (step S10 certainly), makes hummer 40 implement alarm action (step S13), and the processing halt instruction forces to control device 10 outputs and stops processing (step S14).
Therefore, the operating personnel can know really that the temperature of condenser lens 20 becomes the above value of allowable temperature, stops owing to processing forces this moment in addition, can prevent to process the bad possible trouble that betides.
Embodiment 7
Figure 10, Figure 11 are the embodiment 7 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the temperature that keeps condenser lens 20 is in certain value, and the focus of avoiding temperature variation to cause departs from, and goes into electric heater (heater) 41 and temperature-sensitive sticker 26 for 20 groups of condenser lenses.Electric heater 41 is, by electric heater power 42 supply capabilities, the mode that the lens temperature that is detected by temperature-sensitive sticker 26 remains in certain value heats condenser lens 20.
Therefore, have nothing to do with the change of environment temperature or the heating of laser processing device itself, make the temperature of condenser lens 20 remain in certain value, the Working position skew of avoiding focus to depart from thus causing is even also can implement trickle processing by pinpoint accuracy in the long-time continuous running.
Figure 12 is the embodiment 8 of expression laser processing device of the present invention.
The laser processing device of present embodiment also makes the temperature of condenser lens 20 remain in certain value, and the focus of avoiding temperature variation to cause departs from, and substitutes aforesaid electric heater 4 and as the temperature control fitting Peltier (Peltier) element 43 is set at condenser lens 20.
Peltier (Peltier) element 43 via its circulating currents of control power supply 44 control, is implemented heat effect by the circulating current direction, and cold-working usefulness is adjusted the temperature of condenser lens 20 in the mode of certain value by the lens temperature that keeps temperature-sensitive sticker 26 to be detected.
Therefore, have nothing to do in the change of environment temperature or the heating of laser processing device itself, the temperature of condenser lens 20 remains in certain value, avoids the skew that causes Working position that departs from owing to focal length thus, even also can implement trickle processing by pinpoint accuracy in the long-time continuous running.
Figure 13, Figure 14 are the embodiment 9 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the temperature that keeps condenser lens 20 is in certain value, and for the focus of avoiding temperature variation to cause departs from, condenser lens 20 is bestowed heat insulating packaging.Heat insulating packaging is, fixed insulated space by concentric arrangement, is drawn with 45 fillings such as glass fibre (glass wool) heat-barrier material of etc.ing and constitute with the isostructural outer cylinder body of metal 44 in the outside of condenser lens 20 between condenser lens 20 and the outer cylinder body 44 that centered on.
Mode with the top and bottom of airtight aforementioned insulated space between the upper end of outer cylinder body 44 and bottom is installed window seal pad (window screeningplate) 46.This window seal pad 46 is by material-structures such as zinc selenides, can see through laser thus.
Therefore, condenser lens 20 is by external insulation blocking, has nothing to do in the change of environment temperature etc., can suppress the temperature variation of condenser lens 20, the Working position skew of avoiding focal length to depart from thus causing, and the result can implement trickle processing by pinpoint accuracy.
Figure 15 is the embodiment 10 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the temperature that keeps condenser lens 20 is in certain value, for the focus of avoiding temperature variation to cause departs from, clamping polystyrene (polystyrene form) or vinyl chloride pyroconductivity expansivitys such as (vinyl) are the heat insulation accessory 49 of the ring-type made of the heat-barrier material of 0.036kcal/mhdeg degree between the lens 47 of structure condenser lens and entirety of lens package ring (lens mountring) 48.
Therefore, can prevent, can make the heat affecting protection of condenser lens thus by the outside by the heat transfer of entirety of lens package ring 48 to lens 47.
Therefore, have nothing to do, can suppress the temperature variation of condenser lens, can avoid focal length to depart from the change that causes Working position, implement the trickle processing of pinpoint accuracy thus in change of environment temperature etc.
Figure 16, Figure 17 are the embodiment 11 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the temperature that keeps condenser lens 20 is in certain value, for the focus of avoiding temperature variation to cause departs from, ring lens at entirety of lens package ring 48 keeps face 47a uniformly-spaced to form most nadels 50, because nadel 50 is implemented the multiple spot support with the lens 47 of structure condenser lens.
Therefore, the contact area that lens 47 and entirety of lens package ring are 48 does one's utmost to reduce, and is reduced by the heat of entirety of lens package ring 48 to lens 47 conduction thus, and the result can protect the heat affecting of condenser lens by the outside.
Therefore, irrelevant with the change of environment temperature etc., the temperature variation of condenser lens is suppressed, and can avoid being departed from by focal length the skew of the Working position that causes, can implement the trickle processing of pinpoint accuracy.
Figure 18 is the variation of expression embodiment 11.At embodiment shown in Figure 180, the ring lens of entirety of lens package ring 48 keeps face 48a to substitute nadel 50 uniformly-spaced forming most hemispherical projections 51, via hemispherical projection 51 for the lens 47 of structure condenser lens with the multiple spot support.
