CN112279507B - Temperature control method and device, electronic equipment and system - Google Patents
Temperature control method and device, electronic equipment and system Download PDFInfo
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- CN112279507B CN112279507B CN202011147052.3A CN202011147052A CN112279507B CN 112279507 B CN112279507 B CN 112279507B CN 202011147052 A CN202011147052 A CN 202011147052A CN 112279507 B CN112279507 B CN 112279507B
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
- C03B37/07—Controlling or regulating
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- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention relates to the technical field of glass fiber manufacturing, in particular to a temperature control method, a device, electronic equipment and a system, wherein the method comprises the steps of obtaining physical property parameters and the current temperature of a glass raw material in a target kiln; predicting the temperature change trend in the target kiln according to the physical performance parameters and the current temperature; and controlling the temperature in the target kiln based on the predicted temperature change trend. According to the temperature control method provided by the embodiment, the temperature change trend in the target kiln is predicted by using the physical property parameters of the glass raw materials and the current parameters, and the physical property parameters of the glass raw materials are combined in the prediction process; and the predicted temperature variation trend is utilized to control the temperature in the target kiln, and the temperature is accurately controlled in real time on the basis of predicting the temperature variation trend so as to ensure that the temperature in the kiln is accurately and timely adjusted.
Description
Technical Field
The invention relates to the technical field of glass fiber manufacturing, in particular to a temperature control method, a temperature control device, electronic equipment and a temperature control system.
Background
In the manufacture of glass fibers, high temperature furnaces are typically used, with which the raw materials are melted and subsequently formed, and in the process, control of the temperature within the furnace is involved. If the temperature is not controlled timely, the quality of the glass fiber product can not meet the requirement. Taking special glass fiber as an example, the special glass fiber is glass fiber drawn by glass of a silicon-aluminum-magnesium system, has excellent performances of elastic modulus draft, good rigidity, breaking elongation and the like compared with the conventional E glass fiber, and is mainly applied to the field of glass fiber reinforced advanced composite materials. Because the special glass has the characteristics of high melting temperature, high glass melt line temperature, high crystallization speed and the like, the forming difficulty of the glass melt and the fiber is far higher than that of the common E glass fiber in production, and the temperature in the production needs to be accurately controlled.
In the prior art, the temperature inside the kiln is generally adjusted by collecting the temperature inside the kiln and comparing the temperature inside the kiln with a preset temperature. However, in this control method, since the current temperature of the kiln is collected and the temperature adjustment amount is obtained by calculation, this calculation process inevitably consumes a certain amount of time, which results in a delay in temperature adjustment and makes it difficult to adjust the temperature in the kiln in real time.
Disclosure of Invention
In view of this, embodiments of the present invention provide a temperature control method, an apparatus, an electronic device, and a storage medium, so as to solve the problem of hysteresis of temperature adjustment in a kiln.
According to a first aspect, an embodiment of the present invention provides a temperature control method, including:
acquiring physical performance parameters and current temperature of glass raw materials in a target kiln;
predicting the temperature change trend in the target kiln according to the physical performance parameters and the current temperature;
and controlling the temperature in the target kiln based on the predicted temperature change trend.
According to the temperature control method provided by the embodiment of the invention, the temperature change trend in the target kiln is predicted by using the physical property parameters of the glass raw materials and the current parameters, and the physical property parameters of the glass raw materials are combined in the prediction process; and the predicted temperature variation trend is utilized to control the temperature in the target kiln, and the temperature is accurately controlled in real time on the basis of predicting the temperature variation trend so as to ensure that the temperature in the kiln is accurately and timely adjusted.
With reference to the first aspect, in a first embodiment of the first aspect, the predicting a temperature trend within a target lehr based on the physical property parameter of the target glass raw material and the current temperature includes:
and inputting the physical property parameters of the target glass raw material and the current temperature into a temperature prediction model, and outputting the temperature change trend in the target kiln.
According to the temperature control method provided by the embodiment of the invention, the temperature change trend in the target kiln is predicted by using the temperature prediction model, the input of the model comprises physical performance parameters and the current temperature, the output of the model is the temperature change trend, and the complex data processing is reduced, so that the temperature change trend can be rapidly determined, and the timely adjustment of the temperature is further ensured.
With reference to the first embodiment of the first aspect, in a second embodiment of the first aspect, the inputting the physical property parameter of the target glass raw material and the current temperature into a temperature prediction model and outputting a temperature variation trend in the target kiln includes:
acquiring structural parameters and technological parameters of the target kiln, wherein the technological parameters comprise at least one of electrical parameters of a temperature control electrode or flow parameters of combustible gas;
and inputting the structural parameters, the process parameters, the physical performance parameters and the current temperature into the temperature prediction model, and outputting the temperature change trend in the target kiln.
