CN112216775A - LED packaging device and manufacturing method - Google Patents

Abstract

The invention discloses an LED packaging device and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: the support with the bowl cup is arranged on a chip scale packaging unit in the support, the chip scale packaging unit comprises an LED chip, a first transparent layer on the side surface of the LED chip and a light emitting layer on the upper surface of the LED chip and the upper surface of the first transparent layer, a white glue layer is arranged in a hollow gear area in the support, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit. The white glue layer and the first transparent layer of the chip-scale packaging unit can better protect the LED chip, so that the reliability of the LED packaging device is improved; when the LED packaging device works, light emitted by the side face of the LED chip in the chip-scale packaging unit is distributed on the first transparent layer, and the light distributed on the first transparent layer cannot penetrate through the white glue layer, so that the upper surface of the light emitting layer in the chip-scale packaging unit emits light in a single-sided mode, and further the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED packaging device are improved.

Description

LED packaging device and manufacturing method

Technical Field

The invention relates to the field of semiconductor lighting, in particular to an LED packaging device and a manufacturing method thereof.

Background

With the rapid development of the Light Emitting Diode (LED) industry, LED package devices are receiving more and more attention, and when manufacturing LED package devices, LED chips are generally packaged.

Currently, it is common to place LED chips (such as blue chips) in a holder and then fill the area of the hollow in the holder with silica gel mixed with phosphor.

However, the brightness difference between the center and the edge of the LED packaging device obtained by the packaging method is large, and the light emitting uniformity of the LED packaging device is reduced.

Disclosure of Invention

The invention provides an LED packaging device and a manufacturing method thereof.A white glue layer and a first transparent layer of a chip-scale packaging unit can better protect an LED chip, so that the reliability of the LED packaging device is improved; when the LED packaging device works, light emitted by the side face of the LED chip in the chip-scale packaging unit is distributed on the first transparent layer, and the light distributed on the first transparent layer cannot penetrate through the white glue layer, so that the upper surface of the light emitting layer in the chip-scale packaging unit emits light in a single-sided mode, and further the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED packaging device are improved.

In a first aspect, the present invention provides an LED package device comprising: the support with the bowl cup is arranged on a chip-scale packaging unit in the support, the chip-scale packaging unit comprises an LED chip, a first transparent layer on the side surface of the LED chip and a light-emitting layer on the upper surface of the first transparent layer, a white glue layer is arranged in a space blocking area in the support, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip-scale packaging unit.

Preferably, the first transparent layer is no greater than 100 microns thick.

Preferably, the upper surface of the first transparent layer is flush with the upper surface of the LED chip, and the upper surface of the LED chip and the upper surface of the first transparent layer are adhered to the lower surface of the light emitting layer.

Preferably, the chip scale package unit further comprises: the upper surface of the LED chip is bonded with the lower surface of the light emitting layer, and the thickness of the second transparent layer is not more than 100 microns.

Preferably, the LED chip is any one of a face-up chip, a flip chip and a vertical chip;

then, the support structure is any one of a front-mount structure, a flip-chip structure, and a vertical structure.

Preferably, the light-emitting layer is no greater than 300 microns thick.

Preferably, the upper surface of the luminous layer is flush with the upper edge of the bracket;

then, the upper surface of the white glue layer is flush with the upper surface of the light emitting layer.

Preferably, the upper surface of the luminous layer is lower than the upper edge of the bracket; then the process of the first step is carried out,

the upper surface of the white glue layer is inclined inwards and forms a specific angle with the upper edge of the bracket.

Preferably, the luminescent material of the luminescent layer is phosphor or quantum dot; the first transparent layer and the second transparent layer are made of silica gel.

In a second aspect, the present invention provides a method for manufacturing an LED packaged device as described in the first aspect, comprising:

placing a chip scale packaging unit in a support with a bowl cup in a die bonding mode, wherein the upper surface of the chip scale packaging unit is not higher than the upper edge of the support;

dispensing a white glue into the vacant area in the support in a dispensing manner to form a white glue layer, wherein the white glue layer is arranged on the side surface of the chip scale packaging unit, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit;

and baking and curing the support carrying the white glue layer and the chip-scale packaging unit to obtain the LED packaging device.

The present invention provides an LED package device, comprising: the LED packaging structure comprises a support with a bowl cup and a chip-scale packaging unit arranged in the support, wherein the chip-scale packaging unit comprises an LED chip, a first transparent layer on the side surface of the LED chip and a light emitting layer on the upper surface of the LED chip and the upper surface of the first transparent layer, a white glue layer is arranged in a neutral area in the support, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip-scale packaging unit. The white glue layer and the first transparent layer of the chip-scale packaging unit can better protect the LED chip, so that the reliability of the LED packaging device is improved; when the LED packaging device works, light emitted by the side face of the LED chip in the chip-scale packaging unit is distributed on the first transparent layer, and the light distributed on the first transparent layer cannot penetrate through the white glue layer, so that the upper surface of the light emitting layer in the chip-scale packaging unit emits light in a single-sided mode, and further the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED packaging device are improved.

The invention provides a manufacturing method of an LED packaging device, which comprises the following steps: the chip scale packaging unit is placed in the support with the bowl cup in a die bonding mode, the upper surface of the chip scale packaging unit is not higher than the upper edge of the support, then white glue is dispensed into a neutral area in the support in a dispensing mode to form a white glue layer, the white glue layer is placed around the chip scale packaging unit, one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit, and then the support with the white glue layer and the chip scale packaging unit is baked and cured to obtain the LED packaging device. The LED packaging device obtained by the technical scheme provided by the embodiment of the invention has single-sided light emission and relatively high reliability, light-emitting intensity, light-emitting efficiency and light-emitting uniformity. Meanwhile, the manufacturing process of the manufacturing method is simpler and easy to process, the manufacturing efficiency can be obviously improved, and the manufacturing cost is reduced.

Drawings

In order to more clearly illustrate the embodiments or the prior art solutions of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.

Fig. 1 is a schematic structural diagram of an LED package device according to an embodiment of the present invention;

FIG. 2 is a process flow diagram of one LED package device provided in FIG. 1;

fig. 3 is a schematic structural diagram of another LED package device according to an embodiment of the present invention;

FIG. 4 is a process flow diagram of another LED package device provided in FIG. 3;

fig. 5 is a schematic structural diagram of another LED package device according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of another LED package device according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

1-a scaffold;

2-chip scale packaging unit;

21-an LED chip;

22-a first transparent layer;

23-a light-emitting layer;

24-a second transparent layer;

3-white glue layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail and completely with reference to the following embodiments and accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

The embodiment of the invention provides an LED packaging device, which comprises: take support 1 of bowl cup, set up chip scale package unit 2 in the support 1, chip scale package unit 2 includes LED chip 21 the first stratum lucidum 22 of LED chip 21 side reaches LED chip 21 upper surface with the luminescent layer 23 of first stratum lucidum 22 upper surface, the hollow district of support 1 is provided with white glue film 3, 3 upper surface one side of white glue film with the regional meeting of following on chip scale package unit 2.

Referring to fig. 1 or fig. 3, the embodiment provides an LED package device, including: the LED packaging structure comprises a support 1 with a bowl cup, and a chip-scale packaging unit 2 arranged in the support 1, wherein the chip-scale packaging unit 2 comprises an LED chip 21, a first transparent layer 22 on the side surface of the LED chip 21, and a light-emitting layer 23 on the upper surface of the LED chip 21 and the upper surface of the first transparent layer 22, a white glue layer 3 is arranged in a hollow gear area of the support 1, and one side of the upper surface of the white glue layer 3 is connected with the upper edge area of the chip-scale packaging unit 2. The white glue layer 3 and the first transparent layer 22 of the chip scale packaging unit 2 can better protect the LED chip 21, so that the reliability of the LED packaging device is improved; when the LED packaging device works, light emitted from the side surface of the LED chip 21 in the chip-scale packaging unit 2 is distributed on the first transparent layer 22, and the light distributed on the first transparent layer 22 cannot penetrate through the white glue layer 3, so that the single surface of the upper surface of the light-emitting layer 23 in the chip-scale packaging unit 2 emits light, and further the light-emitting intensity, the light-emitting efficiency and the light-emitting uniformity of the LED packaging device are improved.

Specifically, when the LED package device works, light emitted from the side surface of the LED chip 21 in the chip-scale package unit 2 is distributed in the first transparent layer 22, and the light distributed in the first transparent layer 22 and the light emitted from the upper surface of the LED chip 21 cannot penetrate through the white glue layer 3, so that the light distributed in the first transparent layer 22 and the light emitted from the upper surface of the LED chip 21 only point to the light-emitting layer 23, so that the upper surface of the light-emitting layer 23 emits light in a single-sided manner, and the light-emitting intensity, the light-emitting efficiency and the light-emitting uniformity of the LED package device are improved.

In this embodiment, the chip scale package unit 2 disposed in the support 1 specifically means that when the LED package device works, the support 1 and the chip scale package unit 2 are in a conducting state, and it is not necessary to use a bonding wire to conduct the electrode of the support 1 and the electrode of the chip scale package unit 2, so that the phenomenon that the bonding wire deforms to cause collapse of the adhesive layer (for example, a silica gel layer) can be avoided, and the reliability of the LED package device is further improved. The invention does not limit the position relation of the chip-scale packaging unit 2 in the bracket 1, the position relation of the chip-scale packaging unit 2 in the bracket 1 can be determined according to the actual light-emitting requirement, and the chip-scale packaging unit 2 is usually positioned in the central area of the bracket 1.

It should be noted that, the top edge area specifically means that the position where the upper surface side of the white glue layer 3 meets the top edge of the chip scale unit is allowed to have a proper deviation.

As will be appreciated by those skilled in the art, the stent 1 includes, but is not limited to, one or more of a ceramic stent, PPA (polyphthalamide resin) stent, EMC (epoxy resin film plastic) stent, and SMC (glass reinforced unsaturated polyester resin) stent; referring to fig. 1, 3, 5 and 6, the cross-sectional shape of the stent 1 may be generally rectangular or trapezoidal. The LED chips 21 include, but are not limited to, a violet chip, a blue chip, a red chip, and a green chip.

In one embodiment of the present invention, the first transparent layer 22 is not greater than 100 microns thick.

Referring to fig. 1, fig. 3, fig. 5 and fig. 6, in order to ensure the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED package device, the thickness of the first transparent layer 22 is not greater than 100 μm.

In one embodiment of the present invention, the upper surface of the first transparent layer 22 is flush with the upper surface of the LED chip 21, and the upper surfaces of the LED chip 21 and the first transparent layer 22 are adhered to the lower surface of the light emitting layer 23.

Referring to fig. 1 and 3, the upper surface of the first transparent layer 22 is flush with the upper surface of the LED chip 21, the first transparent layer 22 surrounds the light exit surface on the side surface of the LED chip 21, so as to prevent the side surface of the LED chip 21 from contacting with the luminescent material in the luminescent layer 23, that is, prevent other light rays from being generated (for example, other light rays generated after the light rays generated by the LED chip 21 excite the luminescent material in the luminescent layer 23), the upper surface of the LED chip 21 and the upper surface of the first transparent layer 22 are bonded to the lower surface of the luminescent layer 23, so as to ensure that the light rays emitted by the upper surface of the LED chip 21 and the light rays distributed in the first transparent layer 22 can excite the luminescent material in the luminescent layer 23, and improve the luminous.

It should be noted that, in order to ensure that the first transparent layer 22 surrounds the lateral light-emitting surface of the LED chip 21, the height of the first transparent layer 22 is not lower than the height of the LED chip 21, and generally, the shape of the lateral surface of the first transparent layer 22 is the same as or similar to the shape of the lateral surface of the LED chip 21.

It should be noted that, in order to ensure the light emitting efficiency, the light emitting intensity and the light emitting uniformity of the LED package device, the side surface of the light emitting layer 23 and the side surface of the first transparent layer 22 should be located at the same horizontal plane. Obviously, the shape of the upper surface of the light emitting layer 23 includes, but is not limited to, a rectangle.

In an embodiment of the present invention, the chip scale package unit 2 further includes: the upper surface of the LED chip 21 is adhered to the second transparent layer 24 on the upper surface of the transparent layer, the upper surface of the second transparent layer 24 is adhered to the lower surface of the light-emitting layer 23, and the thickness of the second transparent layer 24 is not more than 100 microns.

Referring to fig. 5 and 6, the upper surface of the second transparent layer 24 is bonded to the lower surface of the light emitting layer 23, when the LED package device works, light generated by the LED chip 21 is transmitted to the light emitting layer 23 through the first transparent layer 22 and the second transparent layer 24, and the light emitting material in the light emitting layer 23 is activated to emit required light, because the required light emitted by the LED chip 21 and the light emitting layer 23 cannot pass through the white adhesive layer 3, only the upper surface of the light emitting layer 23 emits light, and the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED package device are improved.

It should be noted that, in order to ensure the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED package device, the thickness of the first transparent layer 22 and the thickness of the second transparent layer 24 are not greater than 100 μm.

In an embodiment of the present invention, the LED chip 21 is any one of a front-mounted chip, a flip chip, and a vertical chip;

then, the structure of the bracket 1 is any one of a forward mounting structure, an inverted mounting structure and a vertical structure.

Referring to fig. 1, 3, 5 and 6, the LED chip 21 is any one of a front-mounted chip, a flip chip and a vertical chip, and in order to increase the adaptability of the LED package device, correspondingly, the support 1 has any one of a front-mounted structure, a flip structure and a vertical structure, so as to meet the requirements of different types of LED package devices.

In one embodiment of the present invention, the thickness of the light emitting layer 23 is not greater than 300 μm.

Referring to fig. 1, fig. 3, fig. 5 and fig. 6, in order to ensure the light emitting intensity, the light emitting efficiency and the light emitting uniformity of the LED package device, the thickness of the first transparent layer 22 and the thickness of the second transparent layer 24 are not greater than 100 micrometers, and the thickness of the light emitting layer 23 is not greater than 300 micrometers.

In one embodiment of the invention, the upper surface of the luminescent layer 23 is flush with the upper edge of the bracket 1;

then, the upper surface of the white glue layer 3 is flush with the upper surface of the light emitting layer 23.

Specifically, because the light-emitting demand of LED encapsulated device during operation is different, LED chip 21 probably selects just adorning any one in chip, flip chip and the perpendicular chip, and different kinds of LED chip 21 are high different, and luminous layer 23 thickness changes because of the light-emitting demand simultaneously, and in a possible implementation, luminous layer 23 upper surface flushes with support 1 upper edge, and is corresponding, and the white glue film 3 upper surface flushes with luminous layer 23 upper surface to guarantee LED encapsulated device's stability and reliability.

In one embodiment of the present invention, the upper surface of the light emitting layer 23 is lower than the upper edge of the support 1; then the process of the first step is carried out,

the upper surface of the white glue layer 3 is inclined inwards and forms a specific angle with the upper edge of the bracket 1.

Referring to fig. 1, fig. 3, fig. 5 and fig. 6, generally, on the premise of ensuring the light-emitting requirement of the LED package device during operation, the upper surface of the light-emitting layer 23 is lower than the upper edge of the support 1, and in order to ensure the adaptability, the light-emitting intensity, the light-emitting efficiency and the light-emitting uniformity of the LED package device, the upper surface of the white adhesive layer 3 is inclined inward, and is in the same horizontal plane with the upper surface contact position of the chip scale package unit 2, and forms a specific angle with the upper edge of the support 1, where the height of the chip scale package unit 2 and the height of the support 1 determine the specific angle formed by the white adhesive layer 3 and the upper edge.

In one embodiment of the present invention, the light emitting material of the light emitting layer 23 is phosphor or quantum dot; the first transparent layer 22 and the second transparent layer 24 are made of silicon gel.

Specifically, the phosphor includes, but is not limited to, one or more of yellow phosphor, blue phosphor, green phosphor, red phosphor and three primary colors phosphor, for example, taking the LED package device emitting white light as an example, a blue LED chip and yellow phosphor, or a blue LED chip and red phosphor and green phosphor, or a violet LED chip and three primary colors phosphor may be selected. The fluorescent powder and the LED chip 21 have a matching problem, and when the overlapping range of the emission peak of the LED chip 21 and the excitation peak of the fluorescent powder is the largest, the luminous efficiency of the LED chip 21 and the fluorescent powder can be exerted to the greatest extent, so that the thickness of the fluorescent powder layer should be not less than 50 mm and not more than 300 mm.

It should be noted that the quantum dots are quasi-zero-dimensional nanocrystals, the grain diameter is between 2 and 20 nanometers, and the quantum dots can emit high-quality pure monochromatic light with various colors according to the diameter of the quantum dots when being stimulated by electricity or light. The quantum dots have narrow and symmetrical fluorescence emission peaks, and the multi-color quantum dots are not easy to have spectrum overlapping when being used simultaneously, so that the light emitting requirements of different LED packaging devices are met. The quantum dots are sensitive to water and oxygen, and the fluorescence efficiency can be irreversibly and rapidly reduced when the quantum dots are exposed to a water and oxygen environment, so that the quantum dots in the luminescent layer 23 need to be packaged to isolate water and oxygen, and the reliability of an LED packaging device is ensured.

Referring to fig. 1, fig. 3, fig. 5 and fig. 6, the light-emitting material of the light-emitting layer 23 is phosphor or quantum dots.

Specifically, the materials of the first transparent layer 22 and the second transparent layer 24 include, but are not limited to, silicone and other materials that have good transparency and can be adhered, and the materials of the first transparent layer 22 and the second transparent layer 24 are generally the same, but may be different.

The invention provides a manufacturing method of an LED packaging device, which comprises the following steps:

placing a chip scale packaging unit in a support with a bowl cup in a die bonding mode, wherein the upper surface of the chip scale packaging unit is not higher than the upper edge of the support;

dispensing a white glue into the vacant area in the support in a dispensing manner to form a white glue layer, wherein the white glue layer is arranged on the side surface of the chip scale packaging unit, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit;

and baking and curing the support carrying the white glue layer and the chip-scale packaging unit to obtain the LED packaging device.

The invention provides a manufacturing method of an LED packaging device, which comprises the following steps: the chip scale packaging unit is placed in the support with the bowl cup in a die bonding mode, the upper surface of the chip scale packaging unit is not higher than the upper edge of the support, then white glue is dispensed into a neutral area in the support in a dispensing mode to form a white glue layer, the white glue layer is placed around the chip scale packaging unit, one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit, and then the support with the white glue layer and the chip scale packaging unit is baked and cured to obtain the LED packaging device. The LED packaging device obtained by the technical scheme provided by the embodiment of the invention has single-sided light emission and relatively high reliability, light-emitting intensity, light-emitting efficiency and light-emitting uniformity. Meanwhile, the manufacturing process of the manufacturing method is simpler and easy to process, the manufacturing efficiency can be obviously improved, and the manufacturing cost is reduced.

Referring to fig. 2 or fig. 4, the chip scale package unit 2 is fixed at a designated position in the support 1 by solder paste or silica gel to form an electrical path or a thermal path, a white glue is dispensed into an empty area in the support 1 by a dispensing manner until the white glue is flush with the upper surface of the chip scale package unit 2, the upper surface of the white glue layer 3 is inclined inward, the contact position with the upper surface of the chip scale package unit 2 is in the same horizontal plane, a specific angle is generated with the upper edge of the support 1, and considering the state of the art, a small amount of white glue is allowed to be present around the upper surface of the chip scale package unit 2, and then the support 1 carrying the white glue layer 3 and the chip scale package unit 2 is placed into an oven to be baked and cured to obtain an LED package device, which has higher reliability, luminous intensity, luminous efficiency and light-emitting uniformity.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An LED package device, comprising: the support with the bowl cup is arranged on a chip scale packaging unit in the support, the chip scale packaging unit comprises an LED chip, a first transparent layer on the side surface of the LED chip and a light emitting layer on the upper surface of the LED chip and the upper surface of the first transparent layer, a white glue layer is arranged in a hollow gear area in the support, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit.

2. The LED packaged device of claim 1, wherein said first transparent layer is no greater than 100 microns thick.

3. The LED package device of claim 2, wherein the first transparent layer upper surface is flush with the LED chip upper surface, and the LED chip upper surface and the first transparent layer upper surface are bonded to the light emitting layer lower surface.

4. The LED packaged device of claim 1, wherein said chip scale packaging unit further comprises: the upper surface of the LED chip is bonded with the lower surface of the light emitting layer, and the thickness of the second transparent layer is not more than 100 microns.

5. The LED package device of claim 1, wherein the LED chip is any one of a face-up chip, a flip chip, and a vertical chip;

then, the support structure is any one of a front-mount structure, a flip-chip structure, and a vertical structure.

6. The LED packaged device of claim 1, wherein said light emitting layer is no greater than 300 microns thick.

7. The LED package device of claim 6, wherein the upper surface of the light emitting layer is flush with the upper edge of the support;

then, the upper surface of the white glue layer is flush with the upper surface of the light emitting layer.

8. The LED package device of claim 6, wherein an upper surface of the light emitting layer is lower than an upper edge of the support; then the process of the first step is carried out,

the upper surface of the white glue layer is inclined inwards and forms a specific angle with the upper edge of the bracket.

9. The LED package device of any of claims 1 to 8, wherein the light emitting material of the light emitting layer is phosphor or quantum dots; the first transparent layer and the second transparent layer are made of silica gel.

10. A method of manufacturing an LED packaged device according to claim 9, comprising:

placing a chip scale packaging unit in a support with a bowl cup in a die bonding mode, wherein the upper surface of the chip scale packaging unit is not higher than the upper edge of the support;

dispensing a white glue into the vacant area in the support in a dispensing manner to form a white glue layer, wherein the white glue layer is arranged on the side surface of the chip scale packaging unit, and one side of the upper surface of the white glue layer is connected with the upper edge area of the chip scale packaging unit;

and baking and curing the support carrying the white glue layer and the chip-scale packaging unit to obtain the LED packaging device.

Images