In this situation, lens 47 also do one's utmost to reduce with the contact area of entirety of lens package ring 48, are reduced by the heat transfer capacity of entirety of lens package ring 48 to lens 47, can protect the heat affecting of condenser lens by the outside thus.
Figure 19 is the embodiment 12 of expression laser processing device of the present invention.
The laser processing device of present embodiment also makes the temperature that keeps condenser lens 20 in certain value, for the focus of avoiding temperature variation to cause departs from, ring lens at entirety of lens package ring 48 keeps face 48a to form the continuous outstanding bar 52 of circumferencial direction, via outstanding bar 52 lens 47 of structure condenser lens is implemented the line contact and supports.
Therefore, lens 47 reduce with the contact area of entirety of lens package ring 48, are reduced by the heat transfer capacity of entirety of lens package ring 48 to lens 47, can protect the heat affecting of condenser lens by the outside thus.
Therefore, have nothing to do in change of environment temperature etc., can suppress the temperature variation of condenser lens, can avoid being departed from by focal length the skew of the Working position that causes, the result can implement the trickle processing of pinpoint accuracy.
Figure 20 is the embodiment 13 of expression laser processing device of the present invention.
The laser processing device of present embodiment departs from for the temperature variation of avoiding condenser lens 20 causes focus, and condenser lens 20 is by 4 convex lens, 53,54,55,56 structures.Wherein, the convex lens 53 of topmost and foot, 56 optical characteristics by zinc selenide optical crystal materials such as (ZnSe) are not easy to exist with ... the lens material structure of temperature (temperature dependency is few), be disposed at the convex lens 54 of center section, 55 are, optical characteristics such as same germanium optical crystals such as (Ge) material in the past exist with ... temperature easily, but the lens material of the focusing excellence of laser constitutes.
The convex lens 54,55 that are disposed at center section keep the outstanding bar 52 of face 48a to implement the lines contact by the ring lens that is formed at entirety of lens package ring 48 and support similarly to Example 11.
Present embodiment, directly be contacted with the outer gas of temperature change and suffer the topmost of influence of ambient temperature and the convex lens 53 of foot easily, 56 are not easy to exist with ... the lens material structure of temperature by optical characteristics, for the lens holder 21 of the temperature variation of the outer gas of conduction and the convex lens 54 that dispose between existing with ... among the material-structure of temperature easily, between 55, implementing the line contact via outstanding bar 52 supports, form heat insulation, therefore can obtain to be not easy to suffer the condenser lens 20 of influence of the temperature change of outer gas.
Therefore, optical characteristics is not easy to exist with ... the topmost of temperature and the convex lens 53 of foot, 56 act on thermal boundary wall (heat barrier), have nothing to do in the change of environment temperature, the temperature variation of the optical characteristics of condenser lens 20 is suppressed, avoid focal length to depart from the skew of the Working position that causes thus, the result can implement the trickle processing of pinpoint accuracy.
Figure 21 is the embodiment 14 of expression laser processing device of the present invention.
The laser processing device of present embodiment also makes the temperature of condenser lens 20 remain in certain value, and the focus of avoiding temperature variation to cause departs from, and condenser lens 20 of laser processing device etc. is contained in the Processing Room 60.Processing Room 60 for example is air conditioner equitemperature adjuster 62 for being connected in through circulation air drain (duct) 61.
The temperature-sensitive sticker 26 of the temperature of condenser lens 20 installation and measuring condenser lenses 20, the temperature signal that temperature-sensitive sticker 26 is exported is the temperature setting device 63 that is input into temperature regulator 62, temperature regulator 62 remains in the mode of the temperature that temperature setting device 63 sets for the temperature of the condenser lens 20 that detected by temperature-sensitive sticker 26, adjusts the air themperature of supplying with to Processing Room.Therefore, the temperature of condenser lens 20 remains in the temperature that temperature setting device 63 sets, have nothing to do in the heating of outer temperature degree or laser processing device itself, no longer take place because focal length departs from the skew of the Working position that causes, even also can implement the trickle processing of pinpoint accuracy in the long-time continuous running.
Figure 22 is the variation of expression embodiment 14.This variant embodiment is that laser processing device 100 all is contained in the constant temperature enclosure 65 with constant temperature room temperature manager 64.
Therefore, the temperature of this situation condenser lens 20 also remains on certain value, irrelevant with the heating of outer temperature degree or laser processing device itself, the skew that focal length departs from the Working position that causes no longer takes place, even can implement the trickle processing of pinpoint accuracy in the long-time continuous running.
Embodiment 15
Figure 23, Figure 24 are the embodiment 15 of expression laser processing device of the present invention.
The laser processing device of present embodiment, even the variation of environment temperature or the heating of laser processing device itself are arranged basically, do not suffer the state of its influence to implement Laser Processing down, because no position deviation, can implement the mode of the Laser Processing of stable pinpoint accuracy, even when having the temperature change of condenser lens 20, the variation of its optical characteristics, via injecting, implement the mechanism of eliminating in the angular setting of the laser of condenser lens.In the present embodiment, eliminate mechanism and reach by amount of deflection instruction means for correcting 70.
