CN112467050A

CN112467050A - OLED device and preparation method thereof

Info

Publication number: CN112467050A
Application number: CN202011308502.2A
Authority: CN
Inventors: 程家有
Original assignee: Semiconductor Integrated Display Technology Co Ltd
Current assignee: Semiconductor Integrated Display Technology Co Ltd
Priority date: 2020-11-20
Filing date: 2020-11-20
Publication date: 2021-03-09

Abstract

The invention relates to the field of micro display, and discloses an OLED device and a preparation method thereof, wherein the preparation method of the OLED device comprises the following steps: providing a silicon wafer substrate, and preparing a CMOS (complementary metal oxide semiconductor) driving circuit on the silicon wafer substrate; preparing an AMOLED light emitting layer according to the pixel arrangement structure; preparing an encapsulation layer on the AMOLED light emitting layer; attaching a protective film to the outer side of the packaging layer to coat the whole packaging layer to obtain a semi-finished product; and tearing off the adhesive film after the semi-finished product is transported, and finishing the subsequent module process to obtain the OLED device. The OLED device and the preparation method thereof overcome the problem that an encapsulation film layer in the prior art is easy to damage, and the semi-finished product is effectively protected.

Description

OLED device and preparation method thereof

Technical Field

The invention relates to the field of OLED (organic light emitting diode) packaging, in particular to an OLED device and a preparation method thereof.

Background

The silicon-based OLED display is a novel display technology combining a semiconductor and an OLED, and is a main scheme of VR/AR and other next-generation intelligent wearable display. With the continued advancement of 5G and AI technologies, more and more wearable display products will become more attractive. The silicon-based OLED micro display device has the advantages of high resolution, low power consumption, small size, light weight and the like, is widely applied to high-resolution near-to-eye display industries such as AR, VR, wearable equipment, industrial security, medical treatment and the like, gradually becomes an important point of a novel display industry, and has great market potential. Organic Light Emitting Display (OLED) is a new generation of Display, and has many advantages of self-luminescence, fast response, wide viewing angle, color saturation, etc. compared with liquid crystal Display. However, the OLED device is sensitive to water and oxygen in the air and is easy to absorb water and oxidize, so that the service life of the OLED device is reduced or a pixel fails, and therefore, the OLED device is effectively packaged, the OLED device is sufficiently isolated from the water and oxygen, and the service life of the OLED device is prolonged. However, Micro OLEDs are more in process and more complex in process, and in the current stage, the key point is that in the research and development stage, the semi-finished product is not effectively protected, and the packaging film layer is easily damaged, thereby affecting the device structure.

Disclosure of Invention

The invention aims to provide an OLED device and a preparation method thereof, the OLED device and the preparation method thereof overcome the problem that an encapsulation film layer in the prior art is easy to damage, and the effective protection of a semi-finished product is realized.

In order to achieve the above object, the present invention provides a method for manufacturing an OLED device, including: providing a silicon wafer substrate, and preparing a CMOS (complementary metal oxide semiconductor) driving circuit on the silicon wafer substrate; preparing an AMOLED light emitting layer according to the pixel arrangement structure; preparing an encapsulation layer on the AMOLED light emitting layer; attaching a protective film to the outer side of the packaging layer to coat the whole packaging layer to obtain a semi-finished product; and tearing off the adhesive film after the semi-finished product is transported, and finishing the subsequent module process to obtain the OLED device.

Preferably, the protective film includes: release films, adhesive films, and base films; and, the attaching the protective film to the outside of the encapsulation layer includes: the release film is removed, and the adhesive film and the base film are attached to the outside of the encapsulation layer.

Preferably, the attaching the adhesive film and the base film to the outside of the encapsulation layer includes: the adhesive film and the base film are attached to the outside of the encapsulation layer in an upward or downward manner.

Preferably, the thickness of the peeling film is configured to be 10-50um, and the material of the peeling film is configured to be a silica gel release film; the thickness of the adhesive film is configured to be 20-100um, and the material of the adhesive film is configured to be polyurethane, styrene-acrylonitrile copolymer; the thickness of the base film is configured to be 10-50um, and the material of the base film is configured to be ethylene terephthalate.

Preferably, the size of the protective film is greater than or equal to the size of the silicon wafer substrate.

Preferably, the adhesion force of the protective film and the packaging layer is not more than 0.2N/25 mm.

In addition, the invention also provides an OLED device which is prepared by using the preparation method of the OLED device.

By the technical scheme, the OLED semi-finished product protected by the protective film is formed, the packaging layer and the OLED device on the lower layer can be protected from being damaged to the greatest extent in the subsequent hysteresis processing or transmission process, and the protective film can be kept until the next module process is required to be performed and can be torn off before the subsequent process.

