CN112448151B - Antenna stack structure and manufacturing method thereof - Google Patents
Antenna stack structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN112448151B CN112448151B CN201910798460.6A CN201910798460A CN112448151B CN 112448151 B CN112448151 B CN 112448151B CN 201910798460 A CN201910798460 A CN 201910798460A CN 112448151 B CN112448151 B CN 112448151B
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- circuit
- layer
- patch cord
- outer layer
- welding pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Abstract
The invention provides a manufacturing method of an antenna stack structure, which comprises the following steps: providing an antenna module, wherein the antenna module comprises a first outer layer circuit, and the first outer layer circuit comprises at least one first welding pad; providing a transmission line, wherein the transmission line comprises a second outer layer line, and the second outer layer line comprises at least one second welding pad; and electrically connecting each first welding pad with one second welding pad through a conductive material, thereby obtaining the antenna stack structure. The manufacturing method of the antenna stack provided by the invention can reduce the signal loss and reduce the whole volume of the antenna stack. The invention also provides an antenna stack structure.
Description
Technical Field
The invention relates to the field of antennas and transmission lines, in particular to an antenna stack and a manufacturing method thereof.
Background
In the 5G era, the number of antennas required by communication products such as mobile phones is increasing, and currently, the antenna-transmission line-motherboard is generally connected by a board-to-board (B2B) connector, but this will increase loss and cause the overall size of the antenna-transmission line-motherboard to be too large, which is not favorable for the development of communication products such as mobile phones toward thinning.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing an antenna stack, which can reduce signal loss and reduce the overall volume of the antenna stack.
In addition, it is also necessary to provide an antenna stack that can reduce signal loss and reduce the overall volume of the antenna stack.
The invention provides a manufacturing method of an antenna stack structure, which comprises the following steps:
providing an antenna module, wherein the antenna module comprises a first outer layer circuit, and the first outer layer circuit comprises at least one first welding pad;
providing a transmission line, wherein the transmission line comprises a second outer layer line, and the second outer layer line comprises at least one second welding pad; and
and electrically connecting each first welding pad with one second welding pad through a conductive material so as to obtain the antenna stack structure.
The invention also provides an antenna stack, which comprises an antenna module and a transmission line, wherein the antenna module comprises a first outer layer circuit, the first outer layer circuit comprises at least one first welding pad, the transmission line comprises a second outer layer circuit, the second outer layer circuit comprises at least one second welding pad, and each first welding pad is electrically connected with one second welding pad through a conductive material.
The antenna module and the transmission line are connected with the adapter plate through the conductive material, so that the signal loss can be reduced, and the transmission speed is higher. Furthermore, all the insulating layers of the antenna stack are made of materials with low dielectric loss such as liquid crystal compositions, and the dielectric loss of the antenna stack can be reduced. Moreover, since the line width of the third patch cord is greater than the line width of the first patch cord and less than the line width of the second patch cord in the patch panel, the patch panel can be used for connecting antenna modules with smaller pitch (e.g., less than 450 μm). When the adapter plate is omitted, the antenna stack and the transmission line are connected only through the conductive material, and the overall size of the antenna stack is reduced.
Drawings
Fig. 1 is a schematic diagram of an overall structure of an antenna stack according to a preferred embodiment of the present invention.
Fig. 2 is a schematic diagram of an overall structure of an antenna stack according to another embodiment of the present invention.
Fig. 3 is a schematic structural diagram of an interposer according to a preferred embodiment of the present invention.
Fig. 4 is a schematic structural diagram of an interposer according to another embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a second copper-clad substrate according to a preferred embodiment of the invention.
Fig. 6 is a structural diagram illustrating a first conductive trace formed after etching on the third copper foil layer shown in fig. 5.
Fig. 7 is a schematic structural view of the first circuit board and the third copper-clad board shown in fig. 6 after lamination and pressing.
Fig. 8 is a schematic structural view of the fifth copper foil layer shown in fig. 7 after the second through hole is formed and plated.