Amount of deflection instruction means for correcting 70, signal by the detected temperatures of the temperature-sensitive sticker 26 input focus lens 20 that are installed on condenser lens 20, for inflector assembly, also promptly for the Y-axis inspection scan flow device 5 that Y-axis scanning mirror 3 is installed, and the X-axis that Y-axis scanning mirror 4 is installed is examined the instruction of the amount of deflection of scan flow device 6 supplies, the temperature correction of the condenser lens 20 that is detected corresponding to temperature-sensitive sticker 26, this amount of deflection instruction means for correcting 70 is for can be arranged at control device 10.
Amount of deflection instruction means for correcting 70, the temperature that possesses the condenser lens 20 that is detected corresponding to temperature-sensitive sticker 26 is set the correction parameter configuration part 71 of correction parameter (parameter), and the condenser lens treatment for correcting portion 72 etc. that is implemented the condenser lens temperature correction about the position command that job sequence is supplied with by the correction parameter that is set in correction parameter configuration part 71.
Secondly, the step of the Laser Processing of present embodiment is described with reference to Figure 25 and Figure 26.
Figure 25 is general flow figure, when beginning the action of laser processing device, is implemented the temperature test (step S20) of condenser lenses by temperature-sensitive sticker 26 prior to Laser Processing.
Secondly, implement the parameter modification processing that condenser lens is proofreaied and correct, obtain the needed correction parameter of temperature (step S30) of present condenser lens thus according to the condenser lens temperature of being tested.
Right Hou is implemented Laser Processing (step S40), and (step S50) is preceding until Laser Processing ends, circulation administration step S20～step S40.
Laser Processing as shown in figure 26, read Working position (x by job sequence, y) (step S41), for Working position (x, y) use the change of condenser lens correction parameter to handle the condenser lens correction parameter execution condenser lens correction that (step S30) asked, obtain the driving command that the temperature change of eliminating condenser lens 20 causes the skew of Working position (x ', y ') step S42 thus) for inflector assembly.
Secondly, driving command (x ', y ') to inflector assembly (Y-axis inspection scan flow device 5, X-axis inspection scan flow device 6) output (step S43), according to irradiation position Hou of the deflection action of inflector assembly decision, implement laser radiation (step S44) for the laser of condenser lens 20.This Hou is judged whether this continuation (step S42) of job sequence, during continuation (step S45 negates), by Working position read in step (step S41) once again repetitiousness implement.
As previously mentioned, detect the temperature of condenser lens 20, the mode of the change of the Working position that causes by the temperature change of eliminating condenser lens, correction is for the instruction of inflector assembly, proofread and correct thus and inject in the angle of the laser of condenser lens 20, not influenced by it even therefore produce the temperature change of condenser lens, can implement the Laser Processing of stable pinpoint accuracy thus.
Figure 27～Figure 29 is another step of the Laser Processing of explanation present embodiment.
In the present embodiment,, detect the condenser lens temperature, proofread and correct the time point of data and establish when exceeding allowable value, upgrade condenser lens and proofread and correct data as the condenser lens variation of temperature by upgrading condenser lens whenever in Laser Processing.
Figure 27 is a general flow, when the action of laser processing device begins, is implemented the temperature test (step S60) of condenser lens 20 by temperature-sensitive sticker prior to Laser Processing.The judgement (step S70) whether the absolute value of the difference of the condenser lens temperature T 0 when the condenser lens temperature T that next execution is detected by temperature-sensitive sticker 26 is proofreaied and correct data updating with condenser lens last time exceeds predefined allowable temperature deviation Td.
(step S70 certainly) implemented condenser lens and proofreaied and correct renewal processing (step S80) when the absolute value of T-T0 exceeded allowable temperature deviation Td.This correction is updated to, and upgrades coordinate conversion function f x (x), the function of fy (y) itself.
This renewal is handled as shown in figure 28, the fixed point P1 that execution is predetermined, P2, the processing of Pn (step S81), survey the Working position of device 9 by vision and observe the processing stand coordinate q1 that detects each fixed point, q2 ... qn (step S82), calculate coordinate conversion function f x (x) by the least square method of Working position error, fy (y) and finish (step S83).
When condenser lens proofread and correct to upgrade and to finish dealing with, remember condenser lens temperature T 0 (step S90) during condenser lens temperature T when upgrading this renewals.
(step S70 negates) implemented Laser Processing (step S100) when the absolute value of T-T0 exceeded allowable temperature deviation Td, until Laser Processing ends preceding (step S110), and circulation administration step S60～step S100.
Laser Processing as shown in figure 29, by job sequence reading matter Working position (x, y) (step S101), for Working position (x, y) proofread and correct change according to condenser lens and handle the coordinate conversion function f x (x) that (step S80) obtained, fy (y) implements coordinate conversion, and the mode of the skew of the Working position that is caused by the temperature change of eliminating condenser lens 20 is obtained driving command for inflector assembly (x ', y ') (step S102).