Additional features and advantages of the invention will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a flow chart of a method of making an OLED device of the present invention;

FIG. 2 is a schematic diagram of a semi-finished product according to one aspect of the present invention; and

fig. 3 is a schematic structural diagram of a protective film according to the present invention.

Description of the reference numerals

1 silicon wafer substrate 2 encapsulation layer

3 protective film 4 Release film

5 adhesive film 6 base film

Detailed Description

The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.

In the present invention, unless otherwise specified, the terms of orientation such as "upper, lower, left, right" used herein generally refer to the upper, lower, left, and right directions as shown in fig. 2. "inner and outer" refer to the inner and outer portions of a particular contour. "distal and proximal" refer to distal and proximal relative to a component.

Fig. 1 is a method for manufacturing an OLED device, as shown in fig. 1, the method for manufacturing the OLED device includes:

s101, providing a silicon wafer substrate, and preparing a CMOS (complementary metal oxide semiconductor) driving circuit on the silicon wafer substrate;

s102, preparing an AMOLED light emitting layer according to a pixel arrangement structure;

s103, preparing an encapsulation layer on the AMOLED light emitting layer;

s104, attaching a protective film to the outer side of the packaging layer to coat the whole packaging layer to obtain a semi-finished product, wherein the attached drawing after coating is shown in figure 2; and

and S105, tearing off the adhesive film after the semi-finished product is transported, and completing the subsequent module process to obtain the OLED device.

Preferably, as shown in fig. 3, the protective film may include: release films, adhesive films, and base films; and, the attaching the protective film to the outside of the encapsulation layer includes: the release film is removed, and the adhesive film and the base film are attached to the outside of the encapsulation layer. As shown in fig. 3.

Preferably, the thickness of the peeling film is configured to be 10-50um, and the material of the peeling film is configured to be a silica gel release film, and preferably, the thickness is selected to be 25 um; the thickness of the adhesive film is configured to be 20-100um, and the material thereof is configured to be polyurethane, styrene-acrylonitrile copolymer, preferably, the thickness is selected to be 30 um; the thickness of the base film is configured to be 10-50um, and the material thereof is configured to be ethylene terephthalate, preferably, the thickness is selected to be 25 um.

Preferably, the size of the protective film is greater than or equal to the size of the silicon wafer substrate. Design theory like this makes things convenient for manual tear film, adopts whole face to paste up, and the mode can adopt pad pasting technology up or down, and is special, the pad pasting technology up indicates: the substrate faces downwards, the protective film faces upwards and is attached to the substrate, and the downward film attaching process refers to the following steps: the substrate faces upwards, and the protective film faces downwards to be attached to the substrate, wherein, the film attaching process is selected but not limited to the upward film attaching process, and if the manual mode is adopted, the downward film attaching mode can be adopted.

In addition, the invention provides an OLED device which is prepared by using the preparation method of the OLED device.

Compared with the prior art, the OLED device has the same distinguishing technical characteristics and technical effects as the preparation method of the OLED device, and the details are not repeated herein.

The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.

It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.

In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims

1. A preparation method of an OLED device is characterized by comprising the following steps:

providing a silicon wafer substrate, and preparing a CMOS (complementary metal oxide semiconductor) driving circuit on the silicon wafer substrate;

preparing an AMOLED light emitting layer according to the pixel arrangement structure;

preparing an encapsulation layer on the AMOLED light emitting layer;

attaching a protective film to the outer side of the packaging layer to coat the whole packaging layer to obtain a semi-finished product;

and tearing off the adhesive film after the semi-finished product is transported, and finishing the subsequent module process to obtain the OLED device.

2. The method of manufacturing an OLED device according to claim 1, wherein the protective film includes: release films, adhesive films, and base films;

and, the attaching the protective film to the outside of the encapsulation layer includes:

the release film is removed, and the adhesive film and the base film are attached to the outside of the encapsulation layer.

3. The method of manufacturing an OLED device according to claim 2, wherein the attaching the adhesive film and the base film to an outer side of the encapsulation layer includes:

the adhesive film and the base film are attached to the outside of the encapsulation layer in an upward or downward manner.

4. The method for manufacturing the OLED device according to claim 2, wherein the thickness of the release film is configured to be 10-50um, and the material thereof is configured to be a silicone release film;

the thickness of the adhesive film is configured to be 20-100um, and the material of the adhesive film is configured to be polyurethane, styrene-acrylonitrile copolymer;

the thickness of the base film is configured to be 10-50um, and the material of the base film is configured to be ethylene terephthalate.

5. The method of claim 2, wherein the size of the protective film is greater than or equal to the size of the silicon wafer substrate.

6. The method of claim 1, wherein the protective film has an adhesion to the encapsulation layer of no more than 0.2N/25 mm.

7. An OLED device, characterized in that it is produced using the method of producing an OLED device according to any one of claims 1 to 6.