CN112229749B - Micro-nano structure mechanical characteristic parameter measuring device, measuring plate and measuring method - Google Patents
Micro-nano structure mechanical characteristic parameter measuring device, measuring plate and measuring method Download PDFInfo
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- CN112229749B CN112229749B CN202010909629.3A CN202010909629A CN112229749B CN 112229749 B CN112229749 B CN 112229749B CN 202010909629 A CN202010909629 A CN 202010909629A CN 112229749 B CN112229749 B CN 112229749B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/40—Investigating hardness or rebound hardness
- G01N3/52—Investigating hardness or rebound hardness by measuring extent of rebound of a striking body
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
A micro-nano structure mechanical characteristic parameter measuring device, a measuring plate and a measuring method comprise a fixing piece, a deformation amplifying piece and a deformation transmitting piece; the deformation amplifying piece is fixedly connected with the fixing piece and is also provided with two supporting strips, and connecting points are arranged at the positions, close to the fixing piece, of the two supporting strips; the two opposite sides of the deformation transfer piece are respectively connected with the two connecting points, an installation part and a limiting part are further arranged on the deformation transfer piece, the installation part is used for clamping a structure to be tested, and the limiting part is fixed on the two opposite sides of the installation part. The mechanical characteristic parameters of the micro-nano structure after one or more process flows can be measured, and then the residual stress condition is obtained.
Description
Technical Field
The invention relates to the field of micro-nano manufacturing, in particular to a micro-nano structure mechanical characteristic parameter measuring device, a measuring plate and a measuring method.
Background
In the fields of micro-nano manufacturing related to semiconductor manufacturing, chip packaging, micro-electro-mechanical system manufacturing and the like, the manufacturing process usually adopts the process flows of deposition, photoetching, removal, electroplating, annealing and the like. The processing parameters used in each process flow are different, the processing methods are different, and the residual stress is left in the processed micro-nano structure due to the different processing materials. In addition, mechanical characteristic parameters of the micro-nano structure are subjected to a series of changes after the complex process flow. The method can measure the residual stress caused by the process flow and the mechanical characteristic parameters of the structure more accurately and conveniently, and has important significance for the performance evaluation and reliability prediction of the micro-nano structure.
The residual stress measurement of the micro-nano structure is generally carried out by the following three methods:
firstly, piezoresistive effect measurement is carried out, a piezoresistive sensor is embedded in a characteristic position of a structure to be measured through a micro-nano manufacturing process, resistance change is generated at the position of the piezoresistive sensor when residual stress occurs in the structure, and stress in the structure can be obtained by measuring the change of the resistance value. The method has many adverse influence factors, such as the preparation process parameters of the sensor, the environmental temperature, the arrangement position of the sensor and the like.
Second, microscopic measurement, which estimates the residual stress of a structure by measuring the amount of change in the lattice of the structure by an interferometric means with the aid of microscopic measuring equipment, is generally classified into destructive measurement and non-destructive measurement. Destructive measurements will greatly change the lattice size and the measurement results will be difficult to reflect in the actual residual stress situation. The size of the micro-nano lattice is not changed in nondestructive measurement, but the crystal size is similar to the size of the structure of the micro-nano structure, so that the distribution of measurement values is influenced by the crystal structure, and great difficulty is caused to the evaluation and use of results.
And thirdly, the nano-imprinting method is characterized in that a nano pressure head is used for leaving nicks on the surface of the structure, the stress condition of the surface of the structure is estimated by measuring the sizes of the nicks, and the method can only obtain the stress condition near the surface.
Two methods are generally used for measuring the mechanical characteristic parameters of the micro-nano structure:
firstly, a deformation measurement method is used for applying mechanical load to a structure and measuring and calculating mechanical characteristic parameters of the structure according to deformation conditions;
and secondly, the vibration test method comprises the steps of clamping the structure on a vibration test device, and measuring and calculating the mechanical characteristics of the structure by measuring the inherent resonance frequency of the structure.
Disclosure of Invention
The invention mainly aims to overcome the defects in the prior art and provides a micro-nano structure mechanical characteristic parameter measuring device, a measuring plate and a measuring method.
The invention adopts the following technical scheme:
a micro-nano structure mechanics characteristic parameter measuring device is characterized in that: comprises a fixed part, a deformation amplifying part and a deformation transmitting part; the deformation amplifying piece is fixedly connected with the fixing piece and is also provided with two supporting strips, and connecting points are arranged at the positions, close to the fixing piece, of the two supporting strips; the two opposite sides of the deformation transfer piece are respectively connected with the two connecting points, an installation part and a limiting part are further arranged on the deformation transfer piece, the installation part is used as a substrate of the structure to be tested, and the limiting part is located on the two opposite sides of the installation part.
