CN112128474A

CN112128474A - Arrangement jig for laser equipment integrated pipelines

Info

Publication number: CN112128474A
Application number: CN202010976151.6A
Authority: CN
Inventors: 陆昱成; 章斌
Original assignee: Suzhou Keyun Laser Technology Co Ltd
Current assignee: Suzhou Keyun Laser Technology Co Ltd
Priority date: 2020-09-16
Filing date: 2020-09-16
Publication date: 2020-12-25

Abstract

The invention relates to the technical field of automation equipment, in particular to a laser equipment integrated pipeline arrangement jig which comprises a first base plate, two opposite first side plates, a second base plate and two opposite second side plates, wherein the first side plates and the first base plate are arranged at an included angle, and one ends of the two first side plates are respectively connected with two ends of the first base plate. Two ends of the second substrate are respectively connected with the two first side plates so as to form a first accommodating space with the first substrate and the two first side plates. The second side plates and the second base plate are arranged at included angles, and one ends of the two second side plates are respectively connected with the second base plate. The second side plate and the first side plate are arranged at intervals to form a second containing space by enclosing the first side plate and the second substrate. The two second side plates and the second substrate enclose a third accommodating space. The plurality of accommodating spaces are used for accommodating and arranging different types of pipelines. The invention can be applied to different automation equipment and different positions of the automation equipment according to the requirements, and has good universality.

Description

Arrangement jig for laser equipment integrated pipelines

Technical Field

The invention relates to the technical field of automation equipment, in particular to an arrangement jig for an integrated pipeline of laser equipment.

Background

The pipelines in the automation equipment are more, and the pipelines are divided into electric lines, air paths, water paths and the like. The number of electrical and gas lines in automation devices is particularly high and complex. In a limited space, it is generally difficult to distribute the various electrical and gas lines in an orderly manner. When the automation equipment fails, maintenance personnel need to spend a great deal of time to separate and clean the electric lines or the gas circuits. Therefore, the reason is difficult to be checked, and the maintenance difficulty is high.

In order to reduce the degree of difficulty of maintenance, the winding displacement structure of switch board electric wire has been disclosed at present (CN210640490), and this winding displacement structure of switch board electric wire includes the box, and the inside back wall upper end fixedly connected with winding displacement device No. one of box, the inside left side wall threaded connection of box have No. two winding displacement devices, and the top and the bottom of box all reserve there is the line hole. This winding displacement structure of switch board electric wire can only be used for arranging the electric wire way, and the commonality is weak.

Disclosure of Invention

The invention aims to provide a laser equipment integrated pipeline arrangement jig with good universality.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a tool is arranged to laser equipment integrated circuit, includes:

a first substrate;

the first side plates are opposite to each other, included angles are formed between the first side plates and the first base plate, and one ends of the two first side plates are respectively connected with two ends of the first base plate;

two ends of the second substrate are respectively connected with the two first side plates so as to form a first accommodating space with the first substrate and the two first side plates;

the second side plates are opposite to each other, included angles are formed between the second side plates and the second base plate, and one ends of the two second side plates are respectively connected with the second base plate; the second side plate and the first side plate are arranged at intervals to form a second accommodating space together with the first side plate and the second base plate; and a third accommodating space is formed by the two second side plates and the second substrate.

Preferably, in the arrangement jig for the integrated pipelines of the laser device, mounting holes are distributed on the first substrate or the first side plate or the second side plate.

Preferably, in the arrangement jig for the integrated pipelines of the laser device, mounting holes extending along the width direction of the first substrate or the first side plate or the second side plate are distributed on the first substrate or the first side plate or the second side plate.

Preferably, in the above arrangement jig for an integrated circuit of a laser device, the second substrate is a solid plate.

Preferably, in the arrangement jig for the laser device integrated pipelines, the arrangement jig for the laser device integrated pipelines further includes a first bottom plate, and the first bottom plate is connected to the other end of the first side plate and extends outward.