According to the temperature control method provided by the embodiment of the invention, in the process of predicting the temperature change trend, the structural parameters and the process parameters of the target kiln are combined, so that the model is customized based on the target kiln, and the accuracy of the prediction result is improved.
With reference to the second embodiment of the first aspect, in a third embodiment of the first aspect, the target kiln is divided into at least 2 temperature control areas, and the temperature variation trend includes a temperature variation trend of each temperature control area.
According to the temperature control method provided by the embodiment of the invention, the temperature change trend of each temperature control area is predicted by dividing the temperature control area of the target kiln, so that each temperature control area is independently controlled, and the accuracy of a temperature control result is further ensured.
With reference to the first aspect or any one of the first to third embodiments of the first aspect, in a fourth embodiment of the first aspect, the controlling the temperature in the target kiln based on the predicted temperature variation tendency includes:
determining the adjustment amount of the process parameters in the target kiln by utilizing the temperature variation trend; wherein the process parameter comprises at least one of an electrical parameter of the temperature-controlled electrode or a flow parameter of the combustible gas;
and controlling the temperature in the target kiln based on the determined adjustment amount of the process parameter.
According to the temperature control method provided by the embodiment of the invention, as the process parameters in the target kiln comprise the electrical parameters of the temperature control electrode and the flow parameters of the combustible gas, the temperature in the target kiln can be controlled by utilizing the flow of the temperature control electrode and the flow of the combustible gas, so that the uniform control of the temperature in the target kiln is realized.
With reference to the fourth embodiment of the first aspect, in the fifth embodiment of the first aspect, the dividing the target kiln into at least 2 temperature control areas, and controlling the temperature in the target kiln based on the determined adjustment amount of the process parameter includes:
controlling the temperature in the first temperature control area by using the electrical parameter of the temperature control electrode corresponding to the first temperature control area in the process parameters, or the electrical parameter of the temperature control electrode corresponding to the first temperature control area and the flow parameter of the combustible gas;
and controlling the temperature in the second temperature control area by using the electrical parameter of the temperature control electrode corresponding to the second temperature control area in the process parameters and/or the flow parameter of the combustible gas corresponding to the second temperature control area.
The temperature control method provided by the embodiment of the invention carries out different temperature control modes based on different temperature control areas, ensures that the temperature control is carried out in combination with each temperature control area, and improves the accuracy of the temperature control.
With reference to the fourth embodiment of the first aspect or the fifth embodiment of the first aspect, in a sixth embodiment of the first aspect, the controlling the temperature in the target kiln based on the determined adjustment amount of the process parameter includes:
and sending the determined adjustment quantity of the process parameter to a temperature adjusting device so that the temperature adjusting device controls the flow of a temperature control electrode or combustible gas in the target kiln to control the temperature in the target kiln.
According to the temperature control method provided by the embodiment of the invention, the adjustment of the process parameters and the temperature control are divided into different devices for processing respectively, so that the distributed processing of the temperature control is realized, and the reliability of the temperature control is ensured.
According to a second aspect, an embodiment of the present invention further provides a temperature control apparatus, including:
the acquisition module is used for acquiring physical performance parameters and the current temperature of a target glass raw material in a target kiln;
the prediction module is used for predicting the temperature change trend in the target kiln according to the physical property parameters of the target glass raw material and the current temperature;
and the control module is used for controlling the temperature in the target kiln based on the predicted temperature change trend.
According to the temperature control device provided by the embodiment of the invention, the temperature change trend in the target kiln is predicted by using the physical property parameters of the glass raw materials and the current parameters, and the physical property parameters of the glass raw materials are combined in the prediction process; and the predicted temperature variation trend is utilized to control the temperature in the target kiln, and the temperature is accurately controlled in real time on the basis of predicting the temperature variation trend so as to ensure that the temperature in the kiln is accurately and timely adjusted.
According to a third aspect, an embodiment of the present invention further provides an electronic device, including:
a memory and a processor, the memory and the processor being communicatively connected to each other, the memory having stored therein computer instructions, and the processor executing the computer instructions to perform the temperature control method according to the first aspect of the present invention or any embodiment of the first aspect.
According to a fourth aspect, the present invention further provides a computer-readable storage medium, which stores computer instructions for causing a computer to execute the temperature control method according to the first aspect of the present invention or any implementation manner of the first aspect.
According to a fifth aspect, an embodiment of the present invention further provides a temperature control system, including:
a target kiln;
the electronic device in the second aspect of the present invention is connected to the temperature control module, and the electronic device is configured to control the temperature control module;
the temperature control assembly is provided with a temperature acquisition device and a temperature adjusting device; the temperature control assembly is used for collecting the temperature in the target kiln and controlling the temperature in the target kiln based on the control of the electronic equipment.