Preferably, the deformation amplifying piece comprises a connecting part, the connecting part is fixedly connected with the fixing part, and one ends of the two supporting strips are respectively and vertically connected with two ends of the connecting part.
Preferably, the deformation transmission member includes two transverse connection regions and two longitudinal connection regions, the two transverse connection regions are respectively located at the sides of the connection points of the mounting portion, and the two longitudinal connection regions are located at the other two sides of the mounting portion; the limiting part is formed on the longitudinal connecting area.
Preferably, the limiting part is strip-shaped.
Preferably, two sides of the mounting part are provided with long holes; comprises two limiting parts which are respectively connected with the side parts of the two long holes.
A micro-nano structure mechanics characteristic parameter measuring plate is characterized in that: the micro-nano structure mechanical characteristic parameter measuring device comprises a frame and at least one micro-nano structure mechanical characteristic parameter measuring device, wherein the frame is composed of a fixing piece and is provided with a plurality of fixing points, and each deformation amplifying piece is fixedly connected with the fixing points.
Preferably, the at least two micro-nano structure mechanical characteristic parameter measuring devices have the same or different sizes.
Preferably, at least two micro-nano structure mechanical characteristic parameter measuring devices are arranged in parallel.
A micro-nano structure mechanical characteristic parameter measuring method is characterized by comprising the following steps: the method is realized by adopting the micro-nano structure mechanical characteristic parameter measuring plate, and comprises the following steps:
) Manufacturing a structure to be measured on the mounting part, measuring and recording a first reference distance between the far ends of the two supporting strips;
) Completing one or a group of process flows of the structure to be measured on the measuring device, measuring a second reference distance between the far ends of the two supporting strips again, and obtaining and recording a first change rate;
) Removing the limiting part, measuring a third reference distance between the far ends of the two supporting strips, and obtaining and recording a second change rate;
) And (4) repeating the steps 1) to 3) to obtain parameters of the structure to be measured under different constraint conditions in each process flow.
As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following advantages:
the device is provided with a fixing piece, a deformation amplifying piece, a deformation transmitting piece and the like; the deformation amplification piece forms a lever-shaped structure, and the change rate of the distance between the two connection points can be obtained by measuring the change rate of the tail end reference distance of the deformation amplification piece before and after the process flow. The limiting part is arranged to restrain the mounting part, and the deformation amount of the structure to be measured under a certain constraint condition when the structure to be measured is subjected to a certain load after being deformed through a process flow can be calculated by measuring the deformation rate change of the front and rear mounting parts after the limiting part is removed, so that the mechanical characteristic parameters and the like of the structure to be measured after the process flow can be calculated and obtained.
The deformation transfer piece of the device is provided with a transverse connection area and a longitudinal connection area so as to simulate the residual stress condition of the structure to be tested under the structural constraint condition, and the width of the longitudinal connection area can be defined as different numerical values so as to simulate the deformation condition of the structure to be tested under different structural constraint conditions.
The device is of a flat plate structure, is manufactured on the basis of substrates (silicon substrates, glass substrates and the like) through a micro-nano processing technology, has the same thickness as all the substrates, and expresses the related structure in a plane graph mode.
The measuring plate of the invention can comprise a plurality of groups of measuring devices with different transverse widths of the longitudinal connecting areas, and is used for measuring the residual stress and the structural characteristic parameters of the structure to be measured under different structural constraint conditions through the same process flow.
The measuring plate of the invention can comprise a plurality of groups of measuring devices with the same structure characteristic dimension, and is used for measuring the residual stress caused by different process flows and the structure mechanical characteristic parameters of the formed intermediate structure.
The measuring plate of the invention can contain a plurality of groups of measuring devices with the same structure size, and the influence of measurement accidental errors is reduced through comparison and calculation among a plurality of groups of data.
The method of the invention adopts a microscopic measurement method to obtain relevant parameters of the measurement plate, carries out computer numerical simulation calculation based on the obtained measurement parameters, and obtains residual stress values, mechanical characteristic parameters of the structure and the like of the structure to be measured under different process flows and different constraint conditions.
