CN112449288B - Flexible circuit board, speaker and electronic equipment - Google Patents
Flexible circuit board, speaker and electronic equipment Download PDFInfo
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- CN112449288B CN112449288B CN201910796665.0A CN201910796665A CN112449288B CN 112449288 B CN112449288 B CN 112449288B CN 201910796665 A CN201910796665 A CN 201910796665A CN 112449288 B CN112449288 B CN 112449288B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
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- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The application provides a flexible circuit board, speaker and electronic equipment, flexible circuit board include first installation department, second installation department and two at least elastic arm, and first installation department is connected through each elastic arm with the second installation department, and each elastic arm is located outside the face at flexible circuit board place. Make the flexible circuit board like this be spatial structure, reduced the whole length of flexible circuit board, through the length that reduces the flexible circuit board, reduced the restriction of flexible circuit board to the magnetic circuit subassembly in the speaker, the flexible circuit board provides the space for setting up the magnetic part, can set up more magnetic parts in the speaker to increase the transduction efficiency of speaker.
Description
Technical Field
The embodiment of the application relates to the field of electronic equipment, in particular to a flexible circuit board, a loudspeaker and electronic equipment.
Background
With the development of communication technology, portable and mobile devices have been developed, and the usage rate of devices related to audio functions is higher and higher. The audio-frequency related equipment has a plurality of entertainment functions such as video playing, digital camera shooting, games, GPS navigation and the like. Therefore, there is a need for audio related devices with good audio play-out performance and increasingly sophisticated and compact spatial structures. In audio related devices, it is often necessary to equip a speaker for the playback of audio signals.
As consumer demand for sound quality of portable and mobile devices increases, micro-speakers need to be designed with larger amplitudes. To avoid fatigue fracture of the flexible circuit board of the speaker at large amplitudes to reduce stress of the flexible circuit board, the flexible circuit board is increased in size. However, for miniature speakers, the oversized size of the flexible circuit board results in limited magnetic path space within the speaker, thereby reducing the transduction efficiency of the speaker.
Disclosure of Invention
The embodiment of the application provides a flexible circuit board, a loudspeaker and electronic equipment, which can reduce the limitation of the flexible circuit board on a magnetic circuit component in the loudspeaker and increase the transduction efficiency of the miniature loudspeaker.
In a first aspect, an embodiment of the present application provides a flexible circuit board, where the flexible circuit board includes a first mounting portion, a second mounting portion, and at least two elastic arms, the first mounting portion is connected to the second mounting portion through each elastic arm, and each elastic arm is located outside a surface where the flexible circuit board is located. Make the flexible circuit board like this be spatial structure, reduced the whole length of flexible circuit board, through the length that reduces the flexible circuit board, reduced the restriction of flexible circuit board to the magnetic circuit subassembly in the speaker, the flexible circuit board provides the space for setting up the magnetic part, can set up more magnetic parts in the speaker to increase the transduction efficiency of speaker.
In a possible implementation manner of the first aspect, the elastic arm has a first connection portion, a connection arm, and a second connection portion, the first connection portion and the second connection portion are connected through the connection arm, the first connection portion is connected with the first installation portion, the second connection portion is connected with the second installation portion, and the connection arm is located outside a surface where the flexible circuit board is located.
In one possible embodiment of the first aspect, the connecting arm is arc-shaped, and a distance between an arc top of the connecting arm and the first connecting portion is greater than or equal to 0.2 and less than or equal to 0.6 mm. The connecting arm is arranged to be arc-shaped, so that stress concentration of the flexible circuit board is reduced, and the strength of the flexible circuit board is improved.
In one possible embodiment of the first aspect, each connection arm is located on the same side of the flexible circuit board; alternatively, the connection arms are located on opposite sides of the flexible circuit board, respectively.
In a possible embodiment of the first aspect, the number of the elastic arms is two, and the two elastic arms are symmetrically arranged. The two elastic arms which are symmetrically arranged are stressed evenly during vibration.
In one possible embodiment of the first aspect, the connecting arm has a width greater than or equal to 0.25 and less than or equal to 0.6mm and a length greater than or equal to 4mm and less than or equal to 9 mm.
In a possible embodiment of the first aspect, the second mounting portion has a connection area and at least two welding areas, the connection area is located between the welding areas, and the number of the elastic arms is equal to the number of the welding areas.
In a possible embodiment of the first aspect, each welding area has an angle with the connection area, and the connection area is parallel to the first mounting portion. Be about to welding area setting of bending, like this, can further save the space that flexible circuit board occupy, for setting up the magnetic part and providing the space, can set up more magnetic parts in the speaker to increase the transduction efficiency of speaker.
In a possible embodiment of the first aspect, the welding zones are parallel to each other, and the angle between the welding zone and the connection zone is greater than or equal to 30 ° and less than or equal to 90 °.
In one possible embodiment of the first aspect, the first connection portion and/or the second connection portion have a bending region, and the bending region is located within a surface where the flexible circuit board is located. Through setting up the region of buckling, reduce the stress that flexible circuit board produced when the vibration.
In a second aspect, an embodiment of the present application provides a speaker, where the speaker includes a frame, and a magnetic circuit assembly, a vibration assembly and the flexible circuit board provided in the foregoing embodiments, which are located on the frame;
the first installation part of the flexible circuit board is connected with the basin frame, the second installation part of the flexible circuit board is connected with the vibration assembly, and the elastic arm is located between the basin frame and the vibration assembly. The basin frame passes through the flexible circuit board with the vibration subassembly and is connected, and the flexible circuit board is spatial structure, has reduced the whole length of flexible circuit board, through the length that reduces the flexible circuit board, has reduced the restriction of flexible circuit board to the interior magnetic circuit subassembly of speaker, and the flexible circuit board provides the space for setting up the magnetic part, can set up more magnetic parts in the speaker to increase the transduction efficiency of speaker.
