CN112234019B - Transfer film, transfer assembly and micro device curved surface transfer method - Google Patents
Transfer film, transfer assembly and micro device curved surface transfer method Download PDFInfo
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- CN112234019B CN112234019B CN202011123961.3A CN202011123961A CN112234019B CN 112234019 B CN112234019 B CN 112234019B CN 202011123961 A CN202011123961 A CN 202011123961A CN 112234019 B CN112234019 B CN 112234019B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
The embodiment of the invention provides a transfer film, a transfer assembly and a micro-device curved surface transfer method, and relates to the field of micro-device transfer. The transfer film comprises a substrate layer, a water absorbing layer and a pickup layer, wherein one side of the water absorbing layer is connected with the substrate layer, the other side of the water absorbing layer is connected with the pickup layer, and the substrate layer is used for separating from the water absorbing layer after the water absorbing layer absorbs water; the pick-up layer is used to pick up the micro device and to transfer the micro device onto a substrate to be transferred. The transfer film can complete the transfer of the micro device, is suitable for the transfer of the micro device from a plane substrate to a plane substrate and is also suitable for the transfer of the plane substrate to a curved surface substrate, and has simple transfer method and high efficiency.
Description
Technical Field
The invention relates to the technical field of micro device transfer, in particular to a transfer film, a transfer assembly and a micro device curved surface transfer method.
Background
Electronic devices are typically manufactured in a planar layout, but many emerging applications, such as from optoelectronics to wearable devices, require three-dimensional curved structures. Due to the lack of efficient manufacturing techniques, manufacturing electronic devices on curved surfaces is very challenging.
In the prior art, the micro device transfer printing from a plane to a curved surface can be preliminarily realized by utilizing the deformation characteristic of the soft transfer printing head, but the transfer printing process depends on the deformation of the transfer printing head, the controllability is not high, and the damage of the device due to stress in the transfer printing process is easily caused. Therefore, it is necessary to develop a micro device transfer technique for a curved surface structure to transfer a micro device onto a curved surface.
Disclosure of Invention
The invention aims to provide a transfer film, a transfer assembly and a micro device curved surface transfer method, which can realize the transfer of a micro device from a plane substrate to the plane substrate and also can realize the transfer of the micro device from the plane substrate to the curved surface substrate, and have high transfer efficiency and strong operability.
Embodiments of the invention may be implemented as follows:
in a first aspect, an embodiment of the present invention provides a transfer film, including a substrate layer, a water absorption layer, and a pickup layer, where one side of the water absorption layer is connected to the substrate layer, and the other side of the water absorption layer is connected to the pickup layer, and the substrate layer is configured to separate from the water absorption layer after the water absorption layer absorbs water; the pickup layer is used to pick up a micro device and to transfer the micro device onto a substrate to be transferred.
In an optional embodiment, the substrate layer includes a first substrate and a first adhesion layer disposed on the first substrate, the first adhesion layer is connected to the water-absorbing layer, and the first adhesion layer is configured to separate from the water-absorbing layer after the water-absorbing layer absorbs water.
In an alternative embodiment, a separation hole is formed in one side, close to the water absorption layer, of the first adhesion layer.
In an alternative embodiment, the side of the pickup layer remote from the water-absorbing layer is provided with a protective layer.
In an alternative embodiment, the pickup layer is a second adhesion layer, and the second adhesion layer is used for picking up the micro device in an adhesion manner.
In a second aspect, embodiments of the present invention provide a transfer assembly comprising a substrate to be transferred and the transfer film of any one of the preceding embodiments, the transfer film comprising a substrate layer, a water-absorbing layer and a pickup layer, wherein one side of the water-absorbing layer is connected to the substrate layer, and the other side of the water-absorbing layer is connected to the pickup layer, and the substrate layer is configured to separate from the water-absorbing layer after the water-absorbing layer absorbs water; the pick-up layer is used for picking up the micro device and transferring the micro device to a substrate to be transferred;
the substrate to be transferred is arranged on one side, far away from the water absorption layer, of the pickup layer and is used for bearing the micro device on the pickup layer.
In an optional embodiment, the substrate to be transferred includes a curved substrate and a third adhesion layer, the third adhesion layer is disposed on the curved substrate, and the third adhesion layer is configured to receive the micro device on the pickup layer.