Preferably, in the arrangement jig for the laser device integrated pipelines, the arrangement jig for the laser device integrated pipelines further includes a second bottom plate, and the second bottom plate is connected to the other end of the second side plate and extends outward.

Preferably, in the arrangement jig for the integrated pipeline of the laser device, the first bottom plate is connected with the second bottom plate, so that the second accommodating space forms a space with a closed periphery.

Preferably, in the above arrangement jig for an integrated circuit of a laser device, the first bottom plate and the second bottom plate are coplanar.

Preferably, in the arrangement jig for the integrated pipeline of the laser device, the first substrate, the first side plate and the first bottom plate are integrally formed by bending.

Preferably, in the above arrangement jig for an integrated circuit of a laser device, the second substrate, the second side plate, and the second bottom plate are integrally formed.

The laser equipment integrated pipeline arrangement jig has the beneficial effects that: a first accommodating space, a second accommodating space, and a third accommodating space are formed to accommodate and arrange different types of pipes. In addition, the laser equipment integrated pipeline arrangement jig is used as a single structural component and can be applied to different automatic equipment and arranged at different positions of the automatic equipment according to requirements. The arrangement jig for the laser equipment integrated pipeline has good universality.

Drawings

Fig. 1 is a perspective view of a laser device integrated circuit arrangement jig according to an embodiment of the present invention in a use state;

FIG. 2 is an exploded view of FIG. 1;

fig. 3 is a perspective view of an integrated pipeline arrangement jig of a laser device according to an embodiment of the present invention;

fig. 4 is an end view of an integrated circuit arrangement jig of a laser device according to an embodiment of the present invention.

The component names and designations in the drawings are as follows:

the base plate comprises a first base plate 10, a first side plate 20, a first bottom plate 30, a fixing hole 31, a second base plate 40, a second side plate 50, a second bottom plate 60, a first accommodating space 71, a second accommodating space 72, a third accommodating space 73, a mounting hole 80, an electric line 200, an air path 300 and a water path 400.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

Fig. 1 is a perspective view of a laser device integrated circuit arrangement jig according to an embodiment of the present invention in a use state. Fig. 2 is an exploded view of fig. 1. Fig. 3 is a perspective view of an integrated circuit arrangement jig of a laser device according to an embodiment of the invention. As shown in fig. 1-3, the present embodiment discloses a laser device integrated pipeline arrangement jig, which includes a first substrate 10, two opposite first side plates 20, a second substrate 40, and two opposite second side plates 50, wherein the first side plates 20 and the first substrate 10 are disposed at an included angle, and one end of each of the two first side plates 20 is connected to two ends of the first substrate 10. Two ends of the second base plate 40 are respectively connected with the two first side plates 20 to enclose a first accommodating space 71 with the first base plate 10 and the two first side plates 20. The second side plates 50 are disposed at an included angle with the second substrate 40, and one end of each of the two second side plates 50 is connected to the second substrate 40. The second side plate 50 is spaced apart from the first side plate 20 to form a second accommodating space 72 with the first side plate 20 and the second base plate 40. The two second side plates 50 and the second base plate 40 enclose a third accommodating space 73.

The laser device integrated circuit arrangement jig of the present embodiment forms a first accommodating space 71, a second accommodating space 72, and a third accommodating space 73 to accommodate and arrange different types of circuits. In addition, the laser device integrated pipeline arrangement jig of the embodiment is used as an independent structural member, and can be applied to different automation devices and arranged at different positions of the automation devices according to requirements. The laser equipment integrated pipeline arrangement jig of the embodiment has good universality.

Specifically, the first side plate 20 of the present embodiment is disposed perpendicular to the first base plate 10, the second base plate 40 is disposed parallel to the first base plate 10, and the second side plate 50 is disposed perpendicular to the second base plate 40 to form a first accommodating space 71, a second accommodating space 72, and a third accommodating space 73, which have rectangular end faces, so as to facilitate arrangement of the electric lines 200, the air paths 300, and the water paths 400.

