CN112463175A - Chip burning method and system and electronic equipment - Google Patents
Chip burning method and system and electronic equipment Download PDFInfo
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Abstract
The embodiment of the invention discloses a chip burning method, a system and electronic equipment, relates to the technical field of chip manufacturing, and solves the problem that the conventional burning method cannot realize dynamic value burning and multi-station information superposition. The chip burning method is used for a chip burning terminal connected with a server side database server through a C-S framework, and comprises the following steps: reading the identification information of the current chip to be burned; sending a request for acquiring chip burning parameters to a server of a server database; and burning the current chip to be burned according to the chip burning parameters returned by the server of the server database. The invention adopts the Internet technology CS framework to realize the transmission of the burning information among different stations.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a chip burning method, a chip burning system and electronic equipment.
Background
With the development of design and manufacturing technologies, integrated circuit designs have been developed from the integration of transistors to the integration of logic gates, and now to the integration of IP, i.e., SoC (System-on-a-Chip) design technology. The SoC can effectively reduce the development cost of electronic/information system products, shorten the development period, and improve the competitiveness of the products, and is the most important product development mode to be adopted in the future industry.
The SOC chip needs programs during working, the process of storing the programs (including chip key information) into the chip is chip burning, at present, large SOC chip information burning has the characteristics of complex and changeable parameters, fast information iteration and the like, most of existing schemes on the market burn the chip by using local static data, and the burning of the large SOC chip becomes a difficult problem in the engineering field.
Disclosure of Invention
In view of this, embodiments of the present invention provide a chip burning method, system and electronic device, which implement transmission of burning information between different stations by using a C-S architecture based on internet technology, and solve the problem that the current burning method cannot implement dynamic value burning and multi-station information stacking.
In a first aspect, an embodiment of the present invention provides a chip burning method for a chip burning terminal connected to a server of a server database through a C-S architecture, including:
reading the identification information of the current chip to be burned;
sending a request for acquiring chip burning parameters to a server of a server database; the server-side database server stores chip identification and corresponding chip burning parameters in advance, and the request for obtaining the chip burning parameters comprises the current chip identification to be burned;
and burning the current chip to be burned according to the chip burning parameters returned by the server of the server database.
With reference to the first aspect, in a first implementable manner of the first aspect, the chip burning parameters at least include: and testing WS data and a final testing FT result of the chip wafer.
With reference to the first aspect, in a second implementable manner of the first aspect, the server-side database server and the chip burning terminal transmit data in a socket manner.
In a second aspect, an embodiment of the present invention provides a chip burning method, for a server side database server connected to a chip burning terminal through a C-S architecture, including:
receiving a request for acquiring chip burning parameters sent by a chip burning terminal; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
obtaining chip burning parameters corresponding to the chip identification in the chip burning parameter obtaining request from a local storage space;
and sending the acquired chip burning parameters to a chip burning terminal so that the chip burning terminal burns the current chip to be burned.
With reference to the second aspect, in a first implementable manner of the second aspect, the chip burning method further includes:
receiving and storing the log file uploaded by the chip test terminal; the log file comprises local key test parameters of the chip burning terminal.
With reference to the second aspect, in a second implementable manner of the second aspect, the server-side database server and the chip burning terminal transmit data in a socket manner.
With reference to the first implementable manner of the second aspect, in a third implementable manner of the second aspect, the server database server and the chip test terminal transmit data in a socket manner.
In a third aspect, an embodiment of the present invention provides a chip burning system, for a chip burning terminal connected to a server of a server database through a C-S architecture, including:
the identification information acquisition module is used for reading the identification information of the current chip to be burned;
the parameter request sending module is used for sending a request for acquiring the chip burning parameters to a server side database server; the server-side database server stores chip identification and corresponding chip burning parameters in advance, and the request for obtaining the chip burning parameters comprises the current chip identification to be burned;
and the burning module is used for burning the current chip to be burned according to the chip burning parameters returned by the server side database server.
With reference to the third aspect, in a first implementable manner of the third aspect, the chip burning parameters at least include: and testing WS data and a final testing FT result of the chip wafer.