In a possible embodiment of the second aspect, the vibration assembly includes a diaphragm and a voice coil for driving the diaphragm to vibrate and generate sound, and the voice coil is connected to the second mounting portion.
In one possible embodiment of the second aspect, the voice coil is bonded to the second mounting portion.
In one possible embodiment of the second aspect, the second mounting portion has at least two soldering regions and a connection region between the soldering regions, and the voice coil includes voice coil leads, and the voice coil leads are soldered in either of the soldering regions.
In one possible embodiment of the second aspect, a first surface of the connection region is bonded to the voice coil, the voice coil lead is soldered to a second surface of any of the soldering regions, the first surface of the connection region and the first surface of the soldering region are located on the same surface of the second mounting portion, the first surface of the soldering region is opposite to the second surface of the soldering region, and the first surface of the soldering region is parallel to the second surface of the soldering region.
In a possible embodiment of the second aspect, the first surface of the connection region and the first surface of the soldering region lie in the same plane.
In a possible embodiment of the second aspect, the first surface of the connection region and the first surface of the welding region have an angle therebetween. Therefore, the space occupied by the flexible circuit board can be further saved, space is provided for arranging the magnetic parts, and more magnetic parts can be arranged in the loudspeaker so as to increase the transduction efficiency of the loudspeaker.
In a possible embodiment of the second aspect, the angle between the first surface of the connection region and the first surface of the welding region is greater than or equal to 30 ° and less than or equal to 90 °.
In one possible embodiment of the second aspect, the number of the flexible circuit boards is two, and the two flexible circuit boards are respectively connected to two opposite sides of the voice coil. Therefore, the symmetry inside the loudspeaker can be kept, the stress inside the loudspeaker is uniform, and the loudspeaker can produce sound better.
In one possible embodiment of the second aspect, the voice coil is in the form of a rectangular frame, and the two flexible circuit boards are connected to two opposite short sides of the voice coil. Like this, can save the manufacturing cost of flexible circuit board, and keep the inside symmetry of speaker, make the inside atress of speaker even, be favorable to the better sound production of speaker.
In one possible embodiment of the second aspect, the magnetic circuit assembly includes a main magnet and secondary magnets respectively disposed on both sides of the main magnet, a magnetic gap is formed between the main magnet and the secondary magnets, and the voice coil is located in the magnetic gap.
In a third aspect, an embodiment of the present application provides an electronic device, which includes an electronic device body and the speaker provided in the foregoing embodiment, where the speaker is located in the electronic device body.
The application provides a flexible circuit board, speaker and electronic equipment, flexible circuit board includes first installation department, second installation department and two at least elastic arms, first installation department and second installation department are connected to each elastic arm, each elastic arm position is outside the face at flexible circuit board place, so that flexible circuit board is spatial structure, flexible circuit board's whole length has been reduced, length through reducing flexible circuit board, the restriction of flexible circuit board to the magnetic circuit subassembly in the speaker has been reduced, flexible circuit board provides the space for setting up the magnetic part, can set up more magnetic parts in the speaker, in order to increase the transduction efficiency of speaker.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a first connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a second connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a third connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a fourth connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a fifth connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 7 is a schematic diagram illustrating a position of a first connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 8 is a schematic diagram illustrating a position of a second connection arm in a flexible circuit board according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of a speaker according to an embodiment of the present application;
FIG. 12 is a cross-sectional view A-A of FIG. 11;
fig. 13 is a schematic internal structural diagram of a speaker according to an embodiment of the present application;
fig. 14 is an exploded view of a speaker according to an embodiment of the present application;
fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Description of reference numerals:
10-a flexible circuit board;
11-a first mounting portion;
12-a second mounting portion; 121-a connecting region; 122-a welding area;
13-a tension arm; 131-a first connection; 132-a connecting arm; 133-a second connecting portion; 134-a bending region;
20-a loudspeaker;
21-a basin stand;
22-a magnetic circuit assembly; 221-a main magnet; 222-a secondary magnet; 223-magnetic gap; 224-pole core;
23-a vibrating assembly; 231-ball top; 232-a voice coil; 233-folding ring;
30-electronic device body.
Detailed Description
In order to make the technical solution and the clarity of the embodiments of the present application clearer, the following explains terms referred to in the embodiments of the present application.
A Flexible Printed Circuit Board (FPCB) is also called a "Flexible Board", and the Flexible Circuit Board may also be called an FPC. The flexible circuit board is a printed circuit board made of a flexible insulating base material. The flexible circuit board has the characteristics of light weight and thin thickness. The flexible circuit board is mainly used in electronic products such as mobile phones, notebook computers, digital cameras and the like. The flexible circuit board is divided into a single-layer board, a double-layer board, a single-face board and a double-face board according to the layer number division of the conductive copper foil.
The single-sided flexible circuit board is formed by covering a layer of protective film on a single-sided PI copper clad plate material after the circuit is completed, and the flexible circuit board only has a single-layer conductor.
The speaker is also called a horn. Is a commonly used electroacoustic transducer. The speakers are classified into dynamic speakers (i.e., moving coil speakers), electrostatic speakers (i.e., capacitive speakers), electromagnetic speakers (i.e., reed speakers), and piezoelectric speakers (i.e., crystal speakers) according to the transduction principle of the speakers.
The principle of moving-coil loudspeaker is that a permanent magnet with high strength is arranged in the loudspeaker to continuously release magnetic force, magnetic induction lines are distributed around the permanent magnet, meanwhile, a winding coil is attached to a circular diaphragm in a spaced mode, the coil penetrates through the permanent magnet, when the coil passes through current, the coil generates magnetic force, the magnetic force and the magnetic field of the permanent magnet repel each other or attract each other to generate vibration, and the coil is attached to the circular diaphragm to drive the diaphragm to vibrate and make sound.