Secondly, driving command (x ', y ') to inflector assembly (Y-axis inspection scan flow device 5, X-axis inspection scan flow device 6) output and by driving command (x ', y ') drives inflector assembly (step S103), according to the deflection action of inflector assembly irradiation position Hou, implement laser radiation (step S104) for condenser lens 20 decision laser.This Hou judges whether to continue job sequence (step S105), during continuation (step S105 negates), by the step of reading in Working position (step S101) repetitiousness execution once again.
As previously mentioned, owing to have the Working position that condenser lens 20 produced of change correction can be eliminated to(for) the device of inflector assembly, the result can be by the Working position processing of good accuracy by purpose.
Substitute to use coordinate conversion as previously mentioned as shown in figure 30, use that (x, y) the correction matrix M that is transformed to the condenser lens temperature of inflector assembly instruction coordinate (x ', y ') implements the correction of condenser lens corresponding to Working position.Via using correction matrix M, also can proofread and correct the Laser Processing that the result can implement pinpoint accuracy fully for nonlinear position deviation.
Correction matrix M condenser lens as shown in figure 28 proofreaies and correct shown in the renewal, implement fixed point P1, P2, the processing of Pn, Working position by vision sensor 10 is observed the processing stand coordinate q1 that detects each fixed point, q2 ... qn can use the least square method decision according to this information by the mode of good accuracy processing for the Working position of purpose.
In example shown in Figure 30, by coordinate X, the quadratic expression of Y is obtained matrix M, is also to use the formula of high order but require the situation of higher degree of accuracy.
Secondly, the flow process of using correction matrix M to add the processing in man-hour illustrates with reference to Figure 31.At first, (x, y) row (step S121) are distinguished correction instruction value (step S122) for all processing stand matrixes by correction matrix M before the execution laser radiation to read a series of processing coordinate by job sequence, the correction point range memory (step S123) of the command value of proofreading and correct (x ', y ').
Right Hou, command value (x ', y ') to the device that takes over (Y-axis inspection scan flow device 5, X-axis inspection scan flow device 6) output and by driving command (x ', y ') drives inflector assembly (step S124), by irradiation position Hou of the deflection action of inflector assembly decision, implement laser radiation (step S125) for the laser of condenser lens 20.This Hou judges whether job sequence continues (step S126), during continuation (step S126 negates), by actuation step (step S124) the repetitiousness execution once again of inflector assembly.
Correction matrix M sets corresponding to the condenser lens temperature, temperature change scope for the condenser lens of inferring is in advance only cut apart temperature by the delineation of essential capacity of decomposition, obtain the value of optimum correction matrix M at each temperature in advance, also can store by the mode of temperature correction form shown in Figure 32 at this.
When obtaining the temperature correction form, unnecessary processing and implementation each time are if implement sufficient when the importing of laser processing device or during the changing the outfit of condenser lens 20.This situation is to be read by memory and the instruction of correction deflector amount corresponding to the correction matrix of the condenser lens temperature that temperature-sensitive sticker 26 detected.
Therefore, even unnecessary interruption Laser Processing under the situation of the temperature change of the condenser lens 20 and correction of implementing condenser lens is upgraded, optimum correction matrix M via setting corresponding to present condenser lens temperature can suppress the skew of the Working position of temperature change thus.Therefore, even implement adding continuously when man-hour the temperature change of condenser lens 20 taking place of running automatically, unnecessary interruption processing can be set correcting value by the most suitable value according to the change of the temperature of condenser lens 20, and the result can implement stable Laser Processing with pinpoint accuracy all the time.
Figure 33 is the setting step that the expression aforementioned temperature is proofreaied and correct form.
Set about the temperature correction form, at first adjust the temperature (step 131) of condenser lens 20, via temperature-sensitive sticker 26 test condenser lens temperature T (step S132).
Right Hou is implemented the cover half sample processing (step S133) of matrix (matrix) shape, and the site error test of this processing result is implemented (step S134) by vision sensor 10, calculates the correction matrix M (step S135) of condenser lens temperature T according to institute's test errors.These are handled temperature by condenser lens and change with necessary capacity of decomposition and implement, and implement (step S136) for the temperature range repetitiousness of necessity.
Figure 34 is the deflection command means for correcting 70 of the situation of representing that as previously mentioned the value of optimum correction matrix M is at each temperature obtained in advance.
The renewal of aforementioned coordinate conversion function or correction matrix whenever when Laser Processing, can be implemented prior to Laser Processing as shown in figure 35.Process flow diagram shown in Figure 35 is when the action of laser processing device begins, to implement the renewal (step S140) that condenser lens is proofreaied and correct prior to Laser Processing, right Hou execution Laser Processing (step S150).
This situation can be omitted temperature-sensitive sticker 26.
Most situations is unlikely in the condenser lens temperature short time under the consideration of too big variation, and condenser lens is proofreaied and correct and upgraded, also can be by the time that is predetermined (timing), and (1 hour degree) is through out-of-date regular execution for example whenever at the fixed time.
