CN112271450A - Capacitive loading patch antenna - Google Patents

Capacitive loading patch antenna Download PDF

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CN112271450A
CN112271450A CN202011197786.2A CN202011197786A CN112271450A CN 112271450 A CN112271450 A CN 112271450A CN 202011197786 A CN202011197786 A CN 202011197786A CN 112271450 A CN112271450 A CN 112271450A
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metal layer
patch antenna
copper foil
microstrip
plate
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CN112271450B (en
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周伟华
李刚
王亚锋
任开锋
孙元峰
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CETC 38 Research Institute
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array

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Abstract

The invention relates to a capacitive loading patch antenna, comprising: the first metal layer is of a hollow structure; the top of the microstrip plate is fixedly provided with a hollow pentagram; the top of the foam plate is fixedly provided with a microstrip plate; the top of the second metal layer is fixedly provided with a foam plate, and the second metal layer and the foam plate are provided with a through hole; the coaxial feed connector penetrates through the through hole, the upper end of the coaxial feed connector is connected with the bottom of the microstrip plate, and the lower end of the microstrip plate is fixedly connected with the bottom of the connecting pipe; the capacitor loading copper foil is arranged at one end of the coaxial feed connector, which is connected with the microstrip plate; the invention can form resonance, realize pure impedance matching and realize perfect matching.

Description

Capacitive loading patch antenna
Technical Field
The invention relates to the technical field of antennas, in particular to a capacitive loading patch antenna.
Background
In the field of radar, a planar patch antenna with a low profile, a small area and a wide bandwidth is often required to be designed.
Firstly, in the azimuth direction or the pitching direction, in order to ensure that the antenna has larger scanning capability without grating lobes, the distance between the radiating elements is dyThe following must be satisfied:
Figure BDA0002754490430000011
wherein: lambda [ alpha ]minAt the minimum operating wavelength of the antenna, thetamaxΔ is the inverse of the number of radiating elements for the maximum scan angle of the antenna from the normal to the wavefront. Accordingly, for large-scale arrays with large scan angles, it is generally desirable that the array element spacing be about λ min2; the same conclusions can be drawn from the spatial sampling theory. Meanwhile, in order to meet the requirement of smaller coupling coefficient between array elements, the length and width of the array elements should be sufficiently smaller than lambdaminAnd/2, this puts stringent requirements on the miniaturized design of the antenna unit.
Secondly, the bandwidth of the common patch antenna is about 3%, the further improvement has certain difficulty, and the feed point of the patch antenna directly influences the impedance matching and the standing-wave ratio. Changes to the patch shape to improve performance tend to limit the freedom of choice of feed points, further leading to matching difficulties.
For example, the utility model patent with the application number "CN 201320353899.6" discloses a capacitive coupling antenna and a bluetooth device using the same, and aims to provide an antenna that is not shielded by a metal housing and a bluetooth device using the same. The capacitive coupling antenna comprises a metal shell, a circuit board is arranged in the metal shell, copper foils are arranged on the front face of the circuit board, solder resist layers are coated on the two sides of the front face of each copper foil, antenna feed points are formed by exposing the middle of each copper foil, and the back face of the circuit board is attached to the inner surface of the metal shell.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the problem of large area of the patch antenna.
The invention solves the technical problems through the following technical means:
a capacitively loaded patch antenna comprising:
the first metal layer is of a multi-angle star-shaped structure;
the top of the microstrip plate is fixedly provided with the first metal layer;
the top of the foam plate is fixedly provided with a microstrip plate;
the top of the second metal layer is fixedly provided with a foam plate, and the second metal layer and the foam plate are provided with a through hole;
the coaxial feed connector penetrates through the through hole, and a gap is reserved between the upper end of the conductor probe in the coaxial feed connector and the first metal layer;
the upper end of the conductor probe in the coaxial feed connector is fixedly connected with the capacitor loading copper foil, the capacitor loading copper foil is fixedly connected with the bottom of the microstrip plate, and a flat plate capacitor is formed by the capacitor loading copper foil, the microstrip plate and the second metal layer.