"and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural.
"plurality" means two or more.
In addition, in the present application, the terms "first," "second," "third," and the like (if any) are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.
The loudspeaker comprises a supporting component, a magnetic circuit component and a vibration component, wherein the magnetic circuit component and the vibration component are supported by the supporting component. The vibration assembly includes a voice coil inserted into the magnetic circuit assembly and a voice coil lead. However, the voice coil lead has poor fatigue resistance, and is easy to break under the working condition of large amplitude of the loudspeaker. In the prior art, the flexible circuit board is adopted to replace a voice coil lead, the flexible circuit board is not easy to break, and the problem that the voice coil lead is easy to break under the working condition of reducing the large amplitude of the loudspeaker is solved. The flexible circuit board is of a planar structure, the stress of the flexible circuit board is large when the flexible circuit board is bent in a vibrating mode, the flexible circuit board is required to be provided with a long bending area, and the size of the flexible circuit board is increased. However, for a micro-speaker, the size of the flexible circuit board is too large, which results in the limited magnetic circuit space in the speaker, and affects the size of the magnetic circuit, thereby reducing the transduction efficiency of the speaker.
In order to solve the problem, the application provides a flexible circuit board, flexible circuit board includes first installation department, second installation department and two at least elastic arms, first installation department and second installation department are connected to each elastic arm, each elastic arm portion is located outside the face at flexible circuit board place, so that flexible circuit board is spatial structure, flexible circuit board's whole length has been reduced, length through reducing flexible circuit board, the restriction of flexible circuit board to the magnetic circuit subassembly in the speaker has been reduced, flexible circuit board provides the space for setting up the magnetic part, can set up more magnetic parts in the speaker, in order to increase the transduction efficiency of speaker.
For convenience of description, the following embodiments take the flexible circuit board as an example for detailed description, and the implementation manner of the flexible circuit board applied to other devices is similar, and this embodiment is not described herein again.
The following describes in detail an implementation of the flexible printed circuit board provided in the present application with reference to embodiments.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application. It should be noted that fig. 1 is merely an exemplary illustration, and the flexible circuit board 10 of the present application is not limited to this manner. Referring to fig. 1, the flexible circuit board 10 provided in this embodiment includes a first mounting portion 11, a second mounting portion 12, and at least two elastic arms 13, where the first mounting portion 11 is connected to the second mounting portion 12 through each elastic arm 13, and each elastic arm 13 is partially located outside a surface where the flexible circuit board 10 is located.
The flexible circuit board 10 is applied to a speaker 20 (for example, the speaker 20 shown in fig. 11 to 14 described below), where the speaker 20 includes a frame 21, and a magnetic circuit component 22 and a vibration component 23 located in the frame 21, the vibration component 23 includes a diaphragm and a voice coil 232 for driving the diaphragm to vibrate and generate sound, and a specific structure of the speaker 20 is described in detail in the embodiment shown in fig. 11 to 14 described below, and is not described again here.
When the flexible circuit board 10 is mounted in the speaker 20, the first mounting portion 11 is connected to the frame 21 of the speaker 20, and the second mounting portion 12 is connected to the voice coil 232 of the speaker 20. Specifically, the first mounting portion 11 is bonded to the frame 21 of the speaker 20, and a part of the second mounting portion 12 is bonded to the voice coil 232 of the speaker 20. In order to ensure the stability of the above bonding, the bonding surface of the first mounting portion 11 and the frame 21 of the speaker 20, and the bonding surface of a part of the second mounting portion 12 and the voice coil 232 of the speaker 20 are both planar, that is, the bonding surface of the frame 21 and the first mounting portion 11 is a planar surface, the bonding surface of the voice coil 232 and the second mounting portion 12 is a planar surface, and the first mounting portion 11 and the second mounting portion 12 are both planar structures. Alternatively, the first mounting portion 11 and the second mounting portion 12 are located in the same plane.
The quantity of the elastic arm 13 can be a plurality of, the first installation part 11 is connected with the second installation part 12 through a plurality of elastic arms 13, the first end of each elastic arm 13 is connected with the first installation part 11, and the second end of each elastic arm 13 is connected with the second installation part 12. A portion of each elastic arm 13 may be a planar structure, and a portion of each elastic arm 13, which is a planar structure, is located in the same plane as the first mounting portion 11 and the second mounting portion 12, and another portion of each elastic arm 13 is located outside the plane of the flexible circuit board 10, that is, another portion of each elastic arm 13 is located in the plane of the first mounting portion 11, the second mounting portion 12 and a portion of the elastic arm 13.
Optionally, the number of the elastic arms 13 is even, that is, the number of the elastic arms 13 is two, four, six, or more than six.
As shown in fig. 1, 11 to 14, since the positions of the voice coil 232 and the frame 21 in the speaker 20 are fixed, that is, the distance between the first mounting portion 11 connected to the frame 21 and the second mounting portion 12 connected to the voice coil 232 is fixed, when the length of the second mounting portion 12 is fixed, a position a of the elastic arm 13 in fig. 1, that is, a portion of the elastic arm 13 located outside the surface where the flexible circuit board 10 is located, is pressed, and the portion of the elastic arm 13 located outside the surface where the flexible circuit board 10 is located extends to both sides of the first mounting portion 11 until the elastic arm 13 is located entirely inside the surface where the flexible circuit board 10 is located, and the length of the first mounting portion 11 is increased, which results in an increase in the overall length of the flexible circuit board 10. Therefore, the present embodiment provides the flexible circuit board 10 having an overall length smaller than that of the prior art flexible circuit board having a planar structure, with the same length of the elastic arm 13.