This situation when the action of laser processing device begins, prior to Laser Processing, judges at first whether timer (timer) 1 is the time to increase (timerup) (step S160) as shown in figure 36.The situation that is not the time increase is for implementing Laser Processing (step S190) immediately, and (step S200) is preceding until Laser Processing ends, circulation administration step S160～step S190.
The situation that time increases is that the execution condenser lens is proofreaied and correct to upgrade and handled (step S170), makes timer 1 involution (step S180) thus.
Embodiment 16
Figure 37 is the embodiment 16 of expression laser processing device of the present invention.
The laser processing device of present embodiment, the Hou section in condenser lens treatment for correcting portion 72 ', group are gone into Y-axis inspection scan flow device 5, the variable gain setting device 73,74 of X-axis inspection scan flow device 6.
Variable gain setting device 73,74, by condenser lens treatment for correcting portion 72 ' input proofread and correct conversion Hou coordinate values (x "; y "), supply with condenser lens temperature information by temperature-sensitive sticker 26, set Y-axis inspection scan flow device 5 corresponding to the condenser lens temperature, the gain a of X-axis inspection scan flow device 6, b.
Obtain the gain a of suitable temperature parameter for the temperature change rate of condenser lens 20, during b, even also can be when the temperature change of condenser lens 20 is arranged by the state processing down of the skew that does not have Working position.And for eliminating the temperature change of condenser lens 20, as gain a, b can understand the change that can fully be eliminated the temperature characterisitic of condenser lens 20 by the expression of first degree of condenser lens temperature.
Therefore, can prevent the skew of the Working position that the temperature change of condenser lens 20 causes.
Embodiment 17
Figure 38 is the embodiment 17 of expression laser processing device of the present invention.
The laser processing device of present embodiment, elimination mechanism as the temperature change of the focus characteristics of condenser lens 20, processing table driving instruction correction unit 75 is set, processing table driving instruction correction unit 75 is, the position command of the processing table means 8 that the temperature of the condenser lens 20 that is detected corresponding to temperature-sensitive sticker 26 equally with amount of deflection instruction means for correcting 70 is supplied with by job sequence, by the meter constant p that the temperature change characteristic of the focus characteristics of condenser lens 20 is determined, q proofreaies and correct.
Meter constant p, q, can test in advance condenser lens 20 focus characteristics the temperature change characteristic and obtain, take advantage of via the difference of the condenser lens temperature T that is detected for standard temperature T0 and temperature-sensitive sticker 26 and to calculate correction coefficient p, q and obtain the corresponding correction coefficient of temperature difference, for the position command X that job sequence is supplied with, Y takes advantage of the calculation correction coefficient, obtain to proofread and correct the position command Δ x of Hou thus, Δ y.
Therefore, the mode of the skew of the Working position that can be caused by the temperature change that condenser lens 20 does not take place moves processing table device 8, even because therefore the temperature change part of the caused Working position of temperature change that condenser lens 20 is arranged can implement the Laser Processing of good accuracy by the mode effect of the mobile elimination of processing table device 8.
Figure 39 is the embodiment 18 of expression laser processing device of the present invention.
The laser processing device of present embodiment, as the elimination mechanism of the temperature change of the focus characteristics of condenser lens 20, group go into condenser lens 20 all for inflector assembly to the lens side Z of optical axis direction (Z-direction) displacement axle driving mechanism.
Inflector assembly, by the Y-axis inspection scan flow device 5 that Y-axis scanning mirror 3 is installed, and the institutes such as X-axis inspection scan flow device 6 that X-axis scanning mirror 4 is installed constitute, and are installed on the not shown pallet.
Lens side Z axle driving mechanism, for example be that feed is spiral, possess and carry the servo motor 30 that is fixed in aforementioned pallet, and by servo motor 30 rotation drivings, the ball-type bolt 31 that condenser lens 20 is moved via rotation to Z-direction, and corresponding to the temperature of the condenser lens 20 that temperature-sensitive sticker 26 detected with the instruction of Z axle to the control circuit 83 of the Z of servo motor 80 axle driver 82 outputs etc.
Lens side Z axle driving mechanism by the rotation of the ball-type bolt 81 of servo motor 80, changes the condenser lens 20 and the relative distance of inflector assembly.
Usually, condenser lens 20, owing to know that refractive index also increased when temperature rose, but owing to be installed on the condenser lens temperature that the temperature-sensitive sticker 26 of condenser lens 20 is detected, inflector assembly shortened with the distance of 20 of condenser lenses when the condenser lens temperature increased, and exported driving command by control circuit 83 thus.
Therefore, even condenser lens 20 has temperature change, via eliminating the relative distance that changes condenser lens 20 and inflector assembly corresponding to the offset mode partly of its temperature variation, can proofread and correct the caused Working position skew of temperature change of condenser lens 20 thus.
Therefore, can avoid the skew of the Working position that the temperature change of condenser lens 20 causes.
Figure 40 is the embodiment 19 of expression laser processing device of the present invention.