Fig. 9 is a structural diagram illustrating a second conductive trace formed after etching on the fifth copper foil layer shown in fig. 8.
Fig. 10 is a schematic structural diagram illustrating a third solder mask layer and a fourth solder mask layer formed on the second conductive traces and the fourth copper foil layer shown in fig. 9, respectively.
Fig. 11 is a schematic view of the structure after forming a second outer layer wiring on the second conductive wiring shown in fig. 10.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
The preferred embodiment of the present invention provides a method for manufacturing an antenna stack, which comprises the following steps:
s10, please refer to fig. 2, an antenna module 10 is provided.
The antenna module 10 includes a first outer layer circuit 1, and the first outer layer circuit 1 includes at least one first pad 2.
S20, please refer to fig. 3, a transfer board 20a is provided.
In the present embodiment, the interposer 20a includes a first switching circuit 21 and a second switching circuit 22 electrically connected to the first switching circuit 21. The line width of the second patch cord 22 is greater than the line width of the first patch cord 21. The first switching line 21 includes at least one third pad 211, and the second switching line 22 includes at least one fourth pad 221.
The manufacturing method of the adapter plate 20a comprises the following steps:
s201, providing a first copper clad substrate (not shown), wherein the first copper clad substrate includes a first insulating layer 23, a first copper foil layer (not shown) formed on the first insulating layer 23, and a second copper foil layer (not shown) formed on a surface of the first insulating layer 23 away from the first copper foil layer.
In the present embodiment, the material of the first insulating layer 23 is Liquid Crystal Polymer (LCP).
S202, opening at least one first through hole (not shown) in the first copper foil layer.
The first via hole penetrates the first copper foil layer and the first insulating layer 23.
S203, etching the first copper foil layer to form the first transfer line 21.
Wherein the first transfer line 21 is formed by etching.
And S204, etching the second copper foil layer to form the second transfer line 22.
The second patch cord 22 is formed by etching.
S205, electroplating in each of the first through holes to form a first conductive pillar 24 in each of the first through holes.
The first conductive pillar 24 is used to electrically connect the first switching line 21 and the second switching line 22.
S206, forming a first solder mask layer 25 on the first bonding pad 21, and exposing a portion of the first bonding pad 21 to the first solder mask layer 25 to form the third pad 211.
The first solder mask layer 25 protects the first transfer line 21. The material of the first solder mask layer 25 can be solder mask ink, such as green oil.
S207, forming a second solder mask layer 26 on the second interposer 22, and exposing a portion of the second interposer 22 to the second solder mask layer 26 to form the fourth solder pads 221.
The second solder mask layer 26 is used to protect the second patch cord 22. The second solder mask layer 26 can be solder mask ink, such as green oil.
As shown in fig. 4, in other embodiments, the interposer 20b further includes a second insulating layer 29 and a third patch cord 27 located between the first patch cord 21 and the second patch cord 22, the second insulating layer 29 is located between the second patch cord 22 and the third patch cord 27, and the third patch cord 27 electrically connects the first patch cord 21 and the second patch cord 22. The line width of the third patch cord 27 is greater than the line width of the first patch cord 21 and less than the line width of the second patch cord 22.
S30, please refer to fig. 11, a transmission line 100 is provided.
The transmission line 100 includes a second outer layer wire 62, and the second outer layer wire 62 includes at least one second pad 651.
The manufacturing method of the transmission line 100 comprises the following steps:
s301, referring to fig. 5, a second copper clad substrate 30 is provided, where the second copper clad substrate 30 includes a third insulating layer 301, a third copper foil layer 302 formed on the third insulating layer 301, and a fourth copper foil layer 303 formed on a surface of the third insulating layer 301 away from the third copper foil layer 302.
In this embodiment, the third insulating layer 301 is made of LCP.
S302, referring to fig. 6, the third copper foil layer 302 is etched to form a first conductive trace 40, thereby obtaining a first circuit substrate 50.
Wherein, the first conductive traces 40 are formed by etching.