The flexible circuit board 10 that this embodiment provided includes first installation department 11, second installation department 12 and two at least elastic arm 13, first installation department 11 and second installation department 12 are connected to each elastic arm 13, each elastic arm 13 part is located outside the face at flexible circuit board 10 place, so that flexible circuit board 10 is spatial structure, the whole length of flexible circuit board 10 has been reduced, through reducing the length of flexible circuit board 10, the restriction of flexible circuit board 10 to circuit subassembly 22 in speaker 20 has been reduced, flexible circuit board 10 provides the space for setting up the magnetic part, can set up more magnetic parts in speaker 20, in order to increase the transduction efficiency of speaker.
The flexible circuit board 10 of this embodiment is connected to the first mounting portion 11 and the second mounting portion 12 through the elastic arms 13. Wherein, each elastic arm 13 is partially positioned outside the surface of the flexible circuit board 10, and the other part of each elastic arm 13 is positioned inside the surface of the flexible circuit board 10. That is, the elastic arm 13 has a portion located within the plane of the flexible circuit board 10, and the elastic arm 13 has a portion located within the plane of the flexible circuit board 10, so as to facilitate the distinction of the portions of the elastic arm 13. In this embodiment, the elastic arm 13 has a first connecting portion 131, a connecting arm 132 and a second connecting portion 133, the first connecting portion 131 and the second connecting portion 133 are connected by the connecting arm 132, the first connecting portion 131 is connected with the first mounting portion 11, the second connecting portion 133 is connected with the second mounting portion 12, and the connecting arm 132 is located outside the surface where the flexible circuit board 10 is located.
As shown in fig. 1, the elastic arm 13 has three parts, namely, a first connecting portion 131, a connecting arm 132 and a second connecting portion 133, a first end of the first connecting portion 131 is connected to the first mounting portion 11, a second end of the first connecting portion 131 is connected to the first end of the connecting arm 132, a second end of the connecting arm 132 is connected to the first end of the second connecting portion 133, and a second end of the second connecting portion 133 is connected to the second mounting portion 12. The first connecting portion 131, the second connecting portion 133 and the second mounting portion 12 are located in a plane where the flexible circuit board 10 is located, and the connecting arm 132 is located outside the plane where the flexible circuit board 10 is located.
The connecting arms 132 may be angled so that the connecting arms 132 are outside the plane of the flexible circuit board 10. The speaker 20 vibrates during operation to vibrate the flexible circuit board 10, so as to avoid stress concentration of the flexible circuit board 10, which may cause the flexible circuit board 10 to break at the stress concentration during vibration. In this embodiment, the connecting arm 132 is arc-shaped, and by setting the connecting arm 132 to be arc-shaped, the stress concentration of the flexible circuit board 10 is reduced, the strength of the flexible circuit board 10 is improved, the amplitude of the speaker 20 is improved, the external radiation capability of the speaker 20 is improved, and the sound quality of the speaker 20 is improved.
In this embodiment, the connecting arm 132 may be C-shaped, S-shaped, or double hump-shaped. To facilitate understanding of the shape of the connecting arm 132, the shape of the connecting arm 132 will be described in detail below with reference to the drawings and specific embodiments.
Fig. 2 is a schematic structural diagram of a first connection arm in a flexible circuit board according to an embodiment of the present application. Referring to fig. 2, in this embodiment, the connecting arm 132 is C-shaped. The C-shaped connecting arm 132 is easy to manufacture, and the C-shaped connecting arm 132 can be obtained only by bending the middle part of the elastic arm 13 once.
Fig. 3 is a schematic structural diagram of a second connection arm in a flexible circuit board according to an embodiment of the present application. Referring to fig. 3, in this embodiment, the connecting arm 132 is S-shaped, with an added bend relative to the C-shaped connecting arm 132 of fig. 2. The S-shaped connecting arm 132 is suitable for a connecting arm 132 with a long length, and the connecting arm 132 with the S-shaped length can be obtained by bending the middle part of the elastic arm 13 twice, wherein the bending directions of the two times are opposite, and the radii of the two times of bending are the same.
Fig. 4 is a schematic structural diagram of a third connection arm in a flexible circuit board according to an embodiment of the present application. Referring to fig. 4, in this embodiment, the connecting arm 132 is double-humped, adding one bend to the S-shaped connecting arm 132 of fig. 3. The double-humped connecting arm 132 is increased in length relative to the S-shaped connecting arm 132 shown in fig. 3, and needs to be bent three times in the middle of the elastic arm 13, the first bending direction and the third bending direction are the same, the second bending direction is opposite to the first bending direction, and the radii of the three times of bending are the same, so that the double-humped connecting arm 132 can be obtained.
Fig. 5 is a schematic structural diagram of a fourth connection arm in a flexible circuit board according to an embodiment of the present application. Referring to fig. 5, in the present embodiment, the elastic arm 13 is formed in the same manner as the elastic arm 13 in fig. 3, and the elastic arm 13 in the present embodiment is different from the elastic arm 13 in fig. 3 in that the radius of the two bends in the present embodiment is different.
Fig. 6 is a schematic structural diagram of a fifth connection arm in a flexible circuit board according to an embodiment of the present application. Referring to fig. 6, in the present embodiment, the elastic arm 13 is formed in the same manner as the elastic arm 13 of fig. 4, and the elastic arm 13 of the present embodiment is different from the elastic arm 13 of fig. 4 in that the radii of the three bends of the present embodiment are sequentially decreased.
The shape of the connecting arm 132 is not limited to the above embodiment, and the above embodiment is only partially illustrated. When the number of the connecting arms 132 is plural, the shapes of the connecting arms 132 may be the same, and the shapes of the connecting arms 132 may also be different, which is not limited herein.