With reference to the third aspect, in a second implementable manner of the third aspect, the server-side database server and the chip burning terminal transmit data in a socket manner.
In a fourth aspect, an embodiment of the present invention provides a chip burning system, configured to a server side database server connected to a chip burning terminal through a C-S architecture, including:
the parameter request receiving module is used for receiving a request for acquiring the chip burning parameters sent by the chip burning terminal; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
the parameter retrieval module is used for acquiring the chip burning parameters corresponding to the chip identifiers in the chip burning parameter acquisition request from a local storage space;
and the parameter sending module is used for sending the acquired chip burning parameters to the chip burning terminal so as to enable the chip burning terminal to burn the current chip to be burned.
With reference to the fourth aspect, in a first implementable manner of the fourth aspect, the chip burning system further includes:
the test parameter storage module is used for receiving and storing the log file uploaded by the chip test terminal; the log file comprises local key test parameters of the chip burning terminal.
With reference to the fourth aspect, in a second implementable manner of the fourth aspect, the server-side database server and the chip burning terminal transmit data in a socket manner.
With reference to the first implementable manner of the fourth aspect, in a third implementable manner of the fourth aspect, the server-side database server and the chip test terminal transmit data in a socket manner.
In a fifth aspect, an embodiment of the present invention provides an electronic device, where the electronic device includes: the device comprises a shell, a processor, a memory, a circuit board and a power circuit, wherein the circuit board is arranged in a space enclosed by the shell, and the processor and the memory are arranged on the circuit board; a power supply circuit for supplying power to each circuit or device of the electronic apparatus; the memory is used for storing executable program codes; the processor reads the executable program code stored in the memory to run a program corresponding to the executable program code, so as to execute the chip burning method according to any one of the foregoing embodiments.
The chip burning method, the system and the electronic equipment provided by the embodiment of the invention use a CS software architecture, test data stores dynamic parameters such as key parameters into a database through test software, and then the chip burning terminal acquires the chip burning parameters from the database to burn a chip to be burned when burning the chip, thereby realizing the transmission of burning information among different stations, achieving the dynamic value burning and the superposition of multi-station information, and solving the problem that the current chip burning method can not realize the dynamic value burning and the superposition of the multi-station information.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a chip burning method according to a first embodiment of the present invention;
FIG. 2 is a flowchart illustrating a second embodiment of a chip burning method according to the present invention;
FIG. 3 is a flowchart illustrating a third embodiment of a chip burning method according to the present invention;
FIG. 4 is a schematic structural diagram of a chip burning system according to a first embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a second embodiment of a chip burning system according to the present invention;
FIG. 6 is a schematic structural diagram of a third embodiment of a chip burning system according to the present invention;
fig. 7 is a schematic structural diagram of an embodiment of an electronic device according to the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 1 is a flowchart illustrating a chip burning method according to a first embodiment of the present invention. Referring to fig. 1, the chip burning method of the present invention is a chip burning terminal connected to a server side database server through a C-S architecture, and includes:
s101, reading identification information of a chip to be burned currently;
in this embodiment, when a chip is to be burned, the chip needs to be identified to obtain the identification information of the chip, so as to facilitate obtaining the corresponding burning parameters through the identification information subsequently.
S102, sending a request for acquiring chip burning parameters to a server of a server database; the server-side database server stores chip identification and corresponding chip burning parameters in advance, and the request for obtaining the chip burning parameters comprises the current chip identification to be burned;
in this embodiment, the chip burning parameters at least include: classification test WS (wafer testing) data and final test FT (Final test) results. Wherein, WS refers to the stage that the chip is in wafer, and the probe card is used to punch the chip pin to test the basic device parameters of the chip, such as Vt (threshold voltage), Rdson (on resistance), BVdss (source-drain breakdown voltage), Igss (gate-source leakage current), Idss (drain-source leakage current), etc., so that the bad chip is picked up and marked by Ink dots (Ink), which can reduce the cost of packaging and testing, the chip passing the test can be packaged, and WS is the embodiment of chip quality. The FT test is mainly used for testing the application aspect of the chip.
S103, burning the current chip to be burned according to the chip burning parameters returned by the server of the server database.
