CN112181078B - Server and computer system - Google Patents
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- CN112181078B CN112181078B CN202011027081.6A CN202011027081A CN112181078B CN 112181078 B CN112181078 B CN 112181078B CN 202011027081 A CN202011027081 A CN 202011027081A CN 112181078 B CN112181078 B CN 112181078B
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- 230000017525 heat dissipation Effects 0.000 description 18
- 230000006870 function Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a server mainboard, a server and a computer system, belongs to the technical field of server equipment, and solves the problem that the mainboard cannot be compatible with front and rear fans in the prior art. The main board includes: a main board body; the main board body is provided with a BMC connector, a CPLD connector, a front fan connector and a rear fan connector; the BMC connector is connected with the CPLD connector through the inner layer wiring of the mainboard body; the front fan connector and the rear fan connector are respectively connected with the CPLD connector through the inner layer wiring of the main board body.
Description
Technical Field
The invention relates to the technical field of server equipment, in particular to a server mainboard, a server and a computer system.
Background
For a general 2U type fan, the fan is generally placed between a hard disk and a main board on the front side of a case, and a power supply, a Riser, an IO board and the like are arranged on the rear side of the case. Each fan has a two-part rotor: the rotor near the hard disk end sucks cold air from the front side of the case, and the rotor near the main board end discharges hot air from the rear side of the case through the main board.
For such a motherboard structure, if the system front IO configuration is to be implemented, board cards such as Riser cards and IO boards need to be placed on the front side of the chassis, and if the fan is placed on the front side of the chassis, the fan may interfere with the Riser cards and the external plug-in cards connected thereto, so that the fan needs to be moved to the rear side of the chassis, which causes the fan to be far away from the fan connector on the motherboard, and the fan connector needs to be connected through a long cable.
According to current design, when the configuration of leading IO needs to be supported, just need move the fan to quick-witted case rear side, and the cable length of same model fan is fixed under the general condition, need configure to this and customize longer connecting cable to the fan to company's whole management and control cost has been increased. In addition, because the fan signal line is long in wiring inside the case, the PWM signal and the rotating speed signal in the cable can be influenced by certain external interference on one hand, certain risks are brought to heat dissipation regulation and control, and on the other hand certain negative influences can be brought to EMI of the whole machine.
Secondly, for the front-mounted IO configuration and the rear-mounted IO configuration, the overall heat dissipation strategy of the system is different, but under the current mainboard architecture, the BMC cannot automatically identify whether the system is in the front-mounted IO configuration or the rear-mounted IO configuration, so that the heat dissipation strategy cannot be automatically adjusted. In addition, 6 fans of the first type are needed under the front IO configuration, but for the rear IO configuration, because the power source occupies a part of space, the fans of the first type cannot be placed, and only two fans of the second type with less quantity but larger single body can be placed to ensure the heat dissipation effect.
Disclosure of Invention
The invention aims to provide a mainboard of a server, the server and a computer system, so as to solve the technical problem that the mainboard cannot be compatible with front and rear fans in the prior art.
In a first aspect, the present invention provides a motherboard of a server, including:
a main board body;
the main board body is provided with a BMC connector, a CPLD connector, a front fan connector and a rear fan connector;
the BMC connector is connected with the CPLD connector through the inner layer wiring of the mainboard body;
the front fan connector and the rear fan connector are respectively connected with the CPLD connector or the BMC connector through the inner layer wiring of the mainboard body.
Further, the number of the front fan connectors is 6, and the number of the rear fan connectors is 4.
In a second aspect, the present invention further provides a server, where the server includes the motherboard of the foregoing invention;
the BMC connector of the mainboard is provided with a BMC, and the CPLD connector of the mainboard is provided with a CPLD;
the front fan connector of the mainboard is provided with a front fan, or the rear fan connector of the mainboard is provided with a rear fan.
Further, a first PWM output end of the BMC is connected to an input end of a PWM switcher of the CPLD, a first output end of the PWM switcher is connected to the first set of front fan connectors, and a second output end of the PWM switcher is connected to the rear fan connectors;
the first TACH input end of the BMC is connected to the output end of a TACH switcher of the CPLD, the first input end of the TACH switcher is connected to the first group of front fan connectors, and the second input end of the TACH switcher is connected to the rear fan connectors.
