CN112203476B - Porous medium liquid film small channel cooling device - Google Patents
Porous medium liquid film small channel cooling device Download PDFInfo
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- CN112203476B CN112203476B CN202011086302.7A CN202011086302A CN112203476B CN 112203476 B CN112203476 B CN 112203476B CN 202011086302 A CN202011086302 A CN 202011086302A CN 112203476 B CN112203476 B CN 112203476B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
Abstract
The invention discloses a porous medium liquid film small channel cooling device, which relates to the technical field of electronic equipment cooling and comprises a channel cooling main body, wherein a porous structure is arranged in the channel cooling main body, a flowing liquid film layer is arranged between the lower surface of the porous structure and the inner bottom of the channel cooling main body, an air evaporation channel is arranged between the upper surface of the porous structure and the inner top of the channel cooling main body, an ultrasonic generator is embedded on the inner side wall of the channel cooling main body and is positioned at one side of the porous structure, and the porosity of the porous structure is linearly or step-wise increased from the bottom to the top. The invention adopts the porous structure with variable pores, improves the permeability and the specific surface area of the flowing liquid film in the porous structure along the heat production direction, effectively decouples the relation and conflict between the flowing performance and the heat transfer performance, improves the cooling performance of the cooling device, shortens the cooling time, promotes the micro-convection of the liquid in the pores of the porous structure under the action of the cavitation and the acoustic flow of the ultrasonic wave, and enhances the fluid disturbance.
Description
Technical Field
The invention relates to the technical field of small-channel cooling devices, in particular to a porous medium liquid film small-channel cooling device.
Background
At present, the safety and stability of the equipment work are increasingly highlighted due to the characteristics of high power, high heat flow density and the like of industrial equipment. The problem of heat dissipation and cooling in a small space becomes a major bottleneck limiting further improvement of the performance of the equipment, and therefore, a device with high-efficiency cooling performance needs to be designed. The flowing liquid film evaporation has high heat transfer performance and is widely applied to the industrial fields of electronic equipment cooling and the like. In the conventional channel cooling device, a single-layer porous structure covered with a constant porosity in a liquid film channel having a flow is mostly employed, thereby obtaining a low cooling performance. In such conventional designs, the conflict between available specific surface area and hydraulic permeability, the inability of the steam generated at the surface of the porous structure to dissipate in time, and the non-uniformity of the heat-generating endwall temperature become significant obstacles in designing high performance cooling channel structures. Since changes in porosity directly affect the porous media permeability and specific surface area, and thus the cooling performance of the device. For example, the increase of porosity can improve the permeability of a liquid film in a porous structure, and the fluid mainly takes convection heat exchange in the porous structure to enhance heat transfer; a corresponding increase in porosity leads to a decrease in the specific surface area, impairing heat transfer; therefore, the conventional liquid film evaporation cooler can increase the permeability of the porous structure and increase the specific surface area to obtain higher cooling performance. In practice, higher permeability and larger specific surface area are difficult to achieve simultaneously. Meanwhile, steam generated on the surface of the porous structure cannot be dissipated in time, and the cooling performance of the equipment is also affected.
The key to improve the cooling performance of the equipment is to solve the relation and conflict between permeability and specific surface area, dissipate steam generated on the surface of the porous structure and improve the uniformity of temperature in heat transfer.
Disclosure of Invention
In view of the above problems, the present invention provides a porous medium liquid film small channel cooling device.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a porous medium liquid film microchannel cooling device, includes passageway cooling main part, passageway cooling main part is the hollow structure of cuboid, wherein:
the multi-cavity structure is characterized in that a porous structure is transversely arranged in the channel cooling main body and divides the channel cooling main body into an upper cavity and a lower cavity, a flowing liquid film layer is arranged between the lower surface of the porous structure and the bottom in the channel cooling main body, an air evaporation channel is arranged between the upper surface of the porous structure and the top in the channel cooling main body, an ultrasonic generator is embedded in the inner side wall of the channel cooling main body and is positioned on one side of the porous structure, a flowing liquid film inlet is formed in one end of the channel cooling main body, a flowing liquid film outlet is formed in the other end of the channel cooling main body, the porous structure is positioned between the flowing liquid film inlet and the flowing liquid film outlet, and the porosity of the porous structure is linearly or stepwisely increased from the bottom to the top.