In a third aspect, an embodiment of the present invention provides a micro device curved surface transfer method, where a transfer film includes a substrate layer, a water absorbing layer, and a pickup layer, which are sequentially disposed; the micro-device curved surface transfer method comprises the following steps:
the pick-up layer picks up the micro device;
the transfer film and the micro device are immersed in water together; the water-absorbent layer absorbs water to separate the water-absorbent layer and the substrate layer;
removing the substrate layer to allow the water-absorbing layer, the pickup layer and the micro-devices on the pickup layer to float on the water surface;
immersing a curved substrate in water and arranging the micro device on one side of the micro device far away from the pickup layer so as to attach the micro device on the curved substrate;
moving the curved substrate, the micro device, the pickup layer, and the water-absorbing layer out of the water surface together;
and removing the pickup layer and the water absorbing layer.
In an alternative embodiment, the substrate layer comprises a first substrate and a first adhesion layer arranged on the first substrate, and a separation hole is formed in one side, close to the water absorption layer, of the first adhesion layer;
the water-absorbent layer absorbs water to separate the water-absorbent layer from the substrate layer:
the water absorbing layer absorbs water so that the water permeates into the separation holes, the viscosity of the first adhesion layer is reduced, and the water absorbing layer is separated from the first adhesion layer.
In an alternative embodiment of the method of the present invention, after the step of removing the curved substrate, the micro device, the pickup layer and the water absorbing layer from the water surface, the method further comprises:
and drying the curved substrate, the micro device, the pickup layer and the water absorption layer.
The beneficial effects of the embodiment of the invention include, for example:
the transfer film provided by the embodiment of the invention comprises a substrate layer, a water absorption layer and a pickup layer which are sequentially arranged, wherein the water absorption layer can be separated from the substrate layer after absorbing water, and the pickup layer is used for picking up a micro device and transferring the micro device to the substrate to be transferred. The substrate to be transferred is not limited to a plane substrate or a curved substrate, the transfer film can realize the transfer of a device from the plane substrate to the plane substrate and also can realize the transfer of a micro device from the plane substrate to the curved substrate, and the transfer film has high transfer efficiency and strong operability.
The transfer assembly provided by the embodiment of the invention comprises the substrate to be transferred and the transfer film, wherein the substrate to be transferred is arranged on one side of the pickup layer, which is far away from the water absorption layer, and is used for bearing the micro device on the pickup layer, so that the transfer of the micro device can be realized, the operability is strong, and the transfer efficiency is high.
According to the micro device curved surface transfer method provided by the embodiment of the invention, the picking layer picks up the micro device and then immerses the micro device into water to separate the water absorption layer from the substrate layer, so that the water absorption layer and the picking layer can float on the water surface; and finally, the curved surface substrate, the micro device, the pickup layer and the water absorption layer are moved out of the water surface together, the pickup layer and the water absorption layer are removed, and the curved surface transfer of the micro device is completed. The micro-device curved surface transfer method is simple in principle, convenient to operate, high in feasibility and high in transfer efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a transfer film according to a first embodiment of the present invention;
fig. 2 is an exploded schematic view of a transfer film according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a substrate to be transferred according to a second embodiment of the present invention;
FIG. 4 is a block diagram illustrating the steps of a micro-device surface transfer method according to a second embodiment of the present invention;
fig. 5 is a first schematic view illustrating a method for transferring a curved surface of a micro device according to a second embodiment of the present invention;
fig. 6 is a second schematic diagram of a micro device curved surface transfer method according to a second embodiment of the present invention;
fig. 7 is a third schematic view illustrating a micro device surface transfer method according to a second embodiment of the present invention;
fig. 8 is a fourth schematic view of a micro-device surface transfer method according to a second embodiment of the present invention;
fig. 9 is a fifth schematic view of a micro-device curved surface transfer method according to a second embodiment of the present invention;
fig. 10 is a sixth schematic view illustrating a curved surface transfer method for a micro device according to a second embodiment of the present invention;
fig. 11 is a seventh schematic view illustrating a micro device surface transfer method according to a second embodiment of the present invention.