The temperature control system provided by the embodiment of the invention can be used for carrying out constant temperature control on the temperature in the target kiln by predicting the temperature change trend, so that a stable glass liquid flow field and a stable temperature field can be obtained in the target kiln, the process oscillation amplitude caused by the existing or unknown disturbance is reduced, the oscillation period is slowed down, and the stability of the glass melting process and the quality of glass liquid are improved.
With reference to the fifth aspect, in a first embodiment of the fifth aspect, the system further comprises:
the server is respectively connected with the temperature control assembly and the electronic equipment; the temperature control assembly is in communication connection with the electronic equipment through the server.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram showing the construction of a temperature control system in an embodiment of the present invention;
FIG. 2 is a schematic diagram showing the structure of a temperature control system in an embodiment of the present invention;
FIG. 3 shows a schematic structural diagram of a target kiln in an embodiment of the invention;
FIG. 4 is a flow chart of a temperature control method according to an embodiment of the invention;
FIG. 5 is a flow chart of a temperature control method according to an embodiment of the invention;
FIG. 6 is a flow chart of a temperature control method according to an embodiment of the invention;
FIG. 7 is a block diagram of a temperature control apparatus according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a temperature control system, as shown in fig. 1, the system includes a target kiln 100, a temperature control assembly 200, and an electronic device 300. The target kiln 100 is used for melting and forming glass raw materials, the temperature control assembly 200 is used for measuring the temperature in the target kiln 100 and adjusting the temperature of the target kiln 100, and the electronic device 300 is used for adjusting the temperature of the target kiln 100 through the temperature control assembly 200 based on the temperature collected by the temperature control assembly 200.
Specifically, as shown in fig. 2, the temperature control assembly 200 includes a temperature acquisition device 201 and a temperature adjustment device 202. The temperature acquisition devices 201 may be arranged at corresponding temperature measurement positions of the target kiln, and may be 1, 2 or more, and the number and the positions of the specific settings may be correspondingly set according to actual conditions, which is not limited herein.
The temperature acquisition device 201 sends the acquired temperature to the electronic equipment 300, and the electronic equipment 300 predicts the temperature change trend in the target kiln by combining the physical property parameters of the glass raw materials on the basis of the acquired temperature.
After predicting the trend of the temperature in the target kiln, the electronic device 300 may control the operation of the temperature adjustment device 202 based on the trend of the temperature, thereby adjusting the temperature in the target kiln in real time.
The method for predicting the temperature variation trend in the target kiln by the electronic device 300 based on the collected temperature and the physical property parameters of the glass raw material will be described in detail below.
As a specific application example of this embodiment, the temperature Control component 200 may be a Distributed Control System (DCS), and the electronic device 300 may be an Advanced Process Control System (APC).
Specifically, the temperature detection system includes a target kiln 100, a DCS control system, and an APC control system. The heat supply of the target kiln can be an electric heating system, a natural gas pure oxygen combustion system and the like. In the operation process of the temperature detection system, the DCS control system acquires and controls the operation process parameters (such as temperature, electric parameters of a temperature control electrode, or the flow of combustible gas) of a target kiln in real time. And the APC system automatically controls the temperature in the target kiln.
Because the APC control system predicts the temperature variation trend, when the process state of the automatic feeding device of the target kiln changes or the flow of the forming area changes, the APC control system carries out simulation calculation according to the real-time process running condition, thereby predicting the temperature variation trend in the target kiln and realizing the constant temperature control of the temperature of the glass liquid in the target kiln.
In some alternative embodiments of this embodiment, fig. 3 shows an alternative configuration of the target kiln. As shown in fig. 3, the target furnace may be divided into at least 2 temperature controlled zones, such as a glass raw material melting zone, a fining zone, and a forming zone. The glass raw material melting area comprises a feeding port 1, a melting tank chimney 4, a melting tank electrode 2, a throat temperature sensor 3 and a melting tank space temperature sensor 8.
Wherein, glass raw materials get into the melting tank from dog-house 1, and melting tank electrode 2 is used for heating the inside of the melting tank, namely, heats the inside of the melting tank with the mode of electrical heating. The melting tank space temperature sensor 8 is used for measuring the temperature in the melting tank space, and the throat temperature sensor 3 is used for measuring the temperature of the glass liquid flowing through the throat.