S303, referring to fig. 7, a fourth insulating layer 601 and a fifth copper foil layer 602 are sequentially formed on the first conductive traces 40.
In this embodiment, the fourth insulating layer 601 is made of LCP.
S304, referring to fig. 8, at least one second through hole (not shown) is opened in the fifth copper foil layer 602, the second through hole penetrates through the third insulating layer 301 and the fourth insulating layer 601, and a second conductive pillar 61 is formed in each second through hole by electroplating.
The second conductive pillar 61 is electrically connected to the fifth copper foil layer 602, the first conductive trace 40 and the fourth copper foil layer 303 respectively.
S305, referring to fig. 9, the fifth copper foil layer 602 is etched to form a second outer layer circuit 62.
Wherein the second outer layer circuit 62 is formed by etching.
S306, etching the fourth copper foil layer 303 to form a third outer layer circuit 66.
Wherein the third outer layer circuit 66 is formed by etching.
S307, referring to fig. 10, a third solder mask 63 is formed on the second outer layer circuit 62, a portion of the second outer layer circuit 62 is exposed to the third solder mask 63 to form the second bonding pad 651, and a fourth solder mask 64 is formed on the third outer layer circuit 66.
The third solder mask 63 is used for protecting the second outer circuit 62, and the fourth solder mask 64 is used for protecting the third outer circuit 66. The third solder mask 63 and the fourth solder mask 64 may be made of solder mask ink, such as green oil.
S308, referring to fig. 11, a gold plating layer 67 is formed on the second pad 651, so as to obtain the transmission line 100.
S40, electrically connecting each of the first pads 2 and one of the second pads 651 through the conductive material 80, thereby obtaining the antenna stack 200.
Specifically, each of the first pads 2 is electrically connected to one of the third pads 211 through the conductive material 80, and each of the fourth pads 221 is electrically connected to one of the second pads 651 through the conductive material 80, so that the antenna module 10 is electrically connected to the transmission line 100. The conductive material 80 includes tin paste or at least one of tin, silver, copper, bismuth, and nickel. In this embodiment, the conductive material 80 is solder paste.
The preferred embodiment of the present invention further provides an antenna stack 200, wherein the antenna stack 200 includes an antenna module 10 and a transmission line 100.
The antenna module 10 includes a first outer layer circuit 1, and the first outer layer circuit 1 includes at least one first pad 2.
The transmission line 100 includes a second outer layer circuit 62, the second outer layer circuit 62 includes at least one second pad 651, and each of the first pads 2 is electrically connected to one of the second pads 651 through a conductive material 80. The conductive material 80 includes tin paste or at least one of tin, silver, copper, bismuth, and nickel. In this embodiment, the conductive material 80 is solder paste.
In the present embodiment, the antenna stack 200 further includes a transfer plate 20a. As shown in fig. 3, the interposer 20a includes a first adapting circuit 21 and a second adapting circuit 22 electrically connected to the first adapting circuit 21, and a line width of the second adapting circuit 22 is greater than a line width of the first adapting circuit 21. The first switching line 21 includes at least one third pad 211, and the second switching line 22 includes at least one fourth pad 221. Each of the first pads 2 is electrically connected to one of the third pads 211 through the conductive material 80, and each of the fourth pads 221 is electrically connected to one of the second pads 651 through the conductive material 80.
In another embodiment, as shown in fig. 4, the patch panel 20b further includes a third patch cord 27 located between the first patch cord 21 and the second patch cord 22, and the third patch cord 27 electrically connects the first patch cord 21 and the second patch cord 22. The line width of the third patch cord 27 is greater than the line width of the first patch cord 21 and less than the line width of the second patch cord 22.
At least one first through hole (not shown) and a first conductive pillar 24 filled in each first through hole are opened in the first insulating layer 23, and the first conductive pillar 24 is electrically connected to the first transfer circuit 21 and the second transfer circuit 22. The first interposer further includes a first solder mask layer 25 disposed on the first interposer 21 and a second solder mask layer 26 disposed on the second interposer 22. The first solder mask layer 25 is used to protect the first interposer 21, and the second solder mask layer 26 is used to protect the second interposer 22. The first solder mask layer 25 and the second solder mask layer 26 can be made of solder mask ink, such as green oil.