The number of times of bending the connecting arm 132 is determined according to the length of the connecting arm 132, and the longer the length of the connecting arm 132, the greater the number of times of bending the connecting arm 132.
The thickness of the flexible circuit board 10 is greater than or equal to 0.08mm and less than or equal to 0.16mm, and in order to avoid the collapse of the connection arm 132 after bending, in the embodiment, the distance between the arc top of the connection arm 132 and the first connection portion 131 is greater than or equal to 0.2mm and less than or equal to 0.6 mm. That is, the height of the arc-shaped connecting arm 132 is greater than or equal to 0.2mm and less than or equal to 0.6mm, that is, the distance between the arc top of the arc-shaped connecting arm 132 and the surface on which the flexible circuit board 10 is located is greater than or equal to 0.2mm and less than or equal to 0.6 mm.
In this embodiment, the number of the connection arms 132 may be multiple, and fig. 7 is a schematic diagram illustrating the position of the first connection arm in the flexible circuit board according to an embodiment of the present application. In a particular implementation, each connection arm 132 is located on the same side of the flexible circuit board 10, as shown in fig. 1 and 7. Specifically, as shown in fig. 1, each of the connection arms 132 is bent toward the upper side of the upper surface of the flexible circuit board 10, or each of the connection arms 132 is bent toward the lower side of the lower surface of the flexible circuit board 10, as long as the connection arm 132 is located outside the surface on which the flexible circuit board 10 is located. When the connecting arms 132 are located on the same side of the flexible circuit board 10, the connecting arms 132 can be bent at the same time, so that the connecting arms 132 can be manufactured conveniently.
Fig. 8 is a schematic diagram illustrating a position of a second connection arm in a flexible circuit board according to an embodiment of the present application. Referring to fig. 8, the connection arms 132 are located on opposite sides of the flexible circuit board 10, respectively. Specifically, a part of the plurality of connection arms 132 is bent toward the upper side of the upper surface of the flexible circuit board 10, and the remaining part of the plurality of connection arms 132 is bent toward the lower side of the lower surface of the flexible circuit board 10. In a specific implementation, the connecting arms 132 are selected to have different positions according to the internal space of the speaker 20, and the embodiment is not limited herein.
As shown in fig. 1, the number of the elastic arms 13 is two, and the two elastic arms 13 are symmetrically disposed. I.e. the two spring arms 13 have the same shape but different bending directions. The two elastic arms 13 which are symmetrically arranged are stressed evenly during vibration. Optionally, the flexible circuit board 10 has a symmetrical structure as shown in fig. 1, so that the flexible circuit board 10 is convenient to manufacture, and the stress of the flexible circuit board 10 is uniform during vibration.
Optionally, the width of the connecting arm 132 is greater than or equal to 0.25mm and less than or equal to 0.6mm, the length of the connecting arm 132 is greater than or equal to 4mm and less than or equal to 9mm, the length of the connecting arm 132 is less than 4mm, and it is difficult to process the connecting arm 132 when the connecting arm 132 is bent into an arc shape, and if the length of the connecting arm 132 is greater than 9mm, the connecting arm 132 is easy to collapse after the connecting arm 132 is bent.
The embodiment of fig. 1 provides a flexible circuit board 10 with reduced stress even if the overall length of the spring arm 13 is shortened by 35%, compared with the prior art flat flexible circuit board. The stress at the maximum amplitude of the speaker 20 using the flexible circuit board 10 provided in the embodiment of fig. 1 is 45Mpa, and the stress at the maximum amplitude of the speaker 20 using the prior art flat flexible circuit board is 57 Mpa.
Fig. 9 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application. Referring to fig. 1 and 9, the second mounting portion 12 has a connecting region 121 and at least two welding regions 122, the connecting region 121 is located between the welding regions 122, and the number of the elastic arms 13 is equal to the number of the welding regions 122. The lead of the voice coil 232 is connected to the welding area 122, because the voice coil 232 has a positive electrode and a negative electrode, at least two welding areas 122 are sequentially arranged, and the two welding areas 122 are respectively and correspondingly connected to the positive electrode and the negative electrode of the voice coil 232. The connection region 121 is for connection with the upper surface of the voice coil 232. In a specific implementation, the connection region 121 is glued to the upper surface of the voice coil 232.
In some speakers 20, the number of the voice coils 232 is at least two, a plurality of voice coils 232 are stacked from top to bottom or from bottom to top, the positive pole and the negative pole of each voice coil 232 may be connected in sequence, and the positive pole and the negative pole of each voice coil 232 may also be connected to the welding region 122, respectively. I.e., the number of weld regions 122 corresponds to the total number of positive and negative poles of each voice coil 232. When the number of the welding areas 122 is plural and the number of the connection areas 121 is one, the connection areas 121 are located between the welding areas 122, that is, the middle portion of the second mounting portion 12 is the connection area 121, and the welding areas 122 are distributed on both sides of the connection area 121. Alternatively, the welding areas 122 are symmetrically distributed on both sides of the connection area 121.
It should be noted that the flexible printed circuit board 10 is formed by covering a protective film on a single-sided PI copper clad laminate after the circuit is completed, and has only a single-layer conductor. A plurality of unconnected circuits are distributed inside the flexible circuit board 10, each circuit corresponds to one elastic arm 13, that is, each elastic arm 13 has one circuit therein, and each elastic arm 13 corresponds to one soldering region 122 on the second mounting portion 12.
Referring to fig. 9, each welding region 122 is angled with respect to the connection region 121, and the connection region 121 is parallel to the first mounting portion 11. I.e., the soldering region 122 is bent, so that the space occupied by the flexible circuit board 10 can be further saved, space is provided for disposing the magnetic member, and more magnetic members can be disposed in the speaker 20 to increase the transduction efficiency of the speaker.