The laser processing device of present embodiment, as the elimination mechanism of the temperature change of the focus characteristics of condenser lens 20, group is gone into to adjust and is injected in the mechanism that injects angle of the laser L of inflector assembly.
This is injected angle adjusting mechanism and has the curved mirror (knee bend mirror) 90 of elbow.The curved mirror of elbow 90 fulcrum 91 such as hand that continued by leisure may be supported with inclination respectively to two directions (P direction and Q direction) of orthogonal.To the P direction, the driving mechanism that the Q direction tilts respectively (actuator) is connected in the curved mirror 90 of elbow with piezoelectric element 92,93 drivings as the curved mirror 90 of elbow.
With quantitative driving, the temperature of the condenser lens 20 that is detected according to temperature-sensitive sticker 26 can be adjusted the angle of the curved mirror 90 of elbow to piezoelectric element 92,93 via electric signal (Control of Voltage).If as in advance for the temperature of condenser lens 20 will essential correction angle relational expression be set in correction when calculating handling part 96 with angle, according to proofreading and correct the corrected value that is instructed with angle calculation handling part 96, adjustment laser L injects the angle in inflector assembly, also promptly adjust and inject, can eliminate the temperature change of the focus characteristics of condenser lens 20 thus in the angle of condenser lens 20.
Therefore, can avoid resulting from the Working position skew of the temperature change of condenser lens 20.Therefore, add man-hour, make the mode of Offset portion of the caused Working position of temperature variation of condenser lens 20 drive the curved mirror 90 of elbow and change its angle along with the driving of inflector assembly via proofreading and correct corresponding to Working position, the result can not suffer the influence of the temperature change of condenser lens 20 to implement the Laser Processing of pinpoint accuracy.
Figure 41 is the embodiment 20 of expression laser processing device of the present invention.
The laser processing device of present embodiment, as the elimination mechanism of the temperature change of the focus characteristics of condenser lens 20, group is gone into the Wavelength variable set mechanism of optical maser wavelength L.This mechanism is for being reached by the Wavelength variable laser oscillator 200 of variable wavelength.Wavelength variable oscillator 200 is, be input into the wavelength commands signal of wavelength commands input terminal 201, the wavelength of output laser L becomes variable, and correcting circuit 202 is eliminated the optical characteristics of condenser lens 20 for the detected temperatures T of the temperature-sensitive sticker 26 that is installed on condenser lens 20 the mode of change is adjusted the wavelength of laser L.
Usually, the refractive index n of condenser lens 20 is gone into for existing with ... wavelength, and is therefore fashionable as long as adjust the wavelength of laser L, promptly can eliminate the mode of the temperature change of condenser lens and adjust.
Therefore, the mode of the offset that can be caused by the temperature change of condenser lens 20 changes Wavelength of Laser, can avoid the skew of the caused Working position of temperature change of condenser lens 20 thus, the result can not suffer the influence of the temperature change of condenser lens to implement the stable Laser Processing of good accuracy.
Figure 42 is the embodiment 21 of expression laser processing device of the present invention.
The laser processing device of present embodiment, as the elimination mechanism of the temperature change of the focusing distance of condenser lens 20, group is gone into to adjust and is injected in the mechanism of the laser L of condenser lens 20 angle of divergence.
This mechanism is for having switching phototube (aclaptive optics) 110.Switching phototube 110 is that the refractive index of the reflecting surface of laser L is variable by electric signal, adjusts the angle of divergence of laser L thus.
As shown in figure 43, via injecting, can change the focus point position of condenser lens 20 by the laser L of Hou in the angle of divergence of the laser L of condenser lens 20.In Figure 43, La is the smaller situation of the angle of divergence of expression laser L, and Lb is the bigger situation of the angle of divergence of expression laser L.The smaller situation of the angle of divergence of laser is to be, because the focal length of focus point Q2 becomes h2 because the focal length of focus point Q1 becomes the bigger situation of the angle of divergence of h1 laser L.
The command signal that switching phototube 110 is exported according to control circuit 111 is with quantitative driving.The temperature of the condenser lens 20 that control circuit 11 is detected corresponding to temperature-sensitive sticker 26 will be instructed to driver 112 outputs of switching phototube 110.
Figure 44 is the embodiment 22 of expression laser processing device of the present invention.
The laser processing device of present embodiment for eliminating the temperature change of the focusing distance that condenser lens 20 causes, is injected in the mechanism of the angle of divergence of the laser L of condenser lens 20 as adjustment, and group is gone into the collimator lens position adjusting mechanism.
Collimator lens (collimator lens) 120 has optical axis direction and moves possible moving lens 121.Moving lens 121 drives for the ball-type bolt 123 that is driven by servo motor 122 and connects, because the displacement of optical axis direction is implemented in the rotation of ball-type bolt 123.
The command signal that servo motor 122 is exported according to control circuit 124 drives.The temperature of the condenser lens 20 that control circuit 124 is detected by temperature-sensitive sticker 26 will be instructed to driver 125 outputs of servo motor 122.