The first metal layer is of a hollow structure, and the vertical component of an electric field is added, so that the bandwidth is increased; meanwhile, the capacitor loading copper foil is arranged at one end, connected with the microstrip plate, of the coaxial feed connector, and the capacitor loading copper foil is fixedly connected with the bottom of the microstrip plate to form resonance, so that pure impedance matching is realized, and perfect matching can be realized.
As a further scheme of the invention: the first metal layer is of a five-pointed star structure.
As a further scheme of the invention: the central part of the first metal layer is hollowed out, and the hollowed-out shape is polygonal or circular.
As a further scheme of the invention: the first metal layer is hollow in the center and is shaped like a pentagram.
As a further scheme of the invention: the capacitor loading copper foil is a planar conductive metal film or a metal sheet or a metal thin plate.
As a further scheme of the invention: the capacitor loading copper foil is polygonal, circular or elliptical in shape.
As a further scheme of the invention: the foam board preferably has a dielectric constant of 1.08.
As a further scheme of the invention: the second metal layer is an aluminum plate, and the thickness of the second metal layer is 4-7 mm.
As a further scheme of the invention: the coaxial feed connector is an SMA-KFD3 or other RF connector with replaceable performance and structure.
As a further scheme of the invention: the microstrip board comprises a microstrip board body and is characterized by further comprising an intermediate layer, a cavity, a soldering tin layer and jelly, wherein the intermediate layer is additionally arranged between the microstrip board body and the foam, the coaxial feed connector sequentially penetrates through the foam, the intermediate layer and the microstrip board body and extends to the inside of the microstrip board body, the cavity is formed in the dielectric layer of the microstrip board body, a capacitor loading copper foil is arranged in the cavity of the microstrip board body and on the front face of the intermediate layer, the soldering tin layer is formed at the joint of the coaxial inner conductor and the circular capacitor loading copper foil, the cavity is dug out in the dielectric layer of the microstrip board body and used for containing the soldering tin layer, and the jelly is filled.
The invention has the advantages that:
1. the invention extends the length of the edge resonance gap through the shape of a polygonal star, reduces the area and also reduces the mutual coupling when the array is randomly assembled in the azimuth direction of 360 degrees.
2. The first metal layer is of a hollow structure, the vertical component of an electric field is added, and the bandwidth is increased; meanwhile, the capacitor loading copper foil is arranged at one end, connected with the microstrip plate, of the coaxial feed connector, and the capacitor loading copper foil is fixedly connected with the bottom of the microstrip plate to form resonance, so that pure impedance matching is realized, and perfect matching can be realized.
3. Usually, because the center of the first metal layer is hollowed out, the feeding point is arranged closest to the center, and the matching cannot be realized because the input impedance has a large inductance component.
4. The invention effectively utilizes the methods of fold line of the patch appearance and hollow center and the mode of feeding end capacitance loading, and achieves the purposes of reducing the size, reducing the mutual coupling, realizing the pure impedance matching and expanding the bandwidth under the condition of not needing complex processing technology.
Drawings
Fig. 1 is a schematic diagram of a capacitive loading patch antenna with a pentagonal patch in the middle of a hollow pentagram.
Fig. 2 is a schematic structural diagram of a main view of a directly fed capacitive loading patch antenna without capacitive loading according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a capacitively loaded patch antenna according to an embodiment of the present invention. (with capacitive loading).
Fig. 4 is a schematic diagram of feeding at a capacitive loading position in the capacitive loading patch antenna according to the embodiment of the present invention.
Fig. 5 shows a standing wave ratio of a capacitively loaded patch antenna according to an embodiment of the present invention.
Fig. 6 shows the direct feed impedance of the capacitively loaded patch antenna according to an embodiment of the present invention.
Fig. 7 is a diagram of a capacitively loaded patch antenna direct feed far field lobe according to an embodiment of the present invention.
Fig. 8 shows a capacitance-loaded standing wave ratio of a capacitively-loaded patch antenna according to an embodiment of the present invention.
Fig. 9 is a diagram illustrating the capacitive loading impedance of a capacitively loaded patch antenna according to an embodiment of the present invention.
Fig. 10 is a capacitively loaded far field lobe pattern of a capacitively loaded patch antenna provided by an embodiment of the present invention.