The transmission line 100 includes a third outer layer circuit 66, a third insulating layer 301, a first conductive trace 40, a fourth insulating layer 601, and a second outer layer circuit 62 stacked in sequence. In this embodiment, the third insulating layer 301 and the fourth insulating layer 601 are both made of LCP. In other embodiments, the transmission line 100 may be replaced by other high frequency materials with smaller dielectric loss, such as fluorine-based materials or Modified Polyimide (MPI).
At least one second through hole (not shown) and a second conductive pillar 61 filled in each second through hole are opened in the third insulating layer 301 and the fourth insulating layer 601, and the second conductive pillar 61 is electrically connected to the second outer layer circuit 62, the first conductive trace 40 and the third outer layer circuit 66.
The transmission line 100 further includes a third solder mask 63 disposed on the second outer layer circuit 62 and a fourth solder mask 64 disposed on the third outer layer circuit 66. The third solder mask 63 is used for protecting the second outer circuit 62, and the fourth solder mask 64 is used for protecting the third outer circuit 66. The third solder mask 63 and the fourth solder mask 64 may be made of solder mask ink, such as green oil.
The antenna module and the transmission line are connected with the adapter plate through the conductive material, so that the signal loss can be reduced, and the transmission speed is higher. Furthermore, all the insulating layers of the antenna stack are made of materials with low dielectric loss such as liquid crystal compositions, and the dielectric loss of the antenna stack can be reduced. Moreover, since the line width of the third patch cord is greater than the line width of the first patch cord and less than the line width of the second patch cord in the patch panel, the patch panel can be used for connecting antenna modules with smaller pitch (e.g., less than 450 μm).
Referring to fig. 1, the present invention further provides another antenna stack 300, except that a relay board in the antenna stack 300 may be omitted, i.e., the antenna module 10 and the transmission line 100 are connected only by the conductive material 80. The conductive material 80 may be used to connect antenna modules 10 having larger line spacings and may also help reduce the overall volume of the antenna stack 300.
The above description is only an optimized embodiment of the present invention, but the present invention is not limited to this embodiment in practical application. Other modifications and changes to the technical idea of the present invention should be made by those skilled in the art within the scope of the claims of the present invention.
Claims (6)
1. A method for manufacturing an antenna stack, comprising:
providing an antenna module, wherein the antenna module comprises a first outer layer circuit, and the first outer layer circuit comprises at least one first welding pad;
providing a transmission line, wherein the transmission line comprises a second outer layer line, and the second outer layer line comprises at least one second welding pad; and
electrically connecting each first welding pad with one second welding pad through a conductive material so as to obtain the antenna stack structure;
wherein electrically connecting each of the first pads to one of the second pads through a conductive material comprises:
providing an adapter plate, wherein the adapter plate comprises a first adapter circuit and a second adapter circuit electrically connected with the first adapter circuit, the circuit width of the second adapter circuit is greater than that of the first adapter circuit, the first adapter circuit comprises at least one third welding pad, and the second adapter circuit comprises at least one fourth welding pad;
electrically connecting each first welding pad with one third welding pad through the conductive material;
electrically connecting each fourth bonding pad with one of the second bonding pads through the conductive material;
the manufacturing method of the adapter plate comprises the following steps:
providing a first copper-clad substrate, wherein the first copper-clad substrate comprises a first insulating layer, a first copper foil layer formed on the first insulating layer and a second copper foil layer formed on the surface, far away from the first copper foil layer, of the first insulating layer;
etching the first copper foil layer to form the first transfer line;
etching the second copper foil layer to form the second patch circuit;
forming a first solder mask layer on the first transfer circuit, wherein part of the first transfer circuit is exposed to the first solder mask layer to form the third bonding pad; and
forming a second solder mask layer on the second adapter circuit, wherein part of the second adapter circuit is exposed to the second solder mask layer to form a fourth welding pad;
the manufacturing method of the transmission line comprises the following steps:
providing a second copper-clad substrate, wherein the second copper-clad substrate comprises a third insulating layer, a third copper foil layer formed on the third insulating layer and a fourth copper foil layer formed on the surface of the third insulating layer far away from the third copper foil layer;
etching the third copper foil layer to form a first conductive circuit;
sequentially forming a fourth insulating layer and a fifth copper foil layer on the first conductive circuit;
etching the fifth copper foil layer to form the second outer layer circuit;
etching the fourth copper foil layer to form a third outer layer circuit;
and forming a third solder mask layer on the second outer layer circuit, and partially exposing the second outer layer circuit to the third solder mask layer to form the second welding pad.