Wherein, each welding area 122 is parallel to each other, and the included angle between the welding area 122 and the connecting area 121 is greater than or equal to 30 degrees and less than or equal to 90 degrees.
Optionally, the angle between the welding area 122 and the connection area 121 is 90 °. Thus, one face of the soldering region 122 can be fully attached to the voice coil 232, which increases the stability of the connection of the flexible circuit board 10 to the coil 232.
Fig. 10 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application. Referring to fig. 10, the first connection portion 121 and/or the second connection portion 133 have a bending region 134, and the bending region 134 is located within a surface where the flexible circuit board 10 is located. Since the positions of the voice coil 232 and the frame 21 in the speaker 20 are fixed, that is, the distance between the first mounting part 11 connected to the frame 21 and the second mounting part 12 connected to the voice coil 232 is fixed. When the length of the elastic arm 13 is long, the connecting arm 132 is bent to be located outside the surface where the flexible circuit board 10 is located, and the first connecting portion 121 and/or the second connecting portion 133 also need to be bent. In order to reduce the stress generated by the flexible circuit board 10 when vibrating, a bending region 134 is provided on the first connection portion 121 and/or the second connection portion 133, wherein the bending region 134 is located within the surface of the flexible circuit board 10.
The bending region 134 is determined according to the length of the elastic arm 13, and when the length of the elastic arm 13 is long, the bending region 134 may be provided only on the first connection portion 121, or the bending region 134 may be provided only on the second connection portion 133, or when the length of the elastic arm 13 is increased, the bending regions 134 may be provided on both the first connection portion 121 and the second connection portion 133.
The bending region 134 may be an arc shape, that is, the first connection portion 121 and/or the second connection portion 133 are bent into an arc shape, and the bending region 134 is located within the surface where the flexible circuit board 10 is located. As the length of the bending region 134 increases, the bending region 134 may be further bent into an S-shape. The present embodiment is not limited herein as long as the stress generated by the flexible circuit board 10 when vibrating can be reduced.
The stress at the maximum amplitude of the speaker 20 using the flexible circuit board 10 provided in the embodiment of fig. 10 is 33Mpa, and the stress at the maximum amplitude of the speaker 20 using the prior art flat flexible circuit board is 57 Mpa.
Fig. 11 is a schematic structural diagram of a speaker according to an embodiment of the present application; FIG. 12 is a cross-sectional view A-A of FIG. 11; fig. 13 is a schematic internal structural diagram of a speaker according to an embodiment of the present application; fig. 14 is an exploded view of a speaker according to an embodiment of the present application. Referring to fig. 11 to 14, the present embodiment provides a speaker 20, and the speaker 20 includes a frame 21, and a magnetic circuit assembly 22, a vibration assembly 23 and the flexible circuit board 10 provided in the above embodiments, which are located in the frame 21. Wherein, the basin frame 21 is used for supporting the magnetic circuit assembly 22 and the vibration assembly 23.
The first installation part 11 of the flexible circuit board 10 is connected with the basin frame 21, the second installation part 12 of the flexible circuit board 10 is connected with the vibration component 23, and the elastic arm 13 of the flexible circuit board 10 is positioned between the basin frame 21 and the vibration component 23.
The specific structure, function and operation principle of the flexible circuit board 10 have been described in detail in the foregoing embodiments, and are not described herein again.
The loudspeaker 20 provided by the embodiment of the application, the loudspeaker 20 comprises a frame 21, and a magnetic circuit assembly 22, a vibration assembly 23 and the flexible circuit board 10 provided by the embodiment which are positioned in the frame 21. The flexible circuit board 10 includes first installation department 11, second installation department 12 and two at least elastic arm 13, first installation department 11 and second installation department 12 are connected to each elastic arm 13, each elastic arm 13 part is located outside the face at flexible circuit board 10 place, so that flexible circuit board 10 is spatial structure, the whole length of flexible circuit board 10 has been reduced, length through reducing flexible circuit board 10, the restriction of flexible circuit board 10 to circuit subassembly 22 in speaker 20 has been reduced, flexible circuit board 10 provides the space for setting up the magnetic part, can set up more magnetic parts in speaker 20, in order to increase speaker 20's transduction efficiency.
Optionally, the vibration assembly 23 includes a diaphragm and a voice coil 232 for driving the diaphragm to vibrate and generate sound, and the voice coil 232 is connected to the second mounting portion 12. When the flexible circuit board 10 is mounted in the speaker 20, the first mounting portion 11 is connected to the frame 21 of the speaker 20, and the second mounting portion 12 is connected to the voice coil 232 of the speaker 20. Wherein, the vibrating diaphragm comprises a top 231 and a folding ring 233 surrounding the top 231.
In this embodiment, the first mounting portion 11 is bonded to the frame 21 of the speaker 20, and a portion of the second mounting portion 12 is bonded to the voice coil 232 of the speaker 20. In order to ensure the stability of the above bonding, the bonding surface of the first mounting portion 11 and the frame 21 of the speaker 20, and the bonding surface of a part of the second mounting portion 12 and the voice coil 232 of the speaker 20 are both planar, that is, the bonding surface of the frame 21 and the first mounting portion 11 is a planar surface, the bonding surface of the voice coil 232 and the second mounting portion 12 is a planar surface, and the first mounting portion 11 and the second mounting portion 12 are both planar structures. Alternatively, the first mounting portion 11 and the second mounting portion 12 are located in the same plane.
Alternatively, in this embodiment, the second mounting portion 12 has at least two soldering regions 122 and a connecting region 121 between the soldering regions 122, and the voice coil 232 has a voice coil lead which is soldered in any of the soldering regions 122.
The voice coil lead of the voice coil 232 has a positive pole and a negative pole, and the positive pole and the negative pole of the voice coil 232 are respectively connected to the welding region 122. I.e., the number of weld regions 122 corresponds to the total number of positive and negative poles of each voice coil 232.