In this embodiment, the server of the server database and the chip burning terminal transmit data in a Socket manner, where a Socket is an intermediate software abstraction layer for communication between an application layer and a TCP/IP protocol suite, and is a set of interfaces. In the design mode, Socket is actually a facade mode, a complex TCP/IP protocol family is hidden behind a Socket interface, for a user, a group of simple interfaces are all, and the Socket organizes data to accord with a specified protocol, so that the Socket has the characteristic of convenient implementation for the user.
In the chip burning method provided by the embodiment, the CS software architecture is used, the chip burning terminal acquires the chip burning parameters from the database server end to burn the chip to be burned when the chip is burned, and the database server stores the chip burning parameters such as WS and FT test data in advance, so that the burning information is transmitted among different stations, the dynamic value burning and the multi-station information superposition are achieved, and the problem that the dynamic value burning and the multi-station information superposition cannot be achieved by the conventional chip burning method is solved.
FIG. 2 is a flowchart illustrating a second embodiment of a chip burning method according to the present invention. Referring to fig. 2, the chip burning method of the present invention is applied to a server database server connected to a chip burning terminal through a C-S architecture, and includes:
s201, receiving a request for acquiring chip burning parameters sent by a chip burning terminal; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
in this embodiment, the server side database server and the chip burning terminal transmit data in a socket manner, and the communication implementation manner is simple.
S202, obtaining chip burning parameters corresponding to chip identifiers in the chip burning parameter obtaining request from a local storage space;
in this embodiment, as an optional implementation manner, before step S202, the method further includes:
receiving and storing a log file uploaded by a chip test terminal; the log file comprises local key test parameters of the chip burning terminal.
In this step, the server side database server and the chip test terminal transmit data in a socket manner. Because the socket mode is adopted to transmit data, the method has the characteristics of simple and convenient implementation mode. When the dynamic parameters such as key test parameters of a station (current test terminal) are stored in a log file and are finally uploaded to a database server for storage, the test data store the dynamic parameters such as the key parameters into a database through test software of the test terminal, and burning and checking are finally facilitated.
S203, sending the acquired chip burning parameters to a chip burning terminal so that the chip burning terminal burns the current chip to be burned.
In this embodiment, the database server sends the chip burning parameters to the chip burning terminal through local retrieval, and the burning program in the chip burning terminal burns the chip after obtaining the chip burning parameters.
In the chip burning method provided by the embodiment, a CS software architecture is used, firstly, each test station encapsulates the test result (namely, dynamic parameters such as key parameters) into a log file to be sent to a database server for storage, and when a subsequent chip burning terminal burns the chip, the chip burning parameters are obtained from the database to burn the chip to be burned, so that the burning information is transmitted among different stations, the dynamic value burning and the multi-station information superposition are achieved, and the problem that the dynamic value burning and the multi-station information superposition cannot be achieved by the conventional chip burning method is solved.
FIG. 3 is a flowchart illustrating a third embodiment of a chip burning method according to the present invention. Referring to fig. 3, the chip burning method of the present invention is applied to a server database server and a chip burning terminal of a C-S architecture, and includes:
s301, reading identification information of a chip to be burned currently by the chip burning terminal;
in this embodiment, this step is similar to step S101 of the above method embodiment, and is not described here again.
S302, the chip burning terminal sends a request for obtaining chip burning parameters to a server side database server; the server-side database server stores chip identification and corresponding chip burning parameters in advance, and the request for obtaining the chip burning parameters comprises the current chip identification to be burned;
in this embodiment, this step is similar to step S102 of the above method embodiment, and is not described here again.
S303, the server side database server receives a request for acquiring the chip burning parameters sent by the chip burning terminal; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
in this embodiment, this step is similar to step S201 of the above method embodiment, and is not described here again.
S304, the server side database server obtains the chip burning parameters corresponding to the chip identification in the chip burning parameter obtaining request from the local storage space;
in this embodiment, this step is similar to step S202 of the above method embodiment, and is not described here again.
S305, the server side database server sends the acquired chip burning parameters to a chip burning terminal;
in this embodiment, this step is similar to step S203 of the above method embodiment, and is not described here again.