Icon: 100-transfer membrane; 110-a base layer; 111-a first substrate; 113-a first adhesion layer; 115-a separation pore; 120-a water-absorbing layer; 130-a pickup layer; 140-a protective layer; 150-a micro device; 200-a substrate to be transferred; 210-a curved substrate; 220-a third adhesion layer; 10-water surface.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1 and fig. 2, the embodiment provides a transfer film 100, which includes a substrate layer 110, a water-absorbing layer 120 and a pickup layer 130, wherein one side of the water-absorbing layer 120 is connected to the substrate layer 110, and the other side is connected to the pickup layer 130, and the substrate layer 110 is used for separating from the water-absorbing layer 120 after the water-absorbing layer 120 absorbs water; the pickup layer 130 is used to pick up the micro device 150 and to transfer the micro device 150 onto the substrate to be transferred 200. It should be noted that the substrate 200 to be transferred may be a plane or a curved surface, and is not limited herein. That is, the transfer film 100 can be used to transfer the micro device 150 from a planar substrate to a planar substrate, or can be used to transfer the micro device 150 from a planar substrate to a curved substrate. In this embodiment, the substrate 200 to be transferred is mainly illustrated as a curved substrate.
The substrate layer 110 includes a first substrate 111 and a first adhesion layer 113 disposed on the first substrate 111, the first adhesion layer 113 is connected to the water-absorbing layer 120, and the first adhesion layer 113 is used to separate from the water-absorbing layer 120 after the water-absorbing layer 120 absorbs water. Alternatively, the first substrate 111 may be made of PET (thermoplastic polyester) or the like as a supporting substrate. The first adhesion layer 113 and the first substrate 111 can be connected by fastening or bonding, which is not limited in this respect. Further, the side of the first adhesion layer 113 close to the water absorbing layer 120 is provided with the separation holes 115, that is, the side of the first adhesion layer 113 far from the first substrate 111 is provided with the separation holes 115, and the shape, size and distribution density of the separation holes 115 can be flexibly set according to the actual situation, which is not limited specifically herein. In this embodiment, since the transfer film 100 is mainly transferred by the micro device 150, it is preferable to provide the separation hole 115 with a nanometer or micrometer size on the first adhesive layer 113, and of course, the separation hole 115 with a larger size, such as a millimeter size, may be provided, which is not particularly limited herein. By providing the separation holes 115, after the water-absorbing layer 120 absorbs water, water can more easily penetrate into the separation holes 115, so that the adhesion between the first adhesive layer 113 and the water-absorbing layer 120 is reduced, and the separation of the first adhesive layer 113 and the water-absorbing layer 120 is facilitated. Alternatively, the first adhesion layer 113 is made of polypropylene, and a plurality of nano-scale or micro-scale separation holes 115 are densely arranged on the surface of the polypropylene.
It should be noted that the separation holes 115 in the first adhesion layer 113 are used to allow water to penetrate into the separation holes 115, so as to reduce the adhesion between the first adhesion layer 113 and the water absorption layer 120. In other alternative embodiments, grooves or channels may be formed in the first adhesion layer 113 instead of the separation holes 115, which is not limited herein.
It is easy to understand that the water-absorbing layer 120 can be made of wood pulp or a flexible film, etc., and the water-absorbing layer 120 and the first adhesive layer 113 are adhered by the adhesion of the first adhesive layer 113 itself, which can cause the adhesion between the first adhesive layer 113 and the water-absorbing layer 120 to weaken when the water-absorbing layer 120 encounters water, so as to separate the first adhesive layer 113 from the water-absorbing layer 120.
In this embodiment, the pickup layer 130 is a second adhesion layer, and the second adhesion layer picks up the micro device 150 in an adhesion manner. It can be understood that the second adhesive layer covers the side of the water-absorbing layer 120 away from the first adhesive layer 113, and the second adhesive layer is adhered to the water-absorbing layer 120 through its own adhesion, and due to the material characteristics of the second adhesive layer, the second adhesive layer 120 will not lose adhesion after meeting water, i.e. in water, the water-absorbing layer 120 and the second adhesive layer can also keep good adhesion and adhere together. After the second adhesion layer completes the transfer of the micro device 150, the second adhesion layer and the water absorbent layer 120 may be separated by other means.