In the figure, 1, a first metal layer; 2. a microstrip plate; 3. a foam board; 4. a second metal layer; 5. a coaxial feed connector; 6. loading copper foil by a capacitor; 7. an intermediate layer; 8. a cavity; 9. a solder layer; 10. and (4) jelly.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic diagram of a central hollow pentagram patch of a capacitive loading patch antenna according to an embodiment of the present invention, fig. 2 is a schematic diagram of a main view structure of a capacitive loading patch antenna directly feeding and not performing capacitive loading according to an embodiment of the present invention, and fig. 3 is a schematic diagram of a structure of a capacitive loading patch antenna according to an embodiment of the present invention. (with capacitive loading), designed center frequency of 7.37GHz, including:
a first metal layer 1, wherein the first metal layer 1 is of a polygonal star structure;
the top of the microstrip plate 2 is fixedly provided with the first metal layer 1;
the micro-strip plate 2 is fixedly arranged at the top of the foam plate 3;
the top of the second metal layer 4 is fixedly provided with a foam plate 3, and the second metal layer 4 and the foam plate 3 are provided with a through hole;
a coaxial feed connector 5, wherein the coaxial feed connector 5 penetrates through the through hole, and a gap is reserved between the upper end of the conductor probe in the coaxial feed connector 5 and the first metal layer 1;
the upper end of the conductor probe in the coaxial feed connector 5 is fixedly connected with the capacitor loading copper foil 6, the capacitor loading copper foil 6 is fixedly connected with the bottom of the microstrip plate 2 in an attached mode, and a flat plate type capacitor is formed by the capacitor loading copper foil 6, the microstrip plate 2 and the second metal layer 4.
Referring to fig. 3, a copper foil with radius r is disposed at 0.762mm below the first metal layer 1, i.e. at the back of the microstrip board 2, facing the center of the feeding coaxial inner conductor, to form a plate capacitor with a capacitance of about 1.43pF with the first metal layer 1 and the second metal layer 4, so that resonance can be formed to form a pure impedance match.
As an embodiment of the present disclosure, referring to fig. 1, the first metal layer 1 is an antenna patch copper foil, the first metal layer 1 is a polygonal structure, and a middle portion of the first metal layer is hollowed out, and the hollowed-out shape is a polygon or a circle.
Further, the first metal layer 1 is a pentagram structure, and the hollow-out arrangement shape is also a pentagram structure, referring to fig. 1, that is, the first metal layer 1 is an integral structure formed by concentrically arranging a polygon a1 and a polygon a2, a copper foil is retained in a middle portion formed by enclosing the polygon a1 and the polygon a2, and the first metal layer 1 is fixedly connected to the top of the microstrip board 2 by welding.
Furthermore, the included angle between the adjacent sides of the polygon a1 being obtuse angles is β, the included angle between the adjacent sides of the polygon a1 being acute angles is α, and the overall length of the polygon a1 is L1 (i.e., the distance between the upper and lower sides in fig. 2).
The included angle of the adjacent sides of the polygon A2, which are obtuse angles, is lambda, the included angle of the adjacent sides of the polygon A2, which are acute angles, is xi, and the length between the bodies of the polygon A2 is L2 (i.e., the distance between the upper and lower parts in FIG. 2).
The side lengths of the polygon A1 and the polygon A2 are the same.
The microstrip board 2 is made of RO4350 or a material with the same dielectric constant and has a thickness h2, and the microstrip board 2 is fixedly arranged on the top of the foam board 3 in a sticking mode.
The foam plate 3 has a dielectric constant of preferably 1.08 and a thickness h 1; the foam plate 3 is fixedly arranged on the top of the second metal layer 4 in a sticking mode.
The second metal layer 4 is an aluminum plate, and the thickness of the second metal layer 4 is 4-7mm, preferably 5 mm.
Preferably, the coaxial feed connector 5 is an SMA-KFD3 or other rf connector with an alternative performance and structure, and the top end of the inner conductor of the coaxial feed connector 5 contacts the copper foil 6 connected to the back surface of the microstrip board 2.