Hereinafter, the integrated circuit arrangement jig for laser device of the present embodiment will be described by arranging the electric lines 200, the air circuits 300 and the water circuits 400 at the same time, wherein the electric lines 200 are accommodated and arranged in the first accommodating space 71, the air circuits 300 are accommodated and arranged in the second accommodating space 72, and the water circuits 400 are accommodated and arranged in the third accommodating space 73. When the staff is in maintenance, can find the corresponding pipeline region easily.

In other embodiments, the integrated circuit arrangement jig of the laser device may also arrange only the electric circuit, only the air circuit, or only the water circuit. In other embodiments, the laser device integrated circuit arrangement jig may further arrange any two of an electric line, an air path, and a water path.

The laser device integrated pipeline arrangement jig of the embodiment can be installed inside the automation device, and also can be installed outside the automation device. Preferably, the integrated circuit arrangement jig for laser equipment of the present embodiment is disposed in an area where the electric circuit 200, the air circuit 300 and the water circuit 400 are dense.

Preferably, the first base plate 10, the first side plate 20 or the second side plate 50 are distributed with mounting holes 80. The mounting holes 80 are provided to facilitate fixing of the electric lines 200, the air paths 300, and the water paths 400, and for example, the electric lines 200, the air paths 300, and the water paths 400 may be fixed to the laser device integrated circuit arrangement jig by a strap.

Preferably, the first base plate 10, the first side plate 20, or the second side plate 50 has mounting holes 80 distributed thereon and extending along the width direction thereof. Further preferably, the first base plate 10, the first side plate 20 and the second side plate 50 are distributed with mounting holes 80. After the plurality of electric wires 200 are classified, they are arranged along the longitudinal direction of the first substrate 10 and fixed to the first substrate 10 by a binding band passing through the adjacent mounting holes 80. After the air passages 300 are classified, they are arranged along the longitudinal direction of the first side plate 20 and fixed to the first side plate 20 by means of bands passing through the adjacent mounting holes 80. After the plurality of water passages 400 are classified, they are arranged along the longitudinal direction of the second side plate 50 and are fixed to the second side plate 50 by means of bands passing through the adjacent mounting holes 80.

The mounting hole 80 of the present embodiment has a certain width, and the extending direction is the same as the extending direction of the electric line 200, the air path 300 and the water path 400, so that the electric line 200, the air path 300 and the water path 400 can be fixed by a wider binding band, the pressure applied to the electric line 200, the air path 300 and the water path 400 by the binding band is reduced, and the purpose of protecting the electric line 200, the air path 300 and the water path 400 is achieved. In addition, the wider strap also acts to right the orientation of the electrical lines 200, air paths 300, and water paths 400, preventing the electrical lines 200, air paths 300, and water paths 400 at the connection with the strap from bending.

Preferably, the second substrate 40 is a solid plate, and the second substrate 40 is located at a position where it is inconvenient for a person to manually fix the electric circuit 200 on the second substrate 40, so that the second substrate 40 is provided as a solid plate, a process of machining the mounting hole 80 can be omitted, and the second substrate 40 has good supporting strength.

Fig. 4 is an end view of an integrated circuit arrangement jig of a laser device according to an embodiment of the present invention. Preferably, the laser device integrated pipeline arrangement jig further includes a first bottom plate 30, and the first bottom plate 30 is connected to the other end of the first side plate 20 and extends outward. Preferably, the first base plate 10, the first side plate 20 and the first bottom plate 30 are integrally formed by bending, and the forming method is simple and easy to process. The first base plate 30 is provided with fixing holes 31, and the first base plate 30 can be fixed to the automation device by fasteners. Specifically, each first base plate 30 is provided with two fixing holes 31 disposed at intervals. The first base plate 30 is disposed generally parallel to the ground to form a support surface.

Preferably, the laser device integrated circuit arrangement jig further includes a second bottom plate 60, and the second bottom plate 60 is connected to the other end of the second side plate 50 and extends outward. Preferably, the first bottom panel 30 is connected to the second bottom panel 60 such that the second receiving space 72 forms a space enclosed all around. The closed accommodating space can conveniently classify and arrange the air passages 300 in a centralized manner.