The molten glass melted by the melting tank enters a fining area for fining, and the fining area comprises a passage electrode 5, a passage liquid flow groove 6 and a fining tank temperature sensor 9. The passage electrode 5 is used for heating the glass liquid in the clarifying tank, the passage liquid tank 6 is used for clarifying the glass liquid, and the clarifying tank temperature sensor 9 is used for measuring the temperature of the glass liquid in the clarifying tank.
After passing through the clarifier, the molten glass flows into a forming zone for forming, and the forming zone comprises a forming zone temperature sensor 10. The forming zone temperature sensor 10 is used to measure the temperature in the forming zone. Wherein, according to the whole preparation process of the glass fiber product, the temperature required by each temperature control area in the target kiln is different, therefore, each temperature control area needs to be controlled respectively. For example, the temperature in the melt zone is 1540 ℃, the temperature in the fining zone is 1490 ℃, and the temperature in the forming zone is 1450 ℃.
The temperature detection system of the embodiment performs constant temperature control on the temperature in the target kiln by predicting the temperature change trend, so that a stable glass liquid flow field and a stable temperature field can be obtained in the target kiln, the process oscillation amplitude caused by existing or unknown disturbance is reduced, the oscillation period is slowed down, and the stability of the glass melting process and the quality of glass liquid are improved.
Further, the target kiln in the embodiment can also be used for direct method forming of characteristic glass fibers, when the capacity of the target kiln is changed within a certain range, the process parameters are automatically adjusted to carry out temperature constant temperature control on a specific position, the temperature field and the flow field in the target kiln are stable, the internal temperature fluctuation is +/-3 ℃, and the glass liquid level fluctuation is less than +/-1 mm.
In accordance with an embodiment of the present invention, there is provided a temperature control method embodiment, it is noted that the steps illustrated in the flowchart of the drawings may be performed in a computer system such as a set of computer executable instructions, and that while a logical order is illustrated in the flowchart, in some cases the steps illustrated or described may be performed in an order different than here.
In this embodiment, a temperature control method is provided, which can be used in the above-mentioned electronic devices, such as a computer, a mobile phone, a tablet computer, etc., fig. 4 is a flowchart of the temperature control method according to the embodiment of the present invention, and as shown in fig. 4, the flowchart includes the following steps:
and S11, acquiring physical property parameters and the current temperature of the glass raw material in the target kiln.
The physical property parameters of the glass raw materials comprise batch ingredients, high-temperature viscosity of glass, density of glass, high-temperature electrical conductivity of glass, high-temperature thermal conductivity of glass, specific heat capacity of glass and the like, and can be selected correspondingly according to actual conditions, and which physical property parameter is specifically adopted is not limited at all.
It should be noted that, when the glass raw materials in the target kiln are different, the physical property parameters of the corresponding glass raw materials are also different, and are specifically related to the glass raw materials in the target kiln.
The physical property parameters of the glass raw materials in the target kiln can be stored in the electronic equipment in advance; or the glass fiber product can be obtained in a man-machine interaction mode before the glass fiber product corresponding to the glass raw material is required to be produced, and the like. The specific acquisition mode of the physical property parameters of the glass raw materials is not limited at all, and the specific acquisition mode can be set according to actual conditions.
The current temperature acquired by the electronic equipment is obtained by acquiring the temperature in the target kiln in real time by the temperature detection device, wherein the current temperature is not limited to one current temperature, and can be the current temperatures of two designated positions, or a plurality of designated positions, and the like.
And S12, predicting the temperature change trend in the target kiln according to the physical performance parameters and the current temperature.
The temperature change trend curves corresponding to different glass raw materials in the target kiln can be measured through multiple experiments, for example, the temperature change trend curves corresponding to different glass raw materials can be obtained through a data fitting mode; the temperature prediction model can also be obtained by training in a neural network mode, the input of the model comprises but is not limited to physical performance parameters and the current temperature, and the output is the predicted temperature change trend; other ways of predicting the temperature variation trend in the target kiln may also be used. The temperature trend is used for predicting whether the subsequent temperature should be increased or decreased.
And S13, controlling the temperature in the target kiln based on the predicted temperature change trend.
After predicting the temperature variation trend, the electronic device may form a temperature control instruction based on the temperature variation trend to control the temperature in the target kiln, so that the temperature in the target kiln changes according to the predicted temperature variation trend.
For example, if the electronic device predicts that the subsequent temperature should be increased, the electronic device may generate a temperature control command to increase the voltage or current of the temperature-controlled electrode, or increase the flow rate of the combustible gas, etc.; if the electronic device predicts that the subsequent temperature should be lowered, the electronic device may generate a temperature control command to decrease the voltage or current of the temperature-controlled electrode, or decrease the flow rate of the combustible gas, or the like.
Details about this step will be described later.