, adjust by control circuit 124 instruction lens positions according to the detected temperatures of the temperature-sensitive sticker 26 that is installed on condenser lens 20, can eliminate the temperature change of the focal length of condenser lens 20 thus via driver 125.
Therefore the location dimension of focus point can be held on the surface of the work,, can prevent to result from that the fuzzy caused processing of focus of change of condenser lens temperature is bad even still can implement stable Laser Processing when condenser lens 20 has temperature change.
Figure 45 is the embodiment 23 of expression laser processing device of the present invention.
The laser processing device of present embodiment, as the elimination mechanism of the temperature change of the focusing distance of condenser lens 20, group go into to make workpiece worktable (worktable) device 8 all for condenser lens 20 to the worktable side Z of optical axis direction (Z-direction) displacement axle driving mechanism (processing height of table adjusting mechanism).
Worktable side Z axle driving mechanism, for example be that feed is spiral, the servo motor 130 that possesses the base station that is fixed on not shown laser processing device, and by servo motor 130 rotation drivings, the ball-type bolt 131 that workpiece table device 8 is moved via rotation to Z-direction, and the temperature of the condenser lens 20 that is detected corresponding to temperature-sensitive sticker 20 is with the control circuit 133 of Z axle instruction to 132 outputs of the Z of servo motor 130 axle driver.
Carry the processing table device 8 of the workpiece W of processing object, make 131 rotations of ball-type bolt adjust Z axle height thus via servo motor 130.
The Z axle height control of processing table device 8, the temperature of the condenser lens 20 that is detected according to the temperature-sensitive sticker 26 that is installed on condenser lens 20 is implemented by the mode of the temperature change composition of the focusing distance of eliminating the condenser lens of inferring in advance 20.
Therefore, the location dimension of focus point is held on the surface of the work, even condenser lens 20 occurrence temperatures changes also can be implemented stable Laser Processing, can prevent from thus to result from that the fuzzy caused processing of focus of change of condenser lens temperature is bad.The industrial possibility of utilizing
As previously mentioned, laser processing device of the present invention is suitable for for tellite, and materials such as the resin material of semiconductor chip etc. or qualification material are implemented boring, block, or add the Laser Processing of sign trickle pinpoint accuracy such as (marking).
Claims (12)
1. laser processing device, comprise make the inflector assembly that the laser direction by laser oscillator output changes and make the laser refraction injected by described inflector assembly and on the processing object workpiece condenser lens of imaging,
For described condenser lens, except focusing on the convex lens group of usefulness, also add the concavees lens that temperature compensation is used, utilize the refractive index temperature of described concavees lens to change the refractive index temperature variation of offsetting described convex lens group, the focus characteristics of described condenser lens and the temperature variation of described condenser lens are irrelevant
It is characterized in that,
The convex lens group of described condenser lens is made of zinc selenide, and described concavees lens are made of germanium.
2. laser processing device comprises:
Make the inflector assembly of the laser direction change of laser oscillator output;
Make laser refraction that described inflector assembly injects and on the processing object workpiece condenser lens of imaging;
The temperature meter that this condenser lens temperature is detected; And
The angle that is incident to the laser of this condenser lens by adjustment compensates the compensation mechanism of this condenser lens because of the variation of the optical characteristics that temperature change caused,
It is characterized in that,
Described compensation mechanism comprises amount of deflection instruction correcting unit, and described amount of deflection instruction correcting unit is configured to the amount of deflection command value that offers inflector assembly is proofreaied and correct, to adjust laser angle according to the detected temperature of temperature meter.
3. laser processing device as claimed in claim 2 is characterized in that,
Have the temperature meter that detects described condenser lens temperature, described amount of deflection instruction correcting unit is proofreaied and correct the amount of deflection command value for described inflector assembly according to the correction parameter of the condenser lens temperature respective settings of described temperature meter detection.
4. laser processing device as claimed in claim 2 is characterized in that,
The correction of amount of deflection instruction is carried out in the coordinate transform of the coordinate transform function that the Working position error that the utilization of described amount of deflection instruction correcting unit is processed based on fixed point obtains.
5. laser processing device as claimed in claim 4 is characterized in that,
To each Laser Processing, before Laser Processing, upgrade described coordinate transform function or described correction matrix.
6. laser processing device as claimed in claim 4 is characterized in that,
Has the temperature meter that detects described condenser lens temperature, when the condenser lens temperature variation that detects by described temperature meter setting when above, before Laser Processing,, upgrade described coordinate transform function or described correction matrix corresponding to condenser lens temperature at this moment.
7. laser processing device as claimed in claim 4 is characterized in that,
In preset time, upgrade described coordinate transform function or described correction matrix.
8. laser processing device as claimed in claim 4 is characterized in that,
Every through official hour, upgrade described coordinate transform function or described correction matrix.
9. laser processing device as claimed in claim 4 is characterized in that,
Obtain the correction matrix of each condenser lens temperature in advance, have the temperature meter that detects described condenser lens temperature, and use the correction matrix of the condenser lens temperature correspondence of described temperature meter detection.