Preferably, the first base plate 30 is coplanar with the second base plate 60. The first base plate 30 and the second base plate 60 jointly form a supporting surface to increase the area of the supporting surface, so that the whole structure is more stable after the laser device integrated pipeline arrangement jig is installed on the automatic device.

Preferably, the second base plate 40, the second side plate 50 and the second base plate 60 are integrally formed. During installation, the second base plate 40, the second side plate 50 and the second bottom plate 60 may be integrally placed in a space surrounded by the first base plate 10 and the first side plate 20, then two ends of the second base plate 40 are respectively welded to the two first side plates 20, and an outer end of the second bottom plate 60 is welded to an inner end of the first bottom plate 30. The laser equipment integrated pipeline arrangement jig is simple in self assembly mode and high in assembly efficiency.

The laser device integrated pipeline arrangement jig of the embodiment is preferably made of an insulating material or an antistatic material. In other embodiments, the laser device integrated circuit arrangement jig may also be made of stainless steel. Insulating or antistatic coatings can also be added on the basis of stainless steel materials.

The laser device integrated circuit arrangement jig of the present embodiment may design the sizes of the first accommodating space 71, the second accommodating space 72, and the third accommodating space 73 according to the sizes of the electric line 200, the air path 300, and the water path 400.

The laser equipment integrated pipeline arrangement jig of the embodiment can be applied to occasions with limited space. The laser equipment integrated pipeline arrangement jig of the embodiment can also be applied to occasions with large space, for example, various motor lines are arranged and fixed in a classified mode.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a tool is arranged to laser equipment integrated circuit which characterized in that includes:

a first substrate (10);

the two opposite first side plates (20), the first side plates (20) and the first base plate (10) are arranged at an included angle, and one ends of the two first side plates (20) are respectively connected with two ends of the first base plate (10);

the two ends of the second base plate (40) are respectively connected with the two first side plates (20) to form a first accommodating space (71) with the first base plate (10) and the two first side plates (20);

the two opposite second side plates (50), the second side plates (50) and the second base plate (40) are arranged at an included angle, and one ends of the two second side plates (50) are respectively connected with the second base plate (40); the second side plate (50) is arranged at a distance from the first side plate (20) to enclose a second accommodating space (72) with the first side plate (20) and the second base plate (40); the two second side plates (50) and the second base plate (40) enclose a third accommodating space (73).

2. The tool for arranging the laser device integrated pipelines according to claim 1, wherein mounting holes (80) are distributed on the first base plate (10) or the first side plate (20) or the second side plate (50).

3. The tool for arranging the laser device integrated pipelines according to claim 2, wherein the mounting holes (80) extending along the width direction of the first base plate (10) or the first side plate (20) or the second side plate (50) are distributed on the first base plate (10) or the second side plate (50).

4. The jig of claim 2, wherein the second substrate (40) is a solid plate.

5. The tool for arranging laser equipment integrated pipelines according to claim 1, further comprising a first bottom plate (30), wherein the first bottom plate (30) is connected to the other end of the first side plate (20) and extends outwards.

6. The jig for arranging laser device integrated circuits according to claim 5, further comprising a second bottom plate (60), wherein the second bottom plate (60) is connected to the other end of the second side plate (50) and extends outward.

7. The jig for arranging laser device integrated circuits according to claim 6, wherein the first base plate (30) is connected to the second base plate (60) so that the second receiving space (72) forms a space enclosed all around.

8. The jig for arranging laser device integrated circuits according to claim 7, wherein the first base plate (30) is coplanar with the second base plate (60).

9. The jig for arranging laser device integrated pipelines according to claim 5, wherein the first base plate (10), the first side plate (20) and the first bottom plate (30) are integrally formed by bending.

10. The jig for arranging laser device integrated circuits according to claim 6, wherein the second base plate (40), the second side plate (50) and the second bottom plate (60) are integrally formed.