Further, a second PWM output terminal of the BMC is connected to a second set of front-mounted fan connectors;
and the second TACH input end of the BMC is connected to the second group of front-mounted fan connectors.
Further, the server also comprises an in-place signal chip;
the front fan connector and the rear fan connector are connected with the input end of the in-place signal chip, and the output end of the in-place signal chip is connected with the I2C input end of the BMC.
Further, the front fan connector is provided with a 6056 model fan, or the rear fan connector is provided with an 8056 model fan.
In a third aspect, the present invention also provides a computer system comprising the server according to the second aspect.
The mainboard and the server of the server provided by the invention have the advantages that the fan connectors are arranged at the front end and the rear end of the mainboard, the fan is installed, the in-place signal of the fan is sent to the I2C input end of the BMC through the in-place chip, the BMC sends a control command to the CPLD according to the in-place signal of the fan, the CPLD sends a signal to the rear fan connector according to the control command, or the CPLD sends a signal to the first group of front fan connectors according to the control command, the BMC directly sends the control command to the second group of front fan connectors to further control the rotation of the fan, the feedback signal of the fan connectors is fed back to the BMC through corresponding channels, and the BMC adjusts the cooling strategies such as the rotating speed of the fan through the feedback signal, so that the heat dissipation mainboard device compatible with the front and the rear fans is finally realized.
Accordingly, the computer system provided by the embodiment of the invention also has the technical effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of a motherboard of a server according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a server according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
For the front-mounted IO configuration and the rear-mounted IO configuration, the overall heat dissipation strategy of the system is different, but under the current mainboard architecture, the BMC cannot automatically identify whether the system is in the front-mounted IO configuration or the rear-mounted IO configuration, so that the heat dissipation strategy cannot be automatically adjusted. In addition, 6 fans of the first type are needed under the front IO configuration, but for the rear IO configuration, because the power source occupies a part of space, the fans of the first type cannot be placed, and only two fans of the second type with less quantity but larger single body can be placed to ensure the heat dissipation effect. Based on such a situation, the BMC is also required to automatically recognize the current configuration, so as to automatically adjust the heat dissipation strategy to ensure the heat dissipation effect under different configurations.
As shown in fig. 1, a motherboard of a server provided in an embodiment of the present invention includes:
a main board body; the main board body is provided with a BMC connector 1, a CPLD connector 2, a front fan connector 3 and a rear fan connector 4; the BMC connector 1 is connected with the CPLD connector 2 through an inner layer of the mainboard body in a wiring mode; the front fan connector 3 and the rear fan connector 4 are respectively connected with the CPLD connector 2 or the BMC connector 1 through inner layer wiring of the mainboard body.
According to the host of the server, the fan connectors are arranged at the front end and the rear end of the mainboard, the fan is installed, the fan in-place signal is sent to the I2C input end of the BMC through the in-place chip, the BMC sends a control command to the CPLD according to the fan in-place signal, and the CPLD sends a signal to the rear fan connector according to the control command; or the CPLD sends signals to the first group of front-mounted fan connectors according to the control commands, the BMC directly sends the control commands to the second group of front-mounted fan connectors so as to control the fans to rotate, feedback signals of the fan connectors are fed back to the BMC through corresponding channels, the BMC adjusts heat dissipation strategies such as fan rotating speed through the feedback signals, and the like, and finally the heat dissipation mainboard device compatible with the front-mounted fans and the rear-mounted fans is achieved.
In one possible embodiment, the number of front fan connectors is 6 and the number of rear fan connectors is 4. More fan connectors are arranged on two sides of the main board, so that a better heat dissipation effect is achieved.
The embodiment of the invention also provides a server, which comprises the mainboard of the server provided by the embodiment of the invention; the BMC connector of the mainboard is provided with a BMC, and the CPLD connector of the mainboard is provided with a CPLD; the front fan connector of the mainboard is provided with a front fan, or the rear fan connector of the mainboard is provided with a rear fan.