In the above porous medium liquid film small channel cooling device, an air inlet is formed on an upper side of one end of the channel cooling main body, an air outlet is formed on an upper side of the other end of the channel cooling main body, and both the air inlet and the air outlet are communicated with the air evaporation channel.
The porous medium liquid film small-channel cooling device is characterized in that the flowing liquid film inlet injects water as a flowing liquid film, and the flowing liquid film is discharged from the flowing liquid film outlet.
The porous medium liquid film small-channel cooling device is characterized in that the porous structure is formed by a single layer of porous medium, and the internal porosity of the porous structure is linearly increased from the bottom to the top.
The porous medium liquid film small-channel cooling device is characterized in that the porous structure is formed by a double-layer porous medium, and the internal porosity of the porous structure is distributed in a step increasing manner from the bottom to the top.
The porous medium liquid film small-channel cooling device is characterized in that the bottom of the channel cooling main body is connected with the heat generating end of the electronic device.
The above porous medium liquid film small channel cooling device, wherein the porous structure is made of copper foam metal.
Due to the adoption of the technology, compared with the prior art, the invention has the following positive effects:
1. the invention adopts the porous structure with variable pores, improves the permeability and the specific surface area of the flowing liquid film in the porous structure along the heat production direction, effectively decouples the relation and conflict between the flowing performance and the heat transfer performance, improves the cooling performance of the cooling device and shortens the cooling time.
2. The invention adopts the ultrasonic generator, promotes the micro-convection of the liquid in the pores of the porous structure under the action of the cavitation and the acoustic flow of the ultrasonic wave, and enhances the fluid disturbance, thereby obtaining better cooling effect.
3. According to the invention, air flow is input into the air evaporation channel, so that convective heat transfer of an evaporation interface and effective dispersion of steam can be effectively improved, continuous evaporation of a flowing liquid film is promoted, and high-efficiency cooling performance is obtained.
Drawings
FIG. 1 is a front sectional view of a porous medium liquid film small channel cooling device with linearly increased porosity according to the present invention.
FIG. 2 is a left-side sectional view of the porous medium liquid film small channel cooling device with linearly increased porosity according to the present invention.
FIG. 3 is a sectional view in a plan view of the porous medium liquid film small passage cooling device of the present invention in which the porosity linearly increases.
FIG. 4 is a front sectional view of the porous medium liquid film small channel cooling device with step-increased porosity of the invention.
FIG. 5 is a left side sectional view of the porous medium liquid film small channel cooling device with step-increase porosity of the invention.
FIG. 6 is a sectional view in plan view of the porous medium liquid film small channel cooling device with stepwise increased porosity according to the present invention.
Reference numerals: 1. a channel cooling body; 11. a flowing liquid film inlet; 12. a fluid film outlet; 13. an air flow inlet; 14. an air flow outlet; 2. a porous structure; 3. a layer of a flowing liquid film; 4. an air evaporation channel; 5. an ultrasonic generator; 6. an upper porous medium; 7. a lower porous medium.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings and specific embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "upper" and "lower", "inner" and "outer" as used herein are defined with reference to the relative positions of the components in the drawings of the present invention only for the clarity and convenience of the description of the technical solutions, and it should be understood that the application of the terms should not be construed as limiting the scope of the present application.