The capacitor loading copper foil 6 is a planar conductive metal film or a metal sheet or a metal thin plate, the capacitor loading copper foil 6 is polygonal, circular or elliptical, and the like, in this embodiment, a circle is taken as an example, the radius of the capacitor loading copper foil 6 is r, and r is2=Cd/ε0ε 2 π, where C is the capacitance of the plate capacitor, ε0Is the vacuum dielectric constant, and ε is the dielectric constant; d is the thickness of the microstrip plate 2.
Illustratively, the capacitance loading copper foil 6 is preferably circular, the radius of the capacitance loading copper foil 6 is r, the capacitance loading copper foil 6 is concentric with the cross-sectional circle of the coaxial conductor probe inside the capacitance loading copper foil 6 and is fixedly welded at the upper end of the coaxial inner conductor, and the capacitance loading copper foil 6 is attached to the bottom of the microstrip board 2.
Illustratively, referring to tables 1 and 2, when L1, L2, h1, h2, α, β, γ, ξ are taken as values according to tables 1 and 2, respectively:
table 1 antenna element size (f ═ 7.37GHz)
L1(mm) L2(mm) r(mm) h1(mm) h2(mm)
17.02 6.68 1.59 2 0.762
Table 2 antenna unit angle (f ═ 7.37GHz)
α(°) β(°) γ(°) ξ(°)
60 132 120 48
As can be seen from tables 1 and 2, L1 is 0.42 λ, and λ is the wavelength of the electromagnetic wave in the vacuum state, thereby achieving the purpose of downsizing.
In addition, the results obtained by performing simulation on the copper foil 6 without capacitance loading and the copper foil 6 with capacitance loading respectively are shown in table 3:
table 3 comparison table of capacitance loading (f ═ 7.37GHz)
Figure BDA0002754490430000081
Fig. 6 shows the direct feed impedance of the capacitively-loaded patch antenna according to the embodiment of the present invention, and according to the simulation results in fig. 6 and table 3, when the antenna is directly fed, the input impedance has a reactance component j ω L ═ 10, ω ═ 2 π f, f ═ 7.37GHz, and it can be seen that: the direct feeding generates a distributed inductance with L326 pH, at this time, the antenna standing wave, the input impedance, and the lobe pattern are shown in fig. 5, fig. 6 and fig. 7, fig. 5 is the standing wave ratio of the direct feeding of the capacitive loading patch antenna provided by the embodiment of the present invention, fig. 7 is the far-field lobe pattern of the direct feeding of the capacitive loading patch antenna provided by the embodiment of the present invention, the curve in fig. 5 represents the VSWR curve (frequency freq (GHz) on the horizontal axis and VSWR amplitude on the vertical axis) of the antenna feeding port in the case of the direct feeding without capacitive loading shown in fig. 2, and as can be seen from fig. 5, the curve decreases with the increase of the frequency, and the VSWR amplitude is greater than 4.5 when the designed center frequency f0 is 7.37 GHz. The solid line in fig. 6 represents the real part of the input impedance of the antenna feed port in the case of the direct feed capacitive-free loading shown in fig. 2, and the dashed line represents the imaginary part of the input impedance, and the curve increases with increasing frequency without good impedance matching over the entire frequency band. Fig. 7 represents a far-field lobe pattern of the antenna under the condition of the direct-feed capacitive-free loading shown in fig. 2, a spherical coordinate system is adopted, the radiation direction of the antenna is a z-axis forward direction, phi is 0 degrees, phi is 180 degrees and < theta 180 degrees is a lobe pattern azimuth plane, phi is 90 degrees and phi is 180 degrees and < theta 180 degrees is a lobe pattern elevation plane, the horizontal axis in the figure is theta, the vertical axis is an antenna gain curve decibel value, wherein a solid line represents the azimuth pattern lobe pattern, and a dotted line represents the elevation pattern lobe pattern.