According to the server provided by the invention, the fan connectors are arranged at the front end and the rear end of the mainboard, the fan is installed, the fan in-place signal is sent to the I2C input end of the BMC through the in-place chip, the BMC sends a control command to the CPLD according to the fan in-place signal, and the CPLD sends a signal to the rear fan connector according to the control command; the CPLD sends signals to the first group of front-mounted fan connectors or the BMC directly sends control commands to the second group of front-mounted fan connectors according to the control commands so as to control the fans to rotate, feedback signals of the fan connectors are fed back to the BMC through corresponding channels, the BMC adjusts heat dissipation strategies such as fan rotating speed and the like through the feedback signals, and finally the heat dissipation mainboard device compatible with the front-mounted fans and the rear-mounted fans is achieved.
In a possible implementation manner, the first PWM output end of the BMC is connected to the input end of the PWM switcher of the CPLD, the first output end of the PWM switcher is connected to the first set of front fan connectors, and the second output end of the PWM switcher is connected to the rear fan connector;
the first TACH input end of the BMC is connected to the output end of a TACH switcher of the CPLD, the first input end of the TACH switcher is connected to the first group of front fan connectors, and the second input end of the TACH switcher is connected to the rear fan connectors.
Through the connection mode, the BMC can send out a control command, and the CPLD sends the command to the front fan or the rear fan to realize a compatible function.
In one possible embodiment, the second PWM output of the BMC is connected to a second set of front fan connectors;
and the second TACH input end of the BMC is connected to the second group of front-mounted fan connectors.
And the control of the two additional fans arranged in front is realized through the second output and input end.
In a possible implementation, the main board further includes an in-place signal chip;
the front fan connector and the rear fan connector are connected with the input end of the in-place signal chip, and the output end of the in-place signal chip is connected with the I2C input end of the BMC.
Through the in-place chip and the corresponding line, the in-place signal of the fan can be sent to the BMC, and then the BMC can judge the in-place condition of the fan.
In a possible embodiment, the front fan connector is provided with a 6056 model fan, or the rear fan connector is provided with an 8056 model fan.
The actual available space of the front and rear fans is different, and the fans of the type can be used for placing the largest number of fans, so that the best heat dissipation effect is achieved.
The server provided by the embodiment of the invention has the following specific implementation modes:
adding a certain number of fan connectors on one side of the existing mainboard close to the power connector, namely placing 4 fan connectors on the rear side of the mainboard; when the rear IO configuration is adopted, the fans are placed on the front side of the case, 6 fans of 6056 models can be adopted, and when the front IO configuration is adopted, the fans are placed on the rear side of the case, 4 fans of 8056 models can be adopted.
Particularly, when the rear IO configuration is adopted, the rear fan connector of the mainboard can be selected not to be loaded (namely, the unoccupied pins of the original board card are used), and when the front IO configuration is adopted, the front fan connector of the mainboard can be selected not to be loaded, so that the cost of the mainboard is ensured not to rise to the maximum extent;
the PWM signal design of the mainboard is shown in FIG. 2, the BMC outputs 6 paths of PWM signals for controlling the rotating speed of the FAN, wherein PWM5-6 is directly connected to Front FAN5-6 of the Front FAN connector; after the PWM1-4 is sent to the CPLD, the internal logic realizes the function of switch switching, and the FAN Select signal output by the BMC controls the PWM1-4 to be switched to Front FAN1-4 or reader FAN1-4. Meanwhile, the CPLD is used as a switch to switch instead of directly outputting a path of signal by the BMC, and the CPLD is connected to the front fan connector and the rear fan connector after being branched, so that the functions of enhancing signal driving and reducing link EMI and stub can be achieved.
The design of the TACH signal of the mainboard is shown in FIG. 2, and the rotating speed feedback signals TACH9-12 of Front FAN5-6 are directly connected to the BMC; the rotating speed feedback signals TACH1-8 of the Front FAN1-4 and the Rear FAN1-4 are both connected to the CPLD, the internal logic of the CPLD realizes the function of switch switching, and the switch is also controlled by the FAN Select signal output by the BMC.
The in-place signals of the front fan and the rear fan are transmitted to an I2C expander chip (in-place chip) on the mainboard through the fan connectors, the BMC can judge whether the current configuration is the front IO configuration or the rear IO configuration through the in-place signals of the fans, the front fan is in the rear IO configuration when in place, and the rear fan is in the front IO configuration when in place. And the BMC can output a FAN Select signal to the CPLD to control the switch logic function inside the CPLD.