In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example 1
Referring to fig. 1, 2 and 3, the porous medium liquid film small channel cooling device provided by the embodiment of the present invention includes a channel cooling main body 1, the channel cooling main body 1 is a rectangular hollow structure, a porous structure 2 is transversely disposed in the channel cooling main body 1, the porous structure 2 divides the interior of the channel cooling main body 1 into an upper cavity and a lower cavity, a flowing liquid film layer 3 is disposed between a lower surface of the porous structure 2 and a bottom portion of the channel cooling main body 1, an air evaporation channel 4 is disposed between an upper surface of the porous structure 2 and a top portion of the channel cooling main body 1, an ultrasonic generator 5 is embedded in an inner side wall of the channel cooling main body 1, the ultrasonic generator 5 is located at one side of the porous structure 2, ultrasonic waves emitted by the ultrasonic generator 5 can improve micro-convection of fluid in the porous structure 2 and improve cooling performance of the cooling device, a flow inlet 11 is disposed at one end of the channel cooling main body 1, a flow liquid film outlet 12 is disposed at the other end of the channel cooling main body 1, the porous structure 2 is located between the flow inlet 11 and the flow liquid film outlet 12, and a porosity of the porous structure 2 linearly increases from the bottom portion to the top portion.
Further optimizing the embodiment, the porous structure 2 is composed of a single-layer porous medium, the internal porosity of the porous structure 2 is linearly increased and distributed from the bottom to the top, the porosity is gradually increased along the heat production direction, the gradual change range of the porosity of the porous structure 2 is 0.5-0.9, the pore diameter range of the porous structure 2 is 0.5-1 mm, the thickness of the porous structure 2 is 10mm, the frequency range of ultrasonic waves generated by the ultrasonic generator 5 is 50-100 khz, and the ultrasonic intensity range is 0-6000W/m 2 。
In this embodiment, water is injected from the fluid film inlet 11 as a fluid film, flows through the porous structure 2 and the fluid film layer 3, and is finally discharged from the fluid film outlet 12, so that heat is efficiently transferred in the channel cooling body 1.
And the bottom of the channel cooling main body 1 is connected with the heat generating end of the electronic device and used for absorbing heat of the heat generating end of the electronic device and performing heat dissipation treatment.
Further, airflow inlet 13 has been seted up to the upside of the one end of passageway cooling main part 1, airflow outlet 14 has been seted up to the upside of the other end of passageway cooling main part 1, airflow inlet 13 and airflow outlet 14 all are linked together with air evaporation passageway 4, the heat that electron device produced the hot end has been absorbed to mobile liquid film layer 3, can produce steam, steam passes through porous structure 2 and gets into in the air evaporation passageway 4, input the air current in the airflow inlet 13, the steam that the air current dispels the production, steam flows out from airflow outlet 14, guarantee that the evaporation of mobile liquid film is gone on continuously.
In the present embodiment, the porous structure 2 employs a copper foam metal.
Example 2
The invention provides a porous medium liquid film small channel cooling device, please refer to fig. 4, fig. 5 and fig. 6, which includes a channel cooling main body 1, the channel cooling main body 1 is a cuboid hollow structure, a porous structure 2 is transversely arranged in the channel cooling main body 1, the porous structure 2 divides the channel cooling main body 1 into an upper cavity and a lower cavity, a flowing liquid film layer 3 is arranged between the lower surface of the porous structure 2 and the bottom of the channel cooling main body 1, an air evaporation channel 4 is arranged between the upper surface of the porous structure 2 and the top of the channel cooling main body 1, an ultrasonic generator 5 is embedded on the inner side wall of the channel cooling main body 1, the ultrasonic generator 5 is positioned on one side of the porous structure 2, one end of the channel cooling main body 1 is provided with a flowing liquid film inlet 11, the other end of the channel cooling main body 1 is provided with a flowing liquid film outlet 12, the porous structure 2 is positioned between the flowing liquid film inlet 11 and the flowing liquid film outlet 12, and the porosity of the porous structure 2 increases from the bottom to the top.
In a further optimization of the above embodiment, the porous structure 2 is formed by two layers of porous media, the internal porosity of the porous structure 2 increases in a stepwise manner from the bottom to the top, the porous structure 2 includes an upper layer of porous media 6 and a lower layer of porous media 7, the porosity of the lower layer of porous media 7 is constant and is 0.5, the porosity of the upper layer of porous media 6 is 0.6, 0.7, 0.8 or 0.9, the thicknesses of the upper layer of porous media 6 and the lower layer of porous media 7 are 1:3, 2:2 or 3:1, and the upper layer of porous media 6 and the lower layer of porous media 7 are welded in a seamless manner.
Further, inlay on the same inside wall of passageway cooling main part 1 and be equipped with two supersonic generator 5, two supersonic generator 5 are located the left and right sides of the inside wall of passageway cooling main part 1, and two supersonic generator 5 all face porous structure 2.
The length of the channel cooling body 1 is 140mm, the width of the channel cooling body 1 is 40mm, the height of the channel cooling body 1 is 15mm, the flow speed of the input air flow in the air flow inlet 13 is 3-7 m/s, the speed of the input fluid film in the fluid film inlet 11 is 0.05-0.1 m/s, the thickness of the fluid film layer 3 is controlled to be 0.5-2 mm, and the thickness of the porous structure 2 is 10mm.
In a specific implementation mode, the variable-pore porous structure 2 covered by the flowing liquid film penetrates into the variable-pore porous structure 2 under the driving of capillary force, steam generated in the evaporation heat transfer process of the liquid film can be dissipated by air from the air inlet 13, and the micro-convection of liquid in pores of the porous structure 2 is promoted by ultrasonic waves in the channel cooling main body 1, so that the wall surface is well cooled. The inner bottom surface of the channel cooling body 1 employs a polished surface to reduce the flow resistance of the fluid.
The porosity of the porous structure 2 is increased gradually or step by step, so that the heat convection area can be increased, and the heat conduction and convection of fluid in the porous structure 2 are promoted; the micro convection of the fluid in the porous structure 2 can be promoted under the cavitation and acoustic flow of the ultrasonic waves, the liquid disturbance is enhanced, and the heat transfer is enhanced, so that better cooling is obtained; the air evaporation channel 4 enhances the convective heat transfer of the evaporation interface, and improves the continuous proceeding of the surface evaporation on the porous structure 2, thereby obtaining a lower temperature at the bottom connected with the heat generating end of the electronic device. The invention improves the cooling performance of the small-channel cooling device and has the advantages of reasonable structure, easy manufacture, high reliability, light weight and small volume.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The utility model provides a porous medium liquid film small channel cooling device, includes passageway cooling main part (1), passageway cooling main part (1) is the hollow structure of cuboid, be provided with porous structure (2) along transversely in passageway cooling main part (1), porous structure (2) will divide into two upper and lower cavitys in passageway cooling main part (1), the lower surface of porous structure (2) with be flowing liquid film layer (3) between passageway cooling main part (1) interior bottom, the upper surface of porous structure (2) with be air evaporation passageway (4) between passageway cooling main part (1) interior top, flowing liquid film import (11) has been seted up to the one end of passageway cooling main part (1), flowing liquid film export (12) has been seted up to the other end of passageway cooling main part (1), porous structure (2) are located flowing liquid film import (11) with between flowing liquid film export (12), its characterized in that, the porosity of porous structure (2) is from the bottom to the linear or the step increase of top.
2. The porous medium liquid film small channel cooling device according to claim 1, wherein the inner side wall of the cooling main body (1) is embedded with an ultrasonic generator (5), and the ultrasonic generator (5) is positioned at one side of the porous structure (2).
3. The porous medium liquid film small channel cooling device as claimed in claim 1, wherein the upper side of one end of the channel cooling main body (1) is opened with an air inlet (13), the upper side of the other end of the channel cooling main body (1) is opened with an air outlet (14), and the air inlet (13) and the air outlet (14) are both communicated with the air evaporation channel (4).
4. The porous medium liquid film microchannel cooling device according to claim 1, wherein the flowing liquid film inlet (11) injects water as a flowing liquid film and is discharged from the flowing liquid film outlet (12).
5. The porous medium liquid membrane small channel cooling device as claimed in claim 1, wherein the porous structure (2) is composed of a single layer of porous medium, and the internal porosity of the porous structure (2) is distributed in a linear increasing way from the bottom to the top.
6. The porous media liquid film minichannel cooling device of claim 1, wherein the porous structure (2) is comprised of a double layer of porous media, the internal porosity of the porous structure (2) increasing in steps from bottom to top.
7. The porous medium liquid film small channel cooling device according to claim 1, wherein the bottom of the channel cooling body (1) is connected with the heat generating end of the electronic device.
8. The porous medium liquid membrane small channel cooling device as claimed in claim 1, wherein the porous structure (2) is made of copper foam metal.
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| CN202011086302.7A CN112203476B (en) | 2020-10-12 | 2020-10-12 | Porous medium liquid film small channel cooling device |
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| CN112765913B (en) * | 2021-04-08 | 2021-06-29 | 中国空气动力研究与发展中心计算空气动力研究所 | Layered gradient porous material sweating cooling structure and aircraft |
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| TW200724010A (en) * | 2005-12-02 | 2007-06-16 | Cooler Master Co Ltd | Water-cooling head and the manufacturing method |
| CN1971195A (en) * | 2006-12-01 | 2007-05-30 | 西安交通大学 | Flat heat pipe for thermal diffusion |
| CN101052290A (en) * | 2007-05-11 | 2007-10-10 | 华南理工大学 | High efficiency heat radiation cool plate for electronic device |
| JP2012132661A (en) * | 2010-12-01 | 2012-07-12 | Fujitsu Ltd | Cooling device and electronic device |
| CN102278904B (en) * | 2011-07-29 | 2013-03-06 | 华北电力大学 | Internal liquid-dividing hood-type condensed heat-exchanging pipe |
| DE102012207478B4 (en) * | 2012-05-07 | 2016-06-23 | Siemens Aktiengesellschaft | System and method for heat dissipation |
| CN107846812B (en) * | 2016-09-20 | 2020-04-21 | 宁波三星智能电气有限公司 | Double-fan type heat dissipation device and heat dissipation method of charging pile and charging pile |
| CN106524804A (en) * | 2016-11-09 | 2017-03-22 | 中山大学 | Microgravity condition based porous medium heat dissipating device and method thereof |
| CN106455454A (en) * | 2016-12-02 | 2017-02-22 | 中国船舶重工集团公司第七二四研究所 | Cold plate based on capillary and small passage composite structure |
| EP3471523B1 (en) * | 2017-10-10 | 2023-07-26 | Veoneer Sweden AB | Ecu cooling arrangement |
| JP2019158200A (en) * | 2018-03-09 | 2019-09-19 | 学校法人東京理科大学 | Cooling device, cooling system and method for manufacturing porous body |
| JP7146524B2 (en) * | 2018-08-13 | 2022-10-04 | 新光電気工業株式会社 | Loop type heat pipe and its manufacturing method |
| CN209710551U (en) * | 2018-11-01 | 2019-11-29 | 南京艾科美热能科技有限公司 | A kind of radiator based on gas-liquid exchange |
| CN209766407U (en) * | 2019-06-18 | 2019-12-10 | 上海交通大学 | Air-cooled high-power high-heat-flow heat dissipation device |
| CN110572990A (en) * | 2019-09-12 | 2019-12-13 | 北京交通大学 | Impact cooling type corrugated surface composite enhanced heat dissipation device |
| CN111599776A (en) * | 2020-06-04 | 2020-08-28 | 北京工业大学 | Multi-layer composite nano-porous evaporator |
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