The bandwidth of the embodiment reaches 8.41 percent (vswr)<2, the calculation process is illustrated in fig. 8), the bandwidth can be achieved by further optimizing h1 and h2 (i.e. adjusting the values of h1 and h 2)30%。
It should be noted that the radius r of the capacitor loaded copper foil 6 in table 1 is obtained as follows:
to achieve a perfect match, according to the resonance condition: j ω L is 1/j ω C, and a 1.43pF distributed capacitor needs to be connected in series to the feed network to form resonance, so as to form pure impedance matching. In this embodiment, a copper foil with a radius r is disposed at a position 0.762mm below the first metal layer 1, i.e. at the back of the microstrip board 2, opposite to the center of the feeding coaxial inner conductor, to form a plate capacitor with the first metal layer 1 and the second metal layer 4, i.e. the capacitance of the plate capacitor is about 1.43 pF. According to the formula C ═ epsilon0εA/d,A=2πr2E 3.66, d 0.762mm, C is capacitance, 1.43, e0The radius of the capacitively loaded copper foil 6 was calculated for the area of copper foil 6, a, which is the vacuum dielectric constant.
From the above, the radius of the capacitor-loaded copper foil 6 can be calculated, but considering that the circular copper foil and the upper patch are not strictly flat capacitors, the upper patch is much larger, and in addition to the capacitance formed with the lower aluminum plate and the edge effect, the actual value of the radius R of the capacitor-loaded copper foil 6 should be multiplied by a factor ζ (0< ζ <1), that is, the actual radius R ═ ζ, where ζ is taken to be 0.69, so that R ═ 1.5mm can be calculated.
Then according to HFSS simulation, correcting the actual R to obtain RCorrectionAt this time, the standing wave, the input impedance and the lobe pattern of the antenna are shown in fig. 8-10, fig. 8 is the capacitance-loaded standing wave ratio of the capacitively-loaded patch antenna provided by the embodiment of the present invention, fig. 9 is the capacitance-loaded impedance of the capacitively-loaded patch antenna provided by the embodiment of the present invention, and fig. 10 is the capacitance-loaded far-field lobe pattern of the capacitively-loaded patch antenna provided by the embodiment of the present invention. The solid line in fig. 8 represents the standing wave ratio VSWR curve (frequency freq (GHz) on the horizontal axis and VSWR amplitude on the vertical axis) of the antenna feed port under the capacitive loading condition shown in fig. 3, and in the frequency range of 7.1GHz to 7.72GHz, the VSWR amplitude is less than 2, the absolute bandwidth is 7.72-7.1 — 0.62(GHz), the center frequency f0 is 7.37GHz, and the relative bandwidth is 100.62/7.37% — 8.41%. The solid line in fig. 9 represents the real part of the input impedance of the antenna feed port in the capacitively loaded condition shown in fig. 3, and the dashed line represents the imaginary part of the input impedance, and it can be seen from the figure that the input impedance zin at the center frequency f0 of 7.37GHz is 50.67-i 0.08 ohms, and compared with the nominal value of 50 ohms, perfect matching is achieved. FIG. 10 is a far-field lobe pattern of the antenna under the capacitive loading condition shown in FIG. 3, and a spherical coordinate system is adopted, wherein the radiation direction of the antenna is the positive direction of the z-axis, and phi is 0 DEG and phi is-180 DEG<θ<180 degrees is the azimuth plane of lobe pattern, and phi is 90 degrees and minus 180 degrees<θ<The angle of 180 degrees is the pitching surface of the lobe graph, the horizontal axis of the lobe graph is theta, the vertical axis of the lobe graph is a decibel value of an antenna gain curve, a solid line represents the azimuth surface lobe graph, and a dotted line represents the pitching surface lobe graph.
The performance parameters of the antenna at a center frequency of 7.37GHz before and after capacitive loading are shown in table 3.
It can be seen from the graph that the present invention achieves a low profile, a planarized structure, a small size, perfect match of pure impedance, and a wider bandwidth.
In actual manufacturing, as shown in fig. 4, a capacitor-loaded copper foil 6 is arranged at a position to facilitate welding of the coaxial inner conductor 5 and the circular capacitor-loaded copper foil 6, so that a welding point is above, when a test piece prototype is actually manufactured, an intermediate layer 7 is additionally arranged between the microstrip board 2 and the foam 3, the coaxial feed connector 5 sequentially penetrates through the foam 3, the intermediate layer 7 and the microstrip board 2 and extends to the interior of the microstrip board 2, a cavity 8 is formed in the dielectric layer of the microstrip board 2, the capacitor-loaded copper foil 6 is arranged in the cavity 8 of the microstrip board 2 and on the front surface of the intermediate layer 7, the coaxial inner conductor 5 and the circular capacitor-loaded copper foil 6 are welded to form a solder layer 9, the shape is irregular, the cavity 8 is dug in the dielectric layer of the microstrip board 2 to accommodate the solder layer 9, and jelly 10 is filled in gaps of the residual cavity, when the jelly dielectric constant is 2-5, a good match can be formed.