Further, a protection layer 140 is disposed on a side of the pickup layer 130, i.e., the second adhesion layer, away from the water absorption layer 120. Before picking up the micro device 150, the protective layer 140 is attached to the surface of the pick-up layer 130 to protect the pick-up layer 130 so as to maintain good adhesion of the second adhesive layer. In use, the protective layer 140 is torn to expose the second adhesive layer, so that the second adhesive layer can pick up the micro device 150 by adhesion.
In the transfer film 100 provided in this embodiment, after the protective layer 140 is torn off, the second adhesion layer is used to pick up the micro device 150 through adhesion, and then the substrate layer 110, the water absorbing layer 120, the pick-up layer 130, and the micro device 150 are immersed in water together, after the water absorbing layer 120 absorbs water, the water permeates into the separation hole 115 of the first adhesion layer 113 in the substrate layer 110, so that the adhesion between the first adhesion layer 113 and the water absorbing layer 120 is weakened, so that the first adhesion layer 113 is separated from the water absorbing layer 120, that is, the substrate layer 110 is separated from the water absorbing layer 120. The separated substrate layer 110 is removed from the water, the water absorbing layer 120 and the pick-up layer 130 float on the water surface 10, so that the substrate 200 to be transferred can be put into the water, the micro device 150, the pick-up layer 130 and the water absorbing layer 120 are fished out of the water surface 10 from the position below the pick-up layer 130 by the substrate 200 to be transferred, so that the micro device 150 on the second adhesion layer is transferred to other substrates 200 to be transferred, and the transfer of the micro device 150 is realized.
Second embodiment
Referring to fig. 3, an embodiment of the invention provides a transfer assembly, which includes a substrate 200 to be transferred and the transfer film 100 of any of the foregoing embodiments, the substrate 200 to be transferred is disposed on a side of the pickup layer 130 away from the water absorbing layer 120, and the substrate 200 to be transferred is used for receiving the micro device 150 on the pickup layer 130. The substrate to be transferred 200 includes a second substrate and a third adhesion layer 220, the third adhesion layer 220 is disposed on the second substrate, and the third adhesion layer 220 is used for receiving the micro device 150 on the pickup layer 130. The second substrate includes, but is not limited to, a planar substrate and a curved substrate. In this embodiment, a method for transferring the micro device 150 to a curved surface is mainly implemented, that is, the second base uses the curved substrate 210. Of course, in other embodiments, the second substrate may also be a planar substrate, and is not limited herein.
In this embodiment, the curved substrate 210 is an arc-shaped curved surface, and in other alternative embodiments, the shape of the curved substrate 210 may also be changed as appropriate, such as a wave shape or other curved surface shapes, which are not limited herein. The third adhesion layer 220 is disposed on the curved substrate 210, optionally, the third adhesion layer 220 covers the surface of the curved substrate 210, and can be combined with the curved substrate 210 by the self viscosity of the third adhesion layer 220, and certainly, the third adhesion layer 220 and the curved substrate 210 can also be fixedly connected by other methods such as adhesion or buckling. It is easily understood that the adhesive force of the third adhesive layer 220 does not decrease or disappear in water.
Referring to fig. 4, in the micro device 150 curved surface transfer method provided by the embodiment of the invention, the micro device 150 is transferred to the substrate 200 to be transferred by using the transfer assembly, that is, the transfer film 100, so as to realize curved surface transfer of the micro device 150. Specifically, the micro device 150 surface transfer method mainly includes the following steps:
s100: picking up the micro device 150. As shown in fig. 5, the transfer film 100 includes a base layer 110, a water absorbing layer 120, a pickup layer 130, and a protective layer 140, which are sequentially disposed. The protective layer 140 is torn, the pickup layer 130, i.e., the second adhesive layer, is exposed, and the pickup layer 130 picks up the micro device 150 by adhesion.
S200: the transfer film 100 and the micro device 150 are immersed together in water. As shown in fig. 6, after the micro device 150 is picked up by the pickup layer 130, the transfer film 100 and the micro device 150 are immersed in water together. Optionally, the transfer film 100 and the micro device 150 float on the water surface 10, and the first substrate 111, the first adhesion layer 113, the water absorption layer 120, the second adhesion layer and the micro device 150 are sequentially arranged from the water surface 10 to the water bottom.