According to the temperature control method provided by the embodiment, the temperature change trend in the target kiln is predicted by using the physical property parameters of the glass raw materials and the current parameters, and the physical property parameters of the glass raw materials are combined in the prediction process; and the predicted temperature variation trend is utilized to control the temperature in the target kiln, and the temperature is accurately controlled in real time on the basis of predicting the temperature variation trend so as to ensure that the temperature in the kiln is accurately and timely adjusted.
In this embodiment, a temperature control method is provided, which can be used in the above-mentioned electronic devices, such as a computer, a mobile phone, a tablet computer, etc., fig. 5 is a flowchart of the temperature control method according to the embodiment of the present invention, and as shown in fig. 5, the flowchart includes the following steps:
and S21, acquiring physical property parameters and the current temperature of the glass raw material in the target kiln.
Please refer to S11 in fig. 4 for details, which are not described herein.
And S22, predicting the temperature change trend in the target kiln according to the physical performance parameters and the current temperature.
In the present embodiment, the temperature change tendency in the target kiln is predicted by using the temperature prediction model as an example. The physical property parameters of the target glass raw material and the current temperature can be input into the temperature prediction model, and the temperature change trend in the target kiln can be output.
Specifically, the step S22 includes the following steps:
s221, obtaining structural parameters and technological parameters of the target kiln.
Wherein the process parameter comprises at least one of an electrical parameter of the temperature-controlled electrode or a flow parameter of the combustible gas.
The structural parameters of the target kiln comprise geometric structural parameters such as the size of the target kiln, and the technological parameters represent the electrical parameters of a temperature control electrode of the target kiln or the flow parameters of combustible gas. The electrical parameter includes voltage or current, and the flow parameter of the combustible gas includes flow, flow rate, and the like of the combustible gas.
S222, inputting the structural parameters, the process parameters, the physical performance parameters and the current temperature into a temperature prediction model, and outputting the temperature change trend in the target kiln.
In the training process of the temperature prediction model, adopted training sample data comprise structural parameters, process parameters and the like of the target kiln.
After the temperature prediction model is obtained through training, the electronic equipment inputs the structural parameters, the process parameters, the physical performance parameters and the current temperature into the temperature prediction model, and the temperature change trend in the target kiln can be output through prediction of the temperature prediction model.
And S23, controlling the temperature in the target kiln based on the predicted temperature change trend.
Please refer to S13 in fig. 4 for details, which are not described herein.
According to the temperature control method provided by the embodiment, the temperature change trend in the target kiln is predicted by using the temperature prediction model, the input of the model comprises physical performance parameters and the current temperature, the output is the temperature change trend, and the complex data processing is reduced, so that the temperature change trend can be rapidly determined, and the timely adjustment of the temperature is further ensured.
In this embodiment, a temperature control method is provided, which can be used in the above-mentioned electronic devices, such as a computer, a mobile phone, a tablet computer, etc., fig. 6 is a flowchart of the temperature control method according to the embodiment of the present invention, and as shown in fig. 6, the flowchart includes the following steps:
and S31, acquiring physical property parameters and the current temperature of the glass raw material in the target kiln.
Please refer to S21 in fig. 5, which is not repeated herein.
And S32, predicting the temperature change trend in the target kiln according to the physical performance parameters and the current temperature.
Please refer to S22 in fig. 5, which is not repeated herein.
And S33, controlling the temperature in the target kiln based on the predicted temperature change trend.
Specifically, the step S33 includes the following steps:
and S331, determining the adjustment amount of the process parameters in the target kiln by utilizing the temperature change trend.
Wherein the process parameter comprises at least one of an electrical parameter of the temperature-controlled electrode or a flow parameter of the combustible gas.
And after predicting the temperature change trend in the target kiln, the electronic equipment determines the adjustment quantity of the process parameters in the target kiln by using the obtained current process parameters. For example, a data table may be maintained in the electronic device, and the data table records the relationship between the temperature variation trend and the adjustment amount of the process parameter during the preparation process. The electronic equipment can determine the adjustment quantity of the process parameters in the target kiln by looking up the data table.
And S332, controlling the temperature in the target kiln based on the determined adjustment amount of the process parameter.
As described above, after determining the adjustment amount of the process parameter, the electronic device may send the determined adjustment amount of the process parameter to the temperature adjustment device, so that the temperature adjustment device controls the temperature control electrode or the flow rate of the combustible gas in the target kiln to control the temperature in the target kiln.
The adjustment of the process parameters and the temperature control are divided into different devices for processing respectively, so that the distributed processing of the temperature control is realized, and the reliability of the temperature control is ensured.
As described above, the target kiln is divided into at least 2 temperature control areas, namely, a first temperature control area and a second temperature control area. The heating mode of the first temperature control area is electric heating and combustible gas heating, the heating mode of the second temperature control area is electric heating, and the combustible gas can be natural gas pure oxygen. Accordingly, the electronic device can predict the temperature change trend of each temperature control area by using the temperature prediction model, and after the temperature change trend of each temperature control area is predicted, the process parameter adjustment amount of each temperature control area can be obtained. Therefore, the electronic device can form a process parameter adjustment instruction corresponding to each temperature control area so as to adjust the temperature of each temperature control area respectively.
Specifically, the step S332 may include the following steps:
(1) and controlling the temperature in the first temperature control area by using the electrical parameter of the temperature control electrode corresponding to the first temperature control area in the process parameters, or the electrical parameter of the temperature control electrode corresponding to the first temperature control area and the flow parameter of the combustible gas.
As described above, the electronic device can obtain the process parameter adjustment amount corresponding to each temperature control region, and therefore, the electronic device forms the process parameter adjustment instruction corresponding to the first temperature control region by using the electrical parameter of the temperature control electrode corresponding to the first temperature control region and the flow parameter of the combustible gas in the process parameters, so as to control the temperature in the first temperature control region. Specifically, the electronic device may control the temperature in the first temperature-controlled region by using an electrical parameter of the temperature-controlled electrode corresponding to the first temperature-controlled region among the process parameters; the electronic device may also control the temperature in the first temperature-controlled region using an electrical parameter of the temperature-controlled electrode corresponding to the first temperature-controlled region among the process parameters and a flow parameter of the combustible gas. For example, in the glass raw material melting zone shown in fig. 3, the temperature may be controlled by the electrical parameters of the temperature-controlled electrode in the glass raw material melting zone, or the temperature may be controlled by the electrical parameters of the temperature-controlled electrode in the glass raw material melting zone and the flow rate parameters of the combustible gas.
(2) And controlling the temperature in the second temperature control area by using the electrical parameter of the temperature control electrode corresponding to the second temperature control area in the process parameters and/or the flow parameter of the combustible gas corresponding to the second temperature control area.
Similarly, the electronic device controls the temperature in the second temperature-controlled zone using the electrical parameter of the temperature-controlled electrode and/or the flow parameter of the combustible gas corresponding to the second temperature-controlled zone among the process parameters. This is because the first temperature control region is heated by electricity or by electricity and combustible gas simultaneously, and the second temperature control region is heated by electricity and/or combustible gas. Accordingly, when the temperature of the corresponding region is controlled, the temperature control command is formed for different heating methods.
For example, for the fining zone shown in fig. 3, electrical heating, or gas heating, or both may be used. Accordingly, the temperature of the temperature-controlled electrode corresponding to the zone can be temperature controlled using electrical parameters and/or flow parameters of the combustible gas.
In the temperature control method provided by this embodiment, since the process parameters in the target kiln include the electrical parameters of the temperature control electrode and the flow parameters of the combustible gas, the temperature in the target kiln can be controlled at a constant temperature by using the flow parameters of the temperature control electrode and the combustible gas, so as to uniformly control the temperature in the target kiln.
To further illustrate the beneficial effects of the temperature control method provided by the embodiments of the present invention, several embodiments are described below.
For example, when the forming flow rate of the special glass fiber is 1.2 ton/day, the temperature fluctuation and the liquid level fluctuation of each temperature sensor are shown in table 1:
TABLE 1 temperature fluctuation situation
| Characteristic temperature | Before use | After use | Reduction of |
| 8 melting tank space temperature sensor | 70(1450～1520) |
6℃ | ↓91％ |
| 3-flow liquid hole temperature sensor | 10(1337～1347) |
6℃ | ↓40％ |
| 10 forming zone temperature sensor | 10(1540～1550) |
6℃ | ↓40％ |
| Fluctuation of liquid level | 8(92～100)mm | 1mm | ↓87％ |
As can be seen from the above table, all the temperature sensors are substantially consistent with the temperature simulation trend of the APC control system (the deviation is within 10 ℃), and therefore the model control result is good. The fluctuation ranges of the three temperatures of the melting tank space temperature sensor 8, the throat temperature sensor 3, the forming area temperature sensor 10 and the like are obviously reduced, the process oscillation amplitude caused by the existing or unknown disturbance is reduced, and the oscillation period is slowed down.
When the forming flow of the special glass fiber is zero, the temperature fluctuation condition and the liquid level fluctuation condition of each temperature sensor are shown in table 2:
TABLE 2 temperature fluctuation situation
| Item | Characteristic temperature | Temperature fluctuation |
| 1 | 8 melting tank space temperature sensor | 1468±3 |
| 2 | 3-flow liquid hole temperature sensor | 1306±3 |
| 3 | 10 forming zone temperature sensor | 1517±3℃ |
As can be seen from the above table, the fluctuation ranges of the three temperatures, i.e., the melting tank space temperature sensor 8, the throat temperature sensor 3, and the forming zone temperature sensor 10, are less than 6 ℃, and the temperature control method provided by this embodiment enables the target kiln to stably operate under the condition of the lowest energy consumption, and has good energy-saving and environmental-protection effects.
In this embodiment, a temperature control device is further provided, and the temperature control device is used to implement the above embodiments and preferred embodiments, which have already been described and will not be described again. As used below, the term "module" may be a combination of software and/or hardware that implements a predetermined function. Although the means described in the embodiments below are preferably implemented in software, an implementation in hardware, or a combination of software and hardware is also possible and contemplated.
The present embodiment provides a temperature control apparatus, as shown in fig. 7, including:
an obtaining module 41, configured to obtain physical performance parameters and a current temperature of a target glass raw material in a target kiln;
a prediction module 42, configured to predict a temperature variation trend in the target kiln according to the physical property parameter of the target glass raw material and the current temperature;
and the control module 43 is configured to control the temperature in the target kiln based on the predicted temperature variation trend.
The temperature control device provided by the embodiment predicts the temperature change trend in the target kiln by using the physical property parameters of the glass raw materials and the current parameters, and combines the physical property parameters of the glass raw materials in the prediction process; and the predicted temperature variation trend is utilized to control the temperature in the target kiln, and the temperature is accurately controlled in real time on the basis of predicting the temperature variation trend so as to ensure that the temperature in the kiln is accurately and timely adjusted.
The temperature control device in this embodiment is presented as a functional unit, where the unit refers to an ASIC circuit, a processor and memory executing one or more software or fixed programs, and/or other devices that may provide the above-described functionality.
Further functional descriptions of the modules are the same as those of the corresponding embodiments, and are not repeated herein.
An embodiment of the present invention further provides an electronic device, which has the temperature control apparatus shown in fig. 7.
Referring to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to an alternative embodiment of the present invention, and as shown in fig. 8, the electronic device may include: at least one processor 51, such as a CPU (Central Processing Unit), at least one communication interface 53, memory 54, at least one communication bus 52. Wherein a communication bus 52 is used to enable the connection communication between these components. The communication interface 53 may include a Display (Display) and a Keyboard (Keyboard), and the optional communication interface 53 may also include a standard wired interface and a standard wireless interface. The Memory 54 may be a high-speed RAM Memory (volatile Random Access Memory) or a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The memory 54 may alternatively be at least one memory device located remotely from the processor 51. Wherein the processor 51 may be in connection with the apparatus described in fig. 7, the memory 54 stores an application program, and the processor 51 calls the program code stored in the memory 54 for performing any of the above-mentioned method steps.
The communication bus 52 may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. The communication bus 52 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown in FIG. 8, but this is not intended to represent only one bus or type of bus.
The memory 54 may include a volatile memory (RAM), such as a random-access memory (RAM); the memory may also include a non-volatile memory (english: non-volatile memory), such as a flash memory (english: flash memory), a hard disk (english: hard disk drive, abbreviated: HDD) or a solid-state drive (english: SSD); the memory 54 may also comprise a combination of the above types of memories.
The processor 51 may be a Central Processing Unit (CPU), a Network Processor (NP), or a combination of a CPU and an NP.
The processor 51 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a Programmable Logic Device (PLD), or a combination thereof. The PLD may be a Complex Programmable Logic Device (CPLD), a field-programmable gate array (FPGA), a General Array Logic (GAL), or any combination thereof.
Optionally, the memory 54 is also used to store program instructions. The processor 51 may call program instructions to implement the temperature control method as shown in the embodiments of fig. 4 to 6 of the present application.
Embodiments of the present invention further provide a non-transitory computer storage medium, where the computer storage medium stores computer-executable instructions, and the computer-executable instructions may execute the temperature control method in any of the above method embodiments. The storage medium may be a magnetic Disk, an optical Disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a Flash Memory (Flash Memory), a Hard Disk (Hard Disk Drive, abbreviated as HDD), a Solid State Drive (SSD), or the like; the storage medium may also comprise a combination of memories of the kind described above.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (12)
1. A method of temperature control, comprising:
obtaining physical performance parameters and current temperature of glass raw materials in a target kiln, wherein the physical performance parameters comprise batch ingredients, high-temperature viscosity of glass, density of the glass, high-temperature electrical conductivity of the glass, high-temperature thermal conductivity of the glass and/or specific heat capacity of the glass;
predicting the temperature change trend in the target kiln according to the physical performance parameters and the current temperature;
and controlling the temperature in the target kiln based on the predicted temperature change trend so as to perform constant temperature control on the temperature in the target kiln.