Optionally, in this embodiment, a first surface of the connection region 121 is bonded to the voice coil 232, a voice coil lead is soldered to a second surface of any of the soldering regions 122, the first surface of the connection region 121 and the first surface of the soldering region 122 are located on the same surface of the second mounting portion 12, the first surface of the soldering region 122 is opposite to the second surface of the soldering region 122, and the first surface of the soldering region 122 is parallel to the second surface of the soldering region 122.
Wherein the first surface of the connection region 121 and the first surface of the soldering region 122 are located in the same plane. That is, one surface of the second mounting portion 12 opposite to the voice coil lead is used for soldering, and the other surface is used for bonding with the voice coil 232.
Optionally, in this embodiment, an included angle is formed between the first surface of the connection region 121 and the first surface of the soldering region 122, that is, the soldering region 122 is bent, so that the space occupied by the flexible circuit board 10 can be further saved, a space is provided for disposing the magnetic member, and more magnetic members can be disposed in the speaker 20 to increase the transduction efficiency of the speaker.
Optionally, in this embodiment, an included angle between the first surface of the connection region 121 and the first surface of the welding region 122 is greater than or equal to 30 ° and less than or equal to 90 °. Wherein the angle between the first surface of the connection region 121 and the first surface of the welding region 122 is 90 °. Thus, one face of the soldering region 122 can be fully attached to the voice coil 232, which increases the stability of the connection of the flexible circuit board 10 to the coil 232.
Optionally, in this embodiment, the number of the flexible circuit boards 10 is two, and the two flexible circuit boards 10 are respectively connected to two opposite sides of the voice coil 232, so that the symmetry inside the speaker 20 can be maintained, the force inside the speaker 20 is uniform, and the speaker 20 can sound better.
In the present embodiment, the voice coil 232 has a rectangular frame shape, and the two flexible circuit boards 10 are respectively connected to two short sides of the voice coil 232 opposite to each other. Two short sides opposite to the voice coil 232 are selected to be connected with the flexible circuit board 10, so that the manufacturing cost of the flexible circuit board 10 can be saved, the symmetry inside the loudspeaker 20 is kept, the stress inside the loudspeaker 20 is uniform, and the loudspeaker 20 can produce sound better.
Optionally, in this embodiment, the magnetic circuit assembly 22 includes a main magnet 221 and a secondary magnet 222 respectively disposed at two sides of the main magnet 221, a magnetic gap 223 is formed between the main magnet 221 and the secondary magnet 222, and the voice coil 232 is located in the magnetic gap. Magnetic circuit assembly 22 also includes a pole piece 224 positioned on main magnet 221.
The main magnet 221 is a permanent magnet with high strength and continuously releasing magnetic force, magnetic induction lines are distributed around the main magnet 221, a magnetic gap is formed between the main magnet 221 and the auxiliary magnet 222, the voice coil 232 is located in the magnetic gap, when the voice coil 232 passes through current, the voice coil 232 generates magnetic force, the magnetic force and the magnetic field of the main magnet 221 repel each other or attract each other to generate vibration, and therefore the vibrating diaphragm is driven to vibrate, and the loudspeaker 20 makes sound.
Optionally, the speaker 20 further comprises a porcelain bowl 24, the porcelain bowl 24 is partially inserted into the speaker 10, and the porcelain bowl 24 is used for fixing the magnetic circuit assembly 22.
Fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present application. Referring to fig. 15, an embodiment of the present application provides an electronic device, which includes an electronic device body 30 and the speaker 20 provided in the foregoing embodiment, where the speaker 20 is located in the electronic device body 30.
The detailed structure, function and operation principle of the speaker 20 have been described in detail in the foregoing embodiments, and are not described herein again.
The electronic device may be a smartphone, laptop, tablet, smartwatch, e-book, Virtual Reality (VR) device, Augmented Reality (AR) device, Mixed Reality (MR), and the like.
Next, an electronic device will be described as an example of a smartphone. The electronic device may also include Radio Frequency (RF) circuitry, memory, other input devices, a display screen, sensors, audio circuitry, I/O subsystems, a microphone, and a power supply. In addition, the electronic equipment also comprises a shell structure which can bear force and play a role in protection, so that a user can hold the electronic equipment and protect part or all of the electronic equipment from being seen.
Among other things, the audio circuitry, speaker 20, and microphone may provide an audio interface between a user and the electronic device. The audio circuit can transmit the signal converted from the received audio data to the loudspeaker 20, and the signal is converted into a sound signal by the loudspeaker 20 and output; on the other hand, the microphone converts the collected sound signal into a signal, which is received by the audio circuit and converted into audio data, and then the audio data is output to the radio frequency circuit to be sent to, for example, another mobile phone, or the audio data is output to the memory for further processing.
The speaker 20 includes a frame 21, and a magnetic circuit assembly 22, a vibration assembly 23, and a flexible circuit board 10 located in the frame 21. The first installation part 11 of the flexible circuit board 10 is connected with the basin frame 21, the second installation part 12 of the flexible circuit board 10 is connected with the vibration component 23, and the elastic arm 13 of the flexible circuit board 10 is positioned between the basin frame 21 and the vibration component 23.
The flexible circuit board 10 includes first installation department 11, second installation department 12 and two at least elastic arm 13, first installation department 11 and second installation department 12 are connected to each elastic arm 13, each elastic arm 13 part is located outside the face at flexible circuit board 10 place, so that flexible circuit board 10 is spatial structure, the whole length of flexible circuit board 10 has been reduced, length through reducing flexible circuit board 10, the restriction of flexible circuit board 10 to circuit subassembly 22 in speaker 20 has been reduced, flexible circuit board 10 provides the space for setting up the magnetic part, can set up more magnetic parts in speaker 20, in order to increase speaker 20's transduction efficiency.