Drawings
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a view showing a structure of a deformation enlarging member;
FIG. 3 is a view showing a structure of a deformation transmitting member;
FIG. 4 is a view showing the structure of a measuring plate according to the present invention;
wherein:
fixing part, 2, deformation enlarging part, 21, front part, 22, rear part, 23, supporting bar, 3, deformation transmitting part, 31, mounting part, 32, transverse connecting area, 33, longitudinal connecting area, 34, limiting part, 35, long hole, 4, connecting point, 5 and fixing point,
the invention is described in further detail below with reference to the figures and specific examples.
Detailed Description
The invention is further described below by means of specific embodiments.
Referring to fig. 1 to 3, a micro-nano structure mechanical characteristic parameter measuring device comprises a fixing member 1, a deformation amplifying member 2 and a deformation transmitting member 3; the deformation amplifying part 2 is fixedly connected with the fixing part 1, and is also provided with two supporting strips 23, and the positions of the two supporting strips 23, which are close to the fixing part 1, are provided with connecting points 4; the two opposite sides of the deformation transmission member 3 are respectively connected with the two connection points 4, and the deformation transmission member is further provided with an installation part 31 and a limiting part 34, the installation part 31 is used as a substrate of the structure to be tested, and the limiting part 34 is fixed on the two opposite sides of the installation part 31.
The measuring device is manufactured by a micro-nano processing technology on the basis of a substrate (a silicon substrate, a glass substrate and the like), the thickness of the measuring device is the same as that of the substrate, and a related structure is expressed in a plane graph mode. The structure to be measured can be obtained by punching holes on a substrate formed by the mounting part and electroplating or by other micro-nano processing technologies.
The deformation amplification member 2 comprises a connection portion fixedly connected with the fixing point 5 of the fixing member 1, and two support bars 23 are vertically connected with two ends of the connection portion respectively. The support bar 23 can be divided into a front portion 21 and a rear portion 22 by the connecting point 4, the front portion 21 is close to the fixing member 1, the rear portion 22 is far away from the fixing member 1, and the length dimension of the rear portion 22 is much larger than that of the front portion.
For a supporting bar 23, a front part 21 and a rear part 22 of the supporting bar form a set of lever-shaped deformation amplifying structures by taking a fixed point 5 of a fixing part 1 as a base point and taking a connecting point 4 as a moving point, when the connecting point 4 generates small displacement, the tail end of the rear part 22 of the supporting bar 23 generates larger displacement, the displacement of the rear part 22 is measured, and the displacement of the connecting point 4 can be obtained through geometric conversion.
The deformation amplifying piece 2 of the invention is composed of two lever-shaped structures by two supporting strips 23, the front parts 21 of the two supporting strips 23 are connected with the position of a fixed point 5 through a connecting part, the tail ends of the two rear parts 22 jointly form a measuring reference, the distance value between the two parts is used as the reference distance of a measuring device, and the distance change rate between the two connecting points 4 can be obtained by measuring the change rate of the reference distance before and after the process flow. In addition, the front portion 21 of the supporting bar 23 can be simplified into a cantilever beam structure with the fixing point 5 as a supporting point and the middle connecting point 4 as a loading point, and since the structural size and parameters of the front portion 21 are known quantities, the acting force of the deformation transmission structure 3 on the two connecting points 4 can be obtained by measuring the displacement of the two middle connecting points 4.
The deformation transmission member 3 comprises two transverse connection areas 32 and two longitudinal connection areas 33, wherein the two transverse connection areas 32 are respectively positioned at the sides of the connection points 4 of the mounting part 31, and the two longitudinal connection areas 33 are positioned at the other two sides of the mounting part 31; the position-limiting portion 34 is formed on the longitudinal connecting region 33, and the position-limiting portion 34 may be a bar. The mounting portion 31 has elongated holes 35 formed in both sides thereof, and the elongated holes 35 are longitudinally arranged in parallel, i.e., between the mounting portion 35 and the longitudinal connecting region 33. Correspondingly, the device comprises two limiting parts 34 which are respectively vertically connected with the long hole 35.
When the structure to be measured generates residual stress through the process flow, the displacement of the transverse connecting structure 32 of the mounting portion 31 is caused, and the horizontal deformation of the mounting portion 31 simultaneously causes the horizontal displacement of the two connecting points 4. By measuring the rate of change of the distance of the end of the rear portion 22 under the deformation amplifying structure 2, the rate of deformation of the mounting portion 31 in the longitudinal direction of the horizontal plane can be obtained.