10. laser processing device, comprise the inflector assembly that the laser direction that makes laser oscillator output changes and make the laser refraction injected by described inflector assembly and on the processing object workpiece condenser lens of imaging,
Have adjust the angle be injected into the laser in the described condenser lens, and compensation because the compensation mechanism of the described condenser lens optical characteristics variation that the condenser lens temperature change is caused,
It is characterized in that,
Described compensation mechanism comprises corresponding to the condenser lens temperature that is detected by temperature meter, the variable setting variable gain setting device for the gain of the amount of deflection command value of described inflector assembly.
11. a laser processing device comprises:
Make the inflector assembly of the laser direction change of laser oscillator output;
Make laser refraction that described inflector assembly injects and on the processing object workpiece condenser lens of imaging;
The temperature meter that this condenser lens temperature is detected; And
The angle that is incident to the laser of this condenser lens by adjustment compensates the compensation mechanism of this condenser lens because of the variation of the optical characteristics that temperature change caused,
It is characterized in that,
Described compensation mechanism comprises that one is arranged at the crooked reflective mirror between laser oscillator and the inflector assembly, and described crooked reflective mirror is configured to will be incident to according to the detected temperature adjustment of temperature meter the laser angle of described inflector assembly.
12. a laser processing device, comprise the inflector assembly that the laser direction that makes laser oscillator output changes and make the laser refraction injected by described inflector assembly and on the processing object workpiece condenser lens of imaging,
It is characterized in that,
Have the temperature meter and the variable wavelength laser oscillator that detect described condenser lens temperature, described variable wavelength laser oscillator is corresponding to the condenser lens temperature that is detected by described temperature meter, the optical maser wavelength of variable setting output is so that compensation is because the variation of the optical characteristics of the described condenser lens that the condenser lens temperature change is caused.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97182515 CN1124917C (en) | 1997-12-26 | 1997-12-26 | Laser machining apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97182515 CN1124917C (en) | 1997-12-26 | 1997-12-26 | Laser machining apparatus |
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| CN1286654A CN1286654A (en) | 2001-03-07 |
| CN1124917C true CN1124917C (en) | 2003-10-22 |
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| CN 97182515 Expired - Lifetime CN1124917C (en) | 1997-12-26 | 1997-12-26 | Laser machining apparatus |
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Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4299185B2 (en) * | 2004-04-27 | 2009-07-22 | 株式会社ディスコ | Laser processing equipment |
| DE102004038310A1 (en) * | 2004-08-05 | 2006-02-23 | Kuka Schweissanlagen Gmbh | Laser device and operating method |
| JP5034015B2 (en) * | 2006-02-16 | 2012-09-26 | 独立行政法人産業技術総合研究所 | Laser processing apparatus and processing method thereof |
| JP5043480B2 (en) * | 2007-03-14 | 2012-10-10 | 日立ビアメカニクス株式会社 | Printed circuit board processing machine |
| DE202010006047U1 (en) * | 2010-04-22 | 2010-07-22 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Beam shaping unit for focusing a laser beam |
| CN102346030B (en) * | 2010-07-30 | 2016-09-14 | 原相科技股份有限公司 | The method of the testing distance that foundation temperature correction range unit measures and device thereof |
| JP5166589B1 (en) * | 2011-10-21 | 2013-03-21 | ファナック株式会社 | Control device for laser processing that controls approach action of processing head |
| CN103128439B (en) * | 2011-11-24 | 2015-05-20 | 三菱电机株式会社 | Lens unit and laser processing device |
| CN103076674A (en) * | 2013-01-11 | 2013-05-01 | 中国科学院长春光学精密机械与物理研究所 | Device for changing laser transmission characteristics by utilizing photo-thermal effect |
| JP5649015B1 (en) | 2013-02-22 | 2015-01-07 | 古河電気工業株式会社 | Laser welding apparatus and laser welding method |
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| GB201505458D0 (en) | 2015-03-30 | 2015-05-13 | Renishaw Plc | Additive manufacturing apparatus and methods |
| JP6667555B2 (en) * | 2015-06-23 | 2020-03-18 | テラダイオード， インコーポレーテッド | Optical element placement for varying beam parameter products in laser delivery systems |
| JP6594545B2 (en) * | 2016-07-14 | 2019-10-23 | 三菱電機株式会社 | Substrate measuring device and laser processing system |
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| CN106312321B (en) * | 2016-11-16 | 2017-11-17 | 哈尔滨工业大学 | A kind of pipeline circumferential weld parital vacuum laser soldering device and the welding method based on the welder |
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| CN116997100B (en) * | 2023-05-29 | 2024-02-20 | 上海展华电子(南通)有限公司 | Bonding pad manufacturing method, system and medium based on machine vision |
| CN117340458B (en) * | 2023-11-23 | 2024-05-10 | 江阴创可激光技术有限公司 | Post-focusing compensation system and method based on temperature detection |
-
1997
- 1997-12-26 CN CN 97182515 patent/CN1124917C/en not_active Expired - Lifetime
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