The middle layer 7 is made of the same material as the microstrip plate 2, the dielectric constant is 2.2-4, the thickness is 0.254mm, the copper foil on the back of the middle layer 7 is not reserved, and the copper foil reserved on the front of the middle layer 7 (namely above the middle layer) is used for manufacturing the capacitor loading copper foil 6.
The horizontal axis Freq in fig. 5 and 8 represents frequency in GHz; the vertical axis represents the standing-wave ratio amplitude without unit; (Vswr is standing-wave ratio), curve info is curve information;
the horizontal axis (Freq) in fig. 6 and 9 represents frequency in GHz; the vertical axis represents the input impedance in ohms;
in fig. 7 and 10, the horizontal axis (theta) represents the azimuth/elevation angle in degrees, and the vertical axis represents the gain curve in decibels (real gain) in dB.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A capacitively loaded patch antenna, comprising:
a first metal layer (1), wherein the first metal layer (1) is of a multi-angle star structure;
the top of the microstrip plate (2) is fixedly provided with the first metal layer (1);
the top of the foam plate (3) is fixedly provided with a microstrip plate (2);
the top of the second metal layer (4) is fixedly provided with a foam plate (3), and the second metal layer (4) and the foam plate (3) are provided with a through hole;
the coaxial feed connector (5) penetrates through the through hole, and a gap is reserved between the upper end of the inner conductor probe of the coaxial feed connector (5) and the first metal layer (1);
the upper end of the conductor probe in the coaxial feed connector (5) is fixedly connected with the capacitor loading copper foil (6), the capacitor loading copper foil (6) is fixedly connected with the bottom of the microstrip plate (2) together, and the capacitor loading copper foil, the microstrip plate (2) and the second metal layer (4) form a flat capacitor.
2. Capacitively loaded patch antenna according to claim 1, characterized in that said first metal layer (4) is a five-pointed star structure.
3. The capacitive loading patch antenna as claimed in claim 2, wherein the first metal layer (4) is hollowed out at a central portion thereof, and the hollowed-out shape is polygonal or circular.
4. The capacitively loaded patch antenna according to claim 3, wherein the central hollow of the first metal layer (4) is shaped as a five-pointed star.
5. Capacitively loaded patch antenna according to claim 1, characterized in that said capacitively loaded copper foil (6) is a planar conductive metal film or sheet or a metal sheet.
6. Capacitively loaded patch antenna according to claim 1, characterized in that the shape of the capacitively loaded copper foil (6) is polygonal or circular or elliptical.
7. Capacitively loaded patch antenna according to claim 1, characterized in that the foam plate (3) has a dielectric constant of preferably 1.08.
8. Capacitively loaded patch antenna according to claim 1, characterized in that said second metal layer (4) is an aluminum plate, said second metal layer (4) having a thickness of 4-7 mm.
9. Capacitively loaded patch antenna according to claim 1, wherein said coaxial feed connector (5) is chosen as SMA-KFD 3.
10. The capacitive loading patch antenna as claimed in claim 1, further comprising an intermediate layer (7), a cavity (8), a solder layer (9), and a gel (10), wherein the intermediate layer (7) is added between the microstrip board (2) and the foam (3), the coaxial feed connector (5) sequentially penetrates through the foam (3), the intermediate layer (7), and the microstrip board (2) and extends to the inside of the microstrip board (2), the cavity (8) is formed in the dielectric layer of the microstrip board (2), the capacitor loading copper foil (6) is arranged in the cavity (8) of the microstrip board (2) and on the front surface of the intermediate layer (7), the solder layer (9) is formed at the connection position of the coaxial inner conductor (5) and the circular capacitor loading copper foil (6), the cavity (8) is dug in the dielectric layer of the microstrip board (2) for accommodating the solder layer (9), the remaining cavity gaps are filled with a jelly (10).
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