Claims (20)
1. A flexible circuit board is characterized by comprising a first mounting part, a second mounting part and at least two elastic arms, wherein the first mounting part and the second mounting part are connected through the elastic arms;
the elastic arm is provided with a first connecting part, a connecting arm and a second connecting part, the first connecting part and the second connecting part are connected through the connecting arm, the first connecting part is connected with the first mounting part, the second connecting part is connected with the second mounting part, and the connecting arm is positioned outside the surface where the flexible circuit board is positioned;
the connecting arm is arc-shaped, the distance between the arc top of the connecting arm and the first connecting part is greater than or equal to 0.2mm and less than or equal to 0.6 mm.
2. The flexible circuit board of claim 1, wherein each of the connection arms is located on a same side of the flexible circuit board; alternatively, the connecting arms are respectively positioned at the opposite sides of the flexible circuit board.
3. The flexible circuit board of claim 2, wherein the number of the elastic arms is two, and the two elastic arms are symmetrically arranged.
4. The flexible circuit board according to any one of claims 1 to 3, wherein the width of the connection arm is greater than or equal to 0.25mm and less than or equal to 0.6mm, and the length of the connection arm is greater than or equal to 4mm and less than or equal to 9 mm.
5. The flexible circuit board of claim 1, wherein the second mounting portion has a connection region and at least two soldering regions, the connection region is located between the soldering regions, and the number of the elastic arms is equal to the number of the soldering regions.
6. The flexible circuit board of claim 5, wherein each soldering region is angled from the connection region, and the connection region is parallel to the first mounting portion.
7. The flexible circuit board of claim 6, wherein the soldering regions are parallel to each other, and an included angle between the soldering region and the connecting region is greater than or equal to 30 ° and less than or equal to 90 °.
8. The flexible circuit board according to any one of claims 1 to 3, wherein the first connection portion and/or the second connection portion has a bending region, and the bending region is located within a surface of the flexible circuit board.
9. A loudspeaker comprising a frame and a magnetic circuit assembly, a vibration assembly and a flexible circuit board of any one of claims 1 to 8 located on the frame;
the first installation department of flexible circuit board with the basin frame is connected, the second installation department of flexible circuit board with the vibration subassembly is connected, and the elastic arm is located the basin frame with between the vibration subassembly.
10. The loudspeaker of claim 9, wherein the vibration assembly comprises a diaphragm and a voice coil for driving the diaphragm to vibrate and generate sound, and the voice coil is connected to the second mounting portion.
11. The speaker of claim 10, wherein the voice coil is bonded to the second mounting portion.
12. The loudspeaker of claim 10 wherein said second mounting portion has at least two solder areas and a connecting area between said solder areas, said voice coil including voice coil leads, said voice coil leads being soldered within any of said solder areas.
13. The loudspeaker of claim 12, wherein a first surface of said attachment region is bonded to said voice coil, said voice coil leads are soldered to a second surface of any of said soldering regions, said first surface of said attachment region is on the same surface of said second mounting portion as said first surface of said soldering region, said first surface of said soldering region is opposite said second surface of said soldering region, and said first surface of said soldering region is parallel to said second surface of said soldering region.
14. The loudspeaker of claim 13, wherein the first surface of the connection region and the first surface of the weld region lie in the same plane.
15. The loudspeaker of claim 13 wherein the first surface of the connection region and the first surface of the weld region have an included angle therebetween.
16. The loudspeaker of claim 15, wherein an angle between the first surface of the connection region and the first surface of the weld region is greater than or equal to 30 ° and less than or equal to 90 °.
17. The speaker of claim 10, wherein the number of the flexible circuit boards is two, and the two flexible circuit boards are respectively connected to two opposite sides of the voice coil.
18. The speaker of claim 17, wherein said voice coil is rectangular frame-shaped, and two of said flexible circuit boards are attached to two opposite short sides of said voice coil, respectively.
19. The speaker of claim 10, wherein the magnetic circuit assembly comprises a main magnet and a secondary magnet disposed on opposite sides of the main magnet, respectively, a magnetic gap being formed between the main magnet and the secondary magnet, the voice coil being located in the magnetic gap.
20. An electronic device comprising an electronic device body and the speaker of any of claims 9-19, the speaker being located within the electronic device body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910796665.0A CN112449288B (en) | 2019-08-27 | 2019-08-27 | Flexible circuit board, speaker and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910796665.0A CN112449288B (en) | 2019-08-27 | 2019-08-27 | Flexible circuit board, speaker and electronic equipment |
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| CN112449288A CN112449288A (en) | 2021-03-05 |
| CN112449288B true CN112449288B (en) | 2022-03-29 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN213661926U (en) * | 2020-11-30 | 2021-07-09 | 瑞声科技(新加坡)有限公司 | Sound production device |
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| CN208924481U (en) * | 2018-08-01 | 2019-05-31 | 瑞声科技(新加坡)有限公司 | Flexible circuit board and mini-sound device |
| CN109862488A (en) * | 2018-12-30 | 2019-06-07 | 瑞声声学科技(深圳)有限公司 | A kind of loudspeaker |
| CN110035362A (en) * | 2018-12-31 | 2019-07-19 | 瑞声科技(新加坡)有限公司 | Loudspeaker |
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| CN202068563U (en) * | 2011-05-19 | 2011-12-07 | 歌尔声学股份有限公司 | Vibration loudspeaker |
| CN202873046U (en) * | 2012-08-21 | 2013-04-10 | 瑞声光电科技(常州)有限公司 | Vibration loudspeaker |
| US9813821B1 (en) * | 2016-06-15 | 2017-11-07 | AAC Technologies Pte. Ltd. | Miniature sound generator |
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