S300: the water absorbent layer 120 is separated from the substrate layer 110. As shown in fig. 7, in water, the water absorbing layer 120 absorbs water, and the water permeates into the separation holes 115 of the first adhesive layer 113, the adhesive force of the first adhesive layer 113 decreases, so that the bonding force between the first adhesive layer 113 and the water absorbing layer 120 is weakened until the first adhesive layer 113 and the water absorbing layer 120 disappear, and finally the first adhesive layer 113 and the water absorbing layer 120 are separated in water.
S400: the base layer 110 is removed. As shown in fig. 8, after the water absorbing layer 120 and the substrate layer 110 are separated, the first substrate 111 and the first adhesion layer 113 are taken out of the water surface 10 as a whole, i.e. the first substrate 111 and the first adhesion layer 113 are removed from the water. At this time, the water-absorbing layer 120, the pickup layer 130, and the micro device 150 on the pickup layer 130 float on the water surface 10, and the water-absorbing layer 120, the second adhesion layer, and the micro device 150 are sequentially arranged from the water surface 10 to the water bottom.
S500: the substrate to be transferred 200 is placed in water to attach the micro device 150 to the substrate to be transferred 200. As shown in fig. 9, the substrate to be transferred 200 may alternatively be a curved substrate. The curved substrate comprises a curved substrate 210 and a third adhesion layer 220, wherein the third adhesion layer 220 covers the surface of the curved substrate 210. The curved substrate is placed in water and is disposed under the micro device 150, the third adhesion layer 220 is disposed on a side of the micro device 150 away from the pickup layer 130, that is, the third adhesion layer 220 is disposed under the micro device 150, the curved substrate 210 is disposed on a side of the third adhesion layer 220 away from the micro device 150, and the micro device 150 is attached to the surface of the third adhesion layer 220 under the action of water pressure.
S600: the curved substrate, micro device 150, pickup layer 130, and water absorbent layer 120 are removed from the water surface 10. As shown in fig. 10, after the micro device 150 is attached to the surface of the third adhesion layer 220, the curved substrate drags the micro device 150, the pick-up layer 130, and the water-absorbing layer 120 out of the water surface 10 from the water. And performing a drying process to dry the curved substrate, the micro device 150, the pickup layer 130, and the water-absorbing layer 120. The drying step is beneficial to increase the adhesion between the micro device 150 and the third adhesion layer 220, so that the micro device 150 is firmly bonded on the surface of the third adhesion layer 220.
S700: the pickup layer 130 and the water absorbent layer 120 are removed. As shown in fig. 11, after the drying step, the pickup layer 130 and the water absorbent layer 120 are removed. Optionally, after the drying step, the micro device 150 is firmly adhered to the third adhesion layer 220, and then the water absorbing layer 120 and the pickup layer 130 are sequentially removed, so that the micro device 150 remains on the third adhesion layer 220, and the surface transfer of the micro device 150 is completed.
The micro device 150 curved surface transfer method is simple in principle, easy to operate and strong in operability, can transfer a large number of micro devices 150 to a curved surface substrate, overcomes the defects of the prior art, cannot damage the micro devices 150 in the transfer process, and is good in controllability. The transfer of the micro device 150 can be realized for irregular 3D curved surfaces, and the transfer efficiency is high and the transfer quality is good.
The contents of other parts not mentioned in this embodiment are similar to those described in the first embodiment, and are not described again here.
In summary, the embodiments of the present invention provide a transfer film 100, a transfer assembly, and a curved surface transfer method for a micro device 150, which can transfer the micro device 150 from a planar substrate to a planar substrate, and also transfer the micro device 150 from the planar substrate to a curved substrate, and have the advantages of good controllability, easy operation, no damage to the micro device 150, and high transfer efficiency and transfer quality, and can also transfer the micro device 150 to an irregular 3D curved surface, and have great popularization and application values.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. A transfer film is characterized by comprising a substrate layer, a water absorption layer and a pickup layer, wherein one side of the water absorption layer is connected with the substrate layer, the other side of the water absorption layer is connected with the pickup layer, and the substrate layer is used for being separated from the water absorption layer after the water absorption layer absorbs water; the picking layer is used for picking up the micro device and transferring the micro device to a substrate to be transferred;
the substrate layer comprises a first substrate and a first adhesion layer arranged on the first substrate, the first adhesion layer is connected with the water absorption layer, and the first adhesion layer is used for separating from the water absorption layer after the water absorption layer absorbs water;
and a separation hole is formed in one side of the first adhesion layer, which is close to the water absorption layer.