And S306, the chip burning terminal burns the current chip to be burned according to the chip burning parameters returned by the server side database server.
In this embodiment, this step is similar to step S103 of the above method embodiment, and is not described here again.
In the chip burning method provided by the embodiment, the CS software architecture is used, the test data stores the dynamic parameters such as the key parameters into the database through the test software, and then the chip burning terminal acquires the chip burning parameters from the database to burn the chip to be burned when burning the chip, so that the burning information is transmitted among different stations, the dynamic value burning and the multi-station information superposition are achieved, and the problem that the dynamic value burning and the multi-station information superposition cannot be realized by the conventional chip burning method is solved.
FIG. 4 is a schematic structural diagram of a chip burning system according to a first embodiment of the invention. Referring to fig. 4, the chip burning system of the present invention is a chip burning terminal 1 connected to a server database server through a C-S architecture, and includes:
the identification information acquisition module 11 is used for reading the identification information of the current chip to be burned;
a parameter request sending module 12, configured to send a request for obtaining chip burning parameters to the server database server 2; the server side database server 2 pre-stores chip identifiers and corresponding chip burning parameters, and the request for obtaining the chip burning parameters comprises the current chip identifiers to be burned;
wherein, the chip burning parameters at least comprise: and testing WS data and a final testing FT result of the chip wafer.
And the burning module 13 is used for burning the current chip to be burned according to the chip burning parameters returned by the server side database server 2.
The server database server 2 and the chip burning terminal 1 transmit data in a socket mode.
FIG. 5 is a schematic structural diagram of a second embodiment of a chip burning system. Referring to fig. 5, the chip burning system of the present invention is used for a server database server connected to a chip burning terminal through a C-S architecture, and includes:
a parameter request receiving module 21, configured to receive a request for obtaining chip burning parameters from the chip burning terminal 1; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
the parameter retrieval module 22 is configured to obtain, from the local storage space, the chip burning parameter corresponding to the chip identifier in the request for obtaining the chip burning parameter;
and the parameter sending module 23 is configured to send the acquired chip burning parameters to the chip burning terminal 1, so that the chip burning terminal burns a chip to be burned currently.
FIG. 6 is a schematic structural diagram of a third embodiment of a chip burning system. Referring to fig. 6, in this embodiment, based on the structure of the second embodiment of the device for screening chips in a hierarchical manner of the present invention, the chip burning system further includes:
the test parameter storage module 24 is used for receiving and storing the log file uploaded by the chip test terminal; the log file comprises local key test parameters of the chip burning terminal.
The embodiment of the invention also provides the electronic equipment. Fig. 7 is a schematic structural diagram of an embodiment of an electronic device of the present invention, which can implement the processes of the embodiments shown in fig. 1, 2, and 3 of the present invention, and as shown in fig. 7, the electronic device may include: the device comprises a shell 41, a processor 42, a memory 43, a circuit board 44 and a power circuit 45, wherein the circuit board 44 is arranged inside a space enclosed by the shell 41, and the processor 42 and the memory 43 are arranged on the circuit board 44; a power supply circuit 45 for supplying power to each circuit or device of the electronic apparatus; the memory 43 is used for storing executable program code; the processor 42 reads the executable program code stored in the memory 43 to run a program corresponding to the executable program code, so as to execute the chip burning method according to any of the foregoing embodiments.
The electronic device exists in a variety of forms, including but not limited to:
(1) a mobile communication device: such devices are characterized by mobile communications capabilities and are primarily targeted at providing voice, data communications. Such terminals include: smart phones (e.g., iphones), multimedia phones, functional phones, and low-end phones, among others.
(2) Ultra mobile personal computer device: the equipment belongs to the category of personal computers, has calculation and processing functions and generally has the characteristic of mobile internet access. Such terminals include: PDA, MID, and UMPC devices, etc., such as ipads.
(3) A portable entertainment device: such devices can display and play multimedia content. This type of device comprises: audio and video playing modules (such as an iPod), handheld game consoles, electronic books, and intelligent toys and portable car navigation devices.
(4) A server: the device for providing the computing service comprises a processor, a hard disk, a memory, a system bus and the like, and the server is similar to a general computer architecture, but has higher requirements on processing capacity, stability, reliability, safety, expandability, manageability and the like because of the need of providing high-reliability service.