2. The method of claim 1, wherein predicting a temperature trend within a target kiln based on the physical property parameter and the current temperature comprises:
and inputting the physical property parameters of the glass raw materials and the current temperature into a temperature prediction model, and outputting the temperature change trend in the target kiln.
3. The method of claim 2, wherein inputting the physical property parameters of the glass raw materials and the current temperature into a temperature prediction model and outputting the temperature variation trend in the target kiln comprises:
acquiring structural parameters and technological parameters of the target kiln, wherein the technological parameters comprise at least one of electrical parameters of a temperature control electrode or flow parameters of combustible gas;
and inputting the structural parameters, the process parameters, the physical performance parameters and the current temperature into the temperature prediction model, and outputting the temperature change trend in the target kiln.
4. The method of claim 3, wherein the target kiln is divided into at least 2 temperature controlled zones, and the temperature trend includes a temperature trend for each of the temperature controlled zones.
5. The method according to any one of claims 1 to 4, wherein the controlling the temperature in the target kiln based on the predicted temperature change tendency comprises:
determining the adjustment amount of the process parameters in the target kiln by utilizing the temperature variation trend; wherein the process parameter comprises at least one of an electrical parameter of the temperature-controlled electrode or a flow parameter of the combustible gas;
and controlling the temperature in the target kiln based on the determined adjustment amount of the process parameter.
6. The method of claim 5, wherein the target kiln is divided into at least 2 temperature controlled zones, and wherein controlling the temperature within the target kiln based on the determined adjustments to the process parameters comprises:
controlling the temperature in the first temperature control area by using the electrical parameter of the temperature control electrode corresponding to the first temperature control area in the process parameters, or the electrical parameter of the temperature control electrode corresponding to the first temperature control area and the flow parameter of the combustible gas;
and controlling the temperature in the second temperature control area by using the electrical parameter of the temperature control electrode corresponding to the second temperature control area in the process parameters and/or the flow parameter of the combustible gas corresponding to the second temperature control area.
7. The method of claim 5, wherein controlling the temperature within the target kiln based on the determined adjustment to the process parameter comprises:
and sending the determined adjustment quantity of the process parameter to a temperature adjusting device so that the temperature adjusting device controls the flow of a temperature control electrode or combustible gas in the target kiln to control the temperature in the target kiln.
8. A temperature control apparatus, comprising:
the system comprises an acquisition module, a storage module and a control module, wherein the acquisition module is used for acquiring physical performance parameters and the current temperature of a target glass raw material in a target kiln, and the physical performance parameters comprise batch ingredients, high-temperature viscosity of glass, density of the glass, high-temperature electrical conductivity of the glass, high-temperature thermal conductivity of the glass and/or specific heat capacity of the glass;
the prediction module is used for predicting the temperature change trend in the target kiln according to the physical property parameters of the target glass raw material and the current temperature;
and the control module is used for controlling the temperature in the target kiln based on the predicted temperature change trend so as to perform constant temperature control on the temperature in the target kiln.
9. An electronic device, comprising:
a memory and a processor, the memory and the processor being communicatively coupled to each other, the memory having stored therein computer instructions, the processor executing the computer instructions to perform the temperature control method of any one of claims 1-7.
10. A computer-readable storage medium storing computer instructions for causing a computer to perform the temperature control method of any one of claims 1-7.
11. A temperature control system, comprising:
a target kiln;
the electronic device of claim 9, connected to a temperature control assembly, the electronic device for controlling the temperature control assembly;
the temperature control assembly is provided with a temperature acquisition device and a temperature adjusting device; the temperature control assembly is used for collecting the temperature in the target kiln and controlling the temperature in the target kiln based on the control of the electronic equipment.
12. The system of claim 11, further comprising:
the server is respectively connected with the temperature control assembly and the electronic equipment; the temperature control assembly is in communication connection with the electronic equipment through the server.
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| CN202011147052.3A CN112279507B (en) | 2020-10-23 | 2020-10-23 | Temperature control method and device, electronic equipment and system |
| PCT/CN2021/097749 WO2022083126A1 (en) | 2020-10-23 | 2021-06-01 | Temperature control method, apparatus, electronic device, and system |
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| CN112923727B (en) * | 2021-02-03 | 2022-03-08 | 中南大学 | Roasting furnace real-time furnace condition evaluation method based on temperature trend characteristic extraction |
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| CN112279507A (en) | 2021-01-29 |
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