The transverse connecting area 32 enables the longitudinal connecting area 33 to be mechanically connected with the mounting portion 31, the horizontal and longitudinal dimensions of the longitudinal connecting area 33 are the same as those of the mounting portion 31, and when the mounting portion 31 deforms due to the process flow of the structure to be tested, the longitudinal connecting area 33 provides horizontal and longitudinal extra resistance for the deformation of the mounting portion 31 so as to simulate the residual stress condition of the structure to be tested under the structural constraint condition. The width of the longitudinal connecting region 33 may be defined as different values to simulate the deformation of the mounting portion 31 under different structural constraints.
The limiting part 34 is a transverse narrow strip constructed on the longitudinal connecting area 33, the limiting part 34 is removed through a micro-nano manufacturing removal process after the process flow to be measured is finished, so that structural constraint of the longitudinal connecting area 33 on the mounting part 31 is removed, the deformation of the structure to be measured under a certain constraint condition under the action of load after deformation of the structure to be measured through the process flow is further calculated by measuring the deformation rate change of the front mounting part and the rear mounting part of the limiting part 34 due to the fact that the transverse size of the longitudinal connecting area 33 is known, and then the mechanical characteristic parameters of the structure to be measured after the process flow can be calculated.
The transverse cross-sectional dimension of the limiting part 34 is known, the material characteristics are known, the transverse cross-sectional dimension is equivalent to two springs with known elastic modulus, the constraint force of the limiting part 34 on the mounting part 31 area can be obtained by removing the deformation values of the mounting parts 31 in front of and behind the limiting part 34, and further the horizontal elastic modulus value of the structure to be measured can be obtained through a numerical simulation calculation method.
The invention also provides a micro-nano structure mechanical characteristic parameter measuring plate, which comprises a frame and at least one micro-nano structure mechanical characteristic parameter measuring device, wherein the frame is used as a fixing piece 1 and is provided with a plurality of fixing points 5, and each deformation amplifying piece 2 is fixedly connected with the fixing points 5. The micro-nano structure mechanical characteristic parameter measuring devices can be reasonably arranged according to the shape of the measuring plate, for example, the micro-nano structure mechanical characteristic parameter measuring devices are arranged in parallel.
The dimensions of different micro-nano structure mechanical characteristic parameter measuring devices can be the same or different. If the measuring device comprises a plurality of measuring devices with the same structure size, the influence of accidental errors in measurement is reduced through comparison and calculation among a plurality of groups of data, and the measuring device can also be used for measuring residual stress caused by different process flows and structural mechanical characteristic parameters of a formed intermediate structure.
Furthermore, a plurality of sets of measuring devices with different transverse widths of the longitudinal connecting region 33 may be included on the measuring board, and are used to measure the residual stress and the structural characteristic parameters of the structure to be measured under different structural constraints through the same process flow.
The invention also provides a micro-nano structure mechanical characteristic parameter measuring method, and the micro-nano structure mechanical characteristic parameter measuring device is adopted to pre-estimate the performance of the structure to be measured so as to determine the size of the measuring device. And then determining the specific number and grouping of the measuring devices according to the specific process flow of the structure to be measured. And finishing the specific structural design of the measuring plate according to the size and the grouping condition. And determining the specific technological process, the measurement time, the removal time of the limiting parts 34 of the measuring devices and the like of the measuring plate, and then manufacturing the measuring plate.
Then, the measurement is carried out through the measuring plate, and the method comprises the following steps:
) Mounting the structure to be measured on the mounting part 31, measuring and recording a first reference distance between the far ends of the two supporting strips 23;
) One of the process flows of the structure to be measured is completed on the measuring device, and the second reference distance between the distal ends of the two support bars 23 is measured again to obtain and record a first change rate = (second reference distance-first reference distance)/first reference distance.
) The stopper 34 is removed, and a third reference distance between the distal ends of the two support bars 23 is measured to obtain and record a second rate of change = (third reference distance-first reference distance)/first reference distance.
) And (4) repeating the steps 1) to 3) to obtain parameters of the structure to be measured under different constraint conditions in each process flow.
According to the method, the measured data are subjected to computer numerical simulation calculation to obtain the residual stress numerical value and the structural mechanical characteristic parameters. The computer numerical simulation model is used for establishing all size measuring devices contained in the measuring plate by using a software tool.
Specifically, a complete computer simulation model of a deformation transmission piece corresponding to the measurement structure is established in advance; calculating a plurality of groups of prestress loads with different values applied to directly-received process flow influence areas in the computer simulation model; calculating the relative displacement of the measurement structure at the connecting point 4 under the condition of applying different prestress loads compared with the size before deformation; and establishing a curve by taking the applied prestress load as an independent variable and taking the relative displacement values generated at the positions of the connecting points under different prestress as dependent variables, and performing numerical fitting calculation to obtain a first relative displacement fitting curve. The first relative displacement fit curve is not a monotonic curve due to material plasticity effects.