(5) And other electronic equipment with data interaction function.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, as for the apparatus embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
For convenience of description, the above devices are described separately in terms of functional division into various units/modules. Of course, the functionality of the units/modules may be implemented in one or more software and/or hardware implementations of the invention.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like.
The above description is only an embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (15)
1. A chip burning method is used for a chip burning terminal connected with a server side database server through a C-S framework, and is characterized by comprising the following steps:
reading the identification information of the current chip to be burned;
sending a request for acquiring chip burning parameters to a server of a server database; the server-side database server stores chip identification and corresponding chip burning parameters in advance, and the request for obtaining the chip burning parameters comprises the current chip identification to be burned;
and burning the current chip to be burned according to the chip burning parameters returned by the server of the server database.
2. The chip burning method of claim 1, wherein the chip burning parameters at least comprise: and testing WS data and a final testing FT result of the chip wafer.
3. The chip burning method according to claim 1, wherein the server-side database server and the chip burning terminal transmit data in a socket manner.
4. A chip burning method is used for a server side database server connected with a chip burning terminal through a C-S architecture, and is characterized by comprising the following steps:
receiving a request for acquiring chip burning parameters sent by a chip burning terminal; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
obtaining chip burning parameters corresponding to the chip identification in the chip burning parameter obtaining request from a local storage space;
and sending the acquired chip burning parameters to a chip burning terminal so that the chip burning terminal burns the current chip to be burned.
5. The chip burning method of claim 4, further comprising:
receiving and storing a log file uploaded by a chip test terminal; the log file comprises local key test parameters of the chip burning terminal.
6. The chip burning method according to claim 4, wherein the server-side database server and the chip burning terminal transmit data through a socket manner.
7. The chip burning method according to claim 5, wherein the server-side database server and the chip testing terminal transmit data in a socket manner.
8. A chip burning system is used for a chip burning terminal connected with a server database server through a C-S architecture, and is characterized by comprising:
the identification information acquisition module is used for reading the identification information of the current chip to be burned;
the parameter request sending module is used for sending a request for acquiring the chip burning parameters to a server side database server; the server-side database server stores chip identification and corresponding chip burning parameters in advance, and the request for obtaining the chip burning parameters comprises the current chip identification to be burned;
and the burning module is used for burning the current chip to be burned according to the chip burning parameters returned by the server side database server.
9. The system of claim 8, wherein the chip burning parameters at least include: and testing WS data and a final testing FT result of the chip wafer.
10. The chip burning system of claim 8, wherein the server-side database server and the chip burning terminal transmit data through a socket.
11. A chip burning system is used for a server side database server connected with a chip burning terminal through a C-S architecture, and is characterized by comprising:
the parameter request receiving module is used for receiving a request for acquiring the chip burning parameters sent by the chip burning terminal; the request for obtaining the chip burning parameters comprises a current chip identifier to be burned;
the parameter retrieval module is used for acquiring the chip burning parameters corresponding to the chip identifiers in the chip burning parameter acquisition request from a local storage space;
and the parameter sending module is used for sending the acquired chip burning parameters to the chip burning terminal so as to enable the chip burning terminal to burn the current chip to be burned.
12. The system of claim 11, further comprising:
the test parameter storage module is used for receiving and storing the log file uploaded by the chip test terminal; the log file comprises local key test parameters of the chip burning terminal.
13. The system of claim 11, wherein the server database server and the chip burning terminal transmit data via a socket.
14. The system of claim 12, wherein the server-side database server and the chip testing terminal transmit data via a socket.
15. An electronic device, characterized in that the electronic device comprises: the device comprises a shell, a processor, a memory, a circuit board and a power circuit, wherein the circuit board is arranged in a space enclosed by the shell, and the processor and the memory are arranged on the circuit board; a power supply circuit for supplying power to each circuit or device of the electronic apparatus; the memory is used for storing executable program codes; the processor executes a program corresponding to the executable program code by reading the executable program code stored in the memory, and is used for executing the chip burning method of any one of the preceding claims 1 to 7.
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