2. A transfer film as claimed in claim 1, wherein the side of the pickup layer remote from the water-absorbing layer is provided with a protective layer.
3. The transfer film of claim 1, wherein the pickup layer is a second adhesive layer that adhesively picks up the micro device.
4. A transfer assembly comprising a substrate to be transferred and the transfer film of any one of claims 1 to 3, the substrate to be transferred being disposed on a side of the pickup layer remote from the water absorbent layer, the substrate to be transferred being configured to receive the micro devices on the pickup layer.
5. The transfer assembly of claim 4, wherein the substrate to be transferred comprises a curved substrate and a third adhesive layer disposed on the curved substrate, the third adhesive layer configured to receive the micro device on the pickup layer.
6. A micro-device curved surface transfer method is characterized in that a transfer film comprises a substrate layer, a water absorption layer and a pickup layer which are sequentially arranged, wherein the substrate layer comprises a first substrate and a first adhesion layer arranged on the first substrate, the first adhesion layer is connected with the water absorption layer, and a separation hole is formed in one side, close to the water absorption layer, of the first adhesion layer; the micro-device curved surface transfer method comprises the following steps:
the pick-up layer picks up the micro device;
the transfer film and the micro device are jointly immersed in water; the water absorption layer absorbs water to separate the water absorption layer from the first adhesion layer;
removing the substrate layer to allow the water-absorbing layer, the pickup layer and the micro-devices on the pickup layer to float on the water surface;
immersing a curved substrate in water and arranging the micro device on one side of the micro device far away from the pickup layer so as to attach the micro device on the curved substrate;
moving the curved substrate, the micro device, the pickup layer, and the water-absorbing layer out of the water surface together;
and removing the pickup layer and the water absorbing layer.
7. The micro-device surface transfer method according to claim 6, wherein the substrate layer comprises a first substrate and a first adhesion layer disposed on the first substrate, and a separation hole is disposed on a side of the first adhesion layer adjacent to the water absorption layer;
the water-absorbent layer absorbs water to separate the water-absorbent layer from the substrate layer:
the water absorbing layer absorbs water so that the water permeates into the separation holes, the viscosity of the first adhesion layer is reduced, and the water absorbing layer is separated from the first adhesion layer.
8. The micro-device curved surface transfer method of claim 6, wherein after the step of moving the curved substrate, the micro-device, the pickup layer, and the water absorbent layer out of the water, further comprising:
and drying the curved substrate, the micro device, the pickup layer and the water absorption layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011123961.3A CN112234019B (en) | 2020-10-20 | 2020-10-20 | Transfer film, transfer assembly and micro device curved surface transfer method |
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| CN106601657A (en) * | 2016-12-12 | 2017-04-26 | 厦门市三安光电科技有限公司 | Transfer system and transfer method of microelements, manufacturing method, device and electronic device |
| CN107073883A (en) * | 2014-09-19 | 2017-08-18 | 尤尼吉可株式会社 | The manufacture method of layered product and flexible device |
| KR20180127045A (en) * | 2017-05-19 | 2018-11-28 | 한국과학기술원 | Laminating structure of electronic device using transferring element and method for fabricating the electronic device |
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| KR101588019B1 (en) * | 2006-09-20 | 2016-02-12 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | Release strategies for making transferable semiconductor structures, devices and device components |
| JP5930625B2 (en) * | 2011-08-03 | 2016-06-08 | 日東電工株式会社 | Die bond film, dicing die bond film, and semiconductor device |
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| CN106601657A (en) * | 2016-12-12 | 2017-04-26 | 厦门市三安光电科技有限公司 | Transfer system and transfer method of microelements, manufacturing method, device and electronic device |
| KR20180127045A (en) * | 2017-05-19 | 2018-11-28 | 한국과학기술원 | Laminating structure of electronic device using transferring element and method for fabricating the electronic device |
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