And (3) carrying out secondary processing on the computer simulation model, removing the limiting part 34, carrying out springback calculation, calculating to obtain the relative displacement generated by the springback of the measurement structure under the condition of applying different prestress loads at the position of the connecting point 4 compared with the size before deformation, establishing a curve by taking the relative displacement value after the springback calculation of the positions of the connecting points under different prestress as a dependent variable, and carrying out numerical fitting calculation to obtain a second relative displacement fitting curve.
And substituting the first change rate obtained by measurement into a first relative displacement fitting curve, calculating a prestress numerical value set required to be applied if the measurement structure generates a measurement displacement value, substituting the second change rate obtained by measurement into a second relative displacement fitting curve, and selecting a prestress numerical value of which the springback quantity meets the measurement conclusion from the prestress numerical value set.
And applying the selected prestress numerical value to the computer simulation model, and performing prestress calculation and rebound calculation again to obtain the distribution condition of the residual stress in the structure of the specified technological process in two states before and after rebound under the specified constraint condition.
The above description is only an embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any insubstantial modifications made by using the design concept should fall within the scope of infringing the present invention.
Claims (9)
1. A micro-nano structure mechanics characteristic parameter measuring device is characterized in that: comprises a fixed part, a deformation amplifying part and a deformation transmitting part; the deformation amplifying piece is fixedly connected with the fixing piece and is also provided with two supporting strips, and connecting points are arranged at the positions, close to the fixing piece, of the two supporting strips; the two opposite sides of the deformation transfer piece are respectively connected with the two connecting points, an installation part and a limiting part are further arranged on the deformation transfer piece, the installation part is used as a substrate of the structure to be tested, and the limiting part is located on the two opposite sides of the installation part.
2. The micro-nano structure mechanical characteristic parameter measuring device according to claim 1, characterized in that: the deformation amplifying piece comprises a connecting part which is fixedly connected with the fixing piece, and one ends of the two supporting strips are respectively and vertically connected with two ends of the connecting part.
3. The micro-nano structure mechanical characteristic parameter measuring device according to claim 1, characterized in that: the deformation transmission piece comprises two transverse connection areas and two longitudinal connection areas, the two transverse connection areas are respectively positioned at the sides of the connection points of the mounting part, and the two longitudinal connection areas are positioned at the other two sides of the mounting part; the limiting part is formed on the longitudinal connecting area.
4. The micro-nano structure mechanical characteristic parameter measuring device according to claim 1, characterized in that: the limiting part is strip-shaped.
5. The micro-nano structure mechanical characteristic parameter measuring device according to claim 3, characterized in that: two sides of the mounting part are provided with long holes; comprises two limiting parts which are respectively connected with the side parts of the two long holes.
6. A micro-nano structure mechanics characteristic parameter measuring plate is characterized in that: the device comprises a frame and at least one micro-nano structure mechanical characteristic parameter measuring device as claimed in any one of claims 1 to 5, wherein the frame is composed of the fixing parts and is provided with a plurality of fixing points, and each deformation amplifying part is fixedly connected with the fixing points.
7. The micro-nano structure mechanical characteristic parameter measurement plate according to claim 6, characterized in that: and the dimensions of at least two micro-nano structure mechanical characteristic parameter measuring devices are the same or different.
8. The micro-nano structure mechanical characteristic parameter measurement plate according to claim 6, characterized in that: at least two micro-nano structure mechanical characteristic parameter measuring devices are arranged in parallel.
9. A micro-nano structure mechanical characteristic parameter measuring method is characterized by comprising the following steps: the method is realized by adopting the micro-nano structure mechanical characteristic parameter measuring plate of any one of claims 6 to 8, and comprises the following steps:
1) manufacturing a structure to be measured on the mounting part, measuring and recording a first reference distance between the far ends of the two supporting strips;
2) completing one or a group of process flows of the structure to be measured on the measuring device, measuring a second reference distance between the far ends of the two supporting strips again, and obtaining and recording a first change rate;
3) removing the limiting part, measuring a third reference distance between the far ends of the two supporting strips, and obtaining and recording a second change rate;
4) and (4) repeating the steps 1) to 3) to obtain parameters of the structure to be measured under different constraint conditions in each process flow.
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