After the BMC identifies the current system configuration through the in-place signal, different heat dissipation strategies can be adjusted according to different configurations to control the duty ratio of the PWM signal, finally different rotating speeds of the fan are controlled, and different heat dissipation requirements under front and rear IO configurations are met.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Corresponding to the device, the embodiment of the invention also provides a computer system, and the computer system comprises the server.
The apparatus provided in the embodiment of the present invention may be specific hardware on the device, or software or firmware installed on the device, or the like. The device provided by the embodiment of the present invention has the same implementation principle and technical effect as the foregoing embodiments, and for the sake of brief description, reference may be made to the corresponding contents in the foregoing embodiments without reference to the apparatus embodiments. It can be clearly understood by those skilled in the art that, for convenience and simplicity of description, the specific working processes of the systems, apparatuses and units described above may all refer to the corresponding processes in the above embodiments, and are not described herein again.
In the embodiments provided by the present invention, it should be understood that the disclosed apparatus may be implemented in other manners. The apparatus embodiments described above are merely illustrative and, for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
For another example, the division of the unit is only one logical function division, and there may be another division in actual implementation, and for another example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments provided by the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention or a part thereof, which essentially contributes to the prior art, can be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the apparatus according to the embodiments of the present invention. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus once an item is defined in one figure, it need not be further defined and explained in subsequent figures, and moreover, the terms "first", "second", "third", etc. are used merely to distinguish one description from another and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still make modifications or changes to the embodiments described in the foregoing embodiments, or make equivalent substitutions for some features, within the scope of the disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention. Are intended to be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. A server, comprising a motherboard of the server, the motherboard comprising:
a main board body;
the mainboard body is provided with a BMC connector, a CPLD connector, a front fan connector and a rear fan connector;
the BMC connector is connected with the CPLD connector through wiring of the inner layer of the mainboard body;
the front fan connector and the rear fan connector are respectively connected with the CPLD connector or the BMC connector through inner-layer wiring of the mainboard body;
the BMC connector of the mainboard is provided with a BMC, and the CPLD connector of the mainboard is provided with a CPLD;
the front fan connector of the mainboard is provided with a front fan, or the rear fan connector of the mainboard is provided with a rear fan;
the front fan connector and the rear fan connector are connected to the input end of an in-place signal chip, and the output end of the in-place signal chip is connected with the I2C input end of the BMC.
2. The server according to claim 1, wherein the first PWM output of the BMC is connected to an input of a PWM switch of the CPLD, the first output of the PWM switch is connected to the first set of front fan connectors, and the second output of the PWM switch is connected to the rear fan connector;
the first TACH input end of the BMC is connected to the output end of a TACH switcher of the CPLD, the first input end of the TACH switcher is connected to the first group of front fan connectors, and the second input end of the TACH switcher is connected to the rear fan connectors.
3. The server of claim 1, wherein the second PWM output of the BMC is connected to a second set of front-facing fan connectors;
and the second TACH input end of the BMC is connected to the second group of front-mounted fan connectors.
4. The server of claim 1, wherein the front fan connector is provided with a model 6056 fan or the rear fan connector is provided with a model 8056 fan.
5. The server of claim 1, wherein the number of front fan connectors is 6 and the number of rear fan connectors is 4.
6. A computer system comprising a server according to any one of claims 1 to 5.
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EP2529313A4 (en) * | 2010-01-29 | 2016-03-16 | Hewlett Packard Development Co | Methods and systems for an interposer board |
CN103455114A (en) * | 2012-05-30 | 2013-12-18 | 鸿富锦精密工业(深圳)有限公司 | Server cabinet radiating module and server cabinet |
US20190286590A1 (en) * | 2018-03-14 | 2019-09-19 | Quanta Computer Inc. | Cpld cache application in a multi-master topology system |
US11119876B2 (en) * | 2018-10-09 | 2021-09-14 | Super Micro Computer, Inc. | Device and method for testing computer system |
CN109882439B (en) * | 2019-03-19 | 2021-04-20 | 浪潮商用机器有限公司 | Fan control system, method and server |
CN110107523B (en) * | 2019-05-13 | 2020-09-04 | 苏州浪潮智能科技有限公司 | Fan control board card based on DSP coprocessing |
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