2. The method of claim 1, wherein the interposer further comprises a second insulating layer and a third patch cord between the first patch cord and the second patch cord, the second insulating layer is between the second patch cord and the third patch cord, the third patch cord electrically connects the first patch cord and the second patch cord, and a cord width of the third patch cord is greater than a cord width of the first patch cord and less than a cord width of the second patch cord.
3. The method of claim 2, wherein the first, second, third, and fourth insulating layers are all made of liquid crystal polymer.
4. An antenna stack is characterized in that the antenna stack comprises an antenna module and a transmission line, the antenna module comprises a first outer layer line, the first outer layer line comprises at least one first welding pad, the transmission line comprises a third outer layer line, a third insulating layer, a first conductive circuit, a fourth insulating layer and a second outer layer line which are sequentially stacked, the second outer layer line comprises at least one second welding pad, at least one second conductive column is arranged in the third insulating layer and the fourth insulating layer, and the second conductive column is electrically connected with the second outer layer line, the first conductive circuit and the third outer layer line;
the antenna stack structure further comprises an adapter plate, the adapter plate comprises a first adapter circuit and a second adapter circuit electrically connected with the first adapter circuit, the circuit width of the second adapter circuit is larger than that of the first adapter circuit, the first adapter circuit comprises at least one third welding pad, the second adapter circuit comprises at least one fourth welding pad, each first welding pad is electrically connected with one of the third welding pads through a conductive material, and each fourth welding pad is electrically connected with one of the second welding pads through the conductive material.
5. The antenna stack of claim 4, wherein the conductive material comprises solder paste or at least one of tin, silver, copper, bismuth, and nickel.
6. The antenna stack of claim 4 wherein the patch panel further comprises a third patch cord between the first patch cord and the second patch cord, the third patch cord electrically connecting the first patch cord and the second patch cord, the third patch cord having a cord width greater than the cord width of the first patch cord and less than the cord width of the second patch cord.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910798460.6A CN112448151B (en) | 2019-08-27 | 2019-08-27 | Antenna stack structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910798460.6A CN112448151B (en) | 2019-08-27 | 2019-08-27 | Antenna stack structure and manufacturing method thereof |
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| CN112448151A CN112448151A (en) | 2021-03-05 |
| CN112448151B true CN112448151B (en) | 2023-03-17 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101390253A (en) * | 2004-10-01 | 2009-03-18 | L.皮尔·德罗什蒙 | Ceramic antenna module and methods of manufacture thereof |
| CN109769344A (en) * | 2017-11-10 | 2019-05-17 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board and the circuit board |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964441B (en) * | 2009-07-24 | 2015-04-15 | 中山市云创知识产权服务有限公司 | Antenna assembly, manufacturing method thereof and shell integrated therewith |
| US8810457B2 (en) * | 2011-06-24 | 2014-08-19 | Taoglas Group Holdings | Orthogonal modular embedded antenna, with method of manufacture and kits therefor |
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2019
- 2019-08-27 CN CN201910798460.6A patent/CN112448151B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101390253A (en) * | 2004-10-01 | 2009-03-18 | L.皮尔·德罗什蒙 | Ceramic antenna module and methods of manufacture thereof |
| CN109769344A (en) * | 2017-11-10 | 2019-05-17 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